Electronic component test pin positioning method and device, equipment and storage medium

Abstract

The invention discloses an electronic component test pin positioning method and device, equipment and a storage medium. The method comprises the steps of obtaining point cloud information of a Mark point of a to-be-tested mainboard; based on the point cloud information of the Mark point and the Mark point mainboard schematic diagram coordinate, determining a corresponding relation between the world coordinate system coordinate of the to-be-tested mainboard electronic component and the mainboard schematic diagram coordinate; determining main board schematic diagram coordinates of the electronic component of the to-be-tested pin; acquiring position information of the electronic component with the to-be-tested pin, correcting the position information, and determining the offset of the electronic component with the to-be-tested pin; and determining the position of the test pin according to the mainboard schematic diagram coordinate of the electronic component of the to-be-tested pin, the corresponding relationship between the world coordinate system coordinate of the electronic component of the to-be-tested mainboard and the mainboard schematic diagram coordinate, the offset of the electronic component of the to-be-tested pin and the position relationship between the to-be-tested pin and the electronic component. According to the invention, the problem of spot measurement failure caused by too small pins and light reflection is effectively solved.

Description

Technical Field

[0001] The embodiments of the present application relate to motherboard point testing technology, and more particularly to a method and device for positioning test pins of electronic components, an electronic device, and a storage medium. Background Art

[0002] When a robot arm is used to replace manual point measurement of signals on a PC (Personal Computer) motherboard, a 3D camera is required to take a picture of the motherboard. Figure 1 A photo of the motherboard taken for an existing 3D camera, such as Figure 1 As shown in the figure, when encountering an integrated circuit (IC) with multiple pins, due to the reflection of the PIN pins or the PIN pins are too small, the point cloud data obtained by the 3D camera will be noisy, such as Figure 1 The PIN pin at position 101 is too small and has reflections, and the PIN pin at position 102 is too small. This makes it difficult to directly segment the 3D point cloud data and calculate the accurate coordinates of the PIN pins to be measured, making it difficult to directly and accurately measure the target PIN pins. Summary of the invention

[0003] In view of this, the embodiments of the present application provide a method and device for positioning test pins of an electronic component, a device, and a storage medium, which can at least solve the aforementioned technical problems.

[0004] According to a first aspect of an embodiment of the present application, a method for locating a test pin of an electronic component is provided, the method comprising:

[0005] Get the point cloud information of the Mark points of the motherboard to be tested;

[0006] Based on the point cloud information of the Mark point and the coordinates of the motherboard schematic diagram of the Mark point, determine the correspondence between the world coordinate system coordinates of the electronic components of the motherboard to be tested and the coordinates of the motherboard schematic diagram;

[0007] Determine the motherboard schematic coordinates of the electronic component of the pin to be tested;

[0008] Acquire the position information of the electronic component of the pin to be tested, and correct the position information to determine the offset of the electronic component of the pin to be tested;

[0009] The position of the test pin is determined based on the motherboard schematic coordinates of the electronic component of the pin to be tested, the correspondence between the world coordinate system coordinates of the motherboard electronic component to be tested and the motherboard schematic coordinates, the offset of the electronic component of the pin to be tested, and the positional relationship between the pin to be tested and the corresponding electronic component of the pin to be tested.

[0010] In some exemplary embodiments, obtaining point cloud information of Mark points of the motherboard to be tested includes:

[0011] Move the teaching robot arm to the Mark point area of ​​the motherboard to be tested, obtain the point cloud information of multiple Mark points of the motherboard to be tested through the 3D camera of the teaching robot arm, and mark them.

[0012] In some exemplary embodiments, determining the correspondence between the world coordinate system coordinates of the electronic components of the motherboard to be tested and the motherboard schematic coordinates based on the point cloud information of the Mark point and the motherboard schematic coordinates of the Mark point includes:

[0013] According to the mark, the Mark point is identified as a circle with a radius of a first length, and the point cloud coordinates of the center of the circle are determined;

[0014] Based on the point cloud coordinates of the center of the Mark point and the mainboard schematic diagram coordinates of the Mark point, a transfer matrix between the world coordinate system coordinates of the electronic component of the mainboard to be tested and the mainboard schematic diagram coordinates is established.

[0015] In some exemplary embodiments, the mainboard schematic diagram coordinates of the electronic component of the pin to be tested are the center point coordinates of the electronic component of the pin to be tested in the mainboard schematic diagram;

[0016] The positional relationship between the pin to be tested and the electronic component corresponding to the pin to be tested is the azimuth offset of the pin to be tested relative to the coordinates of the center point of the electronic component.

[0017] In some exemplary embodiments, determining the mainboard schematic coordinates of the electronic component of the pin to be tested includes:

[0018] Acquire multiple pin coordinates of the electronic component of the pin to be tested in the mainboard schematic diagram; determine the center point coordinates of the electronic component of the pin to be tested through the multiple pin coordinates.

[0019] In some exemplary embodiments, the determining the position of the test pin according to the mainboard schematic coordinates of the electronic component of the pin to be tested, the correspondence between the world coordinate system coordinates of the mainboard electronic component to be tested and the mainboard schematic coordinates, the offset of the electronic component of the pin to be tested, and the positional relationship between the pin to be tested and the corresponding electronic component of the pin to be tested comprises:

[0020] Determine the world coordinates of the center point of the electronic component of the pin to be tested according to the center point coordinates of the electronic component of the pin to be tested in the mainboard schematic diagram and the transfer matrix between the world coordinate system coordinates of the electronic component of the mainboard to be tested and the coordinates of the mainboard schematic diagram;

[0021] Correcting the world coordinates of the center point of the electronic component of the pin to be tested according to the overall offset of the electronic component of the pin to be tested;

[0022] The position of the test pin is determined according to the corrected world coordinates of the center point of the electronic component of the pin to be tested and the azimuth offset of the pin to be tested relative to the coordinates of the center point of the electronic component.

[0023] In some exemplary embodiments, the method further includes: sending the position of the test pin to a robotic arm, and performing point testing on the test pin through the robotic arm.

[0024] According to a second aspect of an embodiment of the present application, a device for positioning a test pin of an electronic component is provided, the device comprising:

[0025] The information acquisition module is used to obtain the point cloud information of the Mark points of the motherboard to be tested;

[0026] A mapping module is used to determine the correspondence between the world coordinate system coordinates of the electronic components of the motherboard to be tested and the coordinates of the motherboard schematic diagram based on the point cloud information of the Mark point and the coordinates of the motherboard schematic diagram of the Mark point;

[0027] A first determination module is used to determine the mainboard schematic coordinates of the electronic component of the pin to be tested;

[0028] A correction module, used to obtain the position information of the electronic component of the pin to be tested, and correct the position information to determine the overall offset of the electronic component of the pin to be tested;

[0029] The second determination module is used to determine the position of the test pin based on the motherboard schematic coordinates of the electronic component of the pin to be tested, the correspondence between the world coordinate system coordinates of the electronic component of the motherboard to be tested and the motherboard schematic coordinates, the offset of the electronic component of the pin to be tested, and the positional relationship between the pin to be tested and the corresponding electronic component of the pin to be tested.

[0030] According to a third aspect of an embodiment of the present application, there is provided an electronic device comprising a processor and a memory for storing processor executable instructions, wherein the processor is configured to execute the steps of the method according to any one of claims 1 to 7 when calling the executable instructions in the memory.

[0031] According to a fourth aspect of an embodiment of the present application, a computer-readable storage medium is provided, characterized in that a computer program is stored in the computer-readable storage medium, and when the computer program is executed by a processor, the steps of the method described in any one of claims 1 to 7 are implemented.

[0032] In the embodiment of the present application, a transfer matrix between the world coordinate system coordinates of the electronic component of the mainboard to be tested and the mainboard schematic coordinates is established based on the Mark point; the world coordinates of the center point of the electronic component of the pin to be tested are determined according to the mainboard schematic coordinates of the electronic component of the pin to be tested and the transfer matrix, and the world coordinates are corrected to determine the world coordinates of the center point of the corrected electronic component; finally, the position of the test pin is determined according to the azimuth offset of the pin to be tested relative to the center point coordinates of the electronic component. The electronic component test pin positioning method and device, electronic device, and storage medium described in the present application effectively solve the problem of point measurement failure caused by the 3D point cloud being unable to effectively identify the test pin due to the pin being too small and the reflection. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following is a brief introduction to the drawings required for use in the embodiments or the prior art descriptions. Obviously, the drawings described below are some embodiments of the present invention, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0034] Figure 1 A schematic diagram of a motherboard photograph taken by an existing 3D camera is shown;

[0035] Figure 2 A schematic diagram of the process of positioning the test pins of an electronic component according to an embodiment of the present application is shown;

[0036] Figure 3 A schematic diagram showing the Mark point shooting and recognition results of an embodiment of the present application is shown;

[0037] Figure 4 A schematic diagram showing the positional deviation of electronic components in an embodiment of the present application is shown;

[0038] Figure 5 A schematic diagram of the structure of a device for positioning a test pin of an electronic component according to an embodiment of the present application is shown;

[0039] Figure 6 A schematic diagram of the structure of an electronic device according to an embodiment of the present application is shown. DETAILED DESCRIPTION

[0040] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present disclosure. Instead, they are merely examples of devices and methods consistent with some aspects of the present disclosure as detailed in the appended claims.

[0041] The essence of the technical solution of the embodiment of the present application is explained in detail below with reference to the accompanying drawings.

[0042] Figure 2 The schematic diagram of the process flow of the electronic component test pin positioning method according to the embodiment of the present application is shown as follows: Figure 2 As shown, the method of the embodiment of the present application includes the following steps:

[0043] Step 201: Obtaining point cloud information of the Mark points of the motherboard to be tested;

[0044] In one embodiment of the present application, obtaining the point cloud information of the Mark points of the motherboard to be tested includes: moving the teaching robot arm to the Mark point area of ​​the motherboard to be tested, obtaining the point cloud information of multiple Mark points of the motherboard to be tested through the 3D camera of the teaching robot arm, and marking them.

[0045] Figure 3 Schematic diagram of the Mark point shooting and recognition results of the embodiment of the present application, as shown in Figure 3 As shown, the teaching robot arm is moved manually or automatically to the three mark point areas of the mainboard, and the three mark points are photographed and marked as RIO.

[0046] Step 202: Based on the point cloud information of the Mark point and the coordinates of the motherboard schematic diagram of the Mark point, determine the correspondence between the world coordinate system coordinates of the electronic component of the motherboard to be tested and the coordinates of the motherboard schematic diagram;

[0047] In one embodiment of the present application, the point cloud information of the Mark point and the motherboard schematic coordinates of the Mark point are used to determine the correspondence between the world coordinate system coordinates of the electronic component of the motherboard to be tested and the motherboard schematic coordinates, including: according to the mark, identifying the Mark point as a circle with a radius of a first length, and determining the point cloud coordinates of the center of the circle; based on the point cloud coordinates of the center of the Mark point and the motherboard schematic coordinates of the Mark point, establishing a transfer matrix between the world coordinate system coordinates of the electronic component of the motherboard to be tested and the motherboard schematic coordinates.

[0048] like Figure 3 As shown, in the embodiment of the present application, a circle with a radius of 0.5 mm is identified according to the marked RIO. The center point cloud coordinates of the three Mark points under the 3D camera are calculated as follows: the first Mark point (c1, d1), the second Mark point (c2, d2), and the third Mark point (c3, d3); the coordinates of the three Mark points in the mainboard schematic are obtained, corresponding to: the first Mark point (e1, f1), the second Mark point (e2, f2), and the third Mark point (e2, f3); based on the first Mark point, the transfer matrix calculation process is as follows:

[0049]

[0050] in The coordinates of the mainboard schematic diagram; P w is the world coordinate system coordinate, Transfer matrix from the end of the robot to the base coordinate system, is the hand-eye matrix, is the camera coordinate system, and the robot base coordinate system is the world coordinate system.

[0051] make but:

[0052]

[0053] make We get:

[0054]

[0055] Construct a linear equation of Ax = b, where

[0056] Substitute the center point cloud coordinates (c2, d2) and (c3, d3) of the second and third Mark points and the mainboard schematic coordinates (e2, f2) and (e3, f3) into the above linear equation respectively, and calculate the transfer matrix parameters a1, a2, a3, a4, t1, t2.

[0057] Step 203: Determine the mainboard schematic coordinates of the electronic component of the pin to be tested;

[0058] The mainboard schematic diagram coordinates of the electronic component of the pin to be tested are the center point coordinates of the electronic component of the pin to be tested in the mainboard schematic diagram;

[0059] Determining the mainboard schematic diagram coordinates of the electronic component of the pin to be tested includes: acquiring multiple pin coordinates of the electronic component of the pin to be tested in the mainboard schematic diagram; and determining the center point coordinates of the electronic component of the pin to be tested through the multiple pin coordinates.

[0060] In the embodiment of the present application, multiple pin coordinates (x1, y1) (x2, y2) ... (xn, yn) of the electronic component of the pin to be tested are obtained from the netlist of the mainboard schematic diagram, and the center point coordinates of the electronic component of the pin to be tested are determined by the multiple pin coordinates: At the same time, calculate the azimuth offset x′ of the point measurement pin coordinates (xi, yi) relative to the center point coordinates (x, y) of the electronic component i =xi-x,y′ i=yi-y.

[0061] Step 204: Obtaining position information of the electronic component of the pin to be tested;

[0062] In the embodiment of the present application, obtaining the position information of the electronic component of the pin to be tested includes: by means of the mechanical arm control module, moving the teaching mechanical arm to the position to be photographed of the mainboard, adjusting the posture of the mechanical arm, controlling the 3D camera to photograph the electronic component of the pin to be tested, and obtaining the 3D point cloud data of the center point of the electronic component of the pin to be tested. The center point of the electronic component of the pin to be tested obtained is the position information of the electronic component of the pin to be tested.

[0063] Step 205: Correcting the position information of the electronic component of the pin to be tested to determine the offset of the electronic component of the pin to be tested;

[0064] Due to the surface mounting technology (SMT) and reflow soldering, as well as the accuracy of the transfer matrix, there is generally a position error between the actual position and theoretical position of the center point of the electronic component in the world coordinate system. Figure 4 Schematic diagram of the positional displacement of electronic components in an embodiment of the present application. Figure 4 As shown, in the embodiment of the present application, based on the precise positioning of the electronic component at the identification point, the center of the electronic component is calculated, and further the offset c′ of the actual center point of the electronic component relative to the center point of the electronic component in the 3D point cloud data can be calculated. i ,d′ i .

[0065] Step 206: Determine the position of the test pin based on the motherboard schematic coordinates of the electronic component of the pin to be tested, the correspondence between the world coordinate system coordinates of the motherboard electronic component to be tested and the motherboard schematic coordinates, the offset of the electronic component of the pin to be tested, and the positional relationship between the pin to be tested and the corresponding electronic component of the pin to be tested.

[0066] In the embodiment of the present application, the positional relationship between the pin to be tested and the electronic component corresponding to the pin to be tested is the azimuth offset x′ of the pin to be tested relative to the center point coordinate of the electronic component determined in step 203. i , y′ i ;

[0067] As an implementation method, the determining the position of the test pin according to the mainboard schematic coordinates of the electronic component of the pin to be tested, the correspondence between the world coordinate system coordinates of the mainboard electronic component to be tested and the mainboard schematic coordinates, the offset of the electronic component of the pin to be tested, and the positional relationship between the pin to be tested and the corresponding electronic component of the pin to be tested includes:

[0068] Determine the world coordinates (P1, P2) of the center point of the electronic component of the pin to be tested according to the center point coordinates (x, y) of the electronic component of the pin to be tested in the mainboard schematic diagram and the transfer matrix Ax=b between the world coordinate system coordinates of the electronic component of the mainboard to be tested and the coordinates of the mainboard schematic diagram;

[0069] P1=x×a1+y×a2+t1

[0070] P2=x×a3+y×a4+t2

[0071] The world coordinates of the center point of the electronic component of the pin to be tested are corrected by the overall offset of the electronic component of the pin to be tested, and the world coordinates of the center point of the electronic component after correction are obtained: (P1′, P2′):

[0072] P1′=P1+c′ i

[0073] P2′=P2+d′ i

[0074] According to the corrected world coordinates of the center point of the electronic component of the pin to be tested and the azimuth offset of the pin to be tested relative to the center point coordinates of the electronic component, the position (P1″, P2″) of the test pin is determined:

[0075] P1″=P1′+x′ i

[0076] P2″=P2′+y′ i

[0077] The actual positions of the test pins (P1″, P2″) are:

[0078] P1″=x×a1+y×a2+t1+x′ i +c′ i

[0079] P2″=x×a3+y×a4+t2+y′ i +d′ i

[0080] Step 207: Send the position of the test pin to the robotic arm, calibrate the point measurement position, and perform point measurement on the test pin through the robotic arm.

[0081] The embodiment of the present application uses the collaboration of multiple robotic arms to drive the oscilloscope probe and the 3D camera to perform signal point measurement on the mainboard signal.

[0082] The electronic component test pin positioning method of the embodiment of the present application is to unify the world coordinate system through calibration between the mechanical arms, complete the hand-eye calibration through the 3D camera, move the teaching 3D camera mechanical arm to the 3 Mark point positions to shoot the point cloud image and depth map, and set the recognition radius of the circle to be 0.5mm to calculate the transfer matrix of the world coordinate system of the mechanical arm and the motherboard to be tested. Identify the point-measured electronic components, obtain the physical center coordinates and all pin coordinates of the target electronic components, and calculate the relative center coordinate orientation of the test pin. Combined with the offset of the patch, calculate the actual point measurement position relative to the center pin, and correct the patch error caused by reflow soldering. Finally, plan the path to control the mechanical arm to point measure to the signal position. The electronic component test pin positioning method of the embodiment of the present application can effectively reduce the position deviation caused by the misjudgment of pin segmentation due to the interference of 3D point cloud noise, and effectively solve the problem of point measurement failure caused by the 3D point cloud being unable to effectively identify the test pin due to the pin being too small and the reflection.

[0083] Based on the same inventive concept, according to the electronic component test pin positioning method provided in the above embodiment of the present application, correspondingly, another embodiment of the present disclosure also provides an electronic component test pin positioning device. Figure 5 Schematic diagram of the structure of the electronic component test pin positioning device according to the embodiment of the present application. Figure 5 As shown, the electronic component test pin positioning device of the embodiment of the present application includes: an information acquisition module 51, a mapping module 52, a first determination module 53, a correction module 54, a second determination module 55, and a point measurement module 56, wherein:

[0084] The information acquisition module 51 is used to obtain the point cloud information of the Mark points of the motherboard to be tested;

[0085] In one embodiment of the present application, the information acquisition module is used to: move the teaching robot arm to the Mark point area of ​​the motherboard to be tested, obtain the point cloud information of multiple Mark points of the motherboard to be tested through the 3D camera of the teaching robot arm, and mark them.

[0086] A mapping module 52, for determining the correspondence between the world coordinate system coordinates of the electronic components of the motherboard to be tested and the coordinates of the motherboard schematic diagram based on the point cloud information of the Mark point and the coordinates of the motherboard schematic diagram of the Mark point;

[0087] In one embodiment of the present application, the mapping module 52 is used to: identify the Mark point as a circle with a radius of a first length according to the mark, and determine the point cloud coordinates of the center of the circle; based on the point cloud coordinates of the center of the circle of the Mark point and the motherboard schematic coordinates of the Mark point, establish a transfer matrix between the world coordinate system coordinates of the electronic components of the motherboard to be tested and the motherboard schematic coordinates.

[0088] A first determination module 53 is used to determine the mainboard schematic coordinates of the electronic component of the pin to be tested;

[0089] The mainboard schematic diagram coordinates of the electronic component of the pin to be tested are the center point coordinates of the electronic component of the pin to be tested in the mainboard schematic diagram; the first determination module 53 is used to: obtain multiple pin coordinates of the electronic component of the pin to be tested in the mainboard schematic diagram; determine the center point coordinates of the electronic component of the pin to be tested through the multiple pin coordinates. At the same time, calculate the azimuth offset of the point measurement pin coordinates relative to the center point coordinates of the electronic component.

[0090] A correction module 54, used to obtain the position information of the electronic component of the pin to be tested, and correct the position information to determine the overall offset of the electronic component of the pin to be tested;

[0091] In the embodiment of the present application, the correction module 54 is used to: move the teaching robot arm to the position to be photographed of the mainboard through the robot arm control module, adjust the robot arm posture, control the 3D camera to photograph the electronic components of the pins to be tested, and obtain the 3D point cloud data of the center point of the electronic components of the pins to be tested. The center point of the electronic components of the pins to be tested obtained is the position information of the electronic components of the pins to be tested.

[0092] Due to SMT and reflow soldering, as well as the accuracy of the transfer matrix, there is generally a position error between the actual position and theoretical position of the center point of the electronic component in the world coordinate system. In the embodiment of the present application, the correction module 54 calculates the center of the electronic component based on the precise positioning of the electronic component at the identification point, and further calculates the offset c′ of the actual center point of the electronic component relative to the center point of the electronic component in the 3D point cloud data. i ,d′ i .

[0093] The second determination module 55 is used to determine the position of the test pin based on the motherboard schematic coordinates of the electronic component of the pin to be tested, the correspondence between the world coordinate system coordinates of the motherboard electronic component to be tested and the motherboard schematic coordinates, the offset of the electronic component of the pin to be tested, and the positional relationship between the pin to be tested and the corresponding electronic component of the pin to be tested.

[0094] In the embodiment of the present application, the positional relationship between the pin to be tested and the electronic component corresponding to the pin to be tested is the azimuth offset x′ of the pin to be tested relative to the center point coordinate of the electronic component determined by the first determination module 53. i , y′ i ;

[0095] As an implementation manner, the second determining module 55 is used to:

[0096] Determine the world coordinates of the center point of the electronic component of the pin to be tested according to the center point coordinates (x, y) of the electronic component of the pin to be tested in the mainboard schematic diagram and the transfer matrix Ax=b between the world coordinate system coordinates of the electronic component of the mainboard to be tested and the coordinates of the mainboard schematic diagram;

[0097] The world coordinates of the center point of the electronic component of the pin to be tested are corrected according to the overall offset of the electronic component of the pin to be tested, so as to obtain the corrected world coordinates of the center point of the electronic component.

[0098] The position of the test pin is determined according to the corrected world coordinates of the center point of the electronic component of the pin to be tested and the azimuth offset of the pin to be tested relative to the coordinates of the center point of the electronic component.

[0099] The spot measurement module 56 is used to send the position of the test pin to the mechanical arm, calibrate the spot measurement position, and perform spot measurement on the test pin through the mechanical arm.

[0100] The embodiment of the present application uses the collaboration of multiple robotic arms to drive the oscilloscope probe and the 3D camera to perform signal point measurement on the mainboard signal.

[0101] In an exemplary embodiment, the information acquisition module 51, the mapping module 52, the first determination module 53, the correction module 54, the second determination module 55, the point measurement module 56, etc. can be implemented by one or more central processing units (CPU, Central Processing Unit), graphics processing units (GPU, Graphics Processing Unit), application specific integrated circuits (ASIC, Application Specific Integrated Circuit), DSP, programmable logic devices (PLD, Programmable Logic Device), complex programmable logic devices (CPLD, Complex Programmable Logic Device), field programmable gate arrays (FPGA, Field-Programmable Gate Array), general-purpose processors, controllers, microcontrollers (MCU, Micro Controller Unit), microprocessors (Microprocessors), or other electronic components.

[0102] In the embodiments of the present application, Figure 5 The specific manner in which each module in the illustrated electronic component test pin positioning device performs operations has been described in detail in the embodiment of the method, and will not be elaborated on here.

[0103] An embodiment of the present application also provides an electronic device, including a processor and a memory for storing processor executable instructions, wherein the processor is configured to execute the steps of the above-mentioned electronic component test pin positioning method when calling the executable instructions in the memory.

[0104] Figure 6 Schematic diagram of the structure of the electronic device according to the embodiment of the present application. Figure 6 As shown, the electronic device 800 supports multi-screen output, and the electronic device 800 may include one or more of the following components: a processing component 802, a memory 804, a power component 806, a multimedia component 808, an audio component 810, an input / output (I / O) interface 812, a sensor component 814, and a communication component 816.

[0105] The processing component 802 generally controls the overall operation of the electronic device 800, such as operations associated with display, phone calls, data communications, camera operations, and recording operations. The processing component 802 may include one or more processors 820 to execute instructions to complete all or part of the steps of the above-mentioned method. In addition, the processing component 802 may include one or more modules to facilitate the interaction between the processing component 802 and other components. For example, the processing component 802 may include a multimedia module to facilitate the interaction between the multimedia component 808 and the processing component 802.

[0106] The memory 804 is configured to store various types of data to support operations on the device 800. Examples of such data include instructions for any application or method operating on the electronic device 800, contact data, phone book data, messages, pictures, videos, etc. The memory 804 can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic memory, flash memory, magnetic disk or optical disk.

[0107] The power component 806 provides power to the various components of the electronic device 800. The power component 806 may include a power management system, one or more power supplies, and other components associated with generating, managing, and distributing power for the electronic device 800.

[0108] The multimedia component 808 includes a screen that provides an output interface between the electronic device 800 and the user. In some embodiments, the screen may include a liquid crystal display (LCD) and a touch panel (TP). If the screen includes a touch panel, the screen may be implemented as a touch screen to receive input signals from the user. The touch panel includes one or more touch sensors to sense touch, slide, and gestures on the touch panel. The touch sensor may not only sense the boundaries of the touch or slide action, but also detect the duration and pressure associated with the touch or slide operation. In some embodiments, the multimedia component 808 includes a front camera and / or a rear camera. When the device 800 is in an operating mode, such as a shooting mode or a video mode, the front camera and / or the rear camera may receive external multimedia data. Each front camera and the rear camera may be a fixed optical lens system or have a focal length and optical zoom capability.

[0109] The audio component 810 is configured to output and / or input audio signals. For example, the audio component 810 includes a microphone (MIC), and when the electronic device 800 is in an operating mode, such as a call mode, a recording mode, and a voice recognition mode, the microphone is configured to receive an external audio signal. The received audio signal can be further stored in the memory 804 or sent via the communication component 816. In some embodiments, the audio component 810 also includes a speaker for outputting audio signals.

[0110] I / O interface 812 provides an interface between processing component 802 and peripheral interface modules, such as keyboards, click wheels, buttons, etc. These buttons may include but are not limited to: home button, volume button, start button, and lock button.

[0111] The sensor assembly 814 includes one or more sensors for providing various aspects of status assessment for the electronic device 800. For example, the sensor assembly 814 can detect the open / closed state of the device 800, the relative positioning of components, such as the display and keypad of the electronic device 800, and the sensor assembly 814 can also detect the position change of the electronic device 800 or a component of the electronic device 800, the presence or absence of contact between the user and the electronic device 800, the orientation or acceleration / deceleration of the electronic device 800, and the temperature change of the electronic device 800. The sensor assembly 814 may include a proximity sensor configured to detect the presence of nearby objects without any physical contact. The sensor assembly 814 may also include an optical sensor, such as a CMOS or CCD image sensor, for use in imaging applications. In some embodiments, the sensor assembly 814 may also include an accelerometer, a gyroscope sensor, a magnetic sensor, a pressure sensor, or a temperature sensor.

[0112] The communication component 816 is configured to facilitate wired or wireless communication between the electronic device 800 and other devices. The electronic device 800 can access a wireless network based on a communication standard, such as Wi-Fi, 2G or 3G, or a combination thereof. In an exemplary embodiment, the communication component 816 receives a broadcast signal or broadcast-related information from an external broadcast management system via a broadcast channel. In an exemplary embodiment, the communication component 816 also includes a near field communication (NFC) module to facilitate short-range communication. For example, the NFC module can be implemented based on radio frequency identification (RFID) technology, infrared data association (IrDA) technology, ultra-wideband (UWB) technology, Bluetooth (BT) technology and other technologies.

[0113] In an exemplary embodiment, the electronic device 800 can be implemented by one or more application-specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field programmable gate arrays (FPGAs), controllers, microcontrollers, microprocessors or other electronic components to perform the steps of the electronic component test pin locating method of the above-mentioned embodiment.

[0114] In an exemplary embodiment, a non-transitory computer-readable storage medium including instructions is also provided, such as a memory 804 including instructions, and the above instructions can be executed by a processor 820 of an electronic device 800 to complete the steps of the electronic component test pin positioning method of the above embodiment. For example, the non-transitory computer-readable storage medium can be a ROM, a random access memory (RAM), a CD-ROM, a magnetic tape, a floppy disk, an optical data storage device, etc.

[0115] The embodiment of the present application also describes a computer-readable storage medium, in which a computer program is stored. When the computer program is executed by a processor, the steps of the electronic component test pin positioning method of the embodiment are implemented.

[0116] It should be understood that "one embodiment" or "an embodiment" mentioned throughout the specification means that specific features, structures or characteristics related to the embodiment are included in at least one embodiment of the present invention. Therefore, "in one embodiment" or "in an embodiment" appearing throughout the specification does not necessarily refer to the same embodiment. In addition, these specific features, structures or characteristics can be combined in one or more embodiments in any suitable manner. It should be understood that in various embodiments of the present invention, the size of the sequence number of the above-mentioned processes does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiment of the present application. The above-mentioned sequence numbers of the embodiments of the present application are for description only and do not represent the advantages and disadvantages of the embodiments.

[0117] It should be noted that, in this article, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the existence of other identical elements in the process, method, article or device including the element.

[0118] In the several embodiments provided in this application, it should be understood that the disclosed devices and methods can be implemented in other ways. The device embodiments described above are only schematic. For example, the division of the units is only a logical function division. There may be other division methods in actual implementation, such as: multiple units or components can be combined, or can be integrated into another system, or some features can be ignored or do not exist.

[0119] The units described above as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units; some or all of the units may be selected according to actual needs to achieve the purpose of the present embodiment.

[0120] The above is only an embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed by the present invention, which should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims

1. A method for positioning a test pin of an electronic component, characterized in that: The method comprises: Get the point cloud information of the Mark points of the motherboard to be tested; Based on the point cloud information of the Mark point and the coordinates of the motherboard schematic diagram of the Mark point, determine the correspondence between the world coordinate system coordinates of the electronic components of the motherboard to be tested and the coordinates of the motherboard schematic diagram; Determine the motherboard schematic coordinates of the electronic component of the pin to be tested; Acquire the position information of the electronic component of the pin to be tested, and correct the position information to determine the offset of the electronic component of the pin to be tested; The position of the test pin is determined based on the motherboard schematic coordinates of the electronic component of the pin to be tested, the correspondence between the world coordinate system coordinates of the motherboard electronic component to be tested and the motherboard schematic coordinates, the offset of the electronic component of the pin to be tested, and the positional relationship between the pin to be tested and the corresponding electronic component of the pin to be tested.

2. The electronic component test pin positioning method according to claim 1, characterized in that: The step of obtaining the point cloud information of the Mark points of the motherboard to be tested includes: Move the teaching robot arm to the Mark point area of ​​the motherboard to be tested, obtain the point cloud information of multiple Mark points of the motherboard to be tested through the 3D camera of the teaching robot arm, and mark them.

3. The electronic component test pin positioning method according to claim 2, characterized in that: Determining the correspondence between the world coordinate system coordinates of the electronic components of the motherboard to be tested and the coordinates of the motherboard schematic diagram based on the point cloud information of the Mark point and the coordinates of the motherboard schematic diagram of the Mark point includes: According to the mark, the Mark point is identified as a circle with a radius of a first length, and the point cloud coordinates of the center of the circle are determined; Based on the point cloud coordinates of the center of the Mark point and the mainboard schematic diagram coordinates of the Mark point, a transfer matrix between the world coordinate system coordinates of the electronic component of the mainboard to be tested and the mainboard schematic diagram coordinates is established.

4. The electronic component test pin positioning method according to claim 3, characterized in that: The mainboard schematic diagram coordinates of the electronic component of the pin to be tested are the center point coordinates of the electronic component of the pin to be tested in the mainboard schematic diagram; The positional relationship between the pin to be tested and the electronic component corresponding to the pin to be tested is the azimuth offset of the pin to be tested relative to the coordinates of the center point of the electronic component.

5. The electronic component test pin positioning method according to claim 4, characterized in that: Determining the mainboard schematic coordinates of the electronic component of the pin to be tested includes: Acquire multiple pin coordinates of the electronic component of the pin to be tested in the mainboard schematic diagram; determine the center point coordinates of the electronic component of the pin to be tested through the multiple pin coordinates.

6. The electronic component test pin positioning method according to claim 4, characterized in that: Determining the position of the test pin according to the mainboard schematic coordinates of the electronic component of the pin to be tested, the correspondence between the world coordinate system coordinates of the mainboard electronic component to be tested and the mainboard schematic coordinates, the offset of the electronic component of the pin to be tested, and the positional relationship between the pin to be tested and the corresponding electronic component of the pin to be tested comprises: Determine the world coordinates of the center point of the electronic component of the pin to be tested according to the center point coordinates of the electronic component of the pin to be tested in the mainboard schematic diagram and the transfer matrix between the world coordinate system coordinates of the electronic component of the mainboard to be tested and the coordinates of the mainboard schematic diagram; Correcting the world coordinates of the center point of the electronic component of the pin to be tested according to the overall offset of the electronic component of the pin to be tested; The position of the test pin is determined according to the corrected world coordinates of the center point of the electronic component of the pin to be tested and the azimuth offset of the pin to be tested relative to the coordinates of the center point of the electronic component.

7. The electronic component test pin positioning method according to claim 1, characterized in that: The method further includes: sending the position of the test pin to a mechanical arm, and performing point testing on the test pin by the mechanical arm.

8. An electronic component test pin positioning device, characterized in that: The device comprises: The information acquisition module is used to obtain the point cloud information of the Mark points of the motherboard to be tested; A mapping module is used to determine the correspondence between the world coordinate system coordinates of the electronic components of the motherboard to be tested and the coordinates of the motherboard schematic diagram based on the point cloud information of the Mark point and the coordinates of the motherboard schematic diagram of the Mark point; A first determination module is used to determine the mainboard schematic coordinates of the electronic component of the pin to be tested; A correction module, used to obtain the position information of the electronic component of the pin to be tested, and correct the position information to determine the overall offset of the electronic component of the pin to be tested; The second determination module is used to determine the position of the test pin based on the motherboard schematic coordinates of the electronic component of the pin to be tested, the correspondence between the world coordinate system coordinates of the electronic component of the motherboard to be tested and the motherboard schematic coordinates, the offset of the electronic component of the pin to be tested, and the positional relationship between the pin to be tested and the corresponding electronic component of the pin to be tested.

9. An electronic device comprising a processor and a memory for storing instructions executable by the processor, characterized in that: The processor is configured to execute the steps of the method according to any one of claims 1 to 7 when calling the executable instructions in the memory.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 7 are implemented.

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