Method and apparatus for measuring core pellet position

Abstract

The application relates to the field of semiconductor device process measurement detection, and discloses a core particle position degree measurement method, device, equipment, computer readable storage medium and computer program product, which are used for solving the technical problem that the measurement result is inaccurate when the core particle position degree is measured by relying on a reference point in the prior art. The method comprises the following steps: acquiring first position information of an initial actual core particle array and acquiring second position information of a theoretical core particle array; performing rotation and translation transformation on the actual core particle array to match and fit the theoretical core particle array; acquiring a fitting transformation matrix corresponding to the actual core particle array when the rotation and translation transformed actual core particle array and the theoretical core particle array reach maximum coincidence; calculating third position information of the actual core particle array when the maximum coincidence is reached according to the first position information and the fitting transformation matrix; and calculating the core particle position degree of the actual core particle array according to the second position information and the third position information.

Description

Technical Field

[0001] This invention relates to the field of semiconductor device process measurement and inspection, and in particular to a method, apparatus, device, computer storage medium, and computer program product for measuring chip position. Background Technology

[0002] In semiconductor device manufacturing processes, such as in multi-chip integrated packaging (MCP) scenarios, chiplet packaging technology is required. Semiconductor chips are integrated using multiple small chips, which can be manufactured on different wafer fabrication processes to achieve high-density interconnectivity, resulting in low-cost, low-power, and high-performance chips. For example, in the emerging semiconductor display technology Micro-LED, tens of thousands of micrometer-sized chips are neatly distributed on the display screen for interconnection and control, achieving high contrast, high brightness, long lifespan, and low power consumption. Furthermore, in the production of radio frequency (RF) or high-performance computing chips, different functional chips are manufactured using different processes and then interconnected through multi-chip fan-out packaging. When multiple chips are arranged on a substrate to form a repeating matrix structure for display, ensuring the accuracy of chip placement is crucial for reliable electrical interconnection. Therefore, monitoring chip placement is essential for ensuring the reliability of chip products.

[0003] Generally, when measuring the positional accuracy of a core particle, a positional reference point within the imaging field of view (shot) is used as a reference, and the core particle positional accuracy is calculated using pixels. This method relies on the existence of the positional reference point and requires ensuring its positional accuracy. However, during the core particle manufacturing process, such as on temporary carriers or molding plates, reference points cannot be densely arranged, making it impossible to guarantee the presence of a positional reference point in every imaging field of view. Furthermore, positional errors in the reference points themselves can cause deviations in the core particle's position, resulting in inaccurate measurement of its positional accuracy. Therefore, there is an urgent need for a method to measure core particle positional accuracy that can calculate the positional accuracy without requiring external reference points within a local field of view and obtain relatively accurate measurement results. Summary of the Invention

[0004] The main objective of this invention is to solve the technical problem that the measurement of core position accuracy in the prior art relies on a reference point and the measurement results are inaccurate.

[0005] The first aspect of the present invention provides a method for measuring the position of a core particle, comprising:

[0006] Obtain the first position information of the initial actual core array, and obtain the second position information of the theoretical core array;

[0007] The actual core array is subjected to rotation and translation transformation to match and fit with the theoretical core array;

[0008] Obtain the fitting transformation matrix corresponding to the actual core array when the actual core array after rotation and translation transformation and the theoretical core array achieve maximum overlap;

[0009] The third position information of the actual core array when maximizing overlap is calculated based on the first position information and the fitted transformation matrix;

[0010] The chip position degree of the actual chip array is calculated based on the second and third position information.

[0011] Optionally, in a first implementation of the first aspect of the present invention, after performing a rotation and translation transformation on the actual chip array, the method further includes:

[0012] Calculate the root mean square value of the distance between each core in the actual core array after rotation and translation and the corresponding core in the theoretical core array;

[0013] When the root mean square value is minimized, the actual core array after the rotation and translation transformation and the theoretical core array achieve maximum overlap.

[0014] Optionally, in a second implementation of the first aspect of the present invention, the method for measuring the core particle position further includes:

[0015] Obtain the positional correspondence between each core in the actual core array and each core in the theoretical core array when the root mean square value is minimized;

[0016] The calculation of the chip position degree of the actual chip array based on the second position information and the third position information includes:

[0017] Based on the second position information, the third position information, and the positional correspondence of each core particle, the positional degree of each core particle is calculated.

[0018] Optionally, in a third implementation of the first aspect of the invention, calculating the positional degree of each core particle includes:

[0019] The horizontal, vertical, and diagonal deviations between each corresponding core in the actual and theoretical core arrays are calculated to obtain the core's positional accuracy.

[0020] Optionally, in a fourth implementation of the first aspect of the present invention, obtaining the first position information of the initial actual chip array includes:

[0021] Acquire images of a calibration board containing multiple feature points with known locations to obtain a matrix image of the feature points;

[0022] The pixel coordinates of each feature point are obtained from the matrix image of the feature points.

[0023] Based on the coordinates of the known feature points on the calibration board and the coordinates of the image feature points, the world coordinates of the motion platform are calibrated, and the calibration algorithm is obtained.

[0024] Obtain the pixel coordinates of each core in the core matrix arranged on the substrate plane, and transform the pixel coordinates of each core according to the calibration algorithm to obtain the first position information of the initial actual core array.

[0025] Optionally, in a fifth implementation of the first aspect of the present invention, after calculating the chip position degree of the actual chip array based on the second position information and the third position information, the method further includes:

[0026] According to the preset defect judgment rules, the defect degree of the actual core array is evaluated based on the core position degree.

[0027] A second aspect of the present invention provides a device for measuring the position of a core particle, comprising:

[0028] The first position acquisition module is used to acquire the first position information of the initial actual core array and the second position information of the theoretical core array.

[0029] The fitting module is used to perform rotation and translation transformations on the actual core array to match and fit it with the theoretical core array;

[0030] The matrix calculation module is used to obtain the fitting transformation matrix of the actual core array when the actual core array after rotation and translation transformation and the theoretical core array achieve maximum overlap.

[0031] The second position acquisition module is used to calculate the third position information of the actual core array when maximizing the overlap based on the first position information and the fitting transformation matrix;

[0032] The position calculation module is used to calculate the position degree of the actual core array based on the second position information and the third position information.

[0033] A third aspect of the present invention provides a measuring device for core particle position, comprising: a motion platform, an image acquisition unit, a memory, and at least one processor, wherein the memory stores instructions; the at least one processor invokes the instructions in the memory to cause the measuring device for core particle position to perform the steps of the above-described measuring method for core particle position.

[0034] A fourth aspect of the present invention provides a computer-readable storage medium storing instructions that, when executed on a computer, cause the computer to perform the steps of the above-described method for measuring the position of the core particle.

[0035] A fifth aspect of the present invention provides a computer program product comprising a computer program / instructions, characterized in that, when the computer program / instructions are executed by a processor, the steps of the core position measurement method as described above are implemented.

[0036] The technical solution provided by this invention involves obtaining the first position information of the initial actual core array and the second position information of the theoretical core array; performing a rotation and translation transformation on the actual core array to match and fit it with the theoretical core array; obtaining the fitting transformation matrix corresponding to the actual core array when the actual core array and the theoretical core array achieve maximum overlap after the rotation and translation transformation; calculating the third position information of the actual core array when maximizing overlap based on the first position information and the fitting transformation matrix; and calculating the core position degree of the actual core array based on the second and third position information. This method enables the calculation of core position degree without requiring external reference points within the local field of view and can obtain relatively accurate measurement results. The device, equipment, computer-readable storage medium, and computer program product provided by this invention also solve the corresponding technical problems. Attached Figure Description

[0037] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:

[0038] Figure 1 This is a flowchart illustrating one embodiment of the core particle position measurement method of the present invention;

[0039] Figure 2 This is a schematic diagram of the core positions of the theoretical core array and the actual core array in one embodiment of the core position measurement method of the present invention;

[0040] Figure 3 This is a schematic diagram of the core positions of the theoretical and actual core arrays when maximizing overlap, as shown in one embodiment of the core position measurement method of the present invention.

[0041] Figure 4 This is a schematic diagram of the deviation of the core position in one embodiment of the core position measurement method of the present invention;

[0042] Figure 5 This is a schematic diagram of one embodiment of the core particle position measurement device in this invention;

[0043] Figure 6 This is a schematic diagram of one embodiment of the measuring device for core particle position in this invention. Detailed Implementation

[0044] Exemplary embodiments of the invention will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limiting the invention to the embodiments set forth herein. Rather, these exemplary embodiments are provided to make the invention more comprehensive and complete, and to facilitate a full communication of the inventive concept to those skilled in the art. The same reference numerals in the drawings denote the same or similar elements, components, or parts, and therefore repeated descriptions of them will be omitted.

[0045] Subject to the technical concept of this invention, the features, structures, characteristics or other details described in a particular embodiment may be combined in one or more other embodiments in a suitable manner.

[0046] In the description of specific embodiments, the features, structures, characteristics, or other details described in this invention are intended to enable those skilled in the art to fully understand the embodiments. However, it is not excluded that those skilled in the art can practice the technical solutions of this invention without one or more of the specific features, structures, characteristics, or other details.

[0047] The flowcharts shown in the accompanying drawings are merely illustrative and do not necessarily include all content and operations / steps, nor do they necessarily have to be performed in the described order. For example, some operations / steps can be broken down, while others can be combined or partially combined; therefore, the actual execution order may change depending on the specific circumstances.

[0048] The block diagrams shown in the accompanying drawings are merely functional entities and do not necessarily correspond to physically independent entities. That is, these functional entities can be implemented in software, in one or more hardware modules or integrated circuits, or in different network and / or processor devices and / or microcontroller devices.

[0049] The terms “and / or” or “and / or” include all combinations of any one or more of the listed items.

[0050] Please see Figures 1-4 One embodiment of the core particle position measurement method of the present invention includes the following:

[0051] In this embodiment, for a chip array, any overall offset or rotation can be corrected through translation and rotation in subsequent process steps. Therefore, overall offset or rotation cannot be considered a defect. The real concern is the localized misalignment of certain chips within the overall chip array. This localized offset refers to the offset relative to the reference represented by the entire chip array, i.e., using the chip array itself as the reference. Positional accuracy refers to the deviation of a design element from its ideal position. In this embodiment, the positional accuracy of a chip refers to the deviation of the actual chip array's position from its ideal position. This can be measured by comparing the actual chip array with its original standard position. Based on this, this embodiment proposes a method for measuring chip positional accuracy using a self-reference method.

[0052] S101. Obtain the first position information of the initial actual core array, and obtain the second position information of the theoretical core array;

[0053] It is understood that the executing entity of this invention can be a core particle position measuring device or a core particle position measuring equipment, and no specific limitation is made here. This embodiment of the invention will be described using a core particle position measuring equipment as an example.

[0054] In the first aspect of this step, in this embodiment, the first position information of the initial actual core array is first obtained. The first position information can be the position coordinates of each core in the initial actual core array. The position coordinates can be position coordinates in a world coordinate system determined based on the motion platform.

[0055] The position coordinates in the world coordinate system determined by the motion platform include: acquiring a calibration plate image containing multiple feature points with known positions to obtain a matrix image of the feature points; obtaining the pixel coordinates of each feature point based on the matrix image of the feature points; calibrating the world coordinates of the motion platform based on the coordinates of the known feature points on the calibration plate and the coordinates of the image feature points to obtain a calibration algorithm; obtaining the pixel coordinates of each core in the core matrix arranged on the substrate plane, and transforming the pixel coordinates of each core according to the calibration algorithm to obtain the first position information of the initial actual core array.

[0056] In one specific embodiment, the core position measurement device used to determine the position coordinates in the world coordinate system includes a motion platform capable of providing high repeatability, with a repeatability of 10–1000 nm over the entire effective stroke. This platform can be a mechanical screw, air-bearing, or magnetically levitated type. The motion platform includes a high-precision grating ruler, which records the position of the motion platform at various times. The grating ruler has a resolution of 2–200 nm. In a preferred embodiment, the repeatability of the motion platform over the entire effective stroke can be 20–200 nm.

[0057] A substrate plane, relatively stationary to the motion platform, is placed on the motion platform. The substrate plane is maintained relative to the motion platform through static friction, vacuum adsorption, or other means. The substrate plane can be made of materials such as glass, sapphire, steel, or resin. An image acquisition unit is positioned above the motion platform, perpendicular to both the motion platform and the substrate plane. This unit can acquire images of a calibration plate on the motion platform, which contains multiple feature points with known locations. The image acquisition unit can also acquire images of all the particles contained on the substrate plane on the motion platform, or acquire multiple images of the particles on the substrate plane and stitch them together to obtain an image of all the particles contained on the substrate plane on the motion platform. Specifically, the image acquisition unit can be a wired scanning camera, an area scan camera, or other types of cameras.

[0058] A world coordinate system is constructed based on a calibration plate, and a motion coordinate system is constructed based on the motion axes of the motion platform. In this embodiment, based on the positional relationship between the calibration plate and the motion platform, the world coordinate system and the motion coordinate system have a parallel projection mapping relationship. A fixture is also connected to the core particle position measurement device. The fixture is used to connect the image acquisition unit, and a tool coordinate system is constructed based on the end of the fixture. According to the positional relationship between the fixture and the motion axes, the coordinates in the motion coordinate system and the tool coordinate system can be mutually converted. An image coordinate system associated with the image acquisition unit is constructed. When the image acquisition unit is fixed to the fixture, the coordinates in the image coordinate system and the tool coordinate system can be mutually converted. In summary, there is a radiative transformation matrix between each coordinate system. Therefore, based on the relationship between the coordinate systems, the world coordinate values ​​of each core particle position can be obtained based on the coordinates in the image coordinate system.

[0059] In the second aspect of this step, this embodiment also requires obtaining the second position information of the theoretical chip array. This second position information can be the position coordinates of each chip in the theoretical chip array during design, or it can be the relative position information between the chips in the theoretical chip array, such as the theoretical horizontal and vertical spacing of each chip in the theoretical chip array. In a specific implementation, the theoretical chip array can be defined as (pitch_h*j, pitch_v*i), where pitch_h is the theoretical horizontal spacing, pitch_v is the theoretical vertical spacing, i is the row number of the chip, and j is the column number of the chip. Based on the spacing information between the chips in the theoretical chip array, a chip position point can be randomly selected in the theoretical chip array and assigned a point coordinate in world coordinates, thereby obtaining the position coordinates of each chip point in the theoretical chip array.

[0060] S102. Perform rotation and translation transformations on the actual core array to match and fit it with the theoretical core array.

[0061] Please see Figure 2 The diagram shows the positions of each particle in the actual and theoretical particle arrays. After obtaining the actual and theoretical particle arrays, since the actual particle array is fabricated based on the theoretical array, ideally, aside from unavoidable errors during fabrication, the actual and theoretical particle arrays should be essentially coincident. Therefore, there exists a rigid body transformation matrix between the actual and theoretical particle arrays to maximize their overlap.

[0062] During the specific matching and fitting process, due to the inherent errors in the arrangement of the actual core array, it may be impossible to achieve complete overlap of all points through translation and rotation. In this embodiment, it is necessary to find a scenario where the overall point set of the actual core array coincides with the theoretical core array to the greatest extent possible. Therefore, a rotation and translation transformation of the actual core array is required for matching and fitting. For example, the centroids of the matrices of the actual and theoretical core arrays can be calculated separately. After aligning the centroids, the core points contained in the actual and theoretical core arrays are paired using the nearest neighbor search method. Based on the obtained paired point sets, the rotation and translation amounts are calculated using the least squares method to minimize the distance between the two sets of point sets corresponding to the actual and theoretical core arrays. The root mean square error (RMSE) is then calculated to measure the quality of the current matching. The pairing process is iteratively repeated based on the quality of the matching until the error value converges, yielding the final optimal rotation and translation amounts.

[0063] In one specific implementation, various fitting algorithms can be used when performing matching fitting; please refer to [link to relevant documentation]. Figure 3 In a specific embodiment, the least squares method can be used for fitting. After obtaining the first and second position coordinates, the actual chip array is rotated and translated based on the least squares method to maximize the overlap between the actual chip array and the theoretical chip array. Specifically, the root mean square (RMS) of the distance between each chip is obtained after each rotation and translation until the RMS value of the distance is minimized; for example... Figure 3 As shown at points A and B, although the positions of each core particle may still have some deviation at this point, in the evaluation method of minimizing the root mean square value of the distance, it is considered that the maximum overlap has been achieved. During the fitting process using the least squares method, various optimization algorithms can be used to simplify the fitting process and quickly obtain the maximum overlap effect after matching and fitting, which will not be elaborated upon here.

[0064] S103. Obtain the fitting transformation matrix corresponding to the actual core array when the actual core array and the theoretical core array after rotation and translation transformation achieve maximum overlap.

[0065] Based on the aforementioned rotation and translation operations, the fitting transformation matrix is ​​obtained when the actual and theoretical core arrays achieve maximum overlap, i.e., when the root mean square value of the distance is minimized. The fitting transformation matrix can be solved using the Singular Value Decomposition (SVD) method.

[0066] S104. Calculate the third position information of the actual core array when maximizing overlap based on the first position information and the fitted transformation matrix;

[0067] The third position information of the actual core array is calculated based on the fitting transformation matrix when the root mean square value of the distance is minimized. In this embodiment, the third position information is the position coordinate of the core of the actual core array after fitting transformation.

[0068] S105. Calculate the core position degree of the actual core array based on the second position information and the third position information.

[0069] Please continue reading. Figure 3 as well as Figure 4 ,in, Figure 4 Indication Figure 3 Taking point A as an example, the deviation values ​​obtained during position measurement include three types of deviation values: vertical deviation, horizontal deviation, and hypotenuse deviation (or Euclidean deviation).

[0070] In addition, the core position test also includes, as please refer to, Figure 3The missing core particle is shown at point B. In step S102, when matching and fitting the actual core particle array and the theoretical core particle array, and obtaining the pairing relationship of core particle points between the two arrays, if some points in the actual core particle array are missing core particles, then some core particle points in the theoretical core particle array cannot be matched with corresponding core particle points. At this time, the core particle position degree at that point is considered to be the maximum deviation value. This maximum deviation value can be a preset value set according to the distance between core particle points. The method in this embodiment can accurately measure and calculate the core particle position degree, and its accuracy can reach a core particle position degree tolerance of less than 20 μm, with good repeatability of device position degree measurement.

[0071] In this embodiment, the defect degree of the actual core array is evaluated based on the core position degree according to a preset defect judgment rule. Specifically, the defect degree of the actual core array can be evaluated based on the measured core position degree and the missing status.

[0072] The method in the embodiments of the invention can achieve matching and alignment without the need for external reference points within the local field of view. Instead, it uses a self-reference method to match and fit the actual core matrix with the theoretical core matrix designed in order to obtain the position information of each corresponding core when maximizing the overlap, thereby obtaining and calculating the core position degree. This eliminates the steps of setting reference points and calculating the deviation of each reference point individually, simplifying the calculation and measurement steps of the core position degree, reducing the difficulty of calculating the core position degree when the core array rotates as a whole, and obtaining more accurate measurement results.

[0073] In one specific embodiment, the chip position measurement method can be used in the product manufacturing process, such as the manufacturing process of display elements for Micro-LED displays. After the chips are fixed to the substrate plane by chip transfer or other methods during manufacturing, the chip position measurement method described in this application can be used to determine whether the current chip position meets the requirements. If it does, the chip is considered a qualified product, and the next step of product manufacturing, such as a Micro-LED display, is based on the qualified display element. Chip-integrated components and products manufactured in this way can have a high pass rate, and the detection efficiency and product yield during the production process are improved.

[0074] The method for measuring the core position degree in the embodiments of the present invention has been described above. The measuring device for the core position degree in the embodiments of the present invention is described below. Please refer to [link / reference]. Figure 5 One embodiment of the core particle position measurement device in this invention includes:

[0075] The first position acquisition module 501 is used to acquire the first position information of the initial actual core array and the second position information of the theoretical core array.

[0076] The fitting module 502 is used to perform rotation and translation transformation on the actual core array to match and fit it with the theoretical core array;

[0077] The matrix calculation module 503 is used to obtain the fitting transformation matrix of the actual core array when the actual core array after rotation and translation transformation and the theoretical core array achieve maximum overlap.

[0078] The second position acquisition module 504 is used to calculate the third position information of the actual core array when maximizing the overlap based on the first position information and the fitting transformation matrix.

[0079] The position calculation module 505 is used to calculate the position degree of the actual core array based on the second position information and the third position information.

[0080] The embodiments of the present invention can achieve matching and alignment by matching and fitting the actual core matrix and the theoretical core matrix during design through a self-reference method without the need for external reference points within the local field of view, thereby obtaining and calculating the core position degree and obtaining relatively accurate measurement results.

[0081] In another embodiment of this application, the fitting module 502 is specifically used to: perform a rotation and translation transformation on the actual core array, calculate the root mean square value of the distance between each core in the rotated and translated actual core array and the corresponding core in the theoretical core array; when the root mean square value is the minimum, the rotated and translated actual core array and the theoretical core array achieve maximum overlap, thereby matching and fitting with the theoretical core array.

[0082] In another embodiment of this application, the matrix calculation module 503 is further configured to:

[0083] Obtain the positional correspondence between each core in the actual core array and each core in the theoretical core array when the root mean square value is minimized;

[0084] The position calculation module 505 is further used to: calculate the position degree of each core particle based on the second position information, the third position information and the position correspondence of each core particle.

[0085] In another embodiment of this application, the position calculation module 505 is further used to: calculate the horizontal deviation, vertical deviation and hypotenuse deviation between each corresponding core in the actual core array and the theoretical core array, so as to obtain the position of the core.

[0086] In another embodiment of this application, the first position acquisition module 501 is further configured to acquire a calibration plate image containing multiple feature points with known positions, and obtain a matrix image of the feature points; acquire the pixel coordinates of each feature point according to the matrix image of the feature points; calibrate the world coordinates of the motion platform according to the coordinates of the known feature points of the calibration plate and the coordinates of the image feature points, and obtain a calibration algorithm; acquire the pixel coordinates of each core particle in the core particle matrix arranged on the substrate plane, and convert the pixel coordinates of each core particle according to the calibration algorithm to obtain the first position information of the initial actual core particle array.

[0087] In another embodiment of this application, the measuring device for the core particle position degree further includes a defect assessment module, which is specifically used to: assess the degree of defect of the actual core particle array based on the core particle position degree according to a preset defect judgment rule.

[0088] The embodiments of the present invention can achieve matching and alignment without the need for external reference points within the local field of view. Instead, it uses a self-reference method to match and fit the actual core matrix with the theoretical core matrix designed in order to obtain the position information of each corresponding core when maximizing the overlap, thereby obtaining and calculating the core position degree. This eliminates the steps of setting reference points and calculating the deviation of each reference point individually, simplifying the calculation and measurement steps of the core position degree, reducing the difficulties brought about by the overall rotation of the core array in calculating the core position degree, and obtaining more accurate measurement results.

[0089] Please see Figure 6 Based on the same inventive concept, embodiments of this specification also provide a core particle position measurement device, which includes: a motion platform 601, an image acquisition unit 602, a memory, and at least one processor; the motion platform 601 adopts a mechanical screw, air-bearing, or magnetic levitation type, and its repeatability positioning accuracy within the entire effective stroke is 10 to 1000 nm; the motion platform 601 also has a grating ruler 603 capable of recording the position of the motion platform, and the resolution of the grating ruler 603 is 2 to 200 nm.

[0090] During operation, the core matrix 604 is arranged on the substrate plane 605, which remains relatively stationary with the motion platform 601 through static friction, vacuum adsorption, etc.; the substrate plane 605 is made of glass, sapphire, steel plate, or resin plate.

[0091] An image acquisition unit 602 is disposed above the motion platform. The image acquisition unit 602 is disposed perpendicular to the motion platform 601 and the substrate plane 605. It can acquire images of all the core particles contained on the substrate plane 605 on the motion platform 601, or acquire multiple images of the core particles contained on the substrate plane 605 and stitch them together to obtain an image of all the core particles contained on the substrate plane 605 on the motion platform 601. The image acquisition unit 602 can be a wired scanning camera, an area scan camera, or other cameras.

[0092] The measuring device for core position can perform the steps of the core position measurement method as described in the foregoing embodiments.

[0093] Based on the same inventive concept, embodiments of this specification also provide a computer-readable medium storing a computer program / instructions, characterized in that, when executed by a processor, the program / instructions implement the steps of the chip position measurement method as described in the foregoing embodiments. The computer program can be stored on one or more computer-readable media. The computer-readable medium can be a readable signal medium or a readable storage medium. A readable storage medium can be, for example, but not limited to, an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any combination thereof. More specific examples of readable storage media (a non-exhaustive list) include: an electrical connection having one or more wires, a portable disk, a hard disk, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fiber, portable compact disk read-only memory (CD-ROM), optical storage device, magnetic storage device, or any suitable combination thereof.

[0094] The computer-readable storage medium may include data signals propagated in baseband or as part of a carrier wave, carrying readable program code. Such propagated data signals may take various forms, including but not limited to electromagnetic signals, optical signals, or any suitable combination thereof. The readable storage medium may also be any readable medium other than a readable storage medium, capable of transmitting, propagating, or transmitting programs for use by or in connection with an instruction execution system, apparatus, or device. The program code contained on the readable storage medium may be transmitted using any suitable medium, including but not limited to wireless, wired, optical fiber, RF, etc., or any suitable combination thereof.

[0095] Program code for performing the operations of this invention can be written in any combination of one or more programming languages, including object-oriented programming languages ​​such as Java and C++, and conventional procedural programming languages ​​such as C or similar languages. The program code can execute entirely on the user's computing device, partially on the user's device, as a standalone software package, partially on the user's computing device and partially on a remote computing device, or entirely on a remote computing device or server. In cases involving remote computing devices, the remote computing device can be connected to the user's computing device via any type of network, including a local area network (LAN) or a wide area network (WAN), or it can be connected to an external computing device (e.g., via the Internet using an Internet service provider).

[0096] In summary, the present invention can be implemented in hardware, or as software modules running on one or more processors, or a combination thereof. Those skilled in the art will understand that in practice, general-purpose data processing devices such as microprocessors or digital signal processors (DSPs) can be used to implement some or all of the functions of some or all of the components according to the embodiments of the present invention. The present invention can also be implemented as a device or apparatus program (e.g., a computer program and computer program product) for performing part or all of the methods described herein. Such programs implementing the present invention can be stored on a computer-readable medium or can be in the form of one or more signals. Such signals can be downloaded from an Internet website, provided on a carrier signal, or provided in any other form.

[0097] In addition, the present invention also provides a computer program product, including a computer program / instructions that, when executed by a processor, implement the steps of the core position measurement method as described in the foregoing embodiments.

[0098] The specific embodiments described above further illustrate the purpose, technical solution, and beneficial effects of the present invention. It should be understood that the present invention is not inherently related to any specific computer, virtual device, or equipment, and various general-purpose devices can also implement the present invention. The above descriptions are merely specific embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

[0099] The various embodiments in this specification are described in a progressive manner. The same or similar parts between the various embodiments can be referred to each other. Each embodiment focuses on describing the differences from other embodiments.

[0100] The above description is merely an embodiment of this application and is not intended to limit the scope of this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of the claims of this application.

Claims

1. A method of measuring the position of a core pellet, characterized by, The method comprises the following steps: acquiring first position information of an initial actual seed array and second position information of a theoretical seed array; performing a rotation and translation transformation on the actual seed array, calculating a root mean square value of distances between each seed in the rotation and translation transformed actual seed array and corresponding seeds in the theoretical seed array, and when the root mean square value is the smallest, the rotation and translation transformed actual seed array and the theoretical seed array reach maximum coincidence, thereby matching and fitting the theoretical seed array; acquiring a position correspondence relationship between each seed in the actual seed array and each seed in the theoretical seed array when the root mean square value is the smallest; acquiring a fitting transformation matrix of the actual seed array when the rotation and translation transformed actual seed array and the theoretical seed array reach maximum coincidence; calculating third position information of the actual seed array when the maximum coincidence is reached according to the first position information and the fitting transformation matrix; calculating a seed position degree of the actual seed array according to the second position information, the third position information and the position correspondence relationship of each seed.

2. The method of claim 1, wherein The calculation of the position degree of each seed comprises: calculating horizontal deviation, vertical deviation and hypotenuse deviation between each corresponding seed in the actual seed array and the theoretical seed array to obtain the position degree of the seed.

3. The method of claim 1 or 2, wherein The acquisition of the first position information of the initial actual seed array comprises: collecting an image of a calibration board containing a plurality of feature points with known positions to obtain a matrix image of the feature points; acquiring pixel coordinates of each feature point according to the matrix image of the feature points; calibrating a world coordinate of a motion platform according to the coordinates of the known feature points of the calibration board and the coordinates of the image feature points to obtain a calibration algorithm; acquiring pixel coordinates of each seed of a seed matrix arranged on a substrate plane, and converting the pixel coordinates of each seed according to the calibration algorithm to obtain the first position information of the initial actual seed array.

4. The method of claim 1 or 2, wherein After the calculation of the seed position degree of the actual seed array according to the second position information, the third position information and the position correspondence relationship of each seed, the method further comprises: performing defect degree evaluation on the actual seed array based on the seed position degree according to a preset defect judgment rule.

5. A device for measuring the position of a core pellet, characterized by The seed position degree measuring device comprises: a first position acquisition module configured to acquire first position information of an initial actual seed array and second position information of a theoretical seed array; a fitting module configured to perform a rotation and translation transformation on the actual seed array, calculate a root mean square value of distances between each seed in the rotation and translation transformed actual seed array and corresponding seeds in the theoretical seed array, and when the root mean square value is the smallest, the rotation and translation transformed actual seed array and the theoretical seed array reach maximum coincidence, thereby matching and fitting the theoretical seed array; a matrix calculation module configured to acquire a position correspondence relationship between each seed in the actual seed array and each seed in the theoretical seed array when the root mean square value is the smallest, and acquire a fitting transformation matrix of the actual seed array when the rotation and translation transformed actual seed array and the theoretical seed array reach maximum coincidence; and a position degree calculation module configured to calculate a seed position degree of the actual seed array according to the second position information, the third position information and the position correspondence relationship of each seed. a second position acquisition module configured to calculate third position information of the actual core array when the maximum overlap is achieved based on the first position information and the fitting transformation matrix; a position degree calculation module configured to calculate the core position degree of the actual core array based on the second position information and the third position information and the position correspondence relationship of each core.

6. A core pellet position measuring device characterized by comprising: The core position degree measurement device comprises a motion platform, an image acquisition unit, a memory, and at least one processor, and the memory stores instructions. The at least one processor invokes the instructions in the memory to enable the core position degree measurement device to perform the steps of the core position degree measurement method according to any one of claims 1-4.

7. A computer-readable storage medium having stored thereon computer programs / instructions, characterized in that, The program / instructions enable the processor to perform the steps of the core position degree measurement method according to any one of claims 1-4 when executed.

8. A computer program product comprising computer programs / instructions, characterized in that, The computer program / instructions enable the processor to perform the steps of the core position degree measurement method according to any one of claims 1-4 when executed.

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