Electronic equipment

Abstract

The invention discloses an electronic device. The electronic device comprises a shell, a main board located in the shell and a first fan stacked with the main board in the first direction. The mainboard is provided with a target heat source part, a target area is formed between the first fan and the mainboard, the target heat source part is arranged in the target area, a shell of the first fan is provided with an air outlet arranged in a second direction, and the second direction is different from the first direction.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to an electronic equipment. Background Art

[0002] As portable electronic devices continue to pursue higher performance, their internal electronic devices are gradually upgraded, and the heat generated is also increasing. In order to meet the heat dissipation requirements, traditional heat dissipation structures often cause components to occupy too much space, which is not conducive to the miniaturization of electronic devices. In addition, the heat dissipation structure of current small electronic devices cannot meet the heat dissipation requirements well, resulting in local high temperatures on the surface of the electronic devices when they are used, affecting the user experience. Summary of the invention

[0003] This application provides the following technical solutions:

[0004] An electronic device, comprising:

[0005] shell;

[0006] A main board, located inside the housing, is provided with a target heat source component;

[0007] A first fan is stacked with the mainboard along a first direction;

[0008] A target area is formed between the first fan and the mainboard, the target heat source component is arranged in the target area, and the housing of the first fan is provided with an air outlet arranged in a second direction, and the second direction is different from the first direction.

[0009] Optionally, in the above electronic device, the second direction and the first direction meet a perpendicular condition;

[0010] A first air inlet is formed on a side of the housing of the first fan facing the mainboard, and / or a second air inlet is formed on a housing wall of the outer shell located on a side of the first fan away from the mainboard at a position corresponding to the first fan.

[0011] Optionally, in the above electronic device, a heat spreader is included between the target heat source component and the first fan, and all or part of the target heat source component is in contact with the heat spreader;

[0012] An air layer is provided between the heat spreader and the housing of the first fan, or a heat conductive layer formed of a heat conductive material is provided between the heat spreader and the housing of the first fan, and both the heat spreader and the housing of the first fan are in contact with the heat conductive layer.

[0013] Optionally, in the above electronic device, the mainboard is provided with a first heat source component and a second heat source component located on a side of the mainboard facing the first fan, and a heat generation amount of the first heat source component is less than a heat generation amount of the second heat source component;

[0014] Wherein, the target heat source component includes the first heat source component, and the second heat source component is arranged outside the target area.

[0015] Optionally, in the above electronic device, a height of the first heat source component relative to the mainboard is smaller than a height of the second heat source component relative to the mainboard.

[0016] Optionally, in the above electronic device, the mainboard is provided with a third heat source component and a fourth heat source component located on a side of the mainboard facing the first fan, and a height of the third heat source component relative to the mainboard is smaller than a height of the fourth heat source component relative to the mainboard;

[0017] Wherein, the target heat source component includes the third heat source component, and the fourth heat source component is arranged outside the target area.

[0018] Optionally, in the above electronic device, a heat generation amount of the fourth heat source component is smaller than a heat generation amount of the third heat source component.

[0019] Optionally, the above-mentioned electronic device includes a second fan located in the casing, the second fan is located outside the coverage area of ​​the mainboard, and the second fan is used to dissipate heat from heat source components on the mainboard located in the target area and / or heat source components on the mainboard arranged outside the target area.

[0020] Optionally, the electronic device includes:

[0021] a first heat transfer member, wherein a heat absorbing portion of the first heat transfer member is connected to at least one heat source component disposed on the mainboard outside the target area, and a heat dissipating portion of the first heat transfer member is located between an air outlet of the first fan and a first heat dissipating port;

[0022] a second heat transfer member, connecting the heat absorbing portion of the first heat transfer member and the housing of the first fan, and used for transferring heat from the housing to the heat absorbing portion;

[0023] Wherein, the first heat dissipation port is opened in the shell and is opposite to the air outlet of the first fan, the side of the shell of the first fan facing the target area is set as a third heat transfer element capable of conducting heat, and the second heat transfer element is connected to the third heat transfer element.

[0024] Optionally, in the above-mentioned electronic device, the air outlet direction of the first fan includes a first target direction of blowing toward a heat source component on the mainboard located between the target area and the second fan, and / or the air outlet direction of the second fan includes a second target direction of blowing toward a heat source component on the mainboard located between the target area and the second fan.

[0025] Optionally, in the above electronic device, the housing has a first surface and a second surface opposite to each other, and a third surface connecting the first surface and the second surface, and the third surface is provided with a first heat dissipation port and a second heat dissipation port corresponding to the positions of the first fan and the second fan respectively;

[0026] The air outlet direction of the first fan includes a third target direction blowing toward the first heat dissipation port, and / or the air outlet direction of the second fan includes a fourth target direction blowing toward the second heat dissipation port.

[0027] Optionally, the electronic device includes:

[0028] The battery module is located in the outer shell and is arranged close to the fourth surface of the outer shell. The fourth surface connects the first surface and the second surface and is opposite to the third surface. The first fan and the second fan are located on the same side of the battery module in the direction from the fourth surface to the third surface. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying any creative work.

[0030] Figure 1 is a schematic diagram of a main view of an electronic device provided in Embodiment 1 of the present application;

[0031] Figure 2 is a schematic top view of an electronic device provided in Embodiment 1 of the present application;

[0032] Figure 3 yes Figure 2 A schematic diagram of the arrangement of the heat source components between the main board and the first fan;

[0033] Figure 4 is a schematic diagram of a main view of an electronic device provided in Embodiment 2 of the present application;

[0034] Figure 5 is a schematic top view of an electronic device provided in Embodiment 2 of the present application;

[0035] Figure 6 It is a schematic diagram of the main view of the electronic device provided in Example 3 of the present application.

[0036] The markings in the figure are:

[0037] 100, housing; 101, first surface; 102, second surface; 103, third surface; 104, fourth surface;

[0038] 200. Battery module;

[0039] 310, first fan; 311, third air inlet; 312, first air inlet; 313, third heat transfer element;

[0040] 320, second fan;

[0041] 400, fin assembly; 410, first fin assembly; 420, second fin assembly;

[0042] 500, mainboard; 501, CPU power supply module; 502, CPU; 503, memory; 504, solid state drive; 505, wireless module; 506, charging module; 510, component group;

[0043] 600, heat-saturating member; 601, bending portion;

[0044] 700, heat transfer parts;

[0045] 710, a first heat transfer element; 720, a fourth heat transfer element;

[0046] 800. A second heat transfer element. DETAILED DESCRIPTION

[0047] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0048] In the description of the present application, the description with reference to the terms "one embodiment", "some embodiments", "example" or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, unless they are contradictory.

[0049] In the description of this specification, relational terms such as first and second, etc. are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "comprise", "include" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the statement "comprises a ..." does not exclude the presence of other identical elements in the process, method, article or device including the element.

[0050] In order to meet the heat dissipation needs, fans for heat dissipation are usually arranged inside electronic devices (electronic devices refer to devices composed of electronic components such as integrated circuits and transistors, and using electronic technology (including) software to function). However, in the process of miniaturization of electronic devices, their internal space is getting smaller and smaller, and the problem of fan space occupation has become more and more prominent. Therefore, how to achieve the miniaturization design of electronic devices while meeting the heat dissipation needs has become a technical problem that technicians in this field need to solve urgently. Moreover, if the heat dissipation architecture cannot be well designed, small electronic devices are prone to local high temperatures on the surface of the shell during use, affecting the user experience.

[0051] See also Figure 1 to Figure 6 The embodiment of the present application provides an electronic device, including a housing 100, a mainboard 500 located inside the housing 100, and a first fan 310 stacked with the mainboard 500 along a first direction. The mainboard 500 is provided with a target heat source component, a target area is formed between the first fan 310 and the mainboard 500, the target heat source component is arranged in the target area, and the housing of the first fan 310 is provided with an air outlet arranged in a second direction, and the second direction is different from the first direction.

[0052] The electronic device can be a laptop computer, a tablet computer, a handheld game console, and other types. The housing 100 is the shell of the electronic device that is exposed to the outside. The housing 100 provides the appearance of the electronic device and provides an internal space for arranging functional components of the electronic device. The motherboard 500 is arranged inside the housing 100, that is, the motherboard 500 is located in the shell cavity of the housing 100. The main circuit system of the electronic device is installed on the motherboard 500, and the motherboard 500 carries a computing power unit that provides computing power for the electronic device to perform functions. The target heat source component refers to a component that generates heat when working, for example, it can be a central processing unit 502, a central processing unit power supply module 501, a memory 503, a solid state drive 504, a wireless module 505, a charging module 506 and other components on the motherboard 500.

[0053] The stacking direction of the first fan 310 and the mainboard 500 is the first direction, which may be a direction that satisfies the vertical condition with the board surface of the mainboard 500. The stacking of the first fan 310 and the mainboard 500 may be understood as the orthographic projection of the first fan 310 along the stacking direction and the orthographic projection of the mainboard 500 along the stacking direction having an overlapping part. Figure 2 and Figure 5 As shown in the top view schematic diagram, the mainboard 500 and the first fan 310 can be arranged in the direction of arrow A, and at least a part of the projection of the mainboard 500 and the first fan 310 will overlap with each other when the mainboard 500 and the first fan 310 are orthographically projected on each other along arrow A. The target area formed between the first fan 310 and the mainboard 500 refers to a spatial area that occupies a certain size in the first direction and corresponds to the area of ​​the mainboard 500 covered by the housing of the first fan 310. The target area provides a space for arranging heat source components, that is, the area on the mainboard 500 corresponding to the first fan 310 allows the heat source components to be arranged. The target heat source component refers to the heat source component that will be arranged in the area on the mainboard 500 corresponding to the first fan 310. Therefore, in the first direction, the target heat source component is located between the plate body of the mainboard 500 and the first fan 310. The housing of the first fan 310 is provided with an air inlet and an air outlet. After the first fan 310 is started, gas can enter the housing of the first fan 310 from the air inlet, and be blown to the outside of the housing of the first fan 310 from the air outlet. That is to say, the air outlet of the housing of the first fan 310 refers to an opening provided in the housing for the gas in the first fan 310 to leave the first fan 310. The direction of the air outlet, i.e., the second direction, refers to the direction that the air outlet faces to the outside of the housing of the first fan 310. The direction of the air outlet of the housing of the first fan 310 is different from the stacking direction of the first fan 310 and the mainboard 500, such as Figure 2 and Figure 5 As shown in the top view, the mainboard 500 and the first fan 310 can be arranged along the direction of arrow A, so the air outlet of the shell of the first fan 310 is not arranged along the direction of arrow A.

[0054] Since the first fan 310 and the main board 500 are stacked along the first direction and the target heat source component is arranged in the target area formed between the first fan 310 and the main board 500, the first fan 310 does not occupy the position on the board surface of the main board 500 where the target heat source component is arranged, and the board surface area of ​​the main board 500 does not need to be additionally increased due to the arrangement of the first fan 310. Moreover, the first fan 310 is arranged on one side of the target heat source component, and the space on the side of the target heat source component away from the board surface of the main board 500 is utilized, so that the components inside the electronic device are more compact, which is conducive to miniaturization of the electronic device. In addition, the shell of the first fan 310 forms a certain barrier between the target heat source component and the inner wall of the electronic device housing 100. In this way, even when the mainboard 500 is close to the inner wall of the housing 100 along the first direction (this situation is often encountered in the process of miniaturization and thinning design of electronic equipment), it can well avoid the target heat source component from causing local high temperature in the housing 100 when it is working, thereby improving the surface temperature of the electronic device when it is used. In other words, the electronic device of the present application can reduce the possibility of local high temperature on the surface during use while being miniaturized, which is conducive to improving the user's experience. At the same time, the direction of the air outlet of the first fan 310 is different from the stacking direction of the first fan 310 and the mainboard 500. In this way, the use of the first fan 310 can make the heat in the internal space of the housing 100 quickly dispersed along the expected path, thereby effectively alleviating the heat accumulation inside the housing 100, which is conducive to more stable and reliable operation of the electronic devices inside the electronic device.

[0055] The arrangement of the air inlet and the air outlet of the first fan has an impact on the heat dissipation effect of the first fan 310. In some embodiments, the orientation of the air outlet opened on the shell of the first fan 310 can be set to meet the perpendicular condition with the stacking direction of the first fan 310 and the main board 500, that is, the second direction meets the perpendicular condition with the first direction. In this way, the first fan 310 blows out the gas in its shell in a manner parallel or approximately parallel to the main board 500. When the airflow passes through the inner wall opposite to the main board 500 of the outer shell 100 and the space between the main board 500 (if any), it will be helpful to avoid the blown airflow from hitting the board surface of the main board 500 or the inner wall opposite to the main board 500 of the outer shell 100 and the main board 500 within a short distance. In other words, the second direction meeting the perpendicular condition with the first direction is conducive to the blown airflow maintaining wind force at a longer distance, thereby enabling the first fan 310 to play a stronger heat dissipation effect.

[0056] In some embodiments, on the basis that the second direction and the first direction meet the perpendicular condition, a first air inlet 312 may be provided on a side of the housing of the first fan 310 facing the mainboard 500. Figure 1~Figure 3As shown, the target heat source component on the mainboard 500 is arranged between the mainboard 500 and the shell of the first fan 310. The shell of the first fan 310 faces the side of the mainboard 500, that is, the side facing the target heat source component. A first air inlet 312 is opened on this side of the shell of the first fan 310, which is conducive to the heat generated by the target heat source component when working to quickly enter the shell of the first fan 310 driven by the airflow, so that the first fan 310 can play a better heat dissipation effect on the target heat source component.

[0057] It should be noted that the target heat source component on the mainboard 500 is Figure 2 The schematic diagram is shown as a component group 510, and it should be understood that although Figure 2 The component group 510 in the figure occupies the entire target area between the first fan 310 and the mainboard 500 in the direction perpendicular to the arrow A, but this is only an example, that is, the present application does not limit the size of the target area occupied by all target heat source components. Figure 3 In the exemplary embodiment, the target heat source component includes a central processing unit 502, a central processing unit power supply module 501 and four memories 503. These heat source components are composed of a component group 510 in Figure 2 Of course, in other embodiments, all target heat source components may be set to only one heat source component. In this case, Figure 2 The component group 510 in FIG. 5 represents a heat source component. That is to say, the present application does not limit the number of all target heat source components represented by the component group 510.

[0058] In some embodiments, on the basis that the second direction and the first direction meet the perpendicular condition, the shell wall of the housing 100 located on the side of the first fan 310 away from the mainboard 500 may be provided with a second air inlet (not shown) at a position corresponding to the first fan 310. Figure 2 As shown, the housing 100 of the electronic device has a first surface 101 and a second surface 102 opposite to each other, the first fan 310 is located inside the housing 100 and between the main board 500 and the second surface 102, and the second surface 102 is the housing wall of the housing 100 located on the side of the first fan 310 away from the main board 500. The position of the second surface 102 corresponding to the first fan 310 means that the first fan 310 is located along the stacking direction of the main board 500 of the first fan 310 (i.e. Figure 2 The second surface 102 is provided with a second air inlet at a position corresponding to the first fan 310. Therefore, when the first fan 310 is working, air outside the electronic device can enter the housing 100 through the second air inlet, and then reach the first fan 310 through a shorter path, thereby achieving higher ventilation efficiency.

[0059] It is easy to understand that in order to make the heat dissipation effect of the first fan 310 better, a first air inlet 312 can be provided on the side of the housing of the first fan 310 facing the mainboard 500, and a second air inlet can be provided on the housing wall of the housing 100 located on the side of the first fan 310 away from the mainboard 500 at a position corresponding to the first fan 310, that is, the heat dissipation architecture of the electronic device can include the first air inlet 312 and the second air inlet at the same time. Figure 1 and Figure 2 As shown, a third air inlet 311 may be provided on the side of the shell of the first fan 310 facing away from the mainboard 500, so that the gas between the shell of the first fan 310 and the second side 102 of the outer shell 100 can enter the shell of the first fan 310 more quickly, making it less likely for heat to accumulate near the second side 102 of the outer shell 100.

[0060] See also Figure 2 In the case where the electronic device has a display screen, the display screen can be arranged on the first surface 101 of the housing 100, that is, the display screen and the first fan 310 are located on both sides of the mainboard 500. When the first fan 310 is working, some heat inside the housing 100 will flow to the first fan 310 under the influence of the airflow. Since the first fan 310 is stacked with the mainboard 500 on the side of the mainboard 500 facing away from the display screen, compared with the conventional arrangement of the fan and the mainboard 500 in a direction parallel to the display screen, the first fan 310 is farther away from the display screen, so the airflow carrying the heat to the first fan 310 has less influence on the display screen, thereby better avoiding the local high temperature of the display screen.

[0061] In some embodiments, the electronic device may include a heat spreader 600 located between the target heat source component and the first fan 310, and all or part of the target heat source component is in contact with the heat spreader 600. A heat spreader refers to a part that uses its own thermal conductivity to diffuse the received heat to various parts of itself, thereby playing a role in uniform heat distribution. For example, the heat spreader may be a copper sheet, a vapor chamber, etc. The contact between the target heat source component and the heat spreader 600 means that the surface of the target heat source component is in contact with the surface of the heat spreader 600.

[0062] The heat spreader 600 can quickly spread the heat to a larger area, that is, the heat spreader 600 can conduct heat and has a larger area than the target heat source component. Since the heat on the target heat source component in contact with the heat spreader 600 can be transferred to the heat spreader 600, the heat can leave the target heat source component more quickly. The heat spreader 600 can be in contact with all the target heat source components, or it can be in contact with only one or some of the target heat source components. For example, Figure 3In the exemplary embodiment shown, all target heat source components, namely the central processing unit 502, the central processing unit power supply module 501 and the four memories 503, are in contact with the heat spreader 600. It should be noted that since the height of the central processing unit power supply module 501 relative to the mainboard 500 is greater than the height of the central processing unit 502 relative to the mainboard 500, the heat spreader 600 is provided with a bending portion 601, and the bending portion 601 connects the first part and the second part of the heat spreader 600, wherein the first part is in contact with the central processing unit 502 and the four memories 503 at the same time, and the second part is in contact with the central processing unit power supply module 501. It is easy to understand that when the number of target heat source components in contact with the heat spreader 600 is more than one, in order to give full play to the role of the heat spreader 600, the target heat source components in contact with the heat spreader 600 can be dispersed as much as possible to reduce heat concentration.

[0063] On the basis of the provision of the heat spreader 600, the heat spreader 600 can be in contact with the shell of the first fan 310, so as to continue to conduct the heat from the target heat source component to the shell of the first fan 310. Of course, the heat spreader 600 and the shell of the first fan 310 can also transfer heat through a heat conductive layer, that is, a heat conductive layer formed by a heat conductive material can be provided between the heat spreader 600 and the shell of the first fan 310, and the heat spreader 600 and the shell of the first fan 310 are both in contact with the heat conductive layer, that is, the heat conductive layer is a heat-conducting physical structure sandwiched between the heat spreader 600 and the shell of the first fan 310. The function of the heat conductive layer is to conduct heat from the heat spreader 600 to the shell of the first fan 310, so the heat conductive material is a material that can conduct heat, such as thermal grease, thermal silicone cloth, etc. The heat conductive layer can be of various types, such as thermal paste, thermal pad, etc. As Figure 3 As shown, when the shell of the first fan 310 is provided with a first air inlet 312 and the size of the first air inlet 312 is relatively large, an air layer can be set between the heat equalizing element 600 and the shell of the first fan 310, that is, there is a gap between the heat equalizing element 600 and the shell of the first fan 310, and the two are not in contact, that is, the air layer refers to the space structure between the heat equalizing element 600 and the shell of the first fan 310.

[0064] See also Figure 1~Figure 3In some embodiments, the electronic device may include a heat transfer member 700, through which the heat of the target heat source component is quickly transferred to the air outlet of the first fan 310, thereby improving the heat dissipation effect of the first fan 310 on the target heat source component. For example, on the basis of the provision of the heat spreader 600, the heat absorption part of the heat transfer member 700 is in contact with the heat spreader 600, and the heat dissipation part of the heat transfer member 700 is arranged at the air outlet of the first fan 310, and the heat on the heat spreader 600 is transferred to the air outlet of the first fan 310 through the heat transfer member 700, and is taken away by the wind blown by the first fan 310. In order to improve the heat dissipation efficiency, the heat dissipation part of the heat transfer member 700 can be arranged in the fin assembly 400, and the fin assembly 400 can provide a larger surface area to accelerate the heat dissipation. The fin assembly 400 can be arranged between the heat dissipation port of the housing 100 and the air outlet of the first fan 310, so that the first fan 310 blows air to the fin assembly 400 to directly bring the heat to the outside of the housing 100.

[0065] In the case where more than two heat source components are arranged on the mainboard 500, the target heat source component located between the first fan 310 and the mainboard 500 may be arranged according to the heat generation of the heat source components. In some embodiments, the mainboard 500 may be provided with a first heat source component and a second heat source component located on the side of the mainboard 500 facing the first fan 310, and the heat generation of the first heat source component is less than the heat generation of the second heat source component; wherein the target heat source component includes the first heat source component, and the second heat source component is arranged outside the target area. The second heat source component is arranged outside the target area means that the projection of the second heat source component along the first direction toward the mainboard 500 and the projection of the first fan 310 along the first direction toward the mainboard 500 have no overlapping parts. Different heat source components may have different power parameters, so the heat generation during operation is different. When the target heat source component located between the first fan 310 and the mainboard 500 is arranged, the first heat source component with relatively low heat generation may be arranged between the first fan 310 and the mainboard 500, and the second heat source component with relatively high heat generation is not arranged between the first fan 310 and the mainboard 500. Under the premise that the heat dissipation capacity of the first fan 310 allows, the total heat generation of all target heat source components should not be too high. The first heat source component with relatively low heat generation is set between the first fan 310 and the main board 500. As many heat source components as possible can be arranged in the target area between the first fan 310 and the main board 500, thereby reducing the occupation of the area outside the target area on the main board 500. In this way, the area outside the target area on the main board 500 can be made smaller to meet the needs of miniaturization of electronic equipment or the needs of arranging larger battery modules 200. Figure 4 In order to arrange a larger number of target heat source components, the central processing unit 502 with a relatively high heat generation may be arranged outside the target area.

[0066] On the basis of setting the target heat source component according to the heat generation of the heat source component, the height of the heat source component relative to the mainboard 500 may also be considered, that is, the height of the heat source component higher than the mainboard 500 in the stacking direction of the first fan 310 and the mainboard 500 .

[0067] In some embodiments, the mainboard 500 may be provided with a first heat source component and a second heat source component located on the side of the mainboard 500 facing the first fan 310, the heat generated by the first heat source component is less than the heat generated by the second heat source component, and the height of the first heat source component relative to the mainboard 500 is less than the height of the second heat source component relative to the mainboard 500; wherein the target heat source component includes the first heat source component, and the second heat source component is arranged outside the target area. In this structure, the heat generated by the heat source component and the height relative to the mainboard 500 are considered at the same time, that is, the heat source component with relatively low heat generation and relatively small size protruding from the mainboard 500 is arranged in the target area, which is conducive to arranging as many heat source components as possible to the target area, and minimizing the size occupied by all the target heat source components as a whole in the stacking direction of the first fan 310 and the mainboard 500, so that the first fan 310 can be arranged closer to the mainboard 500, meeting the needs of miniaturization of electronic equipment or arranging larger battery modules 200.

[0068] In order to better meet the demand for miniaturization of electronic equipment, the target heat source component located between the first fan 310 and the mainboard 500 can be set according to the height of the heat source component relative to the mainboard 500. In some embodiments, the mainboard 500 can be provided with a third heat source component and a fourth heat source component located on the side of the mainboard 500 facing the first fan 310, and the height of the third heat source component relative to the mainboard 500 is less than the height of the fourth heat source component relative to the mainboard 500; wherein, the target heat source component includes the third heat source component, and the fourth heat source component is arranged outside the target area. The fourth heat source component is arranged outside the target area, which means that the projection of the fourth heat source component along the first direction toward the mainboard 500 and the projection of the first fan 310 along the first direction toward the mainboard 500 have no overlapping parts. The height of the heat source component relative to the mainboard 500 is the size of the heat source component higher than the mainboard 500 in the stacking direction of the first fan 310 and the mainboard 500, that is, the size of the protrusion of the mainboard 500. By arranging the relatively small heat source components protruding from the main board 500 in the target area, the size occupied by all the target heat source components as a whole in the stacking direction of the first fan 310 and the main board 500 can be minimized, so that the first fan 310 can be set closer to the main board 500 to meet the demand for miniaturization of electronic equipment.

[0069] In some embodiments, the mainboard 500 may be provided with a third heat source component and a fourth heat source component located on the side of the mainboard 500 facing the first fan 310, the height of the third heat source component relative to the mainboard 500 is less than the height of the fourth heat source component relative to the mainboard 500, and the heat generated by the fourth heat source component is less than the heat generated by the third heat source component; wherein the target heat source component includes the third heat source component, and the fourth heat source component is arranged outside the target area. In this structure, the heat generated by the heat source component and the height relative to the mainboard 500 are considered at the same time, and the heat source component with relatively low heat generation but relatively large size protruding from the mainboard 500 is arranged outside the target area, so that the demand for miniaturization of electronic equipment can be met first.

[0070] See also Figure 4~Figure 6 In some embodiments, the electronic device may include a second fan 320 located in the housing 100, the second fan 320 is located outside the coverage area of ​​the mainboard 500, and the second fan 320 is used to dissipate heat from the heat source components on the mainboard 500 located in the target area and / or the heat source components on the mainboard 500 that are arranged outside the target area. In this structure, two fans are arranged inside the electronic device, wherein the second fan 320 is located outside the coverage area of ​​the mainboard 500, and the coverage area of ​​the mainboard 500 refers to the projection area of ​​the mainboard 500 in the direction perpendicular to its plate surface, so the second fan 320 located outside the coverage area of ​​the mainboard 500 is not arranged in a stacked manner with the mainboard 500, so that the second fan 320 can be set as a fan larger than the first fan 310 in the first direction, so that the second fan 320 can be more easily configured as a fan with a large air volume to be responsible for the heat dissipation of most areas inside the electronic device, so as to better meet the heat dissipation requirements of the heat source components on the mainboard 500 located in the target area and / or the heat source components on the mainboard 500 that are arranged outside the target area.

[0071] like Figure 5 As shown, in order to minimize the distance between the first surface 101 and the second surface 102 of the housing 100, that is, to minimize the size of the electronic device in the stacking direction of the first fan 310 and the mainboard 500, the second fan 320 can be arranged in a direction parallel to the board surface of the mainboard 500 with the first fan 310 and the mainboard 500 as a whole. In the direction perpendicular to the board surface of the mainboard 500, that is, in the direction of arrow A in the figure, the size occupied by the second fan 320 is equal to or approximately equal to the size occupied by the first fan 310 and the mainboard 500 as a whole. It should be noted that Figure 5 Omitted Figure 4 Some parts are not shown, but it does not affect the understanding of the technical solution. In addition, the target heat source component on the mainboard 500 is Figure 5 The schematic diagram is shown as a component group 510, that is, in Figure 4In the exemplary embodiment, the target heat source components include a memory 503, a solid state drive 504, a wireless module 505 and a charging module 506. These heat source components are composed of a component group 510 in Figure 5 Chinese representative.

[0072] like Figure 4 As shown, in some embodiments, the target heat source component includes a memory 503, that is, the memory 503 is arranged in the target area between the first fan 310 and the mainboard 500, the central processing unit 502 and the central processing unit power supply module 501 can be arranged between the above-mentioned target area and the second fan 320, the memory 503 is located at a position close to the central processing unit 502 in the target area, and the central processing unit power supply module 501 is located on the side of the central processing unit 502 close to the second fan 320. In this way, the central processing unit power supply module 501 is arranged at a position far away from the memory 503, which is conducive to reducing the influence of the heat generated by the central processing unit power supply module 501 on the operation of the memory 503.

[0073] See also Figure 4 In the case where two fans, namely the first fan 310 and the second fan 320, are provided, the heat dissipation airflow path inside the housing 100 can be set in more ways. In some embodiments, the air outlet direction of the first fan 310 may include a first target direction blowing toward the heat source component on the mainboard 500 between the target area and the second fan 320, that is, the housing of the first fan 310 is provided with at least one air outlet arranged toward the heat source component on the mainboard 500 between the target area and the second fan 320. By setting the air outlet direction of the first fan 310 to include the above-mentioned first target direction, the heat dissipation effect of the first fan 310 on the heat source component on the mainboard 500 between the target area and the second fan 320 can be improved. Similarly, in some embodiments, the air outlet direction of the second fan 320 may include a second target direction blowing toward the heat source component on the mainboard 500 between the target area and the second fan 320. In some embodiments, the airflow path blowing toward the second target direction may also pass through the heat spreader and / or the heat transfer member, so as to achieve heat dissipation of the device that absorbs the heat of the heat source component.

[0074] It should be noted that the two configurations that the air outlet direction of the first fan 310 includes the first target direction and the air outlet direction of the second fan 320 includes the second target direction may exist at the same time, or only one of them may exist. In the case where the two configurations exist at the same time, the first target direction of the air outlet of the first fan 310 and the second target direction of the air outlet of the second fan 320 may be staggered to avoid mutual influence on the heat dissipation effect of the heat source component located between the target area and the second fan 320 on the mainboard 500.

[0075] In order to achieve the purpose of blowing the heat inside the housing 100 outwards through the fan, either or both of the first fan 310 and the second fan 320 may be selected to set the air outlet direction to include a target direction blowing toward the heat dissipation port on the housing 100. In some embodiments, the housing 100 has a first surface 101 and a second surface 102 opposite to each other, and a third surface 103 connecting the first surface 101 and the second surface 102, and the third surface 103 is provided with a first heat dissipation port and a second heat dissipation port corresponding to the positions of the first fan 310 and the second fan 320, respectively; the air outlet direction of the first fan 310 includes a third target direction blowing toward the first heat dissipation port, and / or the air outlet direction of the second fan 320 includes a fourth target direction blowing toward the second heat dissipation port. In this structure, the first heat dissipation port and the second heat dissipation port on the housing 100 are arranged on the same surface of the housing 100, which is conducive to concentrating the air outlet on the same surface of the housing 100 to reduce the impact of the air outlet on the temperature of most other surfaces of the housing 100. For example, when the electronic device is a handheld device, the method of concentrating the air outlet on the same surface of the housing 100 can make it easier to configure the housing 100 on two opposite surfaces for holding with both hands.

[0076] exist Figure 4 In the exemplary embodiment, as shown by the solid arrow in the figure, the air outlet direction of the first fan 310 is configured with both the first target direction and the third target direction, and the air outlet direction of the second fan 320 is only configured with the fourth target direction. The air outlet in the first target air outlet direction of the first fan 310 blows toward the central processor 502, the air outlet in the third target direction of the first fan 310 blows toward the first heat dissipation port on the third surface 103 of the housing 100, and the air outlet of the second fan 320 blows toward the second heat dissipation port on the third surface 103 of the housing 100. When the electronic device is a handheld device, the third surface 103 of the housing 100 can be set as the top surface of the electronic device. When the user uses the electronic device, the top of the electronic device is generally inclined away from the user, and the hand generally holds the bottom or side of the electronic device. The heat inside the electronic device is blown out from the top, which can reduce the impact of the air outlet on the user.

[0077] On the basis that the heat dissipation port on the housing 100 is arranged on the third surface 103, the electronic device may include: a battery module 200, which is located in the housing 100 and is arranged close to the fourth surface 104 of the housing 100, the fourth surface 104 connects the first surface 101 and the second surface 102 and is opposite to the third surface 103, and the first fan 310 and the second fan 320 are located on the same side of the battery module 200 in the direction from the fourth surface 104 to the third surface 103. The fourth surface 104 is opposite to the third surface 103, which means that the fourth surface 104 and the third surface 103 are located at opposite ends of the housing 100, for example, the third surface 103 is the top surface of the housing 100, and the fourth surface 104 is the bottom surface of the housing 100. With such arrangement, the battery module 200 does not occupy the third surface 103 of the outer shell 100, thereby avoiding the influence of the arrangement of the battery module 200 on the opening of the heat dissipation port. On the other hand, the weight of the battery module 200 is relatively large. When the electronic device is a handheld device, the third surface 103 of the outer shell 100 can be set as the top surface of the electronic device, and the fourth surface 104 of the outer shell 100 can be set as the bottom surface of the electronic device. In this way, the overall center of gravity of the electronic device is lowered, which is convenient for the user to hold and use more stably.

[0078] See also Figure 1 In the case where the electronic device is only provided with the first fan 310, the third surface 103 of the housing 100 only needs to be provided with the first heat dissipation port corresponding to the position of the first fan 310, and the battery module 200 can occupy a part of the third surface 103 of the housing 100, and be installed between the third surface 103 and the fourth surface 104, that is, the two ends of the battery module 200 are respectively close to the third surface 103 and the fourth surface 104. In this way, the battery module 200 can be arranged in a larger volume while reducing the occupation of the fourth surface 104 by the battery module 200, so as to facilitate the arrangement of some interfaces connected to the mainboard 500 on the fourth surface 104, so that the interfaces are arranged as far away from the air outlet surface of the housing 100 as possible.

[0079] See also Figure 4 and Figure 5In some embodiments, the electronic device may include: a first heat transfer member 710, a heat absorption portion of the first heat transfer member 710 connected to at least one heat source component disposed outside the target area on the mainboard 500, and a heat dissipation portion of the first heat transfer member 710 located between the air outlet of the first fan 310 and the first heat dissipation port; wherein the first heat dissipation port is provided in the housing 100 and is opposite to the air outlet of the first fan 310. It should be noted that the heat transfer member refers to a component that absorbs heat from a heat source through its own heat absorption portion, and then transfers the heat to its own heat dissipation portion by using its own thermal conductivity, and then the heat dissipation portion dissipates the heat to the outside, for example, the heat transfer member may be a heat pipe, a copper sheet, etc. The first heat dissipation port is opposite to the air outlet of the first fan 310, which means that the air outlet faces the first heat dissipation port, that is, the direction from the air outlet to the first heat dissipation port is the air outlet direction of the first fan 310 at the air outlet. By providing the first heat transfer member 710, the heat dissipation effect of the first fan 310 on the heat source components on the mainboard 500 outside the target area can be improved. For example, the heat absorption part of the first heat transfer member 710 is connected to the central processor 502 on the mainboard 500, and the heat of the central processor 502 is quickly transferred to the air outlet of the first fan 310 through the first heat transfer member 710 and is taken away by the air outlet of the first fan 310. In order to improve the heat dissipation efficiency, the heat dissipation part of the first heat transfer member 710 can be provided in the first fin assembly 410, and the first fin assembly 410 can provide a larger surface area to accelerate the heat dissipation.

[0080] See also Figure 5 In some embodiments, the side of the first fan 310 housing facing the target area can be provided with a third heat transfer member 313 capable of conducting heat, that is, the third heat transfer member 313 constitutes a part of the housing of the first fan 310, so that after the heat of the component group 510 is dissipated to the housing of the first fan 310, it can be conducted to a larger area along the third heat transfer member 313, thereby accelerating the diffusion speed of the heat in the target area. On this basis, the third heat transfer member 313 can be connected to the heat absorption part of the first heat transfer member 710, such as Figure 6 As shown, the electronic device may include a second heat transfer member 800, which is connected to the heat absorption part of the first heat transfer member 710 and the third heat transfer member 313, and transfers heat from the housing of the first fan 310 to the heat absorption part of the first heat transfer member 710, so that the heat dissipation effect of the first fan 310 on the target area can be improved. In order to improve the heat dissipation effect of the third heat transfer member 313 on the target area, the third heat transfer member 313 can be set as a temperature plate.

[0081] like Figure 4 and Figure 6As shown, in the case where the second fan 320 is provided, the electronic device may include: a fourth heat transfer member 720, the heat absorption portion of the fourth heat transfer member 720 is connected to at least one heat source component disposed outside the target area on the mainboard 500, and the heat dissipation portion of the fourth heat transfer member 720 is located between the air outlet of the second fan 320 and the second heat dissipation port; wherein the second heat dissipation port is provided in the housing 100 and is opposite to the air outlet of the second fan 320. By providing the fourth heat transfer member 720, the heat dissipation effect of the second fan 320 on the heat source component disposed outside the target area on the mainboard 500 can be improved. For example, the heat absorption portion of the fourth heat transfer member 720 is connected to the central processing unit 502 on the mainboard 500, and the heat of the central processing unit 502 is quickly transferred to the air outlet of the second fan 320 through the fourth heat transfer member 720, and is taken away by the air outlet of the second fan 320. In order to improve the heat dissipation efficiency, the heat dissipation portion of the fourth heat transfer member 720 can be provided in the second fin assembly 420, and the second fin assembly 420 can provide a larger surface area to accelerate the heat dissipation.

[0082] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0083] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present application. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. An electronic device, comprising: shell; A main board, located inside the housing, is provided with a target heat source component; A first fan is stacked with the mainboard along a first direction; A target area is formed between the first fan and the mainboard, the target heat source component is arranged in the target area, and the housing of the first fan is provided with an air outlet arranged in a second direction, and the second direction is different from the first direction.

2. The electronic device according to claim 1, wherein the second direction and the first direction meet a perpendicular condition; A first air inlet is formed on a side of the housing of the first fan facing the mainboard, and / or a second air inlet is formed on a housing wall of the outer shell located on a side of the first fan away from the mainboard at a position corresponding to the first fan.

3. The electronic device according to claim 1 or 2, comprising a heat spreader located between the target heat source component and the first fan, wherein all or part of the target heat source component is in contact with the heat spreader; An air layer is provided between the heat spreader and the housing of the first fan, or a heat conductive layer formed of a heat conductive material is provided between the heat spreader and the housing of the first fan, and both the heat spreader and the housing of the first fan are in contact with the heat conductive layer.

4. The electronic device according to claim 1, wherein the mainboard is provided with a first heat source component and a second heat source component located on a side of the mainboard facing the first fan, and a heat generation amount of the first heat source component is less than a heat generation amount of the second heat source component; in, The target heat source component includes the first heat source component, and the second heat source component is disposed outside the target area. 5 . The electronic device according to claim 4 , wherein a height of the first heat source component relative to the main board is smaller than a height of the second heat source component relative to the main board.

6. The electronic device according to claim 1, wherein the mainboard is provided with a third heat source component and a fourth heat source component located on a side of the mainboard facing the first fan, and a height of the third heat source component relative to the mainboard is smaller than a height of the fourth heat source component relative to the mainboard; in, The target heat source component includes the third heat source component, and the fourth heat source component is disposed outside the target area. 7 . The electronic device according to claim 6 , wherein a heat generation amount of the fourth heat source component is smaller than a heat generation amount of the third heat source component.

8. The electronic device according to any one of claims 4 to 7 comprises a second fan located in the housing, the second fan being located outside the coverage area of ​​the mainboard, and the second fan being used to dissipate heat from heat source components on the mainboard located in the target area and / or heat source components on the mainboard arranged outside the target area.

9. The electronic device according to claim 8, comprising: a first heat transfer member, wherein a heat absorbing portion of the first heat transfer member is connected to at least one heat source component disposed on the mainboard outside the target area, and a heat dissipating portion of the first heat transfer member is located between an air outlet of the first fan and a first heat dissipating port; a second heat transfer member, connecting the heat absorbing portion of the first heat transfer member and the housing of the first fan, and used for transferring heat from the housing to the heat absorbing portion; Wherein, the first heat dissipation port is opened in the shell and is opposite to the air outlet of the first fan, the side of the shell of the first fan facing the target area is set as a third heat transfer element capable of conducting heat, and the second heat transfer element is connected to the third heat transfer element.

10. The electronic device according to claim 8, wherein the air outlet direction of the first fan includes a first target direction of blowing toward a heat source component on the mainboard located between the target area and the second fan, and / or the air outlet direction of the second fan includes a second target direction of blowing toward a heat source component on the mainboard located between the target area and the second fan.

11. The electronic device according to claim 8, wherein the housing comprises a first surface and a second surface opposite to each other, and a third surface connecting the first surface and the second surface, wherein the third surface is provided with a first heat dissipation port and a second heat dissipation port corresponding to the positions of the first fan and the second fan respectively; The air outlet direction of the first fan includes a third target direction blowing toward the first heat dissipation port, and / or the air outlet direction of the second fan includes a fourth target direction blowing toward the second heat dissipation port.

12. The electronic device according to claim 11, comprising: The battery module is located in the outer shell and is arranged close to the fourth surface of the outer shell. The fourth surface connects the first surface and the second surface and is opposite to the third surface. The first fan and the second fan are located on the same side of the battery module in the direction from the fourth surface to the third surface.

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