Vacuum adsorption jig for probe

Abstract

The invention relates to the technical field of semiconductor testing, in particular to a vacuum adsorption jig for a probe. The vacuum adsorption jig comprises a detachable vacuum adsorption module, a quick mounting module and a plane adjusting module, the detachable vacuum adsorption module at least comprises vacuum adsorption ceramic and a vacuum cavity, and the vacuum adsorption ceramic is used for adsorbing a cut base material; the vacuum cavity is connected with the vacuum adsorption ceramic and is used for forming a vacuum state to enable the vacuum adsorption ceramic to generate adsorption force; one side of the quick mounting module is connected with the detachable vacuum adsorption module, and the other side of the quick mounting module is connected with processing equipment; and the plane adjusting module is used for adjusting the flatness of the adsorption surface of the detachable vacuum adsorption module. According to the vacuum adsorption jig for the probe, detachable modular design is adopted, machining equipment is convenient to disassemble and assemble, a base material does not need to be directly carried, damage to the base material is avoided, and the product percent of pass is increased.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor testing technology, and more particularly to a vacuum adsorption fixture for a probe. Background Art

[0002] In the production process of micro-electromechanical system (MEMS) probes, each process must be completed and corresponding inspections must be carried out, and unqualified products must be marked. Given that the thickness of the substrate is only 40 microns, the substrate must be transferred to different equipment for processing and inspection during multiple processes and inspections. In this process, if the substrate is directly transferred, it is very easy to cause damage, thereby reducing the qualified rate of the product. In addition, after the substrate is fixed, the processing requires that its flatness must be controlled within ±5 microns. After each transfer of the substrate, its flatness must be readjusted, which is not only time-consuming, but also increases the complexity of production. Finally, the MEMS probe is processed from the initial whole substrate state into a single probe product. At this time, the single product needs to be transferred to other fixtures for easy preservation and use in the next process.

[0003] The current processing method has the following deficiencies, as follows:

[0004] (1) The substrate needs to undergo multiple operations during the processing, and corresponding inspections are required after each process is completed. The existing fixtures and equipment are connected by bolts, and the fixture cannot work as an independent module. Therefore, the substrate can only be directly transferred and fixed for subsequent processes. However, since the substrate itself is relatively thin, it is very easy to be damaged during the transfer process, resulting in a decrease in the product qualification rate;

[0005] (2) The fixture is currently made from a whole piece of ceramic. Due to the limitations of factors such as the complex structure and the thickness of the adsorption surface, the size of the adsorption hole can only reach about 70 microns. After the substrate is cut into a single probe, the width of the probe ranges from 30 to 50 microns, so the single probe product cannot be effectively adsorbed (vacuum cannot be formed). To solve this problem, the prior art adopts a method of fixing the substrate on a transfer film and then adsorbing the transfer film by the processing platform. However, this method cannot adjust the flatness of the substrate, which increases the difficulty of adjusting the laser power, resulting in one end of the substrate being cut well, while the other end cannot be completely cut or the power is too high and damages the transfer film. In addition, the step of adding a transfer film significantly prolongs the operation time and reduces production efficiency;

[0006] (3) The fixture is currently made entirely of ceramic. If the micropores or flatness of the adsorption surface are damaged during long-term use, the cost of replacing the entire ceramic is high. Summary of the invention

[0007] The purpose of the present invention is to provide a vacuum adsorption fixture for probes, so as to solve the problem that the vacuum adsorption fixture in the MEMS probe processing process in the prior art is processed as a whole ceramic, which makes it difficult to effectively adsorb a single probe and the cost of fixture replacement is high.

[0008] Another object of the present invention is to provide a vacuum adsorption fixture for a probe, so as to solve the problem that the vacuum adsorption fixture is difficult to independently realize rapid disassembly and assembly during the MEMS probe processing in the prior art.

[0009] Another object of the present invention is to provide a vacuum adsorption fixture for a probe, so as to solve the problem that the adsorption flatness of the vacuum adsorption fixture is difficult to effectively adjust during the MEMS probe processing in the prior art.

[0010] In order to achieve the above object, the present invention provides a vacuum adsorption fixture for a probe, comprising a detachable vacuum adsorption module, a quick installation module and a plane adjustment module:

[0011] The detachable vacuum adsorption module at least includes vacuum adsorption ceramics and a vacuum chamber:

[0012] The vacuum adsorption ceramic is used to adsorb the cut substrate;

[0013] The vacuum chamber is connected to the vacuum adsorption ceramic and is used to form a vacuum state so that the vacuum adsorption ceramic generates adsorption force;

[0014] The quick installation module is connected to the detachable vacuum adsorption module on one side and to the processing equipment on the other side;

[0015] The plane adjustment module is arranged between the detachable vacuum adsorption module and the quick installation module, and is used to adjust the flatness of the adsorption surface of the detachable vacuum adsorption module.

[0016] In some embodiments, the detachable vacuum adsorption module includes a ceramic pressing plate:

[0017] The ceramic pressing plate is connected to the vacuum chamber via a fastener;

[0018] The vacuum adsorption ceramic is clamped between the ceramic pressing plate and the vacuum chamber.

[0019] In some embodiments, the ceramic pressing plate is a C-shaped flat plate structure;

[0020] The vacuum adsorption ceramic at least comprises a circular protrusion;

[0021] The middle part of the ceramic pressing plate is a circular through hole;

[0022] The circular protrusion fits with the circular through hole of the ceramic pressing plate and is used for vacuum adsorption.

[0023] In some embodiments, the detachable vacuum adsorption module further includes a tilt sensor;

[0024] The vacuum adsorption ceramic also includes a circular bottom plate;

[0025] The inclination sensor is arranged at the extension part of one side of the edge of the circular bottom plate and is used to detect the parallelism of the installation surface of the circular bottom plate.

[0026] In some embodiments, the vacuum adsorption ceramic is made of aluminum nitride or aluminum oxide.

[0027] In some embodiments, a sealing ring groove is provided inside the vacuum chamber:

[0028] The sealing ring groove is located between the connection surface of the vacuum chamber and the vacuum adsorption ceramic and is used for placing the sealing ring.

[0029] In some embodiments, the detachable vacuum adsorption module further includes a quick-release air pipe interface:

[0030] One end of the quick-release air pipe interface is connected to the vacuum chamber, and the other end is connected to the vacuum air source pipe of the vacuum equipment.

[0031] In some embodiments, the plane adjustment module includes a leveling bolt and a leveling wedge:

[0032] There are multiple leveling bolts installed in multiple directions of the leveling connection base;

[0033] The number and installation positions of the leveling wedges correspond to the leveling bolts;

[0034] The leveling bolt passes through the side wall of the leveling connection base and is connected to the leveling wedge block, and is used to adjust the movement amount of the leveling wedge block;

[0035] The wedge-shaped surface of the leveling wedge is in contact with the vacuum chamber to adjust the flatness of the vacuum chamber.

[0036] In some embodiments, the quick installation module includes a quick release lock and a leveling connection base:

[0037] The shape of the leveling connection base is a circular or polygonal flat plate structure;

[0038] A plurality of first mounting holes are arranged at the bottom of the leveling connection base, which is connected to the processing equipment through a quick-release lock.

[0039] In some embodiments, the vacuum adsorption fixture for the probe further includes a device mounting base:

[0040] The equipment mounting base is mounted on the processing equipment and is provided with a plurality of second mounting holes corresponding to the first mounting holes of the leveling connection base;

[0041] The leveling connection base is connected to the equipment installation base through a quick-release lock.

[0042] In some embodiments, the quick release lock comprises a top cap, a lock body and a spring mechanism:

[0043] The top cap is arranged on the top of the lock body and includes a straight-shaped protrusion;

[0044] The lock body is a cylindrical structure with a plurality of cylindrical protrusions at the bottom for locking and fixing;

[0045] The lock body is internally provided with a spring mechanism which is connected with the cylindrical protrusion.

[0046] In some embodiments, the vacuum adsorption fixture for the probe further includes an elastic connection component to elastically connect the detachable vacuum adsorption module to the quick installation module.

[0047] In some embodiments, the elastic connection component is a tension spring.

[0048] The vacuum adsorption fixture for the probe proposed by the present invention adopts a detachable modular design, so as to realize the adsorption and detection of the semi-finished substrate, which is convenient for the disassembly and assembly of the processing equipment, and there is no need to directly carry the substrate, thereby avoiding damage to the substrate and improving the product qualification rate. If damage occurs, only the ceramic piece needs to be replaced to save costs. In addition, after disassembly and assembly, real-time feedback and adjustment of the flatness of the adsorption surface can be made, thereby further improving the processing qualification rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0049] The above and other features, properties and advantages of the present invention will become more apparent through the following description in conjunction with the accompanying drawings and embodiments, in which the same reference numerals always represent the same features, wherein:

[0050] Figure 1 A schematic structural diagram of a vacuum adsorption fixture for a probe according to an embodiment of the present invention is disclosed;

[0051] Figure 2 An exploded view of parts of a vacuum adsorption fixture for a probe according to an embodiment of the present invention is disclosed;

[0052] Figure 3 A schematic diagram of installing a device mounting base in processing equipment according to an embodiment of the present invention is disclosed.

[0053] The meanings of the reference numerals in the figures are as follows:

[0054] 1 ceramic pressure plate;

[0055] 2. Tilt sensor;

[0056] 3. Vacuum adsorption ceramics;

[0057] 31 round bottom plate;

[0058] 311 extension department;

[0059] 32 circular raised portion;

[0060] 4 vacuum chamber;

[0061] 41 first groove structure;

[0062] 42 second groove structure;

[0063] 5. Quick release lock;

[0064] 6. Level the connection base;

[0065] 7 leveling bolts;

[0066] 8. Leveling wedges;

[0067] 9 tension spring;

[0068] 10 Quick-release air pipe connector;

[0069] 11 Equipment mounting base. DETAILED DESCRIPTION

[0070] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the invention and are not used to limit the invention.

[0071] It should be noted that the illustrations provided in the following embodiments are only schematic illustrations of the basic concept of the present invention. Although the illustrations only show components related to the present invention rather than being drawn according to the number, shape and size of components in actual implementation, the form, quantity and proportion of each component in actual implementation may be changed arbitrarily, and the component layout may also be more complicated.

[0072] Figure 1 The structure diagram of the vacuum adsorption fixture for the probe according to one embodiment of the present invention is disclosed. Figure 2 The exploded view of the parts of the vacuum adsorption fixture for the probe according to one embodiment of the present invention is disclosed, such as Figure 1 and Figure 2 As shown, the vacuum adsorption fixture for the probe proposed by the present invention includes a detachable vacuum adsorption module and a quick installation module:

[0073] The detachable vacuum adsorption module at least includes vacuum adsorption ceramics and a vacuum chamber:

[0074] The vacuum adsorption ceramic is used to adsorb the cut substrate;

[0075] The vacuum chamber is connected to the vacuum adsorption ceramic and is used to form a vacuum state so that the vacuum adsorption ceramic generates adsorption force;

[0076] The quick installation module is connected to the detachable vacuum adsorption module on one side and connected to the processing equipment on the other side.

[0077] The vacuum adsorption jig for probes proposed in the present invention can be used for MEMS probe cutting and process flow, and can be quickly disassembled and assembled as an independent module, while ensuring that the product is stably adsorbed on the ceramic adsorption surface and will not be scattered or lost, thereby smoothly connecting various processes.

[0078] The vacuum adsorption ceramic is made of ceramic material, while the vacuum chamber is made of metal material. If the ceramic part is damaged, the vacuum adsorption ceramic can be replaced alone without replacing the entire part.

[0079] Furthermore, the vacuum adsorption fixture for the probe proposed by the present invention further includes a plane adjustment module:

[0080] The plane adjustment module is arranged between the detachable vacuum adsorption module and the quick installation module, and is used to adjust the flatness of the adsorption surface of the detachable vacuum adsorption module.

[0081] The vacuum adsorption fixture for the probe proposed by the present invention realizes the rapid adjustment of the flatness of the product and ensures the processing qualification rate.

[0082] Furthermore, the vacuum adsorption fixture for the probe further includes an elastic connection component:

[0083] The elastic connection assembly is used to connect the detachable vacuum adsorption module with the quick installation module.

[0084] The elastic connection component utilizes elastic materials or design principles to achieve an elastic connection between the detachable vacuum adsorption module and the quick installation module.

[0085] The vacuum adsorption fixture for the probe proposed by the present invention tightly connects the detachable vacuum adsorption module with the quick installation module through the presence of an elastic connection component, thereby ensuring that the entire fixture can maintain stability and flexibility during multiple adjustment processes.

[0086] Combine the following Figure 1 and Figure 2 The various component modules of the vacuum adsorption fixture for the probe proposed by the present invention are described in detail.

[0087] like Figure 1 and Figure 2 In the embodiment shown, the detachable vacuum adsorption module includes a ceramic pressing plate 1, a tilt sensor 2, a vacuum adsorption ceramic 3 and a vacuum chamber 4:

[0088] The ceramic pressing plate 1 is connected to the vacuum chamber 4 via fasteners;

[0089] The tilt sensor 2 is arranged at the outer portion of one side of the edge of the vacuum adsorption ceramic 3;

[0090] The vacuum adsorption ceramic 3 is clamped between the ceramic pressing plate 1 and the vacuum chamber 4 .

[0091] The ceramic pressing plate 1 has a plurality of through holes on the top for bolt connection;

[0092] The ceramic pressing plate 1 is connected to the vacuum chamber 4 by common bolts, and the vacuum adsorption ceramic 3 is sandwiched between the two. The ceramic pressing plate 1, the inclination sensor 2, the vacuum adsorption ceramic 3 and the vacuum chamber 4 together form a whole.

[0093] like Figure 1 and Figure 2 As shown, the ceramic pressing plate 1 is a C-shaped flat plate structure;

[0094] The middle part of the C-shaped structure of the ceramic pressing plate 1 is a circular through hole, which matches the circular protrusion of the vacuum adsorption ceramic 3 .

[0095] Wherein, the vacuum adsorption ceramic 3 includes a circular bottom plate 31 and a circular protrusion 32;

[0096] The circular protrusion 32 is used for vacuum adsorption and is arranged on the upper surface of the circular bottom plate 31 to fit with the circular through hole of the ceramic pressing plate 1;

[0097] An extension portion 311 is provided on one side of the edge of the circular bottom plate 31 of the vacuum adsorption ceramic 3;

[0098] The extension portion 311 is used to install the tilt sensor 2;

[0099] The shape of the extension portion 311 matches the opening portion of the C-shaped structure of the ceramic pressing plate 1 .

[0100] The inclination sensor 2 is used to detect the parallelism of the mounting surface of the circular base plate 31 .

[0101] Furthermore, the vacuum adsorption ceramic 3 is a porous ceramic, and its processing can ensure extremely high flatness and parallelism.

[0102] Porous ceramics are a type of ceramic material with a special structure. It has a large number of evenly distributed tiny pores inside. These tiny pores can form adsorption holes. These adsorption holes allow air or gas to pass through, generating negative pressure during the vacuum adsorption process, thereby firmly adsorbing objects on the ceramic surface.

[0103] The diameter of the adsorption holes of the vacuum adsorption pottery 3 is 25-30 microns, which is evenly distributed on the adsorption surface of the circular protrusion 32, so it is smaller than the diameter of the probe (30-50 microns), and can achieve effective adsorption of a single probe product.

[0104] The ceramic pressing plate 1 and the vacuum chamber 4 are made of metal materials, which may be aluminum alloy 7075.

[0105] The material of the vacuum adsorption ceramic 3 is aluminum nitride or aluminum oxide.

[0106] When selecting the material of the vacuum adsorption ceramic 3, aluminum nitride is considered to be a better choice.

[0107] Aluminum oxide is also an option, but it is harder and more difficult to machine than aluminum nitride. Nevertheless, aluminum oxide still meets the performance requirements.

[0108] Although the hardness of aluminum nitride is slightly lower than that of aluminum oxide, it still meets the performance standards, and during the processing, aluminum nitride can effectively ensure the flatness of the adsorption surface and the parallelism of the mounting surface of the inclination sensor 2 (with an accuracy of 2 microns). In addition, when the ceramic is worn due to long-term use, the vacuum adsorption ceramic 3 can be replaced separately, which significantly reduces maintenance costs.

[0109] The outer dimensions of the inclination sensor 2 should not be larger than the opening dimensions of the C-shaped structure of the ceramic pressing plate 1 .

[0110] Furthermore, the accuracy of the inclination sensor 2 can reach 0.001°. The inclination sensor 2 is a digital display type, and can directly display the value on the sensor.

[0111] The inclination sensor 2 is used to feedback the flatness of the adsorption surface after multiple disassembly and assembly, and make corresponding adjustments accordingly.

[0112] Since ceramic processing can ensure good parallelism, the inclination sensor 2 feeds back the flatness of the mounting surface of the vacuum adsorption ceramic 3. Since the parallelism is guaranteed, it indirectly reflects the flatness of the adsorption surface.

[0113] Furthermore, the vacuum chamber 4 is a circular structure and is connected to the vacuum equipment;

[0114] A circular countersunk hole is provided in the middle of the vacuum chamber 4, and the circular countersunk hole is used to accommodate the circular bottom plate 31 of the vacuum adsorption ceramic 3;

[0115] A first groove structure 41 is formed on the upper surface of the edge of the vacuum chamber 4 , and the first groove structure 41 is used to accommodate the extension portion 311 of the circular bottom plate 31 ;

[0116] The height of the circular bottom plate 31 and its extension 311 should be consistent with the depth of the circular counterbore of the vacuum chamber 4 and the first groove structure 41 .

[0117] Furthermore, a sealing ring groove is provided on the circular counterbore surface of the vacuum chamber 4:

[0118] The sealing ring groove is located between the connection surface of the vacuum chamber 4 and the vacuum adsorption ceramic 3 and is used for placing the sealing ring to ensure the airtightness between the vacuum chamber 4 and the vacuum adsorption ceramic 3 .

[0119] The vacuum adsorption ceramic 3 adopts a through-channel design at the connection between the circular bottom plate 31 and the circular protrusion 32. When the vacuum chamber 4 is evacuated, the through-channel connects the vacuum chamber 4 with the circular protrusion 32, and the circular protrusion 32 can effectively adsorb the cut substrate.

[0120] In this embodiment, the cut substrate is placed on the circular protrusion 31 of the vacuum adsorption ceramic 3 , and the vacuum equipment is turned on to make the vacuum chamber 4 form a vacuum state, so that the cut substrate is adsorbed on the surface of the vacuum adsorption ceramic 3 .

[0121] In this embodiment, the vacuum degree of the vacuum chamber 4 is -0.29 MPa. The vacuum device may be a compressed air source.

[0122] Furthermore, the detachable vacuum adsorption module further includes a quick-release air pipe interface 10:

[0123] The quick-release air pipe interface 10 has one end connected to the vacuum chamber 4 and the other end connected to the vacuum air source pipe of the vacuum equipment.

[0124] Furthermore, the quick-release air pipe interface 10 has a threaded structure at its connection end with the vacuum chamber 4 and is connected to the vacuum chamber 4 via the thread.

[0125] The quick-release air pipe interface 10 is adapted to each vacuum device, so that the vacuum chamber 4 is connected to the vacuum air source corresponding to different vacuum devices through the quick-release air pipe interface 10, thereby realizing quick disassembly and connection between different vacuum devices.

[0126] like Figure 1 and Figure 2 In the embodiment shown, the quick installation module includes a quick release lock buckle 5 and a leveling connection base 6:

[0127] The quick-release locks 5, which are three in number, are mechanical devices that can be quickly loosened or locked and are used to firmly connect the leveling connection base 6 to the equipment mounting base 11. They have efficient operability and reusability and can achieve quick connection and disconnection.

[0128] More specifically, the quick-release lock 5 comprises a top cap, a lock body and a spring mechanism:

[0129] The top cap is arranged on the top of the lock body and includes a straight-shaped protrusion to facilitate operation with fingers or tools;

[0130] The lock body is a cylindrical structure with a plurality of cylindrical protrusions arranged at the bottom;

[0131] The cylindrical protrusion can protrude or retract into the interior of the lock body for locking and fixing;

[0132] The spring mechanism is arranged inside the lock body and connected to the cylindrical protrusion to provide the cylindrical protrusion with elastic force to protrude outward.

[0133] The leveling connection base 6 is in the shape of a circular or polygonal flat plate structure;

[0134] The bottom of the leveling connection base 6 is provided with a plurality of first mounting holes, which are connected to the processing equipment via a quick-release lock buckle 5 .

[0135] In this embodiment, the leveling connection base 6 has three evenly distributed first mounting holes;

[0136] Furthermore, the vacuum adsorption fixture for the probe further includes a device mounting base 11:

[0137] The equipment mounting base 11 is mounted on the processing equipment and is provided with a plurality of second mounting holes corresponding to the first mounting holes of the leveling connection base 6;

[0138] The leveling connection base 6 is connected to the equipment installation base 11 via a quick-release lock buckle 5 .

[0139] The equipment mounting base 11, serving as a fixing foundation for the entire fixture, is a large-area flat plate structure, which is used to fix the leveling connection base 6, provide a stable installation reference, and has the ability to bear the overall weight.

[0140] In this embodiment, the equipment mounting base 11 is also provided with three second mounting holes, which correspond to the positions of the first mounting holes of the leveling connecting base 6, and are used to connect processing equipment of different processes. The quick-release lock buckle 5 passes through the first mounting hole and is connected to the second mounting hole, and the leveling connecting base 6 is connected to the equipment mounting base 11 installed on the corresponding processing equipment, so that the fixture is locked on the processing equipment as a whole.

[0141] Figure 3 A schematic diagram of installing a device mounting base in a processing device according to an embodiment of the present invention is disclosed. Figure 3 As shown, each processing equipment is equipped with an installation structure of an equipment installation base 11 of the same specification, so as to realize the circulation of the vacuum adsorption fixture for the probe proposed by the present invention between different processing equipment.

[0142] It is worth emphasizing that although the unified specifications of the equipment mounting base 11 are the best choice, if there are differences in specifications, as long as the position and size of the mounting holes are consistent with those of the leveling connection base 6, the purpose of the circulation of fixtures between different processing equipment can also be achieved.

[0143] The vacuum adsorption fixture for the probe proposed by the present invention completely avoids direct contact with the substrate during the transportation process, which not only improves the efficiency but also avoids unqualified products caused by direct contact with the substrate.

[0144] like Figure 1 and Figure 2 In the embodiment shown, the plane adjustment module includes a leveling bolt 7 and a leveling wedge 8:

[0145] There are multiple leveling bolts 7 installed in multiple directions of the leveling connection base, so as to achieve flatness adjustment in multiple directions;

[0146] The number and installation position of the leveling wedges 8 correspond to the leveling bolts 7;

[0147] More specifically, for each leveling bolt 7, it passes through the side wall of the leveling connection base 6 and is connected to the corresponding leveling wedge 8, so as to fine-tune the movement amount of the leveling wedge 8;

[0148] The bottom surface of the leveling wedge block 8 is in contact with the leveling connection base 6, and the wedge surface is in contact with the vacuum chamber 4 to adjust the flatness of the vacuum chamber 4;

[0149] The leveling bolt 7 is adjusted to move the leveling wedge 8, thereby adjusting the flatness of the leveling vacuum chamber 4, and finally adjusting the flatness of the adsorption surface substrate.

[0150] Furthermore, the bottom of the vacuum chamber 4 is designed with a second groove structure 42 that matches the leveling wedge 8 and is used to accommodate and guide the leveling wedge 8.

[0151] like Figure 1 and Figure 2 In the illustrated embodiment, the elastic connection component is a tension spring 9, which plays a role of elastic connection.

[0152] Specifically, the tension spring 9 connects the vacuum chamber 4 with the leveling connection base 6, allowing a certain elastic tension to be maintained between the vacuum chamber 4 and the leveling connection base 6, thereby providing a certain flexible connection for the entire fixture.

[0153] In this embodiment, based on the inclination value feedback from the inclination sensor 2, the leveling bolt 7 is adjusted to move the leveling wedge 8. When the leveling bolt 7 adjusts the position of the wedge 8, the vacuum chamber 4 and the vacuum adsorption ceramic 3 can be fine-tuned accordingly through the elastic action of the tension spring 9 to achieve precise control of the flatness of the adsorption surface of the vacuum adsorption ceramic 3.

[0154] The qualified rate of finished products in the traditional processing method is about 80%, while the probe vacuum adsorption fixture proposed in the present invention can increase the qualified rate to about 90%.

[0155] In the original processing method, the production cycle of a substrate is 210 minutes, and 256 products can be produced at a time. After adopting the vacuum adsorption fixture of the present invention, the time required to produce the same number of products (256) can be shortened to 170 minutes, and the fixture can be used as an independent module to facilitate product replacement and equipment movement.

[0156] The vacuum adsorption fixture for the probe proposed by the present invention has the following beneficial effects:

[0157] 1) It can be used as an independent module to achieve quick disassembly and assembly, and is easy to separate from the equipment so as to adsorb semi-finished substrates for testing and other operations. There is no need to directly move the substrate, thereby avoiding damage to the substrate and improving the product qualification rate;

[0158] 2) The diameter of the vent hole is smaller than the finished product size, so that the substrate can be directly adsorbed on the ceramic sheet. Even after cutting, a single needle can be adsorbed, which is convenient for the connection of any subsequent process, and the substrate does not need to be fixed on the transfer film and then placed on the adsorption platform;

[0159] 3) The fixture is made of metal and ceramic. If it is damaged, only the ceramic piece needs to be replaced, which can save costs;

[0160] 4) Built-in inclination sensor with an inclination accuracy of up to 0.001°, which can provide real-time feedback and adjust the flatness of the ceramic surface after disassembly and assembly. Since there is no transfer film between the ceramic surface and the substrate, and the substrate is adsorbed on the ceramic surface, when the flatness of the ceramic surface meets the requirements, the flatness of the substrate can also meet the processing requirements.

[0161] As shown in this application and claims, unless the context clearly indicates an exception, the words "a", "an", "an" and / or "the" do not refer to the singular and may also include the plural. Generally speaking, the terms "include" and "comprise" only indicate the inclusion of the steps and elements that have been clearly identified, and these steps and elements do not constitute an exclusive list. The method or device may also include other steps or elements.

[0162] In the description of the present invention, it should be noted that the directions or positional relationships indicated by terms such as “upper”, “lower”, “front”, “back”, “left”, “right”, “vertical”, “inside” and “outside” are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present invention.

[0163] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0164] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be a connection between two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0165] The above embodiments are provided for persons familiar with the art to implement or use the present invention. Persons familiar with the art may make various modifications or changes to the above embodiments without departing from the inventive concept of the present invention. Therefore, the protection scope of the present invention is not limited to the above embodiments, but should be the maximum scope of the innovative features mentioned in the claims.

Claims

1. A vacuum adsorption fixture for a probe, characterized in that: Including detachable vacuum adsorption module, quick installation module and plane adjustment module: The detachable vacuum adsorption module at least includes vacuum adsorption ceramics and a vacuum chamber: The vacuum adsorption ceramic is used to adsorb the cut substrate; The vacuum chamber is connected to the vacuum adsorption ceramic and is used to form a vacuum state so that the vacuum adsorption ceramic generates adsorption force; The quick installation module is connected to the detachable vacuum adsorption module on one side and to the processing equipment on the other side; The plane adjustment module is arranged between the detachable vacuum adsorption module and the quick installation module, and is used to adjust the flatness of the adsorption surface of the detachable vacuum adsorption module.

2. The vacuum adsorption fixture for a probe according to claim 1, characterized in that: The detachable vacuum adsorption module comprises a ceramic pressing plate: The ceramic pressing plate is connected to the vacuum chamber via a fastener; The vacuum adsorption ceramic is clamped between the ceramic pressing plate and the vacuum chamber.

3. The vacuum adsorption fixture for a probe according to claim 2, characterized in that: The ceramic pressing plate is a C-shaped flat plate structure; The vacuum adsorption ceramic at least comprises a circular protrusion; The middle part of the ceramic pressing plate is a circular through hole; The circular protrusion fits with the circular through hole of the ceramic pressing plate and is used for vacuum adsorption.

4. The vacuum adsorption fixture for a probe according to claim 3, characterized in that: The detachable vacuum adsorption module also includes a tilt sensor; The vacuum adsorption ceramic also includes a circular bottom plate; The inclination sensor is arranged at the extension part of one side of the edge of the circular bottom plate and is used to detect the parallelism of the installation surface of the circular bottom plate.

5. The vacuum adsorption fixture for a probe according to claim 1, characterized in that: The material of the vacuum adsorption ceramic is aluminum nitride or aluminum oxide.

6. The vacuum adsorption fixture for a probe according to claim 1, characterized in that: The interior of the vacuum chamber is provided with a sealing ring groove: The sealing ring groove is located between the connection surface of the vacuum chamber and the vacuum adsorption ceramic and is used for placing the sealing ring.

7. The vacuum adsorption fixture for a probe according to claim 1, characterized in that: The detachable vacuum adsorption module also includes a quick-release air pipe interface: One end of the quick-release air pipe interface is connected to the vacuum chamber, and the other end is connected to the vacuum air source pipe of the vacuum equipment.

8. The vacuum adsorption fixture for a probe according to claim 1, characterized in that: The quick installation module includes a quick release lock and a leveling connection base: The shape of the leveling connection base is a circular or polygonal flat plate structure; A plurality of first mounting holes are arranged at the bottom of the leveling connection base, which is connected to the processing equipment through a quick-release lock.

9. The vacuum adsorption fixture for a probe according to claim 8, characterized in that: Also includes device mounting base: The equipment mounting base is mounted on the processing equipment and is provided with a plurality of second mounting holes corresponding to the first mounting holes of the leveling connection base; The leveling connection base is connected to the equipment installation base through a quick-release lock.

10. The vacuum adsorption fixture for a probe according to claim 8, characterized in that: The quick-release lock comprises a top cap, a lock body and a spring mechanism: The top cap is arranged on the top of the lock body and includes a straight-shaped protrusion; The lock body is a cylindrical structure with a plurality of cylindrical protrusions at the bottom for locking and fixing; The spring mechanism is arranged inside the lock body and connected to the cylindrical protrusion.

11. The vacuum adsorption fixture for a probe according to claim 8, characterized in that: The plane adjustment module includes a leveling bolt and a leveling wedge: There are multiple leveling bolts installed in multiple directions of the leveling connection base; The number and installation positions of the leveling wedges correspond to the leveling bolts; The leveling bolt passes through the side wall of the leveling connection base and is connected to the leveling wedge block, and is used to adjust the movement amount of the leveling wedge block; The wedge-shaped surface of the leveling wedge is in contact with the vacuum chamber to adjust the flatness of the vacuum chamber.

12. The vacuum adsorption fixture for a probe according to claim 1, characterized in that: It also includes an elastic connection component, which elastically connects the detachable vacuum adsorption module with the quick installation module.

13. The vacuum adsorption fixture for a probe according to claim 12, characterized in that: The elastic connection component is a tension spring.

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