Apparatus and method for welding electronic components and manufacturing light emitting diode display
By using a suppressed airflow generating mechanism to flatten the substrate during the substrate transfer process, combined with the use of energy beams, the problems of substrate flatness and fit are solved, and the process yield is significantly improved.
Patent Information
- Application Number
- CN202410462103.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2023-07-10
- Filing Date
- 2024-04-17
- Publication Date
- 2025-01-21
AI Technical Summary
During the transfer of electronic components, light emitting diodes or micro-light emitting diodes from one substrate to another, whether the substrate is bonded and the substrate flatness affect the yield of the transfer process.
A device including a carrying platform and a suppressed airflow generating mechanism is used to generate suppressed airflow through an airflow guide channel to level the substrate, and combined with the use of energy beams, tight welding of electronic components is achieved.
It effectively improves the process yield and ensures the flatness and tight fit of the substrate, thus improving the success rate of electronic component transfer and welding.
Smart Images
Figure CN119328252A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to a device for locally leveling a substrate, equipment for welding electronic components, a method for welding electronic components and a method for manufacturing a light emitting diode display. Background Art
[0002] With the development of the technology of electronic components (such as microelectronic components, light emitting diodes or micro light emitting diodes), a process of transferring electronic components, light emitting diodes or micro light emitting diodes in large quantities from one substrate to another substrate has been developed, which is conducive to the mass production of electronic components.
[0003] However, in the process of transferring electronic components, LEDs or micro LEDs from one substrate to another, the two substrates need to be placed face to face, and then laser processing is used to transfer the electronic components, LEDs or micro LEDs. At this time, whether the two substrates are bonded and whether the substrates remain flat during laser processing is crucial to the yield of the transfer process. Summary of the invention
[0004] The present invention is directed to a device for locally leveling a substrate, which can effectively improve the process yield.
[0005] The present invention is directed to a device for welding electronic components, which can effectively improve the process yield.
[0006] The present invention is directed to a method for welding electronic components, which can effectively improve the process yield.
[0007] The present invention is directed to a method for manufacturing a light emitting diode display, which can effectively improve the process yield.
[0008] One embodiment of the present invention proposes a device for locally leveling a substrate, which includes a carrier platform and a suppressed airflow generating mechanism. The carrier platform has a carrier plane, and the carrier platform is used to carry the substrate to be leveled on the carrier plane. The suppressed airflow generating mechanism includes a main body, a driver and an air pump. The main body is provided with an airflow guiding channel thereon, and the driver can drive the main body to move along the carrier plane relative to the carrier platform. The air pump can provide an airflow guiding channel for airflow to the main body. Among them, the airflow guiding channel can guide the airflow provided by the air pump to between the main body and the carrier platform, float the main body, and generate a suppressed airflow between the main body and the carrier platform.
[0009] One embodiment of the present invention provides an apparatus for soldering electronic components, which includes the above-mentioned device for locally flattening a substrate and an energy generating mechanism. The energy generating mechanism is disposed adjacent to the carrier of the device for locally flattening a substrate, and is used to generate an energy beam that passes through a pressing airflow and is directed toward the carrier.
[0010] One embodiment of the present invention provides a method for welding electronic components, which includes: providing a transfer substrate, having an electronic component to be welded on one surface of the transfer substrate; providing a target substrate, wherein the target substrate includes a welding surface; making the welding surface of the target substrate face the surface of the transfer substrate having the electronic component to be welded, and making the electronic component to be welded contact with the welding surface of the target substrate; applying a compressed airflow on the surface of the transfer substrate where the electronic component to be welded is not provided or on the surface of the target substrate opposite to the welding surface, at a position relative to the electronic component to be welded; and applying an energy beam to weld the electronic component to be welded on the transfer substrate to the target substrate through the compressed airflow.
[0011] An embodiment of the present invention provides a method for manufacturing a light emitting diode display, comprising soldering a light emitting diode chip to a target substrate using the above-mentioned method for soldering electronic components.
[0012] In the device for locally leveling a substrate and the equipment for welding electronic components of the embodiments of the present invention, since the compressed airflow generating mechanism uses an air pump to provide airflow to the airflow guiding channel of the main body, and the airflow guiding channel can guide the airflow provided by the air pump to between the main body and the carrier, float the main body, and generate compressed airflow between the main body and the carrier, the substrate can be leveled, thereby effectively improving the process yield. In the method for welding electronic components and the method for manufacturing a light-emitting diode display of the embodiments of the present invention, since the compressed airflow is applied on the surface of the transfer substrate where the electronic components to be welded are not provided or on the surface of the target substrate relative to the welding surface, relative to the position of the electronic components to be welded, the transfer substrate and the target substrate can be closely attached when the energy beam is applied, thereby effectively improving the process yield. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] Figure 1 FIG. 4 is a cross-sectional schematic diagram of an apparatus for soldering electronic components according to an embodiment of the present invention.
[0014] Figure 2 To illustrate Figure 1 A schematic top view of the path of movement of the energy generating mechanism relative to the supporting platform.
[0015] Figure 3A and Figure 3B A cross-sectional schematic diagram is shown of two steps in the process of a method for soldering electronic components according to an embodiment of the present invention. DETAILED DESCRIPTION
[0016] Reference will now be made in detail to exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Whenever possible, the same reference numerals are used in the drawings and the description to refer to the same or like parts.
[0017] Figure 1FIG. 1 is a cross-sectional schematic diagram of an apparatus for soldering electronic components according to an embodiment of the present invention. Figure 1 , the equipment 100 for soldering electronic components of this embodiment includes a device 200 for locally flattening a substrate and an energy generating mechanism 110. The device 200 for locally flattening a substrate includes a carrier 210 and a compressed airflow generating mechanism 300. The carrier 210 has a carrier plane 212. In this embodiment, the carrier plane 212 is, for example, the upper surface of the carrier 210. The carrier 210 is used to carry a substrate 50 to be flattened on the carrier plane 212. In this embodiment, the substrate 50 to be flattened includes a combination of a transfer substrate 52 on which electronic components 60 to be soldered are carried and a target substrate 54. In one embodiment, the transfer substrate 52 is, for example, a temporary substrate, and the target substrate 54 is, for example, a circuit substrate. In this embodiment, there are a plurality of electronic components 60 to be soldered on the transfer substrate 52, and Figure 1 An electronic component 60 is shown in the enlarged view as an example.
[0018] The compressed air flow generating mechanism 300 includes a body 310, a driver 320, and an air pump 330. The body 310 is provided with an air flow guiding channel 312 thereon, and the driver 320 can drive the body 310 to move relative to the carrier 210 along the carrier plane 212. For example, the driver 320 can drive the carrier 210 or the body 310, so that the body 310 moves relative to the carrier 210 along the carrier plane 212. In this embodiment, the driver 320 is, for example, a motor or other appropriate actuator.
[0019] The air pump 330 can provide an airflow 332 to the airflow guiding channel 312 of the body 310. The airflow guiding channel 312 can guide the airflow 332 provided by the air pump 330 to between the body 310 and the carrier 210, float the body 310, and generate a compressed airflow 334 between the body 310 and the carrier 210.
[0020] The energy generating mechanism 110 is disposed adjacent to the carrier 210 of the device 200 for locally flattening a substrate, and is used to generate an energy beam 112 that passes through the pressing airflow and is emitted toward the carrier 210. In the present embodiment, the energy beam 112 is a laser beam, and the energy generating mechanism 110 is, for example, a laser source. In addition, in the present embodiment, the body 310 includes an optical channel 314 penetrating therein, and the energy beam 112 generated by the energy generating mechanism 110 can be guided to the direction of the pressing airflow 334 and emitted toward the carrier 210 through the optical channel 314. In the present embodiment, a light-transmitting plate 350 (for example, a quartz plate) can be provided at the top of the body 310 (i.e., the top of the optical channel 314), and the energy beam 112 passes through the light-transmitting plate 350 and enters the light channel 314. The light-transmitting plate 350 can seal the top of the airflow guiding channel 312 to facilitate the generation of the pressing airflow 334.
[0021] Specifically, in one embodiment, the electronic component 60 to be welded can be attached to the transfer substrate 52 by the adhesive layer 53, and the electronic component 60 has an electrode 62. In addition, the target substrate 54 has a pad 55, and the pad 55 can be provided with a solder 56. The energy beam 112 can be irradiated on the solder 56 to melt the solder 56. At this time, the electrode 62 is aligned with the pad 55, so when the solder 56 is cooled and solidified, the electrode 62 and the pad 55 can be bonded. At this time, the bonding force between the solder 56 and the electrode 62 is greater than the bonding force between the adhesive layer 53 and the electronic component 60, so when the transfer substrate 52 and the target substrate 54 are separated, the electronic component 60 will remain on the target substrate 54 and be separated from the transfer substrate 52. In this way, the electronic component 60 can be transferred from the transfer substrate 52 to the target substrate 54. In this embodiment, the electronic component 60 to be welded is, for example, a light emitting diode chip or other electronic components.
[0022] In the device 200 for locally leveling a substrate and the equipment 100 for soldering electronic components of the present embodiment, since the compressed airflow generating mechanism 200 uses the air pump 330 to provide the airflow 332 to the airflow guiding channel 312 of the body 310, and the airflow guiding channel 312 can guide the airflow 332 provided by the air pump 330 to between the body 310 and the carrier 210, the body 310 is air-floated, and a compressed airflow 334 is generated between the body 310 and the carrier 210, so that the substrate 50 can be leveled. In this way, when the energy beam 112 is used for processing, the transfer substrate 52 can be closely attached to the target substrate 54, thereby effectively improving the process yield. In addition, the body 310 is air-floated on the carrier 210 to achieve the effect of local pressure equalization, so as to improve the yield of the transferred electronic components 60.
[0023] In this embodiment, the body 310 may include another airflow guiding channel 316 and another air pump 340. The airflow guiding channel 316 is next to the airflow guiding channel 312 and will not be passed by the energy beam 112. The air pump 340 can provide an airflow 342, and the airflow 342 can be guided and applied to the substrate 50 or the carrier 210 to increase the effect of the air floating body 310. However, in other embodiments, the body 310 may not include the airflow guiding channel 316, and the air pump 340 may not be used.
[0024] Figure 2 To illustrate Figure 1 A top view of the path of movement of the energy generating mechanism relative to the carrier platform. Figure 1 and Figure 2 The energy generating mechanism 110 can move relative to the carrier 210, and the body 310 also moves with the energy generating mechanism 110 relative to the carrier 210, so that the energy beam 112 can process the multiple electronic components 60 on the substrate 50 in sequence, for example, Figure 2 In one embodiment, the carrier 210 can move relative to the energy generating mechanism 110. In this embodiment, the light-transmitting plate 350 (such as a quartz plate) only occupies a small area relative to the carrier 210, rather than covering most of the area of the carrier 210, which can effectively reduce costs and has less risk of quartz plate breakage.
[0025] Figure 3A and Figure 3B A cross-sectional schematic diagram showing two steps in the process of a method for soldering electronic components according to an embodiment of the present invention is shown. Figure 3A , Figure 3B and Figure 1 The method for welding electronic components of this embodiment can be used Figure 1 The method of welding electronic components in this embodiment includes the following steps. First, Figure 3A As shown, a transfer substrate 52 is provided, and an electronic component 60 to be soldered is provided on a surface 51 of the transfer substrate 52. In addition, a target substrate 54 is provided, wherein the target substrate 54 includes a soldering surface 57. Then, the soldering surface 57 of the target substrate 54 is made to face the surface 51 of the transfer substrate 52 having the electronic component 60 to be soldered, and the electronic component 60 to be soldered is brought into contact with the soldering surface 57 of the target substrate 54.
[0026] Then, if Figure 3B As shown, a pressing airflow 334 is applied to a surface 58 of the transfer substrate 52 where no electronic component 60 is to be welded (the transfer substrate 52 is disposed between the target substrate 54 and the body 310) or to a surface 59 of the target substrate 54 opposite to the welding surface 57 (the target substrate 54 is disposed between the transfer substrate and the body 310) at a position relative to the electronic component 60 to be welded. Figure 1 As shown, the energy beam 112 is applied to solder the electronic components 60 to be soldered on the transfer substrate 52 to the target substrate 54 by suppressing the gas flow 334 .
[0027] In this embodiment, the compressed air flow 334 is generated by the body 310 between the body 310 and the transfer substrate 52 (the transfer substrate 52 is disposed between the target substrate 54 and the body 310) or the target substrate 54 (the target substrate 54 is disposed between the transfer substrate and the body 310) to float the body 310. In addition, the energy beam 112 is applied to the transfer substrate 52 or the target substrate 54 through the compressed air flow 334, for example, applied to the solder 56 on the transfer substrate 52, or applied to the solder 56 on the target substrate 54, that is, the solder 56 can be disposed on the transfer substrate 52 or the target substrate 54.
[0028] After the solder 56 is melted by the energy beam 112 and cooled and solidified, the solder 56 can bond the electrode 62 and the pad 55. At this time, the bonding force between the solder 56 and the electrode 62 is greater than the bonding force between the adhesive layer 53 and the electronic component 60. Therefore, when the transfer substrate 52 and the target substrate 54 are separated, the electronic component 60 will remain on the target substrate 54 and separate from the transfer substrate 52. In this way, the electronic component 60 can be transferred from the transfer substrate 52 to the target substrate 54. An embodiment of the present invention provides a method for manufacturing a light-emitting diode display, which may include using the above-mentioned method for soldering electronic components to solder a light-emitting diode chip to a target substrate 54. Specifically, in the method for manufacturing a light-emitting diode display, the target substrate 54 is, for example, a display backplane, such as a thin film transistor (TFT) substrate, and the electronic component 60 is a light-emitting diode chip, such as a micro light-emitting diode chip. In this way, after the transfer substrate 52 and the target substrate 54 are separated, the electronic component 60 (light-emitting diode) remains on the target substrate 54 (display backplane) to form a light-emitting diode display.
[0029] In the method for welding electronic components and the method for manufacturing a light-emitting diode display of the present embodiment, since the surface 58 of the transfer substrate 52 where the electronic component 60 to be welded is not provided or the surface 59 of the target substrate 54 relative to the welding surface 60 is provided, a pressing airflow 334 is applied at a position relative to the electronic component 60 to be welded. Therefore, when the energy beam 112 is applied, the transfer substrate 52 and the target substrate 54 can be tightly fitted, thereby effectively improving the process yield.
[0030] In summary, in the device for locally leveling a substrate and the equipment for welding electronic components in the embodiments of the present invention, since the compressed airflow generating mechanism uses an air pump to provide airflow to the airflow guiding channel of the main body, and the airflow guiding channel can guide the airflow provided by the air pump to between the main body and the carrier, float the main body, and generate compressed airflow between the main body and the carrier, the substrate can be leveled, thereby effectively improving the process yield. In the method for welding electronic components and the method for manufacturing a light-emitting diode display in the embodiments of the present invention, since the compressed airflow is applied on the surface of the transfer substrate where the electronic components to be welded are not provided or on the surface of the target substrate relative to the welding surface, relative to the position of the electronic components to be welded, the transfer substrate and the target substrate can be closely attached when the energy beam is applied, thereby effectively improving the process yield.
[0031] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.
Claims
1. A device for welding electronic components, characterized in that: include: A carrying platform having a carrying plane, the carrying platform is used to carry a substrate to be leveled on the carrying plane; A suppressed airflow generating mechanism, comprising: A main body, on which an airflow guiding channel is provided; A driver capable of driving the body to move along the carrying plane relative to the carrying platform; and an air pump, which can provide air flow to the air flow guiding channel of the body; The airflow guiding channel can guide the airflow provided by the air pump to between the main body and the supporting platform, so as to float the main body and generate a compressed airflow between the main body and the supporting platform; and The energy generating mechanism is arranged adjacent to the supporting platform and is used for generating an energy beam passing through the pressing airflow and shooting toward the supporting platform.
2. The device for soldering electronic components according to claim 1, characterized in that: The energy beam is a laser beam.
3. The device for soldering electronic components according to claim 1, characterized in that: The main body includes a light channel penetrating therein, and the energy light beam generated by the energy generating mechanism can be guided to the direction in which the pressing airflow is directed toward the supporting platform through the light channel.
4. The device for soldering electronic components according to claim 1, characterized in that: The substrate to be flattened comprises a combination of a transfer substrate on which electronic components to be soldered are carried and a target substrate.
5. A method for welding electronic components, characterized in that: include: Providing a transfer substrate, wherein the electronic component to be soldered is provided on one surface of the transfer substrate; providing a target substrate, wherein the target substrate comprises a welding surface; Make the welding surface of the target substrate face the surface of the transfer substrate having the electronic component to be welded, and make the electronic component to be welded contact with the welding surface of the target substrate; Applying a pressing gas flow on the surface of the transfer substrate where the electronic component to be soldered is not disposed or on the surface of the target substrate opposite to the soldering surface, at a position opposite to the electronic component to be soldered; as well as An energy beam is applied through the suppressed air flow to solder the electronic components to be soldered on the transfer substrate to the target substrate.
6. The method for soldering electronic components according to claim 5, characterized in that: The pressing airflow is generated by the main body, and an airflow is generated between the main body and the transfer substrate or the target substrate, so as to float the main body.
7. The method for soldering electronic components according to claim 5, characterized in that: The energy beam passes through the pressing gas flow and is applied to the transfer substrate.
8. The method for soldering electronic components according to claim 5, characterized in that: The energy beam is a laser beam.
9. The method for soldering electronic components according to claim 5, characterized in that: The electronic component to be welded is a light emitting diode chip.
10. A method for manufacturing a light emitting diode display, characterized in that: The method comprises using the method for soldering electronic components according to claim 9 to solder a light emitting diode chip to a target substrate.