Electronic device

Abstract

The invention provides an electronic device. The electronic device comprises an outer frame and a lead, the outer frame is provided with a first concave part and a second concave part which are adjacent, and the first concave part is separated from the second concave part. The wire has a first convex portion and a second convex portion. The first convex part is correspondingly arranged in the first concave part, and the second convex part is correspondingly arranged in the second concave part.

Description

Technical Field

[0001] The present disclosure relates to an electronic device, and in particular to an electronic device with corresponding structures on an outer frame and a conductive wire. Background Art

[0002] Due to the rapid development of technology, the use of electronic devices is becoming more and more popular. It has become an important consideration to firmly set the power connection of electronic devices during use. This can improve the reliability of the use of electronic devices and reduce the risk of failure of electronic devices due to unstable power connection. However, there is still room for improvement in the existing design. Summary of the invention

[0003] Some embodiments of the present disclosure provide an electronic device, comprising: an outer frame and a wire. The outer frame has a first concave portion and a second concave portion adjacent to each other, and the first concave portion is separated from the second concave portion. The wire has a first convex portion and a second convex portion. The first convex portion is correspondingly arranged in the first concave portion, and the second convex portion is correspondingly arranged in the second concave portion.

[0004] Some embodiments of the present disclosure provide an electronic device, comprising: an outer frame, a wire, and a cover. The outer frame has a first recess and a second recess separated from the first recess. The wire has a first convex portion. The cover has a through hole. The first convex portion is correspondingly arranged in the first recess, the wire partially overlaps with the second recess, and the normal direction of the first recess is different from the normal direction of the through hole.

[0005] In order to make the above and other purposes, features and advantages of the present disclosure more obvious and understandable, some embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] The various aspects of the present disclosure may be fully understood from the following detailed description in conjunction with the accompanying drawings. It should be noted that, in accordance with standard practice in the industry, various features are not drawn to scale and are for illustration purposes only. In fact, the size of the components may be arbitrarily enlarged or reduced to clearly illustrate the features of the present disclosure.

[0007] Figure 1 A partial stereoscopic schematic diagram of an electronic device according to some embodiments of the present disclosure is shown.

[0008] Figure 2A A partially enlarged perspective view of an outer frame according to some embodiments of the present disclosure is shown.

[0009] Figure 2B A partially enlarged plan view showing an outer frame according to some embodiments of the present disclosure.

[0010] Figure 3A A side view of a wire is shown according to some embodiments of the present disclosure.

[0011] Figure 3B A side view of a wire is shown according to some embodiments of the present disclosure.

[0012] FIG. 4A to FIG. 4C A partial perspective schematic diagram showing the assembly steps of an electronic device according to some embodiments of the present disclosure.

[0013] Figure 5 A partial side schematic diagram of an electronic device according to some embodiments of the present disclosure is shown.

[0014] Figure 6 The electronic device according to some embodiments of the present disclosure is shown along Figure 1 A schematic cross-sectional view along line AA' is shown.

[0015] Figure 7 A partial bottom view schematically shows an electronic device according to some embodiments of the present disclosure.

[0016]

Explanation of symbols

[0017] 100: Electronic devices

[0018] 110: Outer frame

[0019] 110A: Accommodation

[0020] 110B: Flat surface

[0021] 111: First concave part

[0022] 111A: First Subsection

[0023] 111B: Second subsection

[0024] 112: Second recess

[0025] 113: Side wall

[0026] 120: Wire

[0027] 121: First convex part

[0028] 121A: Subpart 1

[0029] 121B: Second subsection

[0030] 122:Second convex part

[0031] 123: The third convex part

[0032] 124:Ontology

[0033] 126: first end

[0034] 127: Second end

[0035] 130: Cover

[0036] 131:Through hole

[0037] 134:The fourth convex part

[0038] A-A': line

[0039] D1: First diameter

[0040] D2: Second diameter

[0041] L1: First length

[0042] L2: Second length

[0043] L3: The third length

[0044] T1: First thickness

[0045] T2: Second thickness

[0046] W1: First width

[0047] W2: Second width

[0048] W3: Third width

[0049] W4: Fourth width DETAILED DESCRIPTION

[0050] The present disclosure can be understood by referring to the following detailed description in conjunction with the accompanying drawings. It should be noted that in order to make it easy for readers to understand and the drawings are concise, the multiple drawings in the present disclosure only depict a portion of the light-emitting unit, and the specific components in the drawings are not drawn according to the actual scale. In addition, the number and size of each component in the figure are only for illustration and are not intended to limit the scope of the present disclosure. In addition, similar and / or corresponding reference numerals may be used in different embodiments, which is only for the purpose of simply and clearly describing some embodiments, and does not represent any correlation between the different embodiments and / or structures discussed.

[0051] Certain words are used throughout the specification and the claims that follow to refer to specific components. It should be understood by those skilled in the art that electronic equipment manufacturers may refer to the same components by different names. This document does not intend to distinguish between components that have the same function but different names. In the following specification and claims, words such as "include", "contain", "have" are open-ended words, and therefore should be interpreted as "including but not limited to..." Therefore, when the terms "include", "contain" and / or "have" are used in the description of the present disclosure, they specify the existence of corresponding features, areas, steps, operations and / or components, but do not exclude the existence of one or more corresponding features, areas, steps, operations and / or components.

[0052] In addition, relative terms such as "below" or "bottom" and "above" or "top" may be used in the embodiments to describe the relative relationship of one component to another component in the drawings. It is understood that if the device in the drawings is turned upside down, the component described on the "below" side will become the component on the "above" side.

[0053] When a corresponding component (such as a film layer or region) is referred to as being "on another component", it can be directly on the other component, or other components can exist between the two. On the other hand, when a component is referred to as being "directly on another component", there is no component between the two. In addition, when a component is referred to as being "on another component", the two have a top-down relationship in the top view direction, and the component can be above or below the other component, and this top-down relationship depends on the orientation of the device.

[0054] It is understood that although the terms "first", "second", etc. may be used herein to describe various components, layers and / or parts, these components, layers and / or parts should not be limited by these terms, and these terms are only used to distinguish different components, layers and / or parts. Therefore, a first component, layer and / or part discussed below may be referred to as a second component, layer and / or part without departing from the teachings of some embodiments of the present disclosure. In addition, for the sake of brevity, the terms "first", "second", etc. may not be used in the specification to distinguish different components. Without violating the scope defined by the appended claims, the first component and / or second component recorded in the claims may be interpreted as any component that conforms to the description in the specification.

[0055] In the present disclosure, the length, width and / or thickness can be measured by an optical microscope, or by a cross-sectional image in an electron microscope, but the above measurement methods are only examples and the present disclosure is not limited thereto. In addition, there may be a certain error between any two values ​​or directions used for comparison. The terms "approximately", "equal", "equal" or "same", "substantially" or "substantially" are generally interpreted as within 20% of a given value, or as within a range of 10%, 5%, 3%, 2%, 1% or 0.5% of a given value. In addition, the term "electrically connected" may be used below. It should be understood that if the present disclosure states that "the first component is electrically connected to the second component", it can be interpreted as the first component and the second component are electrically connected to each other and can be synchronously controlled by a single operation, which may include the situation that "there may be other components between the first component and the second component to electrically connect the two", or include the situation that "there are no other components between the first component and the second component and they are directly electrically connected". If the text refers to the first component being "directly electrically connected" to the second component, it refers to the situation that "there are no other components between the first component and the second component and they are directly electrically connected". In addition, the term "electrically isolated" may be used below. It should be understood that if the present disclosure states that "the first component is electrically isolated from the second component", it can be interpreted as the first component and the second component are electrically separated and not connected to each other, nor are they synchronously controlled by a single operation.

[0056] It should be noted that the technical solutions provided in the following different embodiments can be replaced, combined or mixed with each other to form another embodiment without violating the spirit of the present disclosure.

[0057] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those skilled in the art to which this disclosure belongs. It is understood that these terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with the background or context of the relevant technology and the present disclosure, and should not be interpreted in an idealized or overly formal manner unless specifically defined herein.

[0058] Figure 1A partial plan view of an electronic device 100 according to some embodiments of the present disclosure is shown. The electronic device 100 may include a display device, a backlight device, an antenna device, a light-emitting device, a sensing device, a touch device or a splicing device, but the present disclosure is not limited thereto. The electronic device 100 may be a bendable or flexible electronic device. The display device may be a non-self-luminous display device or a self-luminous display device. The antenna device may be a liquid crystal antenna device or a non-liquid crystal antenna device, and the sensing device may be a sensing device for sensing capacitance, light, heat or ultrasound, but the present disclosure is not limited thereto. In some embodiments, the electronic device 100 includes a flexible panel, and the flexible panel includes electronic components, and the electronic components may include passive components and active components, such as capacitors, resistors, inductors, diodes, transistors, etc. In some embodiments, the electronic device may include, for example, a diode, a liquid crystal, a light emitting diode (LED), a quantum dot (QD), fluorescence, phosphorescence, other suitable display media or a combination thereof. In some embodiments, the diode may include a light emitting diode or a photodiode. The light emitting diode may, for example, include an organic light emitting diode (OLED), a sub-millimeter light emitting diode (miniLED), a micro LED (micro LED) or a quantum dot light emitting diode (quantum dot LED), but the present disclosure is not limited thereto. The splicing device may, for example, be a display splicing device or an antenna splicing device, but the present disclosure is not limited thereto. It should be noted that the electronic device 100 may be any arrangement or combination of the foregoing, but the present disclosure is not limited thereto. In addition, the appearance of the electronic device 100 may be a rectangular, circular, polygonal, a shape with curved edges or other suitable shapes. The electronic device may have peripheral systems such as a drive system, a control system, a light source system, etc. to support a display device, an antenna device, a wearable device (for example, including augmented reality or virtual reality), a vehicle-mounted device (for example, including a car windshield) or a splicing device.

[0059] The following paragraphs will explain the contents of the present disclosure with respect to the local structure of the electronic device 100 . Those skilled in the art should understand that the electronic device 100 may also include other structures or be provided with suitable electronic components to perform the intended functions.

[0060] like Figure 1As shown, the electronic device 100 includes an outer frame 110, a wire 120, and a cover 130. It should be understood that in order to clearly show the detailed structure of the outer frame 110 and the wire 120, the cover 130 is shown in dotted lines in this embodiment. In addition, for the sake of simplicity, only a partial structure of the wire 120 is shown in this embodiment, and the following will refer to Figure 3A and Figure 3B The structure of the wire 120 is further described.

[0061] In some embodiments, the outer frame 110 can be used to protect the electronic components (not shown) disposed inside the electronic device 100. In one embodiment, the outer frame 110 can be, for example, a housing, a back cover, a cover plate, a back plate, etc. of the electronic device, but is not limited thereto. In some embodiments, the wire 120 is disposed on the outer frame 110. For example, the wire 120 can be disposed outside the electronic device 100, that is, the outer frame 110 can be located between the electronic components and the wire 120. In some embodiments, the wire 120 can be used to connect to a power source (not shown), whereby the power source can be electrically connected to the electronic device 100, so that the electronic device 100 can operate normally. In addition, the cover 130 is disposed on the outer frame 110 and at least partially covers the wire 120. For example, the cover 130 partially overlaps with the wire 120 in the normal direction of the outer frame 110 (e.g., parallel to the z direction). In this way, the cover 130 can achieve the effect of protecting the wire 120 and the outer frame 110. However, the present disclosure is not limited thereto.

[0062] Figure 2A A partially enlarged perspective view of the outer frame 110 according to some embodiments of the present disclosure is shown. Figure 2B A partially enlarged plan view of the outer frame 110 according to some embodiments of the present disclosure is shown. Figure 2A and Figure 2B As shown, the outer frame 110 has adjacent first recess 111 and second recess 112, and the first recess 111 and the second recess 112 are separated. For example, there is another part of the outer frame 110 between the first recess 111 and the second recess 112, so that the first recess 111 and the second recess 112 are not connected. In some embodiments, the first recess 111 includes a first sub-portion 111A and a second sub-portion 111B connected. In some embodiments, at least one side wall 113 is formed in the second sub-portion 111B, extending toward the electronic components inside the electronic device 100. In some embodiments, the edge of the side wall 113 can define the boundary of the first sub-portion 111A and the second sub-portion 111B (as shown by the dotted line), but the present disclosure is not limited thereto. In one embodiment, the first recess 111 and the second recess 112 can be, for example, a groove formed in the outer frame 110, or a concave hole opened in the outer frame 110, but is not limited thereto.

[0063] In some embodiments, the first sub-portion 111A of the first recess 111 may have a first length L1 and a first width W1, the second sub-portion 111B has a second length L2 and a second width W2 less than the first width W1 in the area where the two opposite side walls 113 are provided, and the remaining portion of the second sub-portion 111B has a third length L3 and the first width W1. For example, the first length L1, the second length L2, and the third length L3 may be measured along the y direction, and the first width W1 and the second width W2 may be measured along the x direction, but the present disclosure is not limited thereto. In some embodiments, the measurement directions of the first length L1, the second length L2, and the third length L3 may be substantially perpendicular to the measurement directions of the first width W1 and the second width W2. However, the present disclosure is not limited thereto.

[0064] For example, the first length L1 may be in the range of about 8 cm to about 10 cm, the second length L2 may be in the range of about 5 cm to about 6 cm, and the third length L3 may be in the range of about 2 cm to about 4 cm. In some embodiments, the first width W1 may be in the range of about 8 cm to about 10 cm, and the second width W2 may be in the range of about 4 cm to about 6 cm. In some embodiments, the first width W1 may be greater than the second width W2. In addition, the second recess 112 may, for example, have a circular profile and have a first diameter D1. In some embodiments, the first diameter D1 may be between 2 cm and 4 cm. However, the above parameters are merely examples and are not intended to limit the scope of the present disclosure.

[0065] Figure 3A A side view of a wire 120 is shown according to some embodiments of the present disclosure. Figure 3B A side view of a wire 120 is shown according to some embodiments of the present disclosure. Figure 3A and Figure 3B As shown, the wire 120 has a first protrusion 121, a second protrusion 122, a third protrusion 123 and a body 124. For example, the body 124 may have a sheet-like structure, for example, extending along the y direction, but the present disclosure is not limited thereto. The first protrusion 121, the second protrusion 122 and the third protrusion 123 protrude from the body 124 respectively. In some embodiments, the first protrusion 121 and the second protrusion 122 are located on the same side of the body 124. The third protrusion 123 and the first protrusion 121 (or the second protrusion 122) are located on the opposite side of the body 124, but the present disclosure is not limited thereto.

[0066] In some embodiments, the first convex portion 121 includes a first sub-portion 121A and a second sub-portion 121B connected, and the second sub-portion 121B is between the first sub-portion 121A and the body 124. Specifically, the first sub-portion 121A can be connected to the body 124 through the second sub-portion 121B. In some embodiments, the first sub-portion 121A can have a first thickness T1 and a third width W3, and the second sub-portion 121B can have a second thickness T2 and a fourth width W4. For example, the first thickness T1 and the second thickness T2 can be measured along the z direction, and the third width W3 and the fourth width W4 can be measured along the x direction, but the present disclosure is not limited thereto. In some embodiments, the measurement direction of the first thickness T1 and the second thickness T2 can be substantially perpendicular to the measurement direction of the third width W3 and the fourth width W4. However, the present disclosure is not limited thereto.

[0067] For example, the first thickness T1 may be in the range of about 1 cm to about 2 cm, and the second thickness T2 may be in the range of about 2 cm to about 3 cm. In some embodiments, the third width W3 may be in the range of about 4 cm to about 6 cm, and the fourth width W4 may be in the range of about 7 cm to about 8 cm. However, the present disclosure is not limited thereto. In some embodiments, in the normal direction (e.g., parallel to the z-direction), the cross-sectional area of ​​the first sub-portion 121A of the first convex portion 121 is greater than the cross-sectional area of ​​the second sub-portion 121B of the first convex portion 121. In addition, the second convex portion 122 may, for example, have a circular profile and have a second diameter D2. In some embodiments, the second diameter D2 may be between 1 cm and 3 cm, but the present disclosure is not limited thereto.

[0068] In addition, the wire 120 also has a first end 126 and a second end 127 , wherein the first end 126 and the second end 127 are respectively connected to other power sources or electronic devices, and the structures of the connected power sources or electronic devices will not be described in detail below.

[0069] FIG. 4A to FIG. 4C A partial three-dimensional schematic diagram showing the assembly steps of the electronic device 100 according to some embodiments of the present disclosure. Figure 4A As shown, the first protrusion 121 of the wire 120 is aligned and mounted to the first sub-portion 111A of the first recess 111 (see, for example, Figure 2A , Figure 2B ). In the normal direction (e.g., parallel to the z direction), the cross-sectional area of ​​the second sub-portion 121B of the first convex portion 121 is less than or equal to the cross-sectional area of ​​the first sub-portion 111A of the first concave portion 111. For example, the cross-sectional area can be measured along a plane substantially perpendicular to the normal direction (e.g., an xy plane), but the present disclosure is not limited thereto.

[0070] like Figure 4BAs shown, the first protrusion 121 of the wire 120 is moved from the first sub-portion 111A of the first recess 111 to the second sub-portion 111B of the first recess 111. In some embodiments, in the normal direction (e.g., parallel to the z-direction), the cross-sectional area of ​​the second sub-portion 121B of the first protrusion 121 is less than or equal to the cross-sectional area of ​​the second sub-portion 111B of the first recess 111, so that the first protrusion 121 can be accommodated in the second sub-portion 111B of the first recess 111. For example, the above cross-sectional area can be measured along a plane parallel to the xy plane, but the present disclosure is not limited thereto. In addition, the second protrusion 122 of the wire 120 is mounted to the second recess 112 of the outer frame 110. In this way, by providing the first convex portion 121 and the second convex portion 122 on the wire 120 corresponding to the first concave portion 111 and the second concave portion 112 of the outer frame 110 respectively, the stability of the wire 120 on the outer frame 110 can be improved, and the risk of failure of the electronic device 100 due to displacement of the wire 120 can be reduced.

[0071] like Figure 4C As shown, after the first concave portion 121 and the second convex portion 122 of the wire 120 are respectively mounted to the first concave portion 111 and the second concave portion 112 of the outer frame 110, the cover 130 is disposed on the outer frame 110 and covers the wire 120. Specifically, the cover 130 has a through hole 131, wherein the through hole 131 is for the wire 120 to pass through, so that the cover 130 partially overlaps with the wire 120 in the normal direction of the outer frame 110 (for example, parallel to the z direction). In some embodiments, the normal direction of the first concave portion 111 is different from the normal direction of the through hole 131. For example, the normal directions of the first concave portion 111 and the through hole 131 can be defined as directions parallel to the central axes passing through the first concave portion 111 and the through hole 131, respectively. In some embodiments, the normal direction of the first concave portion 111 (for example, parallel to the z direction) is different from the normal direction of the through hole 131 (for example, parallel to the x direction). However, the present disclosure is not limited thereto.

[0072] Figure 5 A partial side view schematic diagram of an electronic device 100 according to some embodiments of the present disclosure is shown. Figure 5 As shown, the outer frame 110 has a receiving portion 110A and a flat portion 110B, wherein the receiving portion 110A protrudes from the flat portion 110B toward the cover 130. In this way, the first protrusion 121 and the second protrusion 122 of the wire 120 can pass through the receiving portion 110A to be fixed to the outer frame 110. The configuration of the receiving portion 110A can ensure that the fixing of the wire 120 does not reduce the space inside the outer frame 110, thereby the electronic device 100 can include more or larger electronic devices to improve the performance of the electronic device 100.

[0073] In some embodiments, the cover 130 has at least one fourth protrusion 134, which is configured to protrude toward the outer frame 110. Specifically, the fourth protrusion 134 may correspond to the third protrusion 123 of the wire 120. In some embodiments, the fourth protrusion 134 of the cover 130 may abut the third protrusion 123 of the wire 120. In some embodiments, a gap may be formed between the fourth protrusion 134 of the cover 130 and the third protrusion 123 of the wire 120. In this way, the fourth protrusion 134 of the cover 130 and the third protrusion 123 of the wire 120 may help to position and fix the wire 120 on the outer frame 110. However, the present disclosure is not limited to this.

[0074] In addition, if Figure 5 As shown, the side wall 113 of the outer frame 110 can cover the second sub-portion 121B of the first protrusion 121, and expose the first sub-portion 121A of the first protrusion 121. In some embodiments, the side wall 113 can abut the first sub-portion 121A of the first protrusion 121, that is, the length extended by the side wall 113 can be substantially equal to the second thickness T2 of the second sub-portion 121B of the first protrusion. In this way, the risk of the wire 120 moving in the vertical direction after installation can be reduced, but the present disclosure is not limited thereto.

[0075] Figure 6 The electronic device 100 according to some embodiments of the present disclosure is shown along Figure 1 A schematic cross-sectional view along line AA' is shown. Figure 7 A partial bottom view schematic diagram of an electronic device according to some embodiments of the present disclosure is shown. Figure 6 As shown, after the wire 120 is installed on the outer frame 110, the first protrusion 121 can be correspondingly disposed in the first recess 111, and the second protrusion 122 can be correspondingly disposed in the second recess 112. In some embodiments, as Figure 7 As shown, in the normal direction (e.g., parallel to the z-direction) of the first recess 111 (and the second recess 112), the cross-sectional area of ​​the second protrusion 122 is less than or equal to the cross-sectional area of ​​the second recess 112, so that the second protrusion 122 can be accommodated in the second recess 112. In addition, in some embodiments, in the normal direction (e.g., parallel to the z-direction), the cross-sectional area of ​​the second sub-portion 121B of the first protrusion 121 is less than or equal to the cross-sectional area of ​​the second sub-portion 111B of the first recess 111, so that the first protrusion 121 can be accommodated in the second sub-portion 111B of the first recess 111. For example, the above cross-sectional area can be measured along a plane parallel to the xy plane, but the present disclosure is not limited thereto.

[0076] In some embodiments, the cover 130 has two opposite fourth protrusions 134, which are arranged to protrude toward the third protrusion 123. In this embodiment, the width of the third protrusion 123 may be greater than the spacing between the two fourth protrusions 134, but the present disclosure is not limited thereto. With the above-mentioned features, the configuration of the wire 120 can be made more stable, reducing the risk of the wire 120 shifting and causing the electronic device 100 to fail. For example, the width of the third protrusion 123 and the spacing between the fourth protrusions 134 can be measured, for example, along the y direction, but the present disclosure is not limited thereto.

[0077] It should be understood that although the above embodiment only shows a partial configuration of the electronic device 100, those skilled in the art should be able to set other optical layers and / or optical components in the structure described in the present disclosure according to the teachings of the present disclosure and for the purpose of enhancing the display and / or touch effects. These configurations derived from the present disclosure are also included in the scope of the present disclosure. In addition, the present disclosure also provides several different semiconductor structures, and those skilled in the art should be able to arbitrarily combine / arrange these semiconductor structures without violating the teachings of the present disclosure, and these arrangements and combinations are all included in the scope of the present disclosure.

[0078] In summary, the embodiments of the present disclosure provide an electronic device having corresponding structures on an outer frame and a conductive wire. Specifically, by providing a first convex portion and a second convex portion on the conductive wire corresponding to the first concave portion and the second concave portion of the outer frame, respectively, the stability of the conductive wire on the outer frame can be improved, and the risk of failure of the electronic device due to displacement of the conductive wire can be reduced. In addition, a fourth convex portion corresponding to the third convex portion of the conductive wire is provided on the cover body, thereby reducing the risk of the conductive wire moving in the vertical direction after installation. In addition, the outer frame is provided with a receiving portion to expand the space inside the outer frame, whereby the electronic device can include a larger number or a larger volume of electronic devices, thereby improving the performance of the electronic device.

[0079] Although the embodiments and advantages of the present disclosure have been disclosed as above, it should be understood that any person skilled in the art can make changes, substitutions and modifications without departing from the spirit and scope of the present disclosure. In addition, the scope of protection of the present disclosure is not limited to the processes, machines, manufacturing, material compositions, devices, methods and steps in the specific embodiments described in the specification. Any person skilled in the art can understand the current or future developed processes, machines, manufacturing, material compositions, devices, methods and steps from the disclosure of the present disclosure. As long as they can implement substantially the same functions or obtain substantially the same results in the embodiments described herein, they can all be used according to the present disclosure. Therefore, the scope of protection of the present disclosure includes the above-mentioned processes, machines, manufacturing, material compositions, devices, methods and steps, and the features between the embodiments can be arbitrarily mixed and matched as long as they do not violate the spirit of the invention or conflict with each other. In addition, each claim constitutes an individual embodiment, and the scope of protection of the present disclosure also includes the combination of each claim and embodiment.

Claims

1. An electronic device, characterized in that: include: An outer frame having a first concave portion and a second concave portion adjacent to each other, and the first concave portion is separated from the second concave portion; as well as A conductive wire having a first protrusion and a second protrusion; The first convex portion is correspondingly arranged in the first concave portion, and the second convex portion is correspondingly arranged in the second concave portion.

2. The electronic device according to claim 1, wherein: The first recessed portion includes a first sub-portion and a second sub-portion connected to each other, and the first protrusion is configured to move from the first sub-portion of the first recessed portion to the second sub-portion of the first recessed portion.

3. The electronic device according to claim 2, wherein: The first convex portion includes a first sub-portion and a second sub-portion connected to each other. In a normal direction, a cross-sectional area of ​​the first sub-portion of the first convex portion is larger than a cross-sectional area of ​​the second sub-portion of the first convex portion, and the cross-sectional area of ​​the second sub-portion of the first convex portion is smaller than or equal to a cross-sectional area of ​​the first sub-portion of the first concave portion.

4. The electronic device according to claim 1, wherein: In a normal direction, a cross-sectional area of ​​the second convex portion is smaller than or equal to a cross-sectional area of ​​the second concave portion.

5. The electronic device according to claim 1, wherein: The invention further comprises a cover body, wherein the cover body has a through hole and the cover body partially overlaps with the lead wire in a normal direction.

6. An electronic device, characterized in that: include: An outer frame having a first concave portion and a second concave portion separated from the first concave portion; A conductive wire having a first protrusion; as well as A cover body having a through hole; The first protrusion is correspondingly arranged in the first concave portion, the conductive line partially overlaps with the second concave portion, and a normal direction of the first concave portion is different from a normal direction of the through hole.

7. The electronic device according to claim 6, wherein: The lead wire has a second protrusion, and the second protrusion is correspondingly arranged in the second concave portion.

8. The electronic device as claimed in claim 7, characterized in that: In the normal direction of the first concave portion, a cross-sectional area of ​​the second convex portion is smaller than or equal to a cross-sectional area of ​​the second concave portion.

9. The electronic device as claimed in claim 6, characterized in that: The first convex portion has a first sub-portion and a second sub-portion connected to the first sub-portion, the first concave portion has a first sub-portion and a second sub-portion connected to the first sub-portion of the first concave portion, and in the normal direction of the first concave portion, a cross-sectional area of ​​the second sub-portion of the first convex portion is less than or equal to a cross-sectional area of ​​the first sub-portion of the first concave portion.

10. The electronic device according to claim 9, wherein: In the normal direction of the first concave portion, the cross-sectional area of ​​the second sub-portion of the first convex portion is smaller than or equal to a cross-sectional area of ​​the second sub-portion of the first concave portion.

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