Special packaging equipment for transistor chip production

Abstract

The invention discloses special packaging equipment for transistor chip production, and relates to the technical field of chip production, the special packaging equipment comprises an equipment main body, injection molding equipment and a base, the upper end of the base is symmetrically provided with mounting seats, the two mounting seats are internally provided with heat dissipation bins, the bottom ends of the two mounting seats are provided with grids, and the grids are arranged in the mounting seats. And air outlet grooves are symmetrically formed in the upper ends of the two sets of mounting bases, linkage shafts are symmetrically installed on the inner wall of the equipment body, and fans are installed at the bottom ends of the two sets of linkage shafts. By arranging the mounting base, the heat dissipation bin and the fan, the limiting shaft drives the fan to rotate, so that airflow enters the heat dissipation bin from the grid and is discharged from the air outlet groove, and when the lower injection molding body carries the chip subjected to injection molding packaging to pass through the lower end of the mounting base, the airflow at the lower end of the mounting base accelerates flowing through the fan; and the airflow drives the heat energy of the chip subjected to injection molding packaging to flow, so that the heat dissipation of the chip subjected to injection molding packaging is accelerated, and the processing efficiency of injection molding packaging is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of chip production, and in particular to packaging equipment dedicated to transistor chip production. Background Art

[0002] Transistors and chips are closely related. In fact, the chip itself is composed of multiple transistors and other electronic devices. Transistors are the basis of circuit design and electronic device manufacturing, and chips are integrated bodies that realize circuit synthesis, integration and optimization. Their joint use enables modern electronic technology to develop rapidly and its application range is becoming more and more extensive. For example, in the field of computer hardware, chips can realize multiple functions such as microprocessors, memory, input and output control, etc.; in the field of communications, chips can realize multiple functions such as signal amplification, digital conversion, encoding and decoding, etc. In the field of electronic instruments and household appliances, chips can also realize automatic control, high-definition display, audio playback and other applications.

[0003] During the chip production process, the chip needs to be packaged. The resin injection molding packaging of the chip is a process in the chip packaging operation. It is used to wrap a layer of resin shell on the surface of the chip for isolation and protection. The resin injection molding packaging process uses the existing injection molding technology. After the injection molding is completed, it is necessary to wait for a period of time to allow the molten resin to cool and take shape, and then open the mold to take out the chip.

[0004] In the prior art, if the resin is waited to be completely cooled and formed, the waiting time is long, which affects the efficiency of injection molding packaging. If the mold is opened and the chip is taken out after the resin is initially cooled, the resin wrapped on the outer surface of the chip has not been completely cooled and formed, the surface temperature is high, and there is still plasticity. The chip is generally taken out by a robot. If the robot takes out the chip by grabbing, then when the resin is grabbed, a dent will form on its surface and deform. The dent deformation will be transmitted to the chip, causing the chip located inside the resin to be squeezed. The squeezing can easily cause defects such as gold wire deformation, chip cracking, and pin warping. If the robot takes out the chip by negative pressure adsorption, the part of the resin located in the negative pressure channel will bulge and deform, and the bulged part of the resin will become hollow. The bulged part does not protect the chip, and major defects will occur in the packaging, affecting the packaging effect. Summary of the invention

[0005] Based on this, the purpose of the present invention is to provide a special packaging equipment for transistor chip production to solve the technical problems in the above-mentioned background technology.

[0006] To achieve the above-mentioned object, the present invention provides the following technical solution: a packaging device for transistor chip production, comprising a device body, an injection molding device and a base, wherein the injection molding device is movably installed inside the device body, and the base is installed inside the device body;

[0007] Two groups of movable seats are movably installed on the inner wall of the base, and lower injection molded bodies are installed on the upper ends of the two groups of movable seats. An upper injection molded body is installed on the lower end of the injection molding equipment, and the upper injection molded body is movably connected with the two groups of lower injection molded bodies respectively. Mounting seats are symmetrically installed on the upper end of the base, and heat dissipation bins are opened inside the two groups of mounting seats. Grids are installed at the bottom ends of the two groups of mounting seats, and air outlet grooves are symmetrically opened on the upper ends of the two groups of mounting seats. Linking shafts are symmetrically installed on the inner wall of the main body of the equipment, and one end of the two groups of linking shafts extends into the two groups of heat dissipation bins respectively, and fans are installed at the bottom ends of the two groups of linking shafts;

[0008] Two groups of limit shafts are symmetrically installed inside the base, and the two groups of limit shafts are connected by a synchronous belt. A driving motor is installed on one side of the base, and the output end of the driving motor is connected to a group of limit shafts. The two groups of limit shafts are respectively movably connected to the two groups of moving seats, and one group of limit shafts is respectively movably connected to the two groups of linkage shafts.

[0009] By adopting the above technical solution, the problem of low efficiency of injection molding and packaging operations is solved. The limit shaft rotates to drive the lower injection molding body and the chip that has been injection molded to move. At the same time, the limit shaft drives the fan to rotate, so that the airflow enters the heat dissipation chamber from the grid and is discharged from the air outlet groove. When the lower injection molding body carries the chip that has been injection molded and packaged through the lower end of the mounting seat, the airflow at the lower end of the mounting seat is accelerated by the fan, and the airflow drives the heat energy of the chip that has been injection molded and packaged to flow, thereby accelerating the heat dissipation of the chip that has been injection molded and packaged, improving the cooling effect of the chip that has been injection molded and packaged, and thus improving the processing efficiency of injection molding and packaging.

[0010] The present invention is further configured as follows: a first transmission shaft is symmetrically installed on the inner wall of the equipment body, and two groups of first transmission shafts are connected to a group of limiting shafts through a synchronous belt, one end of the two groups of first transmission shafts is installed with a first transmission bevel gear, one end of one group of the first transmission shafts is installed with a one-way bearing, and the upper ends of the two groups of connecting shafts are installed with connecting bevel gears, and the two groups of connecting bevel gears are respectively meshed and connected with the two groups of first transmission bevel gears.

[0011] By adopting the above technical solution, the limit shaft rotates, driving the two groups of first transmission shafts to rotate, thereby driving the two groups of first transmission bevel gears to rotate, and the two groups of connecting bevel gears are respectively meshed and connected with the two groups of first transmission bevel gears, so the two groups of connecting bevel gears rotate, thereby driving the two groups of connecting shafts to rotate, and the setting of the one-way bearing enables one group of first transmission shafts to rotate in one direction.

[0012] The present invention is further configured such that an injection molding chamber is provided at the bottom end of the upper injection molding body, and an injection molding head of the injection molding equipment extends into the injection molding chamber, injection molding chambers are provided at the upper ends of the two groups of lower injection molding bodies, reserved holes are provided at the two groups of lower injection molding bodies, and the two groups of reserved holes are arranged close to the injection molding chamber, limiting holes are symmetrically provided at the two groups of movable seats, and the outer walls of the two groups of limiting shafts are respectively threadedly connected to the inner walls of the multiple groups of limiting holes.

[0013] By adopting the above technical solution, the two sets of limit shafts rotate, driving the moving seat to move, and the injection molding equipment and the upper injection molding body move downward, so that the upper injection molding body is closed and connected with a set of lower injection molding bodies, and the injection molding equipment performs resin injection molding and packaging operations on the chips in the injection molding bin.

[0014] The present invention is further configured such that a hydraulic pump is installed at the upper end of the equipment body, a telescopic column is installed at the output end of the hydraulic pump, and the bottom end of the telescopic column is connected to the injection molding equipment, the outer wall of the injection molding equipment is provided with a mounting ring, and the outer wall of the mounting ring is installed with multiple groups of fixed columns, and the bottom ends of the multiple groups of fixed columns are all connected to the upper injection molding body, and the outer wall of one group of the fixed columns is installed with a toothed plate.

[0015] By adopting the above technical solution, the hydraulic pump drives the telescopic column to move, thereby driving the injection molding equipment and the mounting ring to move. Since the mounting ring is connected to the upper injection molding body through multiple sets of fixed columns, the upper injection molding body is driven to move, thereby driving the toothed plate to move.

[0016] The present invention is further configured as follows: an air pump is installed on the inner wall of the equipment body, and the air pump is provided with two groups of air inlet ends and a group of air outlet ends, the air inlet ends of the air pump are installed with air inlet pipes, and the two groups of air inlet pipes are three-way pipes, a plurality of groups of movable tubes are installed in a rectangular array inside the equipment body, and the plurality of groups of movable tubes are respectively connected by synchronous belts, the air intake ports at both ends of the two groups of the air inlet pipes are movably installed with connecting bearings, and one end of the plurality of movable tubes is respectively movably connected to the plurality of connecting bearings.

[0017] By adopting the above technical solution, the air pump is started, the two groups of air intake pipes are inhaled, so that the multiple groups of movable pipes are inhaled, and through the setting of connecting bearings, the multiple groups of movable pipes are movably connected to the two groups of air intake pipes respectively.

[0018] The present invention is further configured such that a plurality of movable blocks are movably installed on the inner wall of the equipment body, and a plurality of arc-shaped slide grooves cooperating with the movable blocks are provided on the inner wall of the equipment body, connecting rods are installed at the bottom ends of the plurality of movable blocks, and one ends of the plurality of connecting rods are respectively connected to a plurality of movable tubes, and an air suction plate is installed at one end of the plurality of movable tubes.

[0019] By adopting the above technical solution, multiple groups of movable blocks cooperate with multiple groups of connecting rods to improve the stability of one end of the multiple groups of movable tubes. The multiple groups of movable tubes generate suction, which is transmitted to the multiple groups of suction plates, and the bottom ends of the multiple groups of suction plates generate suction.

[0020] The present invention is further configured such that a movable shaft is movably installed on the inner wall of the equipment body, and movable gears and movable bevel gears are respectively installed at both ends of the movable shaft, and the movable gears are meshingly connected with the gear plates.

[0021] By adopting the above technical solution, the tooth plate is displaced, driving the movable gear to rotate, thereby driving the movable shaft and the movable bevel gear to rotate.

[0022] The present invention is further configured such that a second transmission shaft is movably installed on the inner wall of the equipment body, and the second transmission shaft is respectively connected to the two sets of movable tubes through synchronous belts, and a second transmission bevel gear is installed on the upper end of the second transmission shaft, and the second transmission bevel gear is meshingly connected with the movable bevel gear.

[0023] By adopting the above technical solution, the movable bevel gear rotates, and the second transmission bevel gear is meshed and connected with the movable bevel gear, so the second transmission bevel gear rotates, thereby driving the second transmission shaft to rotate, thereby driving the multiple groups of movable tubes to rotate.

[0024] The present invention is further configured as follows: an air outlet pipe is installed at the air outlet end of the air pump, two groups of branch pipes are symmetrically installed on the inner wall of the equipment body, and one ends of the two groups of branch pipes are connected to the air outlet pipe, two groups of heat dissipation pipes are installed on the inner wall of the base, and the other ends of the two groups of branch pipes are respectively connected to one end of the two groups of heat dissipation pipes, the outer walls of the two groups of heat dissipation pipes are respectively movably connected to the inner walls of multiple groups of reserved holes, and one ends of the two groups of heat dissipation pipes extend to the outer wall of the equipment body.

[0025] By adopting the above technical solution, the air pump discharges the airflow from the air outlet pipe, and the air outlet pipe conducts the airflow to the two groups of branch pipes, so that the airflow is discharged through the heat dissipation pipe, and the outer wall of the heat dissipation pipe is movably connected with the inner wall of the reserved hole. The heat dissipation pipe absorbs the heat generated by injection molding, and the airflow is discharged through the heat dissipation pipe, thereby improving the heat dissipation effect of the heat dissipation pipe and accelerating the cooling effect of injection molding.

[0026] The present invention is further configured such that the equipment body is symmetrically provided with reserved openings, two groups of the reserved openings are respectively installed with a discharge conveyor belt and a feed conveyor belt, and one end of the discharge conveyor belt and the feed conveyor belt both extend into the interior of the equipment body.

[0027] By adopting the above technical solution, the unpackaged chips are transported to the equipment body through the feeding conveyor belt, and the packaged chips are transported out of the equipment body through the discharging conveyor belt.

[0028] In summary, the present invention mainly has the following beneficial effects:

[0029] 1. The present invention solves the problem of low efficiency of injection molding and packaging by providing a mounting seat, a heat dissipation chamber and a fan. The limit shaft rotates to drive the lower injection molding body and the chip that has been injection molded to move. At the same time, the limit shaft drives the fan to rotate, so that the airflow enters the heat dissipation chamber from the grid and is discharged from the air outlet groove. When the lower injection molding body carries the chip that has been injection molded and packaged through the lower end of the mounting seat, the airflow at the lower end of the mounting seat is accelerated by the fan. The airflow drives the heat energy of the chip that has been injection molded and packaged to flow, thereby accelerating the heat dissipation of the chip that has been injection molded and packaged, improving the cooling effect of the chip that has been injection molded and packaged, and thus improving the processing efficiency of injection molding and packaging.

[0030] 2. The present invention is provided with movable tubes, air suction plates and heat dissipation tubes. The upper injection molding body moves downward to perform injection molding operation. One group of air suction plates adsorbs the chips on the upper end of the feed conveyor belt, and the other group of air suction plates adsorbs the chips that have been injection molded and packaged in a group of lower injection molding bodies. When the upper injection molding body completes the injection molding operation and moves upward, the other group of air suction plates carries the chips that have been injection molded and packaged to the upper end of the discharge conveyor belt, and one group of air suction plates moves the chips to the upper end of a group of lower injection molding bodies, thereby further improving the chip packaging efficiency. When the air pump drives the air suction plates to perform the adsorption operation, the airflow is discharged from the heat dissipation tube, and the outer wall of the heat dissipation tube is movably connected to the inner wall of the reserved hole. The heat dissipation tube absorbs the heat generated by the injection molding, and the airflow is discharged through the heat dissipation tube, thereby further improving the heat dissipation effect of the heat dissipation tube and further accelerating the injection molding cooling effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 A schematic diagram of the main body of a device for packaging a transistor chip according to the present invention;

[0032] Figure 2 This is a schematic diagram of the internal structure of the device body of a special packaging device for producing transistor chips according to the present invention;

[0033] Figure 3 A schematic diagram of a discharging conveyor belt and a feeding conveyor belt of a special packaging device for producing transistor chips according to the present invention;

[0034] Figure 4 A schematic diagram of a mounting ring of a special packaging device for producing transistor chips according to the present invention;

[0035] Figure 5 A schematic diagram of a mounting base of a special packaging device for producing transistor chips according to the present invention;

[0036] Figure 6 A side cross-sectional view of a mounting base of a special packaging device for producing transistor chips according to the present invention;

[0037] Figure 7 A schematic diagram of a mobile base of a special packaging device for producing transistor chips according to the present invention;

[0038] Figure 8 A schematic diagram of a base of a special packaging device for producing transistor chips according to the present invention;

[0039] Fig. 9 A schematic diagram of an air inlet pipe and an air outlet pipe of a special packaging device for producing transistor chips according to the present invention;

[0040] Fig.10 The present invention is a schematic diagram of the movable axis of a special packaging device for producing transistor chips.

[0041] In the figure: 1. Equipment body; 2. Reserved opening; 3. Discharging conveyor belt; 4. Feeding conveyor belt; 5. Hydraulic pump; 6. Telescopic column; 7. Injection molding equipment; 8. Upper injection molding body; 9. Mounting ring; 10. Fixed column; 11. Tooth plate; 12. Base; 13. Driving motor; 14. Limiting shaft; 15. Lower injection molding body; 16. Reserved hole; 17. Moving seat; 18. Limiting hole; 19. Mounting seat; 20. Air outlet slot; 21. Heat dissipation bin; 22. Grid; 23. Connecting Moving shaft; 24, fan; 25, linked bevel gear; 26, first transmission shaft; 27, first transmission bevel gear; 28, one-way bearing; 29, air pump; 30, air inlet pipe; 31, connecting bearing; 32, movable pipe; 33, movable block; 34, connecting rod; 35, air intake plate; 36, air outlet pipe; 37, branch pipe; 38, heat dissipation pipe; 39, movable shaft; 40, movable gear; 41, movable bevel gear; 42, second transmission shaft; 43, second transmission bevel gear. DETAILED DESCRIPTION

[0042] The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0043] The following describes an embodiment of the present invention based on its overall structure.

[0044] A special packaging equipment for transistor chip production, such as Figure 1 - Fig.10 As shown, it includes a device body 1, an injection molding device 7 and a base 12. The injection molding device 7 is movably installed inside the device body 1. The injection molding device 7 performs injection molding operations. The base 12 is installed inside the device body 1.

[0045] Two groups of movable seats 17 are movably installed on the inner wall of the base 12, and lower injection molding bodies 15 are installed on the upper ends of the two groups of movable seats 17. The lower end of the injection molding device 7 is installed with an upper injection molding body 8, and the upper injection molding body 8 is movably connected with the two groups of lower injection molding bodies 15. The upper end of the base 12 is symmetrically installed with mounting seats 19, and heat dissipation bins 21 are opened inside the two groups of mounting seats 19. The bottom ends of the two groups of mounting seats 19 are installed with grids 22. The upper ends of the two groups of mounting seats 19 are symmetrically opened with air outlet grooves 20. The inner wall of the equipment body 1 is symmetrically installed with linkage The two sets of linkage shafts 23 are connected to each other, and one end of the two sets of linkage shafts 23 extends into the two sets of heat dissipation chambers 21 respectively. The bottom ends of the two sets of linkage shafts 23 are both equipped with fans 24. The linkage shafts 23 rotate, thereby driving the two sets of fans 24 to rotate, so that the airflow enters the heat dissipation chamber 21 from the grid 22 and is discharged from the air outlet groove 20. When a set of lower injection molding bodies 15 carries the chip that has been completed by injection molding and encapsulation through the lower end of the mounting seat 19, the airflow at the lower end of the mounting seat 19 is accelerated by the fan 24, thereby accelerating the heat dissipation of the chip that has been completed by injection molding and encapsulation;

[0046] Two groups of limit shafts 14 are symmetrically installed inside the base 12, and the two groups of limit shafts 14 are connected by a synchronous belt. A driving motor 13 is installed on one side of the base 12, and the output end of the driving motor 13 is connected to a group of limit shafts 14. The driving motor 13 drives a group of limit shafts 14 to rotate, and the two groups of limit shafts 14 rotate synchronously. The two groups of limit shafts 14 are movably connected to the two groups of moving seats 17 respectively, and the two groups of limit shafts 14 drive the two groups of moving seats 17 to move, and one group of limit shafts 14 is movably connected to the two groups of connecting shafts 23 respectively, and one group of limit shafts 14 drives the two groups of connecting shafts 23 to rotate.

[0047] See also Figure 2 - Figure 8 The first transmission shaft 26 is symmetrically installed on the inner wall of the equipment body 1, and the two groups of first transmission shafts 26 are connected to a group of limiting shafts 14 through synchronous belts, one end of the two groups of first transmission shafts 26 is installed with a first transmission bevel gear 27, and one end of a group of first transmission shafts 26 is installed with a one-way bearing 28, and the upper ends of the two groups of linkage shafts 23 are installed with linkage bevel gears 25, and the two groups of linkage bevel gears 25 are respectively meshed and connected with the two groups of first transmission bevel gears 27. The limiting shaft 14 rotates to drive the two groups of first transmission shafts 26 to rotate, thereby driving the two groups of first transmission bevel gears 27 to rotate, and the two groups of linkage bevel gears 25 are respectively meshed and connected with the two groups of first transmission bevel gears 27, so the two groups of linkage bevel gears 25 rotate, thereby driving the two groups of linkage shafts 23 to rotate, and the setting of the one-way bearing 28 makes a group of first transmission shafts 26 rotate in one direction.

[0048] See also Figure 2 - Figure 8An injection molding chamber is provided at the bottom of the upper injection molding body 8, and the injection molding head of the injection molding equipment 7 extends into the injection molding chamber. Injection molding chambers are provided at the upper ends of the two groups of lower injection molding bodies 15. The two groups of lower injection molding bodies 15 are provided with reserved holes 16, and the two groups of reserved holes 16 are arranged close to the injection molding chamber. The two groups of movable seats 17 are symmetrically provided with limiting holes 18, and the outer walls of the two groups of limiting shafts 14 are respectively threadedly connected with the inner walls of the multiple groups of limiting holes 18. The two groups of limiting shafts 14 rotate to drive the movable seat 17 to move, and the injection molding equipment 7 and the upper injection molding body 8 move downward, so that the upper injection molding body 8 is closed and connected with a group of lower injection molding bodies 15, and the injection molding equipment 7 performs resin injection molding and packaging operations on the chip in the injection molding chamber.

[0049] See also Figure 1 - Figure 4 A hydraulic pump 5 is installed on the upper end of the equipment body 1, and a telescopic column 6 is installed on the output end of the hydraulic pump 5, and the bottom end of the telescopic column 6 is connected to the injection molding equipment 7. The outer wall of the injection molding equipment 7 is sleeved with a mounting ring 9, and multiple groups of fixed columns 10 are installed on the outer wall of the mounting ring 9, and the bottom ends of the multiple groups of fixed columns 10 are all connected to the upper injection molding body 8. A tooth plate 11 is installed on the outer wall of one group of fixed columns 10. The hydraulic pump 5 drives the telescopic column 6 to move, thereby driving the injection molding equipment 7 and the mounting ring 9 to move. Because the mounting ring 9 is connected to the upper injection molding body 8 through multiple groups of fixed columns 10, it drives the upper injection molding body 8 to move, thereby driving the tooth plate 11 to move.

[0050] See also Figure 2 - Fig.10 An air pump 29 is installed on the inner wall of the equipment body 1, and the air pump 29 is provided with two groups of air inlet ends and one group of air outlet ends. The air inlet ends of the air pump 29 are both equipped with air inlet pipes 30, and both groups of air inlet pipes 30 are three-way pipes. A plurality of movable pipes 32 are installed in a rectangular array inside the equipment body 1, and the plurality of movable pipes 32 are respectively connected by synchronous belts. The air inlets at both ends of the two groups of air inlet pipes 30 are both movably installed with connecting bearings 31, and one end of the plurality of movable pipes 32 is respectively movably connected with the plurality of connecting bearings 31. When the air pump 29 is started, the two groups of air inlet pipes 30 are inhaled, so that the plurality of movable pipes 32 are inhaled, and through the setting of the connecting bearings 31, the plurality of movable pipes 32 are respectively movably connected with the two groups of air inlet pipes 30.

[0051] See also Figure 2 - Fig.10A plurality of movable blocks 33 are movably installed on the inner wall of the equipment body 1, and a plurality of arc-shaped slide grooves matched with the movable blocks 33 are provided on the inner wall of the equipment body 1. Connecting rods 34 are installed at the bottom ends of the plurality of movable blocks 33, and one ends of the plurality of connecting rods 34 are respectively connected with the plurality of movable tubes 32. An air suction plate 35 is installed at one end of the plurality of movable tubes 32. The plurality of movable blocks 33 cooperate with the plurality of connecting rods 34 to improve the stability of one end of the plurality of movable tubes 33. The plurality of movable tubes 32 generate suction force, which is transmitted to the plurality of air suction plates 35, and the bottom ends of the plurality of air suction plates 35 generate suction force.

[0052] See also Figure 2 - Fig.10 A movable shaft 39 is movably installed on the inner wall of the equipment body 1, and a movable gear 40 and a movable bevel gear 41 are respectively installed at both ends of the movable shaft 39, and the movable gear 40 is meshed and connected with the toothed plate 11. The toothed plate 11 is displaced to drive the movable gear 40 to rotate, thereby driving the movable shaft 39 and the movable bevel gear 41 to rotate.

[0053] See also Figure 2 - Fig.10 A second transmission shaft 42 is movably installed on the inner wall of the equipment body 1, and the second transmission shaft 42 is respectively connected to the two groups of movable tubes 32 through synchronous belts. A second transmission bevel gear 43 is installed on the upper end of the second transmission shaft 42, and the second transmission bevel gear 43 is meshed and connected with the movable bevel gear 41. The movable bevel gear 41 rotates, and the second transmission bevel gear 43 is meshed and connected with the movable bevel gear 41, so the second transmission bevel gear 43 rotates, thereby driving the second transmission shaft 42 to rotate, thereby driving the multiple groups of movable tubes 32 to rotate.

[0054] See also Figure 2 - Fig.10 An air outlet pipe 36 is installed at the air outlet end of the air pump 29, two groups of branch pipes 37 are symmetrically installed on the inner wall of the equipment body 1, and one end of the two groups of branch pipes 37 are connected to the air outlet pipe 36, two groups of heat dissipation pipes 38 are installed on the inner wall of the base 12, and the other ends of the two groups of branch pipes 37 are respectively connected to one end of the two groups of heat dissipation pipes 38, the outer walls of the two groups of heat dissipation pipes 38 are respectively movably connected to the inner walls of multiple groups of reserved holes 16, and one end of the two groups of heat dissipation pipes 38 extends to the outer wall of the equipment body 1, the air pump 29 discharges the airflow from the air outlet pipe 36, the air outlet pipe 36 conducts the airflow to the two groups of branch pipes 37, so that the airflow is discharged through the heat dissipation pipe 38, and the outer wall of the heat dissipation pipe 38 is movably connected to the inner wall of the reserved hole 16, the heat dissipation pipe 38 absorbs the heat generated by injection molding, and the airflow is discharged through the heat dissipation pipe 38, thereby improving the heat dissipation effect of the heat dissipation pipe 38 and accelerating the injection molding cooling effect.

[0055] See also Figure 1 - Figure 3The equipment body 1 is symmetrically provided with reserved openings 2, and the two sets of reserved openings 2 are respectively installed with a discharge conveyor belt 3 and a feed conveyor belt 4, and one end of the discharge conveyor belt 3 and the feed conveyor belt 4 are extended to the inside of the equipment body 1, and the unpackaged chips are transported to the equipment body 1 through the feed conveyor belt 4, and the packaged chips are transported out of the equipment body 1 through the discharge conveyor belt 3.

[0056] The working principle of the present invention is as follows: when an operator uses the device to perform packaging operations on transistor chips, the operator conveys the chips to the inside of the device body 1 through the feed conveyor belt 4, and the air pump 29 is started. The air pump 29 generates negative pressure through the air intake pipe 30 and the movable pipe 32, and a group of air intake plates 35 adsorb the chips;

[0057] After a set of suction plates 35 adsorb the chip, the hydraulic pump 5 is started to drive the telescopic column 6 to move upward, thereby driving the injection molding device 7 and the mounting ring 9 to move upward. Since the mounting ring 9 is connected to the upper injection molding body 8 through multiple sets of fixing columns 10, the upper injection molding body 8 is driven to move upward, thereby driving the tooth plate 11 to move, and the tooth plate 11 is meshed and connected with the movable gear 40, so the movable gear 40 rotates, thereby driving the movable shaft 39 to rotate, and then driving the movable bevel gear 40 to rotate, and the movable bevel gear 41 is connected to the second transmission The bevel gear 43 is meshed and connected, so the second transmission bevel gear 43 rotates, thereby driving the second transmission shaft 42 to rotate. Since the second transmission shaft 42 is connected to the two groups of movable tubes 32 respectively through synchronous belts, and the multiple groups of movable tubes 32 are respectively connected through synchronous belts, the multiple groups of movable tubes 32 rotate with the connecting bearing 31 as the center of the circle, thereby driving the multiple groups of suction plates 35 to move. One group of suction plates 35 drives the core plate to move to the upper end of one group of lower injection molding bodies 15, the air pump 29 is turned off, and the chip falls into the injection molding bin inside the lower injection molding body 15;

[0058] When the chip falls into the injection molding chamber inside the lower injection molding body 15, the driving motor 13 is started, thereby driving a set of limit shafts 14 to rotate forward, and the two sets of limit shafts 14 are connected by a synchronous belt, so the two sets of limit shafts 14 rotate synchronously. Because the outer walls of the two sets of limit shafts 14 are respectively threadedly connected to the inner walls of the multiple sets of limit holes 18, the two sets of moving seats 17 are displaced, thereby driving the two sets of lower injection molding bodies 15 to displace, one set of lower injection molding bodies 15 carries the chip and moves to the lower end of the upper injection molding body 8, and the other set of lower injection molding bodies 15 moves to one end of the base 12;

[0059] When a group of lower injection molding bodies 15 carry the chips and move to the lower end of the upper injection molding body 8, the driving motor 13 stops running, and the hydraulic pump 5 is started. The telescopic column 6 drives the injection molding equipment 7 and the upper injection molding body 8 to move downward, so that the upper injection molding body 8 is closed and connected with a group of lower injection molding bodies 15. The injection molding equipment 7 performs resin injection molding and packaging operations on the chips in the injection molding bin. During the injection molding operation, another group of chips is transported to the inside of the equipment body 1 through the feeding conveyor belt 4, and the air pump 29 is started. Another group of suction plates 35 adsorbs another group of chips, and through the outlet pipe 36 and two groups of branch pipes 37, the air flow is discharged through the heat dissipation pipe 38, and the outer wall of the heat dissipation pipe 38 is movably connected with the inner wall of the reserved hole 16. The heat dissipation pipe 38 absorbs the heat generated by injection molding, and the air flow is discharged through the heat dissipation pipe 38, which further improves the heat dissipation effect of the heat dissipation pipe 38 and accelerates the injection molding cooling;

[0060] After the injection molding operation is completed, the telescopic column 6 drives the upper injection molding body 8 to move upward, and another set of air suction plates 35 carry another set of chips to the upper end of another set of lower injection molding bodies 15, so that another set of chips enters another set of lower injection molding bodies 15, and the driving motor 13 is started to drive a set of limit shafts 14 to reverse, thereby driving the two sets of lower injection molding bodies 15 to move, one set of lower injection molding bodies 15 carries the chips that have been completed by injection molding and moves to one end of the base 12, and the other set of lower injection molding bodies 15 carries another set of chips to the lower end of the upper injection molding body 8;

[0061] When a group of lower injection molding bodies 15 carry the chips that have been injection molded and packaged to one end of the base 12, the two groups of first transmission shafts 26 are respectively connected to a group of limit shafts 14 through synchronous belts, so the two groups of first transmission shafts 26 rotate, and a one-way bearing 28 is installed at one end of a group of first transmission shafts 26, so that a group of first transmission shafts 26 only rotates in the positive direction, and the rotation of the two groups of first transmission shafts 26 drives the two groups of first transmission bevel gears 27 to rotate respectively, and the two groups of first transmission bevel gears 27 are respectively meshed and connected with the two groups of linkage bevel gears 25, so the two groups of linkage bevel gears 25 rotate, thereby driving the two groups of linkage shafts 23 to rotate, and then driving the two groups of fans 24 to rotate, so that the airflow enters the heat dissipation chamber 21 from the grid 22, and is discharged from the air outlet groove 20, when a group of lower injection molding bodies 15 carry the chips that have been injection molded and packaged through the lower end of the mounting seat 19, the airflow at the lower end of the mounting seat 19 is accelerated by the fan 24, thereby accelerating the heat dissipation of the chips that have been injection molded and packaged, and further improving the cooling effect of the chips that have been injection molded and packaged;

[0062] When one group of lower injection molding bodies 15 carries the chips that have been completed by injection molding and moves to one end of the base 12, and another group of lower injection molding bodies 15 carries another group of chips and moves to the lower end of the upper injection molding body 8, the upper injection molding body 8 moves downward to perform the injection molding operation, and one group of suction plates 35 adsorbs the chips on the upper end of the feeding conveyor belt 4, and another group of suction plates 35 adsorbs the chips that have been completed by injection molding and packaging in one group of lower injection molding bodies 15. When the upper injection molding body 8 completes the injection molding operation and moves upward, another group of suction plates 35 carries the chips that have been completed by injection molding and packaging and moves to the upper end of the discharging conveyor belt 3, and one group of suction plates 35 moves the chips to the upper end of one group of lower injection molding bodies 15, thereby further improving the chip packaging efficiency;

[0063] The present invention is provided with a mounting seat 19, a heat dissipation chamber 21 and a fan 24. When the chip that has been injection molded and packaged moves to the lower end of the mounting seat 19, the fan 224 rotates, driving the airflow at the lower end of the mounting seat 19 to enter the heat dissipation chamber 21 through the grid 22, and discharge the heat dissipation chamber 21 from the air outlet groove 20, thereby accelerating the flow of air, accelerating the heat dissipation of the chip that has been injection molded and packaged, and improving the cooling effect of the chip that has been injection molded and packaged.

[0064] Although an embodiment of the present invention has been shown and described, this specific embodiment is merely an explanation of the present invention and is not a limitation of the invention. The specific features, structures, materials or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. After reading this specification, those skilled in the art may make modifications, substitutions and variations to the embodiments without creative contributions as needed without departing from the principles and purpose of the present invention. However, as long as they are within the scope of the claims of the present invention, they are protected by patent law.

Claims

1. A packaging device for transistor chip production, comprising a device body (1), an injection molding device (7) and a base (12), characterized in that: An injection molding device (7) is movably installed inside the device body (1), and a base (12) is installed inside the device body (1); Two groups of movable seats (17) are movably mounted on the inner wall of the base (12), and lower injection molding bodies (15) are mounted on the upper ends of the two groups of movable seats (17). An upper injection molding body (8) is mounted on the lower end of the injection molding device (7), and the upper injection molding body (8) is movably connected to the two groups of lower injection molding bodies (15). A mounting seat (19) is symmetrically mounted on the upper end of the base (12), and heat dissipation bins (21) are provided inside the two groups of mounting seats (19). A grid (22) is mounted on the bottom ends of the two groups of mounting seats (19), and air outlet grooves (20) are symmetrically mounted on the upper ends of the two groups of mounting seats (19). Linking shafts (23) are symmetrically mounted on the inner wall of the equipment body (1), and one end of the two groups of linking shafts (23) respectively extends into the two groups of heat dissipation bins (21), and fans (24) are mounted on the bottom ends of the two groups of linking shafts (23); Two groups of limit shafts (14) are symmetrically installed inside the base (12), and the two groups of limit shafts (14) are connected by a synchronous belt. A driving motor (13) is installed on one side of the base (12), and the output end of the driving motor (13) is connected to a group of limit shafts (14). The two groups of limit shafts (14) are movably connected to the two groups of moving seats (17) respectively, and one group of limit shafts (14) is movably connected to the two groups of linkage shafts (23) respectively.

2. The transistor chip production packaging equipment according to claim 1, characterized in that: The inner wall of the equipment body (1) is symmetrically mounted with first transmission shafts (26), and two groups of first transmission shafts (26) are connected to a group of limit shafts (14) through a synchronous belt, one end of the two groups of first transmission shafts (26) is mounted with a first transmission bevel gear (27), one end of one group of the first transmission shafts (26) is mounted with a one-way bearing (28), and the upper ends of the two groups of linkage shafts (23) are mounted with linkage bevel gears (25), and the two groups of linkage bevel gears (25) are respectively meshed and connected with the two groups of first transmission bevel gears (27).

3. The transistor chip production packaging equipment according to claim 1, characterized in that: An injection molding chamber is provided at the bottom end of the upper injection molding body (8), and the injection molding head of the injection molding equipment (7) extends into the injection molding chamber. An injection molding chamber is provided at the upper ends of the two groups of lower injection molding bodies (15). A reserved hole (16) is provided at the two groups of lower injection molding bodies (15), and the two groups of reserved holes (16) are arranged close to the injection molding chamber. The two groups of movable seats (17) are symmetrically provided with limit holes (18), and the outer walls of the two groups of limit shafts (14) are respectively threadedly connected with the inner walls of the multiple groups of limit holes (18).

4. The transistor chip production packaging equipment according to claim 3, characterized in that: A hydraulic pump (5) is installed at the upper end of the equipment body (1), a telescopic column (6) is installed at the output end of the hydraulic pump (5), and the bottom end of the telescopic column (6) is connected to the injection molding equipment (7), the outer wall of the injection molding equipment (7) is provided with a mounting ring (9), the outer wall of the mounting ring (9) is installed with multiple groups of fixed columns (10), and the bottom ends of the multiple groups of fixed columns (10) are all connected to the upper injection molding body (8), and the outer wall of one group of the fixed columns (10) is installed with a toothed plate (11).

5. The transistor chip production packaging equipment according to claim 4, characterized in that: An air pump (29) is installed on the inner wall of the device body (1), and the air pump (29) is provided with two groups of air inlet ends and one group of air outlet ends. The air inlet ends of the air pump (29) are both installed with air inlet pipes (30), and both groups of air inlet pipes (30) are three-way pipes. A plurality of groups of movable pipes (32) are installed in a rectangular array inside the device body (1), and the plurality of groups of movable pipes (32) are respectively connected by synchronous belts. The air inlets at both ends of the two groups of the air inlet pipes (30) are both movably installed with connecting bearings (31), and one end of the plurality of groups of movable pipes (32) is respectively movably connected to the plurality of groups of connecting bearings (31).

6. The transistor chip production packaging equipment according to claim 5, characterized in that: A plurality of movable blocks (33) are movably mounted on the inner wall of the equipment body (1), and a plurality of arc-shaped slide grooves matching the movable blocks (33) are provided on the inner wall of the equipment body (1). Connecting rods (34) are mounted on the bottom ends of the plurality of movable blocks (33), and one end of the plurality of connecting rods (34) is respectively connected to the plurality of movable tubes (32), and one end of the plurality of movable tubes (32) is mounted on an air suction plate (35).

7. The transistor chip production packaging equipment according to claim 6, characterized in that: A movable shaft (39) is movably mounted on the inner wall of the equipment body (1), and a movable gear (40) and a movable bevel gear (41) are respectively mounted on both ends of the movable shaft (39), and the movable gear (40) is meshedly connected with the toothed plate (11).

8. The transistor chip production packaging equipment according to claim 7, characterized in that: A second transmission shaft (42) is movably mounted on the inner wall of the equipment body (1), and the second transmission shaft (42) is respectively connected to the two groups of movable tubes (32) via synchronous belts; a second transmission bevel gear (43) is mounted on the upper end of the second transmission shaft (42), and the second transmission bevel gear (43) is meshedly connected to the movable bevel gear (41).

9. The transistor chip production packaging equipment according to claim 5, characterized in that: The air outlet end of the air pump (29) is provided with an air outlet pipe (36), the inner wall of the device body (1) is symmetrically provided with two groups of branch pipes (37), and one end of each of the two groups of branch pipes (37) is connected to the air outlet pipe (36), the inner wall of the base (12) is provided with two groups of heat dissipation pipes (38), and the other ends of each of the two groups of branch pipes (37) are respectively connected to one end of each of the two groups of heat dissipation pipes (38), the outer walls of the two groups of heat dissipation pipes (38) are respectively movably connected to the inner walls of the plurality of groups of reserved holes (16), and one end of each of the two groups of heat dissipation pipes (38) extends to the outer wall of the device body (1).

10. The transistor chip production dedicated packaging equipment according to claim 1, characterized in that: The equipment body (1) is symmetrically provided with reserved openings (2), and two groups of the reserved openings (2) are respectively provided with a discharge conveyor belt (3) and a feed conveyor belt (4), and one end of the discharge conveyor belt (3) and the feed conveyor belt (4) both extend into the interior of the equipment body (1).

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