electronic devices

Abstract

This application provides an electronic device, relating to the field of electronic device technology. The electronic device includes a display screen, a mid-frame, a bezel, and a conductive layer. The bezel includes a first component and a second component, a portion of which is located on the display side of the display screen. A portion of the conductive layer is attached to the inner surface of the first component, and another portion of the conductive layer is attached to the inner surface of the second component. The conductive layer overlaps with the orthographic projection of the display screen onto a reference plane. The mid-frame includes a metal portion electrically connected to the ground of the electronic device. The metal portion is spaced apart from the conductive layer. The conductive layer has a first coupling surface, and the metal portion has a second coupling surface facing the first coupling surface. The first and second coupling surfaces are spaced apart along a direction perpendicular to the thickness direction of the electronic device. This grounding of static electricity entering the electronic device prevents damage to the display screen from electrostatic discharge.

Description

Technical Field

[0001] This application relates to the field of electronic device technology, and in particular to an electronic device. Background Technology

[0002] Currently, to prevent electrostatic discharge (ESD) damage to the display modules of electronic devices, conductive cloth is used. One end of the conductive cloth overlaps with the protective layer located on the outside of the bend in the display panel of the display module, while the other end is connected to the ground of the electronic device. Static electricity entering the electronic device is conducted away by the conductive cloth, thus achieving the purpose of preventing ESD. However, the actual position of the conductive cloth deviates significantly from the preset position, making it unable to conduct static electricity away, which leads to easy damage to the display module. Summary of the Invention

[0003] This application provides an electronic device that grounds static electricity entering the device, preventing damage to the display screen inside the device from electrostatic discharge.

[0004] This application provides an electronic device including a display screen, a mid-frame, a bezel, and a conductive layer. The bezel includes a first component and a second component. The first component is connected to a first end of the second component, and the second end of the second component is connected to the mid-frame. Both the first and second components are spaced apart from the display screen. A portion of the first component is located on the display side of the display screen, and the first component overlaps with the orthographic projection of the display screen onto a reference plane, which is a plane containing the length and width directions of the electronic device. The inner surface of the first component is connected to the inner surface of the second component. At least a portion of the inner surface of the first component is parallel to the display surface of the display screen, and at least a portion of the inner surface of the second component is perpendicular to the display surface of the display screen. A portion of the conductive layer is attached to the inner surface of the first component, and another portion of the conductive layer is attached to the inner surface of the second component. The conductive layer overlaps with the orthographic projection of the display screen onto the reference plane. The mid-frame includes a metal portion electrically connected to the ground of the electronic device. The metal portion is spaced apart from the conductive layer. The conductive layer has a first coupling surface, and the metal portion has a second coupling surface facing the first coupling surface. The first and second coupling surfaces are spaced apart along a direction perpendicular to the thickness direction of the electronic device.

[0005] When external static electricity enters the electronic device through the gap between the frame and the display screen, it enters the conductive layer. The conductive layer releases the static electricity to the metal component through the gap between the first and second coupling surfaces. The conductive layer then transfers the static electricity to the mid-frame for grounding via a coupling jumper, preventing excessive static electricity accumulation on the display screen and thus preventing damage. Furthermore, the first and second coupling surfaces are arranged perpendicular to the thickness of the electronic device. This increases the coupling area between the first and second coupling surfaces, creating a large-area coupling between the conductive layer and the metal component. This increases the electrostatic transfer efficiency between the conductive layer and the metal component, effectively conducting static electricity from the conductive layer to the metal component and further enhancing the display screen's safety. Additionally, there is no physical connection between the conductive layer and the mid-frame; the conductive layer does not affect the connection between the mid-frame and the frame.

[0006] In some possible implementations, the resistance of the conductive layer is less than or equal to 1 ohm, giving it high conductivity. This allows for rapid electrostatic discharge (ESD) transfer, quickly guiding static electricity to the metal part for grounding and preventing excessive ESD buildup on the display. Furthermore, the low resistance of the conductive layer has minimal impact on antenna performance, allowing for thinner and lighter designs of electronic devices within acceptable limits. It also enables distributed antenna designs, increases battery capacity, and thus allows for longer battery life.

[0007] In some possible implementations, the conductive layer is a metal layer, which can reduce the resistance of the conductive layer and increase its conductivity. Alternatively, the conductive layer can be formed on the inner surface of the frame component using low-cost processes such as laser ablation, laser direct forming, laser reconstruction printing, or laser surface coating, which can reduce the cost of the conductive layer and improve the economics of electronic devices.

[0008] In some possible implementations, the first coupling surface is parallel to the second coupling surface, which can increase the coupling area between the first coupling surface and the second coupling surface, improve the electrostatic transfer efficiency between the conductive layer and the metal part, and help to further improve the efficiency of the conductive layer in removing static electricity.

[0009] In some possible implementations, the distance between the first coupling surface and the second coupling surface is greater than or equal to 0.03 mm and less than or equal to 0.1 mm in a direction perpendicular to the thickness direction of the electronic device, so that the first coupling surface and the second coupling surface form a small gap, further ensuring that the direction and energy of electrostatic discharge are relatively stable, and improving the stability of electrostatic conduction from the conductive layer to the metal part.

[0010] In some possible implementations, the middle frame includes at least one second coupling surface, each second coupling surface corresponding to at least one first coupling surface and facing the corresponding first coupling surface, which improves the efficiency of the conductive layer in guiding static electricity to the middle frame, and the number and position of the first coupling surfaces can be reasonably designed according to the structure of the middle frame.

[0011] In some possible implementations, the first coupling surface is a first plane and the second coupling surface is a second plane, which helps to form a small gap between the first coupling surface and the second coupling surface, ensuring that the direction and energy of electrostatic jump are relatively stable.

[0012] In some possible implementations, the electronic device includes multiple conductive layers spaced apart along the length of the bezel. These conductive layers each conduct static electricity that enters the electronic device through the gap between the bezel and the display screen, increasing the speed of static discharge and further improving the display screen's electrostatic discharge capability. Furthermore, gaps between adjacent conductive layers shorten the length of each individual conductive layer, allowing radio frequency resonant noise generated by the conductive layers to avoid the antenna's resonant frequency band, further reducing its impact on antenna performance.

[0013] In some possible implementations, the spacing between two adjacent conductive layers is greater than or equal to 0.03 mm and less than or equal to 0.8 mm. This avoids excessively large gaps between adjacent conductive layers, preventing static electricity from escaping through these gaps to the display screen and causing damage. Furthermore, it ensures that radio frequency resonant noise generated by the conductive layers avoids the antenna resonant frequency band.

[0014] In some possible implementations, the conductive layer includes a guide portion and a pin portion. The guide portion is attached to the inner surface of the first component, extends along the length of the frame member, and is located on the display side of the display screen. At least a portion of the orthographic projection of the guide portion onto the reference plane is located inside the orthographic projection of the display screen onto the reference plane. The pin portion is attached to the inner surface of the second component, one end of the pin portion is electrically connected to the guide portion, the other end of the pin portion has a first coupling surface, and a gap exists between the metal portion and the pin portion.

[0015] In this way, when static electricity from the outside enters the electronic device, it is guided to the pin section by the guide section. The pin section then guides the static electricity to the metal section for grounding through coupling and tripping, thus preventing static electricity from damaging the display screen.

[0016] In some possible implementations, the mid-frame also includes a body, the metal part being a metal component, the first end of which is fixed to and electrically connected to the body, and the second end of which has a second coupling surface. The guide portion collects static electricity entering the electronic device from the gap between the bezel and the display screen to the pin portion, which then releases the static electricity to the metal component via gap discharge. The metal component then transfers the static electricity to the ground of the body, achieving electrostatic grounding.

[0017] In some possible implementations, the metal component includes an electrically connected connecting plate portion and a coupling plate portion. The connecting plate portion contacts and is electrically connected to the body surface, while the coupling plate portion has a second coupling surface. This ensures a large-area coupling relationship between the metal component and the conductive layer while increasing the electrostatic transport area between the metal component and the body, thereby improving electrostatic transport efficiency.

[0018] In some possible implementations, the second coupling surface is perpendicular to the surface of the connecting plate that is in contact with the body, which helps to reduce the difficulty of making the first coupling surface parallel to the second coupling surface.

[0019] In some possible implementations, along the thickness direction of the electronic device, the end face of the coupling plate portion away from the connecting plate portion is a first arc-shaped surface, which guides the frame component and prevents the metal component from scratching the display screen.

[0020] In some possible implementations, the metal parts are elastic, allowing the coupling plate to undergo elastic deformation, which can prevent the metal parts from undergoing plastic deformation when the frame parts are assembled toward the middle frame.

[0021] In some possible implementations, the coupling plate includes a first plate segment, a bent plate segment, and a second plate segment connected in sequence. The first plate segment is connected to the connecting plate and has a second coupling surface. The second plate segment is located on the same side of the bent plate segment as the first plate segment, so that the coupling plate forms an elastic gap to ensure that the metal part undergoes elastic deformation.

[0022] In some possible implementations, the body has a first groove, a metal component is disposed inside the first groove, the metal component is in contact with the bottom of the first groove, and a portion of the conductive layer is located inside the first groove. This reduces the thickness of the metal component and the body on the electronic device, facilitating a thinner design for the electronic device.

[0023] In some possible implementations, the bottom of the first groove is made of metal, so that the metal part is electrically connected to the bottom of the first groove, and the metal part transmits static electricity to the body to achieve electrostatic grounding.

[0024] In some possible implementations, the middle frame also includes a body, and the metal part is a metal retaining wall that is an integral structure with the body, which can conduct static electricity to the ground area of ​​the middle frame to achieve static grounding.

[0025] In some possible implementations, along the thickness direction of the electronic device, the end of the metal barrier away from the body has a guide surface connected to the second coupling surface, which guides the frame component.

[0026] In some possible implementations, the end of the metal barrier away from the body along the thickness direction of the electronic device has a second arc-shaped surface to prevent the metal parts from scratching the display screen.

[0027] In some possible implementations, the body and the metal barrier form a second groove, and a portion of the conductive layer is located inside the second groove, thereby increasing the coupling area between the first coupling surface and the second coupling surface, and forming a large-area coupling relationship between the pin portion and the metal portion.

[0028] In some possible implementations, the display screen includes a display panel, which comprises a display portion, a bending portion, and a bonding portion connected in sequence. Along the thickness direction of the electronic device, the bonding portion is spaced apart from the display portion and located on the non-display side of the display portion. A conductive layer is located between the bending portion and the frame member. In this way, static electricity entering the electronic device from the gap between the frame member and the display screen is dissipated by the conductive layer, preventing damage to the bending portion caused by static electricity. Attached Figure Description

[0029] Figure 1 This is a cross-sectional schematic diagram of a mobile phone in the related technology;

[0030] Figure 2 A three-dimensional structural schematic diagram of the first electronic device provided in the embodiments of this application;

[0031] Figure 3 for Figure 2 A top view of point A in the diagram;

[0032] Figure 4 for Figure 3 A cross-sectional view along the AA direction;

[0033] Figure 5 for Figure 4 Enlarged view within the dashed box;

[0034] Figure 6 for Figure 4 A three-dimensional structural diagram of the frame components and the conductive layer in the middle;

[0035] Figure 7 for Figure 6 A magnified view of the area indicated by the dashed line in the diagram;

[0036] Figure 8 for Figure 4 A schematic diagram of the three-dimensional structure of the middle frame;

[0037] Figure 9 for Figure 8 Enlarged view of point A in the middle;

[0038] Figure 10 A schematic diagram of the planar structure of a second electronic device provided in an embodiment of this application;

[0039] Figure 11 for Figure 4 A three-dimensional structural diagram of the conductive layer in the image;

[0040] Figure 12 A three-dimensional structural schematic diagram of the first type of metal part provided in the embodiments of this application;

[0041] Figure 13 for Figure 12 A front view of the metal part in the diagram;

[0042] Figure 14 This is a three-dimensional structural diagram of the second type of metal part provided in the embodiments of this application;

[0043] Figure 15 A front view schematic diagram of a third type of metal part provided in an embodiment of this application;

[0044] Figure 16 for Figure 8 A cross-sectional view along the AA direction;

[0045] Figure 17 for Figure 16 Enlarged view of point A in the middle;

[0046] Figure 18 A cross-sectional schematic diagram of a second type of electronic device provided in an embodiment of this application;

[0047] Figure 19 for Figure 18 Enlarged view of point A in the middle;

[0048] Figure 20 for Figure 18 A schematic diagram of the three-dimensional structure of the middle frame;

[0049] Figure 21 for Figure 20 Enlarged view of point A in the middle;

[0050] Figure 22 A cross-sectional schematic diagram of the middle frame of another integral structure provided in an embodiment of this application;

[0051] Figure 23 for Figure 22 Enlarged schematic diagram within the dashed box.

[0052] Explanation of reference numerals in the attached figures:

[0053] 100. Display screen; 110. Display panel; 111. Display unit; 112. Bending part; 113. Binding part;

[0054] 200, conductive layer; 210, guide portion; 220, pin portion; 221, first coupling surface;

[0055] 300, Mid-frame;

[0056] 310. First middle frame component; 320. Second middle frame component;

[0057] 330. Body; 331. Edge portion; 332. Middle plate portion;

[0058] 340. Metal part; 341. Second coupling surface;

[0059] 301, First groove; 302, Second groove;

[0060] 400, Border component; 410, First border; 420, Second border; 401, First component; 402, Second component;

[0061] 610. Connecting plate portion; 620. Coupling plate portion; 621. First plate-shaped segment; 622. Bending plate segment; 623. Second plate-shaped segment;

[0062] 630, First arc-shaped surface; 640, Guide surface; 650, Second arc-shaped surface;

[0063] X: length direction; Y: width direction; Z: thickness direction. Detailed Implementation

[0064] This application provides an electronic device, which may include, but is not limited to, devices with displays such as mobile phones, tablets, laptops, ultra-mobile personal computers (UMPCs), handheld computers, walkie-talkies, netbooks, point-of-sale (POS) machines, personal digital assistants (PDAs), wearable devices, and virtual reality devices.

[0065] In this embodiment, a mobile phone is used as an example for explanation. The mobile phone can be a foldable phone, a candybar phone, or a slider phone.

[0066] Figure 1 This is a cross-sectional schematic diagram of a mobile phone in the related technology.

[0067] During mobile phone use, static electricity can enter the phone's internal components. To prevent damage to the phone's display screen due to electrostatic discharge (ESD), in one implementation method, see [link to implementation details]. Figure 1 As shown, the display screen 800 has a display panel 810, which includes a display part 811, a bending part 812, and a bonding part 813 connected in sequence. A protective layer 820 is provided on the outer side of the bending part 812. One end of the conductive cloth 900 overlaps with the protective layer 820, and the other end of the conductive cloth 900 is connected to the ground of the mobile phone. When size A is larger than size B, the conductive cloth 900 will carry away the static electricity entering the electronic device, preventing static electricity from accumulating on the display screen 800, thus achieving the purpose of ESD protection.

[0068] However, the fit tolerance of the conductive cloth 900 fixture is + / -0.8mm, resulting in a large deviation between the actual position and the preset position of the conductive cloth 900. This causes dimension A to be smaller than dimension B, preventing the conductive cloth 900 from overlapping with the protective layer 820 and thus failing to conduct static electricity away, resulting in damage to the display screen 800. Furthermore, due to the thinness of the bent portion 812, static electricity can easily cause it to break down.

[0069] In view of this, the electronic device provided in this application embodiment provides a conductive layer 200 on the frame 400. The conductive layer 200 guides static electricity entering the electronic device from the gap between the frame 400 and the display screen 100 to the middle frame 300 and grounds it, effectively preventing the display screen 100 from failing due to electrostatic discharge and extending the service life of the display screen 100 and the electronic device. The frame 400 can also be called a small A-shell or an insulating top cover, etc.

[0070] The structure of the electronic device provided in this application will be described below with reference to specific embodiments.

[0071] Example 1

[0072] Figure 2 This is a three-dimensional structural diagram of the first type of electronic device provided in the embodiments of this application. Figure 3 for Figure 2 A top view diagram of point A in the diagram. Figure 4 for Figure 3 A cross-sectional view along the AA direction. Figure 5 for Figure 4 Enlarged schematic diagram within the dashed box.

[0073] See Figure 2 As shown, the electronic device may include a display screen 100, a mid-frame 300, and a bezel 400. The display screen 100 has a display side and a non-display side. The display side is used to display text, images, videos, etc., while the non-display side is positioned opposite to the display side. See also... Figure 4As shown, the display screen 100 and the bezel 400 are disposed on the same side of the middle frame 300, and the bezel 400 and the display screen 100 are respectively connected to the middle frame 300. A portion of the bezel 400 is located on the display side of the display screen 100, and the orthographic projections of the bezel 400 and the display screen 100 on a reference plane overlap. The reference plane is the plane containing the length direction X and the width direction Y of the electronic device. That is, the bezel 400 may include a first part and a second part. The first part is arranged with the display screen 100 in a direction perpendicular to the thickness direction Z of the electronic device, and the second part is located on the display side of the display screen 100 and covers the edge of the display screen 100.

[0074] See Figure 2 As shown, when the electronic device is a folding device with a folded state and an unfolded state, both the middle frame 300 and the side frame 400 are composed of left and right parts. See also... Figure 2 As shown, the middle frame 300 may include a first middle frame member 310 and a second middle frame member 320, which are hinged together by a hinge structure. The side frame member 400 may include a first side frame 410 and a second side frame 420, which are connected by a flexible connector. The first side frame 410 is connected to the first middle frame member 310, and the second side frame 420 is connected to the second middle frame member 320.

[0075] The frame component 400 is made of an insulating material, such as polycarbonate (PC), or PC+N%GF. That is to say, the frame component 400 can also be made of reinforced PC containing N% glass fiber, where N can be 10, 15, 20, 25, etc.

[0076] Figure 6 for Figure 4 A three-dimensional structural diagram of the frame components and the conductive layer in the middle. Figure 7 for Figure 6 A magnified view of the area indicated by the dotted line.

[0077] For example, see Figure 7 As shown, the frame component 400 may include a first component 401 and a second component 402. The first component 401 and the first end of the second component 402 are connected; for example, the first component 401 and the second component 402 may be an integrally formed structure. The second end of the second component 402 is connected to the middle frame 300; for example, the first end of the second component 402 may be connected to the middle frame 300 by snap-fitting, adhesive bonding (e.g., with adhesive backing), or other methods.

[0078] like Figure 5 As shown, both the first component 401 and the second component 402 are spaced apart from the display screen 100, and there is a gap between the first component 401 and the display screen 100 (e.g., Figure 5 (As shown in h). A portion of the first component 401 is located on the display side of the display screen 100. The first component 401 overlaps with the orthographic projection of the display screen 100 onto a reference plane, which is the plane containing the length direction X and the width direction Y of the electronic device. That is, the first component 401 and the outer edge of the display screen 100 are at least partially overlapped in the thickness direction Z of the electronic device. The inner surface of the first component 401 is connected to the inner surface of the second component 402. At least a portion of the inner surface of the first component 401 is parallel to the display surface P of the display screen 100, that is, at least a portion of the inner surface of the first component 401 is a plane parallel to the display surface P of the display screen 100. At least a portion of the inner surface of the second component 402 is perpendicular to the display surface P of the display screen 100, that is, at least a portion of the inner surface of the second component 402 is a plane perpendicular to the display surface P of the display screen 100.

[0079] like Figure 5 As shown, the inner surface of the first component 401 and the inner surface of the second component 402 are set at an angle, and the shape formed by the inner surfaces of the first component 401 and the second component 402 is similar to an "L" shape.

[0080] Wherein, the inner surface of the first component 401 is the surface of the first component 401 near the display screen 100, and the inner surface of the second component 402 is the direction of the second component 402 perpendicular to the thickness direction Z of the electronic device (e.g., Figure 5 (In the X direction) the surface near the display screen 100.

[0081] For example, there can be multiple second components 402, which are arranged at intervals along the length of the first component 401. Of course, in some scenarios, there can also be only one second component 402.

[0082] It should be noted that when the frame component 400 is called the small A-shell, the second component 402 can also be called the small A-shell pin.

[0083] Figure 8 for Figure 4 A three-dimensional structural diagram of the middle frame. Figure 9 for Figure 8 Enlarged diagram of point A in the middle.

[0084] See Figure 9 As shown, the middle frame 300 may include a first groove 301 on the side facing the display screen 100 along the thickness direction Z of the electronic device, and the other end of the second component 402 is located inside the first groove 301 (e.g., Figure 5(As shown). In some embodiments, an adhesive structure such as an adhesive backing (not shown) may be provided between the other end of the second component 402 and the inner wall of the first groove 301 to achieve the connection between the frame component 400 and the middle frame 300.

[0085] The display screen 100 can be a flexible screen, a rigid screen, a hybrid screen, etc. For example... Figure 2 As shown, the display screen 100 is a flexible screen, which enables the electronic device to have a folded state and an unfolded state.

[0086] See Figure 5 As shown, the display screen 100 may include a display panel 110, which is a flexible display panel, such as an organic light-emitting diode (OLED) display panel, an active-matrix organic light-emitting diode (AMOLED) display panel, or an active-matrix organic light-emitting diode (AMOLED) display panel.

[0087] It should be noted that the electronic device is a folding device, and the display screen 100 is a flexible screen that can be bent or unfolded. In this case, the display screen 100 can also be called the inner screen, and therefore the display panel 110 can also be called the inner screen panel.

[0088] See Figure 5 As shown, the display panel 110 may include a display portion 111, a bent portion 112, and a bonding portion 113 connected in sequence. The bent portion 112 is located between the display portion 111 and the bonding portion 113, connecting the two portions. Along the thickness direction Z of the electronic device, the bonding portion 113 is spaced apart from the display portion 111 and located on the non-display side of the display portion 111. The bent portion 112 includes at least a partially curved segment.

[0089] It should be noted that the display screen 100 may include other components besides the display panel 110. In some embodiments, the display screen 100 may also include a cover plate, a polarizer, a transparent adhesive layer, a back film, a support layer, and a connecting layer. The transparent adhesive layer is disposed between the polarizer and the cover plate. The polarizer is located between the transparent adhesive layer and the display portion 111 of the display panel 110. The back film, support layer, and connecting layer connect the bonding portion 113 and the display portion 111 and support it between the display portion 111 and the bonding portion 113. The back film is connected to the bonding portion 113, the connecting layer is connected to the display portion 111, and the support layer is located between the back film and the connecting layer. The cover plate is a light-transmitting plate structure. The cover plate serves to protect the display panel 110 and can transmit the image light emitted from the display panel 110. The polarizer is used to reduce the impact of reflected light on the display effect of the display screen 100. The support layer is made of a conductive material, and the back film is made of an insulating material. In some embodiments, the transparent adhesive layer is an optically clear adhesive (OCA).

[0090] See Figure 5 As shown, due to the gap between the frame 400 and the display screen 100 (e.g. Figure 5 As shown in Figure h), this gap can accommodate the bending and folding needs of the folding machine, or it can prevent the frame 400 from being damaged by impact when the electronic device is dropped. However, static electricity can also easily enter the interior of the electronic device through the gap between the display screen 100 and the frame 400. The static discharge effect may damage the display screen 100, or even damage the electronic device.

[0091] To solve this problem, see Figure 5 As shown, the electronic device also includes a conductive layer 200, which is attached to the inner surface of the frame 400. The conductive layer 200 is spaced apart from the middle frame 300. The conductive layer 200 guides static electricity entering the electronic device from the gap between the display screen 100 and the frame 400 to the middle frame 300 through gap discharge, allowing the static electricity to be grounded through the middle frame 300, preventing damage to the display screen 100. In addition, the conductive layer 200 can also guide static electricity on the display screen 100 to the middle frame 300 for grounding, providing electrostatic discharge protection for the electronic components on the display screen 100, improving the ESD resistance of the display screen 100, and enabling the display screen 100 to withstand higher electrostatic risks and achieve higher reliability. Furthermore, there is no physical connection between the conductive layer 200 and the middle frame 300. The conductive layer 200 does not affect the connection between the frame 400 and the middle frame 300, ensuring that the conductive layer 200 is positioned relative to the middle frame 300 in a preset position, preventing the frame 400 from easily detaching.

[0092] See Figure 7As shown, the electronic device may include multiple conductive layers 200. The number of conductive layers 200 can be 2, 3, 4, etc., and no specific limitation is made here. The multiple conductive layers 200 extend along the length of the frame member 400 (e.g., ...). Figure 7 As shown in the diagram (Y), multiple conductive layers 200 are arranged at intervals to conduct static electricity away, increasing the speed of static electricity dissipation and further improving the anti-static discharge capability of the display screen 100. Furthermore, the gaps between adjacent conductive layers 200 shorten the length of each individual conductive layer 200, allowing the radio frequency resonant noise generated by the conductive layers 200 to avoid the antenna resonant frequency band, further reducing its impact on antenna performance. This enables electronic devices to adopt a distributed antenna layout, increases battery capacity, and disperses heat sources as much as possible for heat dissipation.

[0093] The length of each conductive layer 200 can be set according to the antenna frequency band emitted by the antenna (such as a cellular antenna) near the conductive layer 200, so as to ensure that the radio frequency resonant noise generated by the conductive layer 200 avoids the antenna resonant frequency band.

[0094] It should be noted that, in addition to using multiple conductive layers 200 to conduct static electricity entering the electronic device from the gap between the display screen 100 and the frame 400 to the middle frame 300, in some embodiments, the electronic device may also include a conductive layer 200 to conduct static electricity to the middle frame 300. In this case, the anti-static discharge capability of the display screen 100 can be improved, and the impact on antenna performance can be reduced, allowing the electronic device to adopt a distributed antenna layout and increasing battery capacity.

[0095] In some embodiments, the spacing between two adjacent conductive layers 200 (e.g.) Figure 7 The distance between two conductive layers 200 (as shown in H) can be greater than or equal to 0.03 mm and less than or equal to 0.8 mm. For example, the distance between two adjacent conductive layers 200 can be 0.04 mm, 0.08 mm, 0.1 mm, 0.2 mm, 0.4 mm, 0.6 mm, 0.8 mm, etc., to avoid excessively large gaps between adjacent conductive layers 200, preventing static electricity from escaping through the gaps between adjacent conductive layers 200 to the display screen 100 and causing damage. In addition, it can also ensure that the radio frequency resonant noise generated by the conductive layer 200 avoids the antenna resonant frequency band.

[0096] In some embodiments, the resistance of the conductive layer 200 can be less than or equal to 1 ohm (Ω). For example, the resistance of the conductive layer 200 can be 0.1 ohm, 0.2 ohm, 0.3 ohm, 0.4 ohm, 0.5 ohm, 0.6 ohm, 0.7 ohm, 0.8 ohm, etc. This gives the conductive layer 200 high conductivity and fast electrostatic discharge capability, allowing it to promptly guide static electricity entering the electronic device from the gap between the frame 400 and the display screen 100 to the metal part 340 for grounding. This prevents excessive static electricity accumulation on the display screen 100 and further improves the ESD resistance of the display screen 100.

[0097] It should be noted that, in addition to being less than or equal to 1 ohm, the resistance of the conductive layer 200 can also be greater than 1 ohm in some embodiments.

[0098] Because the conductive layer 200 has low resistance, it absorbs less of the antenna radiation efficiency and has little impact on the antenna performance. Within the allowable range, it absorbs less of the antenna radiation energy of the antenna energy module, which can meet the requirements of the thin and light design of electronic devices and make distributed antenna design possible. It can also increase battery capacity, thereby enabling long-lasting battery design.

[0099] Figure 10 This is a schematic diagram of the planar structure of a second electronic device provided in an embodiment of this application.

[0100] When electronic devices adopt a distributed antenna design, such as Figure 10 As shown, the electronic device includes a system-on-chip (SOC) and a radio frequency integrated circuit (RFIC). The SOC is mounted on the first mid-frame 310, and the RFIC is mounted on the second mid-frame 320. The SOC and RFIC are respectively arranged on different mid-frames. The bending area of ​​the RFIC and the display panel 110 is located on the same side of the second mid-frame 320. The design scheme combining the RFIC side with the flexible screen expands the battery space of the folding device, improves the overall battery life, and realizes the long battery life design of the electronic device. The bending area of ​​the display panel 110 is the area where the bending portion 112 of the display panel 110 is located.

[0101] See also Figure 10As shown, the short-range antenna module is mounted on the first mid-frame 310, and the cellular antenna module is mounted on the second mid-frame 320. The short-range antenna module and the cellular antenna module are respectively arranged on the two mid-frames. There is an overlap between the cellular antenna module and the bending area of ​​the display panel 110. At this time, the conductive layer 200 is close to the cellular antenna module. The conductive layer 200 has low resistance, absorbs less antenna radiation energy of the cellular antenna module, and has little impact on the high-frequency signal of the cellular antenna module. This ensures antenna performance and removes restrictions on antenna distribution, making the overall architecture design more flexible.

[0102] At least one short-range antenna module is provided on the first frame member 310. For example, GPS1 and WIFI1 are installed at position 1, GPS2 and WIFI2 are installed at position 2, BT is installed at position 3, GPS3 and WIFI3 are installed at position 4, GPS4 and WIFI4 are installed at position 5, WIFI5 is installed at position 6, WIFI6 is installed at position 7, WIFI7 is installed at position 8, and WIFI8 is installed at position 9. Of course, the number of short-range antenna modules on the first frame member 310 can be more or less than the number of short-range antenna modules. Figure 10 The quantity shown.

[0103] At least one cellular antenna module is provided on the second frame 320. For example, a first cellular antenna with a middle / high band (MHB) parasitic module is installed at position 10 of the second frame 320, a second cellular antenna with a middle / high band (MHB) parasitic module is installed at position 11, a third cellular antenna with a middle / high band (MHB) parasitic module is installed at position 12, a fourth cellular antenna with a low band (LB) parasitic module is installed at position 13, and a fifth cellular antenna with a middle / high band (MHB) parasitic module is installed at position 14. That is, different cellular antennas in at least one cellular antenna support different frequency bands.

[0104] like Figure 10 As shown, the second, third, and fourth cellular antennas coincide with the bent area of ​​the display panel 110. At this time, the second, third, and fourth cellular antennas are located near the conductive layer 200 within the bent area. For example, the second cellular antenna is located on the side of the conductive layer 200 away from the display screen 100. Of course, the second cellular antenna and the conductive layer 200 can also be in other relative positions. In this case, the conductive layer 200 has low resistance and absorbs less antenna radiation energy from the second, third, and fourth cellular antennas, thus ensuring antenna performance.

[0105] Optionally, the RFIC is coupled to any one of at least one cellular antenna. For example... Figure 10As shown, the RFIC is coupled to the third cellular antenna. This reduces the device area occupied by the RFIC on the second frame 320, thereby increasing the area ratio of the battery on the second frame 320.

[0106] In some embodiments, the conductive layer 200 can be a metal layer made of a highly conductive metal material, such as constantan or manganin, which results in low resistance and high conductivity of the conductive layer 200. Alternatively, a metal layer can be formed on the inner surface of the frame 400 using low-cost processes such as laser activating plating (LAP), laser-direct structuring (LDS), laser restructuring printing (LRP), or laser structuring coating (LSC), which can reduce the cost of the conductive layer 200 and improve the economics of the electronic device.

[0107] It should be noted that when a metal layer is formed through the LAP process, the metal layer can also be called LAP-coated metal.

[0108] In some embodiments, a metal coating can be formed on the inner surface of the frame member 400 using a LAP process, and then the metal coating can be laser-engraved to break it into multiple metal layers, forming multiple metal layers. In this case, the metal layer can also be referred to as a pattern.

[0109] In addition, since the metal layer is formed using technologies such as LAP, LDS, LRP, and LSP, the requirement for the large surface wall thickness of the frame component 400 (i.e., the wall thickness of the first component 401) can be reduced, so that the wall thickness of the first component 401 can be less than or equal to 0.25mm. For example, the wall thickness of the first component 401 can be 0.1mm, 0.15mm, 0.2mm, 0.25mm, etc.

[0110] See Figure 5 As shown, a portion of the conductive layer 200 is located on the display side of the display screen 100 and is spaced apart from the display screen 100 along the thickness direction Z of the electronic device. Another portion of the conductive layer 200 is spaced apart from the display screen 100 along a direction perpendicular to the thickness direction Z of the electronic device and is also spaced apart from the middle frame 300. Therefore, it can be seen that a portion of the orthographic projection of the conductive layer 200 on the reference plane is located inside the orthographic projection of the display screen 100 on the reference screen surface, and another portion is located outside the orthographic projection of the display screen 100 on the reference plane.

[0111] See Figure 7As shown, the conductive layer 200 is attached to the inner surface of the frame member 400 and located between the bent portion 112 and the frame member 400. Specifically, the conductive layer 200 is located on the inner surface of the frame member 400 near the bent portion 112. More specifically, a portion of the conductive layer 200 is attached to the inner surface of the first component 401, and another portion is attached to the inner surface of the second component 402. The conductive layer 200 overlaps with the orthographic projection of the display screen 100 onto the reference plane. In other words, a portion of the conductive layer 200 is located within the gap between the display screen 100 and the first component 401, ensuring that the conductive layer 200 can dissipate static electricity entering the gap between the first component 401 and the display screen 100.

[0112] By placing the conductive layer 200 on the inner surface of the frame member 400, static electricity is guided to the middle frame 300 for grounding without affecting the overall appearance or other performance characteristics. Furthermore, the conductive layer 200 is placed between the frame member 400 and the bent portion 112 (e.g., Figure 5 As shown, static electricity on the bending portion 112 can be guided to the middle frame 300 for grounding, preventing static electricity from discharging in the bending portion 112 and causing damage to the bending portion 112. This can improve the ESD resistance of the bending portion 112, thereby further improving the ESD resistance of the display screen 100.

[0113] Specifically, see Figure 5 As shown, along the direction perpendicular to the thickness direction Z of the electronic device, one end of the conductive layer 200 is closer to the opening end of the gap between the frame 400 and the display screen 100 than the bending portion 112. Static electricity entering from this gap will enter the conductive layer 200, preventing static electricity from discharging in the bending portion 112 and causing damage to the bending portion 112, thereby further improving the ESD resistance of the bending portion 112.

[0114] like Figure 5 As shown, the conductive layer 200 and the middle frame 300 are spaced apart. The conductive layer 200 has a first coupling surface 221, and the middle frame 300 has a second coupling surface 341. The first coupling surface 221 faces the second coupling surface 341, and the first coupling surface 221 and the second coupling surface 341 are perpendicular to the thickness direction Z of the electronic device (e.g., Figure 5 The conductive layers are arranged at intervals in the X direction, creating a gap between the first coupling surface 221 and the second coupling surface 341. The conductive layer 200 releases static electricity to the middle frame 300 through the gap between the first coupling surface 221 and the second coupling surface 341, and then transfers the static electricity to the middle frame 300 for grounding through coupling jumper.

[0115] Since the first coupling surface 221 and the second coupling surface 341 are arranged in a direction perpendicular to the thickness direction Z of the electronic device, the area of ​​the first coupling surface 221 and the second coupling surface 341 in the thickness direction Z of the electronic device can be utilized to increase the coupling area of ​​the first coupling surface 221 and the second coupling surface 341, so that the conductive layer 200 and the middle frame 300 form a large-area coupling relationship, improve the electrostatic transmission efficiency between the conductive layer 200 and the middle frame 300, and promptly conduct the electrostatic charge on the conductive layer 200 to the middle frame 300.

[0116] In some embodiments, the first coupling surface 221 may be a first plane (e.g., Figure 7 As shown), the second coupling surface 341 can be a second plane (e.g. Figure 9 As shown, this helps to better control the size of the gap between the first coupling surface 221 and the second coupling surface 341, so that the first coupling surface 221 and the second coupling surface 341 form a small gap, ensuring that the electrostatic jump direction and energy are relatively stable.

[0117] It should be noted that, in addition to being planar, in some embodiments, at least one of the first coupling surface 221 and the second coupling surface 341 may also be a curved surface.

[0118] For example, see Figure 2 As shown, the first coupling surface 221 and the second coupling surface 341 can be parallel, which increases the coupling area between the first coupling surface 221 and the second coupling surface 341, improves the electrostatic transmission efficiency between the pin portion 220 and the metal portion 340, and helps to further improve the efficiency of the conductive layer 200 in removing static electricity.

[0119] It should be noted that the parallelism between the first coupling surface 221 and the second coupling surface 341 does not mean absolute parallelism; a certain degree of error is permissible. That is, when the included angle between the first coupling surface 221 and the second coupling surface 341 is between 0° and A°, the first coupling surface 221 and the second coupling surface 341 can be considered parallel. Here, A can be a value such as 0.5, 1, 3, 5, etc., and no specific restriction is imposed here.

[0120] Of course, in addition to being parallel, the first coupling surface 221 and the second coupling surface 341 can also be non-parallel in some embodiments. In this case, there is an angle between the first coupling surface 221 and the second coupling surface 341, for example, the angle between the first coupling surface 221 and the second coupling surface 341 can be 10°.

[0121] In some embodiments, the distance between the first coupling surface 221 and the second coupling surface 341 in a direction perpendicular to the thickness direction Z of the electronic device can be greater than or equal to 0.03 mm and less than or equal to 0.1 mm, so that the first coupling surface 221 and the second coupling surface 341 form a small gap, further ensuring that the electrostatic discharge direction and energy are relatively stable, and improving the stability of the conduction of electrostatics from the pin portion 220 to the metal portion 340.

[0122] The gap between the first coupling surface 221 and the second coupling surface 341 can be 0.03mm, 0.04mm, 0.0555mm, 0.06mm, 0.09mm, etc.

[0123] In some embodiments, the middle frame 300 includes at least one second coupling surface 341. For example, the middle frame 300 may include four second coupling surfaces 341, that is, the middle frame 300 may include four metal portions 340. Each second coupling surface 341 corresponds to at least one first coupling surface 221 and faces the corresponding first coupling surface 221. That is, each metal portion 340 may have a clearance fit with one or more pin portions 220. Each second coupling surface 341 corresponds to one or more first coupling surfaces 221, which improves the efficiency of guiding static electricity to the middle frame 300, and the number and position of the first coupling surfaces 221 can be reasonably designed according to the structure of the middle frame 300.

[0124] To increase the coupling area between the first coupling surface 221 and the second coupling surface 341, the length of each second coupling surface 341 in the width direction of the bend 112 can be greater than or equal to a second length. The second length is the sum of the lengths of all the first coupling surfaces 221 in the width direction of the bend 112 plus the sum of the lengths of the multiple gaps formed by all the first coupling surfaces 221 in the width direction of the bend 112. This increases the coupling area between the first coupling surface 221 and the second surface, improving the electrostatic transfer efficiency between the pin portion 220 and the metal portion 340.

[0125] It should be noted that when the number of conductive layers 200 is a single one, the second length is the length of the first coupling surface 221 in the width direction of the bent portion 112.

[0126] Figure 11 for Figure 4 A three-dimensional structural diagram of the conductive layer in the image.

[0127] See also Figure 5 As shown, the conductive layer 200 may include a guide portion 210 and a pin portion 220. The guide portion 210 is attached to the inner surface of the first component 401, and the guide portion 210 extends along the length direction of the frame member 400 (e.g., ...). Figure 7The guide portion 210 extends and is located on the display side of the display screen 100 in the Y direction, and a portion of the guide portion 210 is located in the gap between the display screen 100 and the frame member 400 (e.g., in the Y direction). Figure 5 (As shown). At least a portion of the orthographic projection of the guide portion 210 on the reference plane is located inside the orthographic projection of the display screen 100 on the reference plane. For example, a portion of the orthographic projection of the guide portion 210 on the reference plane is located inside the orthographic projection of the display screen 100 on the reference plane. Of course, the orthographic projection of the guide portion 210 on the reference plane may also be located inside the orthographic projection of the display screen 100 on the reference plane.

[0128] See Figure 7 As shown, the pin portion 220 is attached to the inner surface of the second component 402, and the pin portion 220 is located between the bent portion 112 and the frame member 400 and is spaced apart from the middle frame 300 (e.g., Figure 5 As shown), one end of the pin portion 220 is electrically connected to the guide portion 210, and the other end of the pin portion 220 has a first coupling surface 221. The pin portion 220 and the middle frame 300 are connected by a gap between them (as shown). Figure 5 As shown in the middle L), the pin portion 220 can be electrically coupled, that is, the pin portion 220 can release static electricity to the middle frame 300 through the gap between the pin portion 220 and the middle frame 300.

[0129] When external static electricity enters the electronic device, it is guided by the guide section 210 to the pin section 220. The pin section 220 then guides the static electricity to the middle frame 300 for grounding via a coupling jumper, thus preventing damage to the display screen 100 caused by static electricity. Furthermore, such as... Figure 5 As shown, along the thickness direction Z of the electronic device, the guide part 210 is spaced apart from the display screen 100. The guide part 210 can conduct static electricity on the display screen 100 to the pin part 220 by coupling and tripping, so as to avoid excessive static electricity on the display screen 100 and improve the ESD resistance of the display screen 100.

[0130] See Figure 11 As shown, the conductive layer 200 may include a lead portion 220, and the lead portion 220 and the guide portion 210 are in the width direction of the bent portion 112 (e.g., Figure 5 The pin portion 220 is connected to one end of the guide portion 210 along the length of the frame member 400 (as shown in the X direction). In other examples, the conductive layer 200 may include more than two pin portions 220, in which case all the pin portions 220 are spaced apart along the length of the guide portion 210.

[0131] It should be noted that the width direction of the bent portion 112 is parallel to the length direction of the frame piece 400.

[0132] In some embodiments, when there are multiple conductive layers 200, each conductive layer 200 may include one or more pin portions 220, for example... Figure 6 As shown, the electronic device may include five conductive layers 200, wherein four conductive layers 200 include a pin portion 220 and the remaining conductive layer 200 includes two pin portions 220.

[0133] Since there are multiple conductive layers 200, there are also multiple guide portions 210. These guide portions 210 are spaced apart along the width direction of the bent portion 112. In this case, the first length can be greater than or equal to the width of the bent portion 112. The first length is equal to the sum of the lengths of all guide portions 210 along the width direction of the bent portion 112 plus the sum of the distances between all adjacent guide portions 210. In this way, two guide portions 210 can cover both ends of the bent portion 112, ensuring that the bent portion 112 is not damaged by static electricity.

[0134] It should be noted that when the number of conductive layers 200 is a single one, the first length is the length of the guide portion 210 in the width direction of the bent portion 112.

[0135] In the embodiments of this application, such as Figure 11 As shown, the guide portion 210 can be a long strip structure. For example, the guide portion 210 can be a rectangular strip structure with a length greater than its width. Of course, the guide portion 210 can also be a long strip structure of other shapes, such as a trapezoidal strip structure.

[0136] In the embodiments of this application, such as Figure 11 As shown, the pin portion 220 has a rectangular sheet-like structure. Of course, the pin portion 220 can also have other shapes, such as an arc-shaped sheet-like structure, a trapezoidal sheet-like structure, a triangular sheet-like structure, etc.

[0137] For example, see Figure 8 As shown, the middle frame 300 may include a metal part 340 and a body 330. The metal part 340 is fixedly connected to the body 330, for example, by welding. The metal part 340 is electrically connected to the body 330. The body 330 can serve as the ground of the electronic device, or the body 330 can be electrically connected to the ground of the electronic device, thus enabling the ground connection between the metal part 340 and the electronic device.

[0138] See Figure 5As shown, the metal portion 340 is spaced apart from the conductive layer 200. The metal portion 340 is close to the pin portion 220 of the conductive layer 200, and there is a gap between the metal portion 340 and the pin portion 220, meaning that the metal portion 340 and the pin portion 220 do not contact each other. The metal portion 340 has a second coupling surface 341 facing the first coupling surface 221, allowing the metal portion 340 and the pin portion 220 to be electrically connected in a non-contact manner, thus achieving electrostatic transmission. The pin portion 220 releases static electricity to the metal portion 340 through the gap between the first coupling surface 221 and the second coupling surface 341, achieving electrostatic grounding.

[0139] Figure 12 This is a three-dimensional structural diagram of the first type of metal part provided in the embodiments of this application. Figure 13 for Figure 12 A front view of the metal part in the diagram. Figure 14 This is a three-dimensional structural diagram of the second type of metal part provided in the embodiments of this application. Figure 15 This is a front view schematic diagram of a third type of metal part provided in an embodiment of this application.

[0140] In this embodiment, participants Figure 12 As shown, the metal part 340 is a metal component (such as...). Figure 12 As shown in Figure 340, the first end of the metal component is fixed to and electrically connected to the body 330, and the second end of the metal component has a second coupling surface 341. The guide portion 210 collects static electricity that enters the electronic device from the gap between the frame member 400 and the display screen 100 to the pin portion 220. The pin portion 220 releases the static electricity to the metal component through gap discharge, and the metal component transmits the static electricity to the ground of the body 330 to achieve static grounding.

[0141] For example, see Figure 12 and Figure 13 As shown, metal parts (such as Figure 12 As shown in Figure 340, it includes a connecting plate portion 610 and a coupling plate portion 620 for electrical connection. The connecting plate portion 610 contacts the surface of the body 330 and is electrically connected to the body 330 (in conjunction with it). Figure 5 and Figure 9 As shown), the coupling plate portion 620 has a second coupling surface 341 (as shown). Figure 13 (As shown). In this way, while ensuring a large-area coupling relationship between the metal part and the pin portion 220, the electrostatic transmission area between the metal part and the body 330 is increased, thereby improving the electrostatic transmission efficiency.

[0142] See Figure 13As shown, the second coupling surface 341 can be perpendicular to the surface of the connecting plate portion 610 that is in contact with the body 330, which helps to reduce the difficulty of making the first coupling surface 221 parallel to the second coupling surface 341. Of course, in some embodiments, the second coupling surface 341 may not be perpendicular to the surface of the second component 402 that is in contact with the body 330.

[0143] See also Figure 12 As shown, along the thickness direction Z of the electronic device, the end face of the coupling plate portion 620 away from the connecting plate portion 610 can be a first arc-shaped surface 630. In this case, the end of the coupling plate portion 620 away from the connecting plate portion 610 is equivalent to a rounded head, which can guide the frame member 400, allowing the second component 402 to be inserted into the interior of the first groove 301 to assemble the frame member 400 with the middle frame 300, and preventing the metal parts from scratching the display screen 100. Of course, in some embodiments, the end face of the coupling plate portion 620 away from the connecting plate portion 610 can also be a planar structure.

[0144] In some embodiments, the metal part may be elastic, allowing the coupling plate portion 620 to undergo elastic deformation, which can prevent the metal part from undergoing plastic deformation when the frame part 400 is assembled toward the middle frame 300, and ensure that the gap between the first coupling surface 221 and the second coupling surface 341 meets the requirements.

[0145] There are no restrictions on how to make the metal parts flexible. For example, the metal parts can be made of flexible sheet metal, or this can be achieved by controlling the thickness of the metal parts.

[0146] For example, see Figure 13 As shown, the coupling plate portion 620 may include a first plate-shaped segment 621, a bent plate segment 622, and a second plate-shaped segment 623 connected in sequence. The first plate-shaped segment 621 is connected to the connecting plate portion 610 and has a second coupling surface 341. The second plate-shaped segment 623 is located on the same side of the bent plate segment 622 as the first plate-shaped segment 621. The first plate-shaped segment 621 and the second plate-shaped segment 623 are spaced apart, so that the coupling plate portion 620 forms an elastic gap to ensure that the metal part undergoes elastic deformation.

[0147] It should be noted that the structure of the coupling plate 620, in addition to being for Figure 12 Besides the one shown, it can also be other structures, such as Figure 14 As shown, the coupling plate portion 620 may include a first plate-shaped segment 621, a bent plate segment 722, and a second plate-shaped segment 623 connected in sequence. At this time, the first plate-shaped segment 621 and the second plate-shaped segment 623 are in contact, and the second plate-shaped segment 623 is spaced apart from the connecting plate portion 610.

[0148] It should be noted that the specific structure of the metal parts, in addition to Figure 12 or Figure 14 Besides the structure shown, it can also be other structures, for example... Figure 15 As shown, the metal part is an L-shaped plate structure.

[0149] Figure 16 for Figure 8 A cross-sectional view along the AA direction. Figure 17 for Figure 16 Enlarged diagram of point A in the middle.

[0150] See also Figure 9 As shown, the metal part is disposed inside the first groove 301, and the metal part is in contact with the bottom of the first groove 301 (e.g., Figure 17 As shown, a portion of the conductive layer 200 is located inside the first groove 301. The metal component is in clearance fit with the pin portion 220 through the first groove 301. The depth of the first groove 301 can be used to increase the coupling area between the metal component and the pin portion 220, thereby improving electrostatic transmission efficiency. In addition, placing the metal component and a portion of the pin portion 220 inside the first groove 301 can reduce the impact of the pin portion 220 and the metal component on the thickness of the electronic device, which helps to achieve the thinning design of the electronic device.

[0151] To achieve an electrical connection between the body 330 and the metal component, in one embodiment, the bottom of the first groove 301 can be made of metal, allowing the metal component to be electrically connected to the bottom of the first groove 301. This enables the metal component to transfer static electricity to the body 330, achieving electrostatic grounding. Furthermore, using the bottom of the first groove 301 to electrically connect with the metal component reduces the difficulty of connecting the body 330 to the metal component. For example, the metal component can be electrically connected to the bottom of the first groove 301 by welding.

[0152] It should be noted that, in addition to being made of metal, the bottom of the first groove 301 may also be made of non-metallic material in some embodiments. In this case, the electronic device may also include an electrical connector, through which the metal component is electrically connected to the body 330. That is to say, the metal component can be directly or indirectly electrically connected to the body 330.

[0153] In some embodiments, the body 330 can be a metal body. In this case, the metal body can serve as the ground of the electronic device or be electrically connected to the electronic device. Thus, when static electricity enters from the gap between the display screen 100 and the frame 400, the static electricity can be discharged along the conductive layer 200 on the metal body. Of course, in other embodiments, the body 330 can also be an integral structure composed of metallic and non-metallic materials. In this case, the metal part 340 is electrically connected to the metallic material of the body 330, thereby grounding the metal part 340.

[0154] For example, see Figure 17 As shown, the main body 330 may include an edge portion 331 and a middle plate portion 332. The edge portion 331 is disposed around the middle plate portion 332, and the edge portion 331 and the middle plate portion 332 form a groove for accommodating the display screen 100 and the second component 402. The metal portion 340 is fixedly connected to the middle plate portion 332 and electrically connected to the middle plate portion 332. At this time, the middle plate portion 332 may be a metal middle plate or an integral structure composed of metal and non-metal materials.

[0155] Example 2

[0156] Figure 18 This is a cross-sectional schematic diagram of a second type of electronic device provided in an embodiment of this application. Figure 19 for Figure 18 Enlarged diagram of point A in the middle. Figure 20 for Figure 18 A three-dimensional structural diagram of the middle frame. Figure 21 for Figure 20 Enlarged diagram of point A in the middle.

[0157] The difference between Embodiment 2 and Embodiment 1 lies in the structure of the middle frame 300. Specifically, see... Figure 20 As shown, the middle frame 300 includes a metal part 340 and a body 330. The metal part 340 is a metal retaining wall that is integrally formed with the body 330 (e.g., Figure 20 As shown in 340), the middle frame 300 is an integral part consisting of the main body 330 and the metal retaining wall. At this time, the main body 330 can serve as the ground of the electronic device or the main body 330 can be connected to the ground of the electronic device, thereby realizing the ground connection between the metal part 340 and the electronic device.

[0158] See Figure 19 As shown, there is a gap between the metal barrier and the pin portion 220, meaning that the metal barrier and the pin portion 220 do not contact each other. At this time, the metal barrier and the pin portion 220 are electrically connected in a non-contact manner to achieve electrostatic transmission.

[0159] Specifically, see Figure 19 As shown, the pin portion 220 has a first coupling surface 221 and a metal barrier (such as...) Figure 10 The pin portion 220 has a second coupling surface 341, and a first coupling surface 221 faces the second coupling surface 341. The first coupling surface 221 and the second coupling surface 341 are spaced apart along a direction perpendicular to the thickness direction Z of the electronic device. That is, along the direction perpendicular to the thickness direction Z of the electronic device, at least a portion of the projection of the first coupling surface 221 overlaps with the projection of the second coupling surface 341. The pin portion 220 discharges static electricity to the metal barrier through the gap between the first coupling surface 221 and the second coupling surface 341, thereby achieving electrostatic grounding.

[0160] Furthermore, since the first coupling surface 221 and the second coupling surface 341 are arranged in a direction perpendicular to the thickness direction Z of the electronic device, the first coupling surface 221 and the second coupling surface 341 can be arranged in the thickness direction Z of the electronic device, which increases the area of ​​the first coupling surface 221 and the second coupling surface 341 and increases the coupling area of ​​the first coupling surface 221 and the second coupling surface 341. The pin portion 220 forms a large-area coupling relationship with the metal barrier, which increases the electrostatic transmission efficiency between the pin portion 220 and the metal barrier. It can promptly conduct the static electricity on the conductive layer 200 to the metal barrier, and the static electricity is grounded through the metal barrier.

[0161] See Figure 21 As shown, the middle frame 300 may include a second recess 302 on the side of the electronic device facing the display screen 100 along the thickness direction Z. One end of the second component 402 is located inside the second recess 302 (e.g., Figure 19 (As shown). One end of the second component 402 and the second groove 302 may be provided with adhesive backing to connect the frame component 400 and the middle frame 300.

[0162] See Figure 21 As shown, the main body 330 and the metal retaining wall (such as...) Figure 21 The metal portion 340 in the conductive layer 200 forms a second groove 302, and a portion of the conductive layer 200 is located inside the second groove 302. By utilizing the depth of the second groove 302, the coupling area between the first coupling surface 221 and the second coupling surface 341 is increased, and the pin portion 220 and the metal portion 340 form a large-area coupling relationship. In addition, the fact that a portion of the pin portion 220 is located inside the second groove 302 can reduce the impact of the pin portion 220 on the thickness of the electronic device, which helps to achieve the thinning design of the electronic device.

[0163] Figure 22 This is a cross-sectional schematic diagram of the middle frame of another integral structure provided in an embodiment of this application. Figure 23 for Figure 22 Enlarged schematic diagram within the dashed box.

[0164] Among some possible implementations, see [link to relevant documentation]. Figure 23 As shown, along the thickness direction Z of the electronic device, the metal barrier (such as...) Figure 23 The metal part 340 in the middle has a guide surface 640 connected to the second coupling surface 341 at one end away from the body 330, which guides the frame part 400 so that the second part 402 is inserted into the interior of the second groove 302, thereby realizing the assembly of the frame part 400 and the middle frame 300.

[0165] See Figure 23As shown, the guide surface 640 can be a plane inclined relative to the thickness direction Z of the electronic device. That is, the guide surface 640 is a plane at an angle to the reference plane. In this case, it can be understood that the metal barrier has a chamfered design, and the reference plane is the plane containing the length direction X and the width direction Y of the electronic device. However, in some embodiments, the guide surface 640 can also be an arc surface, which can also achieve the guiding function. In this case, it can be understood that the metal barrier has a first rounded corner design.

[0166] It should be noted that, in addition to having a guide surface 640, in some embodiments, the metal retaining wall may not have a guide surface 640 (e.g., Figure 19 (As shown).

[0167] Among some possible implementations, see [link to relevant documentation]. Figure 23 As shown, along the thickness direction Z of the electronic device, the end of the metal barrier away from the body 330 can have a second arc-shaped surface 650. In this case, it can be understood that the metal barrier has a second rounded corner design to prevent the metal parts from scratching the display screen 100. Of course, in some embodiments, the end face of the metal barrier away from the body 330 can also be a plane or other structures.

[0168] It should be noted that the shapes of the frame 400, conductive layer 200, display screen 100, first coupling surface 221 and second coupling surface 341, as well as their relative positions, have been described in detail in Embodiment 1, and therefore will not be repeated here.

[0169] In summary, the metal part 340 and the body 330 can be either separate structures or integrated structures. Furthermore, the specific structure of the metal part 340 can be other than the structures described in Embodiments 1 and 2, which will not be elaborated upon here.

[0170] Example 3

[0171] The difference between Embodiment 3 and Embodiment 1 is that the electronic device further includes a layer (not shown in the figure). The layer is set on the outer surface of the frame component 400. At this time, the layer, the frame component 400 and the conductive layer 200 form a stack. The layer can improve the appearance of the frame component 400, thereby improving the aesthetics of the electronic device.

[0172] There are no specific restrictions on the thickness of the layers. For example, the layer thickness can be 0.03mm, 0.05mm, etc.

[0173] The border component 400, layers, and conductive layer 200 can form various overlay schemes. For reliability, the following overlay schemes can be used, including but not limited to: 1. 0.1mm to 0.25mm material PC + 0.05mm layer + 10% GF + lap, this scheme has a high-gloss appearance. 2. 0.1mm to 0.25mm material PC + 0.05mm layer + 20% GF + lap, this scheme has a high-gloss appearance. 3. 0.1mm to 0.25mm material PC + 0.05mm layer + 25% GF + lap, this scheme has a high-gloss appearance. 4. 0.1mm to 0.25mm material PC + 0.03mm layer + 10% GF + lap, this scheme has a matte appearance. 5. 0.1mm to 0.25mm material PC + 0.03mm layer + 20% GF + lap, this scheme has a matte appearance. 6. 0.1mm to 0.25mm material PC + 0.03mm layer + 25% GF + lap. This solution has a matte finish.

[0174] The PC material is used to form the border component 400. Of course, the border component 400 can also be made of other materials.

[0175] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, an indirect connection through an intermediate medium, or the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application according to the specific circumstances.

[0176] The devices or elements referred to in the embodiments of this application or implied herein must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as limiting the embodiments of this application. In the description of the embodiments of this application, "a plurality of" means two or more, unless otherwise precisely specified.

[0177] The terms "first," "second," "third," "fourth," etc. (if present) in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that embodiments of the present application described herein can be implemented, for example, in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0178] The term "multiple" in this article refers to two or more. The term "and / or" in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, or B alone. Furthermore, the character " / " in this article generally indicates an "or" relationship between the preceding and following related objects; in formulas, the character " / " indicates a "division" relationship between the preceding and following related objects.

[0179] It is understood that the various numerical designations used in the embodiments of this application are merely for descriptive convenience and are not intended to limit the scope of the embodiments of this application.

[0180] It is understood that, in the embodiments of this application, the order of the above-mentioned process numbers does not imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application.

Claims

1. An electronic device, characterized in that, It includes a display screen (100), a middle frame (300), a bezel (400), and a conductive layer (200); The frame component (400) includes a first component (401) and a second component (402). The first component (401) is connected to a first end of the second component (402), and the second end of the second component (402) is connected to the middle frame (300). The first component (401) and the second component (402) are both spaced apart from the display screen (100). A portion of the first component (401) is located on the display side of the display screen (100). The first component (401) overlaps with the orthographic projection of the display screen (100) on a reference plane. The reference plane is the plane containing the length and width directions of the electronic device. The inner surface of the first component (401) is connected to the inner surface of the second component (402), at least a portion of the inner surface of the first component (401) is parallel to the display surface of the display screen (100), and at least a portion of the inner surface of the second component (402) is perpendicular to the display surface of the display screen (100). A portion of the conductive layer (200) is attached to the inner surface of the first component (401), and another portion of the conductive layer (200) is attached to the inner surface of the second component (402). The conductive layer (200) overlaps with the orthographic projection portion of the display screen (100) on the reference plane. The middle frame (300) includes a metal portion (340) electrically connected to the ground of the electronic device. The metal portion (340) is spaced apart from the conductive layer (200). The conductive layer (200) has a first coupling surface (221). The metal portion (340) has a second coupling surface (341) facing the first coupling surface (221). The first coupling surface (221) and the second coupling surface (341) are spaced apart in a direction perpendicular to the thickness direction of the electronic device.

2. The electronic device according to claim 1, characterized in that, The resistance of the conductive layer (200) is less than or equal to 1 ohm.

3. The electronic device according to claim 1 or 2, characterized in that, The conductive layer (200) is a metal layer.

4. The electronic device according to any one of claims 1 to 3, characterized in that, The first coupling surface (221) is parallel to the second coupling surface (341).

5. The electronic device according to any one of claims 1 to 4, characterized in that, In a direction perpendicular to the thickness direction of the electronic device, the distance between the first coupling surface (221) and the second coupling surface (341) is greater than or equal to 0.03 mm and less than or equal to 0.1 mm.

6. The electronic device according to any one of claims 1 to 5, characterized in that, The middle frame (300) includes at least one second coupling surface (341), each second coupling surface (341) corresponding to at least one first coupling surface (221) and facing the corresponding first coupling surface (221).

7. The electronic device according to any one of claims 1 to 6, characterized in that, The first coupling surface (221) is a first plane, and the second coupling surface (341) is a second plane.

8. The electronic device according to any one of claims 1 to 7, characterized in that, The electronic device includes a plurality of conductive layers (200) spaced apart along the length of the frame member (400).

9. The electronic device according to claim 8, characterized in that, The spacing between two adjacent conductive layers (200) is greater than or equal to 0.03 mm and less than or equal to 0.8 mm.

10. The electronic device according to any one of claims 1 to 9, characterized in that, The conductive layer (200) includes a guide portion (210) and a pin portion (220); The guide portion (210) is attached to the inner surface of the first component (401). The guide portion (210) extends along the length direction of the frame member (400) and is located on the display side of the display screen (100). At least a portion of the orthographic projection of the guide portion (210) on the reference plane is located inside the orthographic projection of the display screen (100) on the reference plane. The pin portion (220) is attached to the inner surface of the second component (402), one end of the pin portion (220) is electrically connected to the guide portion (210), the other end of the pin portion (220) has the first coupling surface (221), and there is a gap between the metal portion (340) and the pin portion (220).

11. The electronic device according to any one of claims 1 to 10, characterized in that, The middle frame (300) also includes a body (330), the metal part (340) is a metal component, the first end of the metal component is fixed to the body (330) and electrically connected to the body (330), and the second end of the metal component has the second coupling surface (341).

12. The electronic device according to claim 11, characterized in that, The metal part includes an electrically connected connecting plate portion (610) and a coupling plate portion (620), the connecting plate portion (610) is in contact with and electrically connected to the body (330), and the coupling plate portion (620) has a second coupling surface (341).

13. The electronic device according to claim 12, characterized in that, The second coupling surface (341) is perpendicular to the surface of the connecting plate portion (610) that is in contact with the body (330).

14. The electronic device according to claim 12 or 13, characterized in that, Along the thickness direction of the electronic device, the end face of the coupling plate portion (620) away from the connecting plate portion (610) is a first arc-shaped surface (630).

15. The electronic device according to any one of claims 12 to 14, characterized in that, The metal part is elastic.

16. The electronic device according to claim 15, characterized in that, The coupling plate portion (620) includes a first plate segment (621), a curved plate segment (622), and a second plate segment (623) connected in sequence. The first plate segment (621) is connected to the connecting plate portion (610) and has the second coupling surface (341). The second plate segment (623) and the first plate segment (621) are located on the same side of the curved plate segment (622).

17. The electronic device according to any one of claims 11 to 16, characterized in that, The body (330) has a first groove (301), the metal part is disposed inside the first groove (301), the metal part is in contact with the bottom of the first groove (301), and a portion of the conductive layer (200) is located inside the first groove (301).

18. The electronic device according to claim 17, characterized in that, The bottom of the first groove (301) is made of metal.

19. The electronic device according to any one of claims 1 to 10, characterized in that, The middle frame (300) also includes a body (330), and the metal part (340) is a metal retaining wall that is integrally formed with the body (330).

20. The electronic device according to claim 19, characterized in that, Along the thickness direction of the electronic device, the end of the metal barrier away from the body (330) has a guide surface (640) connected to the second coupling surface (341).

21. The electronic device according to claim 19 or 20, characterized in that, Along the thickness direction of the electronic device, the end of the metal barrier away from the body (330) has a second arcuate surface (650).

22. The electronic device according to any one of claims 19 to 21, characterized in that, The body (330) and the metal retaining wall form a second groove (302), and a portion of the conductive layer (200) is located inside the second groove (302).

23. The electronic device according to any one of claims 1 to 22, characterized in that, The display screen (100) includes a display panel (120), which includes a display part (121), a bending part (122), and a binding part (123) connected in sequence. Along the thickness direction of the electronic device, the binding part (123) is spaced apart from the display part (121) and located on the non-display side of the display part (121). The conductive layer (200) is located between the bending part (122) and the frame member (400).

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