Heat dissipation components, controllers, and control methods

Abstract

This invention provides a heat dissipation component, a controller, and a control method, comprising: a heat-conducting housing, a heat-conducting channel disposed within the heat-conducting housing, and at least two heat-conducting regions arranged along the extension direction of the heat-conducting channel; at least two heat-conducting parts, each movably disposed within the heat-conducting channel and arranged along the extension direction of the heat-conducting channel, with each of the at least two heat-conducting parts corresponding to one of the at least two heat-conducting regions; wherein the heat dissipation component has a first heat dissipation state and a second heat dissipation state; when the heat dissipation component is in the first heat dissipation state, each heat-conducting part is positioned opposite to its corresponding heat-conducting region; when the heat dissipation component is in the second heat dissipation state, at least a portion of each heat-conducting part is offset from its corresponding heat-conducting region and positioned opposite to an adjacent heat-conducting region of the corresponding heat-conducting region. The technical solution provided by this invention can solve the technical problem of large temperature differences in different regions in existing fusion domain controllers.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation structure technology for controllers, and more specifically, to a heat dissipation component, a controller, and a control method. Background Technology

[0002] Currently, with the development of new energy vehicles, the vehicle architecture is gradually evolving from distributed to multi-domain controllers and cross-domain fusion controllers. Existing fusion domain controllers integrate intelligent driving chips and intelligent cockpit chips into a single domain controller. As the computing power of these chips gradually increases, their power consumption also rises. This increases the difficulty of heat dissipation for the fusion domain controller.

[0003] In existing technologies, conventional heat dissipation methods include the following: adding a water-cooled plate inside or outside the housing for heat dissipation, which dissipates the controller's heat through the water-cooled plate; contacting high-heat components such as intelligent driving chips and intelligent cockpit chips through a metal housing, and dissipating heat through metal bosses and heat dissipation fins on the metal housing, which dissipates the controller's heat into the air through the metal bosses and heat dissipation fins; and using a fan embedded in a metal housing for heat dissipation, which dissipates the heat of the metal housing through the fan.

[0004] However, the above-mentioned heat dissipation methods are effective for conventional single controllers. For converged domain controllers, since different chips generate heat differently, the above-mentioned heat dissipation methods cannot effectively adapt to the heat generation of different chips. As a result, the heat dissipation effect is better for some chips and worse for others. This leads to large temperature differences in different areas of the metal casing of the converged domain controller, which in turn increases the risk of casing deformation due to large temperature differences. Summary of the Invention

[0005] The main objective of this invention is to provide a heat dissipation component, a controller, and a control method to solve the technical problem of large temperature differences in different regions of the fusion domain controller in the prior art.

[0006] To achieve the above objectives, according to one aspect of the present invention, a heat dissipation assembly is provided, comprising:

[0007] A heat-conducting housing, wherein a heat-conducting channel is provided inside the heat-conducting housing, and the heat-conducting housing has at least two heat-conducting regions arranged along the extension direction of the heat-conducting channel;

[0008] At least two heat-conducting parts are movably disposed within a heat-conducting channel and arranged along the extension direction of the heat-conducting channel. Each of the at least two heat-conducting parts corresponds to at least two heat-conducting regions. Each heat-conducting part is formed of a heat-conducting medium. The thermal conductivity of two adjacent heat-conducting parts is different. Two adjacent heat-conducting parts are incompatible with each other and have a boundary surface at the interface, or a separator is provided between two adjacent heat-conducting parts.

[0009] The heat dissipation component has a first heat dissipation state and a second heat dissipation state. When the heat dissipation component is in the first heat dissipation state, each heat-conducting part is arranged opposite to the corresponding heat-conducting area. When the heat dissipation component is in the second heat dissipation state, at least a portion of each heat-conducting part is misaligned with the corresponding heat-conducting area and is arranged opposite to the adjacent heat-conducting area of ​​the corresponding heat-conducting area.

[0010] Furthermore, the heat dissipation component also includes:

[0011] A driving structure is connected to the end of a heat-conducting channel. The driving structure is used to introduce positive or negative pressure fluid into the heat-conducting channel to drive at least two heat-conducting parts to move along the extension direction of the heat-conducting channel.

[0012] Furthermore, the driving structure includes:

[0013] A first driving element is connected to one end of a heat-conducting channel, and the first driving element is used to introduce positive or negative pressure fluid into the heat-conducting channel through one end of the heat-conducting channel; and / or

[0014] The second driving element is connected to the other end of the heat conduction channel. The second driving element is used to introduce negative or positive pressure fluid into the heat conduction channel through the other end of the heat conduction channel.

[0015] Furthermore, the heat dissipation component also includes:

[0016] The connecting pipe has one end connected to one end of the heat conduction channel, and the other end of the connecting pipe extends out of the heat conduction shell. The driving structure is connected to the other end of the connecting pipe.

[0017] Furthermore, the heat dissipation component also includes:

[0018] At least two temperature sensing elements are provided, and at least two temperature sensing elements are set one-to-one with at least two heat conduction areas. Each temperature sensing element is used to detect the temperature of the corresponding heat conduction area.

[0019] The controller, at least two temperature sensors, and the drive structure are all connected to the controller so that the controller controls the drive structure based on the temperature detection signals from the at least two temperature sensors.

[0020] Furthermore, there are multiple heat conduction channels, which are spaced apart;

[0021] Among them, multiple heat conduction channels are arranged along a predetermined direction; or,

[0022] A portion of the multiple heat conduction channels is arranged along a first preset direction, another portion of the multiple heat conduction channels is arranged along a second preset direction, and a portion of the multiple heat conduction channels and another portion of the multiple heat conduction channels are spaced apart along the thickness direction of the heat conduction shell.

[0023] Furthermore, each heat-conducting part is formed of a heat-conducting fluid; and / or,

[0024] The heat-conducting housing is made of metal.

[0025] Furthermore, one of two adjacent heat-conducting parts is formed of liquid water, and the other of two adjacent heat-conducting parts is formed of silicone oil; or,

[0026] The separator is provided with a first guide portion, and the inner wall of the heat conduction channel is provided with a second guide portion. One of the first guide portion and the second guide portion extends along the extension direction of the heat conduction channel, and the first guide portion and the second guide portion guide and cooperate with each other.

[0027] According to another aspect of the present invention, a controller is provided, comprising:

[0028] The heat dissipation components provided above;

[0029] The circuit board and at least two chips are disposed on the circuit board. At least two heat-conducting areas of the heat dissipation component are disposed in a one-to-one correspondence with the at least two chips. Each heat-conducting area is attached to the corresponding chip and dissipates heat for the corresponding chip.

[0030] Furthermore, at least one of the two chips is an intermittent heating chip, and the other of the two chips is a continuous heating chip. The thermal conductivity of the heat-conducting part corresponding to the intermittent heating chip is less than the thermal conductivity of the heat-conducting part corresponding to the continuous heating chip.

[0031] Furthermore, at least two chips include:

[0032] Intelligent driving chip, which is used to collect data collected by cameras during vehicle operation;

[0033] Smart cockpit chip, which is used to collect data from cameras during vehicle driving and parking;

[0034] The communication chip connects with the smart cockpit chip for data exchange.

[0035] Furthermore, the controller also includes:

[0036] The Ethernet switching chip is mounted on the circuit board. Both the intelligent driving chip and the intelligent cockpit chip are connected to the Ethernet switching chip for data transmission.

[0037] The microcontroller unit connects to and transmits data with the Ethernet switching chip.

[0038] According to another aspect of the present invention, a control method is provided, applicable to the heat dissipation assembly provided above, wherein at least two heat-conducting parts include a first heat-conducting part and a second heat-conducting part arranged adjacently, and at least two heat-conducting regions include a first heat-conducting region and a second heat-conducting region arranged adjacently, and the thermal conductivity of the first heat-conducting part is less than the thermal conductivity of the second heat-conducting part; the control method includes:

[0039] The temperatures of the first and second heat-conducting regions are obtained, and the temperatures of the first and second heat-conducting regions are compared.

[0040] When the temperature of the first heat-conducting area is less than or equal to the temperature of the second heat-conducting area, the heat dissipation component is controlled to be in the first heat dissipation state.

[0041] When the temperature of the first heat-conducting area is greater than the temperature of the second heat-conducting area, the heat dissipation component is controlled to be in the second heat dissipation state.

[0042] Further, the heat dissipation assembly is the heat dissipation assembly provided above, wherein the first driving member is connected to one end of the heat conduction channel near the first heat conduction part, and the second driving member is connected to one end of the heat conduction channel near the second heat conduction part; controlling the heat dissipation assembly to be in the second heat dissipation state includes:

[0043] Control the first driving component to introduce negative pressure fluid into the heat dissipation channel; and / or,

[0044] The second drive unit is controlled to introduce positive pressure fluid into the heat dissipation channel.

[0045] Furthermore, controlling the heat dissipation component to be in the second heat dissipation state also includes:

[0046] Obtain the temperature rise rate and / or temperature rise amount of the first heat conduction area within a predetermined time.

[0047] The fluid velocity and flow rate of the first drive member are controlled based on the rate and / or amount of temperature rise in the first heat-conducting region within a predetermined time; and / or, the fluid velocity and flow rate of the second drive member are controlled based on the rate and / or amount of temperature rise in the first heat-conducting region within a predetermined time.

[0048] By applying the technical solution of the present invention, by switching the heat dissipation component to the first heat dissipation state and the second heat dissipation state, it is possible to easily change the position of each heat-conducting part in the heat conduction channel according to the heat dissipation requirements of different heat conduction areas. This allows each heat-conducting part to conduct heat dissipation to the corresponding heat conduction area or adjacent heat conduction areas, thereby ensuring adaptive heat dissipation to meet the heat dissipation requirements of the corresponding heat conduction area as much as possible, so as to ensure the temperature uniformity of different heat conduction areas and reduce the temperature difference between different heat conduction areas. Attached Figure Description

[0049] The accompanying drawings, which form part of this application, are used to provide a further understanding of the invention. The illustrative embodiments of the invention and their descriptions are used to explain the invention and do not constitute an undue limitation of the invention. In the drawings:

[0050] Figure 1 A schematic diagram of the layout structure of the heat-conducting part in the heat-conducting channel of the heat dissipation assembly provided according to an embodiment of the present invention is shown;

[0051] Figure 2 A cross-sectional view of a heat dissipation assembly provided according to an embodiment of the present invention is shown;

[0052] Figure 3 A cross-sectional view of a heat dissipation assembly provided according to another embodiment of the present invention is shown;

[0053] Figure 4 A connection diagram of a controller provided according to an embodiment of the present invention is shown;

[0054] Figure 5 A flowchart of a control method provided according to an embodiment of the present invention is shown.

[0055] The above figures include the following reference numerals:

[0056] 10. Heat dissipation assembly; 11. Heat-conducting housing; 111. Heat-conducting channel; 112. Heat-conducting area; 12. Heat-conducting part; 13. Connecting pipes; 14. Interface partition;

[0057] 20. Circuit board;

[0058] 30. Chip; 31. Intelligent driving chip; 32. Intelligent cockpit chip; 33. Communication chip;

[0059] 40. Ethernet switching chip; 50. Microcontroller unit. Detailed Implementation

[0060] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0061] like Figures 1 to 3 As shown, Embodiment 1 of the present invention provides a heat dissipation assembly 10, which includes a heat-conducting shell 11 and at least two heat-conducting parts 12. A heat-conducting channel 111 is disposed within the heat-conducting shell 11, and the heat-conducting shell 11 has at least two heat-conducting regions 112 arranged along the extending direction of the heat-conducting channel 111. The at least two heat-conducting parts 12 are movably disposed within the heat-conducting channel 111 and arranged along the extending direction of the heat-conducting channel 111. The at least two heat-conducting parts 12 are arranged in a one-to-one correspondence with the at least two heat-conducting regions 112. Each heat-conducting part 12 is formed of a heat-conducting medium, and the thermal conductivity of adjacent heat-conducting parts 12 is different. Adjacent heat-conducting parts 12 are incompatible and have a boundary surface 14 at their junction, or a separator is disposed between adjacent heat-conducting parts 12. The heat dissipation component 10 has a first heat dissipation state and a second heat dissipation state. When the heat dissipation component 10 is in the first heat dissipation state, each heat-conducting part 12 is disposed opposite to the corresponding heat-conducting area 112. When the heat dissipation component 10 is in the second heat dissipation state, at least a portion of each heat-conducting part 12 is misaligned with the corresponding heat-conducting area 112 and is disposed opposite to the adjacent heat-conducting area 112 of the corresponding heat-conducting area 112.

[0062] By employing the heat dissipation component 10 provided in this embodiment, and switching the heat dissipation component 10 to a first heat dissipation state and a second heat dissipation state, the position of each heat-conducting part 12 within the heat conduction channel 111 can be easily changed according to the heat dissipation requirements of different heat-conducting areas 112. This allows each heat-conducting part 12 to conduct heat dissipation to its corresponding heat-conducting area 112 or adjacent heat-conducting areas 112, thereby ensuring adaptive heat dissipation to meet the heat dissipation requirements of the corresponding heat-conducting area 112, ensuring temperature uniformity in different heat-conducting areas 112, and reducing the temperature difference between different areas. The heat dissipation component 10 is mainly used to dissipate heat from a component to be cooled, which can be a fusion domain controller. By applying the heat dissipation component 10 in this embodiment to a fusion domain controller, the large temperature difference in different areas of the fusion domain controller can be effectively reduced, effectively ensuring the heat dissipation effect and heat dissipation uniformity of the fusion domain controller.

[0063] In addition, this dynamic adjustment of heat dissipation strategy can not only improve heat dissipation efficiency and reduce energy waste, but also effectively meet the heat dissipation needs of equipment under different workloads, which has a significant effect on improving the stability of electronic equipment and extending its service life.

[0064] It should be noted that "adjacent heat-conducting parts 12 are incompatible and have an interface 14 at the junction" can be understood as the interface 14 being a natural tension surface formed by capillary action due to the incompatibility of the two heat-conducting media. By moving and pushing the fluid heat-conducting medium material filling the cavity of the metal shell from the outside, the interface 14 can be moved inside the cavity.

[0065] Specifically, at least two heat-conducting parts 12 include a first heat-conducting part 12 and a second heat-conducting part 12 arranged adjacent to each other, and at least two heat-conducting regions 112 include a first heat-conducting region 112 and a second heat-conducting region 112 arranged adjacent to each other. The thermal conductivity of the first heat-conducting part 12 is less than that of the second heat-conducting part 12. Under normal operating conditions, the heat dissipation of the first heat-conducting region 112 is less than that of the second heat-conducting region 112. At this time, the heat dissipation component 10 is in the first heat dissipation state. However, when the heat dissipation of the first heat-conducting region 112 suddenly increases or even exceeds that of the second heat-conducting region 112, the heat dissipation component 10 can be controlled to be in the second heat dissipation state. In this way, the second heat-conducting part 12 with higher thermal conductivity can effectively dissipate heat from the first heat-conducting region 112 quickly, thereby facilitating the rapid reduction of the heat in the first heat-conducting region 112 and avoiding a large temperature difference between the first heat-conducting region 112 and the second heat-conducting region 112.

[0066] It should be noted that when the heat dissipation assembly 10 is in the first heat dissipation state, each heat-conducting part 12 is only positioned opposite to its corresponding heat-conducting region 112; when the heat dissipation assembly 10 is in the second heat dissipation state, a portion of each heat-conducting part 12 is positioned opposite to its corresponding heat-conducting region 112, and another portion of each heat-conducting part 12 is positioned opposite to the adjacent heat-conducting region 112. The ratio between the portion and the other portion of each heat-conducting part 12 can be determined according to specific heat dissipation requirements. Specifically, when the heat dissipation requirement of the first heat-conducting region 112 is greater and the temperature of the first heat-conducting region 112 is greater than the temperature of the second heat-conducting region 112, the length of the portion of the second heat-conducting part 12 corresponding to the first heat-conducting region 112 is larger, so as to quickly meet the heat dissipation requirements of the first heat-conducting region 112.

[0067] Specifically, the heat-conducting part 12 can be a solid structure or a fluid. When the heat-conducting part 12 is a solid structure, it can be a heat-conducting strip or a heat-conducting column; when the heat-conducting part 12 is a fluid, the fluid fills the flow channel. It is only necessary that the thermal conductivity of the heat-conducting medium forming two adjacent heat-conducting parts 12 is different.

[0068] In this embodiment, the heat dissipation assembly 10 further includes a driving structure, which is connected to the end of the heat conduction channel 111. The driving structure is used to introduce positive or negative pressure fluid into the heat conduction channel 111 to drive at least two heat conduction parts 12 to move along the extension direction of the heat conduction channel 111. This structural arrangement facilitates effective adjustment of the positions of at least two heat conduction parts 12, enabling the heat dissipation assembly 10 to smoothly switch between a first heat dissipation state and a second heat dissipation state. Through external driving via the driving structure, the heat dissipation assembly 10 can achieve precise temperature control, which is crucial for ensuring the stable operation of precision electronic equipment under extreme conditions, such as in controllers experiencing extreme temperature variations, ensuring normal operation in different environments.

[0069] Specifically, the fluid in "positive pressure fluid or negative pressure fluid" can be liquid or gas, and when the heat-conducting part 12 is a heat-conducting fluid, the positive pressure fluid and the negative pressure fluid are incompatible with each other.

[0070] Specifically, the driving structure includes a first driving member, which is connected to one end of the heat conduction channel 111. The first driving member is used to introduce positive or negative pressure fluid into the heat conduction channel 111 through one end of the heat conduction channel 111. With this structural arrangement, it is easy to adjust the position of one end of the heat conduction channel 111 through the first driving member, thereby changing the position of at least two heat conduction parts 12 within the heat conduction channel 111.

[0071] Specifically, the driving structure includes a second driving member, which is connected to the other end of the heat conduction channel 111. The second driving member is used to introduce negative or positive pressure fluid into the heat conduction channel 111 through the other end of the heat conduction channel 111. In this way, the position of the other end of the heat conduction channel 111 can be adjusted by the second driving member, thereby changing the position of at least two heat conduction parts 12 in the heat conduction channel 111.

[0072] Specifically, when the driving structure includes a first driving member and a second driving member, the positions of both ends of the heat conduction channel 111 are simultaneously adjusted through the cooperative action of the first and second driving members. This facilitates faster and more adaptive adjustment and change of the positions of at least two heat conduction parts 12 within the heat conduction channel 111. Furthermore, the above structure allows for bidirectional adjustment of the position of the heat conduction parts 12, providing a more flexible heat dissipation strategy suitable for devices with multiple chips 30 or different heat dissipation characteristics. This bidirectional adjustment capability enables the heat dissipation component 10 to more flexibly respond to dynamic changes in the heat sources inside the device. For controllers with multiple chips 30, the heat dissipation strategy can be adjusted in real time according to the heat dissipation conditions of different chips 30, effectively preventing localized overheating and improving the device's heat dissipation efficiency and overall performance.

[0073] In this embodiment, the heat dissipation assembly 10 further includes a connecting pipe 13. One end of the connecting pipe 13 is connected to one end of the heat conduction channel 111, and the other end of the connecting pipe 13 extends out of the heat conduction housing 11. The driving structure is connected to the other end of the connecting pipe 13. This structural arrangement avoids direct contact between the driving component and the heat conduction housing 11, increasing the distance between them. This facilitates flexible adjustment of the driving component's position and prevents heat transfer from the driving component to the heat conduction housing 11 due to excessive proximity.

[0074] Specifically, the heat dissipation assembly 10 also includes at least two temperature sensors and a control unit. The at least two temperature sensors are configured one-to-one with at least two heat-conducting areas 112, and each temperature sensor is used to detect the temperature of its corresponding heat-conducting area 112. Both the at least two temperature sensors and the drive structure are connected to the control unit, so that the control unit controls the drive structure based on the temperature detection signals from the at least two temperature sensors. This allows the control unit to adaptively adjust the drive structure according to the temperature conditions of different heat-conducting areas 112, achieving intelligent heat dissipation control, and enabling the heat dissipation assembly 10 to switch to a first heat dissipation state or a second heat dissipation state.

[0075] In this embodiment, there are multiple heat conduction channels 111, which are spaced apart to improve the heat dissipation effect of the heat dissipation structure. The multi-channel design can increase the heat dissipation area and efficiency of the heat dissipation component 10, and is suitable for heat dissipation of multiple heat sources or high-power heat sources.

[0076] Specifically, multiple heat conduction channels 111 are arranged along a predetermined direction to optimize the layout of the multiple heat conduction channels 111 and improve the heat dissipation effect of the multiple heat conduction channels 111 on at least two heat conduction areas 112. Specifically, each heat conduction channel 111 is provided with at least two heat conduction parts 12, and the at least two heat conduction parts 12 are provided in a one-to-one correspondence with at least two heat conduction areas 112.

[0077] Specifically, a portion of the plurality of heat-conducting channels 111 is arranged along a first preset direction, and another portion of the plurality of heat-conducting channels 111 is arranged along a second preset direction. The portion of the plurality of heat-conducting channels 111 and the other portion of the plurality of heat-conducting channels 111 are spaced apart along the thickness direction of the heat-conducting shell 11. This structural arrangement allows the portion of the plurality of heat-conducting channels 111 and the other portion of the plurality of heat-conducting channels 111 to be distributed at different layer heights of the heat-conducting shell 111, and the portion of the heat-conducting channels 111 to be staggered, thereby further optimizing the structural layout of the plurality of heat-conducting channels 111 and thus better improving the heat dissipation effect on at least two heat-conducting regions 112.

[0078] Specifically, the first preset direction can be horizontal, and the second preset direction can be vertical.

[0079] In this embodiment, each heat-conducting part 12 is formed of a heat-conducting fluid, which can ensure that the heat dissipation assembly 10 has good heat conduction and heat dissipation performance.

[0080] Specifically, the heat-conducting housing 11 is made of metal, which ensures that the heat dissipation component 10 has good thermal conductivity and durability, making it suitable for equipment heat dissipation in various harsh environments, such as high temperature, high humidity, and high vibration industrial environments, thereby reducing maintenance costs.

[0081] Specifically, one of two adjacent heat-conducting parts 12 is formed of liquid water, and the other of two adjacent heat-conducting parts 12 is formed of silicone oil. In this way, the liquid water and silicone oil are incompatible and have an interface 14 at the interface, which can ensure the stable movement of the heat-conducting part 12 within the heat-conducting channel 111 and improve the heat dissipation effect of the heat dissipation assembly 10.

[0082] Alternatively, the separator may have a first guide portion and a second guide portion on the inner wall of the heat conduction channel 111. One of the first and second guide portions extends along the extension direction of the heat conduction channel 111, and the first and second guide portions are guided and engaged. This phased engagement of the first and second guide portions improves the movement stability of the separator, allowing it to move stably along the extension direction of the heat conduction channel 111. The separator also effectively separates adjacent heat conduction sections 12. Specifically, one of the first and second guide portions is a guide protrusion, and the other is a guide groove.

[0083] When a separator is used, a sealing part can be provided around the periphery of the separator. This sealing part is used to fit and cooperate with the inner wall of the heat conduction channel 111 to effectively separate the fluid of the two heat conduction parts 12 on both sides of the separator.

[0084] like Figure 4 As shown, Embodiment 2 of the present invention provides a controller, which includes the heat dissipation component 10, circuit board 20 and at least two chips 30 provided above. The at least two chips 30 are all disposed on the circuit board 20. At least two heat conduction areas 112 of the heat dissipation component 10 are disposed in a one-to-one correspondence with the at least two chips 30. Each heat conduction area 112 is attached to the corresponding chip 30 and dissipates heat from the corresponding chip 30.

[0085] The controller provided in this embodiment can ensure the stable operation of each chip 30 inside the controller, improve the overall performance and service life of the device, and is suitable for the heat dissipation requirements of various high-performance chips 30, such as the intelligent driving chip 31 and intelligent cockpit chip 32 of autonomous vehicles.

[0086] Specifically, when the heat-conducting medium is a fluid, the change in the position of the first heat-conducting part 12 and the second heat-conducting part 12 will also change the position of the interface 14, thereby changing the heat dissipation state.

[0087] In this embodiment, one of the at least two chips 30 is an intermittently heating chip, and the other of the at least two chips 30 is a continuously heating chip. The thermal conductivity of the heat-conducting part 12 corresponding to the intermittently heating chip is less than that of the heat-conducting part 12 corresponding to the continuously heating chip. This configuration allows for customized heat dissipation solutions based on the heating characteristics of the chips 30, effectively avoiding energy waste and localized overheating. It is suitable for heat dissipation in devices with multiple chips 30 and multiple heat sources, such as the fusion domain controller in new energy vehicles.

[0088] Specifically, the intermittently heating chip dissipates relatively little heat during normal operation (in most scenarios). Therefore, a liquid thermally conductive medium with a low thermal conductivity can be filled into the corresponding portion of the heat conduction channel 111 to reduce the overall thermal conductivity of its heat dissipation path. For the continuously heating chip, which requires sustained high heat dissipation, a liquid thermally conductive medium with a high thermal conductivity needs to be filled into the corresponding portion of the heat conduction channel 111 to reduce the overall thermal conductivity of its heat dissipation path in order to ensure its heat dissipation effect.

[0089] When the heat generated by the intermittently heating chip suddenly increases, a liquid thermally conductive material with a high thermal conductivity is applied to at least partially cover the corresponding area of ​​the intermittently heating chip by moving the boundary, thereby enhancing the overall thermal conductivity of its heat dissipation path. This method allows the multi-domain controller to minimize the temperature difference between the heat dissipation areas of the protective shell under different usage scenarios, reducing the risk of warping and deformation of the metal protective shell due to excessive temperature differences in different areas. Specifically, the liquid thermally conductive medium can be selected from various thermal conductivity values ​​[λ1…λn]. By arranging the longitudinal, transverse, single-layer, or staggered multi-layer thermal conductive channels 111 in an alternating manner, a combination of different thermal conductivity values ​​in multiple areas can be achieved, further improving the flexibility of adjusting the thermal conductivity of the naturally heat-dissipating metal protective shell.

[0090] Specifically, at least two chips 30 include an intelligent driving chip 31, an intelligent cockpit chip 32, and a communication chip 33. The intelligent driving chip 31 is used to collect data from cameras during vehicle operation; the intelligent cockpit chip 32 is used to collect data from cameras during vehicle operation and parking; the intelligent cockpit chip 32 connects and interacts with the communication chip 33. This meets the high heat dissipation requirements of autonomous vehicles, ensures the stable operation of the intelligent driving chip 31 and the intelligent cockpit chip 32, and improves driving safety.

[0091] Specifically, the intelligent driving chip 31 is used as an intermittent heat-generating chip, and the intelligent cockpit chip 32 is used as a continuous heat-generating chip. The uniformity of heat dissipation is achieved through the variable thermal conductivity, thereby ensuring the balanced heat dissipation of the entire protective shell of the controller.

[0092] In this embodiment, the controller further includes an Ethernet switching chip 40 and a microcontroller unit 50. The Ethernet switching chip 40 is mounted on the circuit board 20, and both the intelligent driving chip 31 and the intelligent cockpit chip 32 are connected to and transmit data with the Ethernet switching chip 40. The microcontroller unit 50 is also connected to and transmits data with the Ethernet switching chip 40. Through the cooperation of the Ethernet switching chip 40 and the microcontroller unit 50, the controller can achieve high-speed data exchange and intelligent control, making it suitable for devices requiring real-time data processing and control. Furthermore, the above structure transforms the Ethernet switch of the device into an Ethernet switching chip 40 mounted on the circuit board 20, reducing space occupation, changing the connection method, and improving data transmission speed.

[0093] The intelligent driving chip 31 primarily processes data collected by the forward-looking and side-looking cameras. The data results and raw data streams are transmitted via Ethernet to the microcontroller unit 50 for vehicle control decisions, and also to the intelligent cockpit chip 32 for display on the screen of the display component. The intelligent cockpit chip 32 primarily processes data from the forward-looking and surround-view camera components, used for forward-looking video acquisition and recording during driving, and 360° video stitching for parking scenarios. The video data is displayed on the screen for human-machine interaction. The functional safety microcontroller unit 50 receives forward-looking and side-looking video detection results, such as lane lines, pedestrians, and signs. These can be optionally sent to the intelligent cockpit chip 32 for unified decision processing or to the functional safety microcontroller unit 50 for regulatory control decisions and vehicle control signal output. The intelligent cockpit chip 32 connects and interacts with 4G / 5G, WIFI, and BT modules, communicates with the cloud, and transmits data with mobile phones, smart keys, etc. The aforementioned intelligent cockpit chip 32 generally possesses a powerful CPU and GPU, resulting in high overall power consumption. It can be selected as a chip that generates continuous heat, using a thermally conductive medium with a high thermal conductivity (λ2) for heat dissipation. The aforementioned intelligent driving chip 31, when parked, generally does not require AI calculations or recognition of lane lines, vehicles, or pedestrians. It only releases its maximum computing power when in motion. Therefore, it can be selected as a chip that generates intermittent heat. When parked, it uses a thermally conductive medium with a low thermal conductivity (λ1) for heat dissipation; when in motion, it uses a thermally conductive medium with a high thermal conductivity (λ2) for heat dissipation.

[0094] Specifically, when other types of system-on-a-chip or other types of chips (such as communication chip 33 (which can be 4G or 5G), power chip, etc.) need to dissipate heat through the heat-conducting housing 11, depending on the working state, a combination of heat-conducting media with various thermal conductivity (λ1…λn) can be selected to finely divide the heat dissipation areas with different thermal conductivity to achieve balanced control of the heat dissipation area of ​​the entire domain controller housing.

[0095] Specifically, the controller also includes a protective housing, and the heat dissipation assembly 10, circuit board 20, and at least two chips 30 are all installed inside the protective cavity of the protective housing. Specifically, the heat-conducting housing 11 of the heat dissipation assembly 10 can be connected to or integrally formed with the protective housing, thereby facilitating better heat dissipation through the protective housing.

[0096] like Figure 5 As shown, Embodiment 3 of the present invention provides a control method applicable to the heat dissipation assembly 10 provided above. At least two heat-conducting parts 12 include a first heat-conducting part 12 and a second heat-conducting part 12 arranged adjacently, and at least two heat-conducting regions 112 include a first heat-conducting region 112 and a second heat-conducting region 112 arranged adjacently. The thermal conductivity of the first heat-conducting part 12 is less than that of the second heat-conducting part 12. The control method includes: acquiring the temperatures of the first heat-conducting region 112 and the second heat-conducting region 112; comparing the temperatures of the first heat-conducting region 112 and the second heat-conducting region 112; controlling the heat dissipation assembly 10 to be in a first heat dissipation state when the temperature of the first heat-conducting region 112 is less than or equal to the temperature of the second heat-conducting region 112; and controlling the heat dissipation assembly 10 to be in a second heat dissipation state when the temperature of the first heat-conducting region 112 is greater than the temperature of the second heat-conducting region 112. This control method can dynamically adjust the heat dissipation strategy according to the actual heat generation, improving heat dissipation efficiency and making it more suitable for various devices that need to adjust heat dissipation according to workload.

[0097] In this embodiment, the heat dissipation assembly 10 is the heat dissipation assembly 10 provided above. The first driving member is connected to one end of the heat conduction channel 111 near the first heat conduction part 12, and the second driving member is connected to one end of the heat conduction channel 111 near the second heat conduction part 12. Controlling the heat dissipation assembly 10 to be in a second heat dissipation state includes: controlling the first driving member to introduce negative pressure fluid into the heat conduction channel 111; and / or, controlling the second driving member to introduce positive pressure fluid into the heat conduction channel 111. By precisely controlling the fluid pressure of the first driving member and / or the second driving member, the heat dissipation assembly 10 can quickly respond to temperature changes of the heat source and provide instant heat dissipation, making it easier to better suit controllers that require rapid response for heat dissipation.

[0098] Specifically, controlling the heat dissipation component 10 to be in the second heat dissipation state further includes: acquiring the temperature rise rate and / or temperature rise amount of the first heat-conducting region 112 within a predetermined time; controlling the fluid flow rate and flow rate of the first driving component based on the temperature rise rate and / or temperature rise amount of the first heat-conducting region 112 within the predetermined time; and / or controlling the fluid flow rate and flow rate of the second driving component based on the temperature rise rate and / or temperature rise amount of the first heat-conducting region 112 within the predetermined time. By employing this control strategy, the temperature change trend of the heat source corresponding to the first heat-conducting region 112 can be predicted in advance, allowing for early adjustment of the heat dissipation strategy and preventing overheating of the first heat-conducting region 112 due to sudden temperature increases, thus avoiding uneven temperature distribution.

[0099] As can be seen from the above description, the above embodiments of the present invention achieve the following technical effects: under natural heat dissipation conditions, chips with different heat generation and operating characteristics can still achieve balanced heat dissipation in different areas of the metal casing of the entire domain controller by finely adjusting the thermal conductivity of the metal casing they are in contact with, thereby reducing the distortion and deformation of the heat-conducting casing and / or protective casing caused by excessive temperature differences in different areas of the metal heat dissipation casing, enhancing the stability of the overall structure of the next-generation cabin-riding converged domain controller and centralized domain controller under natural heat dissipation conditions, and enhancing the working stability and reliability of the equipment in long-term complex and harsh environments.

[0100] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0101] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps described in these embodiments do not limit the scope of this application. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following drawings denote similar items; therefore, once an item is defined in one drawing, it need not be further discussed in subsequent drawings.

[0102] In the description of this application, it should be understood that the orientation or positional relationship indicated by directional terms such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" is usually based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing this application and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of this application; the directional terms "inner" and "outer" refer to the inner and outer contours relative to the outline of each component itself.

[0103] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0104] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be construed as limiting the scope of protection of this application.

[0105] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A heat dissipation component, characterized in that, include: A heat-conducting housing (11) is provided with a heat-conducting channel (111) inside the heat-conducting housing (11), and the heat-conducting housing (11) has at least two heat-conducting regions (112) arranged along the extension direction of the heat-conducting channel (111); At least two heat-conducting parts (12) are movably disposed within the heat-conducting channel (111) and arranged along the extension direction of the heat-conducting channel (111). The at least two heat-conducting parts (12) are arranged in a one-to-one correspondence with the at least two heat-conducting regions (112). Each heat-conducting part (12) is formed of a heat-conducting medium. The thermal conductivity of two adjacent heat-conducting parts (12) is different. Two adjacent heat-conducting parts (12) are incompatible with each other and have a junctional partition (14) at the junction, or a separator is provided between two adjacent heat-conducting parts (12). The heat dissipation component has a first heat dissipation state and a second heat dissipation state. When the heat dissipation component is in the first heat dissipation state, each of the heat-conducting parts (12) is disposed opposite to the corresponding heat-conducting area (112). When the heat dissipation component is in the second heat dissipation state, at least a portion of each of the heat-conducting parts (12) is misaligned with the corresponding heat-conducting area (112) and is disposed opposite to the adjacent heat-conducting area (112) of the corresponding heat-conducting area (112).

2. The heat dissipation assembly according to claim 1, characterized in that, The heat dissipation component also includes: A driving structure is connected to the end of the heat conduction channel (111). The driving structure is used to introduce positive pressure fluid or negative pressure fluid into the heat conduction channel (111) to drive the at least two heat conduction parts (12) to move along the extension direction of the heat conduction channel (111).

3. The heat dissipation assembly according to claim 2, characterized in that, The driving structure includes: A first driving element is connected to one end of the heat-conducting channel (111), and the first driving element is used to introduce positive or negative pressure fluid into the heat-conducting channel (111) through one end of the heat-conducting channel (111); and / or, The second driving member is connected to the other end of the heat conduction channel (111). The second driving member is used to introduce negative or positive pressure fluid into the heat conduction channel (111) through the other end of the heat conduction channel (111).

4. The heat dissipation assembly according to claim 2, characterized in that, The heat dissipation component also includes: A connecting pipe (13) is provided, one end of which is connected to one end of the heat-conducting channel (111), and the other end of which extends out of the heat-conducting shell (11). The driving structure is connected to the other end of the connecting pipe (13).

5. The heat dissipation assembly according to claim 2, characterized in that, The heat dissipation component also includes: At least two temperature sensing elements are provided, and the at least two temperature sensing elements are provided in a one-to-one correspondence with the at least two heat-conducting areas (112). Each of the temperature sensing elements is used to detect the temperature of the corresponding heat-conducting area (112). A control unit is provided, wherein the at least two temperature sensors and the drive structure are all connected to the control unit, so that the control unit controls the drive structure according to the temperature detection signals of the at least two temperature sensors.

6. The heat dissipation assembly according to claim 1, characterized in that, There are multiple heat conduction channels (111), and the multiple heat conduction channels (111) are arranged at intervals; Among them, the plurality of heat conduction channels (111) are arranged along a predetermined direction; or, A portion of the plurality of heat conduction channels (111) is arranged along a first preset direction, another portion of the plurality of heat conduction channels (111) is arranged along a second preset direction, and a portion of the plurality of heat conduction channels (111) and another portion of the plurality of heat conduction channels (111) are spaced apart along the thickness direction of the heat conduction shell (11).

7. The heat dissipation assembly according to claim 1, characterized in that, Each of the aforementioned heat-conducting parts (12) is formed of a heat-conducting fluid; and / or, The heat-conducting housing (11) is made of metal.

8. The heat dissipation assembly according to claim 1, characterized in that, One of the two adjacent heat-conducting parts (12) is formed of liquid water, and the other of the two adjacent heat-conducting parts (12) is formed of silicone oil; or, The separator is provided with a first guide portion, and the inner wall of the heat conduction channel (111) is provided with a second guide portion. One of the first guide portion and the second guide portion extends along the extension direction of the heat conduction channel (111), and the first guide portion and the second guide portion guide and cooperate with each other.

9. A controller, characterized in that, include: The heat dissipation component according to any one of claims 1 to 8; The circuit board (20) and at least two chips (30) are disposed on the circuit board (20). At least two heat-conducting areas of the heat dissipation component are disposed in a one-to-one correspondence with the at least two chips (30). Each heat-conducting area is attached to the corresponding chip (30) and dissipates heat from the corresponding chip (30).

10. The controller according to claim 9, characterized in that, One of the at least two chips (30) is an intermittent heating chip, and the other of the at least two chips (30) is a continuous heating chip. The thermal conductivity of the heat-conducting part corresponding to the intermittent heating chip is less than the thermal conductivity of the heat-conducting part corresponding to the continuous heating chip.

11. The controller according to claim 9, characterized in that, The at least two chips (30) include: Intelligent driving chip (31), the intelligent driving chip (31) is used to collect data collected by the camera during the vehicle's driving process; The smart cockpit chip (32) is used to collect data collected by the camera during vehicle driving and parking. The communication chip (33) is connected to the smart cockpit chip (32) for data interaction.

12. The controller according to claim 11, characterized in that, The controller also includes: An Ethernet switching chip (40) is disposed on the circuit board (20). The intelligent driving chip (31) and the intelligent cockpit chip (32) are both connected to the Ethernet switching chip (40) for data transmission. The microcontroller unit (50) is connected to the Ethernet switching chip (40) for data transmission.

13. A control method, characterized in that, The heat dissipation assembly applicable to any one of claims 1 to 8, wherein the at least two heat-conducting parts include a first heat-conducting part and a second heat-conducting part arranged adjacently, and the at least two heat-conducting regions include a first heat-conducting region and a second heat-conducting region arranged adjacently, wherein the thermal conductivity of the first heat-conducting part is less than the thermal conductivity of the second heat-conducting part; The control method includes: The temperature of the first heat-conducting region and the temperature of the second heat-conducting region are obtained, and the temperature of the first heat-conducting region is compared with the temperature of the second heat-conducting region. When the temperature of the first heat-conducting area is less than or equal to the temperature of the second heat-conducting area, the heat dissipation component is controlled to be in the first heat dissipation state. When the temperature of the first heat-conducting area is greater than the temperature of the second heat-conducting area, the heat dissipation component is controlled to be in the second heat dissipation state.

14. The control method according to claim 13, characterized in that, The heat dissipation component is the heat dissipation component as described in claim 3, wherein the first driving member is connected to one end of the heat conduction channel near the first heat conduction part, and the second driving member is connected to one end of the heat conduction channel near the second heat conduction part; controlling the heat dissipation component to be in the second heat dissipation state includes: Control the first driving element to introduce negative pressure fluid into the heat-conducting channel; and / or, The second driving element is controlled to introduce positive pressure fluid into the heat conduction channel.

15. The control method according to claim 14, characterized in that, The method of controlling the heat dissipation component to be in the second heat dissipation state further includes: Obtain the temperature rise rate and / or temperature rise amount of the first heat-conducting region within a predetermined time. The fluid flow rate and flow rate of the first drive member are controlled based on the temperature rise rate and / or temperature rise amount of the first heat-conducting region within a predetermined time; and / or, the fluid flow rate and flow rate of the second drive member are controlled based on the temperature rise rate and / or temperature rise amount of the first heat-conducting region within a predetermined time.

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