Electronic system and method of dissipating waste heat

Abstract

The invention relates to an electronic system and a method of dissipating waste heat. Example embodiments relate to an electronic system that provides thermal management of a removable device when the removable device is connected to a master device of the electronic system that may include a receptacle and a heat transfer device having a first portion and a second portion. The main device has a cooling member. A removable device having a heat sink is removably coupled to the main device. A receptacle having a spring finger is coupled to one of the cooling component or the heat sink. The first portion is coupled to one of the cooling component or the heat sink, and the second portion protrudes outwardly. When the removable device is connected to the host device, the second portion extends through the receptacle such that the spring finger establishes a direct thermal interface with the second portion to allow waste heat to be transferred between the heat transfer device and one of the cooling component or the heat sink via the receptacle.

Description

[0001] This application is a divisional application of the Chinese patent application with an application date of October 26, 2021, application number 202111246449.2, and invention name “Electronic system and method for dissipating waste heat”. Technical Field

[0002] The present disclosure relates generally to cooling. Background Art

[0003] Removable devices, such as small form-factor pluggable (SFP) transceiver devices or non-volatile memory express (NVMe) storage drives, may consume greater amounts of power when performing their respective functions, such as transmitting data, receiving data, processing data, storing data, etc. As a result, the removable devices may generate excessive waste heat when performing their respective functions. If sufficient waste heat is not dissipated from the removable device, it may exceed the thermal specifications of the removable device and thereby degrade the performance, reliability, life expectancy of the removable device, and may also cause it to fail. Therefore, one or more heat sinks may be used to regulate waste heat in the removable device. Summary of the invention

[0004] In one aspect, the present disclosure provides an electronic system, comprising: a main device, the main device including a cooling component; a removable device, the removable device including a heat sink, wherein the removable device is capable of being detachably connected to the main device; a receptacle, the receptacle including a plurality of spring fingers, the plurality of spring fingers being coupled to one of the cooling component or the heat sink; and a heat transfer device, the heat transfer device including a first portion and a second portion, wherein the first portion is coupled to one of the cooling component or the heat sink and the second portion protrudes outwardly relative to the cooling component or the heat sink, wherein when the removable device is connected to the main device, the second portion extends through the receptacle so that the plurality of spring fingers establish a direct thermal interface with the second portion to allow waste heat to be transferred between the heat transfer device and one of the cooling component or the heat sink via the receptacle.

[0005] In one aspect, the present disclosure provides an electronic system comprising: a main device, the main device comprising a main circuit board, a connector coupled to the main circuit board, and a cooling component; a heat transfer device, the heat transfer device comprising a first portion and a second portion, wherein the first portion is coupled to the cooling component and the second portion protrudes outwardly relative to the cooling component; and a receptacle, the receptacle comprising a plurality of spring fingers, wherein a removable device is removably connectable to the main device, wherein the removable device comprises a circuit board and a heat sink is coupled to the circuit board to dissipate waste heat generated from the circuit board, wherein the receptacle is coupled to the heat sink, and wherein, when the removable device is connected to the main device, the circuit board is communicatively coupled to the main circuit board through the connector, and the second portion extends through the receptacle so that the plurality of spring fingers establish a direct thermal interface with the second portion to allow the waste heat to be transferred from the heat sink to the cooling component via the receptacle and the first portion and the second portion of the heat transfer device.

[0006] In one aspect, the present disclosure provides a method, comprising: connecting a removable device to a main device of an electronic system via a connector of the main device to communicatively couple a circuit board of the removable device to a main circuit board of the main device, wherein the removable device includes a heat sink coupled to the circuit board to dissipate waste heat generated from the circuit board, wherein the main device includes a cooling component, wherein the electronic system further comprises: a receptacle; and a heat transfer device comprising a first portion and a second portion, wherein the receptacle comprises a plurality of spring fingers coupled to one of the cooling component or the heat sink, and wherein the first portion is coupled to one of the cooling component or the heat sink and the second portion protrudes outwardly relative to the cooling component or the heat sink; extending the second portion through the receptacle to allow the plurality of spring fingers to establish a direct thermal interface with the second portion by compressing each spring finger inwardly and applying a spring force on the second portion; and transferring the waste heat between the heat transfer device and one of the cooling component or the heat sink via the receptacle. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Various examples will be described below with reference to the following drawings.

[0008] Figure 1A A perspective view of a main device having a cooling member according to an example embodiment of the present disclosure is illustrated.

[0009] Figure 1B A perspective view of a removable device having a heat spreader according to an example embodiment of the present disclosure is illustrated.

[0010] Figure 1C An exemplary embodiment according to the present disclosure is shown. Figure 1B A perspective view of an electronic system of a removable device that is detachably connected to Figure 1A main device.

[0011] Figure 1D A side view of an electronic system according to an example embodiment of the present disclosure is illustrated.

[0012] Figure 2A A perspective view of a cooling part of a main device according to another example embodiment of the present disclosure is illustrated.

[0013] Figure 2B A perspective view of a removable device having a heat sink according to another example embodiment of the present disclosure is illustrated.

[0014] Figure 3A A block diagram of a receptacle disposed within a cooling component is illustrated according to an example embodiment of the present disclosure.

[0015] Figure 3B A block diagram of a receptacle disposed within a cooling component according to another example embodiment of the present disclosure is illustrated.

[0016] Figure 3C A block diagram of a receptacle disposed within a cooling component according to yet another example embodiment of the present disclosure is illustrated.

[0017] Figure 4A A perspective view of a portion of a main device having a cooling member according to still another example embodiment of the present disclosure is illustrated.

[0018] Figure 4B A perspective view of a removable device having a heat sink according to yet another example embodiment of the present disclosure is illustrated.

[0019] Figure 4C A diagram showing another exemplary embodiment of the present disclosure having Figure 4B A perspective view of an electronic system of a removable device connected to Figure 4A main device.

[0020] Figure 5 A flow chart depicting a method of thermal management of a removable device according to an example embodiment of the present disclosure is illustrated. DETAILED DESCRIPTION

[0021] The following detailed description refers to the accompanying drawings. Whenever possible, the same reference numerals are used in the accompanying drawings and the following description to refer to the same or similar parts. However, it will be clearly understood that the drawings are only for the purpose of illustration and description. Although several examples are described in this document, modifications, adaptations and other embodiments are also possible. Therefore, the following detailed description does not limit the disclosed examples. On the contrary, the appropriate scope of the disclosed examples can be limited by the attached claims. The terms used herein are only for the purpose of describing the example embodiments and are not intended to be restrictive. As used herein, the singular forms "a", "an" and "the" are also intended to include plural forms unless the context clearly indicates otherwise. As used herein, the term "multiple" is defined as two or more. As used herein, the term "another" is defined as at least the second or more. As used herein, the term "coupled" is defined as connected, whether directly without any intermediate element or indirectly using at least one intermediate element, unless otherwise indicated. Two elements can be mechanically, electrically coupled or communicatively linked through a communication channel, path, network or system. As used herein, the term "and / or" refers to and encompasses any and all possible combinations of one or more of the associated listed items. It will also be understood that although the terms first, second, third, etc. may be used herein to describe various elements, these elements should not be limited by these terms as these terms are only used to distinguish one element from another unless otherwise stated or the context indicates otherwise. As used herein, the term "includes" means including but not limited to, and the term "including" means including but not limited to. The term "based on" means based at least in part on.

[0022] As used herein, the term "main device" may refer to a type of computing device (such as a server device, a storage device, a power conversion device, or a networking device) having a connector or modular port for receiving a removable device. As used herein, the term "removable device" may refer to a type of connectable electronic device that is not inherent to the main device, or it is attached to the main device, and may have to be connected by being inserted into a modular port of the main device for transmission, reception, storage, or processing of data. For example, a removable device may be a pluggable transceiver device or a pluggable storage drive, etc. The term "modular port" may refer to a type of electronic connector that is inherent to the main device, or it is integrated with the main device, and a removable device can be detachably connected to the main device. As used herein, the term "electronic system" may refer to a type of computing infrastructure, such as a rack or housing, in which removable devices and main devices can act as plugs and sockets of computing infrastructure. Further, the term "connectable" may refer to the assembly or insertion of a removable device into a modular port of a main device by inserting or sliding the removable device into the modular port / socket of the main device. Further, as used herein, the term "thermal interface" may refer to the surfaces of two components that are in direct or indirect contact with each other to establish thermal communication therebetween so as to allow waste heat to be transferred between those two components. As used herein, the term "direct thermal interface" may refer to the surfaces of two components that are in direct contact with each other to form an interface therebetween and allow waste heat to be directly transferred between the two components. For example, a direct thermal interface may be formed by direct contact of the dry contact surface of each spring finger with a portion of a heat transfer device, wherein there is no intermediate component (i.e., gap pads, grease, foam, etc.) between those two surfaces. The term "dry contact surface" may refer to a surface area of ​​each spring finger that is configured to contact a mutually opposing surface or portion (mating surface or portion) of another component (e.g., that portion of the peripheral surface of the heat transfer device) to directly transfer waste heat therebetween without the presence of an intermediate component. As used herein, the term "cold plate" may refer to a type of thermally conductive component that may include internal tubing through which a liquid coolant is forced to flow in order to absorb waste heat transferred to the cooling component by a waste heat generating component (e.g., a circuit board of a removable device, or one or more electronic components mounted on a circuit board). In some examples, a cold plate may also be referred to as a liquid-cooled dissipator. Further, the term "heat sink" may refer to a type of passive heat exchanger that may transfer waste heat generated by a waste heat generating component to a fluid medium (such as air or liquid coolant flowing through the heat sink).It may be noted herein that an object, device, or assembly (which may include multiple different bodies that are thermally coupled, and may include multiple different materials) is in "thermal communication" or "thermal conduction" between two surfaces (forming an interface) if any of the following is true: (i) a temperature difference between the two surfaces results in a heat flux through the interface, (ii) the object is a continuous piece of material having a thermal conductivity (often denoted as k, λ, or κ) between the interfaces of about 200 W / mK to about 5000 W / mK, or (iii) the object is a heat pipe, a vapor chamber, a continuous copper body, or a continuous aluminum body. For example, examples of materials with thermal conductivities between the above ranges include certain types of copper, aluminum, silver, and gold.

[0023] The present disclosure describes an example implementation of an electronic system that provides thermal management of a removable device when the removable device is connected to a main device of the electronic system. According to one or more examples of the present disclosure, the electronic system may include a main device, a removable device, a receptacle, and a heat transfer device. In such an example, the main device may include a cooling component, and the removable device may include a heat sink. The receptacle may include a plurality of spring fingers, which are coupled to one of the cooling component or the heat sink. The heat transfer device includes a first portion and a second portion. The first portion of the heat transfer device is coupled to one of the cooling component or the heat sink, and the second portion of the heat transfer device protrudes outwardly relative to one of the cooling component or the heat sink. In such an example, when the removable device is connected to the main device, the second portion of the heat transfer device extends through the receptacle so that the plurality of spring fingers establish a direct thermal interface with the second portion to allow waste heat to be transferred between the heat transfer device and one of the cooling component or the heat sink via the receptacle.

[0024] For purposes of explanation, certain examples are described with reference to the components illustrated in FIGS. 1-5 . However, the functionality of the illustrated components may overlap and may exist in a fewer or greater number of elements and components. Further, all or a portion of the functionality of the illustrated elements may coexist or be distributed among several geographically dispersed locations. Moreover, the disclosed examples may be implemented in a variety of environments and are not limited to the illustrated examples. Further, in conjunction with Figure 5 The described sequence of operations is an example and is not intended to be limiting. Additional or fewer operations or combinations of operations may be used or changed without departing from the scope of the disclosed examples. Therefore, the present disclosure only sets forth possible examples of implementations, and many changes and modifications may be made to the described examples. Such modifications and variations are intended to be included within the scope of the present disclosure and are protected by the following claims.

[0025] A removable device (e.g., a communication device or a storage drive) may be a compact and hot-swappable electronic device / drive for transmitting, receiving, processing, or storing data. In some examples, when connected to a host device (such as a networking device), a communication device (e.g., a small form-factor pluggable (SFP) transceiver) may act as an intermediate component between a networking device connector (such as a switch, router, firewall, or network card (or NIC) of a network device) and an interconnect cable (such as a copper cable or optical fiber coupled to the transceiver). Typically, in such an example, the transceiver converts an electrical signal into an optical signal or vice versa for transmitting or receiving data through an interconnect cable. Therefore, the transceiver may consume a greater amount of power to convert the signal, and may thereby generate excessive waste heat. In some other examples, when connected to a host device (such as a storage device), a storage device (e.g., a non-volatile memory express (NVMe) storage drive) may act as an intermediate component between a peripheral component interconnect express (PCIe) connector of the storage device and a cable connecting the NVMe storage drive. Typically, in such an example, the NVMe storage drive may process, store, and transmit data through a cable. As a result, NVMe storage drives may consume greater amounts of power to process, store, and transfer data, and may thereby generate excess waste heat.

[0026] In this example, if the excessive waste heat generated by the removable device is not fully dissipated, it may degrade the performance, reliability, expected life of the removable device, and may also cause its failure. Therefore, the heat sink is arranged to be thermally connected to the removable device so as to dissipate the waste heat from the removable device. In this example, the cooling air transmitted by the heat sink is used to remove the waste heat from the heat sink. However, when the removable device is connected to the main device, the heat sink may not receive enough cooling air supply to remove the waste heat from the heat sink. Therefore, the main device may provide a cooling component to remove the waste heat from the heat sink. In some examples, the cooling component may establish a thermal interface (or thermal contact) with the heat sink to transfer the waste heat from the heat sink to the cooling component for removing the waste heat from the heat sink. However, it may be difficult to maintain thermal contact between the cooling component and the heat sink because the docking surface of the cooling component and the heat sink may be uneven and / or not smooth. Moreover, the accumulation of debris and / or surface defects (i.e., scratches, dents, etc.) may impair the heat transfer between the docking surfaces. Further, it may be difficult to generate an optimal contact force / pressure to maintain thermal contact or a thermal interface between the mating surfaces. In some other examples, the cooling component and the heat sink may establish and maintain a thermal interface therebetween via an intermediate component to remove waste heat from the heat sink. However, the mating component (i.e., the intermediate component, and one of the heat sink or cooling component) may also have surface defects or may not have a smooth surface.

[0027] Therefore, in order to solve the above problems, a TIM (such as a thermally conductive gap pad or thermal grease) may be provided between the docking components. However, repeatedly inserting / unplugging the removable device into / from the main device may cause the gap pad to peel off or may degrade the gap pad over a period of time. Similarly, repeatedly inserting / unplugging the removable device into / from the main device may make the thermal grease dirty, easily scraped off the main device (when the removable device slips (slides) into the main device), or must be replaced after each service event. Further, when the TIM is provided between the docking components, the electronic system may need to apply a force (i.e., a load) to establish and maintain a thermal interface between the docking components via the TIM. In other words, in order to establish and maintain thermal connectivity between the docking components via the TIM, the load may have to be optimal (i.e., limited or restricted) on the docking components. However, if the load is transferred from the docking component to any other component of the removable device, it may damage those components. For example, the removable device discussed above may include an open device structure (e.g., a circuit board and / or one or more electronic components mounted on a circuit card and directly exposed to the external environment), and may be damaged due to the load transmitted from the docking component. In other words, since the one or more electronic components (such as a processing resource mounted on a circuit board, and / or a ball grid array (BGA) for mounting the processing resource to the circuit board) are pressure-sensitive components, they may be broken due to the load transmitted from the docking component.

[0028] Further, during the process of connecting and disconnecting the removable device from the host device, the cooling component of the host device or the heat sink of the removable device may apply a resistance force that is opposite to the insertion force applied to connect the removable device to the host device or the withdrawal force applied to disconnect the removable device from the host device. In such an example, it is extremely difficult to maintain an optimal resistance force within acceptable safety limits to avoid injuries associated with repeated forces (e.g., insertion force or withdrawal force).

[0029] A technical solution to the above problem may include providing an electronic system for thermally managing a removable device when the removable device is connected to a main device of the electronic system. In one or more examples, the electronic system may include a main device, a removable device, a receptacle, and a heat transfer device. The main device may include a cooling component, and the removable device may include a heat sink. The receptacle may include a plurality of spring fingers, which are coupled to one of the cooling component or the heat sink. The heat transfer device includes a first portion and a second portion, wherein the first portion is coupled to one of the cooling component or the heat sink, and the second portion protrudes outward relative to one of the cooling component or the heat sink. In some examples, when the receptacle is arranged to be in thermal contact and coupled to the cooling component, the first portion of the heat transfer device is arranged to be in thermal contact and coupled to the heat sink. In such an example, when the removable device is detachably connected to the main device, the second portion of the heat transfer device extends through the receptacle so that the plurality of spring fingers establish a direct thermal interface with the second portion to allow waste heat to be transferred from the heat sink to the cooling component via the heat transfer device and the receptacle. In some other examples, when the receptacle is disposed in thermal contact and coupled to the heat sink, the first portion of the heat transfer device is disposed in thermal contact and coupled to the cooling component. In such examples, when the removable device is removably connected to the host device, the second portion of the heat transfer device extends through the receptacle so that the plurality of spring fingers establish a direct thermal interface with the second portion to allow waste heat to be transferred from the heat sink to the cooling component via the receptacle and the heat transfer device. In some examples, the heat transfer device is a heat pipe. In some other examples, the heat transfer device is a vapor chamber.

[0030] In one or more examples, each spring finger can apply an optimal contact force to allow the removable device to be easily inserted into (e.g., inserted into or slid into) the main device. For example, when the removable device is inserted into the main device, each spring finger can be compressed so as to be slightly deflected toward the frame of the receptacle. However, the optimal spring force applied by each of the plurality of spring fingers can be sufficient to establish a direct thermal interface between the dry contact surface of each spring finger and the heat transfer device. In other words, the plurality of spring fingers can provide multiple (arrays) of contact forces or spring forces to generate a substantially low insertion force for inserting the removable device into the main device. At the same time, the plurality of spring fingers can provide multi-point contact conductive cooling of the removable device through the plurality of spring fingers to achieve effective thermal management of the removable device.

[0031] In some examples, the multiple contact forces or spring forces applied by the plurality of spring fingers are within acceptable safety limits to avoid injuries associated with repeated forces (e.g., insertion forces or removal forces). For example, the contact force or spring force applied by each spring finger may be in the range of from about 0.04 lbf to 0.08 lbf. In some examples, each of the plurality of spring fingers may deflect in the range of from about 0.5 mm to 1.0 mm to allow the removable device to be easily inserted into the host device. Even if the heat transfer device has an uneven surface, an uneven surface, surface defects or debris, the plurality of spring fingers may be able to maintain multiple points of contact with the heat transfer device because each spring finger may independently generate an optimal spring force to establish a direct thermal interface with the heat transfer device. Further, since each spring finger may independently apply a spring force on the peripheral surface of the heat transfer device using a substantially small surface area dry contact surface, the plurality of spring fingers may further maintain multiple points of contact with the heat transfer device having the above-mentioned problems associated with the surface. In some examples, the surface area of ​​the dry contact surface of each spring finger can be in a range from about 0.2 square millimeters to 0.6 square millimeters. Further, because the plurality of spring fingers are configured to establish a direct thermal interface with the heat transfer device, the need for a TIM to establish a thermal interface between the receptacle and the heat transfer device can be avoided. Therefore, the use of the plurality of spring fingers can overcome the above-mentioned problems associated with TIMs.

[0032] Further, because the amount of force applied by the plurality of spring fingers of the receptacle on the heat transfer device is controllable, the examples described herein may not allow the load of the docking component (i.e., the receptacle and the heat transfer device) to be transferred to any other component of the removable device (e.g., at least one of the circuit board, the one or more electronic components mounted on the circuit board, or a BGA for mounting the one or more electronic components on the circuit board). Therefore, the examples described herein may prevent the load from being transferred from the docking component to the circuit board, the one or more electronic components, or the BGA, and prevent damage to those components.

[0033] Figure 1A An electronic system 100 (eg, Figure 1C and Figure 1D ) is a perspective view of a host device 102 having a cooling component 106. In one or more examples, the host device 102 can be a computing device (such as a server device, a storage device, a power conversion device, or a networking device) having a modular connector. Figure 1A In one or more examples, the main device 102 is a networked device. In one or more examples, the main device 102 further includes a partially open housing 110 and a connector 112.

[0034] The partially open housing 110 is defined by a cover 114, a pair of side rails 116, and a rear panel 118. Each of the pair of side rails 116 is coupled to one peripheral side of the cover 114. The rear panel 118 is coupled to the rear side of the cover 114 and the pair of side rails 116. The rear panel 118 includes a cutout to allow the connector 112 to be inserted and coupled to the rear panel 118. Each of the pair of side rails 116 includes a plurality of through openings 120 to allow the housing 110 to be coupled to the base (such as screws, rivets, etc.) of the electronic system 100 using fasteners (such as screws, rivets, etc.). Figure 1A 106 is coupled to the housing 110. When the removable device 104 (e.g. Figure 1B , Figure 1C and Figure 1D ), the front side of the housing 110 can receive the removable device when connected to the main device 102.

[0035] When the removable device 104 is connected to (inserted into) the housing 110 of the host device 102, the connector 112 (or modular port) of the host device 102 can communicatively couple the removable device to the host device 102. For example, the connector 112 can have a slot (or socket) to receive a plug (i.e., a portion of a circuit board (not shown)) of the removable device 104 and communicatively couple the removable device 104 to the host device 102. In some examples, the connector 112 can be a networking device connector, a USB connector, a peripheral component interconnect express (PCIe) connector, etc. It can be noted herein that the terms "connector" and "modular port" can be used interchangeably. In Figure 1A , Figure 1C and Figure 1D In the example of FIG. 1 , the connector 112 is a network switch that allows the removable device 104 to be removably coupled to the host device 102 .

[0036] exist Figure 1A In one or more examples, the cooling component 106 is a thermally conductive component that can be configured to be connected to the heat sink 106 via the receptacle 136 and the heat transfer device 150 (in Figure 1B , Figure 1C and Figure 1D ) and the heat sink 108 (shown in Figure 1B , Figure 1C and Figure 1D ) is thermally connected and may include several provisions to allow liquid coolant to flow through it for dissipating waste heat from the cooling component 106.

[0037] exist Figure 1AIn the examples, the cooling component 106 is a square heat conductive component. In some examples, the cooling component 106 is composed of a plurality of blocks 126 and a plenum 128 disposed between and coupled to the plurality of blocks 126. In one or more examples, each of the plurality of blocks 126 has a first recess 130. In some examples, a pair of first blocks 126A of the plurality of blocks 126 are disposed and coupled to each other in succession, such that the first recesses of the pair of first blocks 126A are aligned and extend between a first end 132 and a second end 134 of the cooling component 106. Similarly, a pair of second blocks 126B of the plurality of blocks 126 are disposed and coupled to each other in succession, such that the first recesses of the pair of second blocks 126B are aligned and extend between the first end 132 and the second end 134. Figure 1A In the example of FIG. 1 , the cooling member 106 includes the plurality of blocks 126 in number of four and a collection chamber 128 .

[0038] The collection chamber 128 includes a pair of peripheral walls 138, a front wall 140, a rear wall 142, a cover 144, and a base (not labeled), which are coupled to each other to define a hollow space therebetween. In some examples, the rear wall 142 has a fluid inlet 146 and a fluid outlet 148. In one or more examples, the pair of peripheral walls 138 are coupled to the plurality of blocks 126 so that the collection chamber 128 is in thermal contact with the plurality of blocks 126. Further, the front wall 140 includes a second protrusion 152 having a plurality of second through recesses 154. In some examples, the second protrusion 152 is disposed above the first protrusion 122 so that the plurality of first through recesses 124 and the plurality of second through recesses 154 are aligned with each other to allow the cooling component 106 to be coupled to the housing 110 via fasteners (such as screws, rivets, etc.). In some examples, the collection chamber 128 may further include an internal passage (not shown) disposed within the hollow space and extending between the fluid inlet 146 and the fluid outlet 148, and such internal passage may be integral to the body of the collection chamber 128. In some examples, the internal passage may include features such as fins, an array of pin-like fins, and surface roughening to increase the amount of its surface area exposed to the liquid coolant. In some other examples, the internal passage may also include other features, such as turbulators that enhance turbulence in the flow of the liquid coolant. In one or more examples, features that enhance surface area or turbulence may result in increased thermal properties of the liquid coolant. In some other examples, the collection chamber 128 may include a tube or pipe extending through the hollow space of the collection chamber 128, wherein the tube or pipe may be a different part from the body of the collection chamber 128.

[0039] In some examples, the fluid inlet 146 may be coupled to the inlet channel 155, and the fluid outlet 148 may be coupled to the outlet channel 156. In such examples, a sealant (e.g., a gasket, an adhesive, an O-ring, etc.) may be used to seal the fluid inlet 146 and the fluid outlet 148 to the inlet channel 155 and the outlet channel 156, respectively. In some other examples, the fluid inlet 146 and the fluid outlet 148 may be welded or brazed to the inlet channel 155 and the outlet channel 156, respectively. In one or more examples, the inlet channel 155 may be further coupled to a supply line manifold (not shown), which is fluidly connected to a coolant distribution unit (not shown). Similarly, the outlet channel 156 may be further coupled to a return line manifold (not shown), which is fluidly connected to the coolant distribution unit. In some examples, the coolant distribution unit may be a rack-level liquid cooling system, a row-level liquid cooling system, a data center-level liquid cooling system, etc. In one or more examples, the coolant distribution unit may include a pump (not shown) configured to supply liquid coolant to the plenum 128 of the cooling component 106 via the supply line manifold and the inlet channel 155, and to receive heated liquid coolant from the plenum 128 of the cooling component 106 via the outlet channel 156 and the return line manifold. It may be noted herein that the coolant distribution system may include a heat exchanger (not shown) to remove waste heat from the heated liquid coolant and regenerate the liquid coolant. The process of supplying liquid coolant and receiving heated liquid coolant may continue as discussed above.

[0040] In one or more examples, the receptacle 136 is a thermally conductive component that can be disposed in thermal contact with and coupled to the cooling component 106. For example, the receptacle 136 is disposed along and coupled to at least a portion of the first recess 130 such that an outer surface of the frame 157 of the receptacle 136 is in thermal contact with an inner surface of the cooling component 106 (e.g., a block in the plurality of blocks 126). Figure 1A In the example of , at least one receptacle 136 is disposed in the first recess 130 of each of the plurality of blocks 126. The frame 157 of the receptacle 136 can be soldered to the inner surface of the cooling member 106 (e.g., a block of the plurality of blocks 126). In some examples, the solder can include a thermally conductive material, such as a copper material, an aluminum material, etc.

[0041] The receptacle 136 further includes a plurality of spring fingers 158 disposed in thermal contact with a frame 157 of the receptacle 136. In one or more examples, each of the plurality of spring fingers 158 is a thermally conductive component. In some examples, the plurality of spring fingers 158 are spaced apart from one another along a circumferential direction 10 of the electronic system 100 to form an array of spring fingers (e.g., as shown in FIG. 1 ). Figures 3A-3CIn one or more examples, each of the plurality of spring fingers 158 can be defined by a first end, a second end, and a body interconnecting the first end and the second end. Figure 1A In an example, each of the plurality of spring fingers 158 is a cantilever spring finger 158A. In such an example, the first end, the second end, and the body of each spring finger 158 may have substantially the same dimensions (e.g., width, thickness) to define a spring finger 158 having a cantilever geometry. Further, the first end and the second end may be maintained at different heights by the body. The first end may be coupled to a portion of the frame 157 of the receptacle 136, and the second end may have a dry contact surface. In such an example, the first end may be soldered to an inner surface of the frame 157. In some examples, the solder may include a thermally conductive material, such as a copper material, an aluminum material, etc. In such an example, when the removable device 104 (having the heat transfer device 150 coupled to the heat sink 108) is inserted into the main device 102, the second end of each spring finger 158 can be compressed to slightly deflect inward (e.g., toward the frame 157), wherein the deflection is in the range of from about 0.5 mm to 1.0 mm to establish a direct thermal interface (or contact) with the heat sink 108 of the removable device 104 via the heat transfer device 150. In some examples, each of the plurality of spring fingers 158 is a discrete component. In some other examples, the first end of each of the plurality of spring fingers 158 can be coupled to or merged with each other to form a circular strip of the plurality of spring fingers 158.

[0042] In some examples, the cooling member 106, the receptacle 136, and the plurality of spring fingers 158 may be formed of a thermally conductive material, such as copper, aluminum, etc. The first protrusion 122 and the second protrusion 152 may be formed of a ferrous material, such as steel, etc. The inlet channel 155 and the outlet channel 156 may be formed of a polymer material. Further, each of the inlet channel 155 and the outlet channel 156 may be a flexible channel, respectively.

[0043] Figure 1B An electronic system 100 (eg, Figure 1C and Figure 1D ) is a perspective view of a removable device 104 having a heat sink 108. In one or more examples, the removable device 104 can be a connectable electronic device (or pluggable electronic device), such as a communication device or a storage device. In some examples, the communication device can be a small form factor pluggable (SFP) transceiver, a quad small form factor pluggable transceiver coupled to an active optical cable (AOC), and the like. Similarly, the storage device can be a non-volatile memory express (NVMe) storage drive, and the like. It may be noted herein that the terms "removable device," "removable electronic device," "pluggable removable device," and "connectable electronic device" are used interchangeably. In Figure 1B In one or more examples, the removable device 104 is a transceiver. In one or more examples, the removable device 104 further includes a partially open housing 192, a plurality of external connectors 194, a pair of latches 196, an optical assembly 198, a circuit board 200, and one or more electronic components ( Figure 1B not shown).

[0044] The partially open housing 192 is defined by a base 208, a pair of peripheral walls 210, and a rear panel 212. Each of the pair of peripheral walls 210 is coupled to one peripheral side of the base 208. The rear panel 212 is coupled to the rear side of the base 208 and the pair of peripheral walls 210. The rear panel 212 may include a cutout (not shown) to allow the pair of external connectors 194 to be inserted and coupled to the circuit board 200 and / or the optical assembly 198 via a suitable communication mechanism (e.g., cabling, etc.). Each of the pair of peripheral walls 210 includes a plurality of through openings 214 to allow corresponding latches of the pair of latches 196 to be coupled to the housing 192 of the removable device 104. Each of the pair of external connectors 194 may receive an optical cable 202, etc. For example, each external connector 194 may have a slot (or receptacle) to receive the optical cable 202 and communicatively couple the optical cable 202 to the circuit board 200 and / or the optical assembly 198. In some examples, circuit board 200 can be a rectangular or square semiconductor component mounted on and coupled to base 208 of housing 192. In some examples, the one or more electronic components can include a processor, capacitors, resistors, and the like.

[0045] The heat sink 108 is disposed at the front side of the removable device 104. In some examples, the heat sink 108 is mounted on the circuit board 200 and / or the one or more electronic components. For example, the heat sink 108 can be coupled to the base 208 of the housing 192 via the circuit board 200 using a plurality of spring-loaded shoulder screws 206. In such an example, the plurality of spring-loaded shoulder screws 206 are inserted through a plurality of through openings (not labeled) of the heat sink 108 so as to couple the heat sink 108 to the base 208. In some examples, the heat sink 108 is in thermal communication with the circuit board 200 and / or the one or more electronic components. For example, each of the plurality of spring-loaded shoulder screws 206 can apply an optimal load / force on the heat sink 108 so that the flat lower surface 167 of the heat sink 108 is in direct thermal communication with the one or more electronic components or the circuit board 200. In some other examples, the flat lower surface 167 of the heat sink 108 can be in indirect thermal communication with the circuit board and / or one or more electronic components of the circuit board 200 via a TIM. In some examples, a TIM may be a polymer matrix (such as epoxy or silicone resin) and a thermally conductive filler (such as boron nitride, alumina, aluminum, zinc oxide, silver, etc.).

[0046] exist Figure 1B In the example of , the heat sink 108 is a rectangular thermally conductive solid component. As discussed herein, the heat sink 108 can establish direct thermal contact with a heat source (e.g., the circuit board 200 and / or one or more electronic components mounted on the circuit board 200) via the flat lower surface 167. In this example, the heat sink 108 can further include an upper surface 169 having a second recess 160. Figure 1B In the example of FIG. 1 , the second recess 160 is a curved recess having a first end portion 160A and a second end portion 160B, which are positioned to be spaced apart from each other and disposed at a front end 162 of the heat sink 108 .

[0047] In one or more examples, the electronic system 100 may further include a heat transfer device 150. In some examples, the heat transfer device 150 may be a heat conducting component. Figure 1B In some non-limiting examples, the heat transfer device 150 is a heat pipe 150A. In some non-limiting examples, the heat transfer device 150 can be a heat sink (such as Figure 4B ). Figure 1BIn the example of , the heat pipe 150A is a "U" shaped component. For example, the heat pipe 150A has a first portion 150A1, a pair of second portions 150A3, and a pair of body portions 150A2 interconnecting the first portion 150A1 and the pair of second portions 150A3. In some examples, the first portion 150A1 can be an evaporator section of the heat transfer device 150, and the pair of second portions 150A3 can be a condenser section of the heat transfer device 150. Figure 1B In the example of, the first portion 150A1 is a curved portion, which may have a profile complementary to the profile of the second recess 160 of the heat sink 108. Further, each second portion of the pair of second portions 150A3 may be a straight portion of the heat pipe 150A. Similarly, each body portion of the pair of body portions 150A2 may be a straight upwardly inclined portion of the heat pipe 150A. In one or more examples, the heat pipe 150A may be a two-phase heat transfer device with a very high effective thermal conductivity. In one or more examples, the heat pipe 150A may be a vacuum-tight device having a housing, a working fluid, and a wick structure. During operation, waste heat conducted from a heat source (e.g., the heat sink 108) to the heat pipe 150A may vaporize the working fluid (liquid phase) inside the wick structure in the first portion 150A1. Then, the saturated vapor (gas phase) carrying the latent heat of vaporization may flow to the pair of second portions 150A3 via the pair of body portions 150A2. In the pair of second parts 150A3, the saturated steam can condense and release its latent heat to the cooling member 106 to regenerate the working fluid (liquid phase). The condensed liquid can return to the first part 150A1 by capillary action through the wicking structure. As long as the temperature gradient is established and maintained between the first part 150A1 and the pair of second parts 150A3, the phase change process and the two-phase flow cycle will continue.

[0048] In one or more examples, the heat transfer device 150 can be disposed along the second recess 160 and coupled to the heat sink 108 via welding. For example, the welding can include a thermally conductive material, such as a copper material, an aluminum material, etc. Figure 1B In the example of the embodiment of the present invention, the first portion 150A1 is disposed along the second recess 160 and coupled to the heat sink 108. The pair of body portions 150A2 are disposed on a portion of the circuit board 200 so that a gap (not labeled) is formed between the pair of body portions 150A2 and the circuit board 200. The pair of second portions 150A3 can extend outward beyond the circuit board 200. For example, the pair of second portions 150A3 can protrude outward relative to the heat sink 108. In one or more examples, the heat sink 108 and the heat transfer device 150 can be formed of a thermally conductive material, such as copper, aluminum, etc.

[0049] Figure 1C Describes the Figure 1BA perspective view of an electronic system 100 with a removable device 104 that is removably connected to Figure 1A The main device 102. Similarly, Figure 1D Depicted Figure 1C 1 is a side view of an electronic system 100. It may be noted herein that for ease of illustration, Figure 1C This is not shown in the example Figure 1A The housing 110 and connector 112 of the main device 102 are depicted in the example of FIG. 1 , and such illustration should not be construed as limiting the present disclosure.

[0050] In some examples, electronic system 100 is a computing infrastructure, such as a rack or housing of a data center having a host device 102 (such as a server device, a storage device, a power conversion device, or a networking device) and a removable device 104 (such as a data communication device or a storage drive). In one or more examples, removable device 104 and host device 102 can act as a plug and socket of the computing infrastructure. Figure 1C and Figure 1D In the example of the present invention, the main device 102 is a networking device having a connector, and the removable device 104 is a data communication device having a transceiver. In some examples, the connector can be an Ethernet switch, and the transceiver can be an SFP transceiver coupled to an AOC (not shown) or a QSFP transceiver coupled to an AOC.

[0051] refer to Figure 1D , the removable device 104 can be slidably inserted into the housing 110 of the main device 102 so as to detachably couple the removable device 104 to the main device 102. For example, when the removable device 104 is connected to the main device 102, a portion 200A of the circuit board 200 of the removable device 104 is inserted into the slot 112A of the connector 112 of the main device 102. In other words, the circuit board 200 of the removable device 104 can be communicatively coupled to the circuit board (not shown) of the main device 102 via the connector 112. Therefore, when the removable device 104 is connected to the main device 102, it can remain in an immovable state because the portion 200A of the circuit board 200 is inserted into the slot 112A of the connector 112. In this example, a pair of second portions 150A3 of the heat transfer device 150 are connected to the main device 102 via the receptacle 136 (such as Figure 1A ) is inserted into the main device 102. In this example, the plurality of spring fingers 158 (as shown in FIG. Figure 1A ) can establish a direct thermal interface with each of the pair of second portions 150A3 of the heat transfer device 150 to allow for thermal transfer via the receptacle 136 (e.g., via the frame 157 of the receptacle 136 and each spring finger 158 (in Figure 1AAs shown in FIG. 1 , the heat removal device 104 is inserted into the main device 102 to transfer the waste heat from the heat transfer device 150 to the cooling component 106.

[0052] In one or more examples, a first heat conduction (low resistance) path can be created between a heat source, such as the circuit board 200 (and / or the one or more electronic components), the heat sink 108, and the first portion 150A1 of the heat transfer device 150. Similarly, a second heat conduction path can be created between each second portion 150A3 of the heat transfer device 150, the plurality of spring fingers 158, the frame 157, and the cooling member 106. Further, a third heat conduction path can be created between the cooling member 106 and the liquid coolant circulating within the cooling member 106. Therefore, the electronic system 100 achieves: i) dissipating waste heat from the circuit board 200 (and / or electronic components) to the heat sink 108, ii) transferring waste heat from the heat sink 108 to the heat transfer device 150, iii) transferring waste heat from the first part 150A1 to the pair of second parts 150A3, iv) transferring waste heat from the heat transfer device 150 to the cooling component 106 via the receptacle 136, and v) dissipating waste heat from the cooling component 106 to the liquid coolant.

[0053] In particular, during operation of the electronic system 100, the one or more electronic components of the removable device 104 and / or the circuit board 200, the external connector 194, and the optical assembly 198 may operate in tandem to transmit, receive, process, or store data. Therefore, the removable device 104 may consume a greater amount of power and may thereby generate an increased amount of waste heat. In such an example, the heat sink 108 coupled to the circuit board 200 and / or the one or more electronic components coupled to the circuit board 200 may dissipate waste heat from those devices toward the heat pipe 150A. In some examples, the cooling liquid filled in the first portion 150A1 of the heat pipe 150A may absorb waste heat to help dissipate waste heat from the circuit board 200 and / or the plurality of electronic components to the heat pipe 150A. The pair of body portions 150A2 of the heat pipe 150A may transfer waste heat to the pair of second portions 150A3 of the heat pipe 150A. The plurality of spring fingers 158, which are in thermal contact with the pair of second portions 150A3 of the heat pipe 150A, may transfer waste heat from the heat pipe 150A to the frame 157 of the receptacle 136. For example, the dry contact surface of each spring finger 158, which is in thermal contact with the outer peripheral surface of the pair of second portions 150A3, transfers the dissipated waste heat from the removable device 104 to the receptacle 136 via the plurality of spring fingers 158 and the frame 157. Further, the receptacle 136 may transfer the waste heat to the cooling member 106, for example, to the plurality of blocks 126 of the cooling member 106. Later, the cooling liquid flowing in the plenum 128 may absorb the waste heat from the plurality of blocks 126 of the cooling member 106 and generate heated coolant (not labeled), thereby cooling the cooling member 106. The heated cooling liquid may be pumped to the outside of the electronic system 100 to exchange heat with an external coolant (not shown) and regenerate the cooling liquid. Therefore, according to one or more examples of the present disclosure, the plurality of spring fingers 158 may provide multi-point contact conduction cooling to the removable device 104 to achieve effective thermal management of the removable device 104 .

[0054] In one or more examples, each spring finger 158 can apply an optimal contact force on the thermal transfer device 150 to allow the removable device 104 to be easily inserted (e.g., inserted or slid into) the host device 102. For example, when the removable device 104 is inserted into the host device 102, each spring finger 158 can be compressed to slightly deflect inward (e.g., toward the frame 157). However, the optimal spring force applied by each of the plurality of spring fingers 158 can be sufficient to establish a direct thermal interface between the dry contact surface of each spring finger 158 and the peripheral surface of the thermal transfer device 150. In other words, the plurality of spring fingers 158 can provide multiple (arrays) of contact forces or spring forces to generate a substantially low insertion force for inserting the removable device 104 into the host device 102. In some examples, the multiple contact forces or spring forces applied by the plurality of spring fingers 158 are within acceptable safety limits to avoid injuries associated with repeated forces (e.g., insertion forces or removal forces). For example, the contact force or spring force applied by each spring finger 158 can be in the range of about 0.04 lbf to 0.08 lbf. In some examples, each of the plurality of spring fingers 158 can deflect in the range of about 0.5 mm to 1.0 mm to allow the thermal transfer device 150 coupled to the removable device 104 to be easily inserted into the main device 102.

[0055] In one or more examples, the plurality of spring fingers 158 may be able to maintain multi-point contact with the peripheral surface of the heat transfer device 150 (i.e., via the dry contact surface of each spring finger) even if the peripheral surface has an uneven surface, an uneven surface, surface defects, or debris, because each spring finger 158 may independently generate an optimal spring force to establish a direct thermal interface with mutually opposing portions of the peripheral surface. Further, each spring finger 158 may independently apply a spring force on the peripheral surface using a substantially small surface area dry contact surface. In some examples, the surface area of ​​the dry contact surface of each spring finger 158 may be in a range from about 0.2 square millimeters to 0.6 square millimeters. Since the dry contact surfaces of the plurality of spring fingers 158 establish a direct thermal interface with the peripheral surface of the heat transfer device 150, the need for a TIM to establish a thermal interface between the receptacle 136 and the heat transfer device 150 (as in conventional electronic systems) may be avoided. Therefore, the use of the plurality of spring fingers 158 may overcome the above-mentioned problems associated with a TIM.

[0056] Figure 2A A perspective view of a portion of a main device 302 of an electronic system is depicted, the main device having a cooling component 306. In one or more examples, the main device 302 can further include a partially open housing and a connector (eg, Figure 1A It may be noted herein that for the purpose of illustration, Figure 2A The housing and connector of the main device 302 are not shown in the example, and such illustration should not be construed as limiting the present disclosure.

[0057] In some examples, the cooling component 306 is a cold plate. In one or more examples, the cooling component 306 is a thermally conductive component that can be configured to be connected to the heat sink 330 via the receptacle 336 (in Figure 2B ) and a heat transfer device 350 are thermally connected to the heat sink 308 of the removable device 304 and may include several provisions to allow liquid coolant to flow through it for dissipating waste heat from the cooling component 306.

[0058] As in Figure 1A As discussed in the examples of , the cooling component 306 is composed of a plurality of first blocks 326 and a collection chamber 328 disposed between and coupled to the plurality of first blocks 326. In one or more examples, each of the plurality of first blocks 326 has a first recess 330. The collection chamber 328 includes a pair of peripheral walls 338, a front wall 340, a rear wall 342, a cover 344, and a base (not labeled), which are coupled to each other to define a hollow space therebetween. In some examples, the rear wall 342 has a fluid inlet 346 and a fluid outlet 348. In one or more examples, the pair of peripheral walls 338 is coupled to the plurality of first blocks 326 so that the collection chamber 328 is in thermal contact with the plurality of first blocks 326. Further, the front wall 340 includes a second protrusion 352, which can be used to couple the cooling component 306 to the housing of the main device 302. In some examples, the fluid inlet 346 can be coupled to the inlet channel 355, and the fluid outlet 348 can be coupled to the outlet channel 356. In one or more examples, the inlet passage 355 can be further coupled to a supply line manifold (not shown) that is fluidly connected to a coolant distribution unit (not shown). Similarly, the outlet passage 356 can be further coupled to a return line manifold (not shown) that is fluidly connected to a coolant distribution unit.

[0059] In one or more examples, the electronic system can further include a pair of heat transfer devices 350. In some examples, each heat transfer device in the pair of heat transfer devices 350 can be a thermally conductive component. Figure 2A In the example of FIG. 1 , each heat transfer device in the pair of heat transfer devices 350 is a heat pipe 350A. In some non-limiting examples, each heat transfer device 350 can be a heat sink (e.g., Figure 4B). The heat pipe 350A has a pair of first portions 350A1 and a pair of second portions 350A2. In some examples, each portion of the pair of first portions 350A1 can be an evaporator section of the heat pipe 350A, and each portion of the pair of second portions 350A2 can be a condenser section of the heat pipe 350A. In one or more examples, the heat pipe 350A can be a two-phase heat transfer device with a very high effective thermal conductivity. In one or more examples, the heat pipe 350A can be a vacuum-tight device having a cover, a working fluid, and a wicking structure. In one or more examples, the heat pipe 350A can be disposed along the first recess 330 of each first block 326 and coupled to the cooling component 306 via welding. Figure 2A In the example of the embodiment of the present invention, the first portion 350A1 is disposed along the first recess 330 of each first block 326. Further, the first portion 350A1 is coupled to the cooling member 306. The pair of second portions 350A2 may extend outwardly beyond the cooling member 306. For example, the pair of second portions 350A2 may protrude outwardly relative to the cooling member 306. In one or more examples, the cooling member 306 and the heat transfer device 350 may be formed of a thermally conductive material, such as copper, aluminum, etc.

[0060] Figure 2B A perspective view of a removable device 304 of an electronic system is depicted, the removable device having a heat sink 308. In one or more examples, the removable device 304 further includes a partially open housing 392, a plurality of external connectors 394, a pair of latches 396, an optical assembly 398, a circuit board 400, and one or more electronic components ( Figure 1B not shown).

[0061] The partially open housing 392 is defined by a base, a pair of peripheral walls, and a rear panel 412. In some examples, the rear panel 412 may include a cutout (not shown) to allow the pair of external connectors 394 to be inserted and coupled to the circuit board 400 and / or the optical assembly 398 via a suitable communication mechanism (e.g., cabling, etc.). Each of the pair of external connectors 394 may receive an optical cable 402, etc. For example, each external connector 394 may have a slot (or receptacle) to receive the optical cable 402 and communicatively couple the optical cable 402 to the circuit board 400 and / or the optical assembly 398.

[0062] The heat sink 308 is a thermally conductive solid component that is disposed proximate to the front side of the removable device 304. In some examples, the heat sink 308 is mounted on the circuit board 400 and / or the one or more electronic components and is coupled to the base of the housing 392 using the plurality of spring-loaded shoulder screws 404. In some examples, the heat sink 308 is in thermal communication with the circuit board 400 and / or the one or more electronic components. For example, each of the plurality of spring-loaded shoulder screws 404 may apply an optimal load / force on the heat sink 308 so that the flat lower surface (not shown) of the heat sink 308 is in direct thermal communication with the one or more electronic components or the circuit board 400. The heat sink 308 may further include a plurality of second blocks 410 disposed on and coupled to the upper surface 369 of the heat sink 308. Each of the plurality of second blocks 410 includes a second recess 360. In some examples, a pair of blocks 410A of the plurality of second blocks 410 are disposed and coupled to each other one after another so that the second recesses of the pair of blocks 410A are aligned. Similarly, a pair of blocks 410B in the plurality of second blocks 410 are disposed and coupled to each other successively so that the second recesses of the pair of blocks 410B are aligned. Figure 2B In the example of FIG. 4 , the heat sink 308 includes four second blocks 410 , and each block includes a receptacle 336 .

[0063] In one or more examples, the receptacle 336 is a thermally conductive component that can be disposed in thermal contact with the heat sink 308, for example, via the plurality of second blocks 410. For example, the receptacle 336 is disposed along and coupled to at least a portion of the second recess 360, such that an outer surface of the frame 357 of the receptacle 336 is in thermal contact with an inner surface of the heat sink 308 (e.g., a block in the plurality of second blocks 410). Figure 1A In the examples of , at least one receptacle 336 is disposed in the second recess 360 of each of the plurality of second blocks 410. The frame 357 of the receptacle 336 can be welded to the inner surface of the heat sink 308 (e.g., a block of the plurality of second blocks 410). The receptacle 336 includes a plurality of spring fingers 358. In one or more examples, each of the plurality of spring fingers 358 is a thermally conductive component that can be disposed in thermal contact with the frame 357 of the receptacle 336. In some examples, the plurality of spring fingers 358 are spaced apart from each other along the circumferential direction 10 of the electronic system to form an array of spring fingers (e.g., as Figures 3A-3C In one or more examples, each of the plurality of spring fingers 358 can be defined by a first end, a second end, and a body interconnecting the first end and the second end. Figure 2BIn an example, each of the plurality of spring fingers 358 is a torsion spring finger 358A. In this example, the first end, the second end, and the body of each spring finger 358 may have substantially the same size (e.g., width, thickness). Further, the second end is disposed at an offset distance relative to the first end. Additionally, the first end and the second end are coupled to a portion of the frame 357, and the body having a dry contact surface may be bent inward relative to the frame 357. In this example, the first end and the second end may be welded to the inner surface of the frame 357 of the receptacle 336 using a thermally conductive material. In some examples, when the removable device 304 is inserted into the main device 302 (having a heat transfer device 350 coupled to the cooling component 306), the body of each spring finger 358 may be compressed so as to deflect slightly inward (e.g., toward the frame 375), wherein the deflection is in the range of from about 0.5 mm to 1.0 mm so as to establish a direct thermal interface (or contact) with the cooling component 306 of the main device 302 via the heat transfer device 350. In some examples, the heat sink 308 , the receptacle 336 , and the plurality of spring fingers 358 may be formed of a thermally conductive material, such as copper, aluminum, or the like.

[0064] In one or more examples, Figure 2B The removable device 304 is detachably connected to Figure 2A 302 to define the electronic system of the present disclosure. For example, the removable device 304 can be slidably inserted into the housing of the main device 302 so that the removable device 304 can be detachably coupled to the main device 302. For example, when the removable device 304 is connected to the main device 302, a portion 400A of the circuit board 400 is inserted into a slot (not shown) of a connector of the main device 102. In other words, the circuit board 400 of the removable device 304 can be communicatively coupled to the circuit board (not shown) of the main device 302 via the connector. In this example, the second portion 350A2 of the pair of heat pipes 350A is inserted into the removable device 304 via the receptacle 336 provided in the second recess 360. In this example, the plurality of spring fingers 358 can establish a direct thermal interface with the second portion 350A2 of each heat pipe 350A to allow waste heat to be transferred from the heat sink 308 to the pair of heat pipes 350A via each spring finger 358 and the frame 357.

[0065] In one or more examples, a first heat conduction path may be created between a heat source, such as the circuit board 400 (and / or the one or more electronic components), and the heat sink 308. Further, a second heat conduction path may be created between the heat sink 308 and the second portion 350A2 of each heat pipe in the pair of heat pipes 350A via the corresponding receptacle 336 (e.g., through the plurality of spring fingers 358 and the frame 357). Similarly, a third heat conduction path may be created between the first portion 350A1 of each heat pipe in the pair of heat pipes 350A and the cooling member 306. Further, a fourth heat conduction path may be created between the cooling member 306 and the liquid coolant circulating within the cooling member 306. Therefore, the electronic system achieves: i) dissipating waste heat from the circuit board 400 (and / or electronic components) to the heat sink 308, ii) transferring the waste heat from the heat sink 308 to the heat transfer device 350 via the plurality of spring fingers 358 and the frame 357, iii) transferring the waste heat from the second part 350A2 to the first part 350A1, iv) transferring the waste heat from the heat transfer device 350 to the cooling component 306, and v) dissipating the waste heat from the cooling component 306 to the liquid coolant.

[0066] Figure 3A A block diagram of a receptacle 436 disposed within one of the cooling components 406 is depicted. It may be noted herein that Figure 3A An example of may be a representation of a cross-sectional view of the cooling member 406. Further, it may be noted herein that the receptacle 436 may be disposed within a heat sink (not shown) without departing from the scope of the present disclosure. Figure 3A In an example of the embodiment of the present invention, the cooling member 406 includes a pair of blocks 426 that are disposed and coupled to each other in succession so that the recesses 430 formed in each of the pair of blocks 426 are aligned with each other. In this example, each of the pair of blocks 426 includes two receptacles 436 that are disposed to be spaced apart from each other within the recess 430 so that the outer surface of each receptacle 436 is in thermal contact with the inner surface of the cooling member 406 (e.g., each block 426). For example, each receptacle 436 includes a frame 457 having an outer surface coupled to the inner surface of the cooling member 406. In some examples, the frame 457 is a hollow cylindrical member.

[0067] As in Figure 1AAs discussed in the examples of , the receptacle 436 further includes a plurality of spring fingers 458 that can be disposed in thermal contact with the frame 457. In some examples, the plurality of spring fingers 458 are spaced apart and disposed along a circumferential direction 10 of the electronic system to form an array of spring fingers. In one or more examples, each of the plurality of spring fingers 458 can be defined by a first end 458A, a second end 458B, and a body 458C that interconnects the first end 458A and the second end 458B, respectively. Figure 1A In an example of, each of the plurality of spring fingers 458 may have a cantilever structure. In such an example, the first end 458A, the second end 458B and the body 458C of each spring finger 458 may have substantially the same size (e.g., width, thickness) to define a spring finger 458 having a cantilever geometry. Further, the first end 458A and the second end 458B are maintained at different heights by the body 458C. Further, the first end 458A is coupled to a portion of the frame 457. For example, the first end 458A is coupled to an inner surface of the frame 457. In such an example, the first end 458A may be welded to the inner surface of the frame 457. The second end 458B may have a dry contact surface 458B1. The cooling member 406, the receptacle 436 and the plurality of spring fingers 458 are made of a thermally conductive material, such as a copper material, an aluminum material, etc.

[0068] In one or more examples, when the removable device (having a heat transfer device rigidly coupled to the heat sink) is inserted into the main device, the second end 458B of each spring finger 458 can be compressed by the heat transfer device so as to slightly deflect each spring finger 458 inward (e.g., toward the frame 457) so as to establish a thermal interface (or contact) with the cooling component 406 via the receptacle 436. For example, the dry contact surface 458B1 of each spring finger 458 contacts the outer peripheral surface of the heat transfer device so as to establish a thermal interface between the cooling component 406 and the heat sink via the heat transfer device and the receptacle 436 (e.g., via the plurality of spring fingers 458 and the frame 457). In such an example, the heat transfer device can transfer waste heat from the heat sink to the cooling component 406 via each spring finger 458 and the frame 457.

[0069] Figure 3B A block diagram of a receptacle 536 disposed within one of the cooling components 506 is depicted. It may be noted herein that the receptacle 536 may be disposed within a heat sink (not shown) without departing from the scope of the present disclosure. Figure 3BIn the example of FIG. 5 , the cooling member 506 includes a pair of blocks 526 that are disposed one after another and coupled so that recesses 530 formed in each of the pair of blocks 526 are aligned with each other. In this example, each of the pair of blocks 526 includes a receptacle 536 disposed within the recess 530 so that an outer surface of the receptacle 536 is in thermal contact with an inner surface of the cooling member 506 (e.g., each block 526).

[0070] As in Figure 1A As discussed in the examples of , the receptacle 536 includes a frame 557 and a plurality of spring fingers 558. The frame 557 is a hollow cylindrical component that can be disposed in thermal contact with the cooling component 506, and the plurality of spring fingers 558 can be disposed in thermal contact with the frame 557. In some examples, the plurality of spring fingers 558 are spaced apart and disposed from one another along a circumferential direction 10 of the electronic system to form an array of spring fingers. In one or more examples, each of the plurality of spring fingers 558 can be defined by a first end 558A, a second end 558B, and a body 558C that interconnects the first end 558A and the second end 558B, respectively. Figure 1A In an example, each of the plurality of spring fingers 558 is a torsion spring finger. In this example, the second end 558B is offset a distance "D1" relative to the first end 558A, so that the body 558C is disposed at an angle "α1" relative to the first end 558A to define each spring finger 558 having a torsion-shaped geometry. Further, the first end 558A and the second end 558B are coupled to the inner surface of the frame 557, and the body 558C is bent inward from the inner surface of the receptacle 536. In this example, the first end 558A and the second end 558B may be welded to the inner surface of the frame 557. The body 558C may have a dry contact surface 558C1. The cooling component 506, the receptacle 536, and the plurality of spring fingers 558 are made of a thermally conductive material, such as a copper material, an aluminum material, or the like.

[0071] In one or more examples, when the removable device (having a heat transfer device rigidly coupled to the heat sink) is inserted into the main device, the body 558C of each spring finger 558 may be compressed by the heat transfer device so as to slightly deflect each spring finger 558 inward (e.g., toward the frame 557) so as to establish a thermal interface (or contact) with the cooling component 506 via the receptacle 536. For example, the dry contact surface 558C1 of each spring finger 558 contacts the peripheral surface of the heat transfer device so as to establish a thermal interface between the cooling component 506 and the heat sink via the heat transfer device and the receptacle 536 (e.g., via the plurality of spring fingers 558 and the frame 557). In such an example, the heat transfer device may transfer waste heat from the heat sink to the cooling component 506 via each spring finger 558 and the frame 557.

[0072] Figure 3C A block diagram of a receptacle 636 disposed within one of the cooling components 606 is depicted. Figure 3C In the example of FIG. 6 , the cooling member 606 includes a pair of blocks 626 that are disposed one after another and coupled so that recesses 630 formed in each of the pair of blocks 626 are aligned with each other. In this example, each of the pair of blocks 626 includes a receptacle 636 disposed within the recess 630 so that an outer surface of the receptacle 636 is in thermal contact with an inner surface of the cooling member 606 (e.g., each block 626).

[0073] As in Figure 1A As discussed in the examples of , the receptacle 636 includes a frame 657 and a plurality of spring fingers 658. The frame 657 is a hollow cylindrical component that can be arranged to be in thermal contact with the cooling component 606, and the plurality of spring fingers 658 can be arranged to be in thermal contact with the frame 657. In some examples, the plurality of spring fingers 658 are spaced apart and arranged from each other along the circumferential direction 10 of the electronic system to form an array of spring fingers. In one or more examples, each of the plurality of spring fingers 658 can be defined by a first end 658A, a second end 658B, and a body 658C that interconnects the first end 658A and the second end 658B, respectively. In some examples, the first end 658A and the second end 658B are coupled to the inner surface of the frame 657, and the body 658C is bent inwardly from the inner surface of the frame 657. In such an example, the first end 658A and the second end 658B can be welded to the inner surface of the frame 657. The body 658C may have a dry contact surface 658C1 .

[0074] In one or more examples, when a removable device (having a heat transfer device rigidly coupled to a heat sink, not shown) is inserted into a host device, the body 658C of each spring finger 658 may be compressed by the heat transfer device so as to slightly deflect each spring finger 658 inward (e.g., toward the frame 657) so as to establish a thermal interface (or contact) with the cooling component 606 via the receptacle 636. For example, a dry contact surface 658C1 of each spring finger 658 contacts a peripheral surface of the heat transfer device so as to establish a thermal interface between the cooling component 606 and the heat sink via the heat transfer device and the receptacle 636 (e.g., via the plurality of spring fingers 658 and the frame 657). In such an example, the heat transfer device may transfer waste heat from the heat sink to the cooling component 606 via each spring finger 658 and the frame 657.

[0075] Figure 4A A perspective view of a portion of a main device 702 of an electronic system is depicted, the main device having a cooling component 706. It may be noted herein that for ease of illustration purposes, Figure 4AThe housing and connector of the main device 702 are not shown in the example, and such illustration should not be construed as limiting the present disclosure.

[0076] In some examples, the cooling component 706 is a cold plate. In one or more examples, the cooling component 706 is a thermally conductive component that can be arranged to be in thermal communication with the heat sink 708 of the removable device 704 via the receptacle 736 and the heat transfer device 750, and can include some provisions to allow liquid coolant to flow through it for dissipating waste heat from the cooling component 706.

[0077] The cooling member 706 is a box-shaped member having a pair of peripheral walls 738, a front wall 740, a rear wall 742, a cover 744, and a base (not labeled) coupled to each other to define a hollow space therebetween. In some examples, the rear wall 742 has a fluid inlet 746 and a fluid outlet 748. In some examples, the fluid inlet 746 can be coupled to the inlet channel 755, and the fluid outlet 748 can be coupled to the outlet channel 756.

[0078] In one or more examples, the receptacle 736 is a thermally conductive component that can be disposed in thermal contact with the cooling component 706. The receptacle 736 includes a frame 757 that is coupled to the front wall 740 of the cooling component 706. In some examples, the frame 757 can be welded to the front wall 740 using a thermally conductive welding material. The receptacle 736 further includes a plurality of spring fingers 758. In one or more examples, each of the plurality of spring fingers 758 is a thermally conductive component that can be disposed in thermal contact with the frame 757. In some examples, the plurality of spring fingers 758 are spaced apart from each other along the lateral direction 30 of the electronic system and coupled to the inner surface of the frame 757 to form an array of spring fingers. In one or more examples, each of the plurality of spring fingers 758 can be defined by a first end 758A, a second end 758B, and a body 758C that interconnects the first end 758A and the second end 758B, respectively. In such an example, the body 758C is coupled to the frame 757. The first end 758A and the second end 758B are arranged to face each other, bend inwardly relative to the receptacle 736, and have dry contact surfaces 758A1, 758B1 to establish a direct thermal interface with the heat transfer device 750. In some examples, when the removable device 704 (having the heat transfer device 750 rigidly coupled to the cooling component 706) is inserted into the main device 702, the first end 758A and the second end 758B of each spring finger 758 can be respectively compressed so as to deflect slightly inwardly, for example, along the longitudinal direction 20, so as to establish a direct thermal interface (or contact) with the cooling component 706 of the main device 702 via the heat transfer device 750.

[0079] Figure 4BA perspective view of a removable device 704 of an electronic system is depicted, the removable device having a heat sink 708. In one or more examples, the removable device 704 further includes a partially open housing 792, a plurality of external connectors 794, a pair of latches 796, an optical assembly 798, a circuit board 800, and one or more electronic components ( Figure 1B not shown).

[0080] The partially open housing 792 is defined by a base, a pair of peripheral walls, and a rear panel 812. In some examples, the rear panel 812 may include a cutout (not shown) to allow the pair of external connectors 794 to be inserted and coupled to the circuit board 800 and / or the optical assembly 798 via a suitable communication mechanism (e.g., cabling, etc.). Each of the pair of external connectors 794 may receive an optical cable 802, etc. For example, each external connector 794 may have a slot (or receptacle) to receive the optical cable 802 and communicatively couple the optical cable 802 to the circuit board 800 and / or the optical assembly 798.

[0081] The heat sink 708 is a thermally conductive solid component that is disposed proximate to the front side of the removable device 704. In some examples, the heat sink 708 is mounted on the circuit board 800 and / or the one or more electronic components and is coupled to the base of the housing 792 using the plurality of spring-loaded shoulder screws 804. In some examples, the heat sink 708 is in thermal communication with the circuit board 800 and / or the one or more electronic components. For example, each of the plurality of spring-loaded shoulder screws 804 can apply an optimal load / force on the heat sink 808 so that the flat lower surface (not shown) of the heat sink 708 is in direct thermal communication with the one or more electronic components or the circuit board 800.

[0082] In one or more examples, the electronic system may further include a heat transfer device 750. In some examples, the heat transfer device 750 may be a heat conducting component, such as a vapor chamber 750A. The vapor chamber 750A has a first portion 750A1 and a second portion 750A2. In some examples, the first portion 750A1 may be an evaporator section of the vapor chamber 750A, and the second portion 750A2 may be a condenser section of the vapor chamber 750A. In one or more examples, the vapor chamber 750A may be a two-phase heat transfer device with a very high effective thermal conductivity. In one or more examples, the vapor chamber 750A may be a vacuum-tight device having a housing, a working fluid, and a wicking structure. In one or more examples, the vapor chamber 750A may be disposed on an outer surface of a heat sink and thermally coupled to the heat sink 708 via welding. For example, a first portion 750A1 of the vapor chamber 750A is disposed above and coupled to the heat sink 708 , and a second portion 750A2 of the vapor chamber 750A may protrude outwardly relative to the heat sink 708 .

[0083] Figure 4C Describes the Figure 4B A perspective view of an electronic system 700 having a removable device 704 connected to Figure 4A 706 of the cooling component. In one or more examples, the removable device 704 can be removably connected to the main device 702 to define the electronic system 700. For example, the removable device 704 can be slidably inserted into the housing of the main device 702 so that the removable device 704 can be removably coupled to the main device 702. For example, when the removable device 704 is connected to the main device 702, a portion 800A of the circuit board 800 is inserted into a slot (not shown) of a connector (not shown) of the main device 702. In other words, the circuit board 800 of the removable device 704 can be communicatively coupled to the circuit board (not shown) of the main device 702 via the connector. In this example, the second portion 750A2 of the heat spreader 750A is inserted into the main device 702 via the receptacle 736. In one or more examples, the plurality of spring fingers 758 of the receptacle 736 can establish a direct thermal interface with the second portion 750A2 of the heat sink 750A to allow waste heat to be transferred from the heat sink 708 to the cooling component 706 via the heat transfer device 750 and the receptacle 736 (e.g., via each spring finger 758 and the frame 757).

[0084] In one or more examples, a first heat conduction path can be created between a heat source, such as the circuit board 800 (and / or the one or more electronic components) and the heat sink 708. Further, a second heat conduction path can be created between the first portion 750A1 of the vapor chamber 750A and the heat sink 708. Similarly, a third heat conduction path can be created between the second portion 750A2 of the vapor chamber 750A and the cooling member 706 via the plurality of spring fingers 758 and the frame 757. Further, a fourth heat conduction path can be created between the cooling member 706 and the liquid coolant circulating within the cooling member 706. Therefore, the electronic system 100 achieves: i) dissipating waste heat from the circuit board 800 (and / or electronic components) to the heat sink 708, ii) transferring waste heat from the heat sink 708 to the heat transfer device 750, iii) transferring waste heat from the first part 750A1 to the second part 750A2, iv) transferring waste heat from the heat transfer device 750 to the cooling component 706 via the multiple spring fingers 758 and the frame 757, and v) dissipating waste heat from the cooling component 706 to the liquid coolant.

[0085] Figure 5 is a flow chart depicting a method 900 for thermal management of a removable device. It should be noted herein that, for example, the method 900 is combined with Figures 1A-1C Method 900 may also be combined with Figure 2A-2Bor Figures 4A-4C to describe.

[0086] The method 900 starts at block 902 and continues to block 904. At block 904, the method 900 includes: connecting the removable device to a host device of the electronic system via a connector to communicatively couple a circuit board of the removable device to a main circuit board of the host device, such as Figure 1A and Figure 1B . In some examples, a portion of the circuit board is inserted into an opening of the connector to communicatively couple the circuit board to a main circuit board. In some examples, a receptacle of the electronic system is coupled to a cooling component of the main device. In such an example, a first portion of a heat transfer device of the electronic system is coupled to a heat sink of the removable device, and a second portion of the heat transfer device protrudes outwardly relative to the heat sink. In some other examples, the receptacle is coupled to the heat sink. In such an example, a first portion of the heat transfer device is coupled to the cooling component, and a second portion of the heat transfer device protrudes outwardly relative to the cooling component. In all such examples, the receptacle may include a frame (e.g., a hollow cylindrical component) and a plurality of spring fingers coupled to the frame. In one example, the heat transfer device is a heat pipe. In some other examples, the heat transfer device is a heat spreader.

[0087] Further, method 900 continues to block 906. At block 906, method 900 includes the step of extending a portion (e.g., the second portion) of the heat transfer device through the receptacle to allow the plurality of spring fingers to establish a direct thermal interface with the second portion by compressing each spring finger inwardly (e.g., toward the receptacle) and exerting a spring force on the portion of the heat transfer device.

[0088] In one or more examples, each spring finger may be slightly deflected toward the frame when the removable device is inserted into the host device. However, the optimal spring force applied by each of the plurality of spring fingers may be sufficient to establish a direct thermal interface between the dry contact surface of each spring finger and the peripheral surface of the heat transfer device. The plurality of spring fingers may provide multiple (arrays) of contact forces or spring forces to generate a substantially low insertion force for inserting the removable device into the host device. At the same time, the optimal spring force applied by each of the plurality of spring fingers may be sufficient to establish a direct thermal interface between the dry contact surface of each spring finger and the peripheral surface of the heat transfer device.

[0089] At box 908, method 900 includes: transferring waste heat between the heat transfer device and one of the cooling component or heat sink via each spring finger and the receptacle. In some examples, the removable device may convert an electrical signal into an optical signal or vice versa for transmitting or receiving data through an interconnect cable. In some other examples, the removable device may store and process data. Therefore, the removable device may consume a greater amount of power and may thereby generate an increased amount of waste heat. In some examples, when the receptacle is arranged in thermal contact with the heat sink, the heat sink may first dissipate the waste heat generated by the circuit board and / or the electronic component. Later, the waste heat may be transferred from the heat sink to the heat transfer device via the plurality of spring fingers and the frame. Further, the heat transfer device may transfer the waste heat to the cooling device. In such an example, the coolant flowing in the cooling component may absorb the waste heat from the cooling component and generate a heated coolant, thereby cooling the cooling component. In some other examples, when the receptacle is arranged in thermal contact with the cooling component, the heat sink may first dissipate the waste heat generated by the removable device. Later, the waste heat can be transferred directly from the heat sink to the heat transfer device. Further, the heat transfer device can transfer the waste heat to the cooling device via the receptacle and the plurality of spring fingers. In this example, the coolant flowing in the cooling component can absorb the waste heat from the cooling component and generate heated coolant, thereby cooling the cooling component.

[0090] In one or more examples, the heated coolant can be pumped outside the electronic system to exchange heat with the external coolant and regenerate the coolant. Therefore, according to one or more examples of the present disclosure, the plurality of spring fingers coupled to the receptacle can provide multi-point contact conduction cooling of the removable device through the plurality of spring fingers and the receptacle to achieve effective thermal management of the removable device. The method 900 ends at block 910.

[0091] Various features as illustrated in the examples described herein may be implemented in systems (such as, a host device) and methods for thermal management of a removable device. In one or more examples, an array of spring fingers maintains an optimal contact force when inserting the removable device into the host device, the optimal contact force being within acceptable safety limits to avoid damage associated with repeated forces (e.g., insertion forces or removal forces). Further, even if the peripheral surface has an uneven surface, an uneven surface, surface defects or debris, the plurality of spring fingers may be able to maintain multi-point contact (i.e., via a dry contact surface) with the peripheral surface of the removable device, because each spring finger may independently generate an optimal spring force to establish a direct thermal interface with mutually opposing portions of the peripheral surface. Further, each spring finger may independently apply a spring force on the peripheral surface using a substantially small surface area dry contact surface. Therefore, the plurality of spring fingers may be able to further maintain multi-point contact (i.e., via a dry contact surface) with the peripheral surface having the above-mentioned problems. Since the plurality of spring fingers establish a direct thermal interface with the peripheral surface of the removable device, the need for a TIM to establish a thermal interface between the mating surfaces (as in conventional electronic systems) may be avoided. The plurality of spring fingers can generate an optimal force to compress the heat transfer device and establish and maintain thermal communication between the heat transfer device and one of the cooling component or heat sink. Further, the spring force can be controlled to prevent the load of the docking component (i.e., cooling component and heat sink) from being transferred to other components of the removable device and to prevent damage to those components.

[0092] In the above description, numerous details are set forth to provide an understanding of the subject matter disclosed herein. However, embodiments may be practiced without some or all of these details. Other embodiments may include modifications, combinations, and variations of the details discussed above. The appended claims are intended to cover such modifications and variations.

Claims

1. An electronic system comprising: a main device, the main device comprising a cooling component; a removable device, the removable device comprising a heat sink, wherein the removable device is removably connectable to the main device; a receptacle comprising a plurality of spring fingers coupled to one of the cooling member or the heat sink; and A heat transfer device comprising a first portion and a second portion, wherein the first portion is coupled to one of the cooling component or the heat sink and the second portion protrudes outwardly relative to the cooling component or the heat sink, wherein when the removable device is connected to the host device, the second portion extends through the receptacle so that the plurality of spring fingers establish a direct thermal interface with the second portion to allow waste heat to be transferred between the heat transfer device and one of the cooling component or the heat sink via the receptacle.

2. The electronic system according to claim 1, wherein: The heat transfer device includes one of a heat pipe or a vapor chamber.

3. The electronic system according to claim 1, wherein: The cooling component includes a first recess and the heat sink includes a second recess, wherein the receptacle is disposed along the first recess and coupled to the cooling component, wherein the first portion of the heat transfer device is disposed along the second recess and coupled to the heat sink, and wherein, when the removable device is connected to the main device, the second portion extends through the receptacle to thermally couple the heat sink to the cooling component via the heat transfer device and the receptacle.

4. The electronic system according to claim 3, wherein: The cooling component is a cold plate, wherein the cold plate includes a fluid inlet, a fluid outlet, and a manifold fluidly connecting the fluid inlet and the fluid outlet, wherein the manifold is in thermal communication with the first recess, and wherein liquid coolant is directed from the fluid inlet to the fluid outlet for dissipating the waste heat from the cold plate.

5. The electronic system according to claim 1, wherein: The cooling component includes a first recess and the heat transfer device includes a second recess, wherein the receptacle is disposed along the second recess and coupled to the heat sink, wherein the first portion of the heat transfer device is disposed along the first recess and coupled to the cooling component, and wherein, when the removable device is connected to the main device, the second portion extends through the receptacle to thermally couple the cooling component to the heat sink via the heat transfer device and the receptacle.

6. The electronic system according to claim 5, wherein: The cooling component is a cold plate, wherein the cold plate includes a fluid inlet, a fluid outlet, and a manifold fluidly connecting the fluid inlet and the fluid outlet, wherein the manifold is in thermal communication with the first recess, and wherein liquid coolant is directed from the fluid inlet to the fluid outlet for dissipating the waste heat from the cold plate.

7. The electronic system according to claim 1, wherein: Each spring finger includes: a first end coupled to a frame of the receptacle; a second end having a dry contact surface to establish a direct thermal interface with the heat transfer device; and a body interconnecting the first end and the second end, and wherein the plurality of spring fingers are arranged adjacent to each other in a circumferential direction to form an array of spring fingers.

8. The electronic system according to claim 1, wherein: Each spring finger includes: a first end and a second end, wherein the first end and the second end are coupled to a frame of the receptacle; and a body that interconnects the first end and the second end, wherein the body is bent inwardly relative to the frame and includes a dry contact surface to establish a direct thermal interface with the heat transfer device, and wherein the plurality of spring fingers are arranged adjacent to each other in a circumferential direction to form an array of spring fingers.

9. The electronic system according to claim 8, wherein: The second end is offset relative to the first end such that the body is disposed at an angle relative to the first end.

10. The electronic system according to claim 1, wherein: Each spring finger includes: a first end; a second end; and a body that interconnects the first end and the second end and couples to the frame of the receptacle, wherein the first end and the second end are arranged to face each other, bend inwardly relative to the frame, and have a dry contact surface to establish a direct thermal interface with the heat transfer device, and wherein the plurality of spring fingers are arranged adjacent to each other along a lateral direction to form an array of spring fingers.

11. The electronic system according to claim 1, wherein: The main device further includes: a connector rigidly coupled to the housing of the electronic system; and a main circuit board coupled to the connector, wherein the removable device further includes a circuit board, and wherein, when the removable device is connected to the main device, the circuit board is communicatively coupled to the main circuit board through the connector.

12. An electronic system comprising: a main device, the main device comprising a main circuit board, a connector coupled to the main circuit board, and a cooling component; a heat transfer device comprising a first portion and a second portion, wherein the first portion is coupled to the cooling member and the second portion protrudes outwardly relative to the cooling member; and a receptacle comprising a plurality of spring fingers, wherein the removable device is detachably connectable to the host apparatus, wherein the removable device includes a circuit board, and a heat sink is coupled to the circuit board to dissipate waste heat generated from the circuit board, wherein the receptacle is coupled to the heat sink, and Wherein, when the removable device is connected to the main device, the circuit board is communicatively coupled to the main circuit board through the connector, and the second portion extends through the receptacle so that the plurality of spring fingers establish a direct thermal interface with the second portion to allow the waste heat to be transferred from the heat sink to the cooling component via the receptacle and the first and second portions of the heat transfer device.

13. The electronic system according to claim 12, wherein: The heat transfer device includes one of a heat pipe or a vapor chamber.

14. The electronic system according to claim 12, wherein: The cooling component includes a first recess and the heat transfer device includes a second recess, wherein the receptacle is arranged along the second recess and coupled to the heat sink, wherein the first portion of the heat transfer device is arranged along the first recess and coupled to the cooling component, and wherein, when the removable device is connected to the main device, the second portion extends through the receptacle to thermally couple the cooling component to the heat sink via the heat transfer device and the receptacle.

15. The electronic system according to claim 14, wherein: The cooling component is a cold plate, wherein the cold plate includes a fluid inlet, a fluid outlet, and a manifold fluidly connecting the fluid inlet and the fluid outlet, wherein the manifold is in thermal communication with the first recess, and wherein liquid coolant is directed from the fluid inlet to the fluid outlet for dissipating the waste heat from the cold plate.

16. The electronic system according to claim 12, wherein: Each spring finger includes: a first end coupled to a frame of the receptacle; a second end having a dry contact surface to establish a direct thermal interface with the heat transfer device; and a body interconnecting the first end and the second end, and wherein the plurality of spring fingers are arranged adjacent to each other in a circumferential direction to form an array of spring fingers.

17. The electronic system according to claim 12, wherein: Each spring finger includes: a first end and a second end, wherein the first end and the second end are coupled to a frame of the receptacle; and a body that interconnects the first end and the second end, wherein the body is bent inwardly relative to the frame and includes a dry contact surface to establish a direct thermal interface with the heat transfer device, and wherein the plurality of spring fingers are arranged adjacent to each other in a circumferential direction to form an array of spring fingers.

18. The electronic system according to claim 17, wherein: The second end is offset relative to the first end such that the body is disposed at an angle relative to the first end.

19. The electronic system according to claim 12, wherein: Each spring finger includes: a first end; a second end; and a body that interconnects the first end and the second end and couples to the frame of the receptacle, wherein the first end and the second end are arranged to face each other, bend inwardly relative to the frame, and have a dry contact surface to establish a direct thermal interface with the heat transfer device, and wherein the plurality of spring fingers are arranged adjacent to each other along a lateral direction to form an array of spring fingers.

20. A method comprising: connecting the removable device to a main device of the electronic system via a connector of the main device to communicatively couple a circuit board of the removable device to a main circuit board of the main device, wherein the removable device includes a heat sink coupled to the circuit board to dissipate waste heat generated from the circuit board, Wherein, the main device comprises a cooling component, wherein the electronic system further comprises: a receptacle; and a heat transfer device comprising a first portion and a second portion, wherein the receptacle comprises a plurality of spring fingers coupled to one of the cooling component or the heat sink, and wherein the first portion is coupled to one of the cooling component or the heat sink, and the second portion protrudes outwardly relative to one of the cooling component or the heat sink; extending the second portion through the receptacle to allow the plurality of spring fingers to establish a direct thermal interface with the second portion by compressing each spring finger inwardly and exerting a spring force on the second portion; and The waste heat is transferred between the heat transfer device and one of the cooling component or the heat sink via the receptacle.

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