A method for studying cumulative effects of intense electromagnetic pulses on communication interface chips

Abstract

The application belongs to the technical field of electromagnetic environment effect. The application provides a method for researching cumulative effect of strong electromagnetic pulse of a communication interface chip. On the basis of ensuring normal transceiving of a communication interface circuit, a miniaturized test platform suitable for various ports, high repeatability, high measurability, easy observation of strong electromagnetic pulse effect phenomenon of the interface circuit, acquisition of corresponding threshold data, and further investigation and positioning of sensitive weak links is designed and built, and a test scheme of cumulative effect is proposed, thereby laying a foundation for interface reinforcement and protection of the communication device interface circuit.

Description

Technical Field

[0001] This disclosure relates to the field of electromagnetic environment effects technology, and in particular to a method for studying the cumulative effect of strong electromagnetic pulses for communication interface chips. Background Technology

[0002] Communication interface circuits, as the primary information exchange module between the internal circuits of individual electronic devices and external transmission cables, are crucial for information acquisition and communication. However, the high-intensity, wide-bandwidth electromagnetic pulses released instantaneously when irradiating electronic systems, such as nuclear electromagnetic pulses and ultra-wideband high-power microwave electromagnetic pulses, can easily cause short-term functional failures or permanent performance degradation, even damage, to the electronic components within the wired communication interface circuit. This leads to system malfunctions, degradation, or even damage to the communication system, posing a severe threat to communication and the entire electronic system. Therefore, to ensure the stable and normal operation of communication systems under electromagnetic pulse influence, the study of their effect sensitivity characteristics is a fundamental research priority.

[0003] In related technologies, research on the response characteristics of electronic systems, electronic devices, or semiconductor devices is mainly conducted through experiments. Damage thresholds for electronic devices are obtained based on different experimental methods and apparatuses, and corresponding protective designs are then developed. However, research on interference effects in electronic devices is limited, and there are currently no clear experimental methods for studying the cumulative effects of communication interface chips.

[0004] Domestic and international experimental research in the field of communications often focuses on the entire communication system. However, communication systems are composed of numerous integrated circuits and electronic components, making it difficult to pinpoint specific weak points. Furthermore, for different types of communication signals, researchers use dedicated communication systems or equipment for testing, resulting in high costs and a lack of widely applicable, highly repeatable, and easily observable experimental systems. Summary of the Invention

[0005] To avoid the shortcomings of the prior art, this application provides a method for studying the cumulative effect of strong electromagnetic pulses in communication interface chips. This method addresses the lack of a widely applicable, highly efficient, and reliable test platform system for wired communication interface circuits that can accurately and reliably obtain their failure thresholds without affecting the normal operation of the interface circuit. It also addresses the problem that there are no clear test methods and test results for the cumulative effect.

[0006] According to embodiments of this disclosure, a method for studying the accumulation effect of strong electromagnetic pulses in communication interface chips is provided, the method comprising:

[0007] An injection test platform for an interface chip is constructed. The platform includes a pulse injection source, a transmitting signal acquisition control board, and a receiving signal acquisition control board. The transmitting signal acquisition control board is connected to the receiving signal acquisition control board. The pulse injection source is connected to both the transmitting and receiving signal acquisition control boards to inject pulse voltages into them. The transmitting signal acquisition control board includes a first information processing module, a first serial communication module, a first Ethernet communication module, a first human-machine interaction module, and a first power supply module. The receiving signal acquisition control board includes a second information processing module, a second serial communication module, a second Ethernet communication module, a second human-machine interaction module, and a second power supply module.

[0008] The first interface chip and the second interface chip are respectively installed on the first serial communication module and the second serial communication module, and the threshold voltage is tested on the first interface chip and the second interface chip to obtain the threshold voltage.

[0009] Based on the threshold voltage, cumulative effect tests were performed on the first interface chip and the second interface chip respectively to obtain the number of injections;

[0010] Damage localization analysis is performed on the transmitting end signal acquisition control board and the receiving end signal acquisition control board to obtain damage localization results;

[0011] If the damage location result indicates that the interface chip is damaged, then damage analysis is performed on the interface chip to obtain the interface chip damage analysis result.

[0012] Furthermore, in the transmitting end signal acquisition and control board, the first information processing module is electrically connected to the first serial communication module, the first Ethernet communication module, the first human-machine interaction module, and the first power supply module, respectively; the first power supply module is electrically connected to the first information processing module, the first serial communication module, and the first Ethernet communication module, respectively; wherein,

[0013] The first information processing module is used to generate data information and send the data information to the first serial communication module. The first information processing module interacts with the first serial communication module, the first Ethernet communication module and the first human-machine interaction module, processes the interaction information sent by each module and controls each module.

[0014] The first serial communication module is used to send the data information to the receiving end signal acquisition and control board;

[0015] The first Ethernet communication module is used to encapsulate or parse the data sent by the information processing module, and to send and receive data.

[0016] The first human-computer interaction module is used for human-computer interaction;

[0017] The first power supply module is used to supply power to the information processing module, the serial communication module, the Ethernet communication module and the human-computer interaction module.

[0018] Furthermore, in the transmitting end signal acquisition and control board, the second information processing module is electrically connected to the second serial communication module, the second Ethernet communication module, the second human-machine interaction module, and the second power supply module, respectively. The second power supply module is electrically connected to the second information processing module, the second serial communication module, and the second Ethernet communication module, respectively.

[0019] The second information processing module is used to receive the data information sent by the second serial communication module. The second information processing module interacts with the second serial communication module, the second Ethernet communication module and the second human-machine interaction module, processes the interaction information sent by each module and controls each module.

[0020] The second serial communication module is used to receive the data information sent by the first serial communication module and send the data information to the second information processing module;

[0021] The second Ethernet communication module is used to encapsulate or parse the data sent by the information processing module, and to send and receive data.

[0022] The second human-computer interaction module is used for human-computer interaction;

[0023] The second power supply module is used to supply power to the information processing module, the serial communication module, the Ethernet communication module and the human-computer interaction module.

[0024] Furthermore, the first serial communication module includes a detachable first serial interface plug-in board and a first optocoupler isolator, the first optocoupler isolator being used for signal isolation and being disposed between the first serial interface plug-in board and the first information processing module;

[0025] The second serial communication module has the same structure as the first serial communication module.

[0026] Furthermore, the transmitting end signal acquisition control board also includes:

[0027] The first reserved test point group is used to monitor the input and output status of each module on the transmitting end signal acquisition control board, determine whether the module is working properly, and thus troubleshoot and locate the fault of the transmitting end signal acquisition control board.

[0028] The receiving end signal acquisition control board also includes:

[0029] The second reserved test point group is used to monitor the input and output status of each module on the receiving end signal acquisition control board, determine whether the module is working properly, and thus troubleshoot and locate the fault of the receiving end signal acquisition control board.

[0030] Furthermore, the step of installing the first interface chip and the second interface chip on the first serial communication module and the second serial communication module respectively, and performing a threshold voltage test on the first interface chip and the second interface chip to obtain the threshold voltage includes:

[0031] Using a direct injection method, the core wires of the output line of the pulse injection source are connected to the data transmission lines of the transmitting end signal acquisition control board and the receiving end signal acquisition control board, respectively, and the shielding layer of the output line of the pulse injection source is connected to the ground wires of the transmitting end signal acquisition control board and the receiving end signal acquisition control board, respectively.

[0032] Select the matching first interface chip and second interface chip according to the type of the first serial interface plug-in board and the second serial interface plug-in board, and install the first interface chip and the second interface chip on the first serial interface plug-in board and the second serial interface plug-in board respectively for threshold voltage testing.

[0033] The injection current of the output line of the pulse injection source is monitored using a current clamp, and the port voltage of the transmitting end signal acquisition control board and the receiving end signal acquisition control board is monitored using a voltage probe. The power is turned on so that the first power supply module and the second power supply module supply power to each module.

[0034] Configure the communication rate, hardware verification method, stop bit, message length, message content and data transmission interval of the first serial interface plug-in board and the second serial interface plug-in board, so that the transmitting end signal acquisition control board cyclically sends the data information and the receiving end signal acquisition control board receives the data information.

[0035] Connect an oscilloscope, observe the data transmission status through the human-computer interaction module and the oscilloscope, and capture the signal waveform. Determine whether the first interface chip and the second interface chip are in normal working condition based on the data transmission status and the signal waveform.

[0036] Set the charging voltage of the pulse injection source and trigger it, and record the data transmission status, port voltage and injection current displayed by the first human-machine interaction module and the second human-machine interaction module;

[0037] If the data transmission between the first serial interface plug-in board and the second serial interface plug-in board is normal and the communication is not interrupted, then the charging voltage of the pulse injection source is changed and triggered, and the data transmission status, port voltage and injection current displayed by the first human-machine interaction module and the second human-machine interaction module are recorded until the data transmission of the first serial interface plug-in board or the second serial interface plug-in board is abnormal.

[0038] If the data transmission of the first serial interface plug-in board or the second serial interface plug-in board is abnormal, the transmitting end signal acquisition control board and the receiving end signal acquisition control board shall be restarted. If the problem still cannot be resolved, the injected voltage shall be recorded as the threshold voltage.

[0039] Furthermore, the step of performing a cumulative effect test on the first interface chip and the second interface chip respectively based on the threshold voltage to obtain the number of injections includes:

[0040] Replace the first interface chip and the second interface chip on the first serial interface plug-in board and the second serial interface plug-in board;

[0041] The human-computer interaction module is used to observe the data transmission status and capture signal waveforms. Based on the data transmission status and signal waveforms, it is determined whether the serial interface plug-in board is in normal working condition.

[0042] Configure the communication rate, hardware verification method, stop bit, message length, message content and data transmission interval of the first serial interface plug-in board and the second serial interface plug-in board, so that the transmitting end signal acquisition control board cyclically sends the data information and the receiving end signal acquisition control board receives the data information.

[0043] The test voltage of the pulse injection source is set to half of the threshold voltage and triggered. The data transmission status, port voltage and injection current displayed by the human-machine interaction module are recorded.

[0044] If the data transmission between the first serial interface plug-in board and the second serial interface plug-in board is normal and the communication is not interrupted, then the charging voltage remains unchanged and the triggering continues, recording the data transmission status, port voltage and injected current displayed by the first human-machine interaction module and the second human-machine interaction module, until the data transmission between the first serial interface plug-in board or the second serial interface plug-in board is abnormal.

[0045] If the data transmission of the first serial interface plug-in board or the second serial interface plug-in board is abnormal, the transmitting end signal acquisition control board and the receiving end signal acquisition control board shall be restarted. If the problem still cannot be resolved, the number of injections shall be recorded.

[0046] Furthermore, the step of performing damage localization analysis on the transmitting end signal acquisition control board and the receiving end signal acquisition control board to obtain damage localization results includes:

[0047] By investigating the signal transmission link, damage localization analysis is performed on the signal acquisition and control board to obtain the damage localization results.

[0048] Furthermore, if the damage localization result indicates damage to the interface chip, the step of performing damage analysis on the interface chip to obtain the interface chip damage analysis result includes:

[0049] If the damage location result indicates that the interface chip is damaged, determine the functional pins of the first interface chip and the second interface chip according to the chip's datasheet;

[0050] The resistance of each pin pair of the failed first and second interface chips and the first and second interface chips with good performance is measured using a multimeter. At the same time, the diode setting of the multimeter is used to assist in the judgment. The results are compared with normal chips to find the damaged pins, so as to determine the location and mode of damage.

[0051] The technical solutions provided by the embodiments of this disclosure may include the following beneficial effects:

[0052] In the embodiments of this disclosure, the above-described method for studying the cumulative effect of strong electromagnetic pulses on communication interface chips, on the one hand, ensures the normal transmission and reception of the communication interface circuit, and designs and builds a miniaturized test platform that is suitable for multiple ports, has high repeatability and measurability, facilitates the observation of strong electromagnetic pulse effect phenomena of the interface circuit, obtains corresponding threshold data, and can further investigate and locate its sensitive weak links. On the other hand, a test scheme for the cumulative effect is proposed, laying the foundation for the interface reinforcement and protection of the communication equipment interface circuit. Attached Figure Description

[0053] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure. It is obvious that the drawings described below are merely some embodiments of this disclosure, and those skilled in the art can obtain other drawings based on these drawings without any inventive effort.

[0054] Figure 1 A flowchart illustrating the steps of a method for studying the accumulation effect of strong electromagnetic pulses in a communication interface chip according to an exemplary embodiment of this disclosure;

[0055] Figure 2 The diagram shows a PCB layout of the signal acquisition control board in an exemplary embodiment of this disclosure.

[0056] Figure 3 A physical diagram of the signal acquisition control board in an exemplary embodiment of this disclosure is shown;

[0057] Figure 4 A minimum system diagram of the main controller in an exemplary embodiment of this disclosure is shown;

[0058] Figure 5 This diagram illustrates the feedback principle in an exemplary embodiment of this disclosure.

[0059] Figure 6 This diagram illustrates the schematic of the UART interface isolation circuit in an exemplary embodiment of this disclosure.

[0060] Figure 7 A schematic diagram of a serial communication interface socket and a serial communication plug on a signal acquisition control board in an exemplary embodiment of this disclosure is shown.

[0061] Figure 8 This diagram illustrates the RS-232 circuit schematic in an exemplary embodiment of this disclosure.

[0062] Figure 9 This diagram illustrates the schematic of a liquid crystal module in an exemplary embodiment of this disclosure.

[0063] Figure 10 This diagram illustrates the principle of infrared remote control in an exemplary embodiment of this disclosure.

[0064] Figure 11 This illustrates the data transmission settings interface of the sending end in an exemplary embodiment of this disclosure;

[0065] Figure 12 This illustrates the data transmission settings interface of the receiving end in an exemplary embodiment of this disclosure;

[0066] Figure 13 This illustrates the communication statistics interface in an exemplary embodiment of this disclosure;

[0067] Figure 14 A flowchart illustrating the threshold voltage test in an exemplary embodiment of this disclosure is shown;

[0068] Figure 15 A flowchart illustrating the cumulative effect test flow in an exemplary embodiment of this disclosure is shown. Detailed Implementation

[0069] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the examples set forth herein; rather, they are provided so that this disclosure will be more comprehensive and complete, and will fully convey the concept of the exemplary embodiments to those skilled in the art. The described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

[0070] Furthermore, the accompanying drawings are merely illustrative diagrams of embodiments of this disclosure and are not necessarily drawn to scale. The same reference numerals in the drawings denote the same or similar parts, and therefore repeated descriptions of them will be omitted. Some block diagrams shown in the drawings are functional entities and do not necessarily correspond to physically or logically independent entities.

[0071] This example implementation provides a method for studying the accumulation effect of strong electromagnetic pulses in communication interface chips. (Reference) Figure 1 As shown, the method for studying the accumulation effect of strong electromagnetic pulses for communication interface chips may include steps S101 to S105.

[0072] Step S101: Construct an injection test platform for the interface chip. The injection test platform for the interface chip includes a pulse injection source, a transmitting end signal acquisition control board, and a receiving end signal acquisition control board. The transmitting end signal acquisition control board is connected to the receiving end signal acquisition control board. The pulse injection source is connected to both the transmitting end signal acquisition control board and the receiving end signal acquisition control board to inject pulse voltages into them respectively. The transmitting end signal acquisition control board includes a first information processing module, a first serial communication module, a first Ethernet communication module, a first human-machine interaction module, and a first power supply module. The receiving end signal acquisition control board includes a second information processing module, a second serial communication module, a second Ethernet communication module, a second human-machine interaction module, and a second power supply module.

[0073] Step S102: Install the first interface chip and the second interface chip on the first serial communication module and the second serial communication module respectively, and perform threshold voltage tests on the first interface chip and the second interface chip to obtain the threshold voltage;

[0074] Step S103: Based on the threshold voltage, perform cumulative effect tests on the first interface chip and the second interface chip respectively to obtain the number of injections;

[0075] Step S104: Perform damage location analysis on the transmitting end signal acquisition control board and the receiving end signal acquisition control board to obtain damage location results;

[0076] Step S105: If the damage location result is that the interface chip is damaged, then perform damage analysis on the interface chip to obtain the interface chip damage analysis result.

[0077] Based on the above-mentioned research method for the strong electromagnetic pulse accumulation effect of communication interface chips, on the one hand, while ensuring the normal transmission and reception of the communication interface circuit, a miniaturized test platform was designed and built that is suitable for multiple ports, has high repeatability and measurability, facilitates the observation of the strong electromagnetic pulse effect phenomenon of the interface circuit, obtains the corresponding threshold data, and can further investigate and locate its sensitive weak links. On the other hand, a test scheme for the accumulation effect was proposed, laying the foundation for the interface reinforcement and protection of communication equipment interface circuits.

[0078] Below, we will refer to Figures 1 to 15 The steps of the method for studying the accumulation effect of strong electromagnetic pulses for communication interface chips described above in this example embodiment will be explained in more detail.

[0079] In step S101, the test-specific signal acquisition and control board consists of modules such as an information processing module, a serial communication module, an Ethernet communication module, a human-machine interaction module, and a power supply module. Figure 2 and Figure 3 These are the PCB diagram and physical image of the test-specific signal acquisition and control board.

[0080] Information processing module:

[0081] It is primarily responsible for information interaction with other modules and is the core unit of the information processing module. This application selects the high-performance 32-bit processor chip STM32F407VET6 as the main controller. Figure 4 The minimum system diagram of the main controller mainly consists of SWD interface circuit, power supply circuit, system clock circuit, and startup mode selection circuit.

[0082] Serial communication module:

[0083] Considering the diversity of interface circuits, and to facilitate the modification of different types of interface boards during the experiment, this application designs the serial communication interface section as an independently usable detachable plug-in board. Each plug-in board shares the optocoupler isolation on the signal acquisition and control board, and the plug-in uses an independent 5V power supply.

[0084] Various UART communication interfaces share the main controller's USART1 interface. Different plug-ins are used to implement RS232, RS-485, and RS-422 communication. The CAN interface is independently connected to the plug-in socket, where the original UART transmit / receive signal lines of the main controller are replaced with plug-in ID identification signals. For example... Figure 5 The diagram shown is a feedback principle diagram.

[0085] The ID of the plug-in board is read through two signal lines. [ID1:ID0] can form four different combinations. The ID definitions of each serial communication plug-in are shown in the table below:

[0086] Table 1. ID Definitions for Serial Communication Plug-in Boards

[0087]

[0088] To reduce the impact of external electromagnetic interference on the main control chip, an isolation circuit is required between the serial interface plug-in board and the main control chip. Since this application focuses on the impact of external electromagnetic pulse interference on the communication interface circuit, the isolation circuit needs to have fast switching characteristics; therefore, an optocoupler is used for signal isolation. The optocoupler isolates the interference signal while also converting between 3.3V LVTTL and 5V TTL levels. Figure 6 The diagram shown is a schematic of the UART interface isolation circuit.

[0089] To facilitate frequent insertion and removal during the experiment, PCB terminals with a spacing of 3.81mm were selected to meet the usage requirements. For example... Figure 7 The image shows the serial communication interface socket and serial communication plug-in on the signal acquisition control board.

[0090] Since this application investigates the HEMP effect in typical interface circuits, it aims to direct injected HEMP interference to the communication interface circuit as much as possible to obtain more accurate threshold data. Therefore, the serial communication interface plug-in boards used in the experiment do not have any protective devices. The RS-232 circuit schematic is shown below. Figure 8 As shown.

[0091] Ethernet communication module:

[0092] There are two common design schemes for Ethernet. One is to port the TCP / IP protocol stack to the main controller, encapsulate or parse the data in the main controller, and the Ethernet chip only needs to send and receive data. The other is to integrate the TCP / IP protocol internally into the Ethernet chip, and connect the Ethernet chip and the main controller through an SPI communication interface. The main controller is responsible for data preparation, while the Ethernet chip encapsulates or parses the data and is responsible for sending and receiving data. Since the main controller does not need to handle network protocols in the second scheme, it can have more resource space to handle other tasks. Therefore, this application chooses the second design scheme.

[0093] This application uses the W5500 Ethernet controller chip launched by WIZnet. The W5500 integrates a hardware-implemented TCP / IP protocol stack + MAC + PHY, supports multiple communication protocols, and has a speed of up to 80MHz, which can fully meet the maximum SPI speed of STM32, thereby realizing high-speed network communication.

[0094] Human-computer interaction module:

[0095] To facilitate operation of the signal acquisition and control board, this paper designs a human-machine interface module consisting of an infrared remote controller and a TFT LCD display module. A 480×320 resolution TFT LCD module, JLX350-019-PN, is used, connected to the main controller via a parallel bus, and fixed to the signal acquisition and control board using nylon studs. Signal connections are made via a single-row SIP20-2.54 plug-in connector for easy disassembly. Figure 9 The diagram shown is a schematic of a liquid crystal module. Figure 10 The diagram shown is a schematic of an infrared remote control.

[0096] The communication interface circuit is a bidirectional transmission link with two channels: a transmitter and a receiver. One end is designated as the transmitter, and the other as the receiver. The communication interface's communication rate, hardware verification method, stop bits, message length, message content, and transmission interval are set using an infrared remote control. For example... Figure 11 The image shows the data transmission settings interface for the sending end; as shown... Figure 12 The image shows the data transmission settings interface for the receiving end.

[0097] The communication channel for the corresponding signal is constructed using a pre-programmed serial port program. The operating status of the interface circuit under test is determined by observing the data transmission between the transmitting and receiving ends. Figure 13 The image shown is the communication statistics interface.

[0098] This application uses the pulse current injection method to not only apply a high-threat current to the interface circuit, but also to facilitate the inspection of key components in the interface circuit one by one, and to locate the weak points in the interface circuit. The pulse current injection method is used to study the HEMP response characteristics of the communication interface circuit.

[0099] Considering the complex internal circuit structure of general-purpose computer loading systems, the inability to locate sensitive weak points, and poor test repeatability, as well as the requirements of the experiment in terms of cost, scalability, and development cycle, this invention uses an embedded loading system as the core to build the system hardware platform. Hardware design is performed on the peripheral circuits of the interface chip to realize the loading of the communication interface circuit. A dedicated signal acquisition and control board for experiments is designed, capable of normal communication with five communication circuits: RS-232, RS-485, RS-422, CAN, and Ethernet. This board facilitates the observation of electromagnetic susceptibility phenomena and the troubleshooting and location of faults. This dedicated signal acquisition and control board for experiments has the following characteristics:

[0100] (1) Applicable to multiple interfaces: It can load five common interface circuits such as RS-232, RS-485, RS-422, CAN and Ethernet, ensuring that the interface circuit is in normal working condition.

[0101] (2) Facilitates observation of effects: It has a human-computer interaction module, allowing users to set the communication rate, hardware verification method, message content, and message length of the communication interface. The working status of the communication interface circuit can be determined by monitoring the bit error rate between the sending and receiving ends, and the effects of the communication interface circuit can be observed.

[0102] (3) Facilitates troubleshooting and location: When designing the test-specific signal acquisition and control board, test points are set near the pins of key components. By monitoring the input and output status of key components, it can be determined whether the component is working properly, thereby enabling troubleshooting and location.

[0103] (4) High testability: Considering the diversity of interface circuits, in order to facilitate the change of different types of interface boards during the test, the serial communication interface part is designed as a detachable plug-in board in the design stage. This facilitates the replacement and plugging during the test and avoids the situation where the entire board needs to be replaced if one interface circuit is damaged when the interface circuit board is integrated with the motherboard, thus reducing the test cost. At the same time, the superposition relationship between the normal operation signal and the injected interference signal waveform and the transmission level change can be obtained by monitoring the waveforms at the test points of key components.

[0104] (5) High repeatability: Through fault diagnosis and location, the specific failed component can be identified. With all other components functioning normally, only the failed component needs to be replaced, allowing the test platform to function normally again and enabling multiple repeated tests. To reduce the impact of external electromagnetic interference on the main control chip, this application requires the use of optocouplers for signal isolation between the serial interface plug-in board and the main control chip. The optocoupler uses light as the transmission medium, and there is no direct electrical connection between the input and output terminals. The input circuit uses a light-emitting diode, which has a very low input impedance, significantly reducing the interference voltage fed to the input terminal. This effectively suppresses pulse interference signals, thereby protecting the downstream main control chip and ensuring that strong electromagnetic pulses act precisely on the interface circuit. Only the interface chip needs to be replaced for repeated tests.

[0105] This application decomposes the serial communication interface into two parts: an independently usable, separable plug-in board and an optically isolated plug-in board between the plug-in board and the main control chip. This design facilitates insertion and removal during testing, reduces the testing cost of replacing the board when one interface circuit is damaged, and further improves testing efficiency and repeatability. Separating the interface circuit from the acquisition control board also facilitates fault diagnosis and location. When the tested interface circuit exhibits an effect, the serial communication interface plug-in board can be replaced, and the failure point can be roughly located by observing whether the transmitting and receiving ends resume normal operation. If replacing with a similar, high-performance serial communication plug-in board still fails to restore normal communication between the transmitting and receiving ends, the failure point can be located on the signal acquisition control board responsible for signal loading and processing. If replacing with a similar, high-performance serial communication plug-in board restores normal communication between the transmitting and receiving ends, the failure point can be located on the serial communication interface plug-in board. Subsequently, voltage probes can be used to observe the input and output status of key components on the transmission link to further locate the faulty component.

[0106] The dedicated signal acquisition and control board for testing has the following protective features:

[0107] (1) Signal isolation: The communication and control signals of UART cannot be directly given to the serial signal modulation chip to avoid external interference signals from entering through the signal loop. Therefore, an isolation device needs to be installed between the main control chip and the serial signal modulation chip. Since the focus is on the impact of external electromagnetic pulse interference on the communication interface circuit, the isolation circuit needs to have fast switching characteristics. Therefore, an optocoupler is used for signal isolation.

[0108] (2) Power isolation: Since isolation measures are applied between the UART communication and serial signal modulation chip, the two sides of the isolation area cannot share the power supply and ground. Therefore, an independent power supply with a certain isolation strength needs to be provided in the isolation area.

[0109] (3) Reserved test points: When designing the test-specific signal acquisition and control board, test points were set near the pins of key components. By monitoring the input and output status of key components, it can be determined whether the component is working properly, thereby enabling troubleshooting and location.

[0110] Since the study investigates the HEMP effect in typical interface circuits, it aims to direct the injected HEMP interference to the communication interface circuit as much as possible in order to obtain more accurate threshold data. Therefore, no protective devices are used on the serial communication interface plug-in boards used in the experiment.

[0111] In step S102, as Figure 14 As shown, the specific experimental steps are as follows:

[0112] (1) Using the direct injection method, connect the core wire of the pulse injection source output line to the data transmission line of the RS232 interface communication cable, and connect the shielding layer of the pulse injection source output line to the ground wire of the RS-232 interface communication cable;

[0113] (2) Install the serial communication interface plug-in board used in the test on the signal acquisition control board, use the current clamp to monitor the injected current flowing to the receiving end and the transmitting end respectively on the injected data transmission line, use the voltage probe to monitor the port voltage of the receiving end and the transmitting end, and turn on the power to supply power to each electrical device.

[0114] (3) Set the corresponding communication rate, hardware verification method, stop bit, message length, message content and data transmission interval of the serial port so that one end sends data in a loop and the other end only receives and does not send;

[0115] (4) Observe the data transmission status displayed on the communication statistics interface at both ends of the receiver and the signal waveform captured on the oscilloscope, and judge whether the communication interface circuit is in normal working condition based on the data transmission status and signal waveform;

[0116] (5) Set the charging voltage of the HEMP pulse source and trigger it, and record the data transmission status, port voltage and injection current displayed on the communication statistics interface at this time;

[0117] (6) If the data transmission of the communication interface circuit is normal and the communication is not interrupted, it is considered that the interface circuit has not been damaged under the HEMP injection of this intensity, and step (5) is performed. If data transmission errors, transmission interruptions or other effects occur at both ends of the transmitting and receiving, the signal acquisition control board is restarted. If it still cannot be recovered, the pulse injection voltage is recorded, and the test platform is troubleshooted and diagnosed to locate the faulty components.

[0118] Determining the experimental sample size:

[0119]

[0120] n For sample size, For significance level, 1- That is the required confidence level. Corresponding to The quantile of the standard normal distribution of probability. For large sample sizes and a 95% confidence level, it is typically close to 1.96; for a 99% confidence level, it is typically close to 2.576. e This represents the error range.

[0121] When the confidence level is 95% e Pick hour, nThe initial sample size was 10. Therefore, chips of the same model, batch, and manufacturer were selected.

[0122] In step S103, as Figure 14 As shown, the specific experimental steps are as follows:

[0123] (1) Using the direct injection method, connect the core wire of the pulse injection source output line to the data transmission line of the RS232 interface communication cable, and connect the shielding layer of the pulse injection source output line to the ground wire of the RS-232 interface communication cable;

[0124] (2) Install the serial communication interface plug-in board used in the test on the signal acquisition control board, use the current clamp to monitor the injected current flowing to the receiving end and the transmitting end respectively on the injected data transmission line, use the voltage probe to monitor the port voltage of the receiving end and the transmitting end, and turn on the power to supply power to each electrical device.

[0125] (3) Set the corresponding communication rate, hardware verification method, stop bits, message length, message content, and data transmission interval for the serial port so that one end continuously sends data while the other end only receives and does not send.

[0126] (4) Observe the data transmission status displayed on the communication statistics interface at both ends of the receiver and the signal waveform captured on the oscilloscope, and judge whether the communication interface circuit is in normal working condition based on the data transmission status and signal waveform;

[0127] (5) Set the test voltage of the HEMP pulse source and trigger it, and record the data transmission status, port voltage and injection current displayed on the communication statistics interface at this time;

[0128] If the data transmission of the communication interface circuit is normal and the communication is not interrupted, it is considered that the interface circuit has not been damaged under the HEMP injection of this intensity. Keep the voltage unchanged and proceed to step (5). If data transmission errors, transmission interruptions or other effects occur at both ends of the transmission and reception, restart the signal acquisition control board. If it still cannot be recovered, record the number of pulse injections and perform fault diagnosis on the test platform to locate the faulty components.

[0129] In step S104, by checking the signal transmission link, it can be found that: the main controller, isolation optocoupler and serial communication interface plug-in board on the receiving end signal acquisition control board are all working normally; the main controller and isolation optocoupler on the transmitting end signal acquisition control board are still working normally, but the DOUT2 pin of the transmitting end interface chip has no signal output. When working normally, it outputs an RS-232 level signal, so it is determined that the transmitting end interface chip is damaged.

[0130] In step S104, after damage localization, it can be determined that the interface chip is damaged. Because the internal circuit structure of the interface chip is complex and involves manufacturer secrets, the internal circuit diagram of the chip cannot be obtained. Furthermore, the complex process of interface chip damage cannot be simulated using simulation software. Therefore, this application proposes a method that uses a multimeter to test the resistance change at the pins to quickly determine the damage location and identify the damage mode. This method can highlight key areas for subsequent research without damaging the chip, thus reducing analysis costs.

[0131] The experimental data shows that the injected current and voltage at the transmitting and receiving ports are not linearly related; that is, the port impedance changes with different amplitude HEMPs. Z Given the total loop impedance of the RS-232 interface, we have:

[0132]

[0133] In the formula, This refers to the voltage at the receiving port. For the transmitting port voltage, Inject current into the HEMP signal on the data transmission line at the receiving end. Inject HEMP current into the data transmission line at the transmitting end.

[0134] Experiments revealed that the total impedance of the interface loop continuously decreases during HEMP injection. When the injection source voltage reaches a certain level, the total impedance of the interface loop drops significantly, while the injection current also increases significantly. The main reason for this phenomenon is that when the injected external interference is small, the pulse signal has not yet affected the internal circuit structure of the interface chip. At this time, the internal impedance of the chip is relatively large, and the amplitude of the injection current is small. As the injected external interference increases, the semiconductor structure of the internal circuit of the interface chip changes, forming a low-resistance channel, which causes excessive energy deposition inside the circuit, thereby damaging the internal circuit of the chip.

[0135] The above analysis shows that a strong electromagnetic pulse of a certain amplitude can alter the internal circuit structure of an interface chip, thereby affecting the total impedance of the interface loop. Different types of damage exhibit different impedance change trends in pin pairs. Therefore, the location of damage and the damage mode can be initially located by detecting the resistance changes of the pin pairs before and after damage. Based on the chip's datasheet, the functional pins of the chip are determined. A multimeter is used to measure the resistance of each pin pair of both the failed and functioning interface chips. The diode setting on the multimeter is used for further analysis, and the results are compared with those of a normal chip to locate the damaged pins. In the initial performance verification stage of the chip, or when chip failure analysis is not feasible, using a multimeter to test the resistance changes of the pin pairs can preliminarily determine the location of damage and the damage mode. This method can highlight key areas for subsequent research without damaging the chip, reducing analysis costs.

[0136] In one specific embodiment, based on a typical RS232 interface circuit, the damage threshold voltage of the interface chip under HEMP injection is tested; then, the measured threshold voltage is dated by 3dB to obtain the test voltage, and a cumulative test is performed to record the number of injection pulses that allow the interface chip to communicate normally until it is damaged under the test voltage.

[0137] In one specific embodiment, a direct injection method is used. The core wire of the pulse injection source output line is connected to the data transmission line of the RS232 interface communication cable, and the shielding layer of the pulse injection source output line is connected to the ground wire of the RS-232 interface communication cable to form a complete signal transmission loop. The voltage and current of the interface chip under normal operation and pulse injection are measured by a current clamp and a voltage probe. The communication status of the input and output terminals can be observed by an oscilloscope and the LCD display of the test-specific signal acquisition board. If the interface chip is damaged, the RS232 plug-in board can be removed and the chip replaced.

[0138] In one specific embodiment, based on the experimental platform designed and built, the coupling effect of the HEMP interface circuit is further subdivided into the following five levels according to the changes in the working state of the interface circuit under HEMP interference: no pulse interference, weak pulse interference, strong pulse interference, strong pulse damage, and strong pulse destruction.

[0139] (1) No pulse interference: After HEMP injection, the interface circuit works normally, the transmission data of the sending end and the receiving end are consistent, and no effect phenomenon is produced. That is, HEMP does not affect the communication of the interface circuit at this time.

[0140] (2) Weak pulse interference: After HEMP injection, the received data may have errors, which will reduce the data transmission quality. However, the communication between devices will still proceed normally. That is, HEMP will affect the data transmission quality at this time.

[0141] (3) Strong pulse interference: After HEMP injection, data transmission between the transmitting and receiving ends stops, communication is interrupted, the initialization of the transceiver control program is invalid, and after restarting the acquisition control board, the driver program reloads the interface circuit, and communication returns to normal. That is, at this time, the HEMP intensity is too large, which paralyzes the transceiver control program, but does not damage the interface circuit.

[0142] (4) Strong pulse damage: After HEMP injection, garbled characters or transmission interruption occur during transmission. Even after initializing the transmit / receive control program and restarting the acquisition control board, data transmission still shows garbled characters and intermittent transmission. That is, HEMP causes certain damage to the interface circuit at this time, resulting in irreversible effects.

[0143] (5) High-voltage pulse damage: After HEMP injection, data transmission between the transmitting and receiving ends stops, communication terminates, the circuit shows signs of burning, accompanied by a burning smell. Through inspection and troubleshooting, it was found that the hardware has been damaged by breakdown and burning. Even after initializing the transmit and receive control program and restarting the acquisition control board, the device still cannot communicate. That is, at this time, the high current and high voltage of HEMP will break down and burn the interface circuit, causing irreparable damage and making the interface circuit permanently fail.

[0144] The experiment revealed that when the data packets displayed on the communication statistics interface stopped updating, real-time communication was interrupted; moreover, the voltage waveform captured by the oscilloscope showed that the signal transmission level did not alternate between positive and negative, which was inconsistent with the normal communication operating level; and normal communication could not be restored after restarting. The experimental phenomena were consistent with the fifth level - strong pulse damage, so it was determined that the interface circuit had suffered irreversible damage.

[0145] In one specific embodiment, this application, starting from the perspective of the continuous decrease in interface loop impedance during HEMP injection, proposes to initially locate the damage location and identify the damage mode by detecting the change in resistance between the device pins before and after damage. Based on the chip's datasheet, the functional pins of the chip are determined. A multimeter is used to measure the resistance between each pin of the failed interface chip and a working interface chip. Simultaneously, the diode setting of the multimeter is used for auxiliary judgment. The results are compared with those of a normal chip to locate the damaged pins.

[0146] In one specific embodiment, the chip threshold voltage is determined as follows: chips of the same model, batch, and manufacturer are selected, and an initial sample size of 10 chips is selected. The experiment shows that the measured data follows a normal distribution that decreases to the left and right sides with a certain threshold voltage as the center. The center voltage is taken as the chip threshold voltage.

[0147] Chip test voltage determination: Based on the derating design principle, the chip's threshold voltage is dated by 3dB (half of the threshold voltage) to obtain the test voltage. During the test, the stress on the component will be lower than its design rating. The purpose is to increase the device's operating life and improve its reliability, while comparing the device operating at the threshold voltage to observe the number of pulse injections it can withstand.

[0148] Based on the above-mentioned research method for the strong electromagnetic pulse accumulation effect of communication interface chips, this application, while ensuring the normal transmission and reception of the communication interface circuit, designs and builds a miniaturized test platform that is suitable for multiple ports, highly repeatable, highly measurable, easy to observe the strong electromagnetic pulse effect phenomenon of the interface circuit, obtain corresponding threshold data, and can further investigate and locate its sensitive weak links. It also proposes a test scheme for the accumulation effect, laying the foundation for the interface reinforcement and protection of communication equipment interface circuits.

[0149] This application has the following advantages:

[0150] (1) Applicable to multiple interfaces: It can load five common interface circuits such as RS-232, RS-485, RS-422, CAN and Ethernet, ensuring that the interface circuit is in normal working condition.

[0151] (2) Facilitates observation of effects: It has a human-computer interaction module, allowing users to set the communication rate, hardware verification method, message content, and message length of the communication interface. The working status of the communication interface circuit can be determined by monitoring the bit error rate between the sending and receiving ends, and the effects of the communication interface circuit can be observed.

[0152] (3) Facilitates troubleshooting and location: By monitoring the input and output status of key components, it can be determined whether the component is working properly, thereby enabling troubleshooting and location.

[0153] High testability: Considering the diversity of interface circuits, the serial communication interface section is designed as a detachable plug-in board to facilitate the replacement of different types of interface boards during experiments. This avoids the situation where the entire board needs to be replaced if one interface circuit is damaged, as is the case with an integrated interface circuit board and motherboard, thus reducing experimental costs. Furthermore, by monitoring the waveforms at key component test points, the superposition relationship between normal operating signals and injected interference signals, as well as the changes in transmission levels, can be obtained.

[0154] (4) High repeatability: To reduce the impact of external electromagnetic interference on the main control chip, this application requires the use of optocouplers for signal isolation between the serial interface plug-in board and the main control chip. The optocoupler uses light as the transmission medium, and there is no direct electrical connection between the input and output terminals. The input circuit is a light-emitting diode, which has a very small input impedance, thus significantly reducing the interference voltage fed to the input terminal. This effectively suppresses pulse interference signals, thereby protecting the downstream main control chip and ensuring that strong electromagnetic pulses act precisely on the interface circuit. Repeated tests can be performed simply by replacing the interface chip.

[0155] Rapidly Detect and Locate Damage: This application proposes to initially locate the damage location and determine the damage mode by detecting the change in resistance between the device pins before and after damage. Based on the chip's datasheet, the functional pins of the chip are determined. A multimeter is used to measure the resistance between each pin of the failed interface chip and a working interface chip. The diode setting of the multimeter is used for further analysis. Comparison with a normal chip helps locate the damaged pins and determine the chip's damage location and damage mode.

[0156] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of this disclosure, "a plurality of" means two or more, unless otherwise explicitly specified.

[0157] In the embodiments of this disclosure, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this disclosure according to the specific circumstances.

[0158] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this disclosure. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. In addition, those skilled in the art can combine and integrate the different embodiments or examples described in this specification.

[0159] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the appended claims.

Claims

1. A method for studying the accumulation effect of strong electromagnetic pulses in communication interface chips, characterized in that, The method includes: An injection test platform for an interface chip is constructed. The platform includes a pulse injection source, a transmitting signal acquisition control board, and a receiving signal acquisition control board. The transmitting signal acquisition control board is connected to the receiving signal acquisition control board. The pulse injection source is connected to both the transmitting and receiving signal acquisition control boards to inject pulse voltages into them. The transmitting signal acquisition control board includes a first information processing module, a first serial communication module, a first Ethernet communication module, a first human-machine interaction module, and a first power supply module. The receiving signal acquisition control board includes a second information processing module, a second serial communication module, a second Ethernet communication module, a second human-machine interaction module, and a second power supply module. The first interface chip and the second interface chip are respectively installed on the first serial communication module and the second serial communication module, and the threshold voltage is tested on the first interface chip and the second interface chip to obtain the threshold voltage. Based on the threshold voltage, cumulative effect tests were performed on the first interface chip and the second interface chip respectively to obtain the number of injections; Damage localization analysis is performed on the transmitting end signal acquisition control board and the receiving end signal acquisition control board to obtain damage localization results; If the damage location result indicates that the interface chip is damaged, then damage analysis is performed on the interface chip to obtain the interface chip damage analysis result.

2. The method for studying the accumulation effect of strong electromagnetic pulses for communication interface chips according to claim 1, characterized in that, In the transmitting end signal acquisition and control board, the first information processing module is electrically connected to the first serial communication module, the first Ethernet communication module, the first human-machine interaction module, and the first power supply module, respectively. The first power supply module is electrically connected to the first information processing module, the first serial communication module, and the first Ethernet communication module, respectively. The first information processing module is used to generate data information and send the data information to the first serial communication module. The first information processing module interacts with the first serial communication module, the first Ethernet communication module and the first human-machine interaction module, processes the interaction information sent by each module and controls each module. The first serial communication module is used to send the data information to the receiving end signal acquisition and control board; The first Ethernet communication module is used to encapsulate or parse the data sent by the information processing module, and to send and receive data. The first human-computer interaction module is used for human-computer interaction; The first power supply module is used to supply power to the information processing module, the serial communication module, the Ethernet communication module and the human-computer interaction module.

3. The method for studying the accumulation effect of strong electromagnetic pulses in communication interface chips according to claim 2, characterized in that, In the transmitting end signal acquisition and control board, the second information processing module is electrically connected to the second serial communication module, the second Ethernet communication module, the second human-machine interaction module, and the second power supply module, respectively. The second power supply module is electrically connected to the second information processing module, the second serial communication module, and the second Ethernet communication module, respectively. The second information processing module is used to receive the data information sent by the second serial communication module. The second information processing module interacts with the second serial communication module, the second Ethernet communication module and the second human-machine interaction module, processes the interaction information sent by each module and controls each module. The second serial communication module is used to receive the data information sent by the first serial communication module and send the data information to the second information processing module; The second Ethernet communication module is used to encapsulate or parse the data sent by the information processing module, and to send and receive data. The second human-computer interaction module is used for human-computer interaction; The second power supply module is used to supply power to the information processing module, the serial communication module, the Ethernet communication module and the human-computer interaction module.

4. The method for studying the accumulation effect of strong electromagnetic pulses in communication interface chips according to claim 3, characterized in that, The first serial communication module includes a detachable first serial interface plug-in board and a first optocoupler isolator. The first optocoupler isolator is used for signal isolation and is disposed between the first serial interface plug-in board and the first information processing module. The second serial communication module has the same structure as the first serial communication module.

5. The method for studying the accumulation effect of strong electromagnetic pulses in communication interface chips according to claim 4, characterized in that, The transmitting end signal acquisition and control board also includes: The first reserved test point group is used to monitor the input and output status of each module on the transmitting end signal acquisition control board, determine whether the module is working properly, and thus troubleshoot and locate the fault of the transmitting end signal acquisition control board. The receiving end signal acquisition control board also includes: The second reserved test point group is used to monitor the input and output status of each module on the receiving end signal acquisition control board, determine whether the module is working properly, and thus troubleshoot and locate the fault of the receiving end signal acquisition control board.

6. The method for studying the accumulation effect of strong electromagnetic pulses in communication interface chips according to claim 5, characterized in that, The step of installing the first interface chip and the second interface chip on the first serial communication module and the second serial communication module respectively, and performing threshold voltage tests on the first interface chip and the second interface chip to obtain the threshold voltage includes: Using a direct injection method, the core wires of the output line of the pulse injection source are connected to the data transmission lines of the transmitting end signal acquisition control board and the receiving end signal acquisition control board, respectively, and the shielding layer of the output line of the pulse injection source is connected to the ground wires of the transmitting end signal acquisition control board and the receiving end signal acquisition control board, respectively. Select the matching first interface chip and second interface chip according to the type of the first serial interface plug-in board and the second serial interface plug-in board, and install the first interface chip and the second interface chip on the first serial interface plug-in board and the second serial interface plug-in board respectively for threshold voltage testing. The injection current of the output line of the pulse injection source is monitored using a current clamp, and the port voltage of the transmitting end signal acquisition control board and the receiving end signal acquisition control board is monitored using a voltage probe. The power is turned on so that the first power supply module and the second power supply module supply power to each module. Configure the communication rate, hardware verification method, stop bit, message length, message content and data transmission interval of the first serial interface plug-in board and the second serial interface plug-in board, so that the transmitting end signal acquisition control board cyclically sends the data information and the receiving end signal acquisition control board receives the data information. Connect an oscilloscope, observe the data transmission status through the human-computer interaction module and the oscilloscope, and capture the signal waveform. Determine whether the first interface chip and the second interface chip are in normal working condition based on the data transmission status and the signal waveform. Set the charging voltage of the pulse injection source and trigger it, and record the data transmission status, port voltage and injection current displayed by the first human-machine interaction module and the second human-machine interaction module; If the data transmission between the first serial interface plug-in board and the second serial interface plug-in board is normal and the communication is not interrupted, then the charging voltage of the pulse injection source is changed and triggered, and the data transmission status, port voltage and injection current displayed by the first human-machine interaction module and the second human-machine interaction module are recorded until the data transmission of the first serial interface plug-in board or the second serial interface plug-in board is abnormal. If the data transmission of the first serial interface plug-in board or the second serial interface plug-in board is abnormal, the transmitting end signal acquisition control board and the receiving end signal acquisition control board shall be restarted. If the problem still cannot be resolved, the injected voltage shall be recorded as the threshold voltage.

7. The method for studying the accumulation effect of strong electromagnetic pulses in communication interface chips according to claim 6, characterized in that, The step of performing cumulative effect tests on the first interface chip and the second interface chip respectively based on the threshold voltage to obtain the number of injections includes: Replace the first interface chip and the second interface chip on the first serial interface plug-in board and the second serial interface plug-in board; The human-computer interaction module is used to observe the data transmission status and capture signal waveforms. Based on the data transmission status and signal waveforms, it is determined whether the serial interface plug-in board is in normal working condition. Configure the communication rate, hardware verification method, stop bit, message length, message content and data transmission interval of the first serial interface plug-in board and the second serial interface plug-in board, so that the transmitting end signal acquisition control board cyclically sends the data information and the receiving end signal acquisition control board receives the data information. The test voltage of the pulse injection source is set to half of the threshold voltage and triggered. The data transmission status, port voltage and injection current displayed by the human-machine interaction module are recorded. If the data transmission between the first serial interface plug-in board and the second serial interface plug-in board is normal and the communication is not interrupted, then the charging voltage remains unchanged and the triggering continues, recording the data transmission status, port voltage and injected current displayed by the first human-machine interaction module and the second human-machine interaction module, until the data transmission between the first serial interface plug-in board or the second serial interface plug-in board is abnormal. If the data transmission of the first serial interface plug-in board or the second serial interface plug-in board is abnormal, the transmitting end signal acquisition control board and the receiving end signal acquisition control board shall be restarted. If the problem still cannot be resolved, the number of injections shall be recorded.

8. The method for studying the accumulation effect of strong electromagnetic pulses in communication interface chips according to claim 7, characterized in that, The step of performing damage localization analysis on the transmitting end signal acquisition control board and the receiving end signal acquisition control board to obtain damage localization results includes: By investigating the signal transmission link, damage localization analysis is performed on the signal acquisition and control board to obtain the damage localization results.

9. The method for studying the accumulation effect of strong electromagnetic pulses in communication interface chips according to claim 8, characterized in that, If the damage location result indicates damage to the interface chip, the step of performing damage analysis on the interface chip to obtain the interface chip damage analysis result includes: If the damage location result indicates that the interface chip is damaged, determine the functional pins of the first interface chip and the second interface chip according to the chip's datasheet; The resistance of each pin pair of the failed first and second interface chips and the first and second interface chips with good performance is measured using a multimeter. At the same time, the diode setting of the multimeter is used to assist in the judgment. The results are compared with normal chips to find the damaged pins, so as to determine the location and mode of damage.

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