A visual positioning marking machine, method and storage medium thereof

Abstract

The present application relates to a vision positioning marking machine, a method and a storage medium thereof. The present application relates to the technical field of vision positioning marking, and in particular to a vision positioning marking machine and a marking method, which include a frame, a bidirectional moving stage, a pre-positioning mechanism, a secondary positioning and marking mechanism, a limiting component and a processor. Through the cooperation of the pre-positioning mechanism and the secondary positioning and marking mechanism, accurate positioning and efficient marking of the substrate and its electronic components are realized, and the accuracy of marking of electronic components is improved.

Description

Technical Field

[0001] The present application relates to the field of marking equipment, and in particular to a vision positioning marking machine, method and storage medium thereof. Background Art

[0002] After the production of electronic components is completed, it is usually necessary to perform a marking process on them, so that the electronic components are marked with information, meeting industry specifications, facilitating subsequent tracing of their production information, and at the same time, the marking information can also be used as a positioning mark to facilitate the positioning of the current component during the subsequent processing steps of the product during assembly.

[0003] Generally, the size of electronic components is relatively small. To facilitate the marking process and make the marking position of the electronic components relatively accurate, so as to reduce the impact on the subsequent product assembly process caused by the deviation between the marking position of the electronic component and the preset position during the subsequent product assembly process, several electronic components need to be respectively arranged on a substrate, and then the substrate with the electronic components is placed in the marking equipment, and the marking equipment gradually completes the marking of a large number of electronic components.

[0004] There is a conventional laser marking equipment with a vision positioning module. The vision positioning module is used to position the electronic components, identify the image to determine the position to be marked, and send the position information to the laser module, and the laser module completes the marking operation on the electronic components. However, because the number of electronic components on the same substrate is large, and the cooperation between the vision positioning module and the laser module is required to complete the marking process of the electronic components one by one, the marking speed of the electronic components is relatively slow, and there is room for improvement. Summary of the Invention

[0005] In order to improve the marking accuracy of electronic components, the present application provides a vision positioning marking machine, method and storage medium thereof.

[0006] In a first aspect, a vision positioning marking machine provided by the present application adopts the following technical solution:

[0007] A vision positioning marking machine, comprising a frame, a bidirectional moving stage, a pre-positioning mechanism, a secondary positioning and marking mechanism, a limiting component and a processor. The limiting component includes a first limiting member and a second limiting member. Both the first limiting member and the second limiting member are used for limiting a substrate. The bidirectional moving stage is arranged on the frame. The first limiting member and the second limiting member are sequentially arranged on the bidirectional moving stage. The pre-positioning mechanism and the secondary positioning and marking mechanism are sequentially installed on the frame on one side of the bidirectional moving stage. The pre-positioning mechanism is used for preliminarily positioning the substrate and the electronic components on the substrate. The secondary positioning and marking mechanism is used for positioning and identifying and marking the substrate and the electronic components on the substrate after being positioned by the pre-positioning mechanism. The bidirectional moving stage is used to drive the first limiting member and the second limiting member to synchronously move along the frame in the X-axis or Y-axis direction. The two ends of the bidirectional moving stage along the length direction are respectively provided with a first waiting position and a second waiting position. When the first limiting member is located below the pre-positioning mechanism, the second limiting member is located at the first waiting position. When the first limiting member is located below the secondary positioning and marking mechanism, the first limiting member is located below the pre-positioning mechanism. The processor is electrically connected to the bidirectional moving stage, the pre-positioning mechanism and the secondary positioning and marking mechanism.

[0008] By adopting the above technical solution, when the substrate with electronic components is respectively placed in the first limiting member and the second limiting member, the bidirectional moving stage is used to drive the first limiting member and the second limiting member with the substrate to move along the frame. The pre-positioning mechanism is used to position the substrate to determine the position information of the substrate and the electronic components on the substrate. Subsequently, the secondary positioning and marking mechanism is used to identify the substrate that has been positioned by the pre-positioning mechanism. The secondary positioning and marking mechanism can complete the marking operation on the electronic components on the substrate. Moreover, the two ends of the moving stage along the length direction are respectively provided with a first waiting position and a second waiting position. When the first limiting member is located below the pre-positioning mechanism, the second limiting member is located at the first waiting position. At this time, the substrate placed on the second limiting member can be taken out along the second limiting member, or the substrate can be placed on the second limiting member. Through the above process, it is beneficial to reduce the downtime for waiting to place the substrate, which plays a positive guiding role in improving the marking efficiency of electronic components. Compared with the method of using the cooperation of a positioning module and a laser module to complete the marking of electronic components one by one, in this application, through the cooperation of the pre-positioning mechanism and the secondary positioning and marking mechanism, after the positioning by the pre-positioning mechanism is completed, only the secondary positioning and marking mechanism needs to process the position information collected by the pre-positioning mechanism to determine the marking position required for the electronic components on the substrate. The secondary positioning and marking mechanism can complete the purpose of marking the electronic components on the substrate without the need to perform an identification each time when marking each electronic component.

[0009] Preferably, the pre-positioning mechanism includes an adjustment component and an identification component. The adjustment component is arranged on the frame, and the identification component is arranged on the adjustment component. The adjustment component is used to drive the identification component to move along the Z-axis direction of the frame. The identification component includes a first CCD camera, and the first CCD camera faces the bidirectional moving stage. The first CCD camera is used to identify the substrate and the electronic components on the substrate, and the first CCD camera is electrically connected to the processor.

[0010] By adopting the above technical solution, the substrate and the electronic components on the substrate can be identified by the first CCD camera to determine the position to be marked, and the position information is sent to the processor. The identification accuracy is high, which is beneficial to reducing the situation that the marked position deviates from the actual set position due to the deviation of the identified position.

[0011] Preferably, positioning marks are arranged in a rectangular array on the substrate, and several electronic components are located on the substrate between the positioning marks.

[0012] By adopting the above technical solution, since the positions of the electronic components installed on the substrate are in a relatively fixed state and are all located on the substrate between the positioning marks, when the first CCD camera and the secondary positioning and marking mechanism identify the substrate, the substrate can be preliminarily positioned through the positioning marks to determine the positional relationship between the substrate and the electronic components. When it is necessary to determine the position information of the electronic components along the substrate, only the position information of the positioning marks needs to be determined, and the operation is simple.

[0013] Preferably, the secondary positioning and marking mechanism includes a second CCD camera and a laser marking machine. The second CCD camera is arranged on the laser marking machine, and the laser head of the laser marking machine faces the bidirectional moving stage. The second CCD camera is used to identify the positioning marks, and the second CCD camera is electrically connected to the processor.

[0014] By adopting the above technical solution, the second CCD camera identifies the positioning marks of the substrate and sends the identification information to the processor. The processor compares the position information of the positioning marks identified by the first CCD camera and the second CCD camera to determine the specific position to be marked on the electronic components on the substrate, and the processor pneumatically controls the laser marking machine to start marking the electronic components on the substrate.

[0015] Preferably, the secondary positioning and marking mechanism further includes an air extraction component. The air extraction component is arranged on one side of the laser marking machine, and the air extraction component is used to suck air for the laser marking machine.

[0016] By adopting the above technical solution, the exhaust gas generated during the operation of the laser marking machine is discharged through the air extraction component, reducing the probability of the exhaust gas accumulating between the second CCD camera and the frame, thereby affecting the recognition accuracy of the second CCD camera.

[0017] In a second aspect, the present application provides a marking method for a vision positioning marking machine, which adopts the following technical solution:

[0018] A marking method for a vision positioning marking machine, applied to a vision positioning marking machine described in the first aspect, includes:

[0019] S1. The processor controls the two-way moving stage to actuate the first limiting member and the second limiting member carrying the substrate until the first limiting member is located below the first CCD camera and the second limiting member is located below the second CCD camera;

[0020] S2. The processor controls the first CCD camera and the second CCD camera to start working;

[0021] S3. The first CCD camera identifies the positioning mark on the substrate within the first limiting member and sends the positioning mark to the processor;

[0022] S4. After the processor sends the positioning mark position information to the second CCD camera and the laser marking machine, the laser marking machine starts to mark the electronic components on the substrate within the second limiting member;

[0023] S5. When the laser marking machine finishes marking the electronic components on the substrate within the second limiting member, the processor controls the two-way moving stage to actuate until the second limiting member is located at the second waiting position and the first limiting member is located below the second CCD camera;

[0024] S6. When the laser marking machine finishes marking the electronic components on the substrate within the first limiting member, the processor controls the two-way moving stage to actuate until the first limiting member is located at the second waiting position and the second limiting member is located below the second CCD camera.

[0025] By adopting the above technical solution, through the cooperation of the two-way moving stage with the first CCD camera and the second CCD camera, it is beneficial to reduce the downtime waiting time, and the recognition accuracy is high, which is beneficial to reducing the probability of the actual marking position of the electronic components not meeting the set requirements compared with the preset marking position.

[0026] Preferably,

[0027] A1. The processor converts the positioning mark image information into coordinate information and zeros it;

[0028] A2. The processor identifies the image information of the electronic components between the substrate positioning marks and converts it into coordinate information, so that any electronic component has independent coordinate information;

[0029] A3. The processor processes the coordinate information of the electronic components and calculates the coordinate information of the marking position required by the current electronic component.

[0030] By adopting the above technical solution, the image information is converted into coordinate information. After the processor issues a control instruction to the laser marking machine, the laser marking device only needs to determine the marking position through the coordinate information to complete the marking of the electronic components.

[0031] Preferably,

[0032] B1. The processor sends the position coordinates of the positioning marks and the coordinate information of the marking positions required by the electronic components to the second CCD camera and the laser marking machine;

[0033] B2. The second CCD camera identifies the positioning marks on the substrate and sends the identification information to the processor to determine the coordinate information of the substrate positioning marks;

[0034] B3. The processor determines the coordinate information of several electronic components located on the substrate based on the coordinate information of the substrate positioning marks identified by the second CCD camera, and sends the coordinate information to the laser marking machine.

[0035] By adopting the above technical solution: The processor converts the positioning mark image information into coordinate information and zeros it, identifies the image information of the electronic components between the substrate positioning marks and converts it into coordinate information, so that each electronic component has independent coordinate information, and then processes the coordinate information of the electronic components to calculate the coordinate information of the marking position required by the current electronic component. In addition, the processor also sends the position coordinates of the positioning marks and the coordinate information of the marking positions required by the electronic components to the second CCD camera and the laser marking machine. The second CCD camera identifies the positioning marks on the substrate and sends the identification information to the processor to determine the coordinate information of the substrate positioning marks. The processor determines the coordinate information of the electronic components located on the substrate based on the coordinate information of the substrate positioning marks identified by the second CCD camera and sends the coordinate information to the laser marking machine, realizing high-precision positioning of the marking of the electronic components.

[0036] In a third aspect, a computer-readable storage medium provided by the present application adopts the following technical solution:

[0037] A computer-readable storage medium stores a computer program that can be loaded and executed by a processor to implement the marking method of a vision positioning marking machine described in the second aspect.

[0038] In summary, the present application includes at least one of the following beneficial technical effects:

[0039] 1. After the positioning by the pre-positioning mechanism is completed, only the secondary positioning and marking mechanism needs to process the position information collected by the pre-positioning mechanism to determine the marking position of the electronic components on the substrate. The secondary positioning and marking mechanism can complete the purpose of marking the electronic components on the substrate, without the need for each electronic component to be identified once during the marking process;

[0040] 2. When the first CCD camera and the secondary positioning and marking mechanism identify the substrate, they can be initially positioned through the positioning mark to determine the positional relationship between the substrate and the electronic components. When it is necessary to determine the position information of the electronic components along the substrate, only the position information of the positioning mark needs to be determined, and the operation is simple;

[0041] 3. After converting the image information into coordinate information and issuing a control instruction to the laser marking machine through the processor, the laser marking device can complete the marking of the electronic components only by determining the marking position through the coordinate information. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] Figure 1 is a schematic diagram of the overall structure of a vision positioning marking machine according to an embodiment of the present application.

[0043] Figure 2 is Figure 1 an enlarged schematic diagram of part A in a vision positioning marking machine in

[0044] Figure 3 is a schematic diagram of the structure of the substrate in a vision positioning marking machine according to an embodiment of the present application.

[0045] Figure 4 is a flowchart of the steps of a marking method of a vision positioning marking machine according to an embodiment of the present application.

[0046] Figure 5 is a flowchart of the processor determining the coordinate information of the positioning mark and the electronic components located between the positioning marks in a marking method of a vision positioning marking machine according to an embodiment of the present application.

[0047] Description of reference numerals: 1, frame; 2, bidirectional moving stage; 21, first waiting position; 22, second waiting position; 3, substrate; 31, positioning mark; 311, placement position; 4, pre-positioning mechanism; 41, adjustment assembly; 411, motor screw drive mechanism; 412, mounting seat; 42, identification assembly; 421, first CCD camera; 422, fill light; 5, secondary positioning and marking mechanism; 51, second CCD camera; 52, laser marking machine; 6, limiting assembly; 61, first limiting member; 62, second limiting member; 7, processor; 8, air extraction assembly; 81, negative pressure air extraction fan; 82, air extraction pipeline. Detailed implementation manners

[0048] The upper, lower, left, right, front, rear, side, upper, lower, X-axis, Y-axis, Z-axis, etc. mentioned or possibly mentioned in this specification are defined relative to the structures shown in the respective drawings. The terms "inner" and "outer" respectively refer to the directions towards or away from the geometric center of a specific component, and they are relative concepts. Therefore, they may change accordingly depending on their different positions and usage states. So, these or other orientations should not be construed as restrictive terms.

[0049] The following is a further detailed description of the present application in conjunction with the attached Figures 1-5 drawings.

[0050] In a first aspect, an embodiment of the present application discloses a vision positioning and marking machine. Referring to Figures 1-3 , a vision positioning and marking machine includes a frame 1, a bidirectional moving stage 2, a pre-positioning mechanism 4, a secondary positioning and marking mechanism 5, a limiting assembly 6, and a processor. The limiting assembly 6 includes a first limiting member 61 and a second limiting member 62. Both the first limiting member 61 and the second limiting member 62 are used to limit the substrate 3. The bidirectional moving stage 2 is arranged on the frame 1. The first limiting member 61 and the second limiting member 62 are sequentially arranged on the bidirectional moving stage 2. The pre-positioning mechanism 4 and the secondary positioning and marking mechanism 5 are sequentially arranged on the frame 1 on one side of the bidirectional moving stage 2. The pre-positioning mechanism 4 is used to perform preliminary positioning on the substrate 3 and the electronic components on the substrate 3. The secondary positioning and marking mechanism 5 is used to perform positioning identification and marking on the substrate 3 and the electronic components on the substrate 3 after being positioned by the pre-positioning mechanism 4. The bidirectional moving stage 2 is used to drive the first limiting member 61 and the second limiting member 62 to move synchronously along the X-axis or Y-axis direction of the frame 1. The two ends of the bidirectional moving stage 2 along the length direction are respectively provided with a first waiting position 21 and a second waiting position 22. When the first limiting member 61 is located below the pre-positioning mechanism 4, the second limiting member 62 is located on the first waiting position 21. When the first limiting member 61 is located below the secondary positioning and marking mechanism 5, the first limiting member 61 is located below the pre-positioning mechanism 4. The processor is electrically connected to the bidirectional moving stage 2, the pre-positioning mechanism 4, and the secondary positioning and marking mechanism 5.

[0051] First of all, it should be noted that the bidirectional moving stage 2 is an electric slide table, which includes a base, an X-axis moving component, a Y-axis moving component and a fixed seat. Through the cooperation of the X-axis moving component and the Y-axis moving component, the purpose of moving the fixed seat along the X-axis or Y-axis direction is realized. It is an existing slide table, and its specific composition and working principle will not be elaborated here.

[0052] Specifically, the first limiting member 61 and the second limiting member 62 have the same composition and function. For the convenience of description, the first limiting member 61 is taken to illustrate it below. The first limiting member 61 is recessed in the thickness direction to form a cavity adapted to the contour of the substrate 3. The position of the substrate 3 placed on the first limiting member 61 is defined by the cavity, which is convenient for taking out the substrate 3 along the first limiting member 61, or placing the first limiting member 61 on the first limiting member 61.

[0053] Therefore, in the initial state, the first limiting member 61 is located below the pre-positioning mechanism 4, and the second limiting member 62 is located on the first waiting position 21. At this time, the substrate 3 in the first limiting member 61 is positioned by the pre-positioning mechanism 4, and at the same time, another substrate 3 provided with electronic components can be placed in the second limiting member 62.

[0054] Furthermore, when the substrate 3 in the first limiting member 61 is positioned by the pre-positioning mechanism 4, the processor controls the bidirectional moving stage 2 to act, so that the bidirectional moving stage 2 drives the first limiting member 61 and the second limiting member 62 to act until the first limiting member 61 moves below the secondary positioning and marking mechanism 5. At this time, the second limiting member 62 will move below the pre-positioning mechanism 4.

[0055] Still further, when the first limiting member 61 moves below the secondary positioning and marking mechanism 5, the processor controls the secondary positioning and marking mechanism 5 to start working to achieve the purpose of marking the electronic components on the substrate 3 placed in the first limiting member 61. At the same time, the pre-positioning mechanism 4 will synchronously start to position and identify the substrate 3 and the electronic components on the substrate 3 in the second limiting member 62, and send the identified information to the processor.

[0056] Even further, when the secondary positioning and marking mechanism 5 finishes marking the electronic components on the substrate 3 of the first limiting member 61, the bidirectional moving stage 2 will drive the first limiting member 61 to move towards the second waiting position 22, and at the same time, the second limiting member 62 moves below the secondary positioning and marking mechanism 5. The secondary positioning and marking mechanism 5 starts to mark the electronic components on the substrate 3 located in the second limiting member 62. At the same time, another substrate 3 provided with electronic components to be marked can be placed on the first limiting member 61.

[0057] Correspondingly, after the secondary positioning and marking mechanism 5 finishes marking the electronic components on the substrate 3 of the second limiting member 62, the processor controls the bidirectional moving stage 2 to move until the first limiting member 61 moves under the pre-positioning mechanism 4 and the second limiting member 62 is located on the first waiting position 21. In this way, repeating the above process can achieve the marking process of the electronic components on the substrate 3.

[0058] Referring Figure 1 and Figure 2 , the pre-positioning mechanism 4 includes an adjustment component 41 and an identification component 42. The adjustment component 41 is arranged on the frame 1, and the identification component 42 is arranged on the adjustment component 41. The adjustment component 41 is used to drive the identification component 42 to move along the Z-axis direction of the frame 1.

[0059] Specifically, the adjustment component 41 includes a motor screw lifting mechanism and a mounting seat 412. The motor screw lifting mechanism includes a motor and a screw. The motor is arranged on the frame 1, and the screw is coaxially fixed with the output shaft of the motor. At the same time, the mounting seat 412 is in threaded cooperation with the screw. When the output shaft of the motor rotates, since the screw is coaxially fixed with the motor, the screw rotates synchronously with the output shaft of the motor. And because the mounting seat 412 is in threaded cooperation with the screw, the purpose of the mounting seat 412 moving up and down along the screw is achieved (the up and down movement of the mounting seat 412 is affected by the rotation direction of the output shaft of the motor, which will not be elaborated here).

[0060] At the same time, the identification component 42 includes a first CCD camera 421 and a fill light 422. The first CCD camera 421 and the fill light 422 are successively installed on the mounting seat 412, and the lens of the first CCD camera 421 faces the bidirectional moving stage 2. The first CCD camera 421 is electrically connected to the processor. At the same time, the fill light 422 provides supplementary light for the first CCD camera 421 to reduce the probability of the detection result of the first CCD camera 421 being affected due to insufficient light. At the same time, the height of the first CCD camera 421 along the Z-axis direction can be adjusted through the adjustment component 41 to achieve the purpose of focusing the first CCD camera 421.

[0061] Therefore, the first CCD camera 421 is used to identify the substrate 3 and the electronic components on the substrate 3 to determine the position information of the substrate 3 and the electronic components on the substrate 3, and send the position information to the processor.

[0062] It should be noted here that referring Figure 2 and Figure 3 , positioning marks 31 are arranged in a rectangular array on the substrate 3, and several electronic components are located on the substrate 3 between the positioning marks 31.

[0063] Specifically, four positioning identifiers 31 are provided. The four positioning identifiers 31 are arranged symmetrically about the midline in the length direction of the substrate 3, and a placement position 311 for placing electronic components is formed between the four positioning identifiers 31.

[0064] Therefore, when the first CCD camera 421 starts to scan the substrate 3, the first CCD camera 421 will use the four positioning identifiers 31 as a reference to collect the image between the four positioning identifiers 31 on the substrate 3 and send it to the processor to determine the position information of the electronic components located on the placement position 311, and send the position information to the secondary positioning and marking mechanism 5. Through the secondary marking mechanism, the marking process of the electronic components on the substrate 3 can be completed.

[0065] Refer to Figure 1 and Figure 2 As shown in FIGS. and, the secondary positioning and marking mechanism 5 includes a second CCD camera 51 and a laser marking machine 52. The second CCD camera 51 is arranged on the laser marking machine 52. The laser head of the laser marking machine 52 faces the bidirectional moving stage 2. The second CCD camera 51 is used to identify the positioning identifier 31, and the second CCD camera 51 is electrically connected to the processor.

[0066] First of all, it should be noted that the laser marking machine 52 is a conventional laser etching device, and its specific composition and working principle will not be elaborated here.

[0067] Furthermore, when the substrate 3 identified by the first CCD camera 421 reaches below the second CCD camera 51, the second CCD camera 51 positions the substrate 3 again through the four positioning identifiers 31 and sends the positioning information to the processor. The processor compares and processes the identification information of the first CCD camera 421 and the second CCD camera 51, and uses the identification information of the first CCD camera 421 as a reference to determine the position information of the electronic components on the substrate 3 located below the second CCD camera 51 and sends it to the laser marking machine 52.

[0068] Correspondingly, when the laser marking machine 52 receives the position information sent by the processor, it starts to mark the electronic components on the substrate 3 located below the second CCD camera 51.

[0069] Refer to Figure 1 and Figure 2 As shown in FIGS. and, the secondary positioning and marking mechanism 5 further includes an air extraction assembly 8. The air extraction assembly 8 is arranged on one side of the laser marking machine 52, and the air extraction assembly 8 is used to suck air for the laser marking machine 52.

[0070] Specifically, the air extraction assembly 8 includes a pipeline and a negative pressure air extraction fan 81. The air extraction pipeline 82 is connected to the air inlet of the negative pressure air extraction fan 81, and the air inlet of the air extraction pipeline 82 faces the laser head of the laser marking machine 52. When the laser marking machine 52 starts to mark the electronic components, the negative pressure air extraction fan 81 inhales the smoke generated during the marking of the laser marking machine 52 into the negative pressure air extraction fan 81 and discharges it along the air outlet of the negative pressure air extraction fan 81, reducing the probability of the smoke generated when the laser marking machine 52 marks the electronic components from accumulating near the laser marking machine 52 and the second CCD camera 51 and affecting the detection result of the second CCD camera 51.

[0071] In a second aspect, a marking method for a vision positioning marking machine is disclosed, which is applied to a vision positioning marking machine as described in the first aspect.

[0072] Refer to Figure 4 , including

[0073] S1. The processor controls the bidirectional moving stage 2 to actuate the first limiting member 61 and the second limiting member 62 carrying the substrate 3 until the first limiting member 61 is located below the first CCD camera 421 and the second limiting member 62 is located below the second CCD camera 51.

[0074] S2. The processor controls the first CCD camera 421 and the second CCD camera 51 to start working.

[0075] S3. The first CCD camera 421 identifies the positioning mark 31 on the substrate 3 within the first limiting member 61 and sends the positioning mark 31 to the processor.

[0076] S4. After the processor sends the position information of the positioning mark 31 to the second CCD camera 51 and the laser marking machine 52, the laser marking machine 52 starts to mark the electronic components on the substrate 3 within the second limiting member 62.

[0077] S5. When the laser marking machine 52 finishes marking the electronic components on the substrate 3 within the second limiting member 62, the processor controls the bidirectional moving stage 2 to actuate until the second limiting member 62 is located on the second waiting position 22 and the first limiting member 61 is located below the second CCD camera 51.

[0078] S6. When the laser marking machine 52 finishes marking the electronic components on the substrate 3 within the first limiting member 61, the processor controls the bidirectional moving stage 2 to actuate until the first limiting member 61 is located on the second waiting position 22 and the second limiting member 62 is located below the second CCD camera 51.

[0079] S7. The laser marking machine 52 starts to mark the electronic components on the substrate 3 located at the second limiting member 62. Meanwhile, another substrate 3 with electronic components to be marked can be placed on the first limiting member 61. After the laser marking machine 52 finishes marking the electronic components on the substrate 3 of the second limiting member 62, the processor controls the bidirectional slide to move until the first limiting member 61 is located below the first CCD camera 421 and the second limiting member 62 is located at the first waiting position 21.

[0080] Thus, by looping the steps shown in S1 - S7 above, the sustainable marking of electronic components can be achieved.

[0081] The principle is as follows, referring to Figure 5 , including:

[0082] A1. The processor converts the image information of the positioning mark 31 into coordinate information and sets it to zero.

[0083] Set any one of the positioning marks 31 as the reference, define the coordinates here as (0.00, 0.00). Meanwhile, the coordinate information of the other three positioning marks 31 is (0.00, Y), (Y, 0.00), and (X, Y) respectively. Thus, the coordinates of any point within the rectangular area enclosed by the four sets of reference coordinates can be obtained.

[0084] A2. The processor identifies the image information of the electronic components between the positioning marks 31 on the substrate 3 and converts it into coordinate information, so that any one electronic component has independent coordinate information (the number of coordinate points changes with the shape of the electronic component).

[0085] The processor processes the image recognized by the first CCD camera 421 and converts the image position information of several electronic components located between the four sets of reference coordinates into coordinate information.

[0086] For example: If there is a standard rectangular electronic component at a certain place on the substrate 3, the coordinate information converted from the image information of this electronic component is (1.22, 1.22), (1.22, 2.02), (2.02, 1.22), and (2.02, 2.02), achieving the purpose of positioning the current electronic component.

[0087] A3. The processor processes the coordinate information of the electronic components and calculates the coordinate information of the marking position required for the current electronic component.

[0088] After setting the marking position required for the current electronic component through the processor, the marking position information can be sent to the laser marking machine 52, and the laser marking machine 52 starts to mark the electronic components.

[0089] For example, it is now required to symmetrically mark a straight line with a length of 0.4 mm from the geometric center to both ends in the width direction of the above-mentioned standard rectangular electronic component. Then, the laser head of the laser marking machine 52 will move to the position (1.62, 1.42), start the laser marking machine 52, and the laser head of the laser marking machine 52 will move in a straight line along this coordinate to the position (1.62, 1.82) to achieve the purpose of marking the current electronic component.

[0090] The specific implementation steps are as follows:

[0091] B1. The processor sends the position coordinates of the positioning mark 31 and the coordinate information of the marking position required for the electronic component to the second CCD camera 51 and the laser marking machine 52.

[0092] B2. The second CCD camera 51 identifies the positioning mark 31 on the substrate 3 and sends the identification information to the processor to determine the coordinate information of the positioning mark 31 on the substrate 3.

[0093] B3. Based on the coordinate information of the positioning mark 31 on the substrate 3 identified by the second CCD camera 51, the processor determines the coordinate information of several electronic components located on the substrate 3 and sends the coordinate information to the laser marking machine 52.

[0094] In a third aspect, a computer-readable storage medium provided by the present application stores a computer program, and when the computer program is executed by a processor, the following steps are implemented:

[0095] S1. The processor controls the bidirectional moving stage 2 to act on the first limiting member 61 and the second limiting member 62 carrying the substrate 3 until the first limiting member 61 is located below the first CCD camera 421 and the second limiting member 62 is located below the second CCD camera 51.

[0096] S2. The processor controls the first CCD camera 421 and the second CCD camera 51 to start working.

[0097] S3. The first CCD camera 421 identifies the positioning mark 31 on the substrate 3 located within the first limiting member 61 and sends the positioning mark 31 to the processor.

[0098] S4. After the processor sends the position information of the positioning mark 31 to the second CCD camera 51 and the laser marking machine 52, the laser marking machine 52 starts to mark the electronic components on the substrate 3 within the second limiting member 62.

[0099] S5. When the laser marking of the electronic components on the substrate 3 within the second limiting member 62 by the laser marking machine 52 is completed, the processor controls the bidirectional moving stage 2 to act until the second limiting member 62 is located on the second waiting position 22 and the first limiting member 61 is located below the second CCD camera 51.

[0100] S6. After the laser marking machine 52 finishes marking the electronic components on the substrate 3 within the first limiting member 61, the processor controls the bidirectional moving stage 2 to act until the first limiting member 61 is located on the second waiting position 22 and the second limiting member 62 is located below the second CCD camera 51.

[0101] S7. The laser marking machine 52 starts to mark the electronic components on the substrate 3 located in the second limiting member 62. Meanwhile, another substrate 3 with electronic components to be marked can be placed on the first limiting member 61. After the laser marking machine 52 finishes marking the electronic components on the substrate 3 in the second limiting member 62, the processor controls the bidirectional sliding stage to act until the first limiting member 61 is located below the first CCD camera 421 and the second limiting member 62 is located on the first waiting position 21.

[0102] The implementation principle of a vision positioning marking machine, method and its storage medium according to an embodiment of the present application is as follows: The first CCD camera 421 performs image recognition on several electronic components on the substrate 3 and sends the images to the processor. The processor processes the images and converts the position information of the electronic components in the images into coordinate information. Subsequently, through the cooperation of the second CCD camera 51 and the positioning mark 31, the reference coordinate of the current substrate 3 is determined and sent to the processor. The processor compares the coordinate information with the positioning mark coordinate information detected by the second CCD camera 51 to determine the specific marking coordinates of the electronic components on the current substrate 3, and feeds back the preset marking coordinates to the laser marking machine 52, thereby achieving the purpose of marking the electronic components and effectively improving the marking accuracy of the electronic components.

[0103] Those of ordinary skill in the art can understand that all or part of the processes in the methods of the above embodiments can be completed by instructing relevant hardware through a computer program. The computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above methods. Among them, any reference to a memory, storage, database, or other medium used in the embodiments provided in this application can include non-volatile and / or volatile memories. Non-volatile memories can include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM), or flash memory. Volatile memories can include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in various forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDR SDRAM), enhanced SDRAM (ESDRAM), synchronous link DRAM (SLDRAM), Rambus direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and Rambus dynamic RAM (RDRAM), etc.

[0104] Those skilled in the art can clearly understand that, for the convenience and brevity of description, only the above division of each functional unit and module is used as an example. In actual applications, the above functions can be allocated to different functional units and modules according to needs, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above.

[0105] The embodiments of this specific implementation manner are all preferred embodiments of this application, and do not limit the protection scope of this application accordingly. The same components are denoted by the same reference numerals. Therefore, all equivalent changes made according to the structure, shape, and principle of this application should be covered within the protection scope of this application.

Claims

1. A vision positioning marking machine, characterized in that: It includes a frame (1), a bidirectional moving stage (2), a pre-positioning mechanism (4), a secondary positioning and marking mechanism (5), a limit component (6) and a processor. The limit component (6) includes a first limit member (61) and a second limit member (62). Both the first limit member (61) and the second limit member (62) are used to limit the substrate (3). The bidirectional moving stage (2) is arranged on the frame (1). The first limit member (61) and the second limit member (62) are sequentially arranged on the bidirectional moving stage (2). The pre-positioning mechanism (4) and the secondary positioning and marking mechanism (5) are sequentially mounted on the frame (1) on one side of the bidirectional moving stage (2). A positioning mark (31) is arranged on the substrate (3). The pre-positioning mechanism (4) includes an identification component (42), and the identification component (42) includes a first CCD camera (421). The secondary positioning and marking mechanism (5) includes a second CCD camera (51) and a laser marking machine (52). The first CCD camera (421) identifies the substrate (3) and the electronic components on the substrate (3). When the first CCD camera (421) starts to scan the substrate (3), the first CCD camera (421) will take the positioning mark (31) as a reference, collect the images between the positioning marks (31) on the substrate (3) and send them to the processor to determine the position information of the substrate (3) and the electronic components on the substrate (3). When the substrate (3) after being identified by the first CCD camera (421) reaches below the second CCD camera (51), the second CCD camera (51) positions the substrate (3) again through the positioning mark (31) and sends the positioning information to the processor. The processor compares and processes the identification information of the first CCD camera (421) and the second CCD camera (51), and takes the identification information of the first CCD camera (421) as a reference to determine the position information of the electronic components on the substrate (3) located below the second CCD camera (51) and sends it to the laser marking machine (52). The bidirectional moving stage (2) is used to drive the first limit member (61) and the second limit member (62) to move synchronously along the X-axis or Y-axis direction of the frame (1). The two ends of the bidirectional moving stage (2) along the length direction are respectively provided with a first waiting position (21) and a second waiting position (22);When the first limiting member (61) is located below the pre-positioning mechanism (4), the second limiting member (62) is located on the first waiting position (21). When the first limiting member (61) is located below the secondary positioning and marking mechanism (5), the first limiting member (61) is located below the pre-positioning mechanism (4). The processor is electrically connected to the bidirectional moving stage (2), the pre-positioning mechanism (4), and the secondary positioning and marking mechanism (5).; 2. The vision positioning marking machine according to claim 1, wherein: The pre-positioning mechanism (4) includes an adjustment component (41). The adjustment component (41) is arranged on the frame (1), and the identification component (42) is arranged on the adjustment component (41). The adjustment component (41) is used to drive the identification component (42) to move along the Z-axis direction of the frame (1). The first CCD camera (421) faces the bidirectional moving stage (2). The first CCD camera (421) is used to identify the substrate (3) and the electronic components on the substrate (3), and the first CCD camera (421) is electrically connected to the processor.

3. The vision positioning marking machine according to claim 2, characterized in that: A number of electronic components are located on the substrate (3) between the positioning marks (31).

4. The vision positioning marking machine according to claim 3, characterized in that: The second CCD camera (51) is arranged on the laser marking machine (52). The laser head of the laser marking machine (52) faces the bidirectional moving stage (2). The second CCD camera (51) is used to identify the positioning marks (31), and the second CCD camera (51) is electrically connected to the processor.

5. A vision positioning marking machine according to claim 4, characterized in that: The secondary positioning and marking mechanism (5) further includes an air extraction component (8). The air extraction component (8) is arranged on one side of the laser marking machine (52), and the air extraction component (8) is used to suck air for the laser marking machine (52).

6. A marking method for a vision positioning marking machine, characterized in that, Applied to a vision positioning and marking machine according to any one of claims 1-5, including: S1. The processor controls the bidirectional moving stage (2) to actuate the first limiting member (61) and the second limiting member (62) carrying the substrate (3) until the first limiting member (61) is located below the first CCD camera (421), and the second limiting member (62) is located below the second CCD camera (51); S2. The processor controls the first CCD camera (421) and the second CCD camera (51) to start working; S3. The first CCD camera (421) identifies the positioning marks (31) on the substrate (3) within the first limiting member (61) and sends the positioning marks (31) to the processor; S4. After the processor sends the position information of the positioning marks (31) to the second CCD camera (51) and the laser marking machine (52), the laser marking machine (52) starts to mark the electronic components on the substrate (3) within the second limiting member (62); S5. When the laser marking machine (52) finishes marking the electronic components on the substrate (3) within the second limiting member (62), the processor controls the bidirectional moving stage (2) to actuate until the second limiting member (62) is located on the second waiting position (22), and the first limiting member (61) is located below the second CCD camera (51); S6. When the laser marking machine (52) finishes marking the electronic components on the substrate (3) within the first limiting member (61), the processor controls the bidirectional moving stage (2) to actuate until the first limiting member (61) is located on the second waiting position (22), and the second limiting member (62) is located below the second CCD camera (51).

7. The marking method of a vision positioning marking machine according to claim 6, characterized in that: Including A1. The processor converts the image information of the positioning marks (31) into coordinate information and zeros it; The A2. processor identifies the image information of the electronic components between the positioning marks (31) of the substrate (3) and converts it into coordinate information, so that any electronic component has independent coordinate information; The A3. processor processes the coordinate information of the electronic components and calculates the coordinate information of the marking position required by the current electronic component.

8. The marking method of a vision positioning marking machine according to claim 7, characterized in that: including B1. The processor sends the position coordinates of the positioning marks (31) and the coordinate information of the marking positions required by the electronic components to the second CCD camera (51) and the laser marking machine (52); B2. The second CCD camera (51) identifies the positioning marks (31) on the substrate (3) and sends the identification information to the processor to determine the coordinate information of the positioning marks (31) of the substrate (3); B3. The processor determines the coordinate information of several electronic components located on the substrate (3) based on the coordinate information of the positioning marks (31) of the substrate (3) identified by the second CCD camera (51), and sends the coordinate information to the laser marking machine (52).

9. A computer-readable storage medium, characterized in that, A computer program is stored, which can be loaded and executed by a processor to perform the marking method of a vision positioning marking machine according to any one of claims 6-8.

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