Lead bonding device

Abstract

The invention discloses a lead bonding device, which comprises a first bracket capable of moving along a first horizontal direction, a second bracket capable of moving along a second horizontal direction perpendicular to the first horizontal direction, a mounting base capable of moving along a vertical direction and an ultrasonic welding head vertically mounted on the mounting base, a heating module corresponding to the ultrasonic welding head is arranged, the heating module is installed on a piston rod of a horizontal air cylinder through a movable seat, and when the installation base is located at the highest position of the stroke of the installation base and the piston rod of the horizontal air cylinder is in an extension state, the heating module is located under the ultrasonic welding head. According to the invention, the uniformity and stability of the acting force between the ultrasonic welding head provided with the gold wire and the chip can be improved, the bonding effect and consistency can be improved, non-contact precise heating of the bonding area on the chip can be realized, and the condition that the bonding precision is influenced by chip deviation caused by long-term heating deformation of the chip substrate is avoided.

Description

Technical Field

[0001] The invention relates to the field of semiconductor device packaging, in particular to a wire bonding device. Background Art

[0002] Wire bonding is an important process in semiconductor packaging, which refers to connecting the chip to the carrier through a wire bonder. The bonding head is the core component of the wire bonder and plays a vital role in the quality and speed of bonding.

[0003] In the existing bonding process, hot pressing and ultrasonic bonding is mainly used for bonding. This process requires heating the bottom of the bonding area through a heating plate (about 200°C), and then bonding the lead to the carrier. During heating, the heat of the heating plate is first transferred to the carrier, and then transferred to the chip through the carrier. Bonding can only be performed after both the chip and the carrier reach the working temperature. In the prior art, the entire chip carrier is heated during the heating process, which easily leads to problems such as thermal deformation of the carrier and shifting of the bonding point. Summary of the invention

[0004] The object of the present invention is to provide a wire bonding device, which can not only improve the bonding effect and consistency, but also realize non-contact precise heating of the bonding area on the chip, thereby avoiding the situation where the chip is offset and affects the bonding accuracy.

[0005] To achieve the above-mentioned purpose, the technical solution adopted by the present invention is: a wire bonding device, comprising: a first bracket movable along a first horizontal direction, a second bracket movable along a second horizontal direction perpendicular to the first horizontal direction, a mounting base movable along a vertical direction, and an ultrasonic welding head vertically mounted on the mounting base, wherein the second bracket is movably mounted on the first bracket and connected to a horizontal driving module mounted on the first bracket, the mounting base is movably mounted on the second bracket and connected to a vertical driving module mounted on the second bracket, and a fixing plate is mounted on the mounting base, which is fixed A vertically arranged vertical cylinder is installed on the upper surface of the fixed plate, and the lower end of a telescopic rod whose upper end is connected to the movable end of the vertical cylinder is connected to the ultrasonic welding head. A set of springs arranged on the outside of the telescopic rod is connected between the ultrasonic welding head and the fixed plate. There is also a heating module arranged corresponding to the ultrasonic welding head. This heating module is installed on the piston rod of a horizontal cylinder through a movable seat. When the mounting base is at the highest position of its stroke and the piston rod of the horizontal cylinder is in an extended state, the heating module is located directly below the ultrasonic welding head, and the horizontal cylinder is installed on the second bracket through a connecting bracket.

[0006] The further improved scheme in the above technical scheme is as follows: 1. In the above solution, the ultrasonic welding head located on one side of the mounting base is connected to the mounting base through at least one set of slide rails and sliders.

[0007] 2. In the above solution, the horizontal cylinder is installed on the lower end of the connecting bracket whose upper end is connected to the second bracket and is opposite to the ultrasonic welding head.

[0008] 3. In the above solution, the heating module is a non-contact heating module.

[0009] 4. In the above solution, the heat radiation surface of the heating module is arranged towards the upper and lower sides respectively.

[0010] 5. In the above solution, the horizontal drive module and the vertical drive module are cylinders, hydraulic cylinders or motor drive modules.

[0011] 6. In the above solution, the second bracket and the first bracket, and the mounting base and the second bracket are slidably connected through at least one set of guide grooves and guide bars.

[0012] 7. In the above solution, a first lead bracket is installed on the outer surface of the fixing plate, and a second lead bracket is installed on the outer surface of the ultrasonic welding head.

[0013] Due to the application of the above technical solution, the present invention has the following advantages compared with the prior art: The wire bonding device of the present invention comprises a fixing plate installed on its mounting base, a vertical cylinder installed on the upper surface of the fixing plate, a telescopic rod whose upper end is connected to the movable end of the vertical cylinder is connected to the ultrasonic welding head at the lower end, a set of springs arranged on the outer side of the telescopic rod is connected between the ultrasonic welding head and the fixing plate, and a heating module arranged corresponding to the ultrasonic welding head is also provided. The heating module is installed on the piston rod of a horizontal cylinder through a movable seat. When the mounting base is located at the highest position of its stroke and the piston rod of the horizontal cylinder is in an extended state, the heating module is located directly below the ultrasonic welding head, and the horizontal cylinder is installed on the second bracket through a connecting bracket, which can not only improve the uniformity and stability of the acting force between the ultrasonic welding head installed with gold wire and the chip, improve the bonding effect and consistency, but also realize non-contact precise heating of the bonding area on the chip, and avoid the situation where the chip substrate is deformed due to long-term heat, resulting in the chip being offset and affecting the bonding accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Attached Figure 1 It is a schematic structural diagram of a wire bonding device of the present invention; Attached Figure 2 It is a rear view schematic diagram of the wire bonding device of the present invention; Attached Figure 3 It is a schematic diagram of an ultrasonic welding head in the wire bonding device of the present invention.

[0015] In the above drawings: 1. first bracket; 2. second bracket; 3. mounting base; 4. ultrasonic welding head; 5. horizontal drive module; 6. vertical drive module; 7. fixing plate; 8. vertical cylinder; 9. telescopic rod; 10. spring; 11. heating module; 12. movable seat; 13. horizontal cylinder; 14. connecting bracket; 15. guide groove; 16. guide strip; 17. first lead bracket; 18. second lead bracket. DETAILED DESCRIPTION

[0016] The present invention can be further understood through the specific embodiments given below, but they are not intended to limit the present invention.

[0017] Embodiment 1: A wire bonding device, comprising: a first bracket 1 movable along a first horizontal direction, a second bracket 2 movable along a second horizontal direction perpendicular to the first horizontal direction, a mounting base 3 movable along a vertical direction, and an ultrasonic welding head 4 vertically mounted on the mounting base 3, wherein the second bracket 2 is movably mounted on the first bracket 1 and connected to a horizontal driving module 5 mounted on the first bracket 1, the mounting base 3 is movably mounted on the second bracket 2 and connected to a vertical driving module 6 mounted on the second bracket 2, a fixing plate 7 is mounted on the mounting base 3, and a vertically arranged A vertical cylinder 8, a telescopic rod 9 whose upper end is connected to the movable end of the vertical cylinder 8 is connected to the ultrasonic welding head 4 at the lower end, a set of springs 10 arranged on the outside of the telescopic rod 9 is connected between the ultrasonic welding head 4 and the fixed plate 7, and a heating module 11 is arranged corresponding to the ultrasonic welding head 4, and this heating module 11 is installed on the piston rod of a horizontal cylinder 13 through a movable seat 12. When the mounting base 3 is located at the highest position of its stroke and the piston rod of the horizontal cylinder 13 is in an extended state, the heating module 11 is located directly below the ultrasonic welding head 4, and the horizontal cylinder 13 is installed on the second bracket 2 through a connecting bracket 14.

[0018] The ultrasonic welding head 4 located on one side of the mounting base 3 is connected to the mounting base 3 through at least one set of slide rails and sliders.

[0019] The horizontal cylinder 13 is installed at the lower end of the connecting bracket 14 , whose upper end is connected to the second bracket 2 , facing away from the ultrasonic welding head 4 .

[0020] A first lead bracket 17 is installed on the outer surface of the fixing plate 7 , and a second lead bracket 18 is installed on the outer surface of the ultrasonic welding head 4 .

[0021] Embodiment 2: A wire bonding device, comprising: a first bracket 1 movable along a first horizontal direction, a second bracket 2 movable along a second horizontal direction perpendicular to the first horizontal direction, a mounting base 3 movable along a vertical direction, and an ultrasonic welding head 4 vertically mounted on the mounting base 3, wherein the second bracket 2 is movably mounted on the first bracket 1 and connected to a horizontal driving module 5 mounted on the first bracket 1, the mounting base 3 is movably mounted on the second bracket 2 and connected to a vertical driving module 6 mounted on the second bracket 2, a fixing plate 7 is mounted on the mounting base 3, and a vertically arranged A vertical cylinder 8, a telescopic rod 9 whose upper end is connected to the movable end of the vertical cylinder 8 is connected to the ultrasonic welding head 4 at the lower end, a set of springs 10 arranged on the outside of the telescopic rod 9 is connected between the ultrasonic welding head 4 and the fixed plate 7, and a heating module 11 is arranged corresponding to the ultrasonic welding head 4, and this heating module 11 is installed on the piston rod of a horizontal cylinder 13 through a movable seat 12. When the mounting base 3 is located at the highest position of its stroke and the piston rod of the horizontal cylinder 13 is in an extended state, the heating module 11 is located directly below the ultrasonic welding head 4, and the horizontal cylinder 13 is installed on the second bracket 2 through a connecting bracket 14.

[0022] The heating module 11 is a non-contact heating module, and the heat radiation surface of the heating module 11 is disposed toward the upper and lower sides respectively.

[0023] The horizontal drive module 5 and the vertical drive module 6 are cylinders, hydraulic cylinders or motor drive modules.

[0024] The second bracket 2 and the first bracket 1 as well as the mounting base 3 and the second bracket 2 are slidably connected via at least one set of guide grooves 15 and guide bars 16 .

[0025] Working principle: When in use, the multiple chips to be bonded are each mounted on a chip substrate (usually a lead frame); The bonding gold wire is passed through the first lead frame and the second lead frame into the ultrasonic welding head. The ultrasonic welding head here is obtained by purchasing from outside and belongs to the scope of the prior art, so it is not described in detail; After the chip substrate is loaded and fixed, the ultrasonic welding head is moved to the top of the chip to be bonded by combining the first bracket and the second bracket in the horizontal direction, and then the horizontal cylinder is switched from the original contracted state to the extended state, so that the heating module is moved to the top of the chip to be bonded, so as to directly heat the bonding area of ​​the chip below it by thermal radiation, thereby avoiding long-term overheating of the chip substrate, and avoiding deformation of the chip substrate caused by long-term heating, which drives the position of the chip on it to shift. The gold wire in the ultrasonic welding head can also be heated at the same time. It should be noted that the power for heating the gold wire should be much smaller than the power for heating the bonding area; After heating is completed, the horizontal cylinder is switched back to the contracted state, so that the heating module is moved away from the ultrasonic welding head; then the mounting base is driven to move in the vertical direction so that the ultrasonic welding head is close to the chip to be bonded area; Finally, bonding is achieved through the ultrasonic welding head and the gold wire thereon through the slight reciprocating movement of the vertical cylinder in the vertical direction and the combined movement of the first bracket and the second bracket in the horizontal direction. In this process, the uniformity and stability of the force between the ultrasonic welding head equipped with the gold wire and the chip can be improved, thereby improving the bonding effect and consistency.

[0026] When using the above-mentioned wire bonding device, it can not only improve the uniformity and stability of the force between the ultrasonic welding head equipped with gold wire and the chip, improve the bonding effect and consistency, but also realize non-contact precise heating of the bonding area on the chip, and avoid the chip substrate from being deformed due to long-term heat, causing the chip to shift and affect the bonding accuracy.

[0027] The above embodiments are only for illustrating the technical concept and features of the present invention, and their purpose is to enable people familiar with the technology to understand the content of the present invention and implement it accordingly, and they cannot be used to limit the protection scope of the present invention. Any equivalent changes or modifications made according to the spirit of the present invention should be included in the protection scope of the present invention.

Claims

1. A wire bonding device, comprising: A first bracket (1) movable along a first horizontal direction, a second bracket (2) movable along a second horizontal direction perpendicular to the first horizontal direction, a mounting base (3) movable along a vertical direction, and an ultrasonic welding head (4) vertically mounted on the mounting base (3), characterized in that: the second bracket (2) is movably mounted on the first bracket (1) and connected to a horizontal driving module (5) mounted on the first bracket (1), the mounting base (3) is movably mounted on the second bracket (2) and connected to a vertical driving module (6) mounted on the second bracket (2), a fixing plate (7) is mounted on the mounting base (3), a vertical cylinder (8) is mounted on the upper surface of the fixing plate (7), and a The lower end of a telescopic rod (9) whose upper end is connected to the movable end of the vertical cylinder (8) is connected to an ultrasonic welding head (4); a set of springs (10) arranged on the outside of the telescopic rod (9) is connected between the ultrasonic welding head (4) and the fixed plate (7); and a heating module (11) arranged corresponding to the ultrasonic welding head (4) is also provided. The heating module (11) is installed on the piston rod of a horizontal cylinder (13) through a movable seat (12); when the mounting base (3) is located at the highest position of its stroke and the piston rod of the horizontal cylinder (13) is in an extended state, the heating module (11) is located directly below the ultrasonic welding head (4); and the horizontal cylinder (13) is installed on the second bracket (2) through a connecting bracket (14).

2. The wire bonding device according to claim 1, characterized in that: The ultrasonic welding head (4) located on one side of the mounting base (3) is connected to the mounting base (3) through at least one set of slide rails and a sliding block.

3. The wire bonding device according to claim 1, wherein: The horizontal cylinder (13) is installed on the lower end of the connecting bracket (14) whose upper end is connected to the second bracket (2) and is opposite to the ultrasonic welding head (4).

4. The wire bonding device according to claim 1, wherein: The heating module (11) is a non-contact heating module.

5. The wire bonding device according to claim 1, wherein: The heat radiation surface of the heating module (11) is arranged towards the upper and lower sides respectively.

6. The wire bonding device according to claim 1, characterized in that: The horizontal drive module (15) and the vertical drive module (6) are cylinders, hydraulic cylinders or motor drive modules.

7. The wire bonding device according to claim 1, characterized in that: The second bracket (2) and the first bracket (1), and the mounting base (3) and the second bracket (2) are slidably connected via at least one set of guide grooves (15) and guide strips (16).

8. The wire bonding device according to claim 1, characterized in that: A first lead wire bracket (17) is mounted on the outer surface of the fixing plate (7), and a second lead wire bracket (18) is mounted on the outer surface of the ultrasonic welding head (4).

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