Packaging method of display panel

Abstract

A packaging method of a display panel comprises the following steps: providing the display panel, wherein the display panel is provided with a light-emitting component; the packaging method further comprises the steps that a packaging film layer is arranged above the light-emitting assembly, the packaging film layer comprises a dry film and a release film located on the dry film, and the dry film is completely separated from the display panel; the packaging method further includes performing a first pressurization process on the dry film such that the dry film is subjected to a first pressure and at least partially contacts the display panel, where the process temperature of the first pressurization process is between 30 DEG C and 100 DEG C; the packaging method further includes performing a second pressurization process on the dry film to cause the dry film to receive a second pressure, where the second pressure is greater than the first pressure, and the process temperature of the second pressurization process is between 30 DEG C and 150 DEG C.

Description

Technical Field

[0001] The present disclosure relates to a packaging method for a display panel, and in particular to a packaging method for a large-size display panel. Background Art

[0002] In the current common display panel packaging process, mechanical pressure can be used to make the packaging glue layer and the display panel equipped with light-emitting diodes (LEDs) fit completely. However, under the same pressure channel, the larger the pressure area between the packaging glue layer and the display panel, the greater the total force that the table supporting the display panel needs to withstand. Therefore, as the size of the display panel continues to increase, the bearing capacity of the mechanical pressure equipment is gradually approaching its limit.

[0003] Therefore, how to propose a display panel packaging method that can solve the above problems is one of the problems that the industry is eager to invest research and development resources to solve. Summary of the invention

[0004] In view of this, an object of the present disclosure is to provide a display panel packaging method that can solve the above-mentioned problem.

[0005] One aspect of the present disclosure is related to a packaging method for a display panel, including providing a display panel, wherein the display panel has a light-emitting component. The packaging method also includes setting a packaging film layer above the light-emitting component, wherein the packaging film layer includes a dry film and a release film located on the dry film, and the dry film is completely separated from the display panel; the packaging method also includes performing a first pressing process on the dry film, so that the dry film is subjected to a first pressure and at least partially contacts the display panel, wherein the process temperature of the first pressing process is between 30°C and 100°C; the packaging method also includes performing a second pressing process on the dry film, so that the dry film is subjected to a second pressure, wherein the second pressure is greater than the first pressure, and the process temperature of the second pressing process is between 30°C and 150°C.

[0006] In some embodiments, the first pressure is 0.1 kg / cm 2 and 1.4kg / cm 2 and the second pressure is 3kg / cm 2 With 5kg / cm 2 between.

[0007] In some embodiments, the process temperature of the first pressing process is substantially the same as the process temperature of the second pressing process.

[0008] In some embodiments, the second pressing process includes placing the display panel and the dry film after the first pressing process in a sealed chamber. The second pressing process also includes providing gas to the sealed chamber so that the air pressure of the sealed chamber is 3 kg / cm2 With 5kg / cm 2 between.

[0009] In some embodiments, the second pressing process includes applying a second pressure to different parts of the dry film in sequence by a roller device, wherein the second pressure is 3 kg / cm 2 With 5kg / cm 2 between.

[0010] In some embodiments, the packaging method further comprises performing a curing process on the dry film after performing the second pressing process, wherein a process temperature of the curing process is between 30° C. and 150° C.

[0011] In some embodiments, the process temperature of the second pressing process is lower than the process temperature of the curing process.

[0012] In some embodiments, the second pressing process and the curing process are performed in the same chamber.

[0013] In some embodiments, the packaging method further includes removing a release film from the cured dry film.

[0014] In some embodiments, the packaging method further comprises, after removing the release film, disposing a protective film on the cured dry film.

[0015] In summary, in the packaging method of the display panel of some embodiments of the present disclosure, the existing laminator is first used to attach and cover the packaging film layer on the display panel over a large area, and then the packaging film layer is used to fill the surface of the display panel for a second time through the high-pressure environment of the inflation pressing process or the linear pressing force provided by the roller device, thereby eliminating possible voids between the light-emitting component and the display panel. Further, in the first pressing process, a smaller pressure is provided to the packaging film layer, so that the laminator can attach the packaging film layer over a large area without exceeding its mechanical support load, and then in the second pressing process, the uniform force application characteristic of the inflation pressing process or the local force application characteristic of the linear pressing of the roller device is utilized to provide a larger pressure to the packaging film layer, thereby eliminating tiny vacuum bubble defects. Compared with the common packaging method of display modules, high-yield packaging of large-size display panels can be achieved without exceeding the load of the existing laminator.

[0016] These and other aspects of the present disclosure will become apparent from the following description of preferred embodiments in conjunction with the drawings, but variations and modifications may be made therein without departing from the spirit and scope of the novel concepts of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The drawings illustrate one or more embodiments of the present disclosure and are used together with the written description to explain the principles of the present disclosure. In all drawings, the same figure numerals are used as much as possible to refer to similar or identical components of the embodiments, wherein:

[0018] Figure 1 The present invention is a flow chart of a method for packaging a display panel according to some embodiments of the present disclosure.

[0019] Figures 2 to 8 It is a partial cross-sectional view of an intermediate stage of a display panel packaging method according to some embodiments of the present disclosure.

[0020] Wherein, the reference numerals are:

[0021] 10: Packaging method

[0022] 100: Display panel

[0023] 102: Light-emitting components

[0024] 102a,102b: Pins

[0025] 200: Encapsulation film layer

[0026] 202: Dry film

[0027] 204: Release film

[0028] 206: Protective film

[0029] 900,906,908,910: Carrier

[0030] 902: Mechanical support

[0031] 904: Airbag

[0032] 912:Roller device

[0033] A: Gas

[0034] d: Spacing

[0035] G: Gap

[0036] S102,S104,S106,S108,S110,S112,S114: Step X,Y,Z: Direction

[0037] Page 3 of 3 (Invention Description) DETAILED DESCRIPTION

[0038] The following disclosure is more fully described herein through figures and reference data, and some exemplary embodiments are depicted in the figures. The disclosure may be implemented in different forms and should not be limited by the embodiments mentioned below. However, these embodiments are provided to help more fully understand the content of the disclosure and fully convey the scope of the disclosure to those skilled in the art.

[0039] In the drawings, the thickness of layers, films, panels, regions, etc., is magnified for clarity. Throughout the specification, the same reference numerals will refer to similar components throughout the entire text. It should be understood that when a component such as a layer, film, region, or substrate is referred to as being "on" or "connected to" another component, it may be directly on or connected to another component, or an intermediate component may also exist. In contrast, when a component is referred to as being "directly on" or "directly connected to" another component, there is no intermediate component. As used in the present disclosure, "connection" may refer to physical and / or electrical connection. Furthermore, "electrical connection" or "coupling" may be the presence of other components between two components.

[0040] It should be understood that although the terms "first", "second", "third", etc. may be used in the present disclosure to describe various components, parts, regions, layers and / or parts, these components, parts, regions, and / or parts should not be limited by these terms. These terms are only used to distinguish one component, part, region, layer or part from another component, part, region, layer or part. Therefore, the "first component", "component", "region", "layer" or "part" discussed below may be referred to as a second component, part, region, layer or part without departing from the teachings of the present disclosure.

[0041] The terms used herein are for the purpose of describing specific embodiments only and are not restrictive. As used in this disclosure, unless the content clearly indicates, the singular forms "one", "an" and "the" are intended to include plural forms, including "at least one". "Or" means "and / or". As used in this disclosure, the term "and / or" includes any and all combinations of one or more of the relevant listed items. It should also be understood that when used in this specification, the terms "include" and / or "include" specify the presence and / or parts of the features, regions, entireties, steps, operations, components, but do not exclude the presence or addition of one or more other features, regions, entireties, steps, operations, components, parts and / or their combinations.

[0042] In addition, relative terms such as "lower" or "bottom" and "upper" or "top" may be used in the present disclosure to describe the relationship of one component to another component, as shown in the figures. It should be understood that relative terms are intended to include different orientations of the device in addition to the orientation shown in the figures. For example, if the device in one figure is turned over, the component described as being on the "lower" side of the other components will be oriented on the "upper" side of the other components. Therefore, the exemplary term "lower" can include both "lower" and "upper" orientations, depending on the particular orientation of the figure. Similarly, if the device in one figure is turned over, the component described as being "below" or "below" other components will be oriented as being "above" other components. Therefore, the exemplary term "below" or "below" can include both above and below orientations.

[0043] The use of "about", "approximately", or "substantially" in the present disclosure includes the stated value and the average value within an acceptable deviation range of the particular value determined by a person skilled in the art, taking into account the measurement in question and the specific amount of error associated with the measurement (i.e., the limitations of the measurement system). For example, "about" can mean within one or more standard deviations of the stated value, or within ±30%, ±20%, ±10%, ±5%. Furthermore, the use of "about", "approximately", or "substantially" in the present disclosure can select a more acceptable deviation range or standard deviation depending on the optical properties, etching properties or other properties, and can apply to all properties without one standard deviation.

[0044] Unless otherwise defined, all terms (including technical and scientific terms) used in this disclosure have the same meaning as commonly understood by those skilled in the art. It will be further understood that terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology and this disclosure, and will not be interpreted as an idealized or overly formal meaning unless explicitly defined in this disclosure.

[0045] The present disclosure describes exemplary embodiments with reference to cross-sectional views that are schematic diagrams of idealized embodiments. Therefore, variations in the shapes of the illustrations as a result of, for example, manufacturing techniques and / or tolerances are to be expected. Therefore, the embodiments described in the present disclosure should not be construed as limited to the specific shapes of the regions as shown in the present disclosure, but rather include shape deviations that result, for example, from manufacturing. For example, a region shown or described as flat may typically have rough and / or nonlinear features. In addition, sharp angles shown may be rounded. Therefore, the regions shown in the figures are schematic in nature, and their shapes are not intended to illustrate the precise shape of the regions and are not intended to limit the scope of the claims.

[0046] In the display panel encapsulation process, mechanical pressure can be applied by a laminator to make the encapsulation adhesive layer fit the display panel and the light-emitting components on it completely. Generally speaking, the encapsulation adhesive layer is pressed at 1kg / cm2 by a laminator in a vacuum environment. 2 With 5kg / cm 2 The pressure between 200mm and 250mm is used to complete the encapsulation through a single pressing process. However, under the same pressure channel, the larger the pressure area between the encapsulation glue layer and the display panel, the greater the total force that the table supporting the display panel (such as the mechanical support of the laminator) needs to withstand. Therefore, as the demand for large-size display panels increases, the limited table load capacity may become a factor limiting the process. For example, the size of the 6th generation display panel is 1500mm×1850mm, so when encapsulating, the pressure applied is 5kg / cm 2 When laminating, the table needs to bear a force of about 138 tons, which exceeds the 40-ton load of the existing laminating machine.

[0047] Therefore, the present disclosure aims to propose a two-stage packaging method to achieve packaging of large-size display panels without exceeding the load of existing laminators.

[0048] Please refer to Figures 1 to 8 . Figure 1 FIG. 1 is a flow chart of a display panel packaging method 10 according to some embodiments of the present disclosure. Figure 1 As shown in , the packaging method 10 includes steps S102 to S114. Figures 2 to 8 The figure is a partial cross-sectional view of an intermediate stage of a display panel packaging method 10 according to some embodiments of the present disclosure. Directions X, Y, and Z are shown in the figure. Next, the steps of each stage of the display panel packaging method 10 will be described with reference to the figures.

[0049] First, please refer to Figure 2 In step S102, a display panel 100 is provided and a packaging film layer 200 is disposed on the display panel 100, wherein the packaging film layer 200 includes a dry film 202 and a release film 204. For convenience, the packaging film layer 200 and the display panel 100 in the intermediate stage are collectively referred to as a display module in the subsequent paragraphs.

[0050] like Figure 2As shown in , the display panel 100 is disposed on the stage 900. A plurality of light-emitting components 102 are disposed on the display panel 100. In some embodiments, the light-emitting components 102 may be light-emitting diodes (LEDs), sub-millimeter light-emitting diodes (mini LEDs), or micro LEDs (μLEDs). In some embodiments, each light-emitting component 102 includes a pin 102a and a pin 102b, and a gap G is provided between the pin 102a and the pin 102b.

[0051] In some embodiments, the encapsulation film layer 200 includes a dry film 202 and a release film 204. The dry film 202 is disposed on the side of the encapsulation film layer 200 facing the display panel 100. In other words, after step S102, the dry film 202 is located above the display panel 100 and the light-emitting component 102, and the release film 204 is located above the dry film 202. In some embodiments, the dry film 202 is in contact with the top surface of the light-emitting component 102, but the dry film 202 is completely separated from the top surface of the display panel 100. In some embodiments, the dry film 202 is a semi-cured encapsulation material, such as epoxy, polyurethane (PU), acrylic material or other suitable organic material. In some embodiments, "semi-cured" is defined as a solvent accounting for between 1% and 10% of the total weight of the material. In some embodiments, the release film 204 includes polyethylene terephthalate (PET) or other suitable materials. In some embodiments, the packaging film layer 200 is formed by uniformly coating the material of the dry film 202 on the release film 204. It is worth noting that step S102 can be performed in a non-vacuum chamber.

[0052] Next, in step S104, a first pressing process is performed on the dry film 202. For example, the first pressing process is performed by a laminator. Figure 3 As shown in FIG. 1 , the display module is placed on a mechanical support 902 of a laminator, and a force is applied to the display module along a direction Z (ie, downward) by an airbag 904 of the laminator. In some embodiments, the airbag 904 applies a force such that the dry film 202 is subjected to a force of 0.1 kg / cm 2 and 1.4kg / cm 2In some embodiments, performing the first pressing process further includes placing the display module in a closed chamber and evacuating the closed chamber so that the gas in the gap between the dry film 202 and the display panel 100 is extracted. Next, the airbag 904 is attached to the release film 204 to apply uniform pressure to the display module, and at the same time, the process temperature in the closed chamber is maintained between 30°C and 100°C, so that the dry film 202 has fluidity, so that the dry film 202 can fill the terrain around the light-emitting component 102. In some embodiments, the mechanical support 902 and the airbag 904 can be used as a heat source. After performing the first pressing process, the dry film 202 is at least partially in contact with the display panel 100. For example, if Figure 3 As shown in FIG. 1 , the dry film 202 covers the side and top surfaces of the light emitting element 102 and the top surface of the display panel 100. However, there may be a vacuum gap G between the pins 102a and 102b of the light emitting element 102 and the display panel 100. Figure 3 as shown in .

[0053] Next, in step S106, the dry film 202 is returned to room temperature under normal pressure. Figure 4 As shown in , the display module is taken out from the vacuum sealed chamber, moved to the stage 906 and placed at room temperature and atmospheric pressure until the temperature of the packaging film layer 200 and the display panel 100 returns to room temperature.

[0054] Next, in step S108, a second pressing process is performed on the dry film 202. In some embodiments, the second pressing process is performed by an air-filling pressing process. Figure 5 As shown in FIG. 1 , the display module that has undergone the first pressing process and returned to room temperature is placed on a stage 908 in another sealed chamber. Next, gas A is supplied to the sealed chamber so that the air pressure in the sealed chamber is 3 kg / cm 2 With 5kg / cm 2 and the dry film 202 is subjected to 3kg / cm 2 With 5kg / cm 2 . Since the pressure of the second pressing process is greater than the pressure of the first pressing process, the fluidity of the dry film 202 increases, so that the dry film 202 can fill the vacuum gap G left by the first pressing process. In some embodiments, the process temperature of the second pressing process is between 30°C and 150°C. In some embodiments, the entire process of the second pressing process can maintain a constant temperature or gradually increase the temperature. In some embodiments, the process temperature of the second pressing process is substantially the same as the process temperature of the first pressing process. Since the high-pressure environment of the inflation pressing process provides forces from all directions to the display module and the carrier 908, the inflation pressing process can be applied to display panels 100 with an area of ​​1500mm×1850mm or more without causing the carrier 908 to exceed its maximum load capacity.

[0055] In other embodiments, the second pressing process is performed by a roller device 912. Figure 6 As shown in FIG. 1 , the display module that has undergone the first pressing process and returned to room temperature is placed on a stage 910 in another sealed chamber. A roller device 912 sequentially applies a force along a direction Z (i.e., downward) to different parts of the display module along a direction X. In some embodiments, the force applied by the roller device 912 causes the dry film 202 to be subjected to a pressure of 3 kg / cm 2 With 5kg / cm 2 In some embodiments, performing the second pressing process further includes evacuating the sealed chamber, and then pressurizing the display module through the roller device 912, while maintaining the process temperature in the sealed chamber between 30°C and 100°C. Since the roller device provides local line pressing for the display module, the total force on the carrier 910 thereunder does not exceed its maximum load capacity, so the roller device is also suitable for display panels 100 with an area of ​​more than 1500mm×1850mm.

[0056] In some embodiments, step S108 includes sequentially performing a second pressing process on the dry film 202 through an air pressing process and a roller device line pressing process.

[0057] Next, in step S110, a curing process is performed on the dry film 202. In some embodiments, the process temperature of the curing process is between 30°C and 150°C. In an embodiment in which the second pressing process is performed by an inflation pressing process, the curing process can be achieved in the following manner: after the second pressing process, the display module is left in the aforementioned closed chamber filled with gas A, and then the process temperature is maintained between 100°C and 150°C, and the dry film 202 is directly baked and cured. In some embodiments, the process temperature of the second pressing process is lower than the process temperature of the curing process. On the other hand, in an embodiment in which the second pressing process is performed by a roller device, the display module that has undergone the second pressing process needs to be moved to an oven for baking and curing.

[0058] In some embodiments, since the dry film 202 is coated on the release film 204 in a semi-cured state and then cured, the top surface of the cured dry film 202 may be a rough surface. In some embodiments, the cured dry film 202 has a haze between substantially 0% and 1%.

[0059] Next, in step S112, the release film 204 is removed from the cured dry film 202. Figure 7In some embodiments, in order to allow the release film 204 to be peeled off without affecting the structure of the dry film 202, the release film 204 is a material with no adhesive force. For example, the peeling force of the release film 204 is between 0.1 Nt / inch and 0.3 Nt / inch.

[0060] Next, in step S114, a protective film 206 is disposed on the cured dry film 202. Figure 8 As shown in . In some embodiments, the protective film 206 may include a material having adhesive force or a material without adhesive force. For example, the peeling force of the protective film 206 may be between 0.001 Nt / inch and 6 Nt / inch.

[0061] In addition, in some embodiments, after the protective film 206 is provided, the edges of the protective film 206 and the dry film 202 can be cut as required so that there is a distance d between the two, such as Figure 8 In some embodiments, the protective film 206 protrudes from the dry film 202 along the direction X. In other embodiments, the dry film 202 protrudes from the protective film 206 along the direction X. In some embodiments, the distance d is 30 micrometers.

[0062] From the above detailed description of the specific embodiments of the present disclosure, it can be clearly seen that in the packaging method of the display panel of some embodiments of the present disclosure, the existing laminator is first used to attach and cover the packaging film layer on a large area on the display panel, and then the packaging film layer is used to fill the surface of the display panel for a second time through the high pressure environment of the inflation pressing process or the linear pressing force provided by the roller device, thereby eliminating possible voids between the light-emitting component and the display panel. Further, in the first pressing process, a smaller pressure is provided to the packaging film layer, so that the laminator can attach the packaging film layer on a large area without exceeding its mechanical support load, and then in the second pressing process, the uniform force characteristics of the inflation pressing process or the local force characteristics of the linear pressing of the roller device are used to provide a larger pressure on the packaging film layer to eliminate small vacuum bubble defects. Compared with the common packaging method of display modules, high-yield packaging of large-size display panels can be achieved without exceeding the load of the existing laminator.

[0063] The foregoing description is provided only to illustrate and describe exemplary embodiments of the present disclosure and is not intended to be exhaustive or to limit the precise forms of the invention disclosed in the present disclosure. The above teachings may be modified or varied.

[0064] The embodiments selected and described are intended to explain the content of the present disclosure and their practical applications so as to inspire those skilled in the art to utilize the present disclosure and various embodiments, and to make various modifications to meet the specific intended use. Alternative embodiments will be apparent to those skilled in the art without departing from the spirit and scope of the present disclosure. Therefore, the scope of the present disclosure is determined according to the scope of the attached invention claims, rather than being limited by the foregoing specification and the exemplary embodiments described therein.

Claims

1. A method for packaging a display panel, characterized in that: Include: A display panel is provided, wherein the display panel has a plurality of light-emitting components; Disposing a packaging film layer above the light-emitting components, wherein the packaging film layer comprises a dry film and a release film located on the dry film, and the dry film is completely separated from the display panel; Performing a first pressing process on the dry film so that the dry film is subjected to a first pressure and at least partially contacts the display panel, wherein a process temperature of the first pressing process is between 30° C. and 100° C.; and A second pressing process is performed on the dry film, so that the dry film is subjected to a second pressure, wherein the second pressure is greater than the first pressure, and a process temperature of the second pressing process is between 30° C. and 150° C.

2. The packaging method of a display panel according to claim 1, wherein: The first pressure is 0.1 kg / cm 2 and 1.4kg / cm 2 and the second pressure is between 3kg / cm 2 With 5kg / cm 2 between.

3. The packaging method of a display panel according to claim 1, wherein: The process temperature of the first pressing process is substantially the same as the process temperature of the second pressing process.

4. The packaging method of a display panel according to claim 1, wherein: The second pressing process comprises: placing the display panel and the dry film that have undergone the first pressing process in a sealed chamber; and A gas is supplied to the sealed chamber so that the air pressure of the sealed chamber is 3 kg / cm 2 With 5kg / cm 2 between.

5. The method for packaging a display panel according to claim 1, wherein: The second pressing process includes applying the second pressure to different parts of the dry film in sequence through a roller device, wherein the second pressure is 3kg / cm 2 With 5kg / cm 2 between.

6. The method for packaging a display panel according to claim 1, wherein: The method further comprises performing a curing process on the dry film after performing the second pressing process, wherein a process temperature of the curing process is between 30° C. and 150° C.

7. The method for packaging a display panel according to claim 6, wherein: The process temperature of the second pressing process is lower than the process temperature of the curing process.

8. The method for packaging a display panel according to claim 6, wherein: The second pressing process and the curing process are performed in the same chamber.

9. The method for packaging a display panel according to claim 6, wherein: The method also includes removing the release film from the cured dry film.

10. The method for packaging a display panel according to claim 9, wherein: The method further comprises setting a protective film on the cured dry film after removing the release film.

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