Wafer processing apparatus

Abstract

The application relates to the technical field of semiconductor device manufacturing, and particularly discloses a wafer processing equipment which comprises a main body mechanism, a workbench, a processing mechanism, a receiving mechanism, a winding mechanism and a UV film, the main body mechanism comprises a machine body, a machine cover is connected to the top of the machine body through a hinge, and a barrel mechanism for sleeving the film is arranged on the top of the machine body. The main body mechanism, the film pasting table, the workbench, the barrel mechanism, the machine cover, the processing mechanism and the receiving mechanism are matched with each other, when processing is needed, the driving handle is held by hand, the rear rotating circle cutting assembly is pushed, the bottom circle cutting knife can cut the UV film, then the circle cutting assembly is reset, the receiving block is pulled out, and thus the operation is more convenient and fast, time is saved, the processing efficiency is improved, the waste film can be wound for later use, the operation of unfolding the UV film is simplified, and the operation is further simplified.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor device manufacturing, and in particular relates to wafer processing equipment. Background Art

[0002] Wafer processing equipment includes but is not limited to photolithography machines, etchers, wafer thinning machines, wafer dicing machines, wafer bonders, and wafer laminators. A wafer laminator is a device used to apply films to the surface of wafers during the wafer processing process. Its primary function is to apply thin film materials (such as blue film, UV film, PET substrate film, etc.) to the wafer surface to protect the wafer from contamination, oxidation, or other damage. These films can cover the wafer and adhere tightly to it, providing a protective barrier.

[0003] In the Chinese patent publication number CN115588642A, a manual wafer laminating machine is mentioned, comprising a casing, wherein the casing is movably connected to a first cover at a middle position in a length direction, and a second cover is movably connected to the rear side of the casing, wherein the inner side of the casing is provided with a working table mechanism and a film laminating plate mechanism located below the first cover, a roller mechanism located between the first cover and the second cover, and a barrel mechanism located below the second cover, wherein the first cover is provided with a circular cutting knife mechanism located above the working table mechanism and the film laminating plate mechanism; the beneficial effects of the present invention are as follows: the film laminating plate mechanism is used for placing wafers of different sizes, the roller mechanism can not only firmly stick the film on the wafer, but also cut the film in the horizontal direction, the barrel mechanism is used for winding up a new film and a release film, and can separate the release film on the new film, and the circular cutting knife mechanism can cut the film in the circumferential direction. The manual wafer laminating machine is convenient for the operator to operate and improves the working efficiency of the film laminating;

[0004] The above-mentioned comparative documents and the existing manual wafer laminating machines all require the protective cover to be opened when in use, the wafer to be placed on top of the suction cup, and the wafer to be adsorbed. Subsequently, one end of the film is pulled over the wafer and covered, and the film is tightly adhered to the surface of the wafer by rolling. The protective cover is then closed, and the rotating handle on the protective cover is rotated to allow the circular cutting mechanism inside the protective cover to cut the film. Finally, the cross-cutting mechanism of the laminating machine is used to cut off the covered part, and then the protective cover is opened to remove the waste film to complete the laminating of the wafer. Therefore, repeatedly closing the protective cover during operation will not only cause the quality of the laminating to deteriorate due to environmental factors, but also has certain complexity in operation, which increases a certain amount of time cost. In addition, since the waste film is removed manually, the waste film cannot be collected in a centralized manner, which is inconvenient for later use. Summary of the Invention

[0005] The purpose of the present invention is to provide a wafer processing device to solve the problems existing in the prior art.

[0006] To achieve the above object, the present invention provides the following technical solutions:

[0007] A wafer processing equipment comprises a main mechanism, a workbench, a processing mechanism, a receiving mechanism, a winding mechanism and a UV film, the main mechanism comprising a body, the upper part of the body being connected to an organic cover by a hinge, a barrel mechanism for sleeved film being installed above the body, the processing mechanism being installed inside the cover, and a film-sticking table for positioning wafers being installed in an embedded manner above the workbench; the processing mechanism comprises a side plate, a linkage assembly, a roller assembly, a limiting assembly, and a circular cutting assembly, the side plate being used to guide the linkage assembly and the roller assembly, the limiting assembly being used to guide the circular cutting assembly, the linkage assembly being used to connect the roller assembly and the circular cutting assembly, the roller assembly being used to roll the UV film, and the circular cutting assembly being used to cut the UV film; the receiving mechanism comprises a receiving block and a second rack, the receiving block being used to receive the workbench and the film-sticking table, the second rack being used to drive the winding mechanism; the winding mechanism comprises a support plate and a winding roller, the support plate being fixedly connected to the upper part of the body, and the winding roller being used to wind up the waste film after circular cutting.

[0008] Preferably: the limiting component passes through and fixes the machine cover, the limiting component includes a limiting block, the limiting block is provided with a through slot passing through from top to bottom, a groove is provided at one end of the through slot, the circle cutting component includes a connecting column and a sleeve block, the connecting column passes through the sleeve block, the sleeve block is slidably connected to the inside of the through slot, the sleeve block fits into the groove, the connecting column is located inside the sleeve block and is fixedly connected to a connecting ring, a bearing is installed on the periphery of the connecting ring, and the periphery of the bearing is fixedly connected to the sleeve block.

[0009] Preferably: the linkage assembly includes a longitudinal plate and a linkage longitudinal plate, the rolling assembly includes a support frame and a film pressing roller, a limiting column is fixedly connected to the top of the support frame, the limiting column passes through the linkage longitudinal plate, a spring 1 is surrounded by the periphery of the limiting column, the spring 1 is located above the linkage longitudinal plate, the opposite sides of the side plates are fixedly connected with a transverse slide rail and a limiting slide rail, the limiting slide rail is a special-shaped rail, consisting of a transverse middle and vertical directions at both ends.

[0010] Preferably: the longitudinal plate is rotatably connected by a connecting column, and both ends of the longitudinal plate and the linked longitudinal plate are slidably connected to the inside of the transverse slide rail, and the two ends of the film pressing roller are fixedly connected with a convex rod, and the film pressing roller is rotatably connected to the bottom of the support frame through the convex rod, and the convex rod is slidably connected to the inside of the limiting slide rail.

[0011] Preferably: a rack is fixedly connected to the top of the transverse slide rail, and the two ends of the longitudinal plate are rotatably connected to drive links, and the end of the drive link away from the longitudinal plate is rotatably connected to a linkage link, and the end of the linkage link away from the drive link is rotatably connected to the two ends of the linkage longitudinal plate, and the drive link is rotatably connected to the longitudinal plate and fixedly connected to a gear 1, and the gear 1 fits with the rack 1.

[0012] Preferably: the machine body is provided with a pull-out groove, the inner wall of the pull-out groove is provided with a track assembly, the track assembly is located on both sides of the receiving block, the receiving block is slidably connected to the inside of the pull-out groove through the track assembly, the receiving block is provided with a receiving groove at one end close to the machine body, two receiving connecting rods are rotatably connected to both sides of the workbench, and the lower end of the receiving connecting rod is rotatably connected to the inner wall of the receiving groove.

[0013] Preferably: the winding roller is rotatably connected to one side of the support plate, and one end of the winding roller located inside the support plate is fixedly connected to gear 2, and a one-way gear is meshed and connected below the gear 2, and the one-way gear is rotatably connected to the support plate and the inside of the machine body, a slide groove is provided above the receiving block, and the rack 2 is connected to the inside of the slide groove for sliding up and down, and the rack 2 cooperates with the bottom of the one-way gear.

[0014] Preferably: two springs are fixedly connected to the lower part of the rack and are evenly distributed. The UV film surrounds the periphery of the new film cylinder. A waste film cylinder is provided at one end of the UV film away from the new film cylinder. The waste film cylinder is fixedly sleeved on the periphery of the winding roller.

[0015] Preferably: a notch is provided at the bottom of the receiving groove, the notch is used for connecting the film-sticking table to the pump body inside the machine body, and a buckle is provided at one end of the receiving block away from the machine body, and the buckle is installed on both sides of the receiving block.

[0016] Preferably, the bottom of the connecting column is fixedly connected with a transverse connecting rod, both ends of the connecting rod are rotatably connected with circular cutting knives, and the top of the connecting column is fixedly connected with a driving hand rod.

[0017] Compared with the prior art, the present invention has the following beneficial effects:

[0018] 1. The present invention cooperates with each other through the main body mechanism, film laminating table, workbench, barrel mechanism, machine cover, processing mechanism and receiving mechanism. When in use, the wafer can be placed on the film laminating table and the film laminating table is started through the control panel. After the receiving block is pushed into the machine body, the driving hand lever is held and pushed, and then the circular cutting assembly is rotated so that the bottom circular cutting knife can cut the UV film into a circle. Then, the circular cutting assembly can be reset and the receiving block can be pulled out, which makes the operation more convenient and quick, saves time and improves processing efficiency.

[0019] 2. The present invention cooperates with the receiving mechanism and the winding mechanism, and can wind up the UV film through the winding roller during the process of pulling out the receiving block, and unfold the new UV film. This not only allows the waste film to be rolled up for later use, but also simplifies the operation of unfolding the UV film, further simplifying the operation.

[0020] 3. The present invention has a winding mechanism, which can be used to sleeve a new film tube into the interior of the barrel mechanism during the first use, unfold the UV film on the outside of the new film tube for the first time and stick its end to the outside of the waste film tube, then sleeve the waste film tube onto the outside of the winding roller, and then close the machine cover to avoid opening the machine cover repeatedly, thereby avoiding the external environment causing the UV film to move and affecting the wafer, thereby ensuring and maintaining the quality of the film. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 A perspective view of the wafer processing equipment of the present invention;

[0022] Figure 2 This is a three-dimensional diagram of the wafer processing equipment of the present invention when in use;

[0023] Figure 3 A three-dimensional diagram of the wafer processing equipment of the present invention during maintenance;

[0024] Figure 4 It is a structural diagram of the undertaking mechanism of the present invention;

[0025] Figure 5 For the present invention Figure 4 Cross-sectional view of the middle structure;

[0026] Figure 6 It is a structural schematic diagram of the winding mechanism of the present invention;

[0027] Figure 7 It is a structural diagram of the processing mechanism of the present invention;

[0028] Figure 8 For the present invention Figure 7 Schematic diagram of the structure of the middle linkage assembly and roller pressing assembly;

[0029] Figure 9 For the present invention Figure 7 Schematic diagram of the structure of the middle limit component and the cutting circle component;

[0030] Figure 10 For the present invention Figure 9 A magnified view of the displacement of part A.

[0031] In the picture:

[0032] 1. Main body; 11. Machine body; 12. Drawing slot;

[0033] 2. Film laminating table; 3. Workbench; 4. Barrel mechanism; 5. Machine cover;

[0034] 6. Handling mechanism; 61. Side plate; 62. Horizontal slide rail; 63. Rack 1; 64. Limiting slide rail;

[0035] 65, linkage assembly; 651, longitudinal plate; 652, driving connecting rod; 653, gear 1; 654, linkage connecting rod; 655, linkage longitudinal plate;

[0036] 66, rolling assembly; 661, support frame; 662, limiting column; 663, spring 1; 664, lamination roller; 665, protruding rod;

[0037] 67. Restriction assembly; 671. Restriction block; 672. Through slot; 673. Recess;

[0038] 68. Circular cutting assembly; 681. Connecting column; 682. Connecting ring; 683. Socket block; 684. Bearing; 685. Driving handle; 686. Connecting rod; 687. Circular cutting knife;

[0039] 7. Attachment mechanism; 71. Attachment block; 72. Attachment groove; 73. Notch; 74. Slide; 75. Buckle; 76. Attachment connecting rod; 77. Rack 2; 78. Spring 2; 79. Track assembly;

[0040] 8. Winding mechanism; 81. Support plate; 82. Winding roller; 83. Gear 2; 84. One-way gear;

[0041] 9. UV film; 91. New film tube; 92. Waste film tube. DETAILED DESCRIPTION

[0042] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0043] Reference Figures 1-10 As shown, the present invention provides a wafer processing equipment, including a main mechanism 1, a workbench 3, a processing mechanism 6, a receiving mechanism 7, a winding mechanism 8 and a UV film 9; the main mechanism 1 includes a body 11, a cover 5 is connected to the upper part of the body 11 by a hinge, a barrel mechanism 4 for sleeve film is installed above the body 11, the processing mechanism 6 is installed inside the cover 5, and a film mounting plate 2 for positioning wafers is installed in an embedded manner above the workbench 3;

[0044] The processing mechanism 6 includes a side plate 61, a linkage assembly 65, a rolling assembly 66, a limiting assembly 67, and a circular cutting assembly 68. The side plate 61 is used to guide the linkage assembly 65 and the rolling assembly 66. The limiting assembly 67 is used to guide the circular cutting assembly 68. The linkage assembly 65 is used to connect the rolling assembly 66 and the circular cutting assembly 68. The rolling assembly 66 is used to roll the UV film 9, and the circular cutting assembly 68 is used to cut the UV film 9.

[0045] The receiving mechanism 7 includes a receiving block 71 and a second rack 77. The receiving block 71 is used to receive the workbench 3 and the film laminating plate 2. The second rack 77 is used to drive the winding mechanism 8.

[0046] The winding mechanism 8 includes a support plate 81 and a winding roller 82. The support plate 81 is fixedly connected to the top of the machine body 11. The winding roller 82 is used to wind up the waste film after cutting into circles.

[0047] Reference Figure 7-10 In a further embodiment, the limiting component 67 passes through the fixed machine cover 5, and the limiting component 67 includes a limiting block 671. The limiting block 671 is provided with a through slot 672 running through it from top to bottom, and a groove 673 is provided at one end of the through slot 672. The circle cutting component 68 includes a connecting column 681 and a sleeve block 683. The connecting column 681 passes through the sleeve block 683, and the sleeve block 683 is slidably connected to the inside of the through slot 672. The sleeve block 683 fits into the groove 673. The connecting column 681 is located inside the sleeve block 683 and is fixedly connected to a connecting ring 682. A bearing 684 is installed on the periphery of the connecting ring 682, and the periphery of the bearing 684 is fixedly connected to the sleeve block 683.

[0048] In this embodiment, the coupling post 681 does not affect the sleeve block 683 when rotating, and the sleeve block 683 is only used to engage the groove 673 and limit its sliding connection inside the through groove 672.

[0049] Reference Figure 7-Figure 8 In a further embodiment, the linkage assembly 65 includes a longitudinal plate 651 and a linkage longitudinal plate 655, and the rolling assembly 66 includes a support frame 661 and a film pressing roller 664. A limiting column 662 is fixedly connected to the top of the support frame 661, and the limiting column 662 passes through the linkage longitudinal plate 655. A spring 1 663 is surrounded by the periphery of the limiting column 662, and the spring 1 663 is located above the linkage longitudinal plate 655. The opposite sides of the side plate 61 are fixedly connected with a transverse slide rail 62 and a limiting slide rail 64. The limiting slide rail 64 is a special-shaped track, which is composed of a transverse middle and vertical directions at both ends.

[0050] In this embodiment, the top of the limiting column 662 is a limiting disk, and the upper end of the spring 1 663 is located below the limiting disk. It is mainly used to lift the support frame 661, the film pressing roller 664 and the protruding rod 665 when the protruding rod 665 reaches the track vertically extending the limiting slide rail 64, so that the film pressing roller 664 is temporarily unable to contact the film.

[0051] Reference Figure 7-Figure 8 In a further embodiment, the longitudinal plate 651 is rotatably connected by the connecting column 681, and both ends of the longitudinal plate 651 and the linked longitudinal plate 655 are slidably connected to the inside of the transverse slide rail 62. The two ends of the film pressing roller 664 are fixedly connected with the protruding rod 665. The film pressing roller 664 is rotatably connected to the bottom of the support frame 661 through the protruding rod 665, and the protruding rod 665 is slidably connected to the inside of the limiting slide rail 64.

[0052] In this embodiment, the longitudinal plate 651 is also used to support the circle cutting assembly 68 so that the circle cutting assembly 68 can rotate normally; the transverse slide rail 62 is used to limit the sliding direction of the linkage assembly 65 and the rolling assembly 66; the film pressing roller 664 is made of the same material as the existing manual pressing roller and has a certain degree of softness, thereby avoiding damage to the wafer during rolling.

[0053] Reference Figure 7-Figure 8 In a further embodiment, a rack 63 is fixedly connected to the top of the transverse slide rail 62, and the two ends of the longitudinal plate 651 are rotatably connected to the driving link 652. The end of the driving link 652 away from the longitudinal plate 651 is rotatably connected to the linkage link 654. The end of the linkage link 654 away from the driving link 652 is rotatably connected to the two ends of the linkage longitudinal plate 655. The driving link 652 is rotatably connected to the longitudinal plate 651 and is fixedly connected to the gear 1 653. The gear 1 653 fits with the rack 1 63.

[0054] In this embodiment, the bottom of one end of the driving link 652 close to the longitudinal plate 651 is movably connected to the longitudinal plate 651 through a vertical plug rod, and the gear 1 653 is coaxial with the plug rod. Therefore, when the gear 1 653 is passively rotated due to the engagement with the rack 1 63, the driving link 652 is also rotated, thereby increasing the distance between the longitudinal plate 651 and the linkage longitudinal plate 655, and vice versa.

[0055] Reference Figures 1-4 In a further embodiment, the machine body 11 is provided with a drawing groove 12, and the inner wall of the drawing groove 12 is provided with a track assembly 79, the track assembly 79 is located on both sides of the receiving block 71, and the receiving block 71 is slidably connected to the inside of the drawing groove 12 through the track assembly 79. The receiving block 71 is provided with a receiving groove 72 at one end close to the machine body 11, and two receiving connecting rods 76 are rotatably connected to both sides of the workbench 3, and the lower end of the receiving connecting rod 76 is rotatably connected to the inner wall of the receiving groove 72.

[0056] In this embodiment, the track assembly 79 is composed of a slide rail and a slideway, wherein the slide rail is installed on the inner wall of the pull-out groove 12, and the slideway is installed on the receiving block 71; the receiving groove 72 is used to receive the workbench 3 and the film-sticking plate 2 after they have fallen, and the upper end surfaces of the workbench 3 and the film-sticking plate 2 after they have fallen are lower than the end surface of the receiving block 71, so as to facilitate the receiving block 71 to carry the workbench 3 and the film-sticking plate 2, as well as the wafer installed above the film-sticking plate 2 when pulling.

[0057] Reference Figure 4-Figure 6 In a further embodiment, the winding roller 82 is rotatably connected to one side of the support plate 81, and one end of the winding roller 82 located inside the support plate 81 is fixedly connected to the second gear 83, and the lower part of the second gear 83 is meshed with a one-way gear 84, and the one-way gear 84 is rotatably connected to the inside of the support plate 81 and the machine body 11. A slide groove 74 is provided above the receiving block 71, and the second rack 77 is connected to the inside of the slide groove 74 for sliding up and down, and the second rack 77 is matched with the lower part of the one-way gear 84.

[0058] In this embodiment, the one-way gear 84 is composed of a ratchet and a peripheral gear ring, so that the one-way gear 84 can only rotate in one direction. There are clamps and springs between the gear ring and the ratchet, and the ratchet is fixed inside the body 11.

[0059] Reference Figure 3-Figure 5 In a further embodiment, a spring 2 78 is fixedly connected to the bottom of the rack 2 77 and is evenly distributed. The UV film 9 is wrapped around the periphery of the new film cylinder 91. A waste film cylinder 92 is provided at one end of the UV film 9 away from the new film cylinder 91. The waste film cylinder 92 is fixedly sleeved on the periphery of the winding roller 82.

[0060] In this embodiment, since the one-way gear 84 can only rotate in one direction clockwise, when the rack 2 77 moves to the right, the one-way gear 84 cannot rotate and continuously squeezes the rack 2 77, so that the rack 2 77 slides to the inside of the slide groove 74. During this process, the spring 2 78 is always used to reset and push the rack 2 77 upward until the receiving block 71 moves the rack 2 77 to the left again, and the rack 2 77 can engage with the one-way gear 84 again; the new film cylinder 91 is the state after the UV film 9 is initially curled, and the new film cylinder 91 is connected to the barrel mechanism 4, and the waste film cylinder 92 is fixedly connected to the winding roller 82. Therefore, after the winding roller 82 rotates, the new UV film 9 is continuously unfolded to the top of the film laminating table 2.

[0061] Reference Figure 1-Figure 3 In a further embodiment, a notch 73 is provided at the bottom of the receiving groove 72, and the notch 73 is used to connect the film-sticking plate 2 to the pump body inside the body 11. A buckle 75 is provided at the end of the receiving block 71 away from the body 11, and the buckle 75 is installed on both sides of the receiving block 71.

[0062] In this embodiment, a control panel is provided at the front end of the body 11, and an air pump is provided at the bottom of the control panel, which is connected to the bottom of the film-laminating plate 2 through a hose, so that negative pressure is generated above the film-laminating plate 2 to fix the wafer.

[0063] Reference Figure 10 In a further embodiment, the bottom of the connecting column 681 is fixedly connected to a horizontal connecting rod 686, both ends of the connecting rod 686 are rotatably connected to a circular cutting knife 687, and the top of the connecting column 681 is fixedly connected to a driving hand rod 685.

[0064] In this embodiment, the connecting rod 686 and the circular cutting knife 687 are both existing technologies and are used to perform circular cutting on the UV film 9; the driving handle 685 is a rotating handle that is convenient for the staff to rotate.

[0065] The working principle of the present invention is as follows:

[0066] When starting to use it, first, by unfastening the buckle 75, the receiving block 71 can be pulled out from the inside of the pull-out slot 12, and the wafer is placed on the top of the film-sticking plate 2, and then the film-sticking plate 2 is started through the control panel to generate negative pressure to adsorb and fix the wafer, and then the receiving block 71 is reinserted into the inside of the pull-out slot 12. At this time, the workbench 3 with the film-sticking plate 2 will also re-enter the inside of the pull-out slot 12, and due to the contact between the workbench 3 and the pull-out slot 12, the workbench 3 with the film-sticking plate 2 will be lifted to a certain height so that the wafer is coplanar with the upper surface of the machine body 11. After completion, the position of the receiving block 71 is re-positioned by connecting it with the machine body 11 through the buckle 75; secondly, the machine cover 5 is opened, and the new film cylinder 91 is installed on the roller of the barrel mechanism 4, and then the UV film 9 on the outer periphery of the new film cylinder 91 is unfolded and one end of it is glued and fixed to the outer periphery of the waste film cylinder 92, and then The waste film cylinder 92 is fixedly sleeved on the outer periphery of the winding roller 82, and finally the machine cover 5 is closed to the top of the machine body 11. At this time, the UV film 9 is located within a height of five millimeters above the wafer. Finally, the staff can hold the driving handle 685 and push it to make the sleeve block 683 and the objects inside it slide inside the through groove 672 until the sleeve block 683 is engaged with the inside of the groove 673. At this time, the driving handle 685 is selected again, so that the circular cutting knife 687 rotates around the connecting column 681 as the axis through the connecting column 681 and the connecting rod 686, thereby completing the circular cutting operation; finally, after completing the circular cutting operation, the driving handle 685 can be pulled out to make the sleeve block 683 return to the sliding range of the through groove 672, and pull the sleeve block 683 back to the initial position, finally release the buckle 75 to pull out the receiving block 71, and turn off the adsorption of the film-sticking plate 2 to take out the wafer after film-sticking.

[0067] When the buckle 75 is released and the receiving block 71 is pulled out after the above-mentioned circle cutting operation is completed, that is, when the receiving block 71 moves to the left, the one-way gear 84 will rotate clockwise through the rack 2 77, thereby making the gear 2 83 rotate counterclockwise, and then the winding roller 82 will also rotate clockwise synchronously, so that the winding roller 82 can rewind the UV film 9 after the circle cutting through the waste film cylinder 92; when the receiving block 71 is pushed again to make it re-enter the interior of the drawing groove 12 with the workbench 3 and the film laminating plate 2, that is, when the receiving block 71 moves to the right, it will slide smoothly at first, and then the right side of the workbench 3 will contact the inner wall of the drawing groove 12, but due to The staff continuously pushes the receiving block 71 to move right, thereby squeezing the workbench 3, and then lifting the workbench 3 and the film-sticking plate 2 by a certain distance through the receiving connecting rod 76. Due to the length limitation of the receiving connecting rod 76, the wafer fixed above the film-sticking plate 2 is just coplanar with the upper surface of the machine body 11. At this time, since the one-way gear 84 is one-way, the one-way gear 84 cannot rotate and squeezes the rack 2 77, so that the rack 2 77 slides to the inside of the slide groove 74 until the receiving block 71 stops moving right. The rack 2 77 will re-engage with the one-way gear 84 under the rebound action of the spring 2 78.

[0068] When the cover 5 is closed to the top of the body 11, the side panels 61 will be located on both sides of the UV film 9, while the film pressing roller 664 and the circular cutting knife 687 are in a suspended state and do not contact the UV film 9. However, when the user holds the driving handle 685 and pushes it, that is, when it moves to the right, the longitudinal plate 651 can be moved to the right through the connecting column 681, and in the process of moving to the right, the gear 1 653 on the right side of both ends will be meshed with the rack 1 63 and the gear 1 653 will be passively rotated clockwise, thereby allowing the driving connecting rod 652 to rotate together with the gear 1 653 as the center through the linkage connecting rod. The transmission of 654 allows the linkage longitudinal plate 655 to move right as well, so that the longitudinal plate 651 and the linkage longitudinal plate 655 will move right synchronously, and the distance between the two will become larger during the process. At the same time, the film pressing roller 664 connected to the linkage longitudinal plate 655 through the support frame 661 below the linkage longitudinal plate 655 slides inside the limiting slide rail 64 through the protruding rod 665, so that the film pressing roller 664 contacts the upper surface of the UV film 9 at the beginning of the synchronous right movement and presses the UV film 9 downward, so that the UV film 9 is closely attached to the surface of the wafer. When the gear 1 653 is not engaged with the rack 1 63, the protruding rod 6 65 and the longitudinal plate 651 are spaced greater than the radius of the wafer. At this time, the film pressing roller 664 completes the rolling of the UV film 9 so that the UV film 9 is tightly attached to the wafer. When the gear 1 653 is no longer engaged with the rack 1 63, the connecting column 681 will also move to the center of the film laminating plate 2. At this time, the sleeve block 683 will also be engaged from the through slot 672 to the inside of the groove 673, that is, the entire circular cutting assembly 68 will fall and move a certain distance, so that the circular cutting knife 687 will contact the UV film 9. At this time, the driving hand lever 685 will be selected to make the connecting column 681 carry the connecting rod 686 and the circular cutting knife 6 87 rotates around the center of the film-laminating table 2 to complete the circle cutting of the UV film 9; after the circle cutting is completed, the driving hand bar 685 is pulled so that the circle cutting knife 687 no longer contacts the UV film 9, and the sleeve block 683 returns to the sliding range of the through groove 672, and the driving hand bar 685 is pulled to make the circle cutting assembly 68 move to the left as a whole. At this time, the gear 1 653 will re-engage with the rack 1 63 to shorten the distance between the longitudinal plate 651 and the linkage longitudinal plate 655, and the film pressing roller 664 will roll the UV film 9 again until the connecting column 681 returns to its initial position and is located on the right side of the winding roller 82.

[0069] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. A wafer processing device, comprising a main body mechanism (1), a workbench (3), a processing mechanism (6), a receiving mechanism (7), a winding mechanism (8) and a UV film (9), characterized in that: The main mechanism (1) includes a body (11), a cover (5) is connected to the upper part of the body (11) via a hinge, a barrel mechanism (4) for sleeve film is installed above the body (11), the processing mechanism (6) is installed inside the cover (5), and a film mounting plate (2) for positioning wafers is installed in an embedded manner above the workbench (3); The processing mechanism (6) includes a side plate (61), a linkage assembly (65), a rolling assembly (66), a limiting assembly (67), and a circular cutting assembly (68), wherein the side plate (61) is used to guide the linkage assembly (65) and the rolling assembly (66), the limiting assembly (67) is used to guide the circular cutting assembly (68), the linkage assembly (65) is used to connect the rolling assembly (66) and the circular cutting assembly (68), the rolling assembly (66) is used to roll the UV film (9), and the circular cutting assembly (68) is used to cut the UV film (9); The receiving mechanism (7) includes a receiving block (71) and a second rack (77), wherein the receiving block (71) is used to receive the workbench (3) and the film laminating plate (2), and the second rack (77) is used to drive the winding mechanism (8); The winding mechanism (8) comprises a support plate (81) and a winding roller (82), wherein the support plate (81) is fixedly connected to the upper portion of the machine body (11), and the winding roller (82) is used for winding the waste film after cutting into circles; The limiting assembly (67) passes through and fixes the machine cover (5), and the limiting assembly (67) includes a limiting block (671), and the limiting block (671) is provided with a through slot (672) passing through from top to bottom, and a groove (673) is provided at one end of the through slot (672). The circle cutting assembly (68) includes a connecting column (681) and a sleeve block (683), and the connecting column (681) passes through the sleeve block (683), and the sleeve block (683) is slidably connected to the inside of the through slot (672), and the sleeve block (683) fits into the groove (673). The connecting column (681) is located inside the sleeve block (683) and is fixedly connected to a connecting ring (682), and a bearing (684) is installed on the periphery of the connecting ring (682), and the periphery of the bearing (684) is fixedly connected to the sleeve block (683); The machine body (11) is provided with a drawing groove (12), and the inner wall of the drawing groove (12) is provided with a track assembly (79), and the track assembly (79) is located on both sides of the receiving block (71), and the receiving block (71) is slidably connected to the inside of the drawing groove (12) through the track assembly (79), and the receiving block (71) is provided with a receiving groove (72) at one end close to the machine body (11), and two receiving connecting rods (76) are rotatably connected to the two sides of the workbench (3), and the lower end of the receiving connecting rod (76) is rotatably connected to the inner wall of the receiving groove (72); A notch (73) is provided at the bottom of the receiving groove (72), and the notch (73) is used for connecting the film-sticking table (2) to the pump body inside the machine body (11). A buckle (75) is provided at one end of the receiving block (71) away from the machine body (11), and the buckle (75) is installed on both sides of the receiving block (71).

2. The wafer processing equipment according to claim 1, characterized in that: The linkage assembly (65) includes a longitudinal plate (651) and a linkage longitudinal plate (655); the rolling assembly (66) includes a support frame (661) and a film pressing roller (664); a limiting column (662) is fixedly connected above the support frame (661); the limiting column (662) passes through the linkage longitudinal plate (655); a spring (663) surrounds the periphery of the limiting column (662); the spring (663) is located above the linkage longitudinal plate (655); the opposite sides of the side plate (61) are fixedly connected with a transverse slide rail (62) and a limiting slide rail (64); the limiting slide rail (64) is a special-shaped rail, which is composed of a transverse middle and vertical ends.

3. The wafer processing equipment according to claim 2, wherein: The longitudinal plate (651) is rotatably connected by a connecting column (681), and both ends of the longitudinal plate (651) and the linked longitudinal plate (655) are slidably connected to the inside of the transverse slide rail (62). The two ends of the film pressing roller (664) are fixedly connected with a protruding rod (665), and the film pressing roller (664) is rotatably connected to the bottom of the support frame (661) through the protruding rod (665), and the protruding rod (665) is slidably connected to the inside of the limiting slide rail (64).

4. The wafer processing equipment according to claim 3, characterized in that: A rack (63) is fixedly connected to the top of the transverse slide rail (62), and the two ends of the longitudinal plate (651) are rotatably connected to the driving connecting rod (652). The end of the driving connecting rod (652) away from the longitudinal plate (651) is rotatably connected to the linkage connecting rod (654), and the end of the linkage connecting rod (654) away from the driving connecting rod (652) is rotatably connected to the two ends of the linkage longitudinal plate (655). The driving connecting rod (652) is rotatably connected to the longitudinal plate (651) and is fixedly connected to the gear (653), and the gear (653) fits the rack (63).

5. The wafer processing equipment according to claim 1, wherein: The winding roller (82) is rotatably connected to one side of the support plate (81), and one end of the winding roller (82) located inside the support plate (81) is fixedly connected to a second gear (83), and a one-way gear (84) is meshed and connected below the second gear (83). The one-way gear (84) is rotatably connected to the inside of the support plate (81) and the machine body (11). A sliding groove (74) is provided above the receiving block (71), and the second rack (77) is slidably connected to the inside of the sliding groove (74), and the second rack (77) is matched with the bottom of the one-way gear (84).

6. The wafer processing equipment according to claim 5, characterized in that: A spring 2 (78) that is evenly distributed is fixedly connected to the lower portion of the rack 2 (77), and the UV film (9) surrounds the periphery of the new film cylinder (91). A waste film cylinder (92) is provided at one end of the UV film (9) away from the new film cylinder (91), and the waste film cylinder (92) is fixedly sleeved on the periphery of the winding roller (82).

7. The wafer processing equipment according to claim 1, characterized in that: The bottom of the connecting column (681) is fixedly connected to a transverse connecting rod (686), both ends of the connecting rod (686) are rotatably connected to circular cutting knives (687), and the top of the connecting column (681) is fixedly connected to a driving hand rod (685).

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