Packaging device for solid state hard disk

Abstract

The present invention relates to the technical field of packaging equipment, and in particular to a packaging equipment for solid-state hard disks, comprising an operating table, wherein the upper side of the operating table is connected to a solid-state hard disk substrate through a clamping mechanism to achieve position limiting and fixing of the solid-state hard disk substrate; in the present solution, two first baffles and two second baffles are assembled to cover the outer side of a solid-state hard disk chip, thereby limiting the flow range of glue liquid; during the glue injection process, the first baffle plate contacts the solid-state hard disk substrate, thereby fully injecting glue into the gap between the solid-state hard disk substrate and the solid-state hard disk chip; then, two inverted L-shaped plates move upward and move synchronously in the opposite direction, thereby achieving sufficient and uniform glue injection into the upper side and surface of the solid-state hard disk chip, and finally avoiding the use of a cofferdam glue injection method to improve the efficiency of the packaging process, and also avoiding the glue liquid flowing to other areas of the substrate due to lack of shielding during the glue injection process, which affects the normal use of other areas of the substrate.

Description

Technical Field

[0001] The present invention relates to the technical field of packaging equipment, and in particular to a packaging equipment for a solid state hard disk. Background Art

[0002] Solid-state drive, or SSD for short, is a hard drive made with an array of solid-state electronic storage chips;

[0003] The packaging process is to grind the wafer to a suitable thickness, cut the ground wafer to obtain wafer bare die, and then bond the wafer bare die to the substrate through adhesive. The substrate can be a PCB or lead frame, etc., and then bond the bonded wafer to achieve electrical connection between the wafer chip and the substrate. Finally, the connected chip is sealed and molded through mold connection or injection process. The purpose of chip sealing and packaging is to isolate and protect the chip surface, especially for devices such as solid-state hard drives that are disassembled and installed in the host. Glue injection and packaging of its chips can not only improve impact resistance but also facilitate uniform heat dissipation of the solid-state hard drive chip.

[0004] At present, most of the packaging technologies on the market are wire bonding packaging. This method of connecting contacts through gold wires is affected by the number of contacts. Therefore, chips with many contacts will use flip chip packaging during the packaging process. After flip chip packaging, glue needs to be injected on the surface for protection. The traditional glue injection method is to inject glue through the cofferdam first and then inject the filling glue. The filling glue will quickly fill the space between the substrate and the chip due to the siphon principle, but this glue injection packaging method still has some obvious defects. If the cofferdam injection is not used first to limit the range of the filling glue, it will cause the filling glue to overflow and affect the use of other areas of the substrate. Even if the filling glue is cut later, it will be very troublesome. If the cofferdam injection is performed first, it needs to be dried and cured after the cofferdam, and then the filling glue is injected for secondary drying and curing, which greatly wastes production and processing time. For this reason, we propose a packaging device for solid-state drives. Summary of the invention

[0005] The purpose of the present invention is to solve the shortcomings of the prior art and to propose a packaging device for a solid state hard disk.

[0006] To achieve the above purpose, the technical solution adopted by the present invention is: a packaging device for a solid-state hard disk, comprising an operating table, the upper side of the operating table is connected to a solid-state hard disk substrate through a clamping mechanism to achieve limiting and fixing of the solid-state hard disk substrate, the upper end surface of the solid-state hard disk substrate is fixedly connected to a solid-state hard disk chip, the upper side of the solid-state hard disk substrate is provided with two first baffles, the end surfaces of the two first baffles close to each other are fixedly connected to two limiting blocks, two second baffles are provided between the two first baffles, both left and right end surfaces of the two second baffles are chiseled with limiting grooves, the four limiting blocks slide up and down in the four limiting grooves respectively, and the solid-state hard disk chip is located between the two second baffles and the two first baffles;

[0007] A glue injection mechanism is provided between the two first baffles, and the glue injection mechanism is used to fill glue between the solid state drive chip and the solid state drive substrate and to inject glue to seal the surface of the solid state drive chip;

[0008] A heating mechanism is provided on the upper side of the operating table, and the heating mechanism is used to heat and solidify the injection glue liquid;

[0009] The upper end surface of the operating table is fixedly connected with a support frame, the support frame is located on the upper side of the two first baffles, and the lower side of the support frame is provided with a lifting mechanism, which is used for pulling and driving the two first baffles to move up and down.

[0010] Preferably, the clamping mechanism includes four L-shaped clamping plates, the upper end surface of the operating table is provided with a receiving groove, the solid state hard disk substrate is placed in the receiving groove, the front, back, left and right end surfaces of the operating table are provided with threaded holes, the four threaded holes are threadedly connected with a first screw rod, the four end surfaces away from each other of the four first screw rods are fixedly connected with a handle, the four L-shaped clamping plates are respectively squeezed and fitted on the front, back, left and right end surfaces of the solid state hard disk substrate, and the four first screw rods are rotatably connected to one end surfaces of the four L-shaped clamping plates through four limit rings.

[0011] Preferably, the glue injection mechanism includes two inverted L-shaped plates, and an accommodating cavity is bored in one end surface of the two first baffles that are close to each other, and the two inverted L-shaped plates are respectively connected to the two accommodating cavities by sliding up and down, and two limiting connecting rods are fixedly connected to the upper part between the two first baffles to limit the two inverted L-shaped plates, and the upper end surfaces of the two inverted L-shaped plates are fixedly connected to a glue supply box containing glue liquid inside, and the upper end surfaces of the two inverted L-shaped plates are fixedly connected to a glue supply pump, and the feed pipes of the two glue supply pumps are respectively connected to the two glue supply boxes, and a connecting cavity and a plurality of glue injection cavities are bored in the two inverted L-shaped plates, and the plurality of glue injection cavities are respectively connected to each other through the two connecting cavities, and the discharge pipes of the two glue supply pumps are respectively connected to the two connecting cavities, and a distance adjustment component is arranged between the two inverted L-shaped plates, and the distance adjustment component is used to adjust the distance between the two inverted L-shaped plates.

[0012] Preferably, the pitch adjustment assembly includes two threaded connection blocks, the two threaded connection blocks are respectively fixedly connected to the upper end surfaces of the two inverted L-shaped plates, the two threaded connection blocks are both threadedly connected with a second screw rod, and the thread directions of the two second screw rods are opposite, a first transmission plate is fixedly connected between the two second screw rods, a second transmission plate is arranged on the upper side of the first transmission plate, a transmission belt is sleeved between the second transmission plate and the first transmission plate, and the first transmission plate and the second transmission plate are connected by transmission belt transmission, a servo motor for driving the second transmission plate to rotate is fixedly connected to the right end surface of the second transmission plate, and the servo motor is fixedly connected to the lifting mechanism.

[0013] Preferably, the heating mechanism includes four square grooves, which are respectively excavated at an end surface away from the two first baffles and the two second baffles, and heating resistance wires are fixedly connected in the four square grooves, and the four heating resistance wires are electrically connected to an external power supply. A glue suction component is provided on the upper side of the two inverted L-shaped plates, and the glue suction component is used to evacuate the stored glue in multiple glue injection cavities before heating and curing.

[0014] Preferably, the glue suction assembly includes two glue storage boxes, the two glue storage boxes are respectively fixedly connected to the upper end surfaces of the two inverted L-shaped plates, the upper end surfaces of the two inverted L-shaped plates are fixedly connected with glue suction pumps, the discharge pipes of the two glue suction pumps are respectively connected to the two glue storage boxes, and the feed pipes of the two glue suction pumps are respectively connected to the two connecting chambers.

[0015] Preferably, the lifting mechanism includes an electric telescopic rod, which is fixedly connected to the lower end surface of the support frame, the output end of the electric telescopic rod is fixedly connected to a connecting plate, the servo motor is fixedly connected to the lower end surface of the connecting plate, a slideway assembly for connecting the inverted L-shaped plates and the connecting plates is provided between the two inverted L-shaped plates and the connecting plates, and a limit assembly for preventing the connecting plates from rotating is provided between the connecting plates and the support frame.

[0016] Preferably, the slide assembly includes two slide rails, the two slide rails are fixedly connected to the lower end surface of the connecting plate, the upper end surfaces of the two glue storage boxes and the two glue supply boxes are fixedly connected with T-shaped sliders, and the four glue storage boxes are respectively slidably connected to the two slide rails left and right.

[0017] Preferably, the limiting assembly includes two limiting outer tubes, both of which are fixedly connected to the lower end surface of the support frame, both of which are slidably connected to the limiting inner tube, and the lower end surfaces of the two limiting inner tubes are fixedly connected to the upper end surface of the connecting plate.

[0018] Compared with the prior art, the present invention has the following beneficial effects:

[0019] (1) In this scheme, two first baffles and two second baffles are combined to cover the outside of the solid-state hard disk chip, so as to limit the flow range of the glue liquid. During the glue injection process, the first baffle is in contact with the solid-state hard disk substrate, so as to fully inject glue into the gap between the solid-state hard disk substrate and the solid-state hard disk chip. Then, the two inverted L-shaped plates move upward and move synchronously in the opposite direction, so as to fully and evenly inject glue into the upper side and surface of the solid-state hard disk chip. After the glue injection is completed, the glue liquid is heated and cured by the heating mechanism set on the first baffle and the second baffle. Finally, the lifting mechanism first pulls the two first baffles away from the surface of the solidified glue, and then pulls the two second baffles away from the surface of the solidified glue. At the same time, the second baffle and the first baffle are made of ceramic material, so as to reduce the friction between the solidified glue and the first baffle and the second baffle, thereby facilitating the separation of the first baffle and the second baffle from the surface of the solidified glue. Finally, the cofferdam glue injection method is avoided to improve the efficiency of the packaging process, and it is also avoided that the glue liquid flows to other areas of the substrate due to lack of shielding during the glue injection process, affecting the normal use of other areas of the substrate.

[0020] (2) In this solution, the solid-state hard disk substrate is positioned and limited by a clamping mechanism, so that the second baffle plate and the first baffle plate can accurately cover the outside of the solid-state hard disk chip. At the same time, when the second baffle plate and the first baffle plate are removed, the solid-state hard disk substrate can be avoided from being pulled and lifted from the upper surface of the operating table, thereby facilitating the separation of the second baffle plate and the first baffle plate from the solidified colloid.

[0021] (3) In this scheme, before using the heating mechanism to solidify the glue liquid, the remaining glue liquid in the glue injection cavity is evacuated by the glue suction component, which is beneficial to avoid the residual glue liquid in the glue injection cavity being heated and solidified, causing blockage of the glue injection cavity, thereby facilitating the subsequent continuous glue filling of other chips. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 A perspective view of the present invention;

[0023] Figure 2 is a three-dimensional cross-sectional view of the present invention;

[0024] Figure 3 for Figure 2 A magnified image of point A;

[0025] Figure 4 for Figure 3 A magnified view of point B;

[0026] Figure 5 It is a three-dimensional exploded view of the first baffle of the present invention;

[0027] Figure 6 A three-dimensional diagram of the first baffle and the second baffle of the present invention;

[0028] Figure 7 A three-dimensional view of the inverted L-shaped plate of the present invention;

[0029] Figure 8 A three-dimensional diagram of the first baffle of the present invention;

[0030] Fig. 9 It is a three-dimensional diagram of the second baffle of the present invention.

[0031] In the figure: 1. operating table; 101. receiving slot; 2. support frame; 201. electric telescopic rod; 202. outer limit tube; 203. inner limit tube; 204. connecting plate; 3. L-shaped clamping plate; 301. limit ring; 302. threaded hole; 303. first screw rod; 304. handle; 4. SSD substrate; 401. SSD chip; 5. slide rail; 501. T-shaped slide block; 502. glue storage box; 503. glue suction pump; 504. first baffle; 5041, limit block; 5042, accommodating chamber; 505, second baffle; 5051, limit groove; 506, inverted L-shaped plate; 5061, glue injection chamber; 5062, connecting chamber; 507, limit connecting rod; 508, glue supply pump; 509, glue supply box; 6, square groove; 601, heating resistor wire; 7, threaded connecting block; 701, second screw; 702, first transmission disc; 703, transmission belt; 704, servo motor; 705, second transmission disc. DETAILED DESCRIPTION

[0032] The following description is used to disclose the present invention so that those skilled in the art can implement the present invention. The preferred embodiments described below are only examples, and those skilled in the art may think of other obvious variations.

[0033] Please refer to Figures 1 to 9 A packaging device for a solid-state hard disk shown in the figure comprises an operating table 1, the upper side of the operating table 1 is connected to a solid-state hard disk substrate 4 through a clamping mechanism to realize limiting and fixing the solid-state hard disk substrate 4, the upper end surface of the solid-state hard disk substrate 4 is fixedly connected to a solid-state hard disk chip 401, two first baffles 504 are arranged on the upper side of the solid-state hard disk substrate 4, two limiting blocks 5041 are fixedly connected to one end surface of the two first baffles 504 that are close to each other, two second baffles 505 are arranged between the two first baffles 504, limiting grooves 5051 are cut on both left and right end surfaces of the two second baffles 505, four limiting blocks 5041 slide up and down in the four limiting grooves 5051 respectively, and the solid-state hard disk chip 401 is located between the two second baffles 505 and the two first baffles 504;

[0034] A glue injection mechanism is provided between the two first baffles 504, and the glue injection mechanism is used to fill glue between the solid state drive chip 401 and the solid state drive substrate 4 and to inject glue to seal the surface of the solid state drive chip 401;

[0035] A heating mechanism is provided on the upper side of the operating table 1, and the heating mechanism is used to heat and solidify the injection glue liquid;

[0036] The upper end surface of the operating table 1 is fixedly connected with a support frame 2, which is located on the upper side of the two first baffles 504. A lifting mechanism is arranged on the lower side of the support frame 2, and the lifting mechanism is used to pull and drive the two first baffles 504 to move up and down.

[0037] The specific implementation method is as follows: when the device is needed to package the chip on the solid-state hard disk substrate, the chip with the substrate is placed on the operating table 1, and the position of the substrate and the chip is fixed by adjusting the clamping mechanism so that the chip is located directly below the two first baffles 504 and the two second baffles 505. The lifting mechanism is opened to drive the two second baffles 505 to move downward. When the second baffles 505 contact the substrate, the lifting mechanism continues to move downward to drive the two first baffles 504 to contact the substrate, so that the two first baffles 504 and the two second baffles 505 are closed into a square shape to cover the outside of the chip. The lifting mechanism continues to move downward to drive the glue injection mechanism to contact the substrate, and the glue injection mechanism is opened to inject glue into the gap between the substrate and the chip. Filling, when the filling is completed, the lifting mechanism is opened to move the glue injection mechanism upward and the glue injection mechanism is opened at the same time to realize uniform glue injection filling on the chip surface. Due to the shielding of the first baffle 504 and the second baffle 505, the glue will not flow to other areas and affect the use of other areas of the substrate. When the glue injection filling is completed, the heating mechanism is opened to heat and solidify the glue between the first baffle 504 and the second baffle 505 until the glue is fixed, and then the heating mechanism is closed. The lifting mechanism is opened to drive the first baffle 504 to move upward and separate from the surface of the solidified glue. The lifting mechanism continues to move upward to drive the second baffle 505 to separate from the surface of the solidified glue, and then the clamping mechanism is opened to remove the substrate, and finally the glue injection packaging of the solid state drive substrate chip is completed;

[0038] In this solution, two second baffles 505 and two first baffles 504 are used to limit and block the chip, and the gap between the substrate and the chip is injected with glue by the glue injection mechanism. Then, the glue injection mechanism is adjusted to inject glue to fill the upper side and the periphery of the chip. After the injection is completed, the heating mechanism is used to heat and cure the chip. Finally, the lifting mechanism is adjusted to separate the two first baffles 504 from the solidified glue first, and then separate the two second baffles 505 from the solidified glue, so as to avoid the solidified glue being pulled up by too much friction during the separation of the first baffle 504 and the second baffle 505. Finally, the efficiency of the packaging process is improved by avoiding the use of the cofferdam injection method, and the glue is prevented from flowing to other areas of the substrate due to the lack of shielding during the injection process, which affects the normal use of other areas of the substrate.

[0039] It is worth mentioning that in the present solution, the outer sides of the lower end surfaces of the two second baffles 505 and the two first baffles 504 can be fixedly connected with elastic rubber pads, so that when the second baffles 505 and the first baffles 504 are pressed and fixed on the substrate, the gaps between the second baffles 505 and the first baffles 504 and the substrate can be fully sealed to prevent the glue from flowing out. At the same time, the second baffles 505 and the first baffles 504 in the present solution can be made of ceramic material, which is beneficial to reduce the friction between the cured glue and the second baffles 505 and the first baffles 504, thereby facilitating the second baffles 505 and the first baffles 504 to separate from the surface of the cured glue. At the same time, since ceramics have excellent thermal conductivity, it is convenient for the heating mechanism to heat and cure the glue through heat conduction.

[0040] As an embodiment of the present invention, the clamping mechanism includes four L-shaped clamping plates 3, the upper end surface of the operating table 1 is provided with a receiving groove 101, the solid state hard disk substrate 4 is placed in the receiving groove 101, and the front, back, left and right four end surfaces of the operating table 1 are provided with threaded holes 302, and the four threaded holes 302 are threadedly connected with first screws 303, and the end surfaces away from the four first screws 303 are fixedly connected with handles 304, and the four L-shaped clamping plates 3 are respectively squeezed and fitted on the front, back, left and right four end surfaces of the solid state hard disk substrate 4, and the four first screws 303 are rotatably connected to one end surface of the four L-shaped clamping plates 3 through four limit rings 301.

[0041] The specific implementation is as follows. When it is necessary to use a clamping mechanism to fix the position of the solid-state hard disk chip 401, the solid-state hard disk chip 401 is placed in the accommodating slot 101, the position of the solid-state hard disk chip 401 is adjusted, and the rotating handle 304 drives the first screw 303 to rotate, and the L-shaped clamping plate 3 is driven to move through the threaded cooperation of the first screw 303 and the threaded hole 302. The solid-state hard disk chip 401 is clamped and fixed by the movement of the four L-shaped clamping plates 3, so that the subsequent first baffle plate 504 and the second baffle plate 505 can be accurately covered on the outside of 402 through the lifting mechanism. At the same time, when the lifting mechanism drives the second baffle plate 505 and the first baffle plate 504 to move upward, it can avoid pulling the solid-state hard disk substrate 4 upward, which makes it easier to separate the second baffle plate 505 from the first baffle plate 504 and the solidified glue.

[0042] As an embodiment of the present invention, the glue injection mechanism includes two inverted L-shaped plates 506, and the end surfaces of the two first baffles 504 close to each other are each opened with a receiving cavity 5042. The two inverted L-shaped plates 506 are respectively slidably connected to the two receiving cavities 5042, and the upper part between the two first baffles 504 is fixedly connected with two limiting connecting rods 507 to limit the two inverted L-shaped plates 506. The upper end surfaces of the two inverted L-shaped plates 506 are each fixedly connected with a glue supply box 509 containing glue liquid inside. The two inverted L-shaped plates 506 The upper end surfaces of the two inverted L-shaped plates 506 are fixedly connected with glue supply pumps 508, and the feed pipes of the two glue supply pumps 508 are respectively connected to the two glue supply boxes 509. A connecting cavity 5062 and a plurality of glue injection cavities 5061 are excavated in the two inverted L-shaped plates 506, and the plurality of glue injection cavities 5061 are respectively connected to each other through the two connecting cavities 5062. The discharge pipes of the two glue supply pumps 508 are respectively connected to the two connecting cavities 5062. A distance adjustment component is provided between the two inverted L-shaped plates 506, and the distance adjustment component is used to adjust the distance between the two inverted L-shaped plates 506.

[0043] The pitch adjustment component includes two threaded connection blocks 7, which are respectively fixedly connected to the upper end surfaces of the two inverted L-shaped plates 506. The second screws 701 are threadedly connected in the two threaded connection blocks 7, and the thread directions of the two second screws 701 are opposite. A first transmission disk 702 is fixedly connected between the two second screws 701. A second transmission disk 705 is arranged on the upper side of the first transmission disk 702. A transmission belt 703 is sleeved between the second transmission disk 705 and the first transmission disk 702, and the first transmission disk 702 and the second transmission disk 705 are connected for transmission via the transmission belt 703. A servo motor 704 for driving the second transmission disk 705 to rotate is fixedly connected to the right end surface of the second transmission disk 705, and the servo motor 704 is fixedly connected to the lifting mechanism.

[0044] The specific implementation is as follows. When it is necessary to inject glue between the first baffle plate 504 and the second baffle plate 505, the lifting mechanism is opened to drive the inverted L-shaped plate 506 to slide downward in the accommodating cavity 5042 until the lower end surface of the inverted L-shaped plate 506 contacts the solid state hard disk substrate 4, and the glue supply pump 508 is turned on. The glue supply pump 508 extracts the glue in the glue supply box 509 and injects it into the connecting cavity 5062. The glue in the connecting cavity 5062 enters the multiple glue injection cavities 5061. Since the glue outlets of the multiple glue injection cavities 5061 are aligned with the gap between the solid state hard disk substrate 4 and the solid state hard disk chip 401 at this time, it is convenient to realize the glue injection between the solid state hard disk substrate 4 and the solid state hard disk. The gap between the chips 401 is fully filled. When the gap between the SSD substrate 4 and the SSD chip 401 is filled, the lifting mechanism is turned on to drive the inverted L-shaped plate 506 to move upward, thereby changing the position of the glue outlet of the glue injection cavity 5061, and then the servo motor 704 is turned on. The output end of the servo motor 704 rotates to drive the second transmission disk 705 to rotate, and the first transmission disk 702 is driven to rotate through the transmission belt 703, thereby driving the two second screws 701 with opposite thread directions to rotate, and then driving the two inverted L-shaped plates 506 to move synchronously in the opposite direction, and finally realizing uniform glue injection filling of the upper surface and the periphery of the SSD chip 401;

[0045] It is worth mentioning that since the first baffle plate 504 and the second baffle plate 505 are made of ceramic material and have a certain weight, the inverted L-shaped plate 506 will not be conducive to the friction force driving the first baffle plate 504 and the second baffle plate 505 to move upward and separate from the substrate during the upward movement. In actual use, counterweights can be added to the first baffle plate 504 and the second baffle plate 505 to increase the weight to overcome the problem of friction between the inverted L-shaped plate 506 and the first baffle plate 504. A robotic arm can also be used to fix the position of the first baffle plate 504 after the first baffle plate 504 contacts the substrate to prevent the first baffle plate 504 from being pulled upward by the friction force of the inverted L-shaped plate 506.

[0046] As an embodiment of the present invention, the heating mechanism includes four square grooves 6, which are respectively excavated on one end surface away from the two first baffles 504 and the two second baffles 505, and the four square grooves 6 are fixedly connected with heating resistance wires 601, and the four heating resistance wires 601 are electrically connected to an external power supply. The upper side of the two inverted L-shaped plates 506 is provided with a glue suction component, and the glue suction component is used to evacuate the stored glue in the multiple glue injection cavities 5061 before heating and curing;

[0047] The glue suction assembly includes two glue storage boxes 502, which are respectively fixedly connected to the upper end surfaces of two inverted L-shaped plates 506, and the upper end surfaces of the two inverted L-shaped plates 506 are fixedly connected with glue suction pumps 503. The discharge pipes of the two glue suction pumps 503 are respectively connected to the two glue storage boxes 502, and the feed pipes of the two glue suction pumps 503 are respectively connected to the two connecting chambers 5062.

[0048] The specific implementation is as follows. When the glue liquid needs to be heated and cured, the glue suction pump 503 is first opened to pump the remaining glue liquid in the glue injection cavity 5061 into the glue storage box 502, which is beneficial to avoid blockage caused by the curing of the glue liquid in the glue injection cavity 5061, and is convenient for subsequent glue injection. After the glue liquid in the glue injection cavity 5061 is emptied, the four heating resistors 601 are connected to an external power supply, so that the temperature of the heating resistors 601 cooperates with the first baffle 504 and the second baffle 505 made of ceramic material to achieve uniform heat conduction to heat and cure the internal glue liquid.

[0049] As an embodiment of the present invention, the lifting mechanism includes an electric telescopic rod 201, the electric telescopic rod 201 is fixedly connected to the lower end surface of the support frame 2, the output end of the electric telescopic rod 201 is fixedly connected to the connecting plate 204, the servo motor 704 is fixedly connected to the lower end surface of the connecting plate 204, a slideway assembly for connecting the inverted L-shaped plates 506 and the connecting plate 204 is provided between the two inverted L-shaped plates 506 and the connecting plate 204, and a limit assembly for preventing the connecting plate 204 from rotating is provided between the connecting plate 204 and the support frame 2;

[0050] The slideway assembly includes two slide rails 5, both of which are fixedly connected to the lower end surface of the connecting plate 204, and the upper end surfaces of the two glue storage boxes 502 and the two glue supply boxes 509 are fixedly connected with T-shaped sliders 501, and the four glue storage boxes 502 are respectively slidably connected to the two slide rails 5;

[0051] The limiting assembly includes two limiting outer tubes 202, both of which are fixedly connected to the lower end surface of the support frame 2, and both of which are slidably connected to the limiting inner tube 203, and the lower end surfaces of the two limiting inner tubes 203 are fixedly connected to the upper end surface of the connecting plate 204.

[0052] The specific implementation is as follows: when the lifting mechanism needs to be adjusted, the electric telescopic rod 201 is turned on, the output end of the electric telescopic rod 201 moves to drive the connecting plate 204 to move up and down, and the connecting plate 204 moves up and down to drive the slide rail 5 to move, thereby driving the T-shaped slider 501 to move up and down, and then driving the inverted L-shaped plate 506 to move up and down, and the limit of the limit connecting rod 507 and the limit block 5041 are cooperated to adjust the upper and lower positions of the first baffle 504 and the second baffle 505. Due to the sliding setting of the T-shaped slider 501 The T-shaped slider 501 is in the slide rail 5, so that the slide rail 5 can pull the T-shaped slider 501 to move up and down synchronously without interfering with the left and right movement of the two inverted L-shaped plates 506, thereby facilitating the inverted L-shaped plate 506 to move and inject glue on the upper side of the solid-state hard disk chip 401. The limiting inner tube 203 slides on the limiting outer tube 202, which is beneficial to prevent the output end of the electric telescopic rod 201 from rotating by itself and causing the connecting plate 204 to rotate, thereby facilitating the first baffle plate 504 and the second baffle plate 505 to accurately cover the outside of the solid-state hard disk chip 401 for limiting and shielding.

[0053] Working principle of the present invention: When it is necessary to use the device to package the chip on the solid-state hard disk substrate, the chip with the substrate is placed on the operating table 1, and the positions of the substrate and the chip are fixed by adjusting the clamping mechanism so that the chip is located directly below the two first baffles 504 and the two second baffles 505, and the lifting mechanism is opened to drive the two second baffles 505 to move downward. When the second baffles 505 contact the substrate, the lifting mechanism continues to move downward to drive the two first baffles 504 to contact the substrate, so that the two first baffles 504 and the two second baffles 505 are closed into a square shape to cover the outside of the chip, and the lifting mechanism continues to move downward to drive the glue injection mechanism to contact the substrate, and the glue injection mechanism is opened to inject glue into the gap between the substrate and the chip. Filling. When the filling is completed, the lifting mechanism is opened to move the glue injection mechanism upward and the glue injection mechanism is opened at the same time to achieve uniform glue injection filling on the chip surface. Due to the shielding of the first baffle 504 and the second baffle 505, the glue will not flow to other areas and affect the use of other areas of the substrate. When the glue injection filling is completed, the heating mechanism is turned on to heat and solidify the glue between the first baffle 504 and the second baffle 505 until the glue is fixed, and then the heating mechanism is turned off. The lifting mechanism is opened to drive the first baffle 504 to move upward and separate from the surface of the solidified glue. The lifting mechanism continues to move upward to drive the second baffle 505 to separate from the surface of the solidified glue, and then the clamping mechanism is opened to remove the substrate, and finally the glue injection packaging of the solid state drive substrate chip is completed.

[0054] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments, and the above embodiments and descriptions only describe the principles of the present invention. The present invention may have various changes and improvements without departing from the spirit and scope of the present invention, and these changes and improvements fall within the scope of the present invention to be protected, and the scope of protection claimed by the present invention is defined by the attached claims and their equivalents.

Claims

1. A packaging device for a solid state hard disk, comprising an operating table (1), characterized in that: The upper side of the operating table (1) is connected to a solid state hard disk substrate (4) via a clamping mechanism to achieve position-limiting fixation of the solid state hard disk substrate (4); the upper end surface of the solid state hard disk substrate (4) is fixedly connected to a solid state hard disk chip (401); two first baffles (504) are arranged on the upper side of the solid state hard disk substrate (4); two limit blocks (5041) are fixedly connected to the adjacent end surfaces of the two first baffles (504); two second baffles (505) are arranged between the two first baffles (504); limit grooves (5051) are cut on both left and right end surfaces of the two second baffles (505); the four limit blocks (5041) slide up and down in the four limit grooves (5051) respectively; and the solid state hard disk chip (401) is located between the two second baffles (505) and the two first baffles (504); A glue injection mechanism is provided between the two first baffles (504), the glue injection mechanism being used to inject glue into the space between the solid state drive chip (401) and the solid state drive substrate (4) and to inject glue to seal the surface of the solid state drive chip (401); A heating mechanism is provided on the upper side of the operating table (1), and the heating mechanism is used to heat and solidify the injection glue liquid; The upper end surface of the operating table (1) is fixedly connected to a support frame (2), the support frame (2) is located on the upper side of the two first baffles (504), and a lifting mechanism is provided on the lower side of the support frame (2), the lifting mechanism is used to pull and drive the two first baffles (504) to move up and down; The glue injection mechanism comprises two inverted L-shaped plates (506), and a receiving cavity (5042) is cut on the adjacent end surfaces of the two first baffles (504). The two inverted L-shaped plates (506) are respectively slidably connected in the two receiving cavities (5042) up and down. Two limiting connecting rods (507) are fixedly connected to the upper part between the two first baffles (504) to limit the position of the two inverted L-shaped plates (506). The upper end surfaces of the two inverted L-shaped plates (506) are fixedly connected to a glue supply box (509) containing glue liquid inside. The upper end surfaces of the two inverted L-shaped plates (506) are fixedly connected to the glue supply box (509) containing glue liquid inside. A glue supply pump (508) is fixedly connected, and the feed pipes of the two glue supply pumps (508) are respectively connected to the two glue supply boxes (509); a connecting cavity (5062) and a plurality of glue injection cavities (5061) are respectively opened in the two inverted L-shaped plates (506), and the plurality of glue injection cavities (5061) are respectively connected to each other through the two connecting cavities (5062); the discharge pipes of the two glue supply pumps (508) are respectively connected to the two connecting cavities (5062); and a distance adjustment component is provided between the two inverted L-shaped plates (506), and the distance adjustment component is used to adjust the distance between the two inverted L-shaped plates (506); The lifting mechanism drives the two second baffles (505) to move downwards, and when the second baffles (505) contact the substrate, the lifting mechanism continues to move downwards to drive the two first baffles (504) to contact the substrate, and the lifting mechanism continues to move downwards to drive the glue injection mechanism to contact the substrate.

2. A packaging device for a solid state hard disk according to claim 1, characterized in that: The clamping mechanism comprises four L-shaped clamping plates (3); an upper end surface of the operating table (1) is provided with a receiving groove (101); the solid state hard disk substrate (4) is placed in the receiving groove (101); threaded holes (302) are provided on the front, rear, left and right end surfaces of the operating table (1); first screw rods (303) are threadedly connected in the four threaded holes (302); a handle (304) is fixedly connected to the end surfaces of the four first screw rods (303) that are away from each other; the four L-shaped clamping plates (3) are respectively pressed and fitted on the front, rear, left and right end surfaces of the solid state hard disk substrate (4); and the four first screw rods (303) are rotatably connected to one end surface of the four L-shaped clamping plates (3) through four limit rings (301).

3. The packaging device for a solid state drive according to claim 1, characterized in that: The pitch adjustment assembly comprises two threaded connection blocks (7), the two threaded connection blocks (7) being fixedly connected to the upper end surfaces of two inverted L-shaped plates (506) respectively, the two threaded connection blocks (7) being threadedly connected with second screw rods (701), and the thread directions of the two second screw rods (701) are opposite, a first transmission disc (702) being fixedly connected between the two second screw rods (701), a second transmission disc (705) being arranged on the upper side of the first transmission disc (702), a transmission belt (703) being sleeved between the second transmission disc (705) and the first transmission disc (702), and the first transmission disc (702) and the second transmission disc (705) being transmission-connected via the transmission belt (703), a servo motor (704) for driving the second transmission disc (705) to rotate being fixedly connected to the right end surface of the second transmission disc (705), and the servo motor (704) being fixedly connected to the lifting mechanism.

4. A packaging device for a solid state drive according to claim 3, characterized in that: The heating mechanism comprises four square grooves (6), the four square grooves (6) are respectively excavated at one end surface of the two first baffles (504) and the two second baffles (505) away from each other, a heating resistance wire (601) is fixedly connected in each of the four square grooves (6), and the four heating resistance wires (601) are electrically connected to an external power supply, and a glue suction component is arranged on the upper side of the two inverted L-shaped plates (506), and the glue suction component is used to evacuate the glue stored in the multiple glue injection cavities (5061) before heating and curing.

5. The packaging device for a solid state hard disk according to claim 4, characterized in that: The glue suction assembly comprises two glue storage boxes (502), the two glue storage boxes (502) are respectively fixedly connected to the upper end surfaces of two inverted L-shaped plates (506), the upper end surfaces of the two inverted L-shaped plates (506) are both fixedly connected to glue suction pumps (503), the discharge pipes of the two glue suction pumps (503) are respectively connected to the two glue storage boxes (502), and the feed pipes of the two glue suction pumps (503) are respectively connected to the two connecting cavities (5062).

6. The packaging device for a solid state drive according to claim 5, characterized in that: The lifting mechanism comprises an electric telescopic rod (201), the electric telescopic rod (201) being fixedly connected to the lower end surface of the support frame (2), the output end of the electric telescopic rod (201) being fixedly connected to a connecting plate (204), the servo motor (704) being fixedly connected to the lower end surface of the connecting plate (204), a slideway assembly for connecting the inverted L-shaped plates (506) and the connecting plate (204) being provided between the two inverted L-shaped plates (506) and the connecting plate (204), and a limit assembly for preventing the connecting plate (204) from rotating being provided between the connecting plate (204) and the support frame (2).

7. The packaging device for a solid state drive according to claim 6, characterized in that: The slideway assembly comprises two slide rails (5), the two slide rails (5) are fixedly connected to the lower end surface of the connecting plate (204), the upper end surfaces of the two glue storage boxes (502) and the two glue supply boxes (509) are fixedly connected to T-shaped sliders (501), and the four glue storage boxes (502) are respectively slidably connected to the two slide rails (5) left and right.

8. The packaging device for a solid state drive according to claim 6, characterized in that: The position limiting assembly comprises two position limiting outer tubes (202), the two position limiting outer tubes (202) are fixedly connected to the lower end surface of the support frame (2), the two position limiting outer tubes (202) are slidably connected to the position limiting inner tube (203), and the lower end surfaces of the two position limiting inner tubes (203) are fixedly connected to the upper end surface of the connecting plate (204).

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