An automatic implantation device for mold forming

Abstract

This invention relates to the field of mold processing equipment, and more particularly to an automatic insertion device for mold forming. The technical solution includes a frame and a multi-station turntable mounted on the frame, a ring feeding device, a copper nut feeding device, a pin feeding device, a copper busbar feeding device, a first insertion device, a second insertion device, and a third insertion device. The first insertion device is used to pick up a ring from the ring feeding device and insert it into the mold. The second insertion device is used to pick up copper nuts and pins from the parallel copper nut feeding device and pin feeding device and insert them into the mold. The third insertion device is used to pick up copper busbars from the copper busbar feeding device and place them into the mold. The advantages are: the position of the mold can be flexibly adjusted according to the actual insertion steps; and different feeding and insertion devices are designed for the structural characteristics of the ring, copper nut, and pin, enabling rapid and accurate insertion of various small parts and improving the efficiency of mold forming.

Description

Technical Field

[0001] This invention relates to the field of mold processing equipment, and more particularly to an automatic insertion device for mold forming. Background Technology

[0002] During the mold forming process, accessories such as iron rings, pins, copper nuts, and copper busbars need to be implanted into the mold body. Currently, most of these are implanted manually, which is inefficient and prone to errors due to the large number of accessories to be implanted. Designing automated equipment for automatic implantation in mold forming presents challenges, such as requiring large and complex equipment due to the complexity and variability of the implantation steps, and difficulties in accurately gripping and implanting the pins. Summary of the Invention

[0003] The purpose of this invention is to provide an automated implantation device for mold forming, specifically an automated device with a compact and reasonable structure that can quickly and accurately implant molds.

[0004] To achieve the above objectives, the present invention adopts the following technical solution: an automatic implantation device for mold forming, comprising a frame and a multi-station turntable, an iron ring feeding device, a copper nut feeding device, a PIN pin feeding device, a copper busbar feeding device, a first implantation device, a second implantation device, and a third implantation device mounted on the frame; the multi-station turntable includes at least a first station, a second station, a third station, and a fourth station, and is used to drive the mold through the first station, the second station, the third station, and the fourth station; the first implantation device is used to pick up an iron ring from the iron ring feeding device and implant it into the mold at the second station of the multi-station turntable; the second implantation device is used to pick up a copper nut and a PIN pin from the copper nut feeding device and the PIN pin feeding device arranged side by side and implant them into the mold at the third station of the multi-station turntable; the third implantation device is used to pick up a copper busbar from the copper busbar feeding device and place it into the mold at the fourth station of the multi-station turntable.

[0005] Specifically, the iron ring feeding device, copper nut feeding device, and PIN needle feeding device all adopt a vibratory feeder feeding device.

[0006] Specifically, the iron ring feeding device includes an iron ring vibrating plate and an iron ring vibrating conveyor rail connected to the outlet of the iron ring vibrating plate. The upper end of the iron ring vibrating conveyor rail is provided with an iron ring limiting cover plate, and a height limiting block is provided inside the iron ring vibrating conveyor rail.

[0007] Specifically, the copper nut feeding device includes a copper nut vibratory plate and a copper nut vibratory conveyor rail connected to the outlet of the copper nut vibratory plate. A copper nut limiting cover plate is provided at the upper end of the copper nut vibratory conveyor rail.

[0008] Specifically, the PIN feeding device includes a PIN vibratory feeder and a PIN vibratory conveying track connected to the outlet of the PIN vibratory feeder. A PIN positioning and ejecting mechanism is provided at the end of the PIN vibratory conveying track. The PIN positioning and ejecting mechanism includes a horizontal drive mechanism, a vertical drive mechanism, a positioning slider, and an ejecting pin. The horizontal drive mechanism is driven and connected to the positioning slider, the vertical drive mechanism, and the ejecting pin. The vertical drive mechanism is driven and connected to the ejecting pin. A PIN positioning groove is provided on the positioning slider, corresponding to the outlet end of the PIN vibratory conveying track. Fiber optic detection sensors are provided on both sides of the positioning slider.

[0009] Specifically, it also includes a mold loading and unloading robot, which is used to transfer molds that are to be processed or have been processed.

[0010] Specifically, the first implantation device includes a wire ring suction implantation mechanism and a three-axis drive mechanism for driving the wire ring suction implantation mechanism to move.

[0011] Specifically, the second implantation device includes a PIN needle grasping and implantation mechanism, a copper nut suction and implantation mechanism, and a first four-axis robotic arm. The end of the first four-axis robotic arm is fixedly connected to both the PIN needle grasping and implantation mechanism and the copper nut suction and implantation mechanism.

[0012] Specifically, the third implantation device includes a copper busbar suction and implantation mechanism and a second four-axis robotic arm, which is drivenly connected to the copper busbar suction and implantation mechanism.

[0013] Specifically, an illumination and photography device is installed above the first station of the multi-station turntable. The illumination and photography device is used to illuminate and photograph the mold on the first station and identify the points on the mold that need to be implanted.

[0014] The beneficial effects of this invention are as follows: by using a multi-station turntable to drive the mold to be formed to rotate, the mold can be rotated to different stations for the implantation of different parts. The position of the mold can be flexibly adjusted according to the actual implantation steps. At the same time, different feeding devices and suction implantation devices are designed for the structural characteristics of iron rings, copper nuts and pins, which can realize the rapid and accurate implantation of various small parts and improve the efficiency of mold forming. Attached Figure Description

[0015] Appendix Figure 1 This is a schematic diagram of the overall structure of the automatic implantation device used for mold forming in the embodiment;

[0016] Appendix Figure 2 This is a schematic diagram of the specific structure of the iron ring feeding device and the first implantation device in the embodiment;

[0017] Appendix Figure 3This is a schematic diagram of the specific structure of the copper nut feeding device, the PIN needle feeding device, and the second implantation device in the embodiment.

[0018] Appendix Figure 4 This is a schematic diagram of the specific structure of the PIN pin positioning and ejection mechanism in the embodiment;

[0019] Appendix Figure 5 This is a schematic diagram of the specific structure of the copper busbar feeding device and the third implantation device in the embodiment. Detailed Implementation

[0020] Example 1, referring to Figure 1-5 An automatic implantation device for mold forming includes a frame 1 and a multi-station turntable 2, an iron ring feeding device 3, a copper nut feeding device 4, a pin feeding device 5, a copper busbar feeding device 6, a first implantation device 7, a second implantation device 8, and a third implantation device 9 mounted on the frame 1. The multi-station turntable 2 includes at least a first station 21, a second station 22, a third station 23, and a fourth station 24. The multi-station turntable 2 is used to drive the mold through the first station 21, the second station 22, the third station 23, and the fourth station 24. The first implantation device 7 is used to pick up iron rings from the iron ring feeding device 3 and implant them into the mold at the second station 22 of the multi-station turntable 2. The second implantation device 8 is used to pick up copper nuts and pins from the copper nut feeding device 4 and the pin feeding device 5 arranged side by side and implant them into the mold at the third station 23 of the multi-station turntable 2. The third implantation device 9 is used to pick up copper busbars from the copper busbar feeding device 6 and place them into the mold at the fourth station 24 of the multi-station turntable 2.

[0021] In this embodiment, the multi-station turntable 2 can drive the mold to move between different stations, thereby realizing the assembly and insertion of different parts. For different assembly and insertion requirements of different molds, only the direction and rotation angle of the multi-station turntable 2 need to be adjusted. Specifically, the multi-station turntable 2 includes at least a first station 21, a second station 22, a third station 23, and a fourth station 24. The first station 21 is mainly used for loading and unloading the main body of the mold to be assembled; the second station 22 is used for inserting iron ring parts; the third station 23 is used for inserting copper nuts and pins; and the fourth station 24 is used for inserting copper busbar parts. Correspondingly, the first insertion device 7 is located above the second station 22, the second insertion device 8 is located above the third station 23, and the third insertion device 9 is located above the fourth station 24. To achieve automatic loading and unloading of the mold, a mold loading and unloading robot 10 is also included. The mold loading and unloading robot 10 is used to transfer molds to be processed / processed. A mold clamp is provided at the end of the mold loading and unloading robot 10 for gripping and moving the mold.

[0022] Specifically, the aforementioned iron ring feeding device 3, copper nut feeding device 4, and PIN needle feeding device 5 all adopt vibratory feeder feeding devices.

[0023] The iron ring feeding device 3 includes an iron ring vibrating plate 31 and an iron ring vibrating conveying rail 32 connected to the outlet of the iron ring vibrating plate 31. An iron ring limiting cover plate 33 is provided at the upper end of the iron ring vibrating conveying rail 32, and a height limiting block 34 is provided inside the iron ring vibrating conveying rail 32. The vibratory feeder 31 transports the iron rings via vibration and then transports them to the first implantation device 7 via the vibratory conveyor rail 32. A height-limiting block 34 within the vibratory conveyor rail 32 limits overlapping iron rings. When an overlapping iron ring passes the height-limiting block, the top iron ring is blocked, allowing only one iron ring to pass under the height-limiting block 34, thus preventing overlapping iron rings from hindering proper implantation. The first implantation device 7 picks up the iron ring and places it at the corresponding position on the mold to be assembled. The first implantation device 7 includes an iron ring picking and implantation mechanism 71 and a three-axis drive mechanism 72 that drives the iron ring picking and implantation mechanism 71. The three-axis drive mechanism 72 can drive the iron ring picking and implantation mechanism in the X, Y, and Z axes, thereby picking up the iron ring and placing it at the corresponding position on the mold. The iron ring picking and implantation mechanism 71 uses a suction nozzle mechanism for picking up and placing the iron ring. The X, Y, and Z axes described in this application are conventional coordinate systems, where the X and Y axes are located in the horizontal plane, and the Z axis is perpendicular to the horizontal plane.

[0024] Similarly, the copper nut feeding device 4 includes a copper nut vibratory plate 41 and a copper nut vibratory conveying rail 42 connected to the outlet of the copper nut vibratory plate 41. A copper nut limiting cover plate 43 is provided at the upper end of the copper nut vibratory conveying rail 42. The copper nut vibratory plate 41 conveys the copper nut through vibration and then conveys it to the second implantation device 8 through the copper nut vibratory conveying rail 42. However, since the PIN needle is long and thin and needs to be vertically implanted into the mold, the structure of the PIN needle feeding device 5 is different from that of the iron ring feeding device 3 and the copper nut feeding device 4. The difference is that, in addition to including the PIN needle vibratory plate 51 and the PIN needle vibratory conveying rail 52 connected to the outlet of the PIN needle vibratory plate 51, the PIN needle vibratory conveying rail 52 is also provided with a PIN needle positioning and ejecting mechanism 53 at the end of the PIN needle vibratory conveying rail 52. The PIN needle vibratory feeder 51 outlet and the PIN needle vibratory conveying track 52 are also elongated. The thicker end of the PIN needle is hung inside the PIN needle vibratory conveying track 52. Since the thicker end of the PIN needle is short, it is difficult to accurately clamp it. Therefore, a PIN needle positioning and lifting mechanism 53 is used to position and lift the PIN needle. The PIN needle positioning and lifting mechanism 53 includes a horizontal drive mechanism 531, a vertical drive mechanism 532, a positioning slider 533, and a lifting pin 534. The horizontal drive mechanism 531 and the positioning slider 533 are drivenly connected together with the vertical drive mechanism 532 and the lifting pin 534. The vertical drive mechanism 532 is drivenly connected to the lifting pin 534. The positioning slider 533 is provided with a PIN needle positioning groove 535 for the PIN needle vibration. Corresponding to the outlet end of the conveying track 52, fiber optic detection sensors 536 are provided on both sides of the positioning slider 533; the transverse drive mechanism 531 is used to drive the positioning slider 533 to move so that the PIN needle positioning groove 535 of the positioning slider 533 is aligned with the outlet end of the PIN needle vibration conveying track 52. At this time, the PIN needle falls from the PIN needle vibration conveying track 52 into the PIN needle positioning groove 535. The light detection sensors 536 provided on both sides of the positioning slider 533 are aligned with the PIN needle positioning groove 535. When the PIN needle falls into the PIN needle positioning groove 535, it is detected and moved above the PIN needle positioning groove 535 by the second implantation device 85. The vertical drive mechanism 532 drives the ejector pin 534 to move upward to lift the PIN needle upward, so that it can be accurately clamped by the second implantation device 85.The second implantation device 8 includes a PIN needle gripping implantation mechanism 81, a copper nut suction implantation mechanism 82, and a first four-axis robotic arm 83. The end of the first four-axis robotic arm 83 is fixedly connected to both the PIN needle gripping implantation mechanism 81 and the copper nut suction implantation mechanism 82. The drive mechanism of the second implantation device 8 adopts a four-axis robotic arm, which can provide three-axis drive in the planar and vertical directions, as well as rotation around the Z-axis. It can flexibly switch between the PIN needle gripping implantation mechanism 81 and the copper nut suction implantation mechanism 82. The PIN needle gripping implantation mechanism 81 is used to grip the finger, and the copper nut suction implantation mechanism 82 is a suction nozzle mechanism.

[0025] Specifically, the third implantation device 9 includes a copper busbar suction and implantation mechanism 91 and a second four-axis robotic arm 92. The second four-axis robotic arm 92 is driven and connected to the copper busbar suction and implantation mechanism 91. The copper busbar suction and implantation mechanism 91 picks up copper busbars from the copper busbar feeding device 6 and places them on the mold. The drive mechanism of the third implantation device 92 also adopts a four-axis robotic arm, which can provide conventional three-axis drive for the copper busbar suction and implantation mechanism 91, as well as rotation around the Z-axis, thereby achieving accurate placement and implantation of the copper busbars. The copper busbar feeding device 6 can adopt a structure of multi-layer placement rack combined with a pushing mechanism. The multi-layer placement rack is driven and connected by a vertical drive mechanism. The pushing mechanism can push out copper busbars on the multi-layer placement rack that are at the same horizontal plane as the pushing mechanism, which are then picked up by the third implantation device. The vertical drive mechanism drives the multi-layer placement rack to align the copper busbars on the multi-layer placement rack layer by layer with the pushing mechanism, thereby achieving copper busbar feeding.

[0026] In addition, an illumination and photography device 11 is installed above the first station 21 of the multi-station turntable 2. The illumination and photography device 11 is used to illuminate and photograph the mold on the first station 21 and identify the points on the mold that need to be implanted. By setting up the illumination and photography device 11, the mold on the first station 21 of the multi-station turntable 2 can be illuminated and photographed, which can identify whether the mold is placed correctly. At the same time, it can detect and identify the points on the mold where the parts are implanted, further improving the accuracy of mold forming and implantation.

[0027] Of course, the above are only preferred embodiments of the present invention and are not intended to limit the scope of application of the present invention. Therefore, any equivalent changes made to the principle of the present invention should be included within the protection scope of the present invention.

Claims

1. An automated implantation device for mold forming, characterized in that: The device includes a frame and a multi-station turntable mounted on the frame, a ring feeding device, a copper nut feeding device, a pin feeding device, a copper busbar feeding device, a first implantation device, a second implantation device, and a third implantation device. The multi-station turntable includes at least a first station, a second station, a third station, and a fourth station, and is used to drive the mold through the first, second, third, and fourth stations. The first implantation device is used to pick up a ring from the ring feeding device and implant it into the mold at the second station of the multi-station turntable. The second implantation device is used to pick up copper nuts and pins from the copper nut feeding device and the pin feeding device arranged side-by-side and implant them into the mold at the third station of the multi-station turntable. The third implantation device is used to pick up copper busbars from the copper busbar feeding device and place them into the mold at the fourth station of the multi-station turntable. The ring feeding device, the copper nut feeding device, and the pin feeding device all employ vibratory feeder devices. The pin feeding device includes... The device includes a PIN needle vibratory feeder and a PIN needle vibratory conveying track connected to the outlet of the PIN needle vibratory feeder. A PIN needle positioning and ejecting mechanism is located at the end of the PIN needle vibratory conveying track. This mechanism includes a horizontal drive mechanism, a vertical drive mechanism, a positioning slider, and an ejector pin. The horizontal drive mechanism is driven and connected to the positioning slider, the vertical drive mechanism, and the ejector pin. The vertical drive mechanism is driven and connected to the ejector pin. A PIN needle positioning groove is provided on the positioning slider, corresponding to the outlet end of the PIN needle vibratory conveying track. Fiber optic detection sensors are located on both sides of the positioning slider. The third implantation device includes a copper busbar suction and implantation mechanism and a second / fourth-axis robotic arm. The second / fourth-axis robotic arm is driven and connected to the copper busbar suction and implantation mechanism. The copper busbar feeding device can adopt a multi-layer placement frame combined with a pushing mechanism. The multi-layer placement frame is driven and connected by the vertical drive mechanism. The pushing mechanism can push out copper busbars on the multi-layer placement frame that are at the same horizontal plane as the pushing mechanism.

2. The automatic implantation device for mold forming according to claim 1, characterized in that: The iron ring feeding device includes an iron ring vibrating plate and an iron ring vibrating conveyor rail connected to the outlet of the iron ring vibrating plate. An iron ring limiting cover is provided at the upper end of the iron ring vibrating conveyor rail, and a height limiting block is provided inside the iron ring vibrating conveyor rail.

3. The automatic implantation device for mold forming according to claim 1, characterized in that: The copper nut feeding device includes a copper nut vibratory plate and a copper nut vibratory conveying rail connected to the outlet of the copper nut vibratory plate. A copper nut limiting cover is provided at the upper end of the copper nut vibratory conveying rail.

4. An automatic implantation device for mold forming according to claim 1, characterized in that: It also includes a mold loading and unloading robot, which is used to transfer molds that are to be processed or have been processed.

5. An automatic implantation device for mold forming according to claim 1, characterized in that: The first implantation device includes a wire ring suction and implantation mechanism and a three-axis drive mechanism for driving the wire ring suction and implantation mechanism to move.

6. An automatic implantation device for mold forming according to claim 1, characterized in that: The second implantation device includes a PIN needle grasping and implantation mechanism, a copper nut suction and implantation mechanism, and a first four-axis robotic arm. The end of the first four-axis robotic arm is fixedly connected to both the PIN needle grasping and implantation mechanism and the copper nut suction and implantation mechanism.

7. An automatic implantation device for mold forming according to claim 1, characterized in that: An illumination and photography device is installed above the first station of the multi-station turntable. The illumination and photography device is used to illuminate and photograph the mold on the first station and identify the points on the mold that need to be implanted.

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