Chopper processing device and chopper processing method
By designing a splittering device including multiple rotating components, the central line of the inner hole of the knife split -cutting knife and the high -precision heavy coincidence of the first axis solves the problem of insufficient concentric splitting the knife in traditional crafts, improves production efficiency and product products quality.
Patent Information
- Application Number
- CN202411714965.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-27
- Publication Date
- 2025-01-21
AI Technical Summary
The traditional cutting knife processing technology cannot guarantee the concentricity of the inner hole and the handle of the cutting knife, and cannot meet the strict requirements of semiconductor packaging for the cutting knife concentricity, resulting in low production efficiency and high cost.
Design a riving knife processing device that includes a first rotating component, a second rotating component and a third rotating component. By accurately positioning and assembling these components, high-precision coincidence of the center line of the inner hole of the riving knife with the first axis is achieved, ensuring that after processing The center of the circle on the cross-section of the riving knife and the center line of the inner hole have extremely high concentricity.
It improves the concentricity of the center line of the inner hole of the knife and the first axis, meets the strict requirements of high -end semiconductor packaging on concentricity, reduces human errors, improves the consistency and stability of production, and improves the rate of good products and production efficiency.
Smart Images

Figure CN119328239A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of semiconductor technology, and in particular to a wedge processing device and a wedge processing method. Background Art
[0002] Wire bonding is an important process in semiconductor packaging, and the chopper is a key consumable in the process. The chopper is a crucial consumable in the field of semiconductor packaging, and is mainly used for wire bonding welding of gold wires, silver wires and alloy wires in the IC packaging process. The processing quality of the chopper directly affects the reliability of the packaging process and the performance of the product, so extremely high requirements are placed on its processing accuracy. At present, the production process of the chopper is relatively long, the level of automation is relatively low, and it mainly relies on experienced employees for manual or semi-automatic production, which inevitably leads to low production efficiency and high production costs of the chopper.
[0003] The usage characteristics of the splitting knife require that its key parameters Tip, FA and OR must be highly concentric with the inner hole H, and the concentricity is generally required to be ≤3μm, while the concentricity requirement with the handle is relatively loose, and the concentricity is generally required to be ≤15μm. However, in the manufacturing process of traditional splitting knife blanks, the concentricity of the inner hole and the handle of the splitting knife blank cannot be guaranteed, and usually only the concentricity requirement of ≤15μm can be met. Traditional splitting knife processing usually adopts the method of clamping the handle and processing it through grinding wheel forming grinding or tool grinding. Therefore, the handle is inevitably used as the reference surface for processing. In this way, only the concentricity of the processing size and the handle can be controlled, but the concentricity of the processing size and the inner hole cannot be controlled, and the concentricity requirements of the key dimensions of the splitting knife cannot be met.
[0004] BACKGROUND OF THE INVENTION The above information disclosed is only for understanding the background of the inventive concept and may contain information that does not constitute the prior art. Summary of the invention
[0005] Based on this, it is necessary to provide a chopping knife processing device and a chopping knife processing method to address the above problems.
[0006] The present application provides a riving knife processing device, which includes:
[0007] a first rotating assembly, the first rotating assembly being rotatable about a first axis;
[0008] A second rotating assembly, provided on the first rotating assembly, the second rotating assembly being capable of rotating around a second axis;
[0009] a third rotating assembly, provided on the second rotating assembly, the third rotating assembly being capable of rotating around a third axis, the third rotating assembly being used to fix a riving knife, the riving knife being provided with an inner hole, the center line of the inner hole being parallel to the first axis, the second axis and the third axis, and the distance between the first axis and the second axis being equal to the distance between the second axis and the third axis;
[0010] The third rotating assembly can drive the riving cutter to rotate around the third axis until the distance between the center line of the inner hole and the second axis is equal to the distance between the second axis and the third axis, and then the second rotating assembly can drive the riving cutter to rotate around the second axis so that the center line of the inner hole coincides with the first axis.
[0011] The above-mentioned splitting knife processing device can achieve at least the following beneficial effects:
[0012] After the splitter is mounted on the third rotating assembly and the center line of the inner hole of the splitter is parallel to the third axis, subsequent adjustments can be made. It should be noted that because the semiconductor field has extremely high requirements for precision, the size of the splitter itself is very small, and the inner hole opened on it is even smaller, so for the splitter itself, the inner hole on it may be an eccentric hole, that is, the opening position of the inner hole on the splitter may not be at the exact center of the splitter.
[0013] It should be emphasized that when the second rotating component rotates around the second axis, the third axis of the third rotating component connected to the second rotating component will also rotate around the second axis. Since the distance between the first axis and the second axis is equal to the distance between the second axis and the third axis, it means that the rotation stroke of the third axis around the second axis will inevitably overlap with the first axis, that is, the first axis must be located on the rotation stroke of the third axis around the second axis.
[0014] Therefore, it is necessary to first use the third rotating assembly to drive the splitter to rotate around the third axis until the distance between the center line of the inner hole on the splitter and the second axis is equal to the distance between the second axis and the third axis. In other words, this is to move the center line of the inner hole of the splitter to the rotation stroke of the third axis around the second axis. Then, the second rotating assembly can be used to drive the splitter to rotate around the second axis, that is, the center line of the inner hole of the splitter moves on the rotation stroke of the third axis around the second axis. As mentioned above, the first axis must be located on the rotation stroke of the third axis around the second axis. Then, the center line of the inner hole of the splitter can eventually overlap with the first axis, that is, the center line of the inner hole can eventually have a very high degree of coincidence with the first axis. When the center line of the inner hole of the splitter completes the final adjustment and coincides with the first axis, the first rotating assembly can be started. At this time, the first rotating assembly can drive the splitter to rotate around the first axis, so that the outer peripheral surface of the splitter is cut off. Since the splitter is positioned with the center line of its inner hole as a reference, the center of the circle on the cross section of the processed splitter can have a very high degree of concentricity with the center line of the inner hole.
[0015] The first rotating assembly, the second rotating assembly and the third rotating assembly of the splitting knife processing device are mechanical mechanisms that have been precisely positioned and assembled, and the relative positions of the first axis, the second axis and the third axis are also accurate, which can greatly improve the concentricity of the center line of the inner hole of the adjusted splitting knife with the first axis, meet the strict requirements of high-end semiconductor packaging on the concentricity of the splitting knife, and ensure the consistency and stability of each adjustment, reduce human errors, improve the consistency and stability of production, and improve the yield rate and production efficiency.
[0016] In one embodiment, the splitting knife processing device further includes a cutting member, and when the center line of the inner hole coincides with the first axis, the first rotating assembly can drive the splitting knife to rotate around the first axis, and the cutting member is used to cut the outer peripheral surface of the splitting knife. By setting the cutting member, when the center line of the inner hole of the splitting knife coincides with the first axis, the first rotating assembly drives the splitting knife to rotate around the first axis, so that the cutting member can accurately cut the outer peripheral surface of the splitting knife. Since the cutting process is based on the center line of the inner hole, it is ensured that the center of the circle on the cross section of the splitting knife has extremely high concentricity with the center line of the inner hole, meeting the high precision requirements.
[0017] In one embodiment, the splitting knife processing device further includes a visual recognition component, which is used to identify the positions of the first axis, the second axis, the third axis and the center line. The visual recognition component includes but is not limited to a CCD camera (i.e., Charge-Coupled Device Camera). The visual recognition component can recognize and monitor the positions of the first axis, the second axis, the third axis and the center line of the inner hole of the splitting knife in real time, and ensure the precise positioning of each axis and center line through a visual feedback system, thereby greatly improving the centering accuracy and processing accuracy of the splitting knife. The visual recognition component can provide real-time data, so that the system can automatically adjust the position and angle of each rotating component to ensure that the center line of the inner hole of the splitting knife is accurately aligned with the first axis, the second axis and the third axis, simplifying the operation process and reducing manual intervention. Through the high-precision positioning and real-time monitoring of the visual recognition component, it is ensured that the splitting knife is always in the best position during the processing process, further improving the concentricity of the center line of the inner hole and the center of the cross-section of the splitting knife after processing, and meeting the high-precision requirements in the semiconductor field. The visual recognition component can automatically identify and correct positioning errors, reduce errors that may occur during manual operation, and improve processing consistency and stability. The automated visual recognition and positioning system also makes the adjustment and processing process smoother and more efficient, reducing debugging time and manual operation steps, and significantly improving production efficiency. In addition, the visual recognition component can also adapt to different sizes and shapes of splitting knives, ensuring accurate processing of various types of splitting knives through real-time recognition and adjustment, increasing the adaptability and flexibility of the device.
[0018] In one embodiment, the distance between the first axis and the second axis is 50 mm-200 mm.
[0019] In one embodiment, the distance between the second axis and the third axis is 50 mm-200 mm.
[0020] In one embodiment, the first rotating assembly includes a first driving member and a first rotating disk, the first rotating disk is connected to the first driving member and can rotate around a first axis under the drive of the first driving member, and the second rotating assembly is arranged on the first rotating disk. By arranging the second rotating assembly on the first rotating disk, the first rotating disk is driven by the first driving member to rotate around the first axis, thereby ensuring the stability and coordination of the entire system, and avoiding vibration and instability caused by the independent operation of multiple components. Since the second rotating assembly is arranged on the first rotating disk, the first driving member can accurately control the rotation of the first rotating disk, realize synchronous control of the second rotating assembly, and ensure high precision of the riving knife during centering and positioning.
[0021] In one embodiment, the second rotating component includes a second driving member and a second turntable provided on the first turntable, the second turntable is connected to the second driving member and can rotate around a second axis driven by the second driving member, and the third rotating component is provided on the second turntable.
[0022] In one embodiment, the third rotating assembly includes a third driving member and a clamp provided on the second turntable, the clamp is connected to the third driving member and can rotate around a third axis under the drive of the third driving member, and the clamp is used to clamp the riving knife.
[0023] In one embodiment, the first turntable and the second turntable are stacked and spaced apart, the second driving member is disposed between the first turntable and the second turntable, and the first driving member is disposed on the side of the first turntable facing away from the second driving member. By stacking and spacing the first turntable and the second turntable and arranging the second driving member between the two, the structure of the entire device is made more compact, space is saved, and it is conducive to the miniaturization design of the equipment. In addition, the first driving member and the second driving member are respectively disposed on opposite sides of the first turntable, which can avoid interference that may occur when the second turntable and the first driving member are located on the same side, and avoid interfering with the rotation of the second turntable around the second axis.
[0024] In one embodiment, the first rotating disk and the second rotating disk are both in the shape of a disk and have the same radius, the second axis coincides with the periphery of the first rotating disk, and the third axis coincides with the periphery of the second rotating disk. Since the first rotating disk and the second rotating disk are both in the shape of a disk and have the same radius, and the distance between the first axis and the second axis is equal to the distance between the second axis and the third axis, the third axis must be located on the periphery of the second rotating disk. In other words, the periphery of the second rotating disk coincides with the rotation stroke of the third axis around the second axis. Therefore, when the riving knife rotates around the third axis driven by the third rotating assembly, the center line of the inner hole can be easily and intuitively coincided with the periphery of the second rotating disk, thereby reducing the difficulty of positioning and adjusting the center line of the inner hole of the riving knife and improving the final adjustment accuracy. It can be understood that the center line of the inner hole coincides with the periphery of the second rotating disk, that is, the distance between the center line of the inner hole and the second axis is equal to the distance between the second axis and the third axis, that is, the center line of the inner hole is located on the rotation stroke of the third axis around the second axis.
[0025] The present application also provides a method for processing a cleaver, which is based on the cleaver processing device described in any of the above embodiments, and the method for processing a cleaver comprises the following steps:
[0026] Mounting a riving knife on the third rotating assembly;
[0027] The riving cutter is driven to rotate around the third axis by the third rotating assembly until the distance between the center line of the inner hole and the second axis is equal to the distance between the second axis and the third axis;
[0028] The second rotating assembly drives the splitter to rotate around the second axis until the center line of the inner hole coincides with the first axis;
[0029] The first rotating assembly drives the riving cutter to rotate about the first axis so that the outer peripheral surface of the riving cutter is cut.
[0030] The above-mentioned processing method of the splitting knife can at least achieve the following beneficial effects:
[0031] After the splitter is mounted on the third rotating assembly and the center line of the inner hole of the splitter is parallel to the third axis, subsequent adjustments can be made. It should be noted that because the semiconductor field has extremely high requirements for precision, the size of the splitter itself is very small, and the inner hole opened on it is even smaller, so for the splitter itself, the inner hole on it may be an eccentric hole, that is, the opening position of the inner hole on the splitter may not be at the exact center of the splitter.
[0032] It should be emphasized that when the second rotating component rotates around the second axis, the third axis of the third rotating component connected to the second rotating component will also rotate around the second axis. Since the distance between the first axis and the second axis is equal to the distance between the second axis and the third axis, it means that the rotation stroke of the third axis around the second axis will inevitably overlap with the first axis, that is, the first axis must be located on the rotation stroke of the third axis around the second axis.
[0033] Therefore, it is necessary to first use the third rotating assembly to drive the splitter to rotate around the third axis until the distance between the center line of the inner hole on the splitter and the second axis is equal to the distance between the second axis and the third axis. In other words, this is to move the center line of the inner hole of the splitter to the rotation stroke of the third axis around the second axis. Then, the second rotating assembly can be used to drive the splitter to rotate around the second axis, that is, the center line of the inner hole of the splitter moves on the rotation stroke of the third axis around the second axis. As mentioned above, the first axis must be located on the rotation stroke of the third axis around the second axis. Then, the center line of the inner hole of the splitter can eventually overlap with the first axis, that is, the center line of the inner hole can eventually have a very high degree of coincidence with the first axis. When the center line of the inner hole of the splitter completes the final adjustment and coincides with the first axis, the first rotating assembly can be started. At this time, the first rotating assembly can drive the splitter to rotate around the first axis, so that the outer peripheral surface of the splitter is cut off. Since the splitter is positioned with the center line of its inner hole as a reference, the center of the circle on the cross section of the processed splitter can have a very high degree of concentricity with the center line of the inner hole. BRIEF DESCRIPTION OF THE DRAWINGS
[0034] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the conventional technology, the drawings required for use in the embodiments or the conventional technology descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.
[0035] Figure 1 A schematic structural diagram of a splitting knife processing device provided in one embodiment of the present invention, wherein the splitting knife is not adjusted.
[0036] Figure 2 Another structural schematic diagram of a splitting knife processing device provided by an embodiment of the present invention, in which the splitting knife has been adjusted.
[0037] Figure 3 A cross-sectional view of a riving knife processing device provided in one embodiment of the present invention, in which the adjustment of the riving knife has been completed.
[0038] Figure 4 A schematic diagram of a first axis, a second axis, a third axis, and a center line is provided for one embodiment of the present invention, without adjusting the wedge.
[0039] Figure 5 A schematic diagram of a first axis, a second axis, a third axis, and a center line is provided for an embodiment of the present invention, which shows the process in which the center line of the inner hole of the riving cutter is being adjusted, and the distance between the center line and the second axis is equal to the distance between the second axis and the third axis.
[0040] Figure 6 A schematic diagram of a first axis, a second axis, a third axis, and a center line is provided for an embodiment of the present invention. The adjustment of the wedge has been completed and the center line coincides with the first axis.
[0041] Figure 7 A schematic flow chart of a method for processing a riving knife provided in one embodiment of the present invention.
[0042] Reference numerals:
[0043] 10. Chopping knife processing device; 100. First rotating assembly; 110. First driving member; 120. First turntable; 200. Second rotating assembly; 210. Second driving member; 220. Second turntable; 300. Third rotating assembly; 310. Third driving member; 320. Clamp; 400. Chopping knife; 410. Inner hole; A1. First axis; A2. Second axis; A3. Third axis; A4. Center line. DETAILED DESCRIPTION
[0044] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.
[0045] See also Figures 1 to 6 In some embodiments, the present invention provides a cleaver processing device 10, which includes a first rotating component 100, a second rotating component 200 and a third rotating component 300. The first rotating component 100 can rotate around a first axis A1; the second rotating component 200 is arranged on the first rotating component 100, and the second rotating component 200 can rotate around a second axis A2; the third rotating component 300 is arranged on the second rotating component 200, and the third rotating component 300 can rotate around a third axis A3, and the third rotating component 300 is used to fix the cleaver 400. An inner hole 410 is provided on the cleaver 400, and a center line A4 of the inner hole 410 is parallel to the first axis A1, the second axis A2, and the third axis A3, and a distance D (A1-A2) between the first axis A1 and the second axis A2 is equal to a distance D (A2-A3) between the second axis A2 and the third axis A3. Figure 5 As shown, the third rotating assembly 300 can drive the riving knife 400 to rotate around the third axis A3 until the distance D (A2-A4) between the center line A4 of the inner hole 410 and the second axis A2 is equal to the distance D (A2-A3) between the second axis A2 and the third axis A3; Figure 6 As shown, the second rotating assembly 200 can then drive the riving knife 400 to rotate around the second axis A2 so that the center line A4 of the inner hole 410 coincides with the first axis A1.
[0046] The above-mentioned cleaver processing device 10 can achieve at least the following beneficial effects:
[0047] like Figure 4 As shown, after the splitting knife 400 is mounted on the third rotating assembly 300 and the center line A4 of the inner hole 410 of the splitting knife 400 is parallel to the third axis A3, subsequent adjustments can be made. It should be noted that, because the semiconductor field has extremely high requirements for precision, the size of the splitting knife 400 itself is very small, and the inner hole 410 opened thereon is even smaller, so for the splitting knife 400 itself, the inner hole 410 thereon may be an eccentric hole, that is, the opening position of the inner hole 410 on the splitting knife 400 may not be at the exact center of the splitting knife 400.
[0048] It should be emphasized that when the second rotating component 200 rotates around the second axis A2, the third axis A3 of the third rotating component 300 connected to the second rotating component 200 will also rotate around the second axis A2. Since the distance D (A1-A2) between the first axis A1 and the second axis A2 is equal to the distance D (A2-A3) between the second axis A2 and the third axis A3, it means that the rotation stroke T of the third axis A3 around the second axis A2 will inevitably overlap with the first axis A1, that is, the first axis A1 must be located on the rotation stroke T of the third axis A3 around the second axis A2.
[0049] Therefore, if Figure 5 As shown, it is necessary to first use the third rotating assembly 300 to drive the riving knife 400 to rotate around the third axis A3 until the distance D (A2-A4) between the center line A4 of the inner hole 410 on the riving knife 400 and the second axis A2 is equal to the distance D (A2-A3) between the second axis A2 and the third axis A3. In other words, this is to move the center line A4 of the inner hole 410 of the riving knife 400 to the rotation stroke T of the third axis A3 around the second axis A2. Then, as Figure 6 As shown, the second rotating assembly 200 can be used to drive the riving knife 400 to rotate around the second axis A2, that is, the center line A4 of the inner hole 410 of the riving knife 400 moves on the rotation stroke T of the third axis A3 around the second axis A2, and the first axis A1 mentioned above must be located on the rotation stroke T of the third axis A3 around the second axis A2, so the center line A4 of the inner hole 410 of the riving knife 400 can eventually overlap with the first axis A1, that is, the center line A4 of the inner hole 410 can eventually have a very high degree of coincidence with the first axis A1. When the center line A4 of the inner hole 410 of the riving knife 400 completes the final adjustment and coincides with the first axis A1, the first rotating assembly 100 can be started, and at this time the first rotating assembly 100 can drive the riving knife 400 to rotate around the first axis A1, so that the outer peripheral surface of the riving knife 400 is cut off. Since the center line A4 of the inner hole 410 of the splitting knife 400 is used as a reference when positioning, the center of the circle on the cross section of the splitting knife 400 after processing and the center line A4 of the inner hole 410 can have a very high concentricity.
[0050] The first rotating assembly 100, the second rotating assembly 200 and the third rotating assembly 300 of the splitting knife processing device 10 are mechanical mechanisms that have been precisely positioned and assembled, so the relative positions of the first axis A1, the second axis A2 and the third axis A3 are also accurate, which can greatly improve the concentricity of the center line A4 of the inner hole 410 of the adjusted splitting knife 400 and the first axis A1, meet the strict requirements of high-end semiconductor packaging on the concentricity of the splitting knife 400, and ensure the consistency and stability of each adjustment, reduce human errors, improve the consistency and stability of production, and improve the yield rate and production efficiency.
[0051] Specifically, in some embodiments, the cleaver processing device 10 further includes a visual recognition component (not shown), which is used to identify the positions of the first axis A1, the second axis A2, the third axis A3 and the center line A4. The visual recognition component includes but is not limited to a CCD camera (i.e., a Charge-Coupled Device Camera). The visual recognition component can recognize and monitor the positions of the first axis A1, the second axis A2, the third axis A3 and the center line A4 of the inner hole 410 of the cleaver 400 in real time, and ensure the precise positioning of each axis and the center line A4 through a visual feedback system, thereby greatly improving the centering accuracy and processing accuracy of the cleaver 400. The visual recognition component can provide real-time data, so that the system can automatically adjust the position and angle of each rotating component to ensure the precise alignment of the center line A4 of the inner hole 410 of the cleaver 400 with the first axis A1, the second axis A2 and the third axis A3, thereby simplifying the operation process and reducing manual intervention. Through the high-precision positioning and real-time monitoring of the visual recognition component, the splitting knife 400 is ensured to be always in the best position during the processing, and the concentricity between the center line A4 of the inner hole 410 and the center of the cross-section of the processed splitting knife 400 is further improved, meeting the high-precision requirements of the semiconductor field. The visual recognition component can automatically identify and correct positioning errors, reduce errors that may occur during manual operation, and improve processing consistency and stability. The automated visual recognition and positioning system also makes the adjustment and processing process smoother and more efficient, reduces debugging time and manual operation steps, and significantly improves production efficiency. In addition, the visual recognition component can also adapt to splitting knives 400 of different sizes and shapes. Through real-time recognition and adjustment, it ensures the precise processing of various types of splitting knives 400, increasing the adaptability and flexibility of the device.
[0052] Specifically, in some embodiments, the splitting knife processing device 10 further includes a cutting member (not shown). When the center line A4 of the inner hole 410 coincides with the first axis A1, the first rotating assembly 100 can drive the splitting knife 400 to rotate around the first axis A1, and the cutting member is used to cut the outer peripheral surface of the splitting knife 400. By providing the cutting member, when the center line A4 of the inner hole 410 of the splitting knife 400 coincides with the first axis A1, the first rotating assembly 100 drives the splitting knife 400 to rotate around the first axis A1, so that the cutting member can accurately cut the outer peripheral surface of the splitting knife 400. Since the cutting process is based on the center line A4 of the inner hole 410, it is ensured that the center of the circle on the cross section of the splitting knife 400 and the center line A4 of the inner hole 410 have extremely high concentricity, meeting the high precision requirement.
[0053] See also Figure 1 , Figure 2 and Figure 3 In some embodiments, the first rotating assembly 100 includes a first driving member 110 and a first rotating disk 120, the first rotating disk 120 is connected to the first driving member 110 and can rotate around the first axis A1 under the drive of the first driving member 110, and the second rotating assembly 200 is arranged on the first rotating disk 120. The first driving member 110 may include but is not limited to a motor. For example, when the first driving member 110 is a motor, its output shaft is fixed to the center of the first rotating disk 120, and the first axis A1 passes through the center of the first rotating disk 120. By arranging the second rotating assembly 200 on the first rotating disk 120, the first rotating disk 120 is driven by the first driving member 110 to rotate around the first axis A1, thereby ensuring the stability and coordination of the entire system and avoiding vibration and instability caused by the independent operation of multiple components. Since the second rotating assembly 200 is disposed on the first rotating disk 120 , the first driving member 110 can accurately control the rotation of the first rotating disk 120 , thereby achieving synchronous control of the second rotating assembly 200 and ensuring high precision of the centering and positioning of the riving knife 400 .
[0054] Specifically, Figure 1 , Figure 2 and Figure 3 As shown, in some embodiments, the second rotating assembly 200 includes a second driving member 210 and a second rotating disk 220 provided on the first rotating disk 120, the second rotating disk 220 is connected to the second driving member 210 and can rotate around the second axis A2 under the drive of the second driving member 210, and the third rotating assembly 300 is provided on the second rotating disk 220. Among them, the second driving member 210 may include but is not limited to a motor. For example, when the second driving member 210 is a motor, its output shaft is fixed to the center of the second rotating disk 220, and the second axis A2 passes through the center of the second rotating disk 220.
[0055] Specifically, Figure 1 , Figure 2 and Figure 3 As shown, in some embodiments, the third rotating assembly 300 includes a third driving member 310 and a clamp 320 provided on the second rotating disk 220, the clamp 320 is connected to the third driving member 310 and can rotate around the third axis A3 under the drive of the third driving member 310, and the clamp 320 is used to clamp the riving knife 400. The third driving member 310 may include but is not limited to a motor. For example, when the third driving member 310 is a motor, the center of its output shaft is the third axis A3, and its output shaft is fixed to the clamp 320.
[0056] Specifically, Figure 1 , Figure 2 and Figure 3 As shown, in some embodiments, the first turntable 120 and the second turntable 220 are stacked and spaced, the second driving member 210 is arranged between the first turntable 120 and the second turntable 220, and the first driving member 110 is arranged on the side of the first turntable 120 that faces away from the second driving member 210. By stacking and spacing the first turntable 120 and the second turntable 220, and arranging the second driving member 210 between the two, the structure of the entire device is more compact, space is saved, and it is conducive to the miniaturization design of the device. In addition, the first driving member 110 and the second driving member 210 are respectively arranged on opposite sides of the first turntable 120, which can avoid the interference that may occur when the second turntable 220 and the first driving member 110 are located on the same side, and avoid interfering with the rotation of the second turntable 220 around the second axis A2.
[0057] Specifically, in some embodiments, the distance between the first axis A1 and the second axis A2 is 50 mm-200 mm, and the distance between the second axis and the third axis is 50 mm-200 mm.
[0058] It should be noted that the designs of the first turntable 120 and the second turntable 220 can be various, as long as the distance D (A1-A2) between the center of the first turntable 120 (i.e., where the first axis A1 is located) and the center of the second turntable 220 (i.e., where the second axis A2 is located) is equal to the distance D (A2-A3) between the center of the second turntable 220 and the third axis A3.
[0059] For example, Figure 1 , Figure 2 and Figure 3As shown, in some embodiments, the first turntable 120 and the second turntable 220 are both in the shape of a disk but have the same radius. The distance between the center of the first turntable 120 (i.e., where the first axis A1 is located) and the center of the second turntable 220 (i.e., where the second axis A2 is located) is equal to the distance between the center of the second turntable 220 and the center of the output shaft of the third drive member 310. This can be considered as the distance between the center of the output shaft of the first drive member 110 and the center of the output shaft of the second drive member 210, which is equal to the distance between the center of the output shaft of the second drive member 210 and the center of the output shaft of the third drive member 310. This can also be considered as the distance D (A1-A2) between the first axis A1 and the second axis A2 is equal to the distance D (A2-A3) between the second axis A2 and the third axis A3.
[0060] For another example, in some other embodiments, the first rotating disk 120 and the second rotating disk 220 are both in the shape of a disk and have the same radius, the second axis A2 coincides with the periphery of the first rotating disk 120, and the third axis A3 coincides with the periphery of the second rotating disk 220. Since the first rotating disk 120 and the second rotating disk 220 are both in the shape of a disk and have the same radius, and the distance D (A1-A2) between the first axis A1 and the second axis A2 is equal to the distance D (A2-A3) between the second axis A2 and the third axis A3, the third axis A3 must be located on the periphery of the second rotating disk 220. In other words, the periphery of the second rotating disk 220 coincides with the rotation stroke T of the third axis A3 around the second axis A2. Therefore, when the riving knife 400 rotates around the third axis A3 driven by the third rotating assembly 300, the center line A4 of the inner hole 410 can be easily and intuitively overlapped with the periphery of the second rotating disk 220, thereby reducing the difficulty of positioning and adjusting the center line A4 of the inner hole 410 of the riving knife 400 and improving the final adjustment accuracy. It can be understood that the center line A4 of the inner hole 410 overlaps with the periphery of the second rotating disk 220, that is, the distance D (A2-A4) between the center line A4 of the inner hole 410 and the second axis A2 is equal to the distance D (A2-A3) between the second axis A2 and the third axis A3, that is, the center line A4 of the inner hole 410 is located on the rotation stroke T of the third axis A3 around the second axis A2.
[0061] In addition, if Figure 7 As shown, the present application also provides a processing method of a cleaver 400, which is based on the cleaver processing device 10 described in any of the above embodiments. The processing method of the cleaver 400 includes the following steps:
[0062] S100, installing the riving knife 400 on the third rotating assembly 300;
[0063] S200, driving the riving knife 400 to rotate around the third axis A3 by the third rotating assembly 300 until the distance D (A2-A4) between the center line A4 of the inner hole 410 and the second axis A2 is equal to the distance D (A2-A3) between the second axis A2 and the third axis A3;
[0064] S300, driving the riving knife 400 to rotate around the second axis A2 by the second rotating assembly 200 until the center line A4 of the inner hole 410 coincides with the first axis A1;
[0065] S400 , driving the riving knife 400 to rotate about the first axis A1 via the first rotating assembly 100 so that the outer peripheral surface of the riving knife 400 is cut.
[0066] The processing method of the above-mentioned riving knife 400 can at least achieve the following beneficial effects:
[0067] After the riving knife 400 is mounted on the third rotating assembly 300 and the center line A4 of the inner hole 410 of the riving knife 400 is parallel to the third axis A3, subsequent adjustments can be performed.
[0068] It should be emphasized that when the second rotating component 200 rotates around the second axis A2, the third axis A3 of the third rotating component 300 connected to the second rotating component 200 will also rotate around the second axis A2. Since the distance D (A1-A2) between the first axis A1 and the second axis A2 is equal to the distance D (A2-A3) between the second axis A2 and the third axis A3, it means that the rotation stroke T of the third axis A3 around the second axis A2 will inevitably overlap with the first axis A1, that is, the first axis A1 must be located on the rotation stroke T of the third axis A3 around the second axis A2.
[0069] Therefore, it is necessary to first use the third rotating assembly 300 to drive the riving knife 400 to rotate around the third axis A3 until the distance D (A2-A4) between the center line A4 of the inner hole 410 on the riving knife 400 and the second axis A2 is equal to the distance D (A2-A3) between the second axis A2 and the third axis A3. In other words, this is to move the center line A4 of the inner hole 410 of the riving knife 400 to the rotation stroke T of the third axis A3 around the second axis A2. Then, the second rotating assembly 200 can be used to drive the riving knife 400 to rotate around the second axis A2, that is, the center line A4 of the inner hole 410 of the riving knife 400 moves on the rotation stroke T of the third axis A3 around the second axis A2, and the first axis A1 mentioned above must be located on the rotation stroke T of the third axis A3 around the second axis A2, so the center line A4 of the inner hole 410 of the riving knife 400 can eventually overlap with the first axis A1, that is, the center line A4 of the inner hole 410 can eventually have a very high degree of coincidence with the first axis A1. When the center line A4 of the inner hole 410 of the riving knife 400 completes the final adjustment and coincides with the first axis A1, the first rotating assembly 100 can be started, and the first rotating assembly 100 can drive the riving knife 400 to rotate around the first axis A1, so that the outer peripheral surface of the riving knife 400 is cut off. Since the center line A4 of the inner hole 410 of the splitting knife 400 is used as a reference when positioning, the center of the circle on the cross section of the splitting knife 400 after processing and the center line A4 of the inner hole 410 can have a very high concentricity.
[0070] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0071] The above-mentioned embodiments only express several implementation methods of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.
[0072] In the description of the present invention, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention.
[0073] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.
[0074] In the present invention, unless otherwise clearly defined and limited, if the terms "installed", "connected", "connected", "fixed" and the like appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0075] In the present invention, unless otherwise clearly specified and limited, if there is a description that a first feature is "above" or "below" a second feature, etc., or the like, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.
[0076] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. If present, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in the present invention are for illustrative purposes only and do not represent the only implementation method.
[0077] In the description of this specification, the description of reference terms "one embodiment", "other implementation methods", etc. means that the specific features, structures, materials or features described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic descriptions of the above terms do not necessarily refer to the same embodiment or example. Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by technicians in the technical field of the present invention. The terms used in the specification of the present invention herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention.
Claims
1. A splitting knife processing device, characterized in that: include: a first rotating assembly, the first rotating assembly being rotatable about a first axis; A second rotating assembly, provided on the first rotating assembly, the second rotating assembly being capable of rotating around a second axis; a third rotating assembly, provided on the second rotating assembly, the third rotating assembly being capable of rotating around a third axis, the third rotating assembly being used to fix a riving knife, the riving knife being provided with an inner hole, the center line of the inner hole being parallel to the first axis, the second axis and the third axis, and the distance between the first axis and the second axis being equal to the distance between the second axis and the third axis; The third rotating assembly can drive the riving cutter to rotate around the third axis until the distance between the center line of the inner hole and the second axis is equal to the distance between the second axis and the third axis, and then the second rotating assembly can drive the riving cutter to rotate around the second axis so that the center line of the inner hole coincides with the first axis.
2. The splitting knife processing device according to claim 1, characterized in that: The first rotating assembly includes a first driving member and a first turntable. The first turntable is connected to the first driving member and can rotate around a first axis under the drive of the first driving member. The second rotating assembly is arranged on the first turntable.
3. The splitting knife processing device according to claim 2, characterized in that: The second rotating assembly includes a second driving member and a second rotating disk provided on the first rotating disk. The second rotating disk is connected to the second driving member and can rotate around a second axis driven by the second driving member. The third rotating assembly is provided on the second rotating disk.
4. The splitting knife processing device according to claim 3, characterized in that: The third rotating assembly includes a third driving member and a clamp provided on the second rotating disk. The clamp is connected to the third driving member and can rotate around a third axis under the drive of the third driving member. The clamp is used to clamp the riving knife.
5. The riving knife processing device according to claim 3, characterized in that: The first turntable and the second turntable are stacked and spaced apart, the second driving member is arranged between the first turntable and the second turntable, and the first driving member is arranged on a side of the first turntable facing away from the second driving member.
6. The riving knife processing device according to claim 3, characterized in that: The first turntable and the second turntable are both in a disc shape and have the same radius. The second axis coincides with the periphery of the first turntable, and the third axis coincides with the periphery of the second turntable.
7. The riving knife processing device according to any one of claims 1 to 6, characterized in that: The distance between the first axis and the second axis is 50 mm-200 mm; And / or, the distance between the second axis and the third axis is 50mm-200mm.
8. The riving knife processing device according to any one of claims 1 to 6, characterized in that: The riving knife processing device further includes a visual recognition component, and the visual recognition component is used to identify the positions of the first axis, the second axis, the third axis and the center line.
9. The riving knife processing device according to any one of claims 1 to 6, characterized in that: The splitting knife processing device also includes a cutting piece. When the center line of the inner hole coincides with the first axis, the first rotating assembly can drive the splitting knife to rotate around the first axis. The cutting piece is used to cut the outer peripheral surface of the splitting knife.
10. A method for processing a riving knife, characterized in that: Based on the splitting knife processing device according to any one of claims 1 to 9, the splitting knife processing method comprises the following steps: Mounting a riving knife on the third rotating assembly; The riving cutter is driven to rotate around the third axis by the third rotating assembly until the distance between the center line of the inner hole and the second axis is equal to the distance between the second axis and the third axis; The second rotating assembly drives the splitter to rotate around the second axis until the center line of the inner hole coincides with the first axis; The first rotating assembly drives the riving cutter to rotate about the first axis so that the outer peripheral surface of the riving cutter is cut.
Citation Information
Patent Citations
Grinding device for chamfering inner hole of ceramic chopper
CN114536126A
Semiconductor wedge-shaped chopper and production and processing equipment thereof
CN115020255A
Chopping knife and grinding process
CN117984164A
Rotation multistation wood splitting machine
CN205997108U
End surface polishing machine
US5516328A