Ice microneedle manufacturing device based on semiconductor chilling plate

Abstract

The invention discloses an ice micro-needle manufacturing device based on a semiconductor chilling plate, and belongs to the technical field of ice micro-needles, the ice micro-needle manufacturing device is sequentially provided with a thermoelectric refrigeration module, a copper sheet radiator and a water-cooling heat dissipation module above a micro-needle mold, and a water tank is arranged below the water-cooling heat dissipation module; the copper sheet radiator extends into the water tank and extends towards the top of the water tank, and a semiconductor refrigeration sheet of the thermoelectric refrigeration module is directly connected with the copper sheet radiator. According to the ice microneedle manufacturing device based on the semiconductor chilling plate, the difficulty of preparing the ice microneedle under harsh conditions is overcome, the ice microneedle can be prepared more conveniently and effectively, and the ice microneedle manufacturing device has considerable application prospects.

Description

Technical Field

[0001] The present invention relates to the technical field of ice microneedles, and in particular to an ice microneedle manufacturing device based on a semiconductor refrigeration sheet. Background Art

[0002] As a new type of nanoscale medical device, microneedle patch has the advantages of painless, minimally invasive, and high efficiency. It can enhance the permeability of the skin to drugs, especially macromolecular drugs, and can also achieve controlled release of drugs. Microneedle patch is composed of multiple tiny needles distributed on the substrate, and the length of the microneedle is usually 25~2000μm.

[0003] Microneedles achieve painless drug delivery in a minimally invasive manner, reduce tissue damage, accurately target drug delivery, and reduce drug dosage. As an alternative new drug delivery method, microneedles have broad development prospects in the medical field. Microneedles can be divided into solid microneedles, coated microneedles, hollow microneedles, soluble microneedles, and hydrogel microneedles. Common solid microneedles include metal microneedles and ice microneedles, but traditional ice microneedles need to be prepared in relatively harsh conditions such as a -80°C refrigerator or liquid nitrogen, which makes them difficult to operate. Summary of the invention

[0004] The purpose of the present invention is to provide an ice microneedle manufacturing device based on semiconductor refrigeration sheets, which overcomes the difficulties in preparing ice microneedles under harsh conditions, can achieve convenient and efficient preparation of ice microneedles, and has considerable application prospects.

[0005] To achieve the above-mentioned objectives, the present invention provides an ice microneedle manufacturing device based on semiconductor refrigeration sheets, which include a thermoelectric refrigeration module, a copper plate radiator and a water-cooled heat dissipation module arranged in sequence above the microneedle mold, a water tank being provided below the water-cooled heat dissipation module, the copper plate radiator extending into the interior of the water tank and extending toward the top of the water tank, and the semiconductor refrigeration sheet of the thermoelectric refrigeration module being directly connected to the copper plate radiator.

[0006] Preferably, the water-cooling heat dissipation module further includes a water pump and a water cooling plate, and the water pump is electrically connected to the first DC power supply.

[0007] Preferably, the water tank, the water pump and the water-cooling plate are all connected via a water pipe, and the pipe inside the water-cooling plate is in a serpentine structure, with interfaces connected to the water pipe at both ends thereof.

[0008] Preferably, the water tank is provided with an opening on the top, and is also provided with a side panel located below the water pump or the water cooling plate, and the tops of the side panels are connected to the water pump or the water cooling plate via embedded fixing supports.

[0009] Preferably, the fixed supports are respectively arranged on both sides above the side panels.

[0010] Preferably, the copper sheet heat sink is in sheet shape, and a uniformly distributed rack structure is provided on the top thereof.

[0011] Preferably, the semiconductor refrigeration plate is electrically connected to a second DC power supply.

[0012] Preferably, a heat-conducting copper sheet is provided below the semiconductor refrigeration sheet, and the heat-conducting copper sheet and the outer sides of the semiconductor refrigeration sheet are coated with heat-conducting silicone grease.

[0013] Preferably, the thermoelectric cooling module further comprises a heat-conducting copper rod, which passes through the thermally conductive silicone grease and is connected to the heat-conducting copper sheet, and the heat-conducting copper rod is connected to the microneedle mold.

[0014] Preferably, the water tank and the thermally conductive copper sheet are both connected to a temperature tester, and the temperature tester is used to detect the water temperature inside the water tank and the temperature on the surface of the thermally conductive copper sheet.

[0015] Therefore, the present invention adopts the above-mentioned ice microneedle manufacturing device based on semiconductor refrigeration sheet, which has the following technical effects: (1) The use of semiconductor refrigeration chips for heat transfer makes it possible to prepare ice microneedles without the need for harsh conditions such as -80°C refrigerators or liquid nitrogen. This provides a more convenient preparation channel and preparation device for most people who need to use ice microneedles, while also ensuring safety, convenience, and environmental friendliness. (2) Compared with fan cooling, the water cooling module reduces the temperature of the equipment through water circulation, avoids local overheating, ensures that the temperature of each part of the equipment is more uniform, and provides a larger heat exchange area, further improving the heat dissipation efficiency; (3) Thermal conductive silicone grease is applied on the contact surface between the copper heat sink and the semiconductor cooling sheet, between the semiconductor cooling sheet and the thermal conductive copper sheet, and between the contact surface between the thermal conductive copper sheet and the thermal conductive copper rod. The thermal conductive silicone grease acts as a heat transfer medium and is moisture-proof, dust-proof, corrosion-proof, and shock-proof.

[0016] The technical solution of the present invention is further described in detail below through the accompanying drawings and embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of an embodiment of an ice microneedle manufacturing device based on a semiconductor refrigeration sheet of the present invention; Figure 2 It is a schematic diagram of a water cooling module of an embodiment of an ice microneedle manufacturing device based on a semiconductor refrigeration sheet of the present invention; Figure 3 It is a schematic diagram of a copper plate heat sink and a thermoelectric cooling module of an embodiment of an ice microneedle manufacturing device based on a semiconductor cooling plate of the present invention.

[0018] Reference numerals 1. Microneedle mold; 2. Thermal copper rod; 3. Thermal copper sheet; 4. Thermal silicone grease; 5. Semiconductor cooling sheet; 6. Copper sheet radiator; 7. Water tank; 8. Water pipe; 9. Water pump; 10. Water cooling plate; 11. Fixed support; 12. Temperature tester; 13. First DC power supply; 14. Second DC power supply. DETAILED DESCRIPTION

[0019] The technical solution of the present invention is further described below through the accompanying drawings and embodiments.

[0020] Unless otherwise defined, the technical terms or scientific terms used in the present invention should be understood by people with ordinary skills in the field to which the present invention belongs. The words "first", "second" and similar words used in the present invention do not indicate any order, quantity or importance, but are only used to distinguish different components. "Include" or "comprise" and similar words mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0021] Embodiment 1 like Figure 1 As shown, an ice microneedle manufacturing device based on a semiconductor refrigeration sheet is sequentially arranged with a thermoelectric refrigeration module, a copper plate radiator 6 and a water cooling module above the microneedle mold 1. After the device is started, the thermoelectric refrigeration module generates low temperature through the Peltier effect and transmits the low temperature to the microneedle mold 1, so that the liquid in the mold freezes into ice microneedles. The heat generated by the thermoelectric refrigeration module during the refrigeration process is absorbed by the copper plate radiator 6 and transferred to the water cooling module, which ensures a continuous heat dissipation effect through water circulation.

[0022] like Figure 2 As shown, a water tank 7 is provided below the water-cooled heat dissipation module. The material used to assemble the water tank 7 is an acrylic plate. The acrylic plate is transparent, has excellent insulation performance, is light in weight, is half lighter than ordinary glass, and bears less load. At the same time, it is not easy to produce moss under working conditions of constant contact with water, which makes it convenient to observe the water flow rate from the outside to the inside and has a good heat dissipation effect. The copper sheet radiator 6 extends into the water tank 7 and extends toward the top of the water tank 7. The copper sheet radiator 6 is in the form of a sheet, and a uniformly distributed rack structure is provided above it to ensure that the water flow can almost completely pass through the heat sink, thereby making the cooling effect more significant.

[0023] The water-cooled heat dissipation module also includes a water pump 9 and a water cooling plate 10. The flow rate of the water pump 9 is 2L / min, which is a small water pump 9. The water pump 9 is electrically connected to the first DC power supply 13, and is used to drive the water pump 9 to pump water out of the water tank 7, which can more effectively ensure that the water in the water tank 7 is always in a flowing state, thereby reducing the temperature around the copper plate radiator 6 and better ensuring the heat dissipation effect. The water cooling plate 10 is a common heat dissipation device. Compared with the traditional air-cooled radiator, the water cooling plate 10 has higher heat dissipation efficiency and lower noise level. The water cooling plate 10 uses heat-conducting materials, including copper or aluminum, which can quickly transfer heat from the device to the water flow, keeping the operating temperature of the device within a low range. The pipe inside the water cooling plate 10 is a serpentine structure, which increases the flow path and residence time of water in the water cooling plate 10, thereby improving the heat dissipation efficiency, and both ends of the water cooling plate 10 are provided with interfaces connected to the water pipe 8. The water tank 7, the water pump 9 and the water cooling plate 10 are all connected by a water pipe 8 to form a closed water circulation system to ensure that the water temperature inside the equipment is evenly distributed.

[0024] The top of the water tank 7 is provided with an opening for maintaining the balance of atmospheric pressure in the water tank 7 and also for facilitating the subsequent measurement of water temperature. The top of the water tank 7 is also provided with a side panel located below the water pump 9 or the water cooling plate 10. The top of the side panel is connected to the water pump 9 or the water cooling plate 10 through an embedded fixed support 11, which strengthens the coordination between the support and the side panel so that the side panel will not shake due to the vibration of the water pump 9. The fixed supports 11 are respectively provided on both sides above the side panel, and the structure is triangular, which has the functions of stability, not easy to shake, and better support.

[0025] like Figure 3 As shown, the semiconductor refrigeration sheet 5 of the thermoelectric refrigeration module is directly connected to the copper plate radiator 6, so that the heat generated by the semiconductor refrigeration sheet 5 is transferred through the copper plate radiator 6, so that the temperature difference that the semiconductor refrigeration sheet 5 can produce is larger, so the prepared ice microneedle temperature is lower and the effect is better. Since the semiconductor refrigeration sheet 5 does not require any refrigerant, it can work continuously, there is no pollution source and no rotating parts, and no rotation effect will be produced. At the same time, the semiconductor refrigeration sheet 5 is a current transducer type sheet. The semiconductor refrigeration sheet 5 is electrically connected to the second DC power supply 14. Through the control of the input current, high-precision temperature control can be achieved. In addition, temperature detection and control means can be added to realize remote control, program control, and computer control, which is convenient for forming an automatic control system. In addition, the thermal inertia of the semiconductor refrigeration sheet 5 is very small, and the cooling and heating time is very fast. When the hot end has good heat dissipation and the cold end is unloaded, the refrigeration sheet can reach the maximum temperature difference in less than one minute after power-on.

[0026] A thermally conductive copper sheet 3 is provided under the semiconductor refrigeration sheet 5. The thermally conductive silicone grease 4 is a highly thermally conductive insulating silicone material that almost never solidifies and can maintain a grease state during use for a long time at a temperature of -50°C to 230°C. The outer sides of the thermally conductive copper sheet 3 and the semiconductor refrigeration sheet 5 are coated with the thermally conductive silicone grease 4, which can ensure that most of the heat on the semiconductor refrigeration sheet 5 is transferred to the thermally conductive copper sheet 3.

[0027] The ice microneedle manufacturing device also includes a heat-conducting copper rod 2, which passes through the heat-conducting silicone grease 4 and is connected to the heat-conducting copper sheet 3, so that the heat transferred from the semiconductor cooling sheet 5 by the heat-conducting copper sheet 3 can continue to be transferred to the copper rod. The heat-conducting copper rod 2 is connected to the microneedle mold 1, so as to eventually transfer heat to the solution in the microneedle mold 1, providing the microneedle mold 1 with an environment for preparing the required ice microneedles.

[0028] The water tank 7 and the heat-conducting copper sheet 3 are both connected to a temperature tester 12 , and the temperature tester 12 is used to detect the water temperature inside the water tank 7 and the surface temperature of the heat-conducting copper sheet 3 .

[0029] Working principle: First, after the water tank 7 is assembled, fix the water pump 9 and the water cooling plate 10 on the fixed support 11 above the water tank 7, connect the water pipe 8 between the water tank 7, the water pump 9 and the water cooling plate 10, and then fix the triangular fixed support 11 of the side plate to fix the entire water tank 7. Secondly, apply thermal grease 4 on the contact surface of the semiconductor cooling sheet 5 and the copper radiator 6. When pasting, rotate the semiconductor cooling sheet 5 clockwise for several circles, and then rotate it counterclockwise for several circles to ensure the uniformity of the thermal grease 4 on the contact surface and the good contact between the copper radiator 6 and the semiconductor cooling sheet 5. Apply a thick layer of thermal grease 4 around the thermal conductive copper sheet 3, leaving an area of ​​the corresponding size of the cross section of the thermal conductive copper rod 2 in the middle, and then apply a thin layer of thermal grease 4. Then, the water pump 9 is connected to the first DC power supply 13, the voltage is adjusted to 12V, the current is adjusted to 3.6A, and the semiconductor cooling sheet 5 is connected to the second DC power supply 14, the voltage is adjusted to 12V, and the current is adjusted to 5A. Finally, take the prepared solution and use the thermal conductive copper rod 2 to contact the solution with the thermal conductive copper sheet 3, press the switches of the first DC power supply 13 and the second DC power supply 14, and the ice microneedles can be prepared in about 15 minutes. Observe the prepared ice microneedles under a microscope, and you can find that the ice microneedles are completely melted in about 3 minutes, which can be better used in future medical or beauty fields.

[0030] Therefore, the present invention adopts the above-mentioned ice microneedle manufacturing device based on semiconductor refrigeration sheet, which overcomes the difficulty of preparing ice microneedles under harsh conditions, can prepare ice microneedles more conveniently and effectively, and has considerable application prospects.

[0031] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that they can still modify or replace the technical solution of the present invention with equivalents, and these modifications or equivalent replacements cannot cause the modified technical solution to deviate from the spirit and scope of the technical solution of the present invention.

Claims

1. An ice microneedle manufacturing device based on a semiconductor refrigeration sheet, characterized in that: A thermoelectric cooling module, a copper plate radiator and a water-cooling heat dissipation module are sequentially arranged above the microneedle mold, a water tank is arranged below the water-cooling heat dissipation module, the copper plate radiator extends into the water tank and extends toward the top of the water tank, and the semiconductor cooling plate of the thermoelectric cooling module is directly connected to the copper plate radiator.

2. The ice microneedle manufacturing device based on semiconductor refrigeration sheet according to claim 1 is characterized in that: The water-cooling heat dissipation module also includes a water pump and a water cooling plate, and the water pump is electrically connected to the first DC power supply.

3. The ice microneedle manufacturing device based on semiconductor refrigeration sheet according to claim 2 is characterized in that: The water tank, the water pump and the water cooling plate are all connected via water pipes. The pipes inside the water cooling plate are in a serpentine structure, and both ends of the pipes are provided with interfaces connected to the water pipes.

4. The ice microneedle manufacturing device based on semiconductor refrigeration sheet according to claim 2 is characterized in that: The water tank is provided with an opening at the top and a side plate located below the water pump or the water cooling plate. The tops of the side plates are connected to the water pump or the water cooling plate via embedded fixing supports.

5. The ice microneedle manufacturing device based on semiconductor refrigeration sheet according to claim 4 is characterized in that: The fixed supports are respectively arranged on both sides above the side plates.

6. The ice microneedle manufacturing device based on semiconductor refrigeration sheet according to claim 1 is characterized in that: The copper sheet heat sink is in sheet shape, and a uniformly distributed rack structure is arranged on the top of the copper sheet heat sink.

7. The ice microneedle manufacturing device based on semiconductor refrigeration sheet according to claim 1 is characterized in that: The semiconductor refrigeration plate is electrically connected to the second DC power supply.

8. The ice microneedle manufacturing device based on semiconductor refrigeration sheet according to claim 1, characterized in that: A heat-conducting copper sheet is provided below the semiconductor cooling sheet, and the heat-conducting copper sheet and the outer sides of the semiconductor cooling sheet are both coated with heat-conducting silicone grease.

9. The ice microneedle manufacturing device based on semiconductor refrigeration sheet according to claim 8, characterized in that: The thermoelectric cooling module also includes a heat-conducting copper rod, which passes through the heat-conducting silicone grease and is connected to the heat-conducting copper sheet. The heat-conducting copper rod is connected to the microneedle mold.

10. The ice microneedle manufacturing device based on semiconductor refrigeration sheet according to claim 8, characterized in that: The water tank and the heat-conducting copper sheet are both connected to a temperature tester, and the temperature tester is used to detect the water temperature inside the water tank and the temperature on the surface of the heat-conducting copper sheet.

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