A warpage detection device, a carrier plate manufacturing and a warpage monitoring method thereof

Abstract

This invention discloses a warpage detection device, a carrier plate manufacturing process, and a warpage monitoring method. The warpage detection device includes a support frame, a stress detection layer, and a developing layer. The support frame serves as the basic support structure, the stress detection layer is connected to the support frame, and the developing layer is also connected to the support frame and spaced apart from the stress detection layer. The stress detection layer is designed to deform towards the developing layer under pressure from the carrier plate until it contacts the developing layer and leaves a mark on it. Thus, the warpage of the carrier plate can be visually displayed through the marks on the developing layer, facilitating rapid determination of the warpage location. This allows production personnel to adjust production processes or equipment promptly, reducing losses caused by excessive warpage of the carrier plate.

Description

Technical Field

[0001] This invention relates to the field of flip-chip ball grid array technology, and in particular to a warpage detection device, substrate manufacturing, and warpage monitoring method. Background Technology

[0002] FCBGA substrate, short for Flip Chip Ball Grid Array substrate, is a high-density substrate used for packaging bare IC (integrated circuit) chips. FCBGA substrates play a crucial role in chip packaging, providing support, heat dissipation, and protection for the chip, while also serving as an electronic bridge between the chip and the PCB (printed circuit board). With the rapid development of the electronics industry, the market demand for FCBGA substrates continues to grow. FCBGA substrates are widely used in smartphones, tablets, high-end servers, network routers / converters, high-performance game consoles, and other industries. During the manufacturing process, FCBGA substrates inevitably warp due to external factors. Excessive warping can lead to substandard quality, rework, and scrapping. Because FCBGA substrates undergo multiple processes during production, effectively controlling warping is difficult. Therefore, it is necessary to design a device capable of real-time monitoring of FCBGA substrate warping. Summary of the Invention

[0003] The main objective of this invention is to propose a warpage detection device, a carrier plate manufacturing process, and a warpage monitoring method, aiming to solve the technical problem of how to monitor the warpage of FCBAG carrier plates.

[0004] To achieve the above objectives, the present invention proposes a warpage detection device suitable for detecting the warpage of a carrier plate, comprising:

[0005] support;

[0006] A stress detection layer is connected to the bracket;

[0007] The developing layer is connected to the support and spaced apart from the stress detection layer;

[0008] The stress detection layer is configured to be deformed towards the developing layer by being pressed by the carrier plate, so as to press against the developing layer and produce and reveal a mark on the developing layer.

[0009] In some embodiments, the stress detection layer is configured to have a plurality of detection lines arranged in a crisscross pattern, the support includes a plurality of collimators surrounding the periphery of the developing layer, each of the detection lines is mounted on the collimator, and the detection lines are configured to extend or retract relative to the collimator, the collimator being configured to rotate as the detection lines extend or retract.

[0010] In some embodiments, the warping stress F of the carrier plate and the circumference x of the collimator rotation satisfy: F = kx, where k is the elastic coefficient of the detection line.

[0011] In some embodiments, the stress detection layer is configured to have multiple detection lines arranged horizontally and vertically intersecting each other, and the stress detection layer is provided with a pressure sensor, which is configured to detect the pressure exerted by the carrier plate on each of the detection lines.

[0012] In some embodiments, the support is configured to move toward the carrier plate, and the stress detection layer is configured to move relative to the developing layer in a direction parallel to the movement path of the support, so as to adjust the detection range of the warpage detection device according to the maximum preset warpage value of the carrier plate.

[0013] In some embodiments, along a direction parallel to the movement path of the support, the stress detection layer has a first position and a second position relative to the developing layer. When the stress detection layer is located at the first position, the distance from the stress detection layer to the developing layer is M, and the maximum preset warpage value of the carrier plate is L1. When the stress detection layer is located at the second position, the distance from the stress detection layer to the developing layer is N, and the maximum preset warpage value of the carrier plate is L2. Wherein, when M > N, L1 < L2.

[0014] In some embodiments, the warpage detection device has a positioning position along the direction of movement of the support, and the warpage detection device further includes a transport tray configured to carry the carrier plate and configured to move relative to the support so that the carrier plate is located at the positioning position.

[0015] The warpage detection device further includes a drive component. The support has an initial position, a preparatory position, and a working position. The drive component is connected to the support and is configured to drive the support to move between the initial position, the preparatory position, and the working position. When the support is in the initial position, the carrier plate is about to enter the positioning position. When the support is in the preparatory position, the carrier plate is located in the positioning position. When the support is in the working position, the carrier plate presses against the stress detection layer, and the stress detection layer presses against the developing layer.

[0016] In some embodiments, the maximum preset warpage value of the carrier plate is defined as L, and the thickness of the carrier plate is D. Then the path H of the support moving from the preparatory position to the working position satisfies: H = L + D.

[0017] In some embodiments, the carrier includes a body portion and a support portion connected to the body portion, the support portion protruding from the body portion, and the carrier includes a plurality of shipping units and an auxiliary edge surrounding the shipping units, the support portion being configured to support the auxiliary edge to create a gap between the shipping units and the body portion.

[0018] A second aspect of the present invention also provides a carrier plate manufacturing method and a warpage monitoring method thereof, the warpage monitoring method being applicable to a warpage detection device described in any of the above embodiments, the warpage detection device including a transport tray configured to carry the carrier plate and configured to move relative to the support, the carrier plate manufacturing method and the warpage monitoring method comprising:

[0019] Prepare a substrate and place the substrate on the carrier disk;

[0020] Drive the carrier disk to the warpage detection device;

[0021] The warpage detection device is used to perform warpage detection on the substrate to obtain first detection information;

[0022] The carrier disk is driven to move away from the warpage detection device, and the chip is soldered to the substrate to obtain the first workpiece;

[0023] Drive the carrier disk carrying the first workpiece to move to the warpage detection device;

[0024] The warpage detection device is used to perform warpage detection on the first workpiece to obtain second detection information;

[0025] The carrier disk is driven to move away from the warp detection device, and the first workpiece is encapsulated to obtain the carrier plate;

[0026] Drive the carrier plate to move to the warpage detection device;

[0027] The warpage detection device is used to detect warpage of the carrier plate to obtain third detection information;

[0028] The carrier plate is cut to obtain the shipping unit.

[0029] Compared with the prior art, the beneficial effects of the present invention are:

[0030] In the technical solution of this invention, the warpage detection device includes a support, a stress detection layer, and a developing layer. Both the stress detection layer and the developing layer are connected to the support, and the developing layer and the stress detection layer are spaced apart. The stress detection layer is configured to deform towards the developing layer under pressure from the carrier plate, thereby creating and displaying a mark on the developing layer. This allows production personnel to quickly determine the warpage location of the carrier plate based on the mark on the developing layer, enabling timely adjustments to the production process or equipment and reducing losses caused by excessive warpage of the carrier plate.

[0031] In related technologies, optical instruments are typically used to detect warpage of the carrier plate after it has been manufactured. However, the warpage detection device of this application can be installed at each manufacturing station in the carrier plate production process, thereby acquiring the warpage status of the carrier plate at each station. This allows production personnel to detect, predict, and avoid warpage risks at each manufacturing station in advance, thereby improving the yield rate of the carrier plate, reducing losses caused by excessive warpage, and lowering the manufacturing cost. Furthermore, the optical instruments used in related technologies have complex positioning processes, and the process of scanning and generating carrier plate warpage information is time-consuming. Detecting the next batch of carrier plates requires repeated positioning, resulting in low detection efficiency. The warpage detection device provided in this application uses a mechanical structure to detect carrier plate warpage, which is simple to operate and low in cost. In addition, this warpage detection device can adapt to the carrier plate production cycle, ensuring that excessive warpage is avoided without interfering with the carrier plate production process, resulting in high consistency of the produced carrier plates. Attached Figure Description

[0032] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0033] Figure 1 This is a schematic diagram of the warpage detection device in one embodiment of the present invention;

[0034] Figure 2 In one embodiment of the present invention, the warp detection device is along Figure 1 A sectional view cut along the AA direction;

[0035] Figure 3 In one embodiment of the present invention, the warp detection device is along Figure 1 A sectional view taken along the AA direction; in which the support is in the preparatory position;

[0036] Figure 4In another embodiment of the present invention, the warp detection device edge Figure 1 A sectional view taken along the AA direction; wherein the support is located between the preparatory position and the working position, and the detection line is pressed against the warped portion of the carrier plate;

[0037] Figure 5 In another embodiment of the present invention, the warp detection device is along Figure 1 A cross-sectional view taken along the AA direction; wherein the support is in the working position, the stress detection layer is pressed against the warped portion of the carrier plate, and the stress detection layer is pressed against the developing layer;

[0038] Figure 6 This is a schematic diagram of the structure after the carrier plate is placed on the transport disk in one embodiment of the present invention;

[0039] Figure 7 In one embodiment of the present invention, the carrier plate is placed at the rear edge of the transport disk. Figure 6 A sectional view cut along the BB direction;

[0040] Figure 8 This is a schematic diagram of the structure of the carrier disk in one embodiment of the present invention.

[0041] Explanation of icon numbers:

[0042] Warp detection device 100;

[0043] Support 110; Collimator 111;

[0044] Stress testing layer 120; Testing line 121;

[0045] Developing layer 130;

[0046] Carrier plate 140; Body 141; Support section 142;

[0047] Carrier plate 200;

[0048] Shipping unit 210; auxiliary side 220.

[0049] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0050] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0051] Please see Figures 1 to 8This invention provides a warpage detection device suitable for detecting the warpage of a substrate, including but not limited to flip-chip ball grid array substrates. The warpage detection device includes a support frame, a stress detection layer, and a developing layer. The support frame serves as the basic support structure, the stress detection layer is connected to the support frame, and the developing layer is also connected to the support frame and spaced apart from the stress detection layer. The stress detection layer is designed to deform towards the developing layer under pressure from the substrate until it contacts the developing layer and leaves a mark. Thus, the warpage of the substrate can be visually displayed through the marks on the developing layer, facilitating rapid determination of the warpage location.

[0052] In some embodiments, the stress detection layer may be made of a flexible material capable of deforming with the warping of the carrier plate. In some embodiments, the stress detection layer and the developing layer are configured to move toward the carrier plate until they press against the surface of the carrier plate to obtain information about the warping of the carrier plate. In other embodiments, the carrier plate may be placed on the stress detection layer, and if the carrier plate is warped, the stress detection layer will deform toward the developing layer under the warping action of the carrier plate. When the stress detection layer comes into contact with the developing layer, the developing layer may undergo a color change or other visible markings to indicate the location and extent of the warping of the carrier plate. The developing layer may be made of a pressure-deformable material, such as photosensitive paper or a special coating, leaving a visible imprint or mark on the developing layer when the stress detection layer comes into contact with it.

[0053] Understandably, in some embodiments, the developing layer uses special materials, such as pressure-sensitive ink or a color-developing coating, which immediately reveals traces when the stress detection layer comes into contact with it. By observing the traces on the developing layer, production personnel can quickly determine the warping location of the carrier board and adjust the production process or equipment in a timely manner to avoid losses caused by carrier board warping. Compared to traditional optical inspection methods, the ingenious combination of the stress detection layer and the developing layer makes the inspection process simple and efficient, providing immediate feedback on the warping status of the carrier board, greatly improving production efficiency and quality control capabilities. In other embodiments, the developing layer can also be pressure test paper (also known as pressure-sensitive paper). In still other embodiments, the developing layer can also be replaceable developing test paper.

[0054] Please see Figures 1 to 8This invention provides a warpage detection device 100, which is suitable for detecting the warpage of a carrier 200, including but not limited to a flip-chip ball grid array carrier 200. The warpage detection device 100 includes a support 110, a stress detection layer 120, and a developing layer 130. The support 110 serves as a basic support structure, the stress detection layer 120 is connected to the support 110, and the developing layer 130 is also connected to the support 110 and spaced apart from the stress detection layer 120. The stress detection layer 120 is designed to deform towards the developing layer 130 under pressure from the carrier 200 until it contacts the developing layer 130 and leaves a mark on it. Thus, the warpage of the carrier 200 can be visually displayed through the marks on the developing layer 130, facilitating rapid determination of the warpage location.

[0055] In some embodiments, the stress detection layer 120 may be made of a flexible material capable of deforming with the warping of the carrier plate 200. In some embodiments, the stress detection layer 120 and the developing layer 130 are configured to move toward the carrier plate 200 until they press against the surface of the carrier plate 200 to detect the warping of the carrier plate 200. In other embodiments, the carrier plate 200 may be placed on the stress detection layer 120, and if the carrier plate 200 is warped, the stress detection layer 120 will deform toward the developing layer 130 under the warping action of the carrier plate 200. When the stress detection layer 120 comes into contact with the developing layer 130, the developing layer 130 may undergo a color change or other visible markings to indicate the location and degree of warping of the carrier plate 200. The developing layer 130 may be made of a pressure-deformable material, such as photosensitive paper or a special coating, leaving a visible mark or trace on the developing layer 130 when the stress detection layer 120 comes into contact with it.

[0056] Understandably, in some embodiments, the developing layer 130 uses special materials, such as pressure-sensitive ink or a color-developing coating, which can immediately reveal traces when the stress detection layer 120 comes into contact with it. By observing the traces on the developing layer 130, production personnel can quickly determine the warping location of the carrier plate 200, and then adjust the production process or equipment in a timely manner to avoid losses caused by the warping of the carrier plate 200. Compared with traditional optical inspection methods, the ingenious combination of the stress detection layer 120 and the developing layer 130 makes the inspection process simple and efficient, and the warping of the carrier plate 200 can be given immediate feedback, greatly improving production efficiency and quality control capabilities. In other embodiments, the developing layer 130 can also be pressure test paper (also known as pressure-sensitive paper). In still other embodiments, the developing layer 130 can also be replaceable developing test paper.

[0057] Please see Figures 1 to 3In some embodiments, the warpage detection device 100 includes a support 110, a stress detection layer 120, and a developing layer 130. The stress detection layer 120 is configured with a plurality of detection lines 121 arranged in a crisscross pattern. The support 110 includes a plurality of collimators 111 surrounding the developing layer 130. Each detection line 121 is mounted on a collimator 111 and is configured to extend or retract relative to the collimator 111. The collimator 111 is configured to rotate as the detection lines 121 extend or retract. In some embodiments, the detection lines 121 are made of materials including, but not limited to, nylon. The detection lines 121 are configured to have a certain degree of elasticity to ensure that the pressure applied to the carrier plate 200 by the stress detection layer 120 during warpage detection does not cause marks on the surface of the carrier plate 200, thereby improving the production quality of the carrier plate 200.

[0058] Specifically, the stress detection layer 120 consists of multiple detection lines 121 arranged in a crisscross pattern to form a grid structure. Each detection line 121 is mounted on a collimator 111, which is wound around the periphery of the developing layer 130. When the carrier plate 200 contacts the stress detection layer 120, if the carrier plate 200 is warped, the stress detection layer 120 will deform due to the localized pressure generated by the warped portion of the carrier plate 200, causing the detection lines 121 to extend or retract relative to the collimator 111 at certain positions. The collimator 111 can rotate as the detection lines 121 extend or retract, preventing the detection lines 121 from being damaged by the warping stress of the carrier plate 200. This ensures the service life of the warping detection device 100 while detecting the warping of the carrier plate 200, reducing maintenance costs and frequency.

[0059] It should be noted that the placement of the detection line 121 enables the warpage detection device 100 to accurately sense minute unevenness changes on the surface of the carrier plate 200, especially pressure changes caused by warping. This high sensitivity ensures that even minor warping can be effectively detected by the detection line 121. When the warped portion of the carrier plate 200 contacts the detection line 121 and pressure is applied, the detection line 121 deforms. This deformation process converts the physical signal generated by warping into a mechanical displacement signal, which is beneficial for subsequent signal conversion and recognition. Furthermore, since the warped portion of the carrier plate 200 may have irregular shapes, making it difficult to obtain information about warping, the detection line 121 can form a protrusion based on the highest point of the warp it contacts. This protrusion presses against the developing layer 130, making it easier for the developing layer 130 to reveal traces. At the same time, the presence of the detection line 121 also helps to reduce wear between the developing layer 130 and the carrier plate 200.

[0060] Understandably, in some embodiments, the extension or retraction of the detection line 121 causes the collimator 111 to rotate. When warping occurs in a certain area of ​​the carrier plate 200, the detection line 121 at the corresponding position will be subjected to greater pressure, thus extending or retracting, thereby causing the collimator 111 to rotate. In some embodiments, the rotation angle of the collimator 111 is proportional to the magnitude of the warping stress of the carrier plate 200. Therefore, by detecting the rotation angle of the collimator 111, the warping of the carrier plate 200 can be quantified. Combined with the traces of the developing layer 130, warping detection becomes more intuitive and accurate, allowing production personnel to adjust the production process or equipment in a timely manner based on the detection results, avoiding losses caused by excessive warping of the carrier plate 200.

[0061] In some embodiments, the warping stress F of the carrier plate 200 and the circumference x of the collimator 111 rotation satisfy the relationship F = kx, where k is the elastic coefficient of the detection line 121. That is, the warping stress of the carrier plate 200 can be indirectly measured by calculating and analyzing the rotation circumference of the collimator 111. When the warping stress of the carrier plate 200 is greater, the rotation circumference of the collimator 111 is also greater, and vice versa.

[0062] Specifically, the elastic coefficient k of the detection line 121 is a fixed physical parameter representing the stress change of the detection line 121 per unit length. By measuring the circumference x of the collimator 111's rotation, the warping stress F of the carrier plate 200 can be calculated. This design makes warping detection more quantitative and accurate, providing production personnel with reliable detection data, facilitating timely adjustments to process parameters, and ensuring the consistency and high-quality production of the carrier plate 200.

[0063] Understandably, in some embodiments, the warping stress F of the carrier plate 200 is indirectly measured by rotating the collimator 111 by a distance x, enabling accurate detection of the warping of the carrier plate 200. Since the elastic coefficient k of the detection line 121 is known, the warping stress F of the carrier plate 200 can be calculated based on the relationship F = kx, as long as the rotation distance x of the collimator 111 is measured. This not only simplifies the detection process but also improves detection efficiency, allowing the warping detection device 100 to adapt to the production rhythm of the carrier plate 200 without interfering with the production process, thus ensuring the consistency and high-quality production of the carrier plate 200.

[0064] It should be noted that, in some embodiments, the warpage detection device 100 may be equipped with a pull-string displacement sensor to obtain the rotational circumference of the collimator 111. The pull-string displacement sensor includes a winding reel coaxially arranged with the collimator 111 and a pull-string connected to the periphery of the collimator 111. When the collimator 111 rotates, the pull-string winds around the winding reel, thereby driving the rotatable sliding resistor inside the pull-string displacement sensor to rotate and emit a resistance signal. The warpage detection device 100 may be equipped with a controller and a display. The controller can calculate the rotational distance of the collimator 111 by measuring the change in the resistance signal, and thus obtain the circumference of the collimator 111. After obtaining the warpage stress at the warpage point of the carrier plate 200 based on the rotational circumference of the collimator 111 and the elastic coefficient of the detection line 121, the controller can display the relevant information on the display for easy and quick access by production personnel. In other embodiments, the warpage detection device 100 may also be configured with a combination of a Hall sensor and a magnetic sheet to obtain the rotational circumference of the collimator 111. Specifically, a magnetic sheet may be placed on one side of the collimator 111, and a Hall sensor may be installed below the collimator 111. When the collimator 111 rotates, the magnetic sheet passes through the Hall sensor, thereby generating an induced pulse signal. The controller can calculate the rotational circumference of the collimator 111 by measuring the period and linear velocity of the pulse signal (which can be obtained through other speed sensors). In still other embodiments, the rotational circumference of the collimator 111 may also be obtained by using a roller-type ranging wheel.

[0065] In other embodiments, the warpage detection device 100 includes a support 110, a stress detection layer 120, and a developing layer 130. The stress detection layer 120 is configured with multiple detection lines 121 arranged in a crisscross pattern, and the stress detection layer 120 is equipped with pressure sensors. The pressure sensors are configured to detect the pressure exerted on each detection line 121 by the carrier plate 200, thereby ensuring accurate detection of warpage of the carrier plate 200.

[0066] Specifically, the stress detection layer 120 consists of multiple detection lines 121 arranged in a crisscross pattern to form a grid structure. Each detection line 121 is mounted on a bracket 110, and a pressure sensor is installed between the detection lines 121. When the carrier plate 200 presses against the stress detection layer 120, if the carrier plate 200 is warped, the detection lines 121 will be subjected to pressure from different parts of the carrier plate 200. The pressure sensors can detect the pressure changes on each detection line 121 and convert this information into electrical signals, which are then transmitted to the controller for analysis and processing to determine the warping status of the carrier plate 200. It is understood that in some embodiments, by installing pressure sensors within the stress detection layer 120, real-time monitoring of the warping status of the carrier plate 200 can be achieved. The pressure sensors can accurately capture changes in the force on the detection lines 121, and combined with the traces revealed by the developing layer 130, the warping information of the carrier plate 200 can be quickly obtained.

[0067] In some embodiments, the support 110 is configured to move toward the carrier plate 200, and the stress detection layer 120 is configured to move relative to the developing layer 130 in a direction parallel to the movement path of the support 110. This allows the detection range of the warpage detection device 100 to be adjusted according to the maximum preset warpage value of the carrier plate 200, thereby enabling the warpage detection device 100 to adapt to the detection requirements of different carrier plates 200 and improving the flexibility and accuracy of the detection. Specifically, there is a certain distance between the stress detection layer 120 and the developing layer 130, and the position of the stress detection layer 120 relative to the developing layer 130 can be adjusted according to the maximum preset warpage value of the carrier plate 200 required by the customer. When the preset warpage value of the carrier plate 200 is large, the distance between the stress detection layer 120 and the developing layer 130 can be appropriately reduced, and vice versa. This ensures that the warpage of the carrier plate 200 is within the detection range, avoiding false alarms or missed detections due to an excessively wide or narrow detection range.

[0068] It is understood that, in some embodiments, precise detection of different carrier plates 200 can be achieved by adjusting the position of the stress detection layer 120 relative to the developing layer 130. This adjustable design allows the warpage detection device 100 to adapt to the detection needs of carrier plates 200 with various specifications and degrees of warpage. Production personnel can flexibly adjust the detection range according to actual conditions to ensure that each detection covers all warpage conditions of the carrier plate 200, thereby improving the effectiveness and reliability of the detection, while reducing production and maintenance costs, and increasing the service life and economic benefits of the warpage detection device 100.

[0069] Exemplarily, along the direction parallel to the movement path of the bracket 110, the stress detection layer 120 has a first position and a second position relative to the development layer 130. When the stress detection layer 120 is at the first position, the distance from it to the development layer 130 is M, and the maximum preset warpage value of the carrier plate 200 is L1; when the stress detection layer 120 is at the second position, the distance from it to the development layer 130 is N, and the maximum preset warpage value of the carrier plate 200 is L2. When M > N, L1 < L2. Thus, the production personnel can adjust the distance between the stress detection layer 120 and the development layer 130 according to the maximum preset warpage value of the carrier plate 200, so that the warpage detection device 100 can adapt to the detection requirements of different specifications of the carrier plate 200, improving the flexibility and accuracy of detection.

[0070] Please refer to Figures 3 to 5 , in some embodiments, the warpage detection device 100 has a positioning position along the direction of movement of the bracket 110. The warpage detection device 100 further includes a carrier tray 140 configured to be able to carry the carrier plate 200 and move relative to the bracket 110 so that the carrier plate 200 is located at the positioning position. The warpage detection device 100 further includes a driving member. The bracket 110 has an initial position, a preparatory position, and a working position. The driving member is connected to the bracket 110 and is configured to be able to drive the bracket 110 to move between the initial position, the preparatory position, and the working position.

[0071] Specifically, when the bracket 110 is at the initial position, the carrier plate 200 is to enter the positioning position; when the bracket 110 is at the preparatory position, at this time the carrier plate 200 is located at the positioning position and the stress detection layer 120 has not yet contacted the carrier plate 200; when the bracket 110 is at the working position, the carrier plate 200 has been pressed against the stress detection layer 120 and the stress detection layer 120 has been pressed against the development layer 130. It should be noted that when the bracket 110 is at the initial position, there is enough space between the stress detection layer 120 and the positioning position for the carrier tray 140 to transport the carrier plate 200 to the positioning position.

[0072] Understandably, in some embodiments, by setting different positions of the support 110, an automated inspection process for the carrier plate 200 can be achieved, synchronizing the inspection process with the production cycle of the carrier plate 200. This improves the monitoring of warpage of the carrier plate 200 without affecting its production efficiency. The transport tray 140 carries the carrier plate 200 and can move between different positions, ensuring that the carrier plate 200 is inspected in the correct position and can be transported between manufacturing stations. When the support 110 is in the initial position, the carrier plate 200 has not yet entered the inspection position; when the carrier plate 200 is in the positioning position, the support 110 moves to the preparatory position, ready for inspection; when the support 110 moves to the working position, the carrier plate 200 presses against the stress detection layer 120 for actual warpage detection. Throughout the entire inspection process, the support 110 only needs to move in the same direction, simplifying the inspection process, improving inspection efficiency, ensuring the accuracy of the inspection results, and avoiding errors caused by improper manual operation.

[0073] In some embodiments, for ease of description, the maximum preset warpage value of the carrier plate 200 is defined as L, and the thickness of the carrier plate 200 is defined as D. The path H of the support 110 moving from the preparatory position to the working position satisfies: H = L + D. The distance of the support 110 moving from the preparatory position to the working position is determined by the maximum warpage value of the carrier plate 200 and the thickness of the carrier plate 200, thereby avoiding excessive movement of the support 110 that could damage the carrier plate 200, the stress detection layer 120, and the developing layer 130. At the same time, it ensures that the stress detection layer 120 and the developing layer 130 can effectively detect the carrier plate 200 with different warpage requirements, so that when the carrier plate 200 presses against the stress detection layer 120, it can fully contact the developing layer 130, ensuring the accuracy of the detection.

[0074] Please see Figures 6 to 8 In some embodiments, the carrier tray 140 includes a body portion 141 and a support portion 142 connected to the body portion 141, the support portion 142 protruding from the body portion 141, and the carrier plate 200 includes multiple shipping units 210 and auxiliary edges 220 surrounding the shipping units 210. The support portion 142 is configured to support the auxiliary edges 220, creating a gap between the shipping units 210 and the body portion 141. The carrier plate 200 receives better support on the carrier tray 140, ensuring stability during the inspection process. Simultaneously, the gap between the shipping units 210 and the body portion 141 prevents friction damage between the shipping units 210 and the body portion 141, thereby improving the production quality of the carrier plate 200.

[0075] A second aspect of the present invention also provides a method for manufacturing a carrier plate 200 and monitoring its warpage, which is applicable to the warpage detection device 100 described in any of the above embodiments and implementations. The method includes, but is not limited to, the following steps:

[0076] S101: Substrate fabrication. First, a substrate is fabricated and placed on the carrier tray 140. The substrate is the basis for subsequent processing, and its flatness and dimensions must meet the requirements. The carrier tray 140 is driven to the warpage detection device 100 so that the substrate can enter the detection position of the warpage detection device 100.

[0077] S102: The warpage detection device 100 is used to detect warpage of the substrate to obtain first detection information. When the substrate is pressed against the stress detection layer 120, if the substrate is warped, the stress detection layer 120 will be deformed towards the developing layer 130 due to the pressure from the substrate, thereby generating and displaying traces on the developing layer 130. By observing the traces on the developing layer 130, the warpage location of the substrate can be determined.

[0078] S103: Drive the carrier disk 140 away from the warp detection device 100 so that the substrate is moved out of the detection position.

[0079] S104: The carrier disk 140 carries the substrate to the chip welding point and welds the chip onto the substrate to form the first workpiece.

[0080] S105: Move the carrier plate 140 carrying the first workpiece to the warping detection device 100 again (at this time, the warping detection device 100 can be the warping detection device 100 in step S102, or it can be another additional warping detection device 100).

[0081] S106: The first workpiece is warped using the warp detection device 100 to obtain second detection information. This detection step can detect whether new warping has been introduced during the chip soldering process, so that production personnel can monitor each manufacturing station of the carrier board 200 in real time.

[0082] S107: Drive the carrier disk 140 away from the warp detection device 100 again to move the first workpiece out of the detection position.

[0083] S108: The carrier plate 140 carries the first workpiece to the packaging station, where the first workpiece is packaged to form the carrier plate 200.

[0084] S109: The carrier tray 140 carrying the carrier plate 200 is moved again to the warpage detection device 100 (similarly, this warpage detection device 100 can be the warpage detection device 100 in step S102, or it can be another additional warpage detection device 100), and the warpage detection device 100 is used to perform warpage detection on the carrier plate 200 to obtain the third detection information. This detection step can monitor whether new warpage has been introduced during the packaging process of the carrier plate 200.

[0085] S110: The carrier plate 200 after being packaged by the carrier tray 140 is transported to the cutting station, where the carrier plate 200 is cut into multiple shipping units 210, completing the entire manufacturing and warpage monitoring process.

[0086] It is understood that, in some embodiments, the above steps can ensure that the carrier plate 200 can be detected for warpage in a timely manner at each stage of the production process. Each detection helps to promptly identify and address warpage issues, thereby improving the yield of the carrier plate 200 and reducing losses and manufacturing costs caused by warpage. In other words, by performing multiple warpage detections at different stages, warpage issues can be detected and addressed promptly, ensuring the quality of the carrier plate 200. Each detection can quickly determine the warpage location of the carrier plate 200 based on the traces on the developing layer 130, thus facilitating adjustments to the production process or equipment.

[0087] Compared to traditional optical instrument testing methods, the warpage detection device 100 provided by this invention is simple to operate, low in cost, and adaptable to the production rhythm of the carrier plate 200 without interfering with the production process. The detection process is simple and quick, improving production efficiency. Furthermore, by employing the carrier plate 200 manufacturing and warpage monitoring method provided by this invention, multiple tests are performed throughout the production process to promptly detect and address warpage issues, ensuring high consistency of the produced carrier plates 200 and avoiding product quality problems caused by warpage.

[0088] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0089] Furthermore, if the embodiments of this invention involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or," "and / or," or "and / or" throughout the text implies three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0090] The above are merely preferred embodiments of the present invention and do not limit the scope of the patent. Any equivalent structural transformations made using the contents of the specification and drawings of the present invention under the inventive concept of the present invention, or direct / indirect applications in other related technical fields, are included within the scope of patent protection of the present invention.

Claims

1. A warpage detection device, suitable for detecting the warpage amount of a carrier plate, characterized in that, include: support; A stress detection layer is connected to the bracket; The developing layer is connected to the support and spaced apart from the stress detection layer; The stress detection layer is configured to be deformed toward the developing layer by being pressed by the carrier plate, so as to produce and show a mark on the developing layer; The stress detection layer is configured to have multiple detection lines arranged horizontally and vertically. The support includes multiple collimators surrounding the periphery of the developing layer. Each detection line is mounted on the collimator, and the detection line is configured to extend or retract relative to the collimator. The collimator is configured to rotate as the detection line extends or retracts. The stress detection layer is configured to have multiple detection lines arranged horizontally and vertically, and the stress detection layer is equipped with a pressure sensor, which is configured to detect the pressure of the carrier plate pressing on each of the detection lines. The support is configured to move toward the carrier plate, and the stress detection layer is configured to move relative to the developing layer in a direction parallel to the movement path of the support, so as to adjust the detection range of the warpage detection device according to the maximum preset warpage value of the carrier plate. Along the direction of movement of the support, the warpage detection device has a positioning position, and the warpage detection device further includes a transport tray, the transport tray being configured to carry the carrier plate and configured to move relative to the support so that the carrier plate is located at the positioning position; The warpage detection device further includes a drive component. The support has an initial position, a preparatory position, and a working position. The drive component is connected to the support and is configured to drive the support to move between the initial position, the preparatory position, and the working position. When the support is in the initial position, the carrier plate is about to enter the positioning position. When the support is in the preparatory position, the carrier plate is located in the positioning position. When the support is in the working position, the carrier plate presses against the stress detection layer, and the stress detection layer presses against the developing layer.

2. The warpage detection device as described in claim 1, characterized in that, The warping stress F of the carrier plate and the circumference x of the collimator rotation satisfy: F=kx, where k is the elastic coefficient of the detection line.

3. The warpage detection device as described in claim 1, characterized in that, Along a direction parallel to the movement path of the support, the stress detection layer has a first position and a second position relative to the developing layer. When the stress detection layer is located at the first position, the distance from the stress detection layer to the developing layer is M, and the maximum preset warpage value of the carrier plate is L1. When the stress detection layer is located at the second position, the distance from the stress detection layer to the developing layer is N, and the maximum preset warpage value of the carrier plate is L2. Where M > N, L1 < L2.

4. The warpage detection device as described in claim 1, characterized in that, The maximum preset warpage value of the carrier plate is defined as L, and the thickness of the carrier plate is D. Then the path H of the support moving from the preparatory position to the working position satisfies: H=L+D.

5. The warpage detection device as described in claim 1, characterized in that, The carrier plate includes a body and a support portion connected to the body. The support portion protrudes from the body and the carrier plate includes multiple shipping units and auxiliary edges surrounding the shipping units. The support portion is configured to support the auxiliary edges to create a gap between the shipping units and the body.

6. A carrier plate manufacturing method and a warpage monitoring method thereof, the warpage monitoring method being applicable to the warpage detection device according to any one of claims 1-5, the warpage detection device comprising a transport tray configured to carry the carrier plate and configured to move relative to the support, characterized in that, The carrier plate manufacturing and warpage monitoring methods include: Prepare a substrate and place the substrate on the carrier disk; Drive the carrier disk to the warpage detection device; The warpage detection device is used to perform warpage detection on the substrate to obtain first detection information; The carrier disk is driven to move away from the warpage detection device, and the chip is soldered to the substrate to obtain the first workpiece; Drive the carrier disk carrying the first workpiece to move to the warpage detection device; The warpage detection device is used to perform warpage detection on the first workpiece to obtain second detection information; The carrier disk is driven to move away from the warp detection device, and the first workpiece is encapsulated to obtain the carrier plate; Drive the carrier plate to move to the warpage detection device; The warpage detection device is used to detect warpage of the carrier plate to obtain third detection information; The carrier plate is cut to obtain the shipping unit.

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