Method for producing electrically conductive connection
By setting adhesive components between the wire and the circuit board and using welding methods, the positioning and mechanical connection problems between the electrical contact areas between the wire and the circuit board are solved, and reliable electrical contact connection and material locking protection are achieved.
Patent Information
- Application Number
- CN202410922183.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2023-07-11
- Filing Date
- 2024-07-10
- Publication Date
- 2025-01-14
AI Technical Summary
The prior art is difficult to achieve reliable positioning and mechanical connections between the electrical contact areas of the conductor and the circuit board, especially due to unreliable material locking connections due to shape tolerances and modifications of the flexible material.
An adhesive element is provided between the wire and the circuit board, allowing relative movement but not adhesion connection under low pressure. The adhesive connection is constructed in the mechanical contact area through the adhesive element, and a material locking connection is formed by the welding method to ensure that the wire and the circuit board are connected. Reliable positioning and mechanical connection.
Reliable positioning and mechanical connection between the wire and the circuit board is achieved, protecting the material locking connection from the damage of tensile forces and pressure loads, and improving the reliability and stability of the connection.
Smart Images
Figure CN119315320A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to a method for producing an electrically conductive connection according to the type specified in the independent claim. Background Art
[0002] When producing an electrically conductive connection between an electrical contact region of a conductor and an electrical contact region of a printed circuit board, it is common to pre-position the conductor and mechanically connect it to the printed circuit board. In particular, this pre-positioning can be done by means of a so-called pressure-sensitive adhesive, also referred to in English as a pressure sensitive adhesive or PSA, and subsequently a cohesive, electrically conductive connection can be formed between the electrical contact region of the conductor and the printed circuit board.
[0003] In particular, deviations in the positioning may occur due to the flexible or elastic material, geometric tolerances and morphing of the lines, as a result of which an unreliable integral connection may be formed. Summary of the invention
[0004] A method for producing an electrically conductive connection having the features of the independent claim offers the advantage that a reliable positioning of an electrical contact region of a conductor relative to an electrical contact region of a printed circuit board and ultimately also a mechanical connection between them can be produced.
[0005] To this end, according to the present invention, a method for establishing an electrically conductive connection is provided. The method is designed to establish an electrically conductive connection between an electrical contact region of a conductor and an electrical contact region of a circuit board. Here, an adhesive element is also arranged in the mechanical contact region between the conductor and the circuit board. The adhesive element is designed in this way so that a relative movement between the conductor and the circuit board is allowed when a pressure below a certain value acts, without forming an adhesive connection.
[0006] Furthermore, the electrical contact area of the conductor is positioned relative to the electrical contact area of the circuit board so that a pressure below a certain value acts on the adhesive element for positioning. In particular, the electrical contact area of the conductor can be positioned centrally above the electrical contact area of the circuit board.
[0007] Subsequently, a cohesive connection is formed between the electrical contact region of the conductor and the electrical contact region of the printed circuit board. In particular, such a cohesive connection can be formed by means of a welding method.
[0008] In this case, the adhesive connection is formed in the mechanical contact region by means of an adhesive element before or during the formation of the cohesive connection.
[0009] Advantageous developments and improvements of the device described in the independent claim are made possible by the measures listed in the dependent claims.
[0010] First of all, it should be noted that in the mechanical contact area, both the conductor and the printed circuit board are arranged in mechanical contact with the adhesive element and that the conductor and the printed circuit board are moved relative to each other for positioning without exceeding a certain value for the pressure. Thus, an appropriate pressure can still be applied in order to achieve reliable positioning.
[0011] It should be noted here that the integral connection and the adhesive connection are designed to be spatially separated from each other. As a result, the adhesive connection can protect the integral connection from tensile and compressive loads that could damage the integral connection.
[0012] Furthermore, it should be noted that a circuit board (in English: Printed Circuit Board or PCB for short) or, as it is also known as a printed circuit board, is in principle a carrier element for electronic components, which is used in particular for mechanically fixing and electrically connecting the electronic components. For this purpose, the circuit board has an electrically insulating material, on or in which an electrically conductive connection, a so-called conductor, is arranged, which is preferably made of copper.
[0013] Advantageously, the conductors are received in a thin film. Thus, a so-called flexfoil can be used.
[0014] The conductor is expediently made of copper, thereby making it possible to construct a reliable electrical line.
[0015] According to a preferred aspect of the present invention, the bonding element comprises an elastically deformable outer cover. An adhesive is accommodated inside the outer cover. In particular, the bonding element comprises silicone. Preferably, the bonding element is constructed as a pressure-sensitive adhesive, which is also called pressure sensitive adhesive or PSA in English.
[0016] In this case, the adhesive element, in particular the casing, is spherical in design.
[0017] Preferably, a plurality of adhesive elements are arranged.
[0018] Furthermore, it is expedient to adjust and control the positioning by means of an optical system. In particular, the optical system can be a camera system.
[0019] Finally, it should be noted that the adhesive element develops its adhesive effect when a certain value for the pressure is exceeded. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] Exemplary embodiments of the invention are illustrated in the drawings and are explained in more detail in the following description.
[0021] in:
[0022] Figure 1 The electrically conductive connection according to the invention is shown in a top view;
[0023] Figure 2 The steps of the method according to the invention for producing an electrically conductive connection are shown in a sectional view from the side; and
[0024] Figure 3 A further step of the method according to the invention for producing an electrically conductive connection is shown in a sectional view from the side. DETAILED DESCRIPTION
[0025] Let's do it together Figures 1 to 3 Give a description.
[0026] A method for producing an electrically conductive connection 1 between an electrical contact region 31 of a conductor 3 and an electrical contact region 41 of a printed circuit board 4 can be seen.
[0027] In particular, the conductor is accommodated in the film 30. Furthermore, the conductor 3 consists of copper.
[0028] In this case, an adhesive element 5 is arranged in the mechanical contact region 2 between the conductor 3 and the printed circuit board 4 .
[0029] In particular, the adhesive element 5 is designed in such a way that, when a pressure below a certain value is applied, a relative movement between the conductor 3 and the printed circuit board 4 is permitted without an adhesive connection 7 being formed.
[0030] In this case, the adhesive element 5 comprises an elastically deformable outer casing 51. Adhesive 53 is accommodated in the interior 52 of the outer casing 51. It can also be seen that the adhesive element 5, in particular its outer casing 51, is spherical in shape.
[0031] Furthermore, preferably a plurality of adhesive elements 5 are arranged.
[0032] Depend on Figure 2 It can be seen that the electrical contact region 31 of the conductor 3 is positioned relative to the electrical contact region 41 of the printed circuit board 4 such that a pressure below a certain value acts on the adhesive element 5 for positioning.
[0033] The positioning of the electrical contact region 31 of the conductor 3 relative to the electrical contact region 41 of the printed circuit board 4 can preferably be adjusted and controlled by means of an optical system 8 , such as in particular a camera system 80 .
[0034] Depend on Figure 3It can be seen that subsequently, a materially bonded connection 6 is formed between the electrical contact region 31 of the conductor 3 and the electrical contact region 41 of the printed circuit board 4 , in particular by means of a welding method 60 .
[0035] Furthermore, it can be seen that the adhesive connection 7 is formed in the mechanical contact region 2 by means of the adhesive element 5 before or during the formation of the integral connection 6 .
Claims
1. A method for establishing an electrically conductive connection (1) between an electrical contact region (31) of a conductor (3) and an electrical contact region (41) of a printed circuit board (4), wherein an adhesive element (5) is also arranged in the mechanical contact region (2) between the conductor (3) and the printed circuit board (4), wherein the adhesive element allows a relative movement between the conductor (3) and the printed circuit board (4) when a pressure below a certain value is applied, without forming an adhesive connection (6), wherein the electrical contact region (31) of the conductor (3) is positioned relative to the electrical contact region (41) of the printed circuit board (4) in such a way that a pressure below a certain value is applied to the adhesive element (5) for positioning, wherein subsequently a material-locked connection (6) is formed between the electrical contact region (31) of the conductor (3) and the electrical contact region (41) of the printed circuit board (4), in particular by means of a welding method (60), wherein Before or during the formation of the integrally bonded connection (6), an adhesive connection (7) is formed in the mechanical contact region (2) by means of the adhesive element (5).
2. The method according to the preceding claim, It is characterized in that The conductor (3) is received in the film (30).
3. The method according to any one of the preceding claims, It is characterized in that The conductive wire (3) is made of copper.
4. The method according to any one of the preceding claims, It is characterized in that The adhesive element (5) comprises an elastically deformable outer cover (51), in the interior (52) of which adhesive (53) is accommodated.
5. A method according to the preceding claim, It is characterized in that The bonding element (5) is spherical in design.
6. The method according to any one of the preceding claims, It is characterized in that A plurality of bonding elements (5) are arranged.
7. The method according to any one of the preceding claims, It is characterized in that The positioning is adjusted and controlled by means of an optical system (8), in particular a camera system (80).