Plating liquid supply device, plating system, and maintenance method of plating liquid supply device

Abstract

The present invention provides a plating solution supply device and a maintenance method, which can prevent the scattering of powder as much as possible and perform maintenance. The plating solution supply device for supplying plating solution used for plating comprises: a hopper frame, which accommodates the hopper and accommodates the feeder in a state where a part of the feeder protrudes to the outside, and the hopper frame can change the state to a connected state in which the part of the feeder is accommodated in a box frame and a separated state in which the part of the feeder is located outside the box frame; and a covering member, which is installed on the hopper frame and can change the state to a covered state in which the part of the feeder is accommodated and an exposed state in which the part of the feeder is exposed.

Description

Technical Field

[0001] The invention relates to a plating liquid supply device, a plating system and a maintenance method of the plating liquid supply device. Background Art

[0002] In the past, wiring was formed in fine wiring grooves, holes or resist openings provided on the surface of a substrate such as a semiconductor wafer, or bumps (protruding electrodes) electrically connected to electrodes of a package were formed on the surface of the substrate. As methods for forming the wiring and bumps, for example, electrolytic plating, vapor deposition, printing, ball bumping, etc. are known, but with the increase in the number of I / Os of semiconductor wafers and the narrowing of the pitch, electrolytic plating, which can be miniaturized and has relatively stable performance, has gradually been widely used.

[0003] In an electrolytic plating apparatus, an anode and a substrate are generally disposed facing each other in a plating tank containing a plating solution, and a voltage is applied to the anode and the substrate, thereby forming a plated film on the surface of the substrate.

[0004] In the past, as the anode used in the electrolytic plating device, a dissolving anode that dissolves in the plating solution or an insoluble anode that does not dissolve in the plating solution was used. In the case of using an insoluble anode for plating, as the plating progresses, the metal ions in the plating solution are consumed. Therefore, it is necessary to regularly replenish the plating solution with metal ions to adjust the concentration of the metal ions in the plating solution. Therefore, it is known that a metal powder is dissolved in a plating solution contained in a plating solution tank different from a plating tank, and a device for supplying the plating solution to the plating tank (for example, refer to patent document 1). The device described in patent document 1 is equipped with a hopper for accommodating metal powder, and a feeder for conveying the metal powder falling from the lower opening of the hopper toward the plating solution tank.

[0005] Patent Document 1: Japanese Patent Application Publication No. 2017-141503

[0006] The above-mentioned hopper and feeder have the following situations: the plating liquid vaporizes and adheres to the surface of the machine, causing the powder to adhere, or the lumps contained in the powder cause blockage, etc., which causes a bad supply of powder to the plating liquid tank. Therefore, in the plating liquid supply device, it is expected that the device will be maintained when an abnormality occurs or regularly. However, when maintaining the device, there is a concern that the metal powder will fly. If the metal powder is scattered in the manufacturing plant, there is a concern that it will have an adverse effect on the plating device or damage the health of the operator. Summary of the invention

[0007] The present invention has been made in view of the above-mentioned problems, and one of its objects is to provide a plating solution supply device, a plating system, and a maintenance method that can perform maintenance while preventing scattering of powder as much as possible.

[0008] According to one embodiment of the present invention, a plating liquid supply device is proposed, which is used to supply a plating liquid used for plating, and the plating liquid supply device comprises: a mixing box, which is configured to dissolve a powder containing a metal in the plating liquid; a box frame, which accommodates the above-mentioned mixing box; a hopper, which is configured to accommodate the above-mentioned powder; a feeder, which is configured to supply the above-mentioned powder toward the above-mentioned mixing box from an opening provided at the lower part of the above-mentioned hopper; a hopper frame, which accommodates the above-mentioned hopper and accommodates the above-mentioned feeder in a state in which a part of the above-mentioned feeder protrudes to the outside, and the hopper frame can change the state into a connected state in which the above-mentioned part of the feeder is accommodated in the above-mentioned box frame, and a separated state in which the above-mentioned part of the feeder is located outside the above-mentioned box frame; and a covering component, which is installed on the above-mentioned hopper frame and can change the state into a covered state in which the above-mentioned part of the feeder is accommodated, and an exposed state in which the above-mentioned part of the feeder is exposed. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 It is a schematic diagram showing the overall structure of the plating system according to the present embodiment.

[0010] Figure 2 Yes means Figure 1 A diagram showing details of a plating tank.

[0011] Figure 3 It is a perspective view showing the appearance of the plating solution supply device according to the present embodiment.

[0012] Figure 4 It is a schematic diagram showing the structure of the plating solution supply device according to this embodiment.

[0013] Figure 5 It is a diagram showing the interior of the sealed chamber according to this embodiment.

[0014] Figure 6 This is a perspective view of a hopper frame and a sealed chamber according to one embodiment as viewed from above.

[0015] Figure 7 It is a schematic diagram showing the structure of the plating solution supply device in a connected state.

[0016] Figure 8 It is a schematic diagram showing the structure of the plating solution supply device in a separated state.

[0017] Fig. 9 It is a perspective view showing the appearance of the plating solution supply device in a separated state.

[0018] Fig.10 This is a flowchart showing an example of a maintenance method of a plating solution supply device.

[0019] Fig.11 It is a perspective view showing an example of the appearance of the hopper frame in a separated state. DETAILED DESCRIPTION

[0020] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In the drawings described below, the same or corresponding components are denoted by the same reference numerals and duplicate descriptions are omitted. Figure 1 Schematic diagram showing the overall structure of the plating system involved in this embodiment. In this embodiment, the plating device 1 is an electrolytic plating unit for electrolytically plating a metal such as copper on a substrate such as a wafer. In addition, the plating solution supply device 20 is a device for adjusting the metal ion concentration in the plating solution used in the plating device 1.

[0021] As examples of metals plated on the substrate, copper, indium, nickel, cobalt, and ruthenium can be cited. As examples of powders, copper oxide powder, sulfates such as indium sulfate, nickel sulfate, and cobalt sulfate, sulfamate salts such as nickel sulfamate and cobalt sulfamate, halides such as nickel bromide, nickel chloride, and cobalt chloride, and indium oxide can be cited. The average particle size of the powder containing at least the metal in this embodiment is in the range of 10 microns to 200 microns, more preferably in the range of 15 microns to 50 microns. If the average particle size is too small, there is a concern that it will become dust and easily scatter. On the contrary, if the average particle size is too large, there is also a concern that the solubility in the solution will deteriorate when it becomes a plating solution.

[0022] The plating device 1 has a plurality of plating tanks 2 for plating substrates. Each plating tank 2 includes an inner tank 5 and an outer tank 6. The plating solution fills the inner tank 5, overflows from the side wall of the inner tank 5 and flows into the outer tank 6. The substrate to be plated ( Figure 1 The substrate 1 (not shown) is immersed in the plating solution in the inner tank 5. In one embodiment, the plating device 1 may also include a plating tank 2.

[0023] Figure 2 Yes means Figure 1 The details of the plating tank 2 are shown in FIG. Figure 2 As shown, an insoluble anode 8 held by an anode holder 9 is arranged in the inner tank 5. In addition, in the plating tank 2, a neutral film (not shown) is arranged around the insoluble anode 8. The inner tank 5 is filled with the plating solution, and the plating solution flows into the outer tank 6 over the inner tank 5. In addition, a stirring paddle (not shown) for stirring the plating solution can be provided in the inner tank 5. The stirring paddle reciprocates parallel to the substrate W to stir the plating solution, thereby being able to uniformly supply sufficient metal ions and additives to the surface of the substrate W.

[0024] A substrate W such as a wafer is held by a substrate holder 11 and immersed in the plating solution in the inner tank 5 of the plating tank 2 together with the substrate holder 11. As the substrate W to be plated, a semiconductor substrate, a printed wiring board, etc. can be used.

[0025] The insoluble anode 8 is electrically connected to the positive electrode of the plating power source 15 via the anode holder 9, and the substrate W held by the substrate holder 11 is electrically connected to the negative electrode of the plating power source 15 via the substrate holder 11. When a voltage is applied between the insoluble anode 8 immersed in the plating solution and the substrate W by the plating power source 15, an electrochemical reaction occurs in the plating solution contained in the plating tank 2, thereby precipitating a metal (e.g., copper) on the surface of the substrate W. In this way, the surface of the substrate W is plated with metal.

[0026] return Figure 1 The plating solution supply device 20 comprises: a main box 18, which is configured to maintain the plating solution inside; and a mixing box 19, which mixes and dissolves a powder (hereinafter referred to as metal powder) containing at least a metal (e.g., copper) in the plating solution to generate a high-concentration supplementary plating solution.

[0027] The plating tank 2 and the main tank 18 of the plating device 1 are connected by a plating solution supply line 21 and a plating solution return line 24. The plating solution supply line 21 extends from the main tank 18 to the plating tank 2, and the plating solution return line 24 extends from the plating tank 2 to the main tank 18. During the plating of the substrate, the plating solution circulates between the plating tank 2 and the main tank 18.

[0028] A portion of the plating solution supply pipeline 21 is composed of a plurality of supply branch pipelines 21a, which are respectively connected to the bottom of the inner tank 5 of the plating tank 2. A flow regulating valve 26 is installed in each of the supply branch pipelines 21a. The flow rate of the plating solution from the main tank 18 is regulated by the flow regulating valve 26, and the plating solution of the regulated flow rate flows into the plating tank 2. A portion of the plating solution return pipeline 24 is also composed of a plurality of return branch pipelines 24a, which are respectively connected to the bottom of the outer tank 6 of the plating tank 2. An opening and closing valve 27 is installed in each of the return branch pipelines 24a.

[0029] The plating solution supply device 20 further includes: a first temperature sensor 30 for measuring the temperature of the plating solution in the main tank 18; a first liquid level detector 31 for measuring the liquid level of the plating solution in the main tank 18; a first stirrer 33 for stirring the plating solution in the main tank 18; and an additive inlet 34 for adding an additive to the plating solution in the main tank 18. The first temperature sensor 30, the first liquid level detector 31, the first stirrer 33, and the additive inlet 34 are installed at the upper part of the main tank 18. The first stirrer 33 has a stirring blade 33a arranged in the main tank 18.

[0030] The plating solution supply device 20 further includes: a circulation pump 38 installed in the plating solution supply line 21, a first temperature regulator 39, an on-off valve 41, a flow meter 42 and a filter 44. When the circulation pump 38 is operated, the plating solution in the main tank 18 is supplied to the inner tank 5 of the plating tank 2 through the plating solution supply line 21, overflows from the side wall of the inner tank 5 and flows into the outer tank 6, and further returns to the main tank 18 through the plating solution return line 24. In this way, with the operation of the circulation pump 38, the plating solution circulates between the plating tank 2 and the main tank 18. The temperature of the plating solution flowing through the plating solution supply line 21 is adjusted by the first temperature regulator 39 to a predetermined plating temperature range. The plating temperature range is predetermined based on the plating process of the substrate in the plating tank 2. In one example, the plating temperature range is 25°C to 45°C. The temperature-regulated plating solution is supplied to each inner tank 5 of the plating tank 2 through the flow meter 42, the filter 44 and the flow control valve 26. The flow rate of the plating solution passing through the plating solution supply line 21 is measured by a flow meter 42 .

[0031] The pressure release line 48 is branched from the plating solution supply line 21, and the front end of the pressure release line 48 is connected to the upper part of the main tank 18. The pressure sensor 49 and the pressure relief valve 50 are installed in the pressure release line 48. When the pressure in the plating solution supply line 21 exceeds a certain set value due to reasons such as clogging of the filter 44, the pressure relief valve 50 opens, and a part of the plating solution passing through the plating solution supply line 21 returns to the main tank 18 through the pressure release line 48.

[0032] A first concentration measuring device 54 for measuring the concentration of metal ions (for example, copper ions in the case of copper plating) in the plating solution is installed in the plating solution return pipeline 24. The first concentration measuring device 54 is connected to the action control unit 57, and the measured value of the concentration of the metal ions is sent from the first concentration measuring device 54 to the action control unit 57. The action control unit 57 controls the actions of the plating device 1 and the plating solution supply device 20. The action control unit 57 can also be composed of a dedicated or general-purpose computer.

[0033] The plating solution supply device 20 includes: a second temperature sensor 60 for measuring the temperature of the replenishing plating solution in the mixing tank 19; a second liquid level detector 61 for measuring the liquid level of the replenishing plating solution in the mixing tank 19; a second stirrer 64 for stirring the replenishing plating solution in the mixing tank 19; and a second concentration meter 66 for measuring the metal ion concentration in the replenishing plating solution in the mixing tank 19. The second temperature sensor 60, the second liquid level detector 61, the second stirrer 64, and the second concentration meter 66 are installed on the upper part of the mixing tank 19. The second stirrer 64 has a stirring blade 64a arranged in the mixing tank 19.

[0034] The plating solution supply device 20 further includes a plating solution replenishing line 68 connecting the mixing box 19 to the main box 18. The plating solution replenishing line 68 is provided with a mixing pump 71, a second temperature regulator 73, a replenishing valve 74, and a flow meter 75. The replenishing valve 74 is usually closed. If the replenishing valve 74 is opened while the mixing pump 71 is in operation, the high-concentration replenishing plating solution generated in the mixing box 19 is injected into the plating solution held in the main box 18 through the plating solution replenishing line 68. The replenishing plating solution has a concentration of metal ions higher than the concentration of metal ions in the plating solution in the main box 18.

[0035] The plating solution supply device 20 further includes a mixing circulation line 77 branched from the plating solution replenishing line 68. One end of the mixing circulation line 77 is connected to the plating solution replenishing line 68, and the other end of the mixing circulation line 77 is connected to the mixing box 19. A mixing circulation valve 78 is installed in the mixing circulation line 77. The mixing circulation valve 78 is usually opened. If the mixing pump 71 is operated in a state where the replenishing valve 74 is closed, the replenishing plating solution circulates through the mixing box 19, a part of the plating solution replenishing line 68, and the mixing circulation line 77.

[0036] The mixing pump 71 and the second temperature regulator 73 are located upstream of the mixing circulation line 77. The replenishing plating solution circulates through the mixing tank 19, a portion of the plating solution replenishing line 68, and the mixing circulation line 77, and the temperature of the replenishing plating solution is adjusted by the second temperature regulator 73. As an example, the temperature of the replenishing plating solution is adjusted to a temperature higher than the above-mentioned plating temperature range (for example, 80° C.).

[0037] The plating system further includes a powder supply device 80 for supplying metal powder containing at least copper or other metal to the mixing box 19. As an example, the powder supply device 80 is arranged in a downstairs room and isolated from the clean room. The powder supply device 80 is configured to be connected to the mixing box 19 and to put a certain set amount of metal powder into the mixing box 19. The plating solution containing the metal powder is stirred by the second stirrer 64 in the mixing box 19 while circulating through the mixing box 19, a part of the plating solution replenishing pipeline 68, the second temperature regulator 73, and the mixing circulation pipeline 77. As a result, the metal powder is dissolved in the plating solution to generate a high-concentration replenishing plating solution.

[0038] The mixing box 19 is a closed box. An exhaust line 82 is connected to the upper part of the mixing box 19. One end of the exhaust line 82 is connected to the mixing box 19, and the other end of the exhaust line 82 is connected to a vacuum pump not shown. An exhaust filter 83 is installed in the exhaust line 82. As described above, the supplementary plating liquid in the mixing box 19 is maintained at a certain high temperature by the second temperature regulator 73, so steam is generated from the supplementary plating liquid. The steam flows into the exhaust line 82 and is captured by the exhaust filter 83. In addition, the exhaust filter 83 can capture a part of the metal powder supplied from the powder supply device 80 to the mixing box 19. The exhaust filter 83 can use a non-woven fabric made of a resin such as polypropylene that has resistance to the plating liquid.

[0039] The plating system further includes an extraction line 86 branched from the plating solution supply line 21, a flow meter 87 and an extraction valve 88 installed in the extraction line 86. One end of the extraction line 86 is connected to the plating solution supply line 21, and the other end of the extraction line 86 is connected to the mixing box 19. The flow meter 87 is configured to measure the flow rate of the plating solution passing through the extraction line 86. The extraction valve 88 is usually closed.

[0040] When the concentration of metal ions in the plating solution in the plating tank 2 is within an appropriate range (for example, higher than a preset threshold value), the mixing circulation valve 78 is in an open state and the replenishing valve 74 is in a closed state. When the concentration of metal ions in the plating solution in the plating tank 2 is lower than the threshold value, the mixing circulation valve 78 is closed and the replenishing valve 74 is opened. Through this operation, a high-concentration replenishing plating solution is supplied from the mixing tank 19 to the main tank 18 through the plating solution replenishing pipeline 68. The replenishing plating solution is mixed with the plating solution in the main tank 18.

[0041] The plating solution supply device 20 will be further described. Figure 3 2 is a perspective view showing the appearance of the plating solution supply device according to the present embodiment. Figure 4 2 is a schematic diagram showing the structure of the plating solution supply device of this embodiment. Figure 3 and Figure 4 , the main tank 18 and the like are omitted. The powder supply device 80 in the plating solution supply device 20 has a hopper 133, a feeder 130 and a motor 131. In addition, the plating solution supply device 20 has: a closed chamber 124, a hopper frame 210 for accommodating the hopper 133 and the feeder 130, and a box frame 260 for accommodating the mixing box 19 and the main tank 18.

[0042] Figure 5This is a diagram showing the interior of the sealed chamber 124 of the present embodiment. A powder container 121 containing copper oxide powder is carried into the sealed chamber 124. A vacuum clamp 161 for holding the powder container 121 by vacuum suction, a vibration device (vibrator) 165 for vibrating the powder container 121, and a stand 166 for supporting the powder container 121 are arranged in the sealed chamber 124. The powder container 121 is set on the vacuum clamp 161 and the stand 166 in a state where the powder conduit 146 is facing downward. The vacuum clamp 161 is fixed to the frame 168, and the vibration device 165 is fixed to the vacuum clamp 161. The vacuum clamp 161 has an anti-vibration rubber 161a that is in contact with the powder container 121. A through hole (not shown) for forming a vacuum inside is formed in the anti-vibration rubber 161a. The operation of the vibration device 165 and the vacuum clamp 161 is controlled by Figure 1 The motion control unit 57 shown is controlled.

[0043] The vacuum fixture 161 is connected to an ejector 170 as a vacuum generating device. The ejector 170 and the vibrating device 165 are connected to a compressed air supply pipe 172. The compressed air supply pipe 172 is branched into two, one of which is connected to the ejector 170 and the other is connected to the vibrating device 165. If compressed air is sent to the ejector 170, the ejector 170 forms a vacuum in the vacuum fixture 161, so that the powder container 121 is held by the vibration-proof rubber 161a of the vacuum fixture 161 by vacuum suction. The vibrating device 165 has a structure that is actuated by compressed air. The vibrating device 165 transmits vibration to the powder container 121 through the vacuum fixture 161, so that the powder container 121 held by the vacuum fixture 161 vibrates. The vibrating device 165 may also be in direct contact with the side of the powder container 121. In one embodiment, the vibrating device 165 may also be an electric vibrating device.

[0044] An inlet 126 of a hopper 133 that can be connected to the powder container 121 is arranged in the sealed chamber 124. A powder conduit 146 of the powder container 121 is inserted into the inlet 126 of the hopper 133. When the valve 148 is opened while the powder conduit 146 is connected to the inlet 126, the copper oxide powder in the powder container 121 flows into the inlet 126 through the powder conduit 146 and finally falls into the hopper 133. In the vicinity of the powder conduit 146 in the powder container 121, the density of the powder increases, and a bridging phenomenon that closes the powder container 121 may occur. In order to prevent the bridging phenomenon, the vibrating device 165 vibrates the powder container 121 to fluidize the copper oxide powder in the powder container 121.

[0045] Return to Figure 4The hopper 133 contains the copper oxide powder supplied from the powder container 121. The hopper 133 has a truncated cone shape as a whole, so that the copper oxide powder can easily flow downward. The upper end opening of the hopper 133 is covered by a cover 141. The cover 141 has an inlet 126 for the copper oxide powder to be put in from the above-mentioned powder container and an exhaust port 142. The exhaust port 142 is connected to the internal space of the hopper 133, and is connected to a negative pressure source not shown in the figure through an exhaust pipe 144. An on-off valve 144a such as a butterfly valve is provided in the exhaust pipe 144, and a pipe 144b configured to be able to be loaded and unloaded between the exhaust port 142 and the on-off valve 144 is provided.

[0046] The feeder 130 is configured to feed the powder supplied from the opening at the bottom of the hopper 133 toward the mixing box 19. In the present embodiment, the feeder 130 is a screw feeder having a screw (not shown) inside the supply pipe 130b, but is not limited thereto, and any mechanism such as a feeder using a belt conveyor inside the supply pipe 130b can be used. The motor 131 is connected to the feeder 130 and is configured to drive the feeder 130. The hopper 133 and the feeder 130 are fixed to the bracket 134, and the bracket 134 is supported by the weight measuring device 140. That is, the weight measuring device 140 is configured to measure the total weight of the hopper 133, the feeder 130, the motor 131, and the copper oxide powder present inside the hopper 133 and the feeder 130.

[0047] The outlet of the feeder 130 is surrounded by a shroud 143 disposed on the upper portion of the mixing box 19. If the motor 131 drives the feeder 130, the copper oxide powder in the hopper 133 is transported by the feeder 130 to the inside of the shroud 143 and falls into the mixing box 19. The powder supply device 80 may also include an input pipe extending in a vertical direction from the inside of the shroud 143 toward the mixing box 19. The input pipe is preferably made of an ultra-high molecular weight polyethylene material that prevents charging. In order to suppress the scattering of copper oxide powder from the gap between the feeder 130 and the shroud 143, a spiral airflow may also be generated inside the input pipe.

[0048] The weight measuring device 140 is connected to the operation control unit 57 which controls the operation of the motor 131. The weight measurement value output from the weight measuring device 140 can be sent to the operation control unit 57. The operation control unit 57 receives the weight measurement value from the plating device 1 (see Figure 1 ) sends a signal indicating the required replenishment value, so that the motor 131 is operated until the amount of copper oxide powder added reaches the required replenishment value. The motor 131 drives the feeder 130, and the feeder 130 adds the copper oxide powder in an amount corresponding to the required replenishment value to the mixing box 19.

[0049] In the present embodiment, the powder supply device 80 is accommodated in the hopper frame 210, and the mixing tank 19 is accommodated in the tank frame 260. That is, the powder supply device 80 and the mixing tank 19 in the plating solution supply device 20 are accommodated in different frames.

[0050] The hopper frame 210 accommodates the powder supply device 80. Specifically, the hopper frame 210 accommodates the hopper 133, the feeder 130, and the motor 131. In addition, the hopper frame 210 of the present embodiment also accommodates the bracket 134 supporting the hopper 133 and the feeder 130, and the weight measuring device 140. As an example, the hopper frame 210 is formed of a synthetic resin such as polyethylene. The hopper frame 210 accommodates the feeder 130 in a state where a part of the feeder 130 protrudes to the outside in a manner that the outlet of the feeder 130 can be inserted into the box frame 260. In addition, the feeder 130 is at least located below the hopper 133 and the part receiving the powder from the hopper 133 is accommodated in the hopper frame 210. In addition, the hopper frame 210 is equipped with a covering member 280 that can cover the part of the feeder 130 protruding from the hopper frame 210 (hereinafter referred to as the "protruding part"). The covering member 280 is formed of a tubular member that is capable of expansion and contraction. For example, the covering member is formed of polypropylene and is capable of expansion and contraction to a third to a quarter of the length. The covering member 280 is extended to cover the protruding portion of the feeder 130, and is contracted to expose the protruding portion of the feeder 130. Figure 4 As shown, when the outlet of the feeder 130 is housed in the box frame 260 (connected state), the covering member 280 is retracted and the protruding portion of the feeder 130 is not covered by the covering member 280. In one embodiment, the covering member 280 is configured to be able to be fixed by a pipe fixing band 282 (an example of a "locking mechanism", see Figure 7 , Figure 8 ) is installed in the box frame 260.

[0051] The sealed chamber 124 is placed on the upper portion of the hopper frame 210 , and the hopper frame 210 and the sealed chamber 124 are in communication with each other so that powder can be supplied from the powder container 121 accommodated in the sealed chamber 124 to the hopper 133 . Figure 6It is a three-dimensional view of a hopper frame 210 and a sealed chamber 124 according to an embodiment observed from above. As shown in the figure, an exhaust pipe 144 is provided on the upper surface of the hopper frame 210. The exhaust pipe 144 branches and is connected to the sealed chamber 124 and the hopper frame 210, and a negative pressure is formed inside the sealed chamber 124 and the hopper frame 210 through the exhaust pipe 144. In addition, a compressed air supply pipe 172 connected to the ejector 170 and the vibrator 165 is arranged on the upper surface of the hopper frame 210. In addition, a power line 158 and a signal line 159 connected to electrical equipment inside the hopper frame 210, such as the vibrator 165, the motor 131, and the motion control unit 57 are arranged on the upper surface of the hopper frame 210. An air connector and a wiring connector are provided on the compressed air supply pipe 172, the power line 158, and the signal line 159, and are configured to be disconnected.

[0052] In one embodiment, casters 220 are installed at the lower part of the hopper frame 210, and the hopper frame 210 is configured to be movable. Caster locks 222 for preventing the casters 220 from moving may also be provided on the casters 220. In addition, the hopper frame 210 may also be configured to have mechanisms such as slide rails or hinges instead of casters, and can move in a straight line or curve, or may not have a mechanism for movement.

[0053] Reference Figure 4 The box frame 260 accommodates the mixing box 19. In addition, in the present embodiment, the box frame 260 accommodates the main box 18. The box frame 260 may also accommodate at least a part of the structure of the plating device 1 on the basis of the structure of the plating liquid supply device 20. As an example, the box frame 260 is formed of a synthetic resin such as polyethylene. The box frame 260 is formed with an opening in a manner that the outlet of the feeder 130 can be inserted. Figure 3 and Figure 4 In the example shown, a foot is installed at the bottom of the box frame 260, and a mechanism for moving the box frame 260 such as casters is not installed. However, the box frame 260 may also replace the hopper frame 210 or be installed with a mechanism for moving the hopper frame 210 on the basis of the hopper frame 210.

[0054] In one embodiment, the hopper frame 210 and the box frame 260 are provided with a frame locking mechanism 270 for locking the hopper frame 210 and the box frame 260 to each other in a connected state. The frame locking mechanism 270 can adopt various mechanisms such as a latch, an index plunger, a hook lock, etc.

[0055] Figure 7 is a schematic diagram showing the structure of the plating solution supply device in a connected state, Figure 8 1 is a schematic diagram showing the structure of the plating solution supply device in a separated state. Fig. 92 is a perspective view showing the appearance of the plating solution supply device in a separated state. The hopper frame 210 and the box frame 260 can change their states into a connected state and a separated state. Figure 3 , Figure 4 , Figure 7 As shown, the connection state is a state in which the outlet of the feeder 130 is accommodated in the box frame 260, such as Figure 8 , Fig. 9 As shown, the separated state is a state where the outlet 130c of the feeder 130 is located outside the box frame 260. That is, the hopper frame 210 and the box frame 260 are configured to be separable from each other. Thus, the hopper frame 210 and the box frame 260 can be separated to maintain the hopper 133 or the feeder 130.

[0056] As a maintenance method of the plating solution supply device 20 , a method of placing the hopper frame 210 and the box frame 260 in a separated state will be described. Fig.10 1 is a flowchart showing an example of a maintenance method for a plating solution supply device. In order to maintain the plating solution supply device, first, the on-off valve 144a of the exhaust pipe 144 is closed, and the pipe 144b is removed from the exhaust pipe 144 (step S102). In one embodiment, the pipe 144b is installed on the exhaust pipe 144 by a spiral fixing band, and is removed from the exhaust pipe 144 by loosening the spiral fixing band. In addition, the connection of the compressed air supply pipe 172, the power line 158, and the signal line 159 based on the air connector and the wiring connector is released (step S104).

[0057] Next, the lock based on the caster lock 222 is released, and the locking of the hopper frame 210 and the box frame 260 based on the frame locking mechanism 270 is released (step S106). In addition, when the covering member 280 is not installed on the box frame 260, the covering member 280 is installed on the box frame 260 by the piping fixing belt 282 (step S108). In addition, in the case where there is no piping fixing belt 282 for installing the covering member 280 on the box frame 260, the operator can also form a state in which the end of the covering member 280 is pushed against the box frame 260. Then, the hopper frame 210 is moved to separate the hopper frame 210 from the box frame 260 (step S110). As a result, the outlet 130c of the feeder 130 is moved out of the box frame 260, and the hopper frame 210 and the box frame 260 are in a separated state (refer to Figure 8 , Fig. 9 ). At this time, if Fig. 9 As shown, the cover member 280 is extended as the hopper frame 210 moves, and is in a covering state, so that the protruding portion of the feeder 130 is received by the cover member 280. Thus, the powder can be prevented from scattering from the protruding portion of the feeder 130.

[0058] After the hopper frame 210 and the box frame 260 are separated, the cover member 280 is removed from the box frame 260 (step S112). Thus, the hopper frame 210 can be moved to any place to perform maintenance on the hopper 133 and the feeder 130. In addition, in one embodiment, the cover member 280 can also be closed at the end by the cover 284 in the covering state of accommodating the protruding portion of the feeder 130. Fig.11 2 is a perspective view showing an example of the appearance of the hopper frame in a separated state. As shown in the figure, the end of the covering member 280 is closed by a cover 284, thereby preventing the powder from scattering from the end of the covering member 280 even in the subsequent maintenance work.

[0059] If the maintenance work is completed, the hopper frame 210 and the box frame 260 can also be connected again. As an example, the hopper frame 210 and the box frame 260 can be connected by performing a process opposite to the method of making the above-mentioned hopper frame 210 and the box frame 260 separated. However, in the case where there is no concern that the powder will be scattered from the outlet 130c of the feeder 130 due to the maintenance work of the feeder 130, the hopper frame 210 and the box frame 260 can be connected without accommodating the protrusion of the feeder 130 by the covering member 280. In one embodiment, when the hopper frame 210 and the box frame 260 are in a connected state, the end of the covering member 280 can also be mounted on the box frame 260 by a pipe fixing belt 282.

[0060] The present invention can also be described in the following aspects.

[0061] [Method 1] According to method 1, a plating liquid supply device is proposed, which is used to supply a plating liquid used for plating, and the above-mentioned plating liquid supply device comprises: a mixing box, which is configured to dissolve a powder containing a metal in the plating liquid; a box frame, which accommodates the above-mentioned mixing box; a hopper, which is configured to accommodate the above-mentioned powder; a feeder, which is configured to supply the above-mentioned powder toward the above-mentioned mixing box from an opening provided at the lower part of the above-mentioned hopper; a hopper frame, which accommodates the above-mentioned hopper and accommodates the above-mentioned feeder in a state in which a part of the above-mentioned feeder protrudes to the outside, and the hopper frame can change the state to a connected state in which the above-mentioned part of the feeder is accommodated in the above-mentioned box frame, and a separated state in which the above-mentioned part of the feeder is located outside the above-mentioned box frame; and a covering component, which is installed on the above-mentioned hopper frame and can change the state to a covered state in which the above-mentioned part of the feeder is accommodated, and an exposed state in which the above-mentioned part of the feeder is exposed.

[0062] According to the first aspect, it is possible to perform maintenance while preventing scattering of powder as much as possible.

[0063] [Mode 2] According to Mode 2, in addition to Mode 1, the covering member is formed of a retractable cylindrical member.

[0064] According to aspect 2, the covering member can be extended and retracted to change between the covering state and the exposed state.

[0065] [Mode 3] According to Mode 3, in addition to Mode 2, the covering member has a cap capable of closing an end portion of the tubular member.

[0066] According to the third aspect, a part of the feeder can be accommodated by the covering member, and the end portion can be closed by the cap.

[0067] [Mode 4] According to Mode 4, in addition to Modes 1 to 3, a locking mechanism is further provided, which locks the above-mentioned cover member to the above-mentioned box frame.

[0068] According to aspect 4, the cover member can be locked to the tank frame, so that the hopper frame and the tank frame can be separated.

[0069] [Mode 5] According to Mode 5, in addition to Modes 1 to 4, the hopper frame has casters, and is moved by the casters, thereby changing the state between the connected state and the separated state.

[0070] According to aspect 5, the hopper frame can be easily moved.

[0071] [Mode 6] According to Mode 6, in addition to Modes 1 to 5, a frame locking mechanism is further provided, which locks the hopper frame and the tank frame in the connected state.

[0072] According to aspect 6, it is possible to suppress the hopper frame and the tank frame from being accidentally separated.

[0073] [Mode 7] According to Mode 7, in addition to Modes 1 to 6, a main tank is further provided, the main tank being used to store the plating solution and circulate the plating solution between the main tank and the plating tank.

[0074] [Method 8] According to method 8, a plating system is proposed, which comprises: a plating liquid supply device of any one of methods 1 to 7; a plating tank, which is used to plate the substrate; and a plating liquid supply pipeline, which is connected to the above-mentioned plating liquid supply device and the above-mentioned plating tank.

[0075] According to aspect 8, the same effects as aspects 1 to 7 can be achieved.

[0076] [Method 9] According to method 9, a maintenance method is proposed, which is a maintenance method for the plating liquid supply device of methods 1 to 7, and the above-mentioned maintenance method comprises: when the above-mentioned covering part is installed on the above-mentioned box frame, changing the state of the above-mentioned hopper frame from the above-mentioned connected state to the above-mentioned separated state; accommodating the above-mentioned part of the above-mentioned feeder by the above-mentioned covering part; and removing the above-mentioned covering part from the above-mentioned box frame.

[0077] According to aspect 9, the same effects as aspects 1 to 7 can be achieved.

[0078] Above, the embodiments of the present invention have been described, but the embodiments of the above invention are for easy understanding of the present invention and are not intended to limit the present invention. The present invention can be changed and improved without departing from its main purpose, and the present invention certainly includes its equivalents. In addition, within the scope of at least a part of the above-mentioned problem that can be solved or within the scope of at least a part of the effect, any combination or omission of the constituent elements recorded in the claims and the specification can be performed.

[0079] Description of Reference Numerals

[0080] W…substrate; 1…plating device; 2…plating tank; 18…main box; 19…mixing box; 20…plating solution supply device; 21…plating solution supply pipeline; 57…action control unit; 68…plating solution replenishment pipeline; 71…mixing pump; 77…mixing circulation pipeline; 80…powder supply device; 121…powder container; 124…sealed chamber; 126…inlet; 130…feeder; 130b…supply pipe; 130c…export; 131…motor; 133…hopper; 172…compressed air supply pipe; 210…hopper frame; 220…castor; 260…box frame; 270…frame locking mechanism; 280…covering component; 282…piping fixing belt (locking mechanism); 284…cover.

Claims

1. A plating solution supply device for supplying a plating solution for plating, The plating solution supply device is characterized by comprising: a mixing box configured to dissolve a powder containing a metal in a plating solution; A box frame, wherein the box frame accommodates the mixing box; a hopper configured to receive the powder; a feeder configured to supply the powder from an opening provided at a lower portion of the hopper toward the mixing box; a hopper frame body, the hopper frame body housing the hopper and housing the feeder in a state where a portion of the feeder protrudes to the outside, the hopper frame body being capable of changing a state between a connected state in which the portion of the feeder is housed in the box frame body and a separated state in which the portion of the feeder is located outside the box frame body; as well as A covering member is mounted on the hopper frame and can change a state between a covering state in which the part of the feeder is accommodated and an exposed state in which the part of the feeder is exposed.

2. The plating solution supply device according to claim 1, characterized in that: The covering member is composed of a telescopic cylindrical member.

3. The plating solution supply device according to claim 2, characterized in that: The covering member has a cap capable of closing an end portion of the tubular member.

4. The plating solution supply device according to claim 1, characterized in that: A locking mechanism is further provided for locking the cover member to the box frame.

5. The plating solution supply device according to claim 1, characterized in that: The hopper frame has casters, and is moved by the casters, thereby changing its state between the connected state and the separated state.

6. The plating solution supply device according to claim 1, characterized in that: A frame locking mechanism is further provided for locking the hopper frame and the tank frame in the connected state.

7. The plating solution supply device according to claim 1, characterized in that: The main tank further includes a main tank that contains a plating solution and circulates the plating solution between the main tank and the plating tank.

8. A plating system, characterized in that: have: The plating solution supply device according to any one of claims 1 to 7; a plating tank for plating a substrate; and A plating solution supply pipeline is connected to the plating solution supply device and the plating tank.

9. A maintenance method, which is a maintenance method for a plating solution supply device according to any one of claims 1 to 7, characterized in that: Include: In a state where the cover member is mounted on the box frame, changing the state of the hopper frame from the connected state to the separated state; The covering member receives the portion of the feeder; and The covering member is removed from the box frame.

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