Resin composition, article, and method for manufacturing flexible transparent electronic device

Abstract

Provided is a resin composition which is used in the production of a flexible transparent electronic device (100) by forming a flexible transparent electronic device (100) on a glass support substrate (1) via a release layer (2), irradiating the release layer (2) with an ultraviolet laser light (LB) via the glass support substrate (1), and forming the flexible transparent electronic device (100) on the glass support substrate (1) via the release layer (2). Peeling off the flexible transparent electronic device (100) from the glass support substrate (1); the resin composition is used to form the release layer (2). The resin composition contains an ultraviolet curable resin containing a hydrophilic group and an ultraviolet light absorber that absorbs ultraviolet laser light (LB); the absorbance of the ultraviolet light absorber to the ultraviolet laser light (LB) is 0.7 or more per 1 [mu] m optical path length, and the absorbance of the ultraviolet light absorber to the ultraviolet light irradiated to cure the ultraviolet curable resin is 0.3 or less per 1 [mu] m optical path length.

Description

Technical Field

[0001] The present invention relates to a resin composition, an article and a method for manufacturing a flexible transparent electronic device. Background Art

[0002] As disclosed in Patent Document 1, the present inventors have developed a transparent display device in which a light emitting diode (LED) element formed on a transparent substrate is used for pixels. Such a transparent display device can be viewed from the back side through the transparent display device, and is therefore used, for example, in a car windshield. In addition, as disclosed in Patent Document 1, the present inventors have also developed a transparent sensing device in which a microsensor is provided on a transparent substrate.

[0003] In this specification, electronic devices such as transparent display devices and transparent sensing devices, in which electronic components are formed on a transparent substrate and the back side can be viewed, are referred to as "transparent electronic devices." Among transparent electronic devices, if the transparent substrate is flexible, a "flexible transparent electronic device" can be obtained.

[0004] As disclosed in Patent Document 1, when manufacturing a flexible transparent electronic device, a peeling layer, a flexible transparent substrate, and an electronic element are sequentially formed on a glass supporting substrate, and then the flexible transparent electronic device including the flexible transparent substrate and the electronic element is peeled off from the glass supporting substrate.

[0005] Specifically, the peeling layer formed between the glass supporting substrate and the flexible transparent substrate is irradiated with an ultraviolet laser to peel the flexible transparent electronic device from the glass supporting substrate. Such a method is called laser lift-off (LLO). Since a peeling layer is formed between the glass supporting substrate and the flexible transparent substrate, damage to the flexible transparent substrate (i.e., the flexible transparent electronic device) caused by the irradiation of the ultraviolet laser can be suppressed.

[0006] Prior art literature

[0007] Patent Literature

[0008] Patent Document 1: International Publication No. 2021 / 132106 Summary of the invention

[0009] A part or all of the release layer adheres to and remains on the flexible transparent electronic device (specifically, the flexible transparent substrate) released from the glass supporting substrate. The release layer remaining on the flexible transparent substrate is removed by an alkaline solution.

[0010] The present inventors have found the following problems with respect to the release layer disclosed in Patent Document 1.

[0011] Since the release layer disclosed in Patent Document 1 contains a thermosetting resin, the release layer is cured by heating in the process of forming a flexible transparent electronic device on a glass supporting substrate, etc. Therefore, the release layer containing a thermosetting resin has a problem of poor removability with an alkaline solution.

[0012] Therefore, the present inventors have focused their attention on ultraviolet curing resins that do not progress in curing due to heating or the like as the resin contained in the release layer.

[0013] Here, the peeling layer contains an ultraviolet absorber for exhibiting peeling properties by irradiation with ultraviolet laser. When the ultraviolet laser is irradiated on the peeling layer, the ultraviolet laser is absorbed by the ultraviolet absorber, and the peeling layer is decomposed. On the other hand, if the ultraviolet absorber excessively absorbs ultraviolet rays for curing the ultraviolet curing resin, the ultraviolet curing resin will not be cured and the peeling layer cannot be formed. That is, the curing property of the peeling layer becomes insufficient.

[0014] The present invention has been made in view of such circumstances, and provides a resin composition containing an ultraviolet curable resin to be used in a peeling layer having curability, peelability, and removability.

[0015] The resin composition of one embodiment of the present invention is used for the production of flexible transparent electronic devices.

[0016] The above-mentioned flexible transparent electronic device is manufactured as follows:

[0017] forming a flexible transparent electronic device on a glass supporting substrate via a peeling layer, and irradiating the peeling layer with an ultraviolet laser via the glass supporting substrate to peel the flexible transparent electronic device from the glass supporting substrate;

[0018] The resin composition is a resin composition for forming the peeling layer, comprising:

[0019] A UV curable resin having a hydrophilic group, and

[0020] A UV absorber that absorbs the above-mentioned UV laser light;

[0021] The absorbance of the ultraviolet absorber to the ultraviolet laser is 0.7 or more per 1 μm of optical path length.

[0022] The ultraviolet absorber has an absorbance of 0.3 or less per 1 μm of optical path length with respect to ultraviolet rays irradiated to cure the ultraviolet curing resin.

[0023] An article according to one embodiment of the present invention comprises:

[0024] a glass supporting substrate, and

[0025] a release layer formed on the glass supporting substrate;

[0026] The article is used to irradiate the peeling layer with ultraviolet laser through the glass supporting substrate to peel the flexible transparent electronic device formed on the peeling layer from the glass supporting substrate.

[0027] The resin composition for forming the above-mentioned release layer comprises:

[0028] A UV curable resin having a hydrophilic group, and

[0029] A UV absorber that absorbs the above-mentioned UV laser light;

[0030] The absorbance of the ultraviolet absorber to the ultraviolet laser is 0.7 or more per 1 μm of optical path length.

[0031] The ultraviolet absorber has an absorbance of 0.3 or less per 1 μm of optical path length with respect to ultraviolet rays irradiated to cure the ultraviolet curing resin.

[0032] A method for manufacturing a flexible transparent electronic device according to one embodiment of the present invention forms a flexible transparent electronic device on a glass supporting substrate via a peeling layer, and irradiates the peeling layer with ultraviolet laser via the glass supporting substrate to peel the flexible transparent electronic device from the glass supporting substrate.

[0033] The peeling layer comprises:

[0034] A UV curable resin having a hydrophilic group, and

[0035] A UV absorber that absorbs the above-mentioned UV laser light;

[0036] The absorbance of the ultraviolet absorber to the ultraviolet laser is 0.7 or more per 1 μm of optical path length.

[0037] The ultraviolet absorber has an absorbance of 0.3 or less per 1 μm of optical path length with respect to ultraviolet rays irradiated to cure the ultraviolet curing resin.

[0038] According to the present invention, there can be provided a resin composition containing an ultraviolet curable resin, which is used in a peeling layer having all the properties of curability, peelability, and removability. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Figure 1 is a schematic partial plan view showing an example of a flexible transparent display device.

[0040] Figure 2 yes Figure 1 A cross-sectional view based on the II-II cutting line.

[0041] Figure 3 This is a cross-sectional view showing an example of a method for manufacturing the flexible transparent display device according to the first embodiment.

[0042] Figure 4 This is a cross-sectional view showing an example of a method for manufacturing the flexible transparent display device according to the first embodiment.

[0043] Figure 5 This is a cross-sectional view showing an example of a method for manufacturing the flexible transparent display device according to the first embodiment.

[0044] Figure 6 This is a cross-sectional view showing an example of a method for manufacturing the flexible transparent display device according to the first embodiment.

[0045] Figure 7 This is a cross-sectional view showing an example of a method for manufacturing the flexible transparent display device according to the first embodiment.

[0046] Figure 8 This is a cross-sectional view showing an example of a method for manufacturing the flexible transparent display device according to the first embodiment.

[0047] Fig. 9 This is a cross-sectional view showing an example of a method for manufacturing the flexible transparent display device according to the first embodiment.

[0048] Fig.10 This is a cross-sectional view showing an example of a method for manufacturing the flexible transparent display device according to the first embodiment.

[0049] Fig.11 This is a cross-sectional view showing an example of a method for manufacturing the flexible transparent display device according to the first embodiment.

[0050] Fig.12 This is a cross-sectional view showing an example of a method for manufacturing the flexible transparent display device according to the first embodiment.

[0051] Fig.13 This is a cross-sectional view showing an example of a method for manufacturing the flexible transparent display device according to the first embodiment.

[0052] Fig.14 This is a schematic plan view showing an example of laminated glass according to the second embodiment.

[0053] Fig.15 This is a schematic cross-sectional view showing an example of laminated glass according to the second embodiment.

[0054] Fig.16 This is a schematic cross-sectional view showing another example of the laminated glass according to the second embodiment.

[0055] Fig.17 This is a schematic partial plan view showing an example of a flexible transparent display device according to a third embodiment.

[0056] Fig.18 1 is a schematic partial plan view showing an example of a flexible transparent sensing device according to a fourth embodiment.

[0057] Fig.19 is a schematic cross-sectional view of the sensor 70 . DETAILED DESCRIPTION

[0058] The specific embodiments to which the present invention is applied are described in detail below with reference to the accompanying drawings. However, the present invention is not limited to the following embodiments. In addition, the following description and drawings are appropriately simplified for the purpose of clear description.

[0059] In this specification, a “transparent electronic device” refers to an electronic device in which electronic elements are formed on a transparent substrate and in which visual information such as a person or background located on the back side of the electronic device can be visually recognized in a desired usage environment.

[0060] In this specification, "transparent display device" refers to a display device that can visually recognize visual information such as a person or background located on the back side of the display device in a desired usage environment. It should be noted that whether it can be visually recognized is determined at least when the display device is in a non-display state, that is, when it is not powered on. "Transparent display device" is a form of "transparent electronic device".

[0061] Similarly, in this specification, "transparent sensing device" refers to a sensing device that can visually recognize visual information such as a person or background located on the back side of the sensing device in the desired usage environment. "Sensing device" refers to a device that can obtain various information using sensors. "Transparent sensing device" is a form of "transparent electronic device".

[0062] In this specification, "transparent" means that the transmittance of visible light is 40% or more, preferably 60% or more, and more preferably 70% or more. In addition, it can mean that the transmittance is 5% or more and the haze value is 10 or less. If the transmittance is 5% or more, when observing the outdoors during the day from indoors, the outdoors can be observed at a brightness equal to or higher than that of the indoors, and sufficient visibility can be ensured.

[0063] If the transmittance is 40% or more, even if the brightness of the front and back sides of the transparent display device is the same, the back side of the transparent display device can be viewed without any problem. If the haze value is 10 or less, the contrast of the background can be sufficiently ensured.

[0064] The term "transparent" does not matter whether or not a color is imparted, that is, it may be colorless and transparent or colored and transparent.

[0065] In addition, the transmittance means the value (%) measured by the method based on ISO9050. The haze value means the value measured by the method based on ISO14782.

[0066] (First embodiment)

[0067] <Configuration of flexible transparent display device>

[0068] First, refer to Figure 1 and Figure 2 The structure of the flexible transparent display device manufactured using the manufacturing method of the flexible transparent display device according to the first embodiment will be described. Figure 1 is a schematic partial plan view showing an example of a flexible transparent display device. Figure 2 yes Figure 1 A cross-sectional view based on the II-II cutting line.

[0069] It should be explained, of course Figure 1 and Figure 2 The right-handed xyz orthogonal coordinate system shown is convenient for explaining the positional relationship of the components. Usually, the positive direction of the z-axis is the vertical upward direction, and the xy plane is a horizontal plane.

[0070] Figure 1 and Figure 2 The flexible transparent display device 100 shown is a flexible transparent electronic device including a flexible transparent substrate 10 , a light emitting unit 20 , an IC (Integrated Circuit) chip 30 , wiring 40 , and a protective layer 50 . Figure 1 The display area 101 of the flexible transparent display device 100 shown in the figure is composed of a plurality of pixels and is an area for displaying images. It should be noted that images include text. Figure 1 As shown, the display area 101 is composed of a plurality of pixels arranged in a row direction (x-axis direction) and a column direction (y-axis direction). Figure 1 FIG. 1 shows a portion of the display area 101, showing 4 pixels in total, 2 pixels in the row direction and 2 pixels in the column direction. Here, a pixel PIX is surrounded by a dotted line. Figure 1 Omitted Figure 2 The flexible transparent substrate 10 and the protective layer 50 are shown. Figure 1 Although it is a plan view, the light emitting unit 20 and the IC chip 30 are indicated by dots for easy understanding.

[0071] <Planar Arrangement of Light Emitting Unit 20 , IC Chip 30 , and Wiring 40 >

[0072] First, refer to Figure 1 The planar arrangement of the light emitting section 20 , the IC chip 30 , and the wiring 40 will be described.

[0073] like Figure 1 As shown in FIG. 1 , the pixels PIX surrounded by dot-dash lines are arranged in a matrix at a pixel pitch Px in the row direction (x-axis direction) and at a pixel pitch Py in the column direction (y-axis direction). Figure 1 As shown, each pixel PIX includes a light emitting unit 20 and an IC chip 30. That is, the light emitting unit 20 and the IC chip 30 are arranged in a matrix at a pixel pitch Px in the row direction (x-axis direction) and at a pixel pitch Py in the column direction (y-axis direction).

[0074] It should be noted that the arrangement form of the pixels PIX, that is, the light emitting sections 20 is not limited to a matrix as long as they are arranged in a predetermined direction at a predetermined pixel pitch.

[0075] like Figure 1 As shown, the light emitting unit 20 of each pixel PIX includes at least one light emitting diode element (hereinafter referred to as LED element). That is, the flexible transparent display device is a display device using LED elements in each pixel PIX, which is called an LED display or the like.

[0076] exist Figure 1 In the example of , each light emitting unit 20 includes a red LED element 21, a green LED element 22, and a blue LED element 23 as electronic components. The LED elements 21 to 23 correspond to subpixels constituting one pixel. In this way, each light emitting unit 20 has LED elements 21 to 23 that emit red, green, and blue light, which are the three primary colors of light, and therefore, the flexible transparent display device can display full-color images.

[0077] It should be noted that each light emitting unit 20 may include two or more LED elements of the same color. This can expand the dynamic range of the image.

[0078] The LED elements 21 to 23 are so-called micro LED elements, for example, having a diameter of 10000 μm. 2 Specifically, the width (length in the x-axis direction) and length (length in the y-axis direction) of the LED element 21 on the flexible transparent substrate 10 are, for example, 100 μm or less, preferably 50 μm or less, and more preferably 20 μm or less. The same applies to the LED elements 22 and 23. Depending on various manufacturing conditions, the lower limit of the width and length of the LED element is, for example, 3 μm or more.

[0079] It should be explained that Figure 1 The dimensions of the LED elements 21 to 23 in FIG. 2 , namely, the width and the length, are the same, but may be different from each other.

[0080] In addition, on the flexible transparent substrate 10, the area occupied by each of the LED elements 21 to 23 is preferably 3000 μm 2Below, more preferably 500 μm 2 It should be noted that, due to various manufacturing conditions, the lower limit of the area occupied by one LED element is, for example, 10 μm. 2 Here, in this specification, the area of ​​LED elements and the area of ​​components such as wiring refer to the area of Figure 1 The area occupied by components such as LED elements and wiring in the xy plane view.

[0081] It should be explained that Figure 1 The shapes of the LED elements 21 to 23 shown are rectangular (including square), but are not particularly limited.

[0082] Here, the LED elements 21 to 23 have, for example, a mirror structure for efficiently extracting light to the visible side. Therefore, the transmittance of the LED elements 21 to 23 is, for example, as low as about 10% or less. However, in the flexible transparent display device, as described above, for example, a 10000 μm 2 The LED elements 21 to 23 are of a microscopic size below 10 cm. Therefore, even when observing the flexible transparent display device from a close distance of, for example, several 10 cm to 2 m, the LED elements 21 to 23 are almost invisible. In addition, the area with low transmittance in the display area 101 is narrow, and the visibility on the back side is excellent. In addition, the degree of freedom of the configuration of the wiring 40 and the like is also large.

[0083] It should be noted that “a region with low transmittance in the display region 101 ” refers to a region with a transmittance of 20% or less, for example. The same applies to the following.

[0084] In addition, since the LED elements 21 to 23 of a micro size are used, the LED elements are not easily damaged even if the flexible transparent display device is bent. Therefore, the flexible transparent display device can be installed on a curved transparent plate such as a window glass for a car, or can be sealed between two curved transparent plates for use. Here, since the flexible transparent substrate 10 is flexible (having flexibility), the flexible transparent display device can be bent.

[0085] The LED elements 21 to 23 are not particularly limited, and are, for example, inorganic materials. The red LED element 21 is, for example, AlGaAs, GaAsP, GaP, etc. The green LED element 22 is, for example, InGaN, GaN, AlGaN, GaP, AlGaInP, ZnSe, etc. The blue LED element 23 is, for example, InGaN, GaN, AlGaN, ZnSe, etc.

[0086] The luminous efficiency, i.e., the energy conversion efficiency, of the LED elements 21 to 23 is, for example, 1% or more, preferably 5% or more, and more preferably 15% or more. If the luminous efficiency of the LED elements 21 to 23 is 1% or more, even the LED elements 21 to 23 of the above-mentioned micro-size can obtain sufficient brightness and can be used as a display device during the day. In addition, if the luminous efficiency of the LED element is 15% or more, heat generation is suppressed and it is easy to seal it inside the laminated glass using the resin adhesive layer.

[0087] The pixel pitches Px and Py are, for example, 100 to 3000 μm, preferably 180 to 1000 μm, and more preferably 250 to 400 μm. If the pixel pitches Px and Py are within the above ranges, sufficient display performance can be ensured and high transparency can be achieved. In addition, diffraction phenomena that may be caused by light from the back side of the flexible transparent display device can be suppressed.

[0088] In addition, the pixel density of the display area 101 of the flexible transparent display device is, for example, greater than 10 ppi, preferably greater than 30 ppi, and more preferably greater than 60 ppi.

[0089] The area of ​​one pixel PIX is Px×Py. 4 μm 2 ~9×10 6 μm 2 , preferably 3×10 4 ~1×10 6 μm 2 , more preferably 6×10 4 ~2×10 5 μm 2 If the area of ​​1 pixel is 1×10 4 μm 2 ~9×10 6 μm 2 , appropriate display performance can be ensured and the transparency of the display device can be improved. The area of ​​1 pixel can be appropriately selected according to the size, purpose, and viewing distance of the display region 101.

[0090] The ratio of the area occupied by the LED elements 21 to 23 to the area of ​​one pixel is, for example, 30% or less, preferably 10% or less, more preferably 5% or less, and further preferably 1% or less. If the ratio of the area occupied by the LED elements 21 to 23 to the area of ​​one pixel is 30% or less, transparency and visibility on the back side are improved.

[0091] Figure 1In each pixel, three LED elements 21 to 23 are arranged in a row in the positive direction of the x-axis, but the present invention is not limited thereto. For example, the arrangement order of the three LED elements 21 to 23 may be changed. In addition, the three LED elements 21 to 23 may be arranged in the y-axis direction. Alternatively, the three LED elements 21 to 23 may be arranged at the vertices of a triangle.

[0092] In addition, if Figure 1 As shown, when each light emitting unit 20 includes a plurality of LED elements 21 to 23, the interval between the LED elements 21 to 23 in the light emitting unit 20 is, for example, 100 μm or less, preferably 10 μm or less. In addition, the LED elements 21 to 23 may be arranged to be in contact with each other. This makes it easy to share the first power branch line 41a, and the aperture ratio is improved.

[0093] It should be noted that Figure 1 In the example, the arrangement order, arrangement direction, etc. of the plurality of LED elements of each light emitting section 20 are the same, but may be different. In addition, when each light emitting section 20 includes three LED elements emitting light of different wavelengths, the LED elements may be arranged in the x-axis direction or the y-axis direction in a part of the light emitting sections 20, and the LED elements of each color may be arranged at the vertices of a triangle in the other light emitting sections 20.

[0094] exist Figure 1 In the example of FIG. 1 , the IC chip 30 is an electronic component that is arranged for each pixel PIX and drives the light emitting unit 20. Specifically, the IC chip 30 is connected to the LED elements 21 to 23 via the driving lines 45, respectively, and can drive the LED elements 21 to 23 independently.

[0095] It should be noted that one IC chip 30 may be arranged for each of the plurality of pixels, and the plurality of pixels connected to each IC chip 30 may be driven. For example, if one IC chip 30 is arranged for each of four pixels, the number of IC chips 30 can be reduced to 1. Figure 1 The area of ​​the IC chip 30 can be reduced to 1 / 4 of the example.

[0096] The area of ​​the IC chip 30 is, for example, 100,000 μm 2 Below, preferably 10000 μm 2 Below, more preferably 5000 μm 2 The transmittance of the IC chip 30 is as low as about 20% or less, but by using the IC chip 30 of the above size, the area with low transmittance in the display area 101 becomes narrower, and the visibility on the back side is improved.

[0097] The IC chip 30 may be, for example, a hybrid IC including an analog region and a logic region. The analog region includes, for example, a current control circuit and a voltage conversion circuit.

[0098] It should be noted that an LED element with an IC chip may be used in which the LED elements 21 to 23 and the IC chip 30 are sealed with resin. In addition, a circuit including a thin film transistor (TFT) may be used instead of the IC chip 30. Furthermore, the IC chip 30 is not essential.

[0099] On the other hand, a micro sensor may be mounted on the IC chip 30. That is, the flexible transparent display device may also be a flexible transparent sensing device. The details of the micro sensor will be described later in the fourth embodiment.

[0100] The wiring 40 of this embodiment is a display wiring, such as Figure 1 As shown, a plurality of power supply lines 41, ground lines 42, row data lines 43, column data lines 44 and drive lines 45 are provided.

[0101] exist Figure 1 In the example of FIG. 4 , the power supply line 41 , the ground line 42 , and the column data line 44 are extended in the y-axis direction. On the other hand, the row data line 43 is extended in the x-axis direction.

[0102] In each pixel PIX, the power line 41 and the column data line 44 are provided on the negative x-axis side relative to the light emitting unit 20 and the IC chip 30, and the ground line 42 is provided on the positive x-axis side relative to the light emitting unit 20 and the IC chip 30. Here, the power line 41 is provided on the negative x-axis side relative to the column data line 44. In addition, in each pixel PIX, the row data line 43 is provided on the negative y-axis side relative to the light emitting unit 20 and the IC chip 30.

[0103] Furthermore, the details are described later, such as Figure 1 As shown, the power line 41 includes a first power branch line 41a and a second power branch line 41b. The ground line 42 includes a ground branch line 42a. The row data line 43 includes a row data branch line 43a. The column data line 44 includes a column data branch line 44a. These branches are included in the wiring 40.

[0104] like Figure 1 As shown in FIG. 1 , each power line 41 extending in the y-axis direction is connected to the light emitting section 20 and the IC chip 30 of each pixel PIX arranged side by side in the y-axis direction. More specifically, in each pixel PIX, the LED elements 21 to 23 are arranged side by side in the x-axis positive direction on the side closer to the x-axis positive direction than the power line 41. Therefore, the first power branch line 41a branched from the power line 41 in the x-axis positive direction is connected to the ends of the LED elements 21 to 23 on the y-axis positive direction side.

[0105] In addition, in each pixel PIX, the IC chip 30 is arranged on the negative side of the y-axis with respect to the LED elements 21 to 23. Therefore, between the LED element 21 and the column data line 44, the second power branch line 41b branching from the first power branch line 41a in the negative direction of the y-axis is extended in a straight line and connected to the negative side of the x-axis at the end of the IC chip 30 on the positive side of the y-axis.

[0106] like Figure 1 As shown, each ground line 42 extending in the y-axis direction is connected to the IC chip 30 of each pixel PIX arranged side by side in the y-axis direction. Specifically, a ground branch line 42a branching from the ground line 42 in the negative x-axis direction extends linearly and is connected to the end of the IC chip 30 on the positive x-axis direction.

[0107] Here, the ground line 42 is connected to the LED elements 21 to 23 via the ground branch line 42 a , the IC chip 30 , and the driving line 45 .

[0108] like Figure 1 As shown, each row data line 43 extending in the x-axis direction is connected to the IC chip 30 of each pixel PIX arranged side by side in the x-axis direction (row direction). Specifically, the row data branch line 43a branched from the row data line 43 in the positive direction of the y-axis is extended in a straight line and connected to the end of the IC chip 30 on the negative side of the y-axis.

[0109] Here, the row data line 43 is connected to the LED elements 21 to 23 via the row data branch line 43 a , the IC chip 30 , and the driving line 45 .

[0110] like Figure 1 As shown, each column data line 44 extending in the y-axis direction is connected to the IC chip 30 of each pixel PIX arranged side by side in the y-axis direction (column direction). Specifically, a column data branch line 44a branched from the column data line 44 in the positive direction of the x-axis is extended in a straight line and connected to the end of the IC chip 30 on the negative side of the x-axis.

[0111] Here, the column data line 44 is connected to the LED elements 21 to 23 via the column data branch line 44 a , the IC chip 30 , and the driving line 45 .

[0112] The driving lines 45 connect the LED elements 21 to 23 and the IC chip 30 in each pixel PIX. Specifically, in each pixel PIX, three driving lines 45 extend in the y-axis direction and connect the ends of the LED elements 21 to 23 on the negative side of the y-axis to the ends of the IC chip 30 on the positive side of the y-axis.

[0113] It should be explained that Figure 1The arrangement of the power line 41, the ground line 42, the row data line 43, the column data line 44, their branches, and the drive line 45 shown is only an example and can be changed as appropriate. For example, at least one of the power line 41 and the ground line 42 can be extended in the x-axis direction instead of the y-axis direction. In addition, the power line 41 and the column data line 44 can also be replaced.

[0114] In addition, you can also use Figure 1 The overall structure shown is a structure that is reversed upside down or left-right, etc. Furthermore, it is also possible to make Figure 1 The overall structure shown is a structure that is reversed upside down or left-right, etc.

[0115] Furthermore, the row data lines 43 , the column data lines 44 , their branch lines, and the driving lines 45 are not necessarily required.

[0116] The wiring 40 is, for example, a metal such as copper (Cu), aluminum (Al), silver (Ag), or gold (Au). Among them, from the perspective of cost, a metal having low resistivity copper or aluminum as a main component is preferably used. In addition, in order to reduce reflectivity, the wiring 40 may be coated with a material such as titanium (Ti), molybdenum (Mo), copper oxide, or carbon. In addition, a concavo-convex surface may be formed on the surface of the coated material.

[0117] Figure 1 The width of the wiring 40 of the display area 101 shown is, for example, 1 to 100 μm, preferably 3 to 20 μm. Since the width of the wiring 40 is less than 100 μm, even when observing the flexible transparent display device from a close distance of, for example, about 10 cm to 2 m, the wiring 40 is almost impossible to be visually recognized, and the visibility on the back side is excellent. On the other hand, in the case of the thickness range described later, if the width of the wiring 40 is made greater than 1 μm, the excessive increase in the resistance of the wiring 40 can be suppressed, and the voltage drop and the decrease in signal strength can be suppressed. In addition, the decrease in heat conduction caused by the wiring 40 can also be suppressed.

[0118] Here, if Figure 1 As shown in the figure, when the wiring 40 mainly extends in the x-axis direction and the y-axis direction, a cross diffraction image extending in the x-axis direction and the y-axis direction is sometimes generated by light irradiated from the outside of the flexible transparent display device, which reduces the visibility of the back side of the flexible transparent display device. If the width of each wiring is narrowed to suppress the diffraction, the visibility of the back side is further improved. From the viewpoint of suppressing diffraction, the width of the wiring 40 can be 50 μm or less, preferably 10 μm or less, and more preferably 5 μm or less.

[0119] The resistivity of the wiring 40 is, for example, 1.0×10 -6 Ωm or less, preferably 2.0×10 -8The thermal conductivity of the wiring 40 is, for example, 150 to 5500 W / (m·K), or preferably 350 to 450 W / (m·K).

[0120] Figure 1 The spacing between adjacent wirings 40 in the display area 101 shown is, for example, 3 to 100 μm, preferably 5 to 30 μm. If there is an area where the wirings 40 become dense, the visual recognition on the back side may be hindered. If the spacing between adjacent wirings 40 is 3 μm or more, such visual hindrance can be suppressed. On the other hand, if the spacing between adjacent wirings 40 is 100 μm or less, sufficient display performance can be ensured.

[0121] In addition, when the interval between the wirings 40 is not constant due to bending of the wirings 40 or the like, the interval between the adjacent wirings 40 described above refers to the minimum value thereof.

[0122] The ratio of the area occupied by the wiring 40 to the area of ​​one pixel is, for example, 30% or less, preferably 10% or less, more preferably 5% or less, and further preferably 3% or less. The transmittance of the wiring 40 is, for example, as low as 20% or less or 10% or less. However, if the ratio of the area occupied by the wiring 40 in one pixel is 30% or less, the area with low transmittance in the display area 101 becomes narrower, and the visibility on the back side is improved.

[0123] Furthermore, the total area occupied by the light emitting unit 20 , the IC chip 30 , and the wiring 40 is, for example, 30% or less, preferably 20% or less, and more preferably 10% or less with respect to the area of ​​one pixel.

[0124] <Cross-sectional structure of flexible transparent display device>

[0125] Next, refer to Figure 2 The cross-sectional structure of the flexible transparent display device is described.

[0126] The flexible transparent substrate 10 is a transparent substrate having insulating properties. Figure 2 In the example shown in FIG. 1 , the flexible transparent substrate 10 has a two-layer structure of a main substrate 11 and an adhesive layer 12 .

[0127] Although described in detail later, the main substrate 11 is made of, for example, a transparent resin.

[0128] The adhesive layer 12 is, for example, a transparent resin adhesive such as an epoxy-based, acrylic-based, olefin-based, polyimide-based, or novolac-based adhesive.

[0129] The main substrate 11 may be a thin glass plate having a thickness of, for example, 200 μm or less, preferably 100 μm or less. The adhesive layer 12 is not necessarily required.

[0130] Examples of the transparent resin constituting the main substrate 11 include polyester resins such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), olefin resins such as cycloolefin polymer (COP) and cycloolefin copolymer (COC), cellulose resins such as cellulose, cellulose acetate, and cellulose triacetate (TAC), imide resins such as polyimide (PI), amide resins such as polyamide (PA), amide-imide resins such as polyamideimide (PAI), and polycarbonate (PC). Carbonate resins such as polyethersulfone (PES), sulfone resins such as polyparaxylene, vinyl resins such as polyethylene (PE), polyvinyl chloride (PVC), polystyrene (PS), polyvinyl acetate (PVAc), polyvinyl alcohol (PVA), polyvinyl butyral (PVB), acrylic resins such as polymethyl methacrylate (PMMA), ethylene-vinyl acetate copolymer resin (EVA), urethane resins such as thermoplastic polyurethane (TPU), epoxy resins, etc.

[0131] Among the materials used for the above-mentioned main substrate 11, polyethylene naphthalate (PEN) and polyimide (PI) are preferred from the viewpoint of improving heat resistance. In addition, cycloolefin polymer (COP), cycloolefin copolymer (COC), polyvinyl butyral (PVB) and the like are preferred from the viewpoint of low birefringence and ability to reduce deformation and blurring of images seen through the transparent substrate.

[0132] The above materials may be used alone or in combination of two or more materials. Furthermore, the main substrate 11 may be formed by stacking flat plates made of different materials.

[0133] The entire thickness of the flexible transparent substrate 10 is, for example, 1 to 1000 μm, or preferably 5 to 200 μm. The internal transmittance of visible light of the flexible transparent substrate 10 is, for example, 50% or more, or preferably 70% or more, or more preferably 90% or more.

[0134] In addition, since the flexible transparent substrate 10 is flexible, the flexible transparent display device can be mounted on a curved transparent plate, or can be used by being sandwiched between two curved transparent plates.

[0135] like Figure 2 As shown in FIG. 1 , the LED elements 21 to 23 and the IC chip 30 are disposed on the flexible transparent substrate 10, namely, the adhesive layer 12, and are connected to the wiring 40 disposed on the flexible transparent substrate 10. Figure 2 In the example of FIG. 1 , the wiring 40 is composed of a first metal layer M1 formed on the main substrate 11 and a second metal layer M2 formed on the adhesive layer 12 .

[0136] The thickness of the wiring 40 , that is, the total thickness of the first metal layer M1 and the second metal layer M2 is, for example, 0.1 to 10 μm, preferably 0.5 to 5 μm. The thickness of the first metal layer M1 is, for example, approximately 0.5 μm, and the thickness of the second metal layer M2 is, for example, approximately 3 μm.

[0137] In detail, Figure 2 As shown in FIG. 1 , the grounding wire 42 extending in the y-axis direction has a two-layer structure including a first metal layer M1 and a second metal layer M2 because the current is large. That is, at the location where the grounding wire 42 is provided, the adhesive layer 12 is removed, and the second metal layer M2 is formed on the first metal layer M1. Figure 2 Not shown, but Figure 1 The power supply line 41 , the row data line 43 , and the column data line 44 shown also have a two-layer structure including a first metal layer M1 and a second metal layer M2 .

[0138] Here, if Figure 1 As shown, the power line 41, the ground line 42 and the column data line 44 extending in the y-axis direction intersect with the row data line 43 extending in the x-axis direction. Figure 2 Although not shown in the figure, at the intersection, the row data line 43 is composed only of the first metal layer M1, and the power line 41, the ground line 42, and the column data line 44 are composed only of the second metal layer M2. Moreover, at the intersection, an adhesive layer 12 is provided between the first metal layer M1 and the second metal layer M2 to insulate the first metal layer M1 from the second metal layer M2.

[0139] Similarly, in Figure 1 In the intersection of the column data line 44 and the first branch power line 41 a shown, the first branch power line 41 a is composed only of the first metal layer M1 , and the column data line 44 is composed only of the second metal layer M2 .

[0140] In addition, Figure 2 In the example of FIG. 4 , the ground branch line 42a, the driving line 45, and the first power branch line 41a are formed only by the second metal layer M2, and are formed in a manner covering the ends of the LED elements 21 to 23 and the IC chip 30. Figure 2 Although not shown, the second power supply branch line 41b, the row data branch line 43a, and the column data branch line 44a are also similarly formed only of the second metal layer M2.

[0141] It should be noted that, as described above, the first power branch line 41a is composed of only the first metal layer M1 at the intersection with the column data line 44, and is composed of only the second metal layer M2 at other locations. In addition, a metal pad made of copper, silver, gold, or the like may be disposed on the wiring 40 formed on the flexible transparent substrate 10, and at least one of the LED elements 21 to 23 and the IC chip 30 may be disposed thereon.

[0142] The protective layer 50 is a transparent resin formed on substantially the entire surface of the flexible transparent base material 10 so as to cover and protect the light emitting section 20 , the IC chip 30 , and the wiring 40 .

[0143] The thickness of the protective layer 50 is, for example, 3 to 1000 μm, or preferably 5 to 200 μm.

[0144] The elastic modulus of the protective layer 50 is, for example, 10 GPa or less. When the elastic modulus is low, the impact during peeling can be absorbed, and damage to the protective layer 50 can be suppressed.

[0145] The internal transmittance of visible light of the protective layer 50 is, for example, 50% or more, preferably 70% or more, and more preferably 90% or more.

[0146] Examples of the transparent resin constituting the protective layer 50 include vinyl resins such as polyethylene (PE), polyvinyl chloride (PVC), polystyrene (PS), polyvinyl acetate (PVAc), polyvinyl alcohol (PVA), polyvinyl butyral (PVB), olefin resins such as cycloolefin polymer (COP) and cycloolefin copolymer (COC), urethane resins such as thermoplastic polyurethane (TPU), polyester resins such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), various acrylic resins such as polymethyl methacrylate (PMMA), ethylene-vinyl acetate copolymer resin (EVA), etc., or thermoplastic resins of copolymers thereof.

[0147] <Method for manufacturing flexible transparent display device>

[0148] Next, refer to Figure 3 to Figure 13 An example of a method for manufacturing the flexible transparent display device according to the first embodiment will be described. Figure 3 to Figure 13 This is a cross-sectional view showing an example of a method for manufacturing the flexible transparent display device according to the first embodiment. Figure 3 to Figure 13 is with Figure 2 The corresponding cross-sectional view.

[0149] First, if Figure 3 As shown in FIG. 1 , a release layer 2 and a main substrate 11 are sequentially formed on substantially the entire surface of a glass supporting substrate 1. Here, the glass supporting substrate 1, the release layer 2, and the main substrate 11 are described.

[0150] The glass supporting substrate 1 is a glass substrate for supporting and conveying the flexible transparent display device 100 formed on the glass supporting substrate 1 .

[0151] As described later, the peeling layer 2 is provided to peel the flexible transparent display device 100 from the glass support substrate 1. The resin composition for forming the peeling layer 2 contains an ultraviolet curing resin and an ultraviolet absorber for absorbing ultraviolet laser for peeling. In addition, the resin composition further contains a photopolymerization initiator.

[0152] Here, the ultraviolet absorber is used for the following Fig.13 The absorbance of the ultraviolet laser LB used for peeling shown in FIG. 1 is greater than 0.7 per 1 μm of optical path length. Fig.13 As shown, when the release layer 2 is irradiated with ultraviolet laser light LB, the ultraviolet absorber absorbs the ultraviolet laser light, and a part or the whole of the release layer 2 is decomposed. As a result, the flexible transparent display device 100 is peeled off from the glass supporting substrate 1.

[0153] Furthermore, since the release layer 2 absorbs the ultraviolet laser LB, the ultraviolet laser LB hardly reaches the flexible transparent substrate 10. Therefore, damage to the flexible transparent substrate 10 due to irradiation with the ultraviolet laser LB or damage to electronic components and the like caused by the impact can be suppressed.

[0154] As described later, the wavelength of the ultraviolet laser LB for lift-off is, for example, 355 nm (YAG harmonic), 308 nm (XeCl), or 248 nm (KrF).

[0155] On the other hand, the absorbance of the ultraviolet light absorber to the ultraviolet light for curing is 0.3 or less per 1 μm of the optical path length. That is, the ultraviolet light absorber contained in the resin composition for forming the peeling layer 2 is suppressed from absorbing the ultraviolet light for curing. Therefore, when the resin composition for forming the peeling layer 2 is irradiated with ultraviolet light for curing, the ultraviolet curing resin is cured to form the peeling layer 2.

[0156] Since the release layer 2 does not contain a thermosetting resin, curing does not proceed due to heating or the like.

[0157] The wavelength of the ultraviolet rays for curing is, for example, 365 nm, 385 nm, 395 nm, or 405 nm.

[0158] The absorbance of the photopolymerization initiator with respect to ultraviolet light for curing is, for example, 0.3 or more per 1 μm of the optical path length.

[0159] The absorbance of the ultraviolet absorber and the photopolymerization initiator is measured in accordance with JIS K0115, for example.

[0160] The ultraviolet curing resin contained in the resin composition for forming the peeling layer 2 has a hydrophilic group. Therefore, the peeling layer 2 is excellent in removability using an alkaline solution or an acid solution. The hydrophilic group is, for example, at least one hydrophilic group selected from a carboxyl group, a hydroxyl group, a phosphoric acid group, a nitro group, a sulfonic acid group, an amino group, and an amide group. In particular, when there is at least one hydrophilic group selected from a carboxyl group, a hydroxyl group, a phosphoric acid group, a nitro group, and a sulfonic acid group, it can be dissolved and removed using an alkaline solution after peeling. In particular, if the ratio of the hydroxyl group is high, the stability to the heating process is high, and the adaptability to processes such as photolithography is also high, which is more preferred. In addition, when there is an amino group or an amide group, it can be dissolved and removed using an acid solution after peeling.

[0161] As described above, the release layer 2 has curability, release property, and removability.

[0162] The ultraviolet curable resin contained in the resin composition for forming the peeling layer 2 has, for example, a radical polymerization reaction group as a photopolymerization reaction group, such as an acrylate ultraviolet curable resin or a methacrylate ultraviolet curable resin. The ultraviolet curable resin contained in the resin composition for forming the peeling layer 2 may be, for example, an ultraviolet curable resin having an anion polymerization reaction group or a cationic polymerization reaction group as a photopolymerization reaction group, such as an epoxy ultraviolet curable resin containing a glycidyl group or an oxetane group.

[0163] The content of photopolymerization reaction groups in the ultraviolet curable resin contained in the resin composition for forming the peeling layer 2 is, for example, 200 to 400 g / mol. If the content of photopolymerization reaction groups is 200 g / mol or more, the peeling layer 2 will not dissolve in organic solvents such as acetone, isopropyl alcohol, and N-methyl-2-pyrrolidone (NMP: N-methylpyrrolidone), and the solvent resistance of the peeling layer 2 is improved. The organic solvent is used, for example, in the process of forming the flexible transparent electronic device 100 on the glass supporting substrate 1.

[0164] On the other hand, when the content of the photopolymerizable reactive group is 400 g / mol or less, the release layer 2 is dissolved in an alkaline solution, and the removability of the release layer 2 is improved.

[0165] As will be described later in Examples, the content of the photopolymerizable group in the ultraviolet curable resin contained in the resin composition can be adjusted by simply changing the mixing ratio of the resin having a photopolymerizable group and the resin not having a photopolymerizable group.

[0166] On the other hand, the content of the photopolymerizable groups in the ultraviolet curable resin contained in the resin composition can be measured by, for example, quantitative analysis using proton nuclear magnetic resonance.

[0167] The network chain concentration of the release layer 2 formed by curing the resin composition is, for example, 1,000,000 mol / m 3 Below. If the concentration of the network chain is 1000000 mol / m 3 If the network chain concentration of the peeling layer 2 is 500000 mol / m 3 After that, the removability of the release layer 2 is further improved.

[0168] The details of the method for measuring the reticular chain concentration are described in the examples.

[0169] The thickness of the release layer 2 is, for example, 1 to 20 μm, or preferably 2 to 10 μm.

[0170] The surface roughness Ra of the peeling layer 2 is, for example, 0.5 μm or less, preferably 0.01 μm or less. The surface roughness Ra of the peeling layer 2 affects the surface roughness of the main substrate 11 formed on the peeling layer 2. Furthermore, the smaller the surface roughness Ra of the peeling layer 2, the more accurately the first metal layer M1 formed on the main substrate 11 can be patterned (see Figure 4 ).

[0171] The surface roughness Ra of the release layer 2 is measured in accordance with JIS B0601, for example.

[0172] The amount of the ultraviolet absorber added is, for example, 1 to 70 parts by mass, or preferably 2 to 50 parts by mass, based on 100 parts by mass of the total amount of the ultraviolet curable resin and the solvent in the resin composition.

[0173] The amount of the photopolymerization initiator added is, for example, 0.1 to 20 parts by mass, or preferably 0.5 to 5 parts by mass, based on 100 parts by mass of the total amount of the ultraviolet curable resin and the solvent in the resin composition.

[0174] The peeling layer 2 preferably has a lower transmittance of, for example, ultraviolet laser light LB than the flexible transparent substrate 10 (particularly the main substrate 11). The peeling layer 2 does not need to be transparent because it is removed.

[0175] Examples of the ultraviolet absorber contained in the release layer 2 include organic ultraviolet absorbers such as benzophenone-based, benzotriazole-based, triazine-based, hindered amine-based, and benzoate-based ultraviolet absorbers and inorganic ultraviolet absorbers such as titanium oxide and zinc oxide.

[0176] The ultraviolet absorber can be in liquid form or in particulate form (powder form). When the peeling layer 2 contains a powdered ultraviolet absorber, the peeling property is improved. In addition, even if the ultraviolet absorber is in liquid form, as long as it is an organic resin having a polymerization functional group and is a material that becomes a solid by curing when forming the peeling layer 2, the peeling property is improved in the same way as the case of a powdered ultraviolet absorber. Here, the temperature of the peeling layer 2 around the laser irradiation part also rises due to the heat conduction from the laser irradiation part during laser peeling. In addition, in order to prevent charging caused by peeling, laser peeling can be performed under a certain humidity environment, but in order to prevent condensation, the glass supporting substrate 1 (and the peeling layer 2) cannot be cooled. From this point of view, the softening point or glass transition temperature of the particulate ultraviolet absorber is preferably above 50°C, and more preferably above 100°C.

[0177] The average particle size (D50) of the particulate ultraviolet absorber is generally preferably 10 μm or less, and more specifically, the diameter is preferably smaller than the film thickness of the release layer 2. In addition, the average particle size (D50) of the ultraviolet absorber dispersed in the release layer 2 is more preferably smaller than the wavelength of the irradiated ultraviolet rays.

[0178] The main substrate 11 is formed, for example, by applying a resin composition for forming the main substrate 11 onto the release layer 2 and curing the resin composition.

[0179] It should be noted that a film-like main substrate 11 may be attached to the release layer 2 .

[0180] The resin composition used to form the main substrate 11 contains, for example, less than 40% by mass of an organic compound (e.g., a diluent solvent) having a molecular weight of less than 100. If the content of the organic compound having a molecular weight of less than 100 in the resin composition used to form the main substrate 11 is less than 40% by mass, the penetration of the resin composition into the peeling layer 2 is suppressed.

[0181] The content of the organic compound having a molecular weight of less than 100 in the resin composition can be measured using, for example, a gas chromatography-mass spectrometer (GC-MS: Gas Chromatography-Mass Spectrometry).

[0182] In addition, as an index for evaluating the permeability of the resin composition for forming the main substrate 11 into the peeling layer 2, the present inventors used the mass-weighted average value (hereinafter referred to as "mass-weighted average SP value") of the solubility parameters (SP values) of each organic compound (e.g., diluent) with a molecular weight of less than 100 contained in the resin composition. If the mass-weighted average SP value of the organic compound with a molecular weight of less than 100 contained in the resin composition for forming the main substrate 11 is, for example, 11 or more, the permeation of the resin composition into the peeling layer 2 is suppressed.

[0183] Here, as the SP value of each organic compound, there are known calculated values ​​based on Hansen's report in 1967 and Fedors' report in 1974. The unit of SP value is the conventional [(cal / cm 3 ) 1 / 2 ].

[0184] The mass-weighted average SP value of the organic compound with a molecular weight of less than 100 in the resin composition is calculated from the SP value and content of each organic compound with a molecular weight of less than 100. For example, the organic compound with a molecular weight of less than 100 contained in the resin composition is the diluent A, B, and C, and the respective SP values ​​are set to Spa, SPb, and SPc, and the respective contents are set to Ma, Mb, and Mc. In this case, the mass-weighted average SP value SP * It is expressed by the following formula.

[0185] SP * =(SPa×Ma+SPb×Mb+SPc×Mc) / (Ma+Mb+Mc)

[0186] Here, if the resin composition used to form the main substrate 11 permeates into the peeling layer 2, the performance and thickness of the main substrate 11 are adversely affected, and the peeling property and removability of the peeling layer 2 are also reduced. In other words, if the penetration of the resin composition into the peeling layer 2 can be suppressed, the main substrate 11 can obtain the desired performance and thickness, and the reduction in the peeling property and removability of the peeling layer 2 can be suppressed.

[0187] Next, if Figure 4 As shown in FIG. 1 , after the first metal layer M1 is formed on substantially the entire surface of the main substrate 11, the first metal layer M1 is patterned by photolithography to form lower layer wiring. Specifically, the first metal layer M1 is used to form a lower layer wiring. Figure 1 The positions where the power supply line 41, the ground line 42, the row data line 43, the column data line 44, etc. are formed as shown form lower layer wiring.

[0188] It should be noted that no lower layer wiring is formed at the intersections of the power supply line 41 , the ground line 42 , and the column data line 44 with the row data line 43 .

[0189] Next, if Figure 5 As shown, after the adhesive layer 12 is formed on substantially the entire surface of the main substrate 11 , the LED elements 21 to 23 and the IC chip 30 are mounted on the adhesive layer 12 having viscous properties.

[0190] Next, if Figure 6As shown, after a photoresist FR1 is formed on substantially the entire surface of the flexible transparent substrate 10 including the main substrate 11 and the adhesive layer 12, the photoresist FR1 on the first metal layer M1 is removed by patterning. Figure 1 The photoresist FR1 of the intersections of the row data line 43 with the power line 41 , the ground line 42 , and the column data line 44 is not removed.

[0191] Next, if Figure 7 As shown, the adhesive layer 12 in the portion where the photoresist FR1 has been removed is removed by dry etching, thereby exposing the first metal layer M1, that is, the underlying wiring.

[0192] Next, if Figure 8 As shown, all the photoresist FR1 on the flexible transparent substrate 10 is removed. Thereafter, a plating seed layer (not shown) is formed on substantially the entire surface of the flexible transparent substrate 10 .

[0193] Next, if Fig. 9 As shown, after forming a photoresist FR2 on substantially the entire surface of the flexible transparent substrate 10, the photoresist FR2 is removed by patterning at a location where upper layer wiring is to be formed, thereby exposing the seed layer.

[0194] Next, if Fig.10 As shown, the second metal layer M2 is formed by plating on the seed layer where the photoresist FR2 has been removed. Thus, the upper layer wiring is formed by the second metal layer M2.

[0195] Next, if Fig.11 As shown, the photoresist FR2 is removed. Furthermore, the seed layer exposed by the removal of the photoresist FR2 is removed by etching.

[0196] Next, if Fig.12 As shown, the protective layer 50 is formed on substantially the entire surface of the flexible transparent substrate 10. Thus, the flexible transparent display device 100 is formed on the glass supporting substrate 1 with the release layer 2 interposed therebetween. Fig.12 Items of this embodiment are shown. Fig.12 As shown, in the article of this embodiment, a release layer 2 is formed between the glass supporting substrate 1 and the flexible transparent display device 100 .

[0197] Finally, if Fig.13 As shown, ultraviolet laser light LB such as excimer laser light is irradiated from the lower side of the glass supporting substrate 1 in the figure, and the flexible transparent display device 100 formed on the glass supporting substrate 1 is peeled off from the glass supporting substrate 1. The ultraviolet laser light LB that transmits the glass supporting substrate 1 can be used to decompose the peeling layer 2, and the flexible transparent display device 100 can be peeled off from the glass supporting substrate 1.

[0198] For example, by scanning a line beam of ultraviolet laser LB, the entire glass support substrate 1 can be irradiated with ultraviolet laser LB. The wavelength of ultraviolet laser LB is, for example, 400 nm or less. As ultraviolet laser LB, for example, excimer lasers such as those with a wavelength of 308 nm (XeCl) and a wavelength of 248 nm (KrF) can be used.

[0199] The release layer 2 remaining on the flexible transparent display device 100 (specifically, the flexible transparent substrate 10 ) after the release is removed by, for example, an alkaline solution.

[0200] The flexible transparent display device 100 may be manufactured through the above processes.

[0201] In the manufacturing method of the flexible transparent display device of the present embodiment, a peeling layer 2 that absorbs the ultraviolet laser LB is formed between the glass supporting substrate 1 and the flexible transparent substrate 10 before peeling. When the ultraviolet laser LB is irradiated, the peeling layer 2 decomposes, and the flexible transparent substrate 10 is not decomposed, and the flexible transparent display device 100 is peeled off from the glass supporting substrate 1. In addition, since the peeling layer 2 absorbs the ultraviolet laser LB, it is difficult for the ultraviolet laser LB to reach the flexible transparent substrate 10. Therefore, it is possible to suppress damage to the flexible transparent substrate 10 due to irradiation of the laser, or damage to electronic components and the like caused by the impact.

[0202] In addition, in the manufacturing method of the flexible transparent display device of the present embodiment, the peeling layer 2, i.e., the resin composition for forming the peeling layer 2, contains an ultraviolet curable resin and an ultraviolet absorber. Here, since the absorbance of the ultraviolet absorber to the ultraviolet laser LB for peeling is 0.7 or more per 1 μm of the optical path length, the peeling layer 2 has excellent peelability.

[0203] On the other hand, since the absorbance of the ultraviolet light absorber for curing ultraviolet light is 0.3 or less per 1 μm of optical path length, the absorption of the ultraviolet light for curing by the ultraviolet light absorber is suppressed, and the curability of the release layer 2 is also excellent.

[0204] Furthermore, since the ultraviolet curable resin has a hydrophilic group, the release layer 2 is excellent in removability with an alkaline solution.

[0205] As described above, the release layer 2 used for manufacturing the flexible transparent display device of the present embodiment has curability, release property, and removability.

[0206] (Second embodiment)

[0207] <Construction of laminated glass with flexible transparent display device>

[0208] Next, refer to Fig.14 , Fig.15The structure of the laminated glass according to the second embodiment will be described. Fig.14 This is a schematic plan view showing an example of laminated glass according to the second embodiment.

[0209] Fig.15 This is a schematic cross-sectional view showing an example of laminated glass according to the second embodiment. Fig.14 , Fig.15 The laminated glass 200 shown is used for a windshield among window glasses of an automobile, but is not particularly limited.

[0210] First, refer to Fig.14 The planar structure of the laminated glass 200 will be described.

[0211] like Fig.14 As shown, a black shielding portion 201 is provided around the entire periphery of the laminated glass 200. The shielding portion 201 shields sunlight and protects the adhesive used to install the laminated glass 200 on the car from ultraviolet damage. In addition, due to the shielding portion 201, the adhesive cannot be seen from the outside.

[0212] like Fig.14 As shown, the flexible transparent display device 100 has Figure 1 In addition to the display area 101 shown, a non-display area 102 provided around the display area is also provided. Here, the display area 101 is a region composed of a plurality of pixels and displays an image as described in the first embodiment, so a detailed description is omitted.

[0213] It should be explained that Fig.14 Although it is a plan view, the non-display area 102 and the shielding portion 201 are indicated by dots for easy understanding.

[0214] The non-display area 102 has no pixels and is an area where no image is displayed. Figure 1 The power line 41, the ground line 42, the row data line 43, and the column data line 44 are connected by wide wiring. The width of the wiring in the non-display area 102 is, for example, 100 to 10000 μm, preferably 100 to 5000 μm. The interval between the wirings is, for example, 3 to 5000 μm, preferably 50 to 1500 μm.

[0215] Therefore, the non-display area 102 is opaque and can be seen from inside the vehicle, while the display area 101 is transparent. Here, if the non-display area 102 can be seen, the design of the laminated glass 200 is reduced. Therefore, in the laminated glass 200 of the second embodiment, at least a part of the non-display area 102 of the flexible transparent display device 100 is provided in the shielding portion 201. The non-display area 102 provided in the shielding portion 201 is hidden by the shielding portion 201 and cannot be seen. Therefore, compared with the case where the entire non-display area 102 can be seen, the design of the laminated glass 200 is improved.

[0216] Next, refer to Fig.15 The cross-sectional structure of the laminated glass 200 will be described. Fig.15 is a cross-sectional view of a display area 101 of a flexible transparent display device 100 .

[0217] like Fig.15 As shown, the laminated glass 200 of the second embodiment is formed by laminating a pair of glass plates 220a and 220b with an intermediate film interposed therebetween. Moreover, the laminated glass 200 includes the flexible transparent display device 100 of the first embodiment with intermediate films 210a and 210b interposed therebetween. The intermediate films 210a and 210b are made of, for example, polyvinyl butyral (PVB).

[0218] Here, Fig.16 2 is a schematic cross-sectional view showing another example of the laminated glass according to the second embodiment. Fig.16 In the laminated glass 200 shown in FIG. 1 , the protective layer 50 of the flexible transparent display device 100 is composed of, for example, polyvinyl butyral (PVB) and also has the function of serving as an intermediate film. Fig.16 In the laminated glass 200 shown, the Fig.15 The intermediate film 210 a is formed on the protective layer 50 .

[0219] (Third embodiment)

[0220] <Configuration of flexible transparent display device>

[0221] Next, refer to Fig.17 The configuration of the flexible transparent display device according to the third embodiment will be described. Fig.17 FIG. 1 is a schematic partial plan view showing an example of a flexible transparent display device according to the third embodiment. Fig.17 As shown, the flexible transparent display device of this embodiment has Figure 1 In addition to the configuration of the flexible transparent display device of the first embodiment shown, a sensor 70 is further provided in the display region 101 .

[0222] exist Fig.17In the example shown, the sensor 70 is provided between the specified pixels PIX, and is connected to the power supply line 41 and the ground line 42. In addition, the detection data obtained by the sensor 70 is outputted via the data output line 46 extending from the sensor 70 in the y-axis direction. On the other hand, a control signal is inputted to the sensor 70 via the control signal line 47 extending to the sensor 70 in the y-axis direction to control the sensor 70. The sensor 70 may be single or multiple. The multiple sensors 70 may be arranged at a specified interval, for example, in the x-axis direction or the y-axis direction.

[0223] In the following description, a case where the flexible transparent display device of this embodiment is mounted on a windshield among window glasses of a car will be described. That is, the flexible transparent display device of this embodiment can also be applied to the laminated glass of the second embodiment.

[0224] The sensor 70 is, for example, an illumination sensor (e.g., a light receiving element) for detecting the illumination inside and outside the vehicle. For example, the brightness of the display area 101 obtained by the LED elements 21 to 23 is controlled according to the illumination detected by the sensor 70. For example, the greater the illumination outside the vehicle relative to the illumination inside the vehicle, the greater the brightness of the display area 101 obtained by the LED elements 21 to 23. With such a configuration, the visibility of the flexible transparent display device is further improved.

[0225] In addition, the sensor 70 may be an infrared sensor (e.g., a light receiving element) or an image sensor (e.g., a CMOS (Complementary Metal-Oxide-Semiconductor) image sensor) for sensing the line of sight of an observer (e.g., a driver). For example, the flexible transparent display device is driven only when the sensor 70 senses the line of sight. Fig.14 When the laminated glass is shown, as long as the observer does not direct his / her sight toward the flexible transparent display device, the flexible transparent display device will not block the observer's field of view, so it is preferred. Alternatively, the sensor 70 as an image sensor can be used to detect the observer's action, and based on the action, for example, the flexible transparent display device is turned on and off, or the display screen is switched.

[0226] The other structures are the same as those of the flexible transparent display device of the first embodiment.

[0227] (Fourth embodiment)

[0228] <Composition of flexible transparent sensing device>

[0229] Next, refer to Fig.18 The configuration of the flexible transparent sensing device according to the fourth embodiment will be described. Fig.181 is a schematic partial plan view showing an example of a flexible transparent sensing device according to a fourth embodiment. Fig.18 The flexible transparent sensing device shown in Figure 1 The structure of the flexible transparent display device shown in the figure is a flexible transparent electronic device having a structure in which each pixel PIX is provided with a sensor 70 instead of the light emitting unit 20 and the IC chip 30. That is, Fig.18 The flexible transparent sensing device shown does not have a light emitting portion 20 and does not have a display function.

[0230] The sensor 70 is not particularly limited. Fig.18 The flexible transparent sensing device shown is a CMOS image sensor. That is, Fig.18 The flexible transparent sensing device shown has an imaging area 301 composed of a plurality of pixels PIX arranged in a row direction (x-axis direction) and a column direction (y-axis direction), and has an imaging function. Fig.18 FIG. 3 shows a portion of the imaging area 301, showing 4 pixels in total, 2 pixels in the row direction and 2 pixels in the column direction. Here, a pixel PIX is surrounded by a dotted line. Fig.18 In, with Figure 1 The flexible transparent substrate 10 and the protective layer 50 are also omitted. Fig.18 Although it is a plan view, the sensor 70 is indicated by dots for easy understanding.

[0231] exist Fig.18 In the example shown, one sensor 70 is provided for each pixel PIX, and is disposed between a power line 41 and a ground line 42 extending in the y-axis direction, and is connected to both of them. In addition, detection data obtained by the sensor 70 is output via a data output line 46 extending in the y-axis direction from the sensor 70. On the other hand, a control signal is input to the sensor 70 via a control signal line 47 extending in the y-axis direction to the sensor 70, and the sensor 70 is controlled. The control signal is, for example, a synchronization signal, a reset signal, etc.

[0232] It should be noted that the power supply line 41 may be connected to a battery (not shown).

[0233] Here, Fig.19 is a schematic cross-sectional view of the sensor 70 . Fig.19 The sensor 70 shown is a back-illuminated CMOS image sensor. The sensor 70 as an image sensor is not particularly limited, and may be a front-illuminated CMOS image sensor or a CCD (Charge-Coupled Device) image sensor.

[0234] like Fig.19As shown, each sensor 70 includes a wiring layer, a semiconductor substrate, color filters CF1 to CF3, and micro lenses ML1 to ML3. Here, internal wiring IW is formed inside the wiring layer. In addition, photodiodes PD1 to PD3 are formed inside the semiconductor substrate.

[0235] A semiconductor substrate (e.g., a silicon substrate) is formed on the wiring layer. The internal wiring IW formed inside the wiring layer connects the wiring 40 (power line 41, ground line 42, data output line 46, and control signal line 47) to the photodiodes PD1 to PD3. When light is irradiated to the photodiodes PD1 to PD3, current is output from the photodiodes PD1 to PD3. The current output from the photodiodes PD1 to PD3 is amplified by an amplifier circuit (not shown) and output via the internal wiring IW and the data output line 46.

[0236] The color filters CF1 to CF3 are formed on the photodiodes PD1 to PD3 formed inside the semiconductor substrate, respectively. The color filters CF1 to CF3 are, for example, a red filter, a green filter, and a blue filter, respectively.

[0237] The micro lenses ML1 to ML3 are placed on the color filters CF1 to CF3, respectively. The light collected by the micro lenses ML1 to ML3, which are convex lenses, enters the photodiodes PD1 to PD3, respectively, via the color filters CF1 to CF3.

[0238] The sensor 70 of the present embodiment has, for example, a flexible transparent substrate 10 with an area of ​​250,000 μm 2 In other words, in this specification, a microsensor refers to a sensor having an area of ​​250,000 μm in top view. 2 The area of ​​the sensor 70 is preferably 25000 μm 2 Below, more preferably 2500 μm 2 It should be noted that, due to various manufacturing conditions, the lower limit of the area of ​​the sensor 70 is, for example, 10 μm. 2 above.

[0239] It should be explained that Fig.18 The shape of the sensor 70 shown is a rectangular shape, but is not particularly limited.

[0240] The flexible transparent sensing device of this embodiment can also be applied to the laminated glass of the second embodiment. When the flexible transparent sensing device of this embodiment is mounted on a windshield of a window glass of a vehicle (e.g., a car), the image of at least one of the inside and outside of the car can be acquired by using the sensor 70. That is, the flexible transparent sensing device of this embodiment has a function as a driving recorder.

[0241] It should be noted that the sensor 70 in the flexible transparent sensing device of the fourth embodiment may be a single one. In addition, the sensor 70 in the flexible transparent sensing device of the fourth embodiment is not limited to the image sensor, and may be the illumination sensor, infrared sensor, etc. illustrated in the third embodiment. Furthermore, the sensor 70 may be a radar sensor, a Lidar sensor, etc. By using the window glass for a vehicle equipped with the flexible transparent sensing device using these sensors 70, for example, the inside and outside of the vehicle can be monitored.

[0242] That is, the sensor 70 of the fourth embodiment only needs to have a 250,000 μm area on the flexible transparent substrate 10. 2 The following micro-sized microsensors are not particularly limited. For example, the sensor 70 may be a temperature sensor, an ultraviolet sensor, an electric wave sensor, a pressure sensor, an acoustic sensor, a velocity / acceleration sensor, and the like.

[0243] The other structures are the same as those of the flexible transparent display device of the first embodiment.

[0244] Example

[0245] Examples of the present invention are shown below, but the present invention is not limited to the following examples. Examples 1 to 6, 10, and 11 are embodiments of the present invention. Examples 7 to 9 are comparative examples.

[0246] Table 1 summarizes the resin type of the release layer 2 of Examples 1 to 9, the absorbance of the ultraviolet absorber per 1 μm of the optical path length of the laser, the presence or absence of a hydrophilic group, the content of the photopolymerizable group (g / mol), the reticular chain concentration (mol / m 3 ) and evaluation results (peelability and removability).

[0247] <Example 1>

[0248] [Formation of Release Layer 2]

[0249] First, a resin composition for a peeling layer is applied to a glass supporting substrate 1 by a spin coater to form a coating film. As the glass supporting substrate 1, a glass substrate AN100 manufactured by AGC Corporation having a thickness of 0.7 mm was used.

[0250] The resin composition for the release layer contains an ultraviolet curing resin, a leveling agent, an ultraviolet absorber, a photopolymerization initiator, and a diluting solvent.

[0251] The resin composition contains 30% by mass of acrylic resin 8KQ-2001 manufactured by TAISEI FINE CHEMICAL and 20% by mass of acrylic resin 7KQ-7041 manufactured by TAISEI FINE CHEMICAL as ultraviolet curing resins. Here, both acrylic resins 8KQ-2001 and 7KQ-7041 have carboxyl groups as hydrophilic groups. On the other hand, acrylic resin 8KQ-2001 has 500 g / mol of free radical polymerization reaction groups, but acrylic resin 7KQ-7041 does not have free radical polymerization reaction groups. Therefore, in the resin composition for the peeling layer of Example 1, the content of the photopolymerization reaction groups, i.e., free radical polymerization reaction groups, in the ultraviolet curing resin is 300 g / mol.

[0252] The resin composition contained 50% by mass of propylene glycol monomethyl ether manufactured by Kanto Chemical Co., Ltd. as a diluent solvent.

[0253] The total amount of the ultraviolet curable resin and the organic solvent is 100 parts by mass, and the resin composition contains 0.3 parts by mass of BYK-UV3535 manufactured by BYK as a leveling agent, 6 parts by mass of Tinuvin 400 manufactured by BASF as an ultraviolet absorber, 3 parts by mass of Tinuvin 479, and 3 parts by mass of Omnirad 907 manufactured by IGM Resins BV as a photopolymerization initiator. Tinuvin 400 as an ultraviolet absorber is in a liquid state, and Tinuvin 479 is in a particle state with an average particle size (D50) of 0.5 μm.

[0254] The absorbance of the ultraviolet absorber to ultraviolet laser light is 1 per 1 μm of optical path length.

[0255] The coating film was heated at 120°C for 5 minutes in the atmosphere to volatilize the dilution solvent, and then 2 The acrylic resin was cured by irradiating ultraviolet rays having a wavelength of 365 nm with a cumulative light amount of 1.04 Å. The coating film was then heated at 200° C. for 30 minutes to form a release layer 2 of acrylic resin on the glass supporting substrate 1 .

[0256] The network chain concentration of the peeling layer 2 is 415000 mol / m 3 .

[0257] The reticular chain concentration is calculated using the modified Flory-Rehner equation shown below. The reticular chain concentration is obtained by performing the evaluation of the removability described later.

[0258]

[0259] Here, ν represents the concentration of the network chain (mol / m 3), g represents the volume fraction of the resin in the peeling layer 2 before swelling, and V represents the molecular volume (molecular weight / density) of the swelling solution (m 3 / mol), μ represents the interaction constant between the peeling layer 2 and the swelling solution, V R The volume fraction of the resin in the swollen release layer 2 is shown. The swelling solution is an alkaline solution for removing the release layer 2 .

[0260] Here, since the release layer 2 before swelling has a solid structure, the volume fraction g of the resin in the release layer 2 before swelling is set to 1.

[0261] The molecular volume V of the swelling solution (alkaline solution) is considered to be equal to that of water and is set to 18×10 -6 .

[0262] The interaction constant μ between the release layer 2 and the swelling solution was set to a fixed value of 0.4.

[0263] The specific gravity of the swelling solution (alkaline solution) and the resin are both set to 1, and the volume fraction V of the resin in the swollen release layer 2 is R The mass of the peeling layer 2 after swelling is defined as (mass of the peeling layer 2 before swelling) / (mass of the peeling layer 2 after swelling). The mass of the peeling layer 2 after swelling is the mass of the peeling layer 2 dried after the evaluation of removability described later.

[0264] [Formation of Flexible Transparent Substrate 10]

[0265] Next, a resin composition for a flexible transparent substrate is applied on the release layer 2 by a spin coater to form a coating film. The resin composition contains an ultraviolet curable resin, a leveling agent, a photopolymerization initiator, and a diluting solvent.

[0266] The resin composition contains 49% by mass of acrylic resin A-DCP manufactured by Shin-Nakamura Chemical Industry Co., Ltd. and 21% by mass of acrylic resin A-DPH manufactured by Shin-Nakamura Chemical Industry Co., Ltd. as ultraviolet curable resins. In addition, the resin composition contains 15% by mass of methanol (molecular weight 32) manufactured by Kanto Chemical Co., Ltd. and 15% by mass of propylene glycol monomethyl ether (molecular weight 90) manufactured by Kanto Chemical Co., Ltd. as diluent solvents. That is, the content of the diluent solvent (organic compound having a molecular weight less than 100) in the resin composition for the flexible transparent substrate of Example 1 is 30% by mass.

[0267] Here, the SP value of methanol is 14.3 (based on Hansen's calculation value), and the SP value of propylene glycol monomethyl ether is 10.4 (based on Fedors' calculation value). Therefore, the mass-weighted average SP value of the diluent solvent (organic compound with a molecular weight of less than 100) in the resin composition for the flexible transparent substrate of Example 1 is (14.3×0.15+10.4×0.15) / (0.15+0.15)=12.

[0268] The resin composition contained 0.1 parts by mass of BYK-361N manufactured by BYK as a leveling agent and 5 parts by mass of Omnirad 184 manufactured by IGM Resins B.V. as a photopolymerization initiator, based on a total of 100 parts by mass of the ultraviolet curable resin and the organic solvent.

[0269] The coating film was heated at 120°C for 5 minutes in the atmosphere to volatilize the dilution solvent, and then 2 The acrylic resin was cured by irradiating ultraviolet rays with a wavelength of 365 nm at an irradiation energy density of 1.5 Å. The coated film was then heated at 140° C. for 10 minutes to form a flexible transparent substrate 10 of acrylic resin on the release layer 2 .

[0270] <Example 2>

[0271] The same procedure as in Example 1 was performed except that the amount of the ultraviolet absorber added to the resin composition for the peeling layer was changed. Specifically, the amount of the ultraviolet absorber Tinuvin 400 manufactured by BASF was changed from 6 parts by mass to 4 parts by mass, and the amount of Tinuvin 479 manufactured by BASF was changed from 3 parts by mass to 2 parts by mass.

[0272] At the same time, as shown in Table 1, in the resin composition for a release layer of Example 2, the absorbance of the ultraviolet absorber to ultraviolet laser light was reduced to 0.7 per 1 μm of the optical path length.

[0273] <Example 3>

[0274] The same procedure as in Example 1 was performed except that the blending ratio of the acrylic resin in the resin composition for the peeling layer was changed. Specifically, the blending ratio of two acrylic resins 8KQ-2001 / 7KQ-7041 manufactured by TAISEI FINE CHEMICAL was changed from 30% by mass / 20% by mass to 40% by mass / 10% by mass.

[0275] At the same time, as shown in Table 1, in the resin composition for the peeling layer of Example 3, the content of the photopolymerization reaction group, i.e., the free radical polymerization reaction group, in the ultraviolet curable resin increased to 400 g / mol. In addition, the network chain concentration of the peeling layer 2 of Example 3 increased to 440,000 mol / m 3 .

[0276] <Example 4>

[0277] The same procedure as in Example 1 was performed except that the blending ratio of the acrylic resin in the resin composition for the peeling layer was changed. Specifically, the blending ratio of two acrylic resins 8KQ-2001 / 7KQ-7041 manufactured by TAISEI FINE CHEMICAL was changed from 30 mass % / 20 mass % to 20 mass % / 30 mass %.

[0278] At the same time, as shown in Table 1, in the resin composition for the peeling layer of Example 4, the content of the photopolymerization reaction group, i.e., the free radical polymerization reaction group, in the ultraviolet curable resin was reduced to 200 g / mol. In addition, the network chain concentration of the peeling layer 2 of Example 4 was reduced to 390,000 mol / m 3 .

[0279] <Example 5>

[0280] The same procedure as in Example 1 was performed except that the type of acrylic resin in the resin composition for the peeling layer was changed. Specifically, the entire amount of acrylic resin 7KQ-7041 manufactured by Taisei Fine Chemical Co., Ltd. in Example 1 was replaced with acrylic resin A-DPH manufactured by Shin-Nakamura Chemical Co., Ltd.

[0281] At the same time, as shown in Table 1, the network chain concentration of the peeling layer 2 of Example 5 increased to 900000 mol / m 3 .

[0282] <Example 6>

[0283] The same procedure as in Example 1 was performed except that the amount of the ultraviolet absorber added to the resin composition for the peeling layer was changed. Specifically, the amount of Tinuvin 400 manufactured by BASF as the ultraviolet absorber was changed from 6 parts by mass to 9 parts by mass, and the amount of Tinuvin 479 manufactured by BASF was changed from 3 parts by mass to 0 parts by mass. That is, only Tinuvin 400 as a liquid ultraviolet absorber was added.

[0284] At the same time, as shown in Table 1, in the resin composition for a release layer of Example 6, the absorbance of the ultraviolet absorber to ultraviolet laser light was reduced to 0.9 per 1 μm of the optical path length.

[0285] <Example 7>

[0286] The acrylic resin as the ultraviolet curable resin in the resin composition for the peeling layer was changed to a novolac resin as the thermosetting resin. Specifically, the entire amount of the acrylic resin totaling 50% by mass in Example 1 was replaced with a novolac resin TR4020G manufactured by Asahi Organic Materials Industries. The resin composition for the peeling layer did not contain a photopolymerization initiator.

[0287] The coating film was heated at 170° C. for 5 minutes in the atmosphere to cure the novolac resin, thereby forming a release layer 2 of the novolac resin on the glass supporting substrate 1 .

[0288] Other than that, it is the same as Example 1.

[0289] <Example 8>

[0290] The same procedure as in Example 1 was performed except that the amount of the ultraviolet absorber added to the resin composition for the peeling layer was changed. Specifically, the amount of the ultraviolet absorber Tinuvin 400 manufactured by BASF was changed from 6 parts by mass to 2 parts by mass, and the amount of Tinuvin 479 manufactured by BASF was changed from 3 parts by mass to 1 part by mass.

[0291] At the same time, as shown in Table 1, in the resin composition for a release layer of Example 8, the absorbance of the ultraviolet absorber to ultraviolet laser light was reduced to 0.4 per 1 μm of the optical path length.

[0292] <Example 9>

[0293] The same procedure as in Example 1 was performed except that the type and proportion of the acrylic resin in the resin composition for the peeling layer were changed. Specifically, the resin composition for the peeling layer of Example 9 contained 35% by mass of acrylic resin A-DCP manufactured by Shin-Nakamura Chemical Co., Ltd. and 15% by mass of acrylic resin A-DPH manufactured by Shin-Nakamura Chemical Co., Ltd. as ultraviolet curable resins. Both the acrylic resin A-DCP manufactured by Shin-Nakamura Chemical Co., Ltd. and the acrylic resin A-DPH do not have a hydrophilic group.

[0294] [Evaluation of peelability]

[0295] The peeling layers 2 obtained in Examples 1 to 11 were evaluated for their ability to be peeled off from the glass support substrate 1 using the LLO method. An excimer laser annealing device manufactured by LightTech was used, and a laser source using XeCl with an oscillation wavelength of 308 nm. The irradiation energy density of the ultraviolet laser LB was 750 mJ / cm 2 .

[0296] In Table 1, the mark ○ indicates that the release layer 2 was released without resistance. The mark △ indicates that the release layer 2 was released with resistance. The mark × indicates that it was not released.

[0297] [Evaluation of removal]

[0298] In Examples 1 to 11, the removability of the release layer 2 remaining on the flexible transparent substrate 10 after being peeled off from the glass supporting substrate 1 was evaluated by an alkaline solution. After the flexible transparent substrate 10 with the release layer 2 remaining was immersed in a 5 mass % potassium hydroxide aqueous solution at 20° C. for 30 minutes, it was determined by visual observation whether the release layer 2 was removed from the flexible transparent substrate 10.

[0299] In Table 1, the mark ○ indicates that the release layer 2 can be removed. The mark △ indicates that the release layer 2 can be removed by extending the immersion time. The mark × indicates that the release layer 2 cannot be removed even if the immersion time is extended.

[0300] With reference to Table 1, the evaluation results of the release layers of Examples 1 to 9 are described.

[0301] The release layer of Example 1 was good in both release and removability.

[0302] In the resin composition for the release layer of Example 2, the absorbance of the ultraviolet absorber to the ultraviolet laser light is reduced to 0.7 per 1 μm of the optical path length. Therefore, the release layer of Example 2 is inferior to the release layer of Example 1 in terms of release properties.

[0303] In the resin composition for the release layer of Example 3, the content of the photopolymerization reaction group, ie, the radical polymerization reaction group, in the ultraviolet curable resin is increased to 400 g / mol. Therefore, the release layer of Example 3 is inferior to the release layer of Example 1 in removability.

[0304] The peeling layer of Example 4 had good peeling and removability. On the other hand, in the resin composition for the peeling layer of Example 4, the content of the photopolymerization reaction group in the ultraviolet curable resin, i.e., the radical polymerization reaction group, was reduced to 200 g / mol. Therefore, the peeling layer of Example 4 had a lower solvent resistance than the peeling layer of Example 1, and whitening was observed at the stage before peeling.

[0305] In the peeling layer of Example 5, the concentration of the network chain increased to 900000 mol / m 3 Therefore, the release layer of Example 5 has lower removability than the release layer of Example 1.

[0306] In the resin composition for the release layer of Example 6, the absorbance of the ultraviolet absorber to the ultraviolet laser light was reduced to 0.9 per 1 μm of the optical path length. Therefore, the release layer of Example 6 was inferior to the release layer of Example 1 in terms of release properties.

[0307] Since the resin composition for the release layer of Example 7 is a novolac resin, the release layer cannot be removed even if it is immersed in an alkaline solution for a long time.

[0308] In the resin composition for the release layer of Example 8, the absorbance of the ultraviolet absorber to the ultraviolet laser light was reduced to 0.4 per 1 μm of the optical path length. Therefore, even if the release layer of Example 8 was irradiated with the ultraviolet laser light, it could not be released.

[0309] Since the resin composition for the release layer of Example 9 does not have a carboxyl group as a hydrophilic group, the release layer cannot be removed even if it is immersed in an alkaline solution for a long time.

[0310] [Table 1]

[0311]

[0312] In Examples 10 and 11 shown below, the resin composition for the release layer was not changed, but the resin composition for the flexible transparent substrate was changed.

[0313] <Example 10>

[0314] The same as Example 1 except that the ratio of the acrylic resin to the diluent solvent in the resin composition for the flexible transparent substrate is changed. Specifically, the resin composition for the flexible transparent substrate of Example 10 contains 43% by mass of the acrylic resin A-DCP manufactured by Shin-Nakamura Chemical Co., Ltd. and 19% by mass of the acrylic resin A-DPH manufactured by Shin-Nakamura Chemical Co., Ltd. as ultraviolet curable resins. In addition, the resin composition contains 19% by mass of methanol manufactured by Kanto Chemical Co., Ltd. and 19% by mass of propylene glycol monomethyl ether manufactured by Kanto Chemical Co., Ltd. as diluent solvents. That is, the content of the diluent solvent (organic compound having a molecular weight of less than 100) in the resin composition for the flexible transparent substrate of Example 10 is 38% by mass.

[0315] At the same time, the resin composition for the flexible transparent substrate of Example 10 is more likely to permeate into the peeling layer than the resin composition for the flexible transparent substrate of Example 1. Therefore, the peeling layer of Example 10 has lower peelability and removability than the peeling layer of Example 1. It should be noted that the resin composition for the peeling layer of Example 10 is the same as the resin composition for the peeling layer of Example 1. In this way, if the resin composition for the flexible transparent substrate formed on the peeling layer is changed, the peelability and removability of the peeling layer will change.

[0316] In addition, the mass-weighted average SP value of the diluent solvent (organic compound having a molecular weight of less than 100) in the resin composition for a flexible transparent substrate of Example 10 is the same as that of Example 1.

[0317] <Example 11>

[0318] The same procedure as in Example 1 was performed except that the ratio of the diluent solvent in the resin composition for a flexible transparent substrate was changed. Specifically, the entire amount of methanol manufactured by Kanto Chemical Co., Ltd. as the diluent solvent in Example 1 was replaced with 1-butanol (molecular weight 74) manufactured by Kanto Chemical Co., Ltd. Here, the SP value of 1-butanol is 11.3 (based on Hansen's calculation value).

[0319] At the same time, the mass-weighted average SP value of the diluent solvent (organic compound having a molecular weight of less than 100) in the resin composition for a flexible transparent substrate of Example 11 becomes (11.3×0.15+10.4×0.15) / (0.15+0.15)=11.

[0320] At the same time, the resin composition for the flexible transparent substrate of Example 11 also easily permeates into the peeling layer compared with the resin composition for the flexible transparent substrate of Example 1. Therefore, the peeling layer of Example 11 has lower peelability and removability than the peeling layer of Example 1. It should be noted that the resin composition for the peeling layer of Example 11 is also the same as the resin composition for the peeling layer of Example 1.

[0321] It should be noted that the present invention is not limited to the above-described embodiments, and can be appropriately modified within a scope not departing from the gist of the invention.

[0322] This application claims priority based on Japanese patent application No. 2022-095927 filed on June 14, 2022, and all the disclosed contents are incorporated herein.

[0323] Explanation of symbols

[0324] 1Glass support substrate

[0325] 2 Peeling layer

[0326] 10Flexible transparent substrate

[0327] 11 Main base board

[0328] 12 Adhesive layer

[0329] 20 light emitting part

[0330] 21~23LED components

[0331] 30IC chip

[0332] 40 wiring

[0333] 41 Power cord

[0334] 41a 1st power branch line

[0335] 41b Second power branch line

[0336] 42 ground wire

[0337] 42a grounding branch line

[0338] 43 data lines

[0339] 43a data branch line

[0340] 44 columns of data lines

[0341] 44a column data branch

[0342] 45 drive line

[0343] 46 data output lines

[0344] 47 control signal line

[0345] 50 protection layers

[0346] 70 sensors

[0347] 100 Flexible transparent display devices

[0348] 101 Display Area

[0349] 102 Non-display area

[0350] 200 laminated glass (window glass)

[0351] 201 Shelter

[0352] 210a, 210b Intermediate film

[0353] 220a, 220b glass plate

[0354] 301 Camera Area

[0355] CF1~CF3 color filter

[0356] FR1, FR2 photoresist

[0357] IW internal wiring

[0358] M1 Metal Layer 1

[0359] M2 Metal Layer 2

[0360] ML1~ML3 microlens

[0361] PD1~PD3 photodiode

[0362] PIX

Claims

1. A resin composition used for manufacturing flexible transparent electronic devices, The manufacturing of the flexible transparent electronic device is as follows: forming a flexible transparent electronic device on a glass supporting substrate via a peeling layer, and irradiating the peeling layer with an ultraviolet laser via the glass supporting substrate to peel the flexible transparent electronic device from the glass supporting substrate; The resin composition is a resin composition for forming the peeling layer, comprising: A UV curable resin having a hydrophilic group, and an ultraviolet absorber for absorbing the ultraviolet laser; The absorbance of the ultraviolet absorber to the ultraviolet laser is greater than 0.7 per 1 μm of optical path length, The absorbance of the ultraviolet absorber with respect to ultraviolet rays irradiated to cure the ultraviolet curable resin is 0.3 or less per 1 μm of optical path length.

2. The resin composition according to claim 1, wherein The hydrophilic group is at least one hydrophilic group selected from the group consisting of a carboxyl group, a hydroxyl group, a phosphoric acid group, a nitro group, a sulfonic group, an amino group and an amide group.

3. The resin composition according to claim 1 or 2, wherein The content of the photopolymerization reaction groups in the ultraviolet curable resin is 200 to 400 g / mol.

4. The resin composition according to claim 3, wherein The photopolymerization reaction group is at least one photopolymerization reaction group selected from a free radical polymerization reaction group, an anion polymerization reaction group, and a cationic polymerization reaction group.

5. The resin composition according to claim 1 or 2, wherein The ultraviolet curable resin is an acrylate ultraviolet curable resin or a methacrylate ultraviolet curable resin.

6. The resin composition according to claim 1 or 2, wherein further comprising a photopolymerization initiator, The absorbance of the photopolymerization initiator with respect to the ultraviolet rays irradiated to cure the ultraviolet curable resin is 0.3 or more per 1 μm of optical path length.

7. The resin composition according to claim 1 or 2, wherein The ultraviolet absorber includes a particulate ultraviolet absorber that is solid at room temperature.

8. An article having: a glass supporting substrate, and a release layer formed on the glass supporting substrate; The article is used to irradiate the peeling layer with ultraviolet laser through the glass supporting substrate to peel the flexible transparent electronic device formed on the peeling layer from the glass supporting substrate. The resin composition for forming the release layer comprises: A UV curable resin having a hydrophilic group, and an ultraviolet absorber for absorbing the ultraviolet laser; The absorbance of the ultraviolet absorber to the ultraviolet laser is greater than 0.7 per 1 μm of optical path length, The absorbance of the ultraviolet absorber with respect to ultraviolet rays irradiated to cure the ultraviolet curable resin is 0.3 or less per 1 μm of optical path length.

9. The article according to claim 8, wherein The stripping layer has a chain density of 1,000,000 mol / m 3 the following.

10. The article according to claim 8 or 9, wherein A flexible transparent substrate constituting the flexible transparent electronic device is formed on the release layer.

11. The article according to claim 10, wherein Electronic components constituting the flexible transparent electronic device are formed on the flexible transparent substrate.

12. A method for manufacturing a flexible transparent electronic device, comprising forming a flexible transparent electronic device on a glass supporting substrate via a peeling layer, and irradiating the peeling layer with ultraviolet laser via the glass supporting substrate to peel the flexible transparent electronic device from the glass supporting substrate. The resin composition for forming the release layer comprises: A UV curable resin having a hydrophilic group, and an ultraviolet absorber for absorbing the ultraviolet laser light, The absorbance of the ultraviolet absorber to the ultraviolet laser is greater than 0.7 per 1 μm of optical path length, The absorbance of the ultraviolet absorber with respect to ultraviolet rays irradiated to cure the ultraviolet curable resin is 0.3 or less per 1 μm of optical path length.

13. The method for manufacturing a flexible transparent electronic device according to claim 12, wherein: When forming the flexible transparent electronic device, a flexible transparent substrate constituting the flexible transparent electronic device is formed on the peeling layer, The substrate resin composition for forming the flexible transparent substrate contains less than 40% by mass of an organic compound having a molecular weight of less than 100.

14. The method for manufacturing a flexible transparent electronic device according to claim 12 or 13, wherein: When forming the flexible transparent electronic device, a flexible transparent substrate constituting the flexible transparent electronic device is formed on the peeling layer, The substrate resin composition used to form the flexible transparent substrate contains an organic compound with a molecular weight of less than 100, and the mass-weighted average SP value of the organic compound is 11 (cal / cm 3 ) 1 / 2 above.

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