Packaging method of microsystem in cartridge case and cartridge body

Abstract

The invention discloses a packaging method of a microsystem in a cartridge case and a cartridge body in the technical field of ammunition high overload resistance protection, and aims to solve the problem that in the prior art, the microsystem is easily damaged under the action of transmission stress and high-frequency vibration caused by launching overload. The method comprises the following steps: transmission stress and high-frequency vibration are greatly attenuated when spreading across different first encapsulating materials, so that the influence of overload vibration on a microsystem is gradually reduced; the launching overload is spread forwards from the missile tail, overload vibration is transmitted to the later segment with the larger size from the former segment with the smaller size, and due to the inconsistent sectional sizes, part of vibration is transmitted to the second semi-finished product encapsulation part, so that the overload vibration borne by the micro-system module is reduced, and the reliability of the micro-system module is improved. The overload vibration is weakened through continuous cross-segment propagation accumulation; when the second encapsulating material integrally bears the overload transmitted from the bullet tail, the overload impact can be converted into the force expanding towards the periphery to extrude the bullet shell, and the overload borne by the microsystem is also reduced.

Description

Technical Field

[0001] The invention relates to a packaging method for a microsystem in a cartridge case and a cartridge body, belonging to the technical field of high overload protection of ammunition. Background Art

[0002] Micro-intelligent ammunition is a guided munition with target recognition and maneuvering tracking capabilities. This type of ammunition uses the microsystem inside the projectile to achieve target recognition and control the engine for maneuvering tracking. The various modules of the microsystem can be subdivided into detection, flight control, energy, and drive. However, when the ammunition is launched, it will produce a large overload acceleration. During this process, each internal module will be subjected to a large launch overload. Each microsystem module is easily damaged by the transfer stress and high-frequency vibration caused by the launch overload. Summary of the invention

[0003] The purpose of the present application is to overcome the deficiencies in the prior art and to provide a method for packaging a microsystem in a cartridge case and a projectile body that reduce the risk of damage to the microsystem during ammunition firing.

[0004] In order to achieve the above objectives, this application is implemented by adopting the following technical solutions: In a first aspect, the present application provides a method for packaging a microsystem in a cartridge, comprising: Selecting a corresponding first potting material according to the overload resistance upper limit value of each microsystem module; Placing the microsystem into a mold, and sequentially pouring a corresponding first potting material into each microsystem module to obtain a second semi-finished potting component, wherein the second semi-finished potting component includes a plurality of segments with successively decreasing cross-sectional sizes; Placing the second semi-finished potting component into the cartridge case in the order of the smaller cross-sectional dimensions of the segments closer to the tail of the cartridge; The second semi-finished potting component is potted in the cartridge case using a second potting material.

[0005] In some embodiments of the first aspect, the mold includes a plurality of cavity segments with successively decreasing cross-sectional sizes, the microsystem is placed in the mold, and the corresponding first potting material is poured into each microsystem module in turn to obtain a second semi-finished potted part.

[0006] In some embodiments of the first aspect, after the second semi-finished potting part is directly obtained, the surface of the second semi-finished potting part is roughened.

[0007] In some embodiments of the first aspect, after each microsystem module is sequentially injected with the corresponding first potting material, a first semi-finished potting part is obtained; and a plurality of segments with successively decreasing cross-sectional sizes are cut out on the first semi-finished potting part to obtain a second semi-finished potting part.

[0008] In some embodiments of the first aspect, after obtaining the second semi-finished potting part, a section with the largest cross-sectional size is cut along the axial direction to obtain a planar section; The second semi-finished potting component is potted in the cartridge case using a second potting material, including pouring the second potting material between the planar cut surface and the inner wall of the cartridge case.

[0009] In some embodiments of the first aspect, interfaces between different first encapsulation materials and interfaces between different segments are spaced a set distance apart.

[0010] In a second aspect, the present application also provides a projectile, comprising: Shells and second semi-finished potting parts; The second semi-finished potting component includes a plurality of micro-system modules potted by different first potting materials; The second semi-finished potting component is potted in the cartridge case by a second potting material. The second semi-finished potting component further comprises a plurality of segments, and the closer the segment is to the tail of the cartridge, the smaller the cross-sectional size is.

[0011] In some embodiments of the second aspect, interfaces between different first encapsulation materials and interfaces between different segments are spaced a set distance apart.

[0012] In some embodiments of the second aspect, the segment with the largest cross-sectional dimension includes a flat cut surface formed by flat cutting along the axial direction, and a second potting material is poured between the flat cut surface and the inner wall of the cartridge case.

[0013] In some embodiments of the second aspect, the second potting material and the first potting material are epoxy resins of different types.

[0014] Compared with the prior art, the present invention has the following beneficial effects: The packaging method and projectile of the microsystem in the shell provided by the present application have different overload vibration transmission capabilities of each first potting material for different frequencies and amplitudes, so that the transferred stress and high-frequency vibration will be greatly attenuated when propagating across different first potting materials, thereby gradually reducing the influence of the overload vibration on the microsystem; the launch overload starts to propagate forward from the tail of the projectile, so the smaller the radius of the segment size closer to the tail of the projectile, the overload influence on the microsystem module close to the tail of the projectile can be reduced, and at the interface of different segments, the previous segment with a smaller size transmits the overload vibration to the next segment with a larger size, and due to the inconsistent cross-sectional sizes, the overload vibration After entering the next larger segment, the vibration does not propagate strictly along the axis, but propagates obliquely to the side of the segment due to the difference in cross-sectional dimensions. Part of the vibration will be transmitted to the second semi-finished potting part, reducing the overload vibration of the microsystem module; the overload vibration is cumulatively weakened by continuously propagating across segments; the second potting material is subjected to the overload vibration transmission of the second semi-finished potting part inside, and the contact surface between the second potting material and the second semi-finished potting part can be approximately regarded as an inclined surface. Therefore, when the second potting material as a whole bears the overload transmitted from the tail of the bullet, it will convert the overload impact into a force that expands and squeezes the shell outward, also reducing the overload on the microsystem. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions in the present application or the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0016] Figure 1 It is a schematic diagram of the structure of the shell near the microsystem in the projectile provided in this embodiment; Figure 2 is a schematic structural diagram of a second semi-finished potting component in the elastic body provided in this embodiment; Figure 3 It is a schematic structural diagram of the shell after the second semi-finished potting part in the projectile body provided in this embodiment is potted in the shell by the second potting material without showing the shell; Figure 4 Schematic diagram of the steps of the encapsulation method of the microsystem in the cartridge case provided by the present embodiment; In the figure: 1. Shell; 1.1. Bullet tail; 2. Second semi-finished potting part; 21. First module; 22. Second module; 23. Third module; 24. Section boundary line; 3. Second potting material; 4. Flat cut surface. DETAILED DESCRIPTION

[0017] The following will be combined with the drawings in the embodiments of this application / this application to clearly and completely describe the technical solutions in the embodiments of this application / this application. Obviously, the described embodiments are only part of the embodiments of this application / this application, not all of the embodiments. The following description of at least one exemplary embodiment is actually only illustrative and is by no means intended to limit the application / this application and its application or use. Embodiment 1

[0018] This embodiment provides a packaging method for a microsystem in a cartridge case to solve the problem in the prior art that the microsystem in the cartridge case has poor overload resistance and is easily damaged when subjected to overload during ammunition firing.

[0019] refer to Figure 4 The packaging method of the microsystem in the cartridge case provided in this embodiment includes: Select the corresponding first potting material according to the overload resistance upper limit of each microsystem module, Place the microsystem into the mold, and sequentially inject the corresponding first potting material into each microsystem module to obtain a second semi-finished potting component 2, wherein the second semi-finished potting component 2 includes a plurality of segments with successively decreasing cross-sectional dimensions; The second semi-finished potting part 2 is placed into the cartridge case 1 in the order of the smaller cross-sectional size of the segment closer to the tail 1.1; The second semi-finished potting component 2 is potted in the cartridge case 1 using the second potting material 3 .

[0020] Since the various modules of the microsystem can be further divided into detection, flight control, energy, and drive, etc., and different types of microsystem modules have different overload resistance capabilities, this embodiment uses a variety of different first potting materials to pot microsystem modules with different functions, taking into account both overload resistance and economy; since each first potting material has different overload vibration transmission capabilities of different frequencies and amplitudes, the transferred stress and high-frequency vibration will be greatly attenuated when propagating across different first potting materials, thereby gradually reducing the impact of overload vibration on the microsystem. The launch overload starts to propagate forward from the tail 1.1, so the smaller the radius of the segment size is, the smaller the segment size is, which can reduce the overload effect on the microsystem module near the tail. In addition, at the interface of different segments, the previous segment with a smaller size transmits the overload vibration to the next segment with a larger size. Due to the inconsistent cross-sectional dimensions, the overload vibration does not strictly propagate along the axis after entering the next segment with a larger size, but propagates obliquely to the side of the segment due to the difference in cross-sectional dimensions, and part of the vibration will be transmitted to the second semi-finished potting part 2, reducing the overload vibration of the microsystem module; the overload vibration is cumulatively weakened by continuous cross-segment propagation. In addition, the second potting material 3 is subjected to the overload vibration transmission of the second semi-finished potting part 2 inside, and the contact surface between the second potting material 3 and the second semi-finished potting part 2 can be approximately regarded as an inclined surface. Therefore, when the second potting material 3 as a whole bears the overload transmitted from the tail 1.1, it will convert the overload impact into a force that expands and squeezes the shell 1 outward, which also reduces the overload on the microsystem. Embodiment 2

[0021] This embodiment provides a packaging method for a microsystem in a cartridge case. This embodiment is optimized on the basis of the first embodiment to improve the technical effect and refine the technical solution. For details not fully described in this embodiment, please refer to the first embodiment.

[0022] As one of the embodiments, in the process of making the second semi-finished potting part 2, a mold can be prefabricated according to the set shape of the second semi-finished potting part 2, and the various modules of the microsystem are placed in the mold in sequence according to the design. Different first potting materials are poured into the mold respectively, and the mold is demolded after the first potting material solidifies to directly obtain the second semi-finished potting part 2.

[0023] The second semi-finished potting part 2 obtained by this method has a relatively smooth segmented side surface. During the secondary potting process, the smooth side surface may be difficult to effectively combine with the second potting material 3. Therefore, the surface of the second semi-finished potting part 2 is roughened. In this way, during the secondary potting process, the bonding degree between the second semi-finished potting part 2 and the second potting material 3 can be improved.

[0024] The second semi-finished potting part 2 can also be made by another method. After each micro-system module is sequentially poured with the corresponding first potting material, a first semi-finished potting part is temporarily obtained; a plurality of sections with successively decreasing cross-sectional sizes are cut out on the first semi-finished potting part to obtain the second semi-finished potting part 2. The surface of each section of the second semi-finished potting part 2 obtained in this way is obtained by cutting, and has a texture similar to that after roughening, and can also be reliably combined with the second potting material 3.

[0025] refer to Figure 2 As one embodiment, after obtaining the second semi-finished potting part 2, the section with the largest cross-sectional size is cut along the axial direction to obtain a flat section 4; Figure 3 , the second semi-finished potting part 2 is potted in the cartridge case 1 using the second potting material 3, including pouring the second potting material 3 between the plane cut surface 4 and the inner wall of the cartridge case 1. The plane cut surface 4 has at least two functions: 1. The unsolidified second potting material 3 flows into the area between other segments and the inner wall of the cartridge case 1 through the cavity between the plane cut surface 4 and the inner wall of the cartridge case 1 during pouring; 2. The gap between the segment with the largest cross-sectional size and the inner wall of the cartridge case 1 is too small or there is no gap. The plane cut surface 4 is cut to increase the gap between the segment with the largest cross-sectional size and the inner wall of the cartridge case 1, thereby increasing the pouring amount of the second potting material 3, thereby increasing the ability of the second potting material 3 to absorb overload, and promoting the second potting material 3 to convert overload impact into a force that expands and squeezes the cartridge case 1 outward toward the side of the plane cut surface 4.

[0026] In addition, in order to prevent stress concentration, as one embodiment, the interfaces between different first encapsulation materials and the interfaces between different segments are separated by a set distance. Figure 2 and Figure 3 In this embodiment, the microsystem includes three modules: Figure 2 The first semi-finished potting component 2 composed of the first module 21, the second module 22 and the third module 23 is poured with three different first potting materials, namely the first module 21, the second module 22 and the third module 23, and has two sections with different cross-sectional sizes, as shown in FIG. Figure 3 The segment boundary line 24 is located in the middle of the second module 22, avoiding the interface between the first module 21 and the second module 22 and the interface between the second module 22 and the third module 23. Figure 3 After the second potting material 3 is poured, the smaller segment is completely wrapped by the poured second potting material 3 , while the planar cut surface 4 of the larger segment is poured by the second potting material 3 . Embodiment 3

[0027] This embodiment provides a body, referring to Figure 4The projectile provided in this embodiment can be encapsulated with the microsystem inside the shell 1 by the encapsulation method of the microsystem inside the shell provided in the first or second embodiment. Figure 1 and Figure 3 The projectile body provided in this embodiment includes a shell 1 and a second semi-finished potting part 2; the second semi-finished potting part 2 includes a plurality of microsystem modules potted with different first potting materials; the second semi-finished potting part 2 is potted in the shell 1 with a second potting material 3, and the second semi-finished potting part 2 also includes a plurality of segments, and the closer to the tail 1.1 of the projectile, the smaller the cross-sectional size of the segment.

[0028] The projectile provided in this embodiment has a microsystem inside the shell 1 with good anti-launch overload capability. In view of the corresponding technical effect description, please refer to the discussion of embodiment 1 or 2 for details, which will not be repeated here.

[0029] As one embodiment, the segment with the largest cross-sectional size in the second semi-finished potting part 2 includes a flat cut surface 8 formed by flat cutting along the axial direction, and the second potting material 3 is poured between the flat cut surface 8 and the inner wall of the shell 1. Please refer to the discussion of the first or second embodiment for the function of the flat cut surface 8, which will not be repeated here.

[0030] As one embodiment, the second potting material 3 and the first potting material are epoxy resins of different types. Since each first potting material has different vibration transmission capabilities for different frequencies and amplitudes, the second potting material 3 and the first potting material also have different vibration transmission capabilities for different frequencies and amplitudes. The transfer stress and high-frequency vibration will be greatly attenuated when propagating across different first potting materials, or when the transfer stress and high-frequency vibration propagates from the first potting material to the second potting material 3, thereby gradually reducing the impact of overload vibration on the microsystem.

[0031] By doping different components and contents into epoxy resin, epoxy resins with different properties and types can be formulated.

[0032] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and the like are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", and the like may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0033] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "provided at", "provided with", "located", "installed", "set", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, or it can be internal communication between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances. "Hinged" includes "rotational connection".

[0034] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the technical principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A method for packaging a microsystem in a cartridge, characterized in that: include, Selecting a corresponding first potting material according to the overload resistance upper limit value of each microsystem module; Placing the microsystem into a mold, and sequentially pouring a corresponding first potting material into each microsystem module to obtain a second semi-finished potting component (2), wherein the second semi-finished potting component (2) comprises a plurality of segments with successively decreasing cross-sectional dimensions; Placing the second semi-finished potting component (2) into the cartridge case (1) in the order of the smaller cross-sectional dimensions of the segments closer to the cartridge tail (1.1); The second semi-finished potting component (2) is potted in the cartridge case (1) using a second potting material (3).

2. The packaging method of the microsystem in the cartridge case according to claim 1, characterized in that: The mold comprises a plurality of cavity sections with successively decreasing cross-sectional dimensions, the microsystem is placed in the mold, and the corresponding first potting material is poured into each microsystem module in turn to obtain a second semi-finished potted part (2).

3. The packaging method of the microsystem in the cartridge case according to claim 2, characterized in that: After the second semi-finished potting part (2) is directly obtained, the surface of the second semi-finished potting part (2) is roughened.

4. The packaging method of the microsystem in the cartridge case according to claim 1, characterized in that: After each microsystem module is sequentially injected with a corresponding first potting material, a first semi-finished potting component is obtained; and a plurality of sections with successively decreasing cross-sectional dimensions are cut out of the first semi-finished potting component to obtain a second semi-finished potting component (2).

5. The packaging method of the microsystem in the cartridge case according to claim 1, characterized in that: After obtaining the second semi-finished potting part (2), the segment with the largest cross-sectional size is cut along the axial direction to obtain a planar section (4); The second semi-finished potting component (2) is potted in the cartridge case (1) using a second potting material (3), including pouring the second potting material (3) between the planar cut surface (4) and the inner wall of the cartridge case (1).

6. The packaging method of the microsystem in the cartridge case according to claim 1, characterized in that: The interfaces between different first encapsulation materials and the interfaces between different segments are spaced at a set distance.

7. A projectile, characterized in that: include, A cartridge case (1) and a second semi-finished potting component (2); The second semi-finished potting component (2) comprises a plurality of micro-system modules potted with different first potting materials; The second semi-finished potting component (2) is potted in the cartridge case (1) by means of a second potting material (3), and the second semi-finished potting component (2) further comprises a plurality of segments, wherein the closer the segment is to the tail (1.1), the smaller the cross-sectional size of the segment is.

8. The projectile according to claim 7, characterized in that: The interfaces between different first encapsulation materials and the interfaces between different segments are spaced at a set distance.

9. The projectile according to claim 7, characterized in that: The segment with the largest cross-sectional dimension comprises a planar cut surface (8) formed by planar cutting along the axial direction, and a second potting material (3) is poured between the planar cut surface (8) and the inner wall of the cartridge case (1).

10. The elastic body according to any one of claims 7 to 9, wherein the second potting material (3) and the first potting material are epoxy resins of different types.

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