A cleaning device for semiconductor wafers

Abstract

The present invention relates to the technical field of semiconductor wafer cleaning. Specifically, it relates to a cleaning device for semiconductor wafers, including: an ultrasonic cleaning machine, a retention bracket installed on the side of the ultrasonic cleaning machine, a transmission mechanism horizontally installed on the retention bracket, a bottom plate obliquely arranged on the retention bracket, a baffle hinged to the lower end of the bottom plate, a number of along strips connected at equal intervals to the upper end of the bottom plate, a linear movement mechanism arranged behind the ultrasonic cleaning machine, a number of support columns arrayed on the linear movement mechanism, a clamping and brushing part installed on the number of support columns, and a lowering mechanism arranged on the clamping and brushing part, which can not only prevent the mutual influence between semiconductor wafers in the case of batch cleaning, but also completely eliminate the interference of foreign objects on smaller semiconductor wafers during cleaning, effectively ensuring the cleaning efficiency and cleaning effect.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor wafer cleaning, and more particularly, to a cleaning device for semiconductor wafers. Background Art

[0002] Semiconductor wafers are essential core components in modern electronic devices. A semiconductor wafer is a microelectronic device made of semiconductor materials, usually made of materials such as silicon, germanium, or gallium arsenide. These materials have electrical conductivity between that of conductors and insulators at room temperature, so they are called "semiconductors". Semiconductor wafers are widely used in electronic products such as computers, mobile phones, and digital recorders.

[0003] The manufacture of semiconductor wafers is a complex and delicate process, covering multiple steps from raw material preparation to final packaging. The first step in semiconductor wafer manufacturing is to produce a single crystal cylinder, usually using silicon or gallium arsenide materials. After the single crystal cylinder is made, it is cut into thin slices with a diamond saw, and then the wafers are sequentially ground, polished, cleaned, etc. During the manufacturing process, the wafers will be contaminated. For example, after grinding, abrasive mortar, silicon chips, and even iron chips on the grinding plate will remain on both surfaces of the wafer. Therefore, contaminants from multiple sources such as air, the human body, production equipment, or chemical agents can cause the wafers to be contaminated.

[0004] In order to keep the wafer surface clean at the microscale, ensure its surface reaches an extremely high cleanliness, and avoid contaminants affecting the performance and reliability of electronic devices, etc., it is essential to clean the wafers. Cleaning can remove dirt and chemical impurities on the wafers, prevent the wafer surface from being corroded, remove thermal stress, etc. However, there are some problems during the wafer cleaning process:

[0005] 1. When using ultrasonic cleaning, due to the small size of the wafers, putting semiconductor wafers into the ultrasonic cleaning tank in batches will cause trouble in putting them in and taking them out, resulting in low efficiency. Moreover, batches of semiconductor wafers are very likely to stick together in the cleaning tank, resulting in incomplete cleaning. Or, the semiconductor wafers are inserted into the cleaning basket of the ultrasonic cleaning machine and then cleaned. Although this improves the cleaning efficiency, the cleaning basket is very likely to interfere with the small-sized semiconductor wafers, resulting in poor cleaning effect;

[0006] 2. When the wafers are placed individually on the conveyor belt and cleaned with cleaning equipment arranged above the conveyor belt, only the upper surface of the wafer can be cleaned at a time, and the lower surface of the wafer in contact with the conveyor belt cannot be cleaned synchronously. It can only be cleaned again after turning it over, seriously affecting the cleaning efficiency;

[0007] 3. The drying operation after cleaning needs to be carried out separately, the connection of the production line is poor, the production efficiency is affected, and there is a great risk that larger wafers will be secondarily contaminated. Summary of the Invention

[0008] The object of the present invention is to provide a cleaning device for semiconductor wafers to solve the above problems.

[0009] To achieve the above object, the present invention provides a cleaning device for semiconductor wafers, including: an ultrasonic cleaning machine, a fixing bracket installed on the side of the ultrasonic cleaning machine, a transmission mechanism horizontally installed on the fixing bracket, a bottom plate obliquely arranged on the fixing bracket, a baffle hinged at the lower end of the bottom plate, a plurality of along-stripes connected at equal intervals at the upper end of the bottom plate, a linear moving mechanism arranged behind the ultrasonic cleaning machine, a plurality of struts array-mounted on the linear moving mechanism, a clamping and brushing part installed on the plurality of struts, a lowering mechanism arranged on the clamping and brushing part, and a hot air drying part arranged on the linear moving mechanism and the clamping and brushing part;

[0010] A plurality of the along-stripes are close to the transmission mechanism;

[0011] The clamping and brushing part is slidably installed in the lowering mechanism, wherein:

[0012] The transmission mechanism is adapted to transport peripheral semiconductor wafers in columns through the plurality of along-stripes to the bottom plate, so that the peripheral semiconductor wafers are arranged in batches in multiple columns on the bottom plate;

[0013] Driving the clamping and brushing part can clamp all the peripheral semiconductor wafers on the bottom plate;

[0014] The clamping and brushing part is adapted to subject the peripheral semiconductor wafers to a brushing action to complete the preliminary cleaning of the peripheral semiconductor wafers;

[0015] The linear moving mechanism and the lowering mechanism are adapted to drive the clamping and brushing part to perform horizontal movement and sinking actions respectively, so that the peripheral semiconductor wafers enter the cleaning tank of the ultrasonic cleaning machine for cleaning;

[0016] Driving the hot air drying part can generate flowing hot air and discharge it bidirectionally towards the peripheral semiconductor wafers, so that the peripheral semiconductor wafers are in a dry and hot environment.

[0017] Further, the clamping and brushing part includes a plurality of clamping bars arranged in the same direction as the bottom flat plate, and the plurality of clamping bars are arranged facing each other in pairs. A plurality of first hanging blocks and a plurality of second hanging blocks are respectively installed at the upper ends of the plurality of clamping bars, and the plurality of first hanging blocks and the plurality of second hanging blocks are arranged at intervals. A base bar block is arranged above the plurality of first hanging blocks and the plurality of second hanging blocks in the same direction. A first rectangular groove and a second rectangular groove are formed in the lower half of the base bar block along the long side direction of the base bar block, and the second rectangular groove is located behind the first rectangular groove. Two through grooves are formed in the upper half of the base bar block and are respectively connected to the second rectangular groove and the first rectangular groove. A plurality of first connecting plates and a plurality of second connecting plates are respectively slidably installed in the two through grooves. Two connecting bars are respectively installed on the plurality of first connecting plates and the plurality of second connecting plates. And two first electric push rods are mirror-symmetrically arranged at both ends of the base bar block, and the output shafts of the two first electric push rods are respectively connected to the two connecting bars;

[0018] The plurality of clamping bars are attached to the surface of the bottom flat plate, and the lower ends of the plurality of clamping bars are all in contact with the baffle;

[0019] The plurality of first hanging blocks are slidably installed in the first rectangular groove, and the plurality of first connecting plates are respectively connected to the plurality of first hanging blocks;

[0020] The plurality of second hanging blocks are slidably installed in the second rectangular groove, and the plurality of second connecting plates are respectively connected to the plurality of second hanging blocks.

[0021] Further, the clamping and brushing part further includes a U-shaped plate arranged in the same direction as the bottom flat plate and installed on the plurality of support columns. The left open end of the U-shaped plate faces the bottom flat plate. Two groups of a plurality of cleaning brushes are oppositely installed inside the U-shaped plate. A groove member is horizontally placed at the top end of the U-shaped plate. A tension member is slidably installed at one end in the groove member. An extension panel is connected to the groove member on the side away from the tension member. And a second electric push rod is installed on the extension panel, and the output shaft of the second electric push rod is connected to the tension member;

[0022] The other end of the tension member is integrally connected to the base bar block;

[0023] The plurality of clamping bars are aligned with the gap between the two groups of a plurality of cleaning brushes;

[0024] The base bar block is higher than the top surface of the U-shaped plate.

[0025] Further, the lowering mechanism includes a plurality of sinking grooves formed on the surface of the U-shaped plate and perpendicular to the groove member, a mounting plate member installed at the lower end of the U-shaped plate, and a cylinder arranged on the mounting plate member;

[0026] The output end of the cylinder is connected to the middle part of the groove member;

[0027] The bottom of the groove member is slidably mounted in a plurality of the sunken grooves.

[0028] Furthermore, the hot air drying part includes a hot air blower arranged on the linear moving mechanism, two transfer air boxes installed on the side surface of the C-shaped plate, two outer blowing channels respectively communicating with the two transfer air boxes, an accumulation chamber installed at the air outlet of the hot air blower, and two conveying pipes with one end communicating with the accumulation chamber and the other end respectively communicating with the two transfer air boxes;

[0029] The two outer blowing channels are obliquely shaped and arranged facing each other;

[0030] The movement trajectories of a plurality of the clamping strips are located between the two outer blowing channels.

[0031] Furthermore, the transmission mechanism includes a reference table horizontally installed on the retention bracket, and a plurality of conveyor belts linearly arranged on the reference table;

[0032] A plurality of the conveyor belts respectively align with the gaps between a plurality of the clamping strips arranged in pairs facing each other;

[0033] A plurality of the along strips respectively adhere to a plurality of the conveyor belts.

[0034] Furthermore, rubber strips are installed on the facing sides of a plurality of the clamping strips.

[0035] Furthermore, a plurality of groups of guiding eaves are installed on the top of the bottom surface flat plate, and a plurality of groups of the guiding eaves are close to a plurality of the second hanging blocks;

[0036] A plurality of groups of the guiding eaves correspond to a plurality of the conveyor belts one by one.

[0037] Furthermore, a receiving dish is detachably installed on the bottom of the lower surface of the C-shaped plate.

[0038] Compared with the prior art, the present invention has the following beneficial effects:

[0039] 1. With the cooperation of the transmission mechanism and the clamping and brushing part, the cleaning device for semiconductor wafers can automatically arrange the semiconductor wafers to be cleaned as required, and can stably clamp all the arranged semiconductor wafers. In addition, under the combined action of the linear moving mechanism and the lowering mechanism, all the clamped wafers can be smoothly sent into the cleaning tank of the ultrasonic cleaning machine for cleaning, ensuring batch cleaning while taking into account the rapid and convenient loading and unloading of semiconductor wafers, thereby effectively ensuring the overall high-efficiency cleaning;

[0040] 2. The cleaning device for semiconductor wafers uses a clamping and brushing part as a carrier for the semiconductor wafers in the cleaning tank of the ultrasonic cleaning machine to support them for cleaning. It can spread all the semiconductor wafers out in a single layer, exposing both the front and back sides fully in the cleaning tank for thorough cleaning. This not only prevents the mutual influence between semiconductor wafers during batch cleaning but also completely eliminates the interference of foreign objects to the smaller semiconductor wafers during cleaning, effectively ensuring the cleaning efficiency and cleaning effect.

[0041] 3. The cleaning device for semiconductor wafers can finely brush both the front and back sides of all semiconductor wafers through the clamping and brushing part before sending them into the cleaning tank of the ultrasonic cleaning machine for cleaning, thereby removing a part of the contaminants existing on the semiconductor wafers. Furthermore, while improving the cleaning effect on the semiconductor wafers and ensuring the thorough cleaning of contaminants, it forms a pretreatment process, preventing the direct placement of semiconductor wafers with excessive attached contaminants into the cleaning tank, which may cause the cleaning liquid to be contaminated too quickly, extending the single - use life of the cleaning liquid in the ultrasonic cleaning machine and avoiding the cumbersome operation and economic losses caused by frequent replacement.

[0042] 4. The cleaning device for semiconductor wafers can continuously blow dry hot air towards both the front and back sides of the semiconductor wafers through the heat - drying part immediately after the cleaning of the semiconductor wafers is completed, so that the semiconductor wafers are continuously wrapped in the dry hot air flow, realizing the drying operation of the semiconductor wafers. Furthermore, it greatly improves the connection of the production line, eliminating the need to transfer the semiconductor wafers to other locations for drying. This not only ensures the production efficiency but also effectively avoids the risk of secondary contamination of the cleaned semiconductor wafers during the transfer to the drying location, ensuring the effectiveness of the cleaning. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] The present invention will be further described below in conjunction with the drawings and embodiments.

[0044] Figure 1 Shows a perspective view of the present invention;

[0045] Figure 2 Shows a front view of the present invention;

[0046] Figure 3 Shows a first partial perspective view of the present invention;

[0047] Figure 4 Shows a second partial perspective view of the present invention;

[0048] Figure 5 Shows a third partial perspective view of the present invention;

[0049] Figure 6Shows a fourth partial perspective view of the present invention;

[0050] Figure 7 Shows a fifth partial perspective view of the present invention;

[0051] Figure 8 Shows a partial bottom perspective view of the present invention;

[0052] Figure 9 Shows a schematic diagram when a semiconductor wafer is sent into the cleaning tank of an ultrasonic cleaning machine;

[0053] Figure 10 Shows a partial right view of the present invention from another angle;

[0054] Figure 11 Shows the present invention Figure 5 An enlarged view of part A;

[0055] Figure 12 Shows the present invention Figure 7 An enlarged view of part B;

[0056] Figure 13 Shows the present invention Figure 10 An enlarged view of part C.

[0057] In the figures, the same reference numerals denote the same structural elements, where:

[0058] 1. Ultrasonic cleaning machine; 2. Retaining bracket; 3. Transmission mechanism; 31. Reference table; 32. Conveyor belt; 4. Bottom flat plate; 5. Baffle; 6. Along the strip; 7. Linear moving mechanism; 8. Support pillar; 9. Clamping and brushing part; 91. Clamping strip; 92. First hanging block; 93. Second hanging block; 94. Matrix strip; 95. First rectangular groove; 96. Second rectangular groove; 97. First connecting plate; 98. Second connecting plate; 99. Connecting strip; 991. First electric push rod; 992. C-shaped plate; 993. Cleaning brush; 994. Groove part; 995. Tension part; 996. Extension panel; 997. Second electric push rod; 10. Lowering mechanism; 101. Sinking groove; 102. Mounting plate part; 103. Cylinder; 11. Heat drying part; 12. Hot air blower; 13. Intermediate air box; 14. Outer blowing channel; 15. Accumulation chamber; 16. Delivery pipe; 17. Rubber strip; 18. Guiding edge; 19. Receiving dish. Detailed Description of the Invention

[0059] Now, the present invention will be further described in detail with reference to the accompanying drawings. These drawings are all simplified schematic diagrams, only showing the basic structure of the present invention in a schematic way, so they only show the components related to the present invention.

[0060] As Figures 1-13As shown, a cleaning device for semiconductor wafers comprises: an ultrasonic cleaning machine 1, a retaining bracket 2 installed on the side of the ultrasonic cleaning machine 1, a transmission mechanism 3 installed horizontally on the retaining bracket 2, a bottom plate 4 obliquely arranged on the retaining bracket 2, a baffle 5 hinged at the lower end of the bottom plate 4, a plurality of longitudinal strips 6 connected to the upper end of the bottom plate 4 at equal intervals, a linear moving mechanism 7 arranged at the rear of the ultrasonic cleaning machine 1, a plurality of pillars 8 arranged in an array on the linear moving mechanism 7, and a clamping brush installed on the plurality of pillars 8. Part 9, a lowering mechanism 10 arranged on the clamping and brushing part 9, and a hot baking part 11 arranged on the linear moving mechanism 7 and the clamping and brushing part 9, the baffle 5 can ensure that the semiconductor wafer will not leak out when the transmission mechanism 3 sends the semiconductor wafer to the bottom plate 4, and at the same time, the hinged baffle 5 can be pushed away when the clamping and brushing part 9 completes the clamping of the semiconductor wafer and moves to the cleaning tank of the ultrasonic cleaning machine 1, so as not to hinder the clamping and brushing part 9, and when the clamping and brushing part 9 needs to be re-attached to the bottom plate 4, the baffle 5 is bent downward to make way for the clamping and brushing part 9 to move;

[0061] A plurality of said along-line 6 are close to said transmission mechanism 3;

[0062] The clamping and brushing part 9 is slidably mounted in the lowering mechanism 10, wherein:

[0063] The transmission mechanism 3 is suitable for transporting the peripheral semiconductor wafers to the bottom plate 4 via the plurality of the longitudinal strips 6, so that the peripheral semiconductor wafers are arranged in batches in multiple rows on the bottom plate 4;

[0064] Driving the clamping and cleaning brush 9 can clamp all the peripheral semiconductor wafers on the bottom plate 4;

[0065] The clamping and brushing part 9 is suitable for subjecting the peripheral semiconductor wafer to a brushing action, so as to complete the preliminary cleaning of the peripheral semiconductor wafer;

[0066] The linear moving mechanism 7 and the lowering mechanism 10 are suitable for driving the clamping and brushing part 9 to perform lateral movement and sinking respectively, so that the peripheral semiconductor wafer enters the cleaning tank of the ultrasonic cleaning machine 1 for cleaning. The linear moving mechanism 7 can be a linear motor or a gear rack transmission mechanism, etc., which can realize linear reciprocating movement;

[0067] The driving of the hot air drying unit 11 can generate a flowing hot air stream and discharge it bidirectionally towards the peripheral semiconductor wafers, so that the peripheral semiconductor wafers are in a dry and hot environment. With the cooperation of the transmission mechanism 3 and the clamping and brushing unit 9, the cleaning device for semiconductor wafers can automatically arrange the semiconductor wafers to be cleaned as required and stably clamp all the arranged semiconductor wafers. In addition, under the combined action of the linear moving mechanism 7 and the lowering mechanism 10, all the clamped wafers can be smoothly sent into the cleaning tank of the ultrasonic cleaner 1 for cleaning, ensuring batch cleaning while taking into account the fast and convenient loading and unloading of semiconductor wafers, thus effectively ensuring the overall high-efficiency cleaning. The cleaning device for semiconductor wafers uses the clamping and brushing unit 9 as the carrier of the semiconductor wafers in the cleaning tank of the ultrasonic cleaner 1 to support their cleaning, enabling all the semiconductor wafers to be laid out in a single layer, with both their front and back sides fully exposed in the cleaning tank for thorough cleaning. This not only prevents mutual influence between semiconductor wafers during batch cleaning but also completely eliminates interference from foreign objects to the smaller semiconductor wafers during cleaning, effectively guaranteeing the cleaning efficiency and cleaning effect. Through the clamping and brushing unit 9, before the semiconductor wafers are sent into the cleaning tank of the ultrasonic cleaner 1 for cleaning, the front and back sides of all the semiconductor wafers can be finely brushed to remove some of the contaminants on the semiconductor wafers, thereby forming a pretreatment process while improving the cleaning effect of the semiconductor wafers and ensuring thorough cleaning of the contaminants, preventing the cleaning liquid from being contaminated too quickly by directly putting semiconductor wafers with excessive contaminants into the cleaning tank, extending the single-use life of the cleaning liquid in the ultrasonic cleaner 1, and avoiding the cumbersome operation and economic losses caused by frequent replacement. Through the hot air drying unit 11, after the cleaning of the semiconductor wafers is completed, hot dry air can be continuously blown towards their front and back sides, so that the semiconductor wafers are continuously wrapped in the hot dry air stream to complete the drying operation of the semiconductor wafers, thereby greatly improving the connection of the production line. There is no need to transfer the semiconductor wafers to other locations for drying, which not only ensures the production efficiency but also effectively avoids the risk of secondary contamination during the transfer of the cleaned semiconductor wafers to the drying location, ensuring the effectiveness of the cleaning.

[0068] Optionally, the clamping and brushing part 9 includes a plurality of clamping strips 91 arranged in the same direction as the bottom flat plate 4, and the plurality of clamping strips 91 are arranged in pairs facing each other. A plurality of first hanging blocks 92 and a plurality of second hanging blocks 93 are respectively installed at the upper ends of the plurality of clamping strips 91, and the plurality of first hanging blocks 92 and the plurality of second hanging blocks 93 are arranged at intervals. A matrix strip block 94 is arranged above the plurality of first hanging blocks 92 and the plurality of second hanging blocks 93. A first rectangular groove 95 and a second rectangular groove 96 are formed in the lower half of the matrix strip block 94 along the long side direction of the matrix strip block 94, and the second rectangular groove 96 is located behind the first rectangular groove 95. Two through grooves are formed in the upper half of the matrix strip block 94 and are respectively connected to the second rectangular groove 96 and the first rectangular groove 95. A plurality of first connecting plates 97 and a plurality of second connecting plates 98 are respectively slidably installed in the two through grooves. Two connecting strips 99 are respectively installed on the plurality of first connecting plates 97 and the plurality of second connecting plates 98. Two first electric push rods 991 are mirror-symmetrically arranged at both ends of the matrix strip block 94, and the output shafts of the two first electric push rods 991 are respectively connected to the two connecting strips 99;

[0069] The plurality of clamping strips 91 are attached to the surface of the bottom flat plate 4, and the lower ends of the plurality of clamping strips 91 are all in contact with the baffle 5;

[0070] The plurality of first hanging blocks 92 are slidably installed in the first rectangular groove 95, and the plurality of first connecting plates 97 are respectively connected to the plurality of first hanging blocks 92;

[0071] A plurality of the second hanging blocks 93 are slidably installed in the second rectangular grooves 96, and a plurality of the second connecting plates 98 are respectively connected to the plurality of the second hanging blocks 93. Before cleaning, it is necessary to set the number of semiconductor wafers to be cleaned in a single batch first, that is, the arrangement height of the semiconductor wafers on the bottom flat plate 4 should be controlled to an appropriate level, so as to ensure that all the semiconductor wafers in the current batch can be sent into the cleaning tank of the ultrasonic cleaning machine 1 and covered by the cleaning liquid for cleaning subsequently. In the initial state, the output shafts of the two first electric push rods 991 are both in the state of extending by the same amount. After the conveying mechanism 3 conveys all the semiconductor wafers to be cleaned in the current batch onto the bottom flat plate 4 and arranges them, the two first electric push rods 991 are synchronously driven to synchronously pull the two connecting bars 99, a plurality of first connecting plates 97 and a plurality of second connecting plates 98 towards each other. One first electric push rod 991 pulls a plurality of clamping bars 91 connected to a plurality of first hanging blocks 92 in the same direction, while the other first electric push rod 991 pulls a plurality of clamping bars 91 connected to a plurality of second hanging blocks 93 in the opposite direction, so that every two opposite clamping bars 91 gradually close until all the semiconductor wafers are clamped, and then the driving of the two first electric push rods 991 is stopped. The clamping and brushing part 9 is used to put and take out the semiconductor wafers into and out of the cleaning tank of the ultrasonic cleaning machine 1 in batches, ensuring that the putting and taking out of the semiconductor wafers can be completed quickly and conveniently, and effectively improving the overall cleaning efficiency; at the same time, after a batch of semiconductor wafers are all clamped by the clamping and brushing part 9, the semiconductor wafers are in a single-layer spread state, so that both the front and back sides of the semiconductor wafers can be completely exposed. When they enter the cleaning tank of the ultrasonic cleaning machine 1 for cleaning, both the front and back sides can be thoroughly cleaned, thereby avoiding the mutual influence between the semiconductor wafers or the interference of foreign objects on them, and ensuring a high-quality cleaning effect.

[0072] Optionally, the clamping and brushing part 9 further includes a U-shaped plate 992 arranged in the same direction as the bottom flat plate 4 and installed on a plurality of the columns 8, and the left open end of the U-shaped plate 992 faces the bottom flat plate 4. Two groups of a plurality of cleaning brushes 993 installed oppositely inside the U-shaped plate 992, a groove member 994 horizontally placed at the top end of the U-shaped plate 992, a tension member 995 with one end slidably installed in the groove member 994, an extension panel 996 connected to the side of the groove member 994 away from the tension member 995, and a second electric push rod 997 installed on the extension panel 996, and the output shaft of the second electric push rod 997 is connected to the tension member 995;

[0073] The other end of the tension member 995 is integrally connected to the base strip 94;

[0074] A plurality of the clamping strips 91 are aligned with the gaps between two groups of a plurality of the cleaning brushes 993, ensuring that the plurality of clamping strips 91 can enter, but the gaps between the two groups of a plurality of cleaning brushes 993 are smaller than the thickness of the plurality of clamping strips 91, so as to ensure that after the plurality of clamping strips 91 holding the semiconductor wafers enter the inside of the U-shaped plate 992, the two groups of a plurality of cleaning brushes 993 can fully contact the front and back surfaces of the semiconductor wafers and brush them;

[0075] The base strip 94 is higher than the top surface of the U-shaped plate 992. Before the transfer mechanism 3 conveys the semiconductor wafers, the plurality of clamping strips 91 are adjusted to a state where they are attached to the surface of the bottom flat plate 4 and the lower ends are in contact with the baffle 5 through the linear movement mechanism 7 and the lowering mechanism 10; after all the semiconductor wafers on the bottom flat plate 4 are clamped, the second electric push rod 997 is driven to pull the tension member 995 backward along the groove member 994, so as to pull the base strip 94 backward synchronously, so that the plurality of clamping strips 91 and the semiconductor wafers they hold gradually enter the U-shaped plate 992. After all the semiconductor wafers enter the U-shaped plate 992, the second electric push rod 997 is driven in the reverse direction to push them out. This is repeated for multiple back-and-forth movements. During this process, the front and back surfaces of all the semiconductor wafers are finely brushed by the two groups of a plurality of cleaning brushes 993 for many times. Furthermore, before the semiconductor wafers are cleaned by the ultrasonic cleaning machine 1, they are first subjected to a pretreatment to remove stubborn pollutants on the semiconductor wafers, or pollutants that are not easily cleaned by the ultrasonic cleaning machine 1, etc., and a part of the pollutants existing on the semiconductor wafers are removed first, ensuring the cleaning effect of the semiconductor wafers, ensuring the thoroughness of the pollutant cleaning, and at the same time, effectively preventing the semiconductor wafers with excessive attached pollutants from being directly put into the cleaning tank for cleaning, which may cause the cleaning liquid to be polluted too quickly, extending the single service life of the cleaning liquid in the ultrasonic cleaning machine 1, and avoiding the cumbersome operation and economic losses caused by frequent replacement; after the pretreatment is completed, the plurality of clamping strips 91 are reset by the second electric push rod 997 to ensure that they can smoothly enter the cleaning tank of the ultrasonic cleaning machine 1.

[0076] Optionally, the lowering mechanism 10 includes a plurality of sinking grooves 101 formed on the surface of the U-shaped plate 992 and perpendicular to the groove member 994, a mounting plate member 102 installed at the lower end of the U-shaped plate 992, and a cylinder 103 provided on the mounting plate member 102;

[0077] The output end of the cylinder 103 is connected to the middle of the groove member 994;

[0078] The bottom of the groove member 994 is slidably installed in several of the sunken grooves 101. After the pre-treatment of the semiconductor wafer is completed and several clamping bars 91 are reset, first, the linear moving mechanism 7 is used to laterally move several clamping bars 91 to an appropriate position, and then the driving cylinder 103 is driven to directly pull down the groove member 994 along several sunken grooves 101, indirectly causing the tension member 995 and the base strip 94 to move downward synchronously until the entire semiconductor wafer enters the cleaning tank of the ultrasonic cleaning machine 1 and is submerged by the cleaning liquid, ensuring that the semiconductor wafer can be smoothly cleaned by the ultrasonic cleaning machine 1.

[0079] Optionally, the hot air drying part 11 includes a hot air blower 12 provided on the linear moving mechanism 7, two transfer air boxes 13 installed on the side of the C-shaped plate 992, two external blowing channels 14 respectively connected to the two transfer air boxes 13, an accumulation chamber 15 installed at the air outlet of the hot air blower 12, and two conveying pipes 16 with one end connected to the accumulation chamber 15 and the other end respectively connected to the two transfer air boxes 13;

[0080] The two external blowing channels 14 are obliquely arranged and face each other;

[0081] The movement trajectories of several clamping bars 91 are located between the two external blowing channels 14 to prevent the external blowing channels 14 from obstructing the movement of several clamping bars 91. After the cleaning is completed in the ultrasonic cleaning machine 1, the driving cylinder 103 is reversely driven to lift the semiconductor wafer out of the cleaning tank of the ultrasonic cleaning machine 1 until the groove member 994 is pushed up to the highest position, that is, the state where the base strip 94 is higher than the top surface of the C-shaped plate 992, and this state is maintained for a certain period of time. During this process, the linear moving mechanism 7 needs to be coordinated to control all of them above the cleaning tank of the ultrasonic cleaning machine 1 to prevent the remaining cleaning liquid on several clamping bars 91 and the semiconductor wafer from dripping onto other positions and causing pollution; Subsequently, the second electric push rod 997 is used to pull several clamping bars 91 backward towards the two external blowing channels 14 until the outermost clamping bar 91 is close to the two external blowing channels 14. Then, the hot air blower 12 is started. The hot air blower 12 starts to blow hot air, and the hot air is successively sent to the two transfer air boxes 13 along the accumulation chamber 15 and the two conveying pipes 16, and finally obliquely blown out through the two external blowing channels 14, so that both the front and back surfaces of the semiconductor wafer on several clamping bars 91 are continuously blown by the dry hot air, enabling the semiconductor wafer to be continuously wrapped in the dry hot air flow, realizing the drying operation of the semiconductor wafer, thereby greatly improving the connection of the production line. There is no need to transfer the semiconductor wafer to other locations for drying, which not only ensures the production efficiency but also effectively avoids the risk of secondary pollution to the semiconductor wafer during the transfer of the cleaned semiconductor wafer to the drying location, ensuring the effectiveness of the cleaning.

[0082] Optionally, the transmission mechanism 3 includes a reference table 31 horizontally installed on the retention bracket 2, and a plurality of conveyor belts 32 linearly arranged on the reference table 31, ensuring that the semiconductor wafers to be cleaned can be sequentially sent to the bottom flat plate 4 through the plurality of conveyor belts 32;

[0083] The plurality of conveyor belts 32 are respectively aligned with the gaps between a plurality of pairs of oppositely arranged clamping strips 91, ensuring that the plurality of conveyor belts 32 accurately group and sequentially arrange the semiconductor wafers to a preset position, so as to ensure that the semiconductor wafers fall within the clamping area of the plurality of clamping strips 91 and are smoothly clamped;

[0084] The plurality of guiding strips 6 are respectively close to the plurality of conveyor belts 32, ensuring that the semiconductor wafers can smoothly slide down along the guiding strips 6 onto the bottom flat plate 4 after leaving the conveyor belts 32.

[0085] Optionally, rubber strips 17 are installed on the opposite sides of the plurality of clamping strips 91. During clamping, the soft rubber strips 17 form a certain protection for the semiconductor wafers to prevent the semiconductor wafers from being clamped and damaged; at the same time, the soft rubber strips 17 have deformation ability, so as to ensure that even when there are slight errors in the semiconductor wafers resulting in inconsistent sizes, under the continuous closing of the two clamping strips 91 on both sides, the rubber strips 17 can adapt to the shape of the middle semiconductor wafers, thereby ensuring that all semiconductor wafers are firmly clamped and improving the error tolerance rate.

[0086] Optionally, a plurality of groups of guiding eaves 18 are installed on the top of the bottom flat plate 4, and the plurality of groups of guiding eaves 18 are close to the plurality of second hanging blocks 93;

[0087] The plurality of groups of guiding eaves 18 correspond to the plurality of conveyor belts 32 one by one, and the plurality of groups of guiding eaves 18 are used to block and prevent on the movement route of the semiconductor wafers to prevent the semiconductor wafers from sliding freely out of the movement route, ensuring that they can smoothly slide into the clamping area of the plurality of clamping strips 91.

[0088] Optionally, a receiving dish 19 is detachably installed on the bottom of the lower surface of the U-shaped plate 992. When the two groups of cleaning brushes 993 brush the semiconductor wafers, the receiving dish 19 can catch the contaminants brushed off and sliding down along the U-shaped plate 992 to a certain extent, thereby reducing the subsequent cleaning pressure.

[0089] The above are only the preferred embodiments of the present invention and are not used to limit the present invention. For those skilled in the art, the present invention can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A cleaning device for semiconductor wafers, characterized in that, Including: An ultrasonic cleaning machine (1), a retaining bracket (2) installed on the side of the ultrasonic cleaning machine (1), a transmission mechanism (3) horizontally installed on the retaining bracket (2), a bottom flat plate (4) obliquely arranged on the retaining bracket (2), a baffle (5) hinged to the lower end of the bottom flat plate (4), a plurality of along-stripes (6) equally spaced and connected to the upper end of the bottom flat plate (4), a linear moving mechanism (7) arranged behind the ultrasonic cleaning machine (1), a plurality of support columns (8) array-mounted on the linear moving mechanism (7), a clamping and brushing part (9) installed on the plurality of support columns (8), a lowering mechanism (10) arranged on the clamping and brushing part (9), and a heat drying part (11) arranged on the linear moving mechanism (7) and the clamping and brushing part (9); A plurality of the along-stripes (6) are close to the transmission mechanism (3); The clamping and brushing part (9) is slidably installed in the lowering mechanism (10), wherein: The transmission mechanism (3) is adapted to transport the peripheral semiconductor wafers to the bottom flat plate (4) in columns through the plurality of along-stripes (6), so that the peripheral semiconductor wafers are arranged in multiple columns in batches on the bottom flat plate (4); The driving of the clamping and brushing part (9) enables all the peripheral semiconductor wafers on the bottom flat plate (4) to be clamped; The clamping and brushing part (9) is adapted to subject the peripheral semiconductor wafers to a brushing action to complete the preliminary cleaning of the peripheral semiconductor wafers; The linear moving mechanism (7) and the lowering mechanism (10) are adapted to drive the clamping and brushing part (9) to perform horizontal movement and sinking actions respectively, so that the peripheral semiconductor wafers enter the cleaning tank of the ultrasonic cleaning machine (1) for cleaning; The driving of the heat drying part (11) can generate a flowing hot air flow and can discharge it bidirectionally towards the peripheral semiconductor wafers, so that the peripheral semiconductor wafers are in a dry heat environment; The clamping and brushing part (9) includes a plurality of clamping strips (91) arranged in the same direction as the bottom flat plate (4), and the plurality of clamping strips (91) are arranged facing each other in pairs. A plurality of first hanging blocks (92) and a plurality of second hanging blocks (93) are respectively installed at the upper ends of the plurality of clamping strips (91), and the plurality of first hanging blocks (92) and the plurality of second hanging blocks (93) are arranged at intervals. A base strip block (94) is arranged above the plurality of first hanging blocks (92) and the plurality of second hanging blocks (93) in the same direction. A first rectangular groove (95) and a second rectangular groove (96) are formed in the lower half of the base strip block (94) along the long side direction of the base strip block (94), and the second rectangular groove (96) is located behind the first rectangular groove (95). Two through grooves are formed in the upper half of the base strip block (94) and are respectively connected to the second rectangular groove (96) and the first rectangular groove (95). A plurality of first connecting plates (97) and a plurality of second connecting plates (98) are respectively slidably installed in the two through grooves. Two connecting strips (99) are respectively installed on the plurality of first connecting plates (97) and the plurality of second connecting plates (98). Two first electric push rods (991) are mirror-symmetrically arranged at both ends of the base strip block (94), and the output shafts of the two first electric push rods (991) are respectively connected to the two connecting strips (99); The plurality of clamping strips (91) are attached to the surface of the bottom flat plate (4), and the lower ends of the plurality of clamping strips (91) are all attached to the baffle (5); The plurality of first hanging blocks (92) are slidably installed in the first rectangular groove (95), and the plurality of first connecting plates (97) are respectively connected to the plurality of first hanging blocks (92); The plurality of second hanging blocks (93) are slidably installed in the second rectangular groove (96), and the plurality of second connecting plates (98) are respectively connected to the plurality of second hanging blocks (93); Synchronously drive the two first electric push rods (991) to synchronously pull the two connecting strips (99), the plurality of first connecting plates (97) and the plurality of second connecting plates (98) towards each other. One first electric push rod (991) pulls the plurality of clamping strips (91) connected to the plurality of first hanging blocks (92) in the same direction, while the other first electric push rod (991) pulls the plurality of clamping strips (91) connected to the plurality of second hanging blocks (93) in the opposite direction, so that every two facing clamping strips (91) gradually close until all the semiconductor wafers are clamped, and then stop driving the two first electric push rods (991).

2. The cleaning device for semiconductor wafers according to claim 1, wherein The clamping and brushing part (9) further includes a U-shaped plate (992) arranged in the same direction as the bottom flat plate (4) and installed on several of the struts (8), and the left open end of the U-shaped plate (992) faces the bottom flat plate (4). Two groups of several cleaning brushes (993) are installed inside the U-shaped plate (992) facing each other, a groove member (994) is horizontally placed at the top of the U-shaped plate (992), a tension member (995) with one end slidably installed in the groove member (994), an extension panel (996) connected to the side of the groove member (994) away from the tension member (995), and a second electric push rod (997) installed on the extension panel (996), and the output shaft of the second electric push rod (997) is connected to the tension member (995); The other end of the tension member (995) is integrally connected to the base strip (94); Several of the clamping strips (91) are aligned with the gaps between two groups of several cleaning brushes (993); The base strip (94) is higher than the top surface of the U-shaped plate (992).

3. The cleaning device for semiconductor wafers according to claim 2, wherein The lowering mechanism (10) includes several sinking grooves (101) formed on the surface of the U-shaped plate (992) and perpendicular to the groove member (994), a mounting plate member (102) installed at the lower end of the U-shaped plate (992), and a cylinder (103) provided on the mounting plate member (102); The output end of the cylinder (103) is connected to the middle part of the groove member (994); The bottom of the groove member (994) is slidably installed in several of the sinking grooves (101).

4. The cleaning device for semiconductor wafers according to claim 3, wherein The heat drying part (11) includes a hot air blower (12) provided on the linear moving mechanism (7), two transfer air boxes (13) installed on the side of the U-shaped plate (992), two outer blowing channels (14) respectively connected to the two transfer air boxes (13), an accumulation chamber (15) installed at the air outlet of the hot air blower (12), and two conveying pipes (16) with one end connected to the accumulation chamber (15) and the other end respectively connected to the two transfer air boxes (13); The two outer blowing channels (14) are obliquely arranged and face each other; The movement trajectories of several of the clamping strips (91) are located between the two outer blowing channels (14).

5. The cleaning device for semiconductor wafers according to claim 4, wherein The transmission mechanism (3) includes a reference table (31) horizontally installed on the fixing bracket (2), and several conveyor belts (32) linearly arranged on the reference table (31); Several of the conveyor belts (32) are respectively aligned with the gaps between several pairs of the clamping strips (91) arranged facing each other; Several of the along strips (6) are respectively close to several of the conveyor belts (32).

6. The cleaning device for semiconductor wafers according to claim 5, wherein Rubber strips (17) are installed on the opposite sides of several of the clamping strips (91).

7. The cleaning device for semiconductor wafers according to claim 6, characterized in that Several groups of guiding eaves (18) are installed on the top of the bottom flat plate (4), and several groups of the guiding eaves (18) are close to several of the second hanging blocks (93); Several groups of the guiding eaves (18) correspond to several of the conveyor belts (32) one by one.

8. The cleaning device for semiconductor wafers according to claim 7, characterized in that A receiving dish (19) is detachably installed on the bottom of the lower surface of the U-shaped plate (992).

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