A thinning device for processing silicon wafers

Abstract

The present invention discloses a thinning device for processing silicon wafers, which relates to the field of thinning processing of silicon wafers, including a water collection trough, the inner wall of which is fixed with a support plate, the top of which is fixed with a bearing cylinder, a loading mechanism is arranged below the bearing cylinder, and the loading mechanism includes a sliding cylinder, the top of which is rotatably connected with an anti-skid table. The thinning device for processing silicon wafers can thin silicon wafers by transmitting rotation, which not only avoids the problem of the clamping claws blocking the grinding area, but also avoids the problem of poor limiting effect caused by the heat generated by grinding compared to the suction cup limiting method, and the silicon wafer only needs to rotate half a circle to complete the grinding and thinning operation, which is very fast and efficient, and the grinding force area on the silicon wafer is relatively symmetrical, thereby avoiding the problem of warping caused by asymmetric force on the silicon wafer.

Description

Technical Field

[0001] The invention relates to the technical field of wafer silicon slice thinning processing, and in particular to a thinning device for wafer silicon slice processing. Background Art

[0002] ‌‌ Wafer silicon wafers, also known as wafers, are key materials used in semiconductor manufacturing. Wafer silicon wafers are thin slices processed from high-purity silicon ingots, usually in a round or flat shape. These silicon wafers undergo a series of complex manufacturing processes, such as doping, photolithography and etching, and are ultimately used to manufacture integrated circuits and various electronic components. In the process of wafer silicon wafer manufacturing and processing, in order to meet the required process requirements, the thickness of the silicon wafers needs to be thinned to facilitate subsequent wafer silicon wafer processing.

[0003] At present, when silicon wafers are thinned, a grinding wheel smaller than the diameter of the silicon wafer is generally used. During the operation, the grinding wheel is used to grind and thin the silicon wafer along a specified path. This grinding method not only causes multiple repeated grinding areas on the silicon wafer, reducing the thinning efficiency, but also when the grinding wheel is grinding a certain area at the edge of the silicon wafer, the force on the grinding area is much greater than the force on the symmetrical side. The asymmetric external force will cause the silicon wafer to warp during grinding and thinning, affecting subsequent processing.

[0004] On the other hand, after searching, the patent with the announcement number CN117754382B discloses a wafer thinning machine grinding device, which avoids the waste splashing when the wafer is ground, and the grinding component grinds the wafer through the grinding component. However, it is difficult to limit and fix the wafer silicon wafers of different diameters and thicknesses in the above scheme. When grinding and thinning the wafer silicon wafer, it is necessary to limit and fix it first. The current fixing methods are mainly divided into two types, one is to clamp and fix it by placing the clamping claw on the silicon wafer, and the other is to fix it by adsorbing the silicon wafer surface by the suction cup. However, in the clamping and fixing method of the clamping claw, the clamping claw will block the movement trajectory of the grinding wheel, so that the staff needs to adjust the clamping position of the clamping claw many times to complete the entire thinning operation, which is very cumbersome and inefficient. In the suction cup fixing method, the heat generated during grinding and thinning will be transferred to the position where the suction cup adsorbs the silicon wafer. The suction cup will deform due to the high temperature, resulting in poor fixing effect of the silicon wafer, affecting the flatness of the thinning. To this end, we provide a thinning device for wafer silicon wafer processing to solve the above problems. Summary of the invention

[0005] The purpose of the present invention is to make up for the shortcomings of the prior art and provide a thinning device for wafer silicon wafer processing, including a water collecting trough, a support plate is fixed to the inner wall of the water collecting trough, a carrying cylinder is fixed to the top of the support plate, a loading mechanism is arranged below the carrying cylinder, the loading mechanism includes a sliding cylinder, and the top of the sliding cylinder is rotatably connected to an anti-slip table.

[0006] A correction mechanism is arranged on the outside of the anti-slip table, and the correction mechanism includes two symmetrical moving frames, and the two moving frames are respectively located on both sides of the anti-slip table, and a group of correction rollers are rotatably connected to the side surfaces of the two moving frames that are close to each other, and the number of correction rollers in each group is two and symmetrical to each other. A grinding mechanism is arranged above the anti-slip table, and the grinding mechanism includes a U-shaped frame, and grinding rollers are installed below the U-shaped frame, and the two correction rollers in each group of correction rollers are respectively located on both sides of the grinding roller.

[0007] An annular track and an annular top plate are fixed to the inner wall of the supporting tube, and the annular top plate is located below the annular track. Twelve pressing mechanisms are arranged inside the supporting tube, and the pressing mechanisms include a sleeve, and an extrusion column is slidably connected to the inner wall of the sleeve. A telescopic spring four is arranged inside the sleeve, and both ends of the telescopic spring four are respectively fixed to the sleeve and the extrusion column.

[0008] The above-mentioned loading mechanism also includes a movable electric rail fixed on the water collecting trough, and a loading platform is fixed at the output end of the movable electric rail, the sliding cylinder passes through the loading platform and is slidably connected to the loading platform, a baffle is fixed at the bottom of the sliding cylinder, and a telescopic spring 1 is sleeved on the outer surface of the sliding cylinder, and the telescopic spring 1 is fixed between the loading platform and the baffle. The staff places the silicon wafers to be processed on the anti-slip table, and controls the movable electric rail to drive the loading platform to move, so that the silicon wafers are loaded to the bottom of the supporting cylinder. Through the setting of the telescopic spring 1, after the baffle is not pressed, the baffle moves downward under the spring tension of the telescopic spring 1, which is convenient for the subsequent discharge of the silicon wafers.

[0009] The above-mentioned loading mechanism also includes a blocking plate fixed at the bottom of the supporting plate, the blocking plate is adapted to the loading platform, a telescopic cylinder is fixed to the outer surface of the supporting plate, a top pressure ring is fixed to the telescopic end of the telescopic cylinder, the top pressure ring is slidably connected to the blocking plate, and two sliding rods are fixed to the outer surface of the supporting plate, both of the two sliding rods are slidably connected to the top pressure ring. During loading, the wafer silicon wafer is placed on the anti-slip table, and when the moving electric rail is controlled to drive the loading platform to move, the anti-slip table is moved to the bottom of the carrying cylinder, and the deviation correction mechanism is used to make the wafer silicon wafer and the carrying cylinder be on the same axis, and the telescopic cylinder is controlled to drive the top pressure ring to move upward to press the baffle, thereby lifting the wafer silicon wafer that has been returned to its position.

[0010] A motor is fixed to the outer surface of the water collecting trough, and a bidirectional threaded rod is fixed to the output end of the motor, and the bidirectional threaded rod is rotatably connected to the water collecting trough, and threaded tubes are fixed to the outer surfaces of the two movable racks, and the two threaded tubes are threadedly connected to the bidirectional threaded rod, and a limiting rod group is fixed to the inner wall of the water collecting trough, and the limiting rod group includes two limiting rods, and the two movable racks are slidably connected to the limiting rod group. When the silicon wafer is located between the two movable racks, the motor is controlled to drive the bidirectional threaded rod to rotate, and the two movable racks are moved closer to each other by the rotation of the bidirectional threaded rod. At this time, the two groups of deviation correction rollers will correct the silicon wafer and return it to its original position, so that the silicon wafer and the supporting tube are on the same axis, so that the device can adapt to silicon wafers of different diameters.

[0011] Two symmetrical auxiliary components are arranged above each of the moving frames, and the auxiliary components include a sleeve fixed on the moving frame, the inner wall of the sleeve is slidably connected with a pressure block, a plurality of balls are installed on the bottom surface of the pressure block, and a second telescopic spring is arranged inside the sleeve, and the two ends of the second telescopic spring are respectively fixed to the sleeve and the pressure block. During the grinding and thinning process of the silicon wafer, the pressure block is subjected to the spring pressure of the second telescopic spring, so that the pressure block always fits the upper surface of the silicon wafer. The four pressure blocks will assist the silicon wafer in rotating, thereby improving the stability of the silicon wafer during rotation.

[0012] Two sliding bars are fixed on the outer surface of the water collecting trough, and both of the sliding bars are slidably connected to the U-shaped frame. The outer surface of the supporting cylinder is rotatably connected with a one-way threaded rod, and the one-way threaded rod is threadedly connected to the U-shaped frame. A scale is fixed on the outer surface of the supporting cylinder, and a pointer matched with the scale is fixed on the outer surface of the U-shaped frame. The one-way threaded rod is rotated to control the descending distance of the grinding roller, so as to adjust the thinning degree of the silicon wafer by the grinding roller. The descending distance of the grinding roller can be accurately controlled by the distance that the pointer moves on the scale, so that the staff can accurately control the thinning degree of the silicon wafer.

[0013] A cooling mechanism is provided above the grinding roller, and the cooling mechanism includes a water outlet trough fixed below the supporting cylinder, the water outlet trough is located above the grinding roller, a water inlet pipe is fixedly connected above the water outlet trough, a water pump is installed on the outer surface of the water inlet pipe, and the water pump is fixed on the outer surface of the support plate, and water retaining blocks are fixed on the upper surfaces of the two movable frames, and the two water retaining blocks are sealingly and slidingly connected to the water outlet trough, and the water pump draws external coolant to flow into the water outlet trough through the water inlet pipe. When the two movable frames move according to the size of the wafer silicon wafer, the movable frames simultaneously drive the water retaining blocks to move, and the distance between the two water retaining blocks is equal to the diameter of the wafer silicon wafer. The coolant sprayed from the water outlet trough will completely cover the grinding area of ​​the wafer silicon wafer, providing a cooling effect for the grinding area.

[0014] A second motor is fixed on the outer surface of the supporting cylinder, a rotating plate is arranged inside the supporting cylinder, the rotating plate is rotatably connected to the water inlet pipe, the output end of the second motor is transmission-connected to the rotating plate via a belt and a pulley, the pressing mechanism also includes a slider, the slider is fixed to the rotating plate, the slider is slidably connected to the annular track, the second motor is controlled to drive the rotating plate to rotate, and the rotation of the rotating plate drives the twelve pressing mechanisms to rotate.

[0015] A sliding rod three is fixed on the top of the sleeve, and the top end of the sliding rod three passes through the slider and is slidably connected to the slider. A telescopic spring three is sleeved on the outer surface of the sliding rod three, and the telescopic spring three is fixed between the slider and the sleeve. A pressure column is fixed on the outer surface of the sleeve, and a ball is installed on the top end of the pressure column. The ball of the pressure column contacts the bottom surface of the annular top plate. When each sleeve rotates, the pressure column on it moves downward under the top pressure of the annular top plate, so that the extrusion column cooperates with the anti-slip table to clamp the wafer silicon wafer and drive the wafer silicon wafer to rotate. The rotating one-way threaded rod drives the grinding roller to descend, so that the rotating wafer silicon wafer is polished and thinned by the grinding roller. The wafer silicon wafer is thinned by this way of transmitting rotation.

[0016] Compared with the prior art, the thinning device for wafer silicon processing has the following beneficial effects:

[0017] 1. The present invention is provided with a loading mechanism, a correction mechanism and a pressing mechanism. The loading mechanism is used to load the silicon wafer to the bottom of the carrying cylinder, and the two movable frames are brought close to each other so that the silicon wafer and the carrying cylinder are on the same axis. The rotating rotating plate drives the twelve pressing mechanisms to rotate. When the sleeve rotates, the pressure column moves downward under the pressure of the annular top plate, so that the extrusion column cooperates with the anti-slip table to clamp the silicon wafer and drive the silicon wafer to rotate. The rotating silicon wafer will be polished and thinned by the grinding roller. The silicon wafer is thinned by the way of transmitting rotation, which not only avoids the problem of the clamping claws blocking the grinding area, but also avoids the problem of poor limiting effect caused by the heat generated by grinding compared to the suction cup limiting method.

[0018] 2. The present invention is provided with a grinding mechanism and a cooling mechanism. The one-way threaded rod is rotated to control the descending distance of the grinding roller, so as to adjust the thinning degree of the silicon wafer by the grinding roller. The descending distance of the grinding roller can be accurately controlled by the distance that the pointer moves on the scale, so that the staff can accurately control the thinning degree of the silicon wafer. At the same time, the twelve pressing mechanisms rotate to drive the silicon wafer to rotate and be polished by the grinding roller. The silicon wafer only needs to rotate half a circle to complete the grinding and thinning operation. It is very fast and efficient, and the grinding force area on the silicon wafer is relatively symmetrical, thereby avoiding the problem of warping of the silicon wafer caused by asymmetric force.

[0019] Other advantages, objectives and features of the present invention will be set forth in part in the following description and, in part, will be apparent to those skilled in the art based on an examination of the following or may be taught from the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic front view of the three-dimensional structure of the present invention;

[0021] Figure 2 A rear view showing the three-dimensional structure of the present invention;

[0022] Figure 3 It is a schematic diagram of the three-dimensional structure of the present invention during thinning operation;

[0023] Figure 4 It is a three-dimensional structural schematic diagram of the feeding mechanism of the present invention;

[0024] Figure 5 It is a schematic diagram of the split structure of the feeding mechanism of the present invention;

[0025] Figure 6 It is a schematic diagram of the three-dimensional structure of the feeding mechanism and the deviation correcting mechanism of the present invention when they cooperate;

[0026] Figure 7 It is a three-dimensional structural schematic diagram of the deviation correction mechanism of the present invention;

[0027] Figure 8 It is a schematic diagram of the three-dimensional structure inside the sleeve of the present invention;

[0028] Fig. 9 It is a three-dimensional structural schematic diagram of the feeding mechanism and the top pressing mechanism of the present invention when they cooperate;

[0029] Fig.10 It is a three-dimensional structural schematic diagram of the grinding mechanism and the cooling mechanism of the present invention;

[0030] Fig.11 It is a three-dimensional structural schematic diagram of the grinding mechanism of the present invention;

[0031] Fig.12 It is a schematic diagram of the split structure of the cooling mechanism of the present invention;

[0032] Fig.13 It is a three-dimensional structural cross-sectional view of the water retaining block and the water outlet trough of the present invention;

[0033] Fig.14 It is a schematic diagram of the three-dimensional structure inside the bearing tube of the present invention;

[0034] Fig.15 It is a three-dimensional structural schematic diagram of the top pressing mechanism of the present invention;

[0035] Fig.16 It is a schematic diagram of the three-dimensional structure inside the sleeve of the present invention.

[0036] In the figure:

[0037] 1. Water collecting tank; 2. Support plate; 3. Carrying tube;

[0038] 4. Feeding mechanism; 401. Moving electric rail; 402. Feeding platform; 403. Sliding cylinder; 404. Baffle; 405. Telescopic spring 1; 406. Anti-slip platform; 407. Stop plate; 408. Top pressure ring; 409. Sliding rod 1; 410. Telescopic cylinder;

[0039] 5. Correction mechanism; 501. Moving frame; 502. Correction roller; 503. Threaded pipe; 504. Bidirectional threaded rod; 505. Motor 1; 506. Limit rod group; 507. Sleeve; 508. Press block; 509. Telescopic spring 2; 510. Water retaining block;

[0040] 6. Grinding mechanism; 601. Grinding roller; 602. U-shaped frame; 603. One-way threaded rod; 604. Scale; 605. Pointer; 606. Sliding rod 2;

[0041] 7. Cooling mechanism; 701. Water inlet pipe; 702. Water pump; 703. Water outlet tank;

[0042] 8. Pressing mechanism; 801. Sleeve; 802. Sliding rod three; 803. Sliding block; 804. Telescopic spring three; 805. Pressure column; 806. Extrusion column; 807. Telescopic spring four;

[0043] 9. Rotating plate; 10. Motor 2; 11. Annular track; 12. Annular top plate. DETAILED DESCRIPTION

[0044] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0045] See also Figure 1 and Figure 2 The present invention provides a technical solution: a thinning device for wafer silicon wafer processing, including a water collecting trough 1, a support plate 2 is fixed to the inner wall of the water collecting trough 1, a bearing cylinder 3 is fixed to the top of the support plate 2, a loading mechanism 4 is arranged below the bearing cylinder 3, the loading mechanism 4 includes a sliding cylinder 403, and the top of the sliding cylinder 403 is rotatably connected to an anti-slip platform 406.

[0046] See also Figure 3 , Figure 4 and Figure 5 The feeding mechanism 4 also includes a movable electric rail 401 fixed on the water collecting tank 1, a feeding platform 402 is fixed at the output end of the movable electric rail 401, a sliding cylinder 403 passes through the feeding platform 402 and is slidably connected to the feeding platform 402, a baffle 404 is fixed at the bottom of the sliding cylinder 403, and a telescopic spring 405 is sleeved on the outer surface of the sliding cylinder 403, and the telescopic spring 405 is fixed between the feeding platform 402 and the baffle 404. The staff places the wafer silicon wafer to be processed on the anti-slip table 406, and controls the movable electric rail 401 to drive the feeding platform 402 to move, so that the wafer silicon wafer is fed to the bottom of the carrying cylinder 3. Through the setting of the telescopic spring 405, after the baffle 404 is not pressed, the baffle 404 moves downward under the spring tension of the telescopic spring 405, which is convenient for the subsequent discharge of the wafer silicon wafer.

[0047] The loading mechanism 4 also includes a blocking plate 407 fixed at the bottom of the support plate 2, the blocking plate 407 is adapted to the loading platform 402, a telescopic cylinder 410 is fixed to the outer surface of the support plate 2, and a top pressure ring 408 is fixed to the telescopic end of the telescopic cylinder 410, and the top pressure ring 408 is slidably connected to the blocking plate 407, and two sliding rods 409 are fixed to the outer surface of the support plate 2, and the two sliding rods 409 are slidably connected to the top pressure ring 408. When loading, the wafer silicon wafer is placed on the anti-slip table 406 when in use, and the moving electric rail 401 is controlled to drive the loading platform 402 to move, so that the anti-slip table 406 moves to the bottom of the carrying tube 3, and the correction mechanism 5 is used to make the wafer silicon wafer and the carrying tube 3 on the same axis, and the telescopic cylinder 410 is controlled to drive the top pressure ring 408 to move upward to press the baffle plate 404, so as to lift the wafer silicon wafer that has been returned to its position.

[0048] See also Figure 6 , Figure 7 and Figure 8 A correction mechanism 5 is arranged on the outside of the anti-slip table 406, and the correction mechanism 5 includes two symmetrical moving frames 501, and the two moving frames 501 are respectively located on both sides of the anti-slip table 406, and a group of correction rollers 502 are rotatably connected to the side surfaces of the two moving frames 501 close to each other, and the number of each group of correction rollers 502 is two and symmetrical to each other, and a grinding mechanism 6 is arranged above the anti-slip table 406, and the grinding mechanism 6 includes a U-shaped frame 602, and a grinding roller 601 is installed below the U-shaped frame 602, and the two correction rollers 502 in each group of correction rollers 502 are respectively located on both sides of the grinding roller 601.

[0049] A motor 505 is fixed to the outer surface of the water collecting trough 1, and a bidirectional threaded rod 504 is fixed to the output end of the motor 505. The bidirectional threaded rod 504 is rotatably connected to the water collecting trough 1. Threaded tubes 503 are fixed to the outer surfaces of the two movable frames 501, and the two threaded tubes 503 are threadedly connected to the bidirectional threaded rod 504. A limiting rod group 506 is fixed to the inner wall of the water collecting trough 1. The limiting rod group 506 includes two limiting rods. The two movable frames 501 are slidably connected to the limiting rod group 506. When the silicon wafer is located between the two movable frames 501, the motor 505 is controlled to drive the bidirectional threaded rod 504 to rotate. The bidirectional threaded rod 504 rotates the two movable frames 501 to approach each other. At this time, the two groups of correcting rollers 502 will correct the silicon wafer and return it to its original position, so that the silicon wafer and the supporting tube 3 are on the same axis, so that the device can adapt to silicon wafers of different diameters.

[0050] Two symmetrical auxiliary components are arranged above each moving frame 501, and the auxiliary components include a sleeve 507 fixed on the moving frame 501, and a pressure block 508 is slidably connected to the inner wall of the sleeve 507, and a plurality of balls are installed on the bottom surface of the pressure block 508. A telescopic spring 509 is arranged inside the sleeve 507, and the two ends of the telescopic spring 509 are respectively fixed to the sleeve 507 and the pressure block 508. During the grinding and thinning process of the silicon wafer, the pressure block 508 is subjected to the spring pressure of the telescopic spring 509, so that the pressure block 508 always fits the upper surface of the silicon wafer. The four pressure blocks 508 assist the silicon wafer in rotating, thereby improving the stability of the silicon wafer during rotation.

[0051] See also Fig. 9 , Fig.10 and Fig.11 Two sliding rods 606 are fixed on the outer surface of the water collecting tank 1, and the two sliding rods 606 are slidably connected to the U-shaped frame 602. The outer surface of the carrying cylinder 3 is rotatably connected with a one-way threaded rod 603, and the one-way threaded rod 603 is threadedly connected to the U-shaped frame 602. A scale 604 is fixed on the outer surface of the carrying cylinder 3, and a pointer 605 matched with the scale 604 is fixed on the outer surface of the U-shaped frame 602. The one-way threaded rod 603 is rotated to control the descending distance of the grinding roller 601, so as to adjust the thinning degree of the silicon wafer by the grinding roller 601. The descending distance of the grinding roller 601 can be accurately controlled by the distance that the pointer 605 moves on the scale 604, so that the staff can accurately control the thinning degree of the silicon wafer.

[0052] See also Fig.12 and Fig.13A cooling mechanism 7 is provided above the grinding roller 601, and the cooling mechanism 7 includes a water outlet trough 703 fixed below the supporting cylinder 3, the water outlet trough 703 is located above the grinding roller 601, and a water inlet pipe 701 is fixedly connected above the water outlet trough 703, and a water pump 702 is installed on the outer surface of the water inlet pipe 701, and the water pump 702 is fixed on the outer surface of the supporting plate 2, and water retaining blocks 510 are fixed on the upper surfaces of the two movable frames 501, and the two water retaining blocks 510 are both sealingly slidably connected to the water outlet trough 703.

[0053] The interior of the water outlet trough 703 is provided with a connected square cavity and a C-shaped cavity, and the bottom of the C-shaped cavity is provided with an opening (water outlet). The water pump 702 draws external coolant through the water inlet pipe 701 and circulates it into the square cavity of the water outlet trough 703. The coolant in the square cavity of the water outlet trough 703 then flows out from the bottom of the C-shaped cavity. The top of the water retaining block 510 coincides with the square cavity and the C-shaped cavity, and is slidably arranged inside the square cavity and the C-shaped cavity. The top of the water retaining block 510 is sealed and slidably connected to the cavity walls of the square cavity and the C-shaped cavity, so that the coolant in the water outlet trough 703 is only sprayed out from between the two water retaining blocks 510.

[0054] When the two moving frames 501 move according to the size of the wafer silicon wafer, the moving frames 501 simultaneously drive the water retaining block 510 to move. The distance between the two water retaining blocks 510 is equal to the diameter of the wafer silicon wafer. The coolant sprayed from the water outlet 703 will completely cover the polishing area of ​​the wafer silicon wafer, providing a cooling effect for the polishing area.

[0055] See also Fig.14 , Fig.15 and Fig.16 An annular track 11 and an annular top plate 12 are fixed to the inner wall of the bearing tube 3, and the annular top plate 12 is located below the annular track 11. Twelve pressing mechanisms 8 are arranged inside the bearing tube 3, and the pressing mechanisms 8 include a sleeve 801, and an extrusion column 806 is slidably connected to the inner wall of the sleeve 801. A telescopic spring 807 is arranged inside the sleeve 801, and both ends of the telescopic spring 807 are respectively fixed to the sleeve 801 and the extrusion column 806.

[0056] A motor 2 10 is fixed to the outer surface of the carrying cylinder 3, and a rotating plate 9 is arranged inside the carrying cylinder 3. The rotating plate 9 is rotatably connected to the water inlet pipe 701, and the output end of the motor 2 10 is transmission-connected to the rotating plate 9 via a belt and a pulley. The pressing mechanism 8 also includes a slider 803, which is fixed to the rotating plate 9 and slidably connected to the annular track 11. The arrangement of the telescopic spring 4 807 can prevent the extrusion column 806 from clamping the wafer in cooperation with the anti-slip table 406, thereby preventing the wafer from being damaged due to excessive clamping.

[0057] A slide bar 3 802 is fixed on the top of the sleeve 801, and the top end of the slide bar 3 802 passes through the slider 803 and is slidably connected to the slider 803. The outer surface of the slide bar 3 802 is sleeved with a telescopic spring 3 804, and the telescopic spring 3 804 is fixed between the slider 803 and the sleeve 801. The pressure column 805 is subjected to the spring force of the telescopic spring 3 804, so that the pressure column 805 remains in contact with the annular top plate 12. A pressure column 805 is fixed on the outer surface of the sleeve 801, and a ball is installed on the top end of the pressure column 805. The ball of the pressure column 805 contacts the bottom surface of the annular top plate 12. The annular top plate 12 is composed of an arc top plate, an arc bottom plate and two inclined arc plates, and the two inclined arc plates are fixed between the arc top plate and the arc bottom plate. When the motor 2 10 drives the rotating plate 9 to rotate, the rotating The rotation of plate 9 drives the twelve pressing mechanisms 8 to rotate. At this time, the pressure column 805 located at the arc top plate of the annular top plate 12 will be squeezed by the oblique arc plate of the annular top plate 12 and move downward. When the pressure column 805 moves to the arc bottom plate of the annular top plate 12, the squeezing column 806 cooperates with the anti-slip table 406 to clamp the wafer silicon wafer. The rotating plate 9 continues to drive the squeezing column 806 to rotate, thereby rotating the wafer silicon wafer. The rotating unidirectional threaded rod 603 drives the grinding roller 601 to descend, so that the rotating wafer silicon wafer is polished and thinned by the grinding roller 601. The two oblique arc plates of the annular top plate 12 are far away from the water outlet trough 703 and the grinding roller 601. When the pressure column 805 moves along the oblique arc plate of the annular top plate 12, the water outlet trough 703 and the grinding roller 601 do not interfere with the moving trajectory of the pressing mechanism 8.

[0058] During the grinding and thinning process of the silicon wafer, the pressing block 508 is always in contact with the upper surface of the silicon wafer due to the spring pressure of the telescopic spring 509. The four pressing blocks 508 will assist the silicon wafer in rotating. At the same time, the four deviation correction rollers 502 will horizontally clamp the silicon wafer. When the squeezing column 806 located under the arc bottom plate of the annular top plate 12 rotates, the squeezing column 806 cooperates with the anti-slip table 406 to clamp the silicon wafer so that the silicon wafer can rotate smoothly.

[0059] Working principle: When in use, place the silicon wafer on the anti-slip table 406, control the moving electric rail 401 to drive the loading table 402 to move, so that the anti-slip table 406 moves to the bottom of the carrying tube 3, and then control the motor 1 505 to drive the two-way threaded rod 504 to rotate. The two-way threaded rod 504 rotates and the two moving frames 501 are close to each other. At this time, the two sets of deviation correction rollers 502 will correct the deviation of the silicon wafer and return it to its original position, so that the silicon wafer and the carrying tube 3 are on the same axis, and then control the telescopic cylinder 410 to drive the top pressure ring 408 to move upward to press the baffle 404, lift the silicon wafer that has been returned to its original position, and make the lifted silicon wafer press the four pressure blocks 508 to retract into their corresponding sleeves 507 respectively, and at the same time, the lifted silicon wafer is squeezed by the extended squeezing column 806, and then control the motor 2 10 to drive The rotating plate 9 rotates, and the rotation of the rotating plate 9 drives the twelve pressing mechanisms 8 to rotate. At this time, the pressure column 805 located at the arc top plate of the annular top plate 12 will be squeezed by the inclined arc plate of the annular top plate 12 and move downward. When the pressure column 805 moves to the arc bottom plate of the annular top plate 12, the squeezing column 806 cooperates with the anti-slip table 406 to clamp the wafer silicon wafer, and the rotating plate 9 continues to drive the squeezing column 806 to rotate, thereby rotating the wafer silicon wafer, and rotating the one-way threaded rod 603 drives the grinding roller 601 to descend, so that the rotating wafer silicon wafer is polished and thinned by the grinding roller 601. By transmitting rotation in this way, the wafer silicon wafer is thinned, which not only avoids the problem of the clamping claw blocking the grinding area, but also avoids the problem of poor limiting effect caused by the heat generated by grinding compared to the suction cup limiting method.

[0060] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

Claims

1. A thinning device for wafer silicon processing, comprising a water collecting tank (1), characterized in that: A support plate (2) is fixed to the inner wall of the water collecting tank (1), a bearing cylinder (3) is fixed to the top of the support plate (2), a loading mechanism (4) is arranged below the bearing cylinder (3), the loading mechanism (4) comprises a sliding cylinder (403), and the top of the sliding cylinder (403) is rotatably connected to an anti-slip platform (406); A deflection correction mechanism (5) is arranged outside the anti-slip platform (406), the deflection correction mechanism (5) comprises two symmetrical moving frames (501), the two moving frames (501) are respectively located on two sides of the anti-slip platform (406), and a group of deflection correction rollers (502) are rotatably connected to the side surfaces of the two moving frames (501) close to each other, and each group of deflection correction rollers (502) is two in number and symmetrical to each other, a grinding mechanism (6) is arranged above the anti-slip platform (406), the grinding mechanism (6) comprises a U-shaped frame (602), a grinding roller (601) is installed below the U-shaped frame (602), and the two deflection correction rollers (502) in each group of deflection correction rollers (502) are respectively located on two sides of the grinding roller (601); The inner wall of the bearing tube (3) is fixed with an annular track (11) and an annular top plate (12), the annular top plate (12) is composed of an arc top plate, an arc bottom plate and two inclined arc plates, and the two inclined arc plates are fixed between the arc top plate and the arc bottom plate, the annular top plate (12) is located below the annular track (11), twelve pressing mechanisms (8) are arranged inside the bearing tube (3), the pressing mechanisms (8) include a sleeve (801), the inner wall of the sleeve (801) is slidably connected with an extrusion column (806), a telescopic spring four (807) is arranged inside the sleeve (801), and the two ends of the telescopic spring four (807) are respectively fixed to the sleeve (801) and the extrusion column (806); A second motor (10) is fixed on the outer surface of the bearing cylinder (3); a rotating plate (9) is arranged inside the bearing cylinder (3); an output end of the second motor (10) is connected to the rotating plate (9) through a belt and a pulley; the pressing mechanism (8) further comprises a slider (803); the slider (803) is fixed to the rotating plate (9); and the slider (803) is slidably connected to the annular track (11); A sliding rod three (802) is fixed above the sleeve (801), the top end of the sliding rod three (802) passes through the slider (803) and is slidably connected to the slider (803), the outer surface of the sliding rod three (802) is sleeved with a telescopic spring three (804), the telescopic spring three (804) is fixed between the slider (803) and the sleeve (801), and a pressure column (805) is fixed on the outer surface of the sleeve (801), and a ball bearing is installed on the top end of the pressure column (805), and the ball bearing of the pressure column (805) is in contact with the bottom surface of the annular top plate (12).

2. The thinning device for wafer silicon processing according to claim 1, characterized in that: The feeding mechanism (4) further comprises a movable electric rail (401) fixed on the water collecting tank (1); a feeding platform (402) is fixed to the output end of the movable electric rail (401); the sliding cylinder (403) passes through the feeding platform (402) and is slidably connected to the feeding platform (402); a baffle (404) is fixed to the bottom of the sliding cylinder (403); a telescopic spring (405) is sleeved on the outer surface of the sliding cylinder (403); and the telescopic spring (405) is fixed between the feeding platform (402) and the baffle (404).

3. The thinning device for wafer silicon processing according to claim 2, characterized in that: The feeding mechanism (4) further comprises a blocking plate (407) fixed to the bottom of the support plate (2), the blocking plate (407) being matched with the feeding platform (402), a telescopic cylinder (410) being fixed to the outer surface of the support plate (2), a top pressure ring (408) being fixed to the telescopic end of the telescopic cylinder (410), the top pressure ring (408) being slidably connected to the blocking plate (407), and two sliding rods (409) being fixed to the outer surface of the support plate (2), both of the two sliding rods (409) being slidably connected to the top pressure ring (408).

4. The thinning device for wafer silicon processing according to claim 1, characterized in that: A motor 1 (505) is fixed to the outer surface of the water collecting trough (1), a bidirectional threaded rod (504) is fixed to the output end of the motor 1 (505), the bidirectional threaded rod (504) is rotatably connected to the water collecting trough (1), a threaded tube (503) is fixed to the outer surface of the two movable frames (501), the two threaded tubes (503) are threadedly connected to the bidirectional threaded rod (504), a limiting rod group (506) is fixed to the inner wall of the water collecting trough (1), the limiting rod group (506) comprises two limiting rods, and the two movable frames (501) are slidably connected to the limiting rod group (506).

5. The thinning device for wafer silicon processing according to claim 1, characterized in that: Two symmetrical auxiliary components are arranged above each of the movable frames (501), and the auxiliary components include a sleeve (507) fixed on the movable frame (501), the inner wall of the sleeve (507) is slidably connected with a pressure block (508), the bottom surface of the pressure block (508) is installed with a plurality of balls, and a second telescopic spring (509) is arranged inside the sleeve (507), and the two ends of the second telescopic spring (509) are respectively fixed to the sleeve (507) and the pressure block (508).

6. The thinning device for wafer silicon processing according to claim 1, characterized in that: Two sliding rods (606) are fixed on the outer surface of the water collecting tank (1), and the two sliding rods (606) are both slidably connected to the U-shaped frame (602). The outer surface of the supporting cylinder (3) is rotatably connected to a one-way threaded rod (603), and the one-way threaded rod (603) is threadedly connected to the U-shaped frame (602). A scale (604) is fixed on the outer surface of the supporting cylinder (3), and a pointer (605) adapted to the scale (604) is fixed on the outer surface of the U-shaped frame (602).

7. The thinning device for wafer silicon processing according to claim 1, characterized in that: A cooling mechanism (7) is arranged above the grinding roller (601), and the cooling mechanism (7) comprises a water outlet trough (703) fixed below the supporting cylinder (3), the water outlet trough (703) being located above the grinding roller (601), a water inlet pipe (701) being fixedly connected above the water outlet trough (703), the rotating plate (9) being rotatably connected to the water inlet pipe (701), a water pump (702) being installed on the outer surface of the water inlet pipe (701), the water pump (702) being fixed on the outer surface of the supporting plate (2), and water retaining blocks (510) being fixed on the upper surfaces of the two movable frames (501), and the two water retaining blocks (510) being sealingly slidably connected to the water outlet trough (703).

Images