Printing machine solder paste management system, method and storage medium

Abstract

The present invention discloses a printing press solder paste management system, method and storage medium, which relate to the technical field of solder paste management. It solves the technical problem in the prior art that solder paste cannot be classified according to its characteristics, so that the use of backup solder paste cannot be controlled with high precision. Specifically, a characteristic evaluation unit marks the solder paste purchased in real time as a newly added solder paste, and performs characteristic evaluation on the newly added solder paste, obtains a characteristic evaluation coefficient based on information processing, and divides the newly added solder paste into non-matching solder paste, matching solder paste and backup solder paste through coefficient comparison; a backup analysis control unit performs backup demand analysis on the printing press, and controls the use of backup solder paste according to the backup demand analysis; and a supply risk assessment unit performs risk assessment on the solder paste supply during the operation phase of the printing press.

Description

Technical Field

[0001] The present invention relates to the technical field of solder paste management, and in particular to a printing press solder paste management system, method and storage medium. Background Art

[0002] Printer solder paste is a sticky, viscous substance primarily used for spot welding electronic components on PCBs (printed circuit boards). Metal powder is the primary component of solder paste, typically an alloy powder composed of tin, lead, silver, copper, and other metal elements. Different alloy compositions have varying melting points, welding properties, and costs.

[0003] Patent publication number CN116362630A discloses a solder paste printer management method, system, and medium based on the Internet of Things (IoT), belonging to the field of solder paste printer management technology. The present invention obtains data information on the printing process requirements of the current solder paste printing product and generates solder paste printing recommendations based on the data information on the printing process requirements of the current solder paste printing product and related performance critical points. The present invention predicts the degradation of the solder paste printer by converting the production quality of the solder paste printing product within a preset time into a state transition probability matrix through a Markov chain, and then constructs a solder paste printer performance degradation prediction model based on the state transition probability matrix. This model is then combined with the processing requirements of the product to be solder paste printed to evaluate the degradation, thereby avoiding the production of a large number of defective or substandard products when solder paste printers that do not meet the processing requirements are used to mass-produce products.

[0004] However, in the existing technology, when solder paste is supplied, it is not possible to infer whether the solder paste meets the requirements based on characteristic analysis, and it is not possible to classify the solder paste into types based on its characteristics, so that the use of backup solder paste cannot be controlled with high precision. In addition, it is even more impossible to conduct a risk assessment of the solder paste supply, which reduces the efficiency of the printing machine.

[0005] In view of the above technical defects, a solution is now proposed. Summary of the Invention

[0006] The purpose of the present invention is to solve the above-mentioned problems and to provide a printing press solder paste management system, method and storage medium.

[0007] The purpose of the present invention can be achieved through the following technical solutions:

[0008] A printing press solder paste management system includes a solder paste management platform, which is connected to:

[0009] The characteristic evaluation unit is used to mark the solder paste purchased in real time as newly added solder paste and perform characteristic evaluation on the newly added solder paste. It collects information on viscosity, thixotropy, and soldering performance, processes the information, and obtains characteristic evaluation coefficients based on the information. By comparing the coefficients, the newly added solder paste is classified into non-matching solder paste, matching solder paste, and backup solder paste.

[0010] Backup analysis control unit, used to analyze the backup needs of the printing press and control the use of backup solder paste based on the backup needs analysis;

[0011] The supply risk assessment unit is used to conduct risk assessment on solder paste supply during the operation phase of the printing press. It collects supply risk information and substitutes it into the formula to obtain the supply risk assessment coefficient. The coefficient comparison is used to infer whether the supply risk assessment is qualified. If not, the solder paste supply is restarted. If so, the printing efficiency is evaluated.

[0012] The printing satisfaction analysis unit is used to perform printing analysis on the printing press, collect consumption parameters and area parameters, and infer whether the printing efficiency is abnormal based on parameter comparison. If so, the extrusion volume is adaptively adjusted; if not, the printing press is continuously monitored.

[0013] As a preferred embodiment of the present invention, the viscosity impact information is the ratio of the average amount of newly added solder paste scraped off during a single scraping operation under a set scraper force and the floating span value of the coverage area of the newly added solder paste when scraped onto the circuit board;

[0014] Thixotropic impact information is the ratio of the difference between the viscosity reduction ratio of the newly added solder paste and the preset viscosity reduction ratio when the newly added solder paste is subjected to external force, and the duration of the newly added solder paste moving to the initial shape of the solder paste on the circuit board.

[0015] The welding performance information is the real-time increase in conductive loss when adding solder paste for welding and the increase in the number of solder joints that fall off after welding is completed.

[0016] As a preferred embodiment of the present invention, if the characteristic evaluation coefficient exceeds the maximum value of the characteristic evaluation coefficient threshold range, a non-matching signal is generated; if the characteristic evaluation coefficient is within the characteristic evaluation coefficient threshold range, an inefficient matching signal is generated; if the characteristic evaluation coefficient is lower than the characteristic evaluation coefficient threshold range, a high matching signal is generated.

[0017] As a preferred embodiment of the present invention, the backup demand analysis process is as follows: the deviation between the preset solder paste usage and the actual usage during the current use of the printing press, and the ratio of the solder paste replenishment delay time to the total printing time during the printing press use phase are obtained, and floating inferences are performed based on the two values. If the duration of the increase in the usage deviation and the duration ratio in the same period exceeds the duration threshold, or the average of the floating speed in the same period exceeds the speed average threshold, it is inferred that solder paste backup is required in the current printing phase; conversely, if the duration of the increase in the usage deviation and the duration ratio in the same period does not exceed the duration threshold, and the average of the floating speed in the same period does not exceed the speed average threshold, it is inferred that solder paste backup is not required in the current printing phase;

[0018] As a preferred embodiment of the present invention, when solder paste backup is needed, the interval period for changing the type of the originally supplied solder paste during the current backup solder paste storage stage is inferred. If the type change interval period is shorter than the set period, the current backup solder paste is replenished first when it meets the solder paste type required by the printer, and solder paste scheduling is performed before the solder paste storage time threshold is exceeded when it does not meet the requirements. On the contrary, if the type change interval period is longer than the set period, the current backup solder paste is continuously replenished.

[0019] As a preferred embodiment of the present invention, the supply risk information includes the numerical ratio of the time when the ambient temperature and humidity of the surrounding environment of the solder paste are within the set range during the real-time supply phase of the solder paste of the printing press and the maximum span of the reciprocating fluctuation of the ambient temperature and humidity at any two moments during the supply phase, the numerical ratio of the ambient temperature control deviation floating span of the solder paste during the real-time warming period during the solder paste supply phase of the printing press and the duration of the solder paste in the temperature environment without control deviation, and the deviation value of the distribution uniformity of the alloy powder and flux corresponding to each part of the solder paste after the stirring is completed.

[0020] As a preferred embodiment of the present invention, if the supply risk assessment coefficient exceeds the supply risk assessment coefficient threshold, a supply qualified signal is generated; if the supply risk assessment coefficient does not exceed the supply risk assessment coefficient threshold, a supply unqualified signal is generated.

[0021] As a preferred embodiment of the present invention, the consumption parameter and the area parameter are respectively the peak value of the increase in the deviation of the solder paste consumption when the scraper angle of the printer is alternating at the corresponding printing moment when the real-time printing speed of the printer fluctuates, and the maximum deviation of the pressure forming area of the same type of solder paste in the delivery area when the printer is continuously printing and under the same pressure;

[0022] If the consumption parameter exceeds the increased span peak threshold, or the area parameter exceeds the area maximum deviation value threshold, a supply deviation signal is generated; if the consumption parameter does not exceed the increased span peak threshold, and the area parameter does not exceed the area maximum deviation value threshold, a qualified signal is generated.

[0023] As a preferred embodiment of the present invention, a method for managing solder paste of a printing machine includes the following steps:

[0024] Step 1: Property testing: After the printing press is used and the amount of solder paste is reduced, the purchased solder paste properties are tested and classified according to the solder paste property analysis;

[0025] Step 2: Backup analysis control: backup control of solder paste backup type during feature division;

[0026] Step 3: Supply risk analysis: Conduct risk analysis on solder paste addition supply;

[0027] Step 4: Printing efficiency analysis: Conduct printing efficiency analysis when there is no risk in supply.

[0028] As a preferred embodiment of the present invention, a computer-readable storage medium stores a computer program thereon, and when the computer program is executed by a processor, the above-mentioned printing machine solder paste management method is implemented.

[0029] Compared with the prior art, the present invention has the following beneficial effects:

[0030] 1. In the present invention, the characteristics of the solder paste purchased by the printing press in real time are analyzed. Through the solder paste characteristic detection, it is ensured that the solder paste purchased by the printing press in real time can meet the actual printing needs, ensure the efficiency of the solder paste and ensure that the solder paste characteristics are within the same range, avoid affecting the use of the original remaining solder paste, and promote the efficiency and stability of the printing press;

[0031] Conduct backup demand analysis on the printing press, and infer whether the current low-risk impact analysis is normal through the analysis of spare solder paste usage. Then, conduct a risk assessment of spare solder paste usage in combination with the current printing press usage needs to avoid the alternative solder paste being unsuitable for use in the current period, resulting in waste of spare solder paste storage costs and affecting the printing quality of the printing press.

[0032] 2. In the present invention, a risk assessment is performed on the solder paste supply during the operation phase of the printing press. Whether there is a supply risk during the current solder paste supply phase is inferred. This prevents external influences from reducing the solder paste supply efficiency, affecting the normal operation of the printing press, and also avoids abnormal solder paste supply execution that leads to increased solder paste and storage costs, which also causes the printing press to slow down and affects the execution of the printing job.

[0033] When the solder paste is supplied, the printing machine is analyzed for printing. The operating performance analysis of the printing machine is used to infer whether the current printing satisfies the actual demand, thereby inferring whether the operating efficiency of the current printing machine is qualified after receiving the supplied solder paste. The real-time performance of the printing machine is tested to ensure the execution efficiency of the printing task. At the same time, the efficiency of solder paste use can be monitored in real time through performance testing. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] To facilitate understanding by those skilled in the art, the present invention is further described below with reference to the accompanying drawings.

[0035] Figure 1 This is a system principle block diagram of the present invention;

[0036] Figure 2 is a flow chart of the method of the present invention;

[0037] Figure 3 It is a schematic diagram of the execution steps of the method of the present invention. DETAILED DESCRIPTION

[0038] In order to enable those skilled in the art to better understand the solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0039] References herein to "embodiments" mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of the present invention. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute a separate or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0040] Example 1

[0041] See also Figure 1 As shown, a solder paste management system for a printing press includes a solder paste management platform, wherein the solder paste management platform is communicatively connected to a printing press usage unit, a characteristic evaluation unit, a backup analysis control unit, a supply risk assessment unit, and a printing satisfaction analysis unit. Each component of this embodiment is oriented towards solder paste management and cooperates with the operation of the printing press to ensure the efficiency of the printing press usage and solder paste supply.

[0042] The printing press usage unit serves as a monitoring module for the printing press operation switch. When the printing press starts running, it generates a solder paste management signal and sends it to the solder paste management platform. After receiving the solder paste management signal, the solder paste management platform manages the solder paste during the printing press operation phase. All aspects of the solder paste involved meet the efficiency of the printing press.

[0043] The solder paste management platform generates a characteristic evaluation signal and sends it to the characteristic evaluation unit. After receiving the characteristic evaluation signal, the characteristic evaluation unit performs a characteristic analysis on the solder paste purchased by the printer in real time. Through solder paste characteristic testing, it ensures that the solder paste purchased by the printer in real time can meet the actual printing needs, ensures the efficiency of solder paste usage, and ensures that the solder paste characteristics are within the same range, avoiding any impact on the use of the original remaining solder paste, thereby promoting the efficiency and stability of the printer.

[0044] Mark the solder paste purchased in real time as newly added solder paste and perform a characteristic evaluation on the newly added solder paste. Obtain the average amount of newly added solder paste scraped off during a single scraping operation at a set scraper force, as well as the floating span value of the coverage area of the newly added solder paste when scraped onto the circuit board. Calculate the ratio and mark it as viscosity impact information. Set the label NDX.

[0045] At the same time, the deviation between the viscosity reduction ratio of the newly added solder paste and the preset viscosity reduction ratio when the newly added solder paste is subjected to external force and the duration of the newly added solder paste moving to the initial shape of the solder paste on the circuit board are obtained. The numerical ratio is obtained through ratio calculation and marked as thixotropic influence information; the label CBX is set;

[0046] Obtain the real-time conductive loss growth span when adding new solder paste for welding and the growth span of the number of solder joints falling off after welding is completed, and calculate the average value of the growth span based on the sum and average, and mark it as welding performance information and set the label HJX;

[0047] Substitute the above collected information into the formula to obtain the newly added solder paste characteristic evaluation coefficient TX during the operation of the printing machine, where the formula is: , where vng1, vng2, and vng3 are preset proportional coefficients, e is a natural constant, and α is an error correction factor with a value of 0.798;

[0048] Compare the newly added solder paste characteristic evaluation coefficient TX during the operation of the printer with the characteristic evaluation coefficient threshold range:

[0049] If the characteristic evaluation coefficient TX of the newly added solder paste during the operation of the printer exceeds the maximum value of the characteristic evaluation coefficient threshold range, it is inferred that the characteristic analysis of the current newly added solder paste is abnormal, and a non-matching signal is generated and sent to the solder paste management platform. The solder paste management platform will not use the current batch of solder paste as the newly added solder paste and re-select the material;

[0050] If the characteristic evaluation coefficient TX of the newly added solder paste is within the characteristic evaluation coefficient threshold range during the operation of the printing press, it is inferred that the characteristic analysis of the current newly added solder paste is inefficient, and an inefficient matching signal is generated and sent to the solder paste management platform. The solder paste management platform uses the current batch of solder paste as an alternative new solder paste and replaces it when the solder paste quantity is insufficient to ensure the continuous operation of the printing press. The characteristics of this type of solder paste meet the requirements, but the risk of printing press operation control is high when using it, and it is only used as an alternative solder paste;

[0051] If the characteristic evaluation coefficient TX of the newly added solder paste during the operation of the printer is lower than the characteristic evaluation coefficient threshold range, it is inferred that the characteristic analysis of the current newly added solder paste is qualified, and a high matching signal is generated and sent to the solder paste management platform. After receiving the high matching signal, the solder paste management platform uses the current newly added solder paste as the supplementary solder paste for the printer;

[0052] At the same time, a backup analysis control signal is generated and sent to the backup analysis control unit. After receiving the backup analysis control signal, the backup analysis control unit performs a backup demand analysis on the printing press. Through the backup solder paste usage analysis, it is inferred whether the current low-risk impact analysis is normal. Thus, the backup solder paste usage risk assessment is performed in combination with the current usage demand of the printing press to avoid the backup solder paste being unsuitable for use in the current period, resulting in a waste of storage costs for the backup solder paste and affecting the printing quality of the printing press.

[0053] Obtain the deviation between the preset solder paste usage and the actual usage during the current printing press usage, and the ratio of the solder paste replenishment delay time to the total printing time during the printing press usage phase. Perform floating inference based on these two values. If the duration of the usage deviation and the duration ratio increasing in the same period exceeds the duration threshold, or the average floating speed in the same period exceeds the speed average threshold, then it is inferred that solder paste backup is required in the current printing phase. Conversely, if the duration of the usage deviation and the duration ratio increasing in the same period does not exceed the duration threshold, and the average floating speed in the same period does not exceed the speed average threshold, then it is inferred that solder paste backup is not required in the current printing phase.

[0054] When solder paste backup is needed, the replacement interval of the original solder paste type during the current backup solder paste storage stage is inferred. If the type replacement interval is shorter than the set period, the current backup solder paste will be replenished first if it meets the solder paste type required by the printer, and solder paste scheduling will be performed before the solder paste storage time threshold is exceeded if it does not meet the requirements. Conversely, if the type replacement interval is longer than the set period, the current backup solder paste will be continuously replenished.

[0055] Send the real-time processing method of backup solder paste to the solder paste management platform during the printing press operation stage;

[0056] The solder paste management platform generates a supply risk assessment signal and sends it to the supply risk assessment unit. After receiving the signal, the supply risk assessment unit conducts a risk assessment on the solder paste supply during the printing press operation phase. By inferring whether there is a supply risk during the current solder paste supply phase, the unit can avoid external influences that may reduce the solder paste supply efficiency and affect the normal operation of the printing press. It also avoids abnormal solder paste supply execution that leads to increased solder paste and storage costs, which may also cause the printing press to slow down and affect the execution of the printing job.

[0057] Obtain the numerical ratio of the duration of time during which the ambient temperature and humidity of the solder paste supplying environment of the printer are within the set range and the maximum span of the reciprocating fluctuation of the ambient temperature and humidity at any two moments in the supply phase, i.e., the ratio of the duration to the amplitude span, without considering the influence of inconsistent units, and set the label SK;

[0058] At the same time, the numerical ratio of the ambient temperature control deviation floating span of the solder paste in the real-time reheating period during the solder paste supply phase of the printer and the duration of the solder paste in the temperature environment without control deviation is obtained and set as KS; the temperature control deviation floating span is expressed as the deviation between the actual temperature value and the set control temperature value, corresponding to the deviation floating span;

[0059] After the solder paste of the printing machine has returned to temperature, it is stirred according to the set stirring speed and time, and the distribution uniformity deviation value of the corresponding alloy powder and flux in each part of the stirred solder paste is obtained. The uniformity deviation value is expressed as the content deviation value of the corresponding powder and flux in the same area position of each part of the solder paste; and it is set as the label JP;

[0060] The above collected information is uniformly marked as supply risk information, and substituted into the formula to obtain the supply risk assessment coefficient P in the printing machine solder paste supply stage, where the formula is:

[0061] , where mh1, mh2, and mh3 are preset proportional coefficients, t1 is the time duration of the ratio of duration to amplitude span growth, and t2 is the time duration of the ratio of temperature deviation to duration not growing;

[0062] Compare the supply risk assessment coefficient P in the printer solder paste supply stage with the supply risk assessment coefficient threshold:

[0063] If the supply risk assessment coefficient P during the solder paste supply phase of the printing press exceeds the supply risk assessment coefficient threshold, it is inferred that the supply risk assessment of the printing press is qualified, a supply qualified signal is generated, and the supply qualified signal is sent to the solder paste management platform; if the supply risk assessment coefficient P during the solder paste supply phase of the printing press does not exceed the supply risk assessment coefficient threshold, it is inferred that the supply risk assessment of the printing press is unqualified, a supply unqualified signal is generated, and the supply unqualified signal is sent to the solder paste management platform. After receiving the supply unqualified signal, the solder paste management platform suspends the current supply of solder paste, schedules spare solder paste, and resupplies it to ensure supply efficiency;

[0064] After completing the supply risk assessment, a printing satisfaction analysis signal is generated and sent to the printing satisfaction analysis unit. After receiving the printing satisfaction analysis signal, the printing satisfaction analysis unit performs a printing analysis on the printing press when the solder paste is supplied. Through the operating performance analysis of the printing press, it is inferred whether the current printing satisfaction meets the actual demand, and thus whether the current operating efficiency of the printing press after receiving the supplied solder paste is qualified. The real-time performance of the printing press is tested to ensure the execution efficiency of the printing task. At the same time, the performance test can monitor the efficiency of the use of solder paste in real time.

[0065] At the corresponding moments of different solder paste reserves within the solder paste supply cycle, the peak value of the solder paste consumption deviation value corresponding to the printing moment when the printer's scraper angle alternates when the real-time printing speed of the printer fluctuates is obtained. At the same time, the maximum deviation value of the pressure forming area of the same type of solder paste in the delivery area under the same pressure when the printer is continuously printing is obtained. It can be understood that the solder paste consumption deviation reflects the deviation between the supply amount of solder paste during printing and the usage amount of the scraper. The pressure forming area also reflects the area formed by the amount of solder paste delivered under the same pressure, which mainly reflects the coordination efficiency of the printer and the solder paste.

[0066] The peak value of the deviation of the solder paste consumption corresponding to the alternating angle of the scraper of the printer at the printing moment when the real-time printing speed of the printer fluctuates, and the maximum deviation of the pressure forming area of the same type of solder paste in the delivery area under the same pressure when the printer is continuously printing are marked as consumption parameters and area parameters respectively, and compared with the threshold of the peak value of the increase of span and the threshold of the maximum deviation of the area respectively:

[0067] If the peak value of the deviation of the solder paste consumption at the printing moment corresponding to the alternating scraper angle of the printer when the real-time printing speed of the printer fluctuates exceeds the peak value threshold of the increase span, or if the printer continues to print and the maximum deviation value of the pressure forming area of the same type of solder paste in the delivery area under the same pressure exceeds the maximum area deviation value threshold, it is inferred that there is an abnormality in the real-time printing efficiency after the printer completes the solder paste supply, and a supply deviation signal is generated and sent to the solder paste management platform. After receiving the supply deviation signal, the solder paste management platform adjusts the real-time solder paste extrusion amount of the current printer according to the adjustment of the printing speed and scraper angle to avoid the reduction of printing efficiency due to the deviation of the solder paste amount;

[0068] If the peak value of the deviation of the solder paste consumption at the printing moment corresponding to the alternating scraper angle of the printer when the real-time printing speed of the printer fluctuates does not exceed the peak value threshold of the deviation of the span, and the printer continues to print and the maximum deviation value of the pressure forming area of the same type of solder paste in the delivery area under the same pressure does not exceed the maximum area deviation value threshold, then it is inferred that the real-time printing efficiency of the printer after completing the solder paste supply is normal, and a qualified signal is generated and sent to the solder paste management platform;

[0069] Example 2

[0070] Please refer to Figure 2-3 As shown, a printing press solder paste management method includes four steps: printing demand generation, procurement environment, use link, and printing demand execution. The printing press solder paste management also plays a role in detecting the operating efficiency of the printing press.

[0071] In the four specific environmental steps, the specific process is the use of the printing press, that is, the use demand is generated; then the purchased solder paste characteristics are tested, that is, after the printing press is used and the amount of solder paste is reduced, the purchased solder paste characteristics are tested, and the types are classified according to the solder paste characteristics analysis, backup analysis and control are carried out, and backup control is carried out on the solder paste backup type when the characteristics are classified. After the backup is completed, the supply risk analysis is carried out, the risk analysis of the solder paste replenishment supply is carried out, and the printing efficiency analysis is carried out, and the printing efficiency analysis is carried out when there is no risk;

[0072] Additionally, a computer-readable storage medium stores a computer program, which, when executed by a processor, implements the above-mentioned printing press solder paste management method.

[0073] Those skilled in the art will understand that all or part of the processes in the above-mentioned embodiment methods can be implemented by instructing related hardware through a computer program. The computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods.

[0074] Among them, any reference to memory, storage, database or other media used in the embodiments provided in this application may include non-volatile and / or volatile memory, non-volatile memory may include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM) or flash memory, and volatile memory may include random access memory (RAM) or external cache memory.

[0075] By way of illustration and not limitation, RAM is available in many forms such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), Synchronous Link DRAM (SLDRAM), Rambus direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM), etc.

[0076] Those skilled in the art will clearly understand that for the sake of convenience and brevity of description, only the division of the above-mentioned functional units and modules is used as an example for illustration. In actual applications, the above-mentioned functions can be distributed and completed by different functional units and modules as needed, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above.

[0077] The above formulas are obtained by collecting a large amount of data and performing software simulation to select a formula close to the actual value. The coefficients in the formula are set by those skilled in the art according to actual conditions;

[0078] When the present invention is in use, the characteristic evaluation unit is used to mark the solder paste purchased in real time as newly added solder paste, and perform characteristic evaluation on the newly added solder paste, collect viscosity influence information, thixotropy influence information and welding performance information, and obtain characteristic evaluation coefficients based on information processing, and divide the newly added solder paste into non-matching solder paste, matching solder paste and backup solder paste through coefficient comparison; the backup analysis control unit is used to perform backup demand analysis on the printing press, and perform backup solder paste usage management and control based on the backup demand analysis; the supply risk assessment unit is used to perform risk assessment on the solder paste supply during the operation phase of the printing press, collect supply risk information, and substitute it into the formula to obtain the supply risk assessment coefficient, and infer whether the supply risk assessment is qualified through coefficient comparison. If not, the solder paste is re-supplied; if yes, the printing efficiency is evaluated; the printing satisfaction analysis unit is used to perform printing analysis on the printing press, collect consumption parameters and area parameters, and infer whether the printing efficiency is abnormal based on parameter comparison. If yes, the extrusion amount is adaptively controlled; if not, the printing press is continuously monitored.

[0079] The preferred embodiments of the present invention disclosed above are intended only to help illustrate the present invention. These preferred embodiments do not exhaustively describe all details, nor do they limit the present invention to specific embodiments. Obviously, many modifications and variations are possible based on the contents of this specification. These embodiments are selected and described in detail in this specification to better explain the principles and practical applications of the present invention, thereby enabling those skilled in the art to better understand and utilize the present invention. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A printing press solder paste management system, characterized in that: Including solder paste management platform, the solder paste management platform is connected to: The characteristic evaluation unit is used to mark the solder paste purchased in real time as newly added solder paste and perform characteristic evaluation on the newly added solder paste. It collects viscosity impact information, thixotropy impact information, and soldering performance information, and obtains characteristic evaluation coefficients based on information processing. The newly added solder paste is classified into non-matching solder paste, matching solder paste, and backup solder paste by comparing the coefficients. The viscosity impact information is the ratio of the average amount of newly added solder paste scraped off during a single scraping operation at a set scraper force and the floating span value of the coverage area of the newly added solder paste when scraped onto the circuit board. Thixotropic impact information is the ratio of the difference between the viscosity reduction ratio of the newly added solder paste and the preset viscosity reduction ratio when the newly added solder paste is subjected to external force, and the duration of the newly added solder paste moving to the initial shape of the solder paste on the circuit board. The welding performance information is the real-time increase in conductive loss when adding solder paste for welding and the increase in the number of solder joints that fall off after welding is completed. Backup analysis control unit, used to analyze the backup needs of the printing press and control the use of backup solder paste based on the backup needs analysis; The supply risk assessment unit is used to conduct risk assessment on solder paste supply during the operation phase of the printing press. It collects supply risk information and substitutes it into the formula to obtain the supply risk assessment coefficient. The coefficient comparison is used to infer whether the supply risk assessment is qualified. If not, the solder paste supply is restarted. If so, the printing efficiency is evaluated. Supply risk information includes the numerical ratio of the duration of the ambient temperature and humidity of the solder paste supplied to the printer during the real-time solder paste supply phase within the set range to the maximum span of the corresponding ambient temperature and humidity fluctuations at any two moments during the supply phase; the numerical ratio of the ambient temperature control deviation fluctuation span of the solder paste during the real-time rewarming period during the solder paste supply phase to the duration of the solder paste being in an uncontrolled temperature environment; and the deviation values of the alloy powder and flux distribution uniformity corresponding to each part of the solder paste after stirring. The labels SK, KS, and JP are set respectively. The formula is: , where P is the supply risk assessment coefficient, mh1, mh2, and mh3 are the preset proportional coefficients, and t1 is the numerical growth period of the ratio of duration to amplitude span, and t2 is the non-growth period of the numerical ratio of temperature deviation to duration; The printing satisfaction analysis unit is used to perform printing analysis on the printing press, collect consumption parameters and area parameters, and infer whether the printing efficiency is abnormal based on parameter comparison. If so, the extrusion volume is adaptively adjusted; if not, the printing press is continuously monitored.

2. A printing press solder paste management system according to claim 1, characterized in that: If the characteristic evaluation coefficient exceeds the maximum value of the characteristic evaluation coefficient threshold range, a non-matching signal is generated; if the characteristic evaluation coefficient is within the characteristic evaluation coefficient threshold range, a low-efficiency matching signal is generated; if the characteristic evaluation coefficient is lower than the characteristic evaluation coefficient threshold range, a high-matching signal is generated.

3. The solder paste management system for a printing press according to claim 1, characterized in that: The backup demand analysis process is as follows: obtain the deviation between the preset solder paste usage and the actual usage during the current printing press use process, and the ratio of the solder paste replenishment delay time to the total printing time during the printing press use phase, and make floating inferences based on the two values. If the duration of the usage deviation and the duration ratio increasing in the same period exceeds the duration threshold, or the average floating speed in the same period exceeds the speed average threshold, then it is inferred that solder paste backup is required in the current printing phase; conversely, if the duration of the usage deviation and the duration ratio increasing in the same period does not exceed the duration threshold, and the average floating speed in the same period does not exceed the speed average threshold, then it is inferred that solder paste backup is not required in the current printing phase.

4. The solder paste management system for a printing press according to claim 3, characterized in that: When solder paste backup is needed, the interval period for changing the type of the original supplied solder paste during the current backup solder paste storage stage is inferred. If the type change interval period is shorter than the set period, the current backup solder paste will be replenished first when it meets the solder paste type required by the printer, and solder paste scheduling will be performed before the solder paste storage time threshold is exceeded when it does not meet the requirements. On the contrary, if the type change interval period is longer than the set period, the current backup solder paste will be continuously replenished.

5. The solder paste management system for a printing press according to claim 1, characterized in that: If the supply risk assessment coefficient exceeds the supply risk assessment coefficient threshold, a supply qualified signal is generated; if the supply risk assessment coefficient does not exceed the supply risk assessment coefficient threshold, a supply unqualified signal is generated.

6. The solder paste management system for a printing press according to claim 1, characterized in that: The consumption parameter and area parameter are respectively the peak value of the deviation of solder paste consumption when the scraper angle of the printer changes at the corresponding printing moment when the real-time printing speed of the printer fluctuates, and the maximum deviation of the pressure forming area of the same type of solder paste in the delivery area when the printer is continuously printing and under the same pressure; If the consumption parameter exceeds the increased span peak threshold, or the area parameter exceeds the area maximum deviation value threshold, a supply deviation signal is generated; if the consumption parameter does not exceed the increased span peak threshold, and the area parameter does not exceed the area maximum deviation value threshold, a qualified signal is generated.

7. A solder paste management method for a printing press solder paste management system based on any one of claims 1 to 6, characterized in that: The following steps are involved: Step 1: Property testing: After the printing press is used and the amount of solder paste is reduced, the purchased solder paste properties are tested and classified according to the solder paste property analysis; Step 2: Backup analysis control: backup control of solder paste backup type during feature division; Step 3: Supply risk analysis: Conduct risk analysis on solder paste addition supply; Step 4: Printing efficiency analysis: Conduct printing efficiency analysis when there is no risk in supply.

8. A computer-readable storage medium, characterized in that A computer program is stored thereon, and when the computer program is executed by a processor, a solder paste management method as claimed in claim 7 is implemented.

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