A self-repairing conductive hydrogel material based on dynamic acylhydrazone bonds and hydrogen bonds, and its preparation method and application

Abstract

The present invention discloses a preparation method and application of a self-healing conductive hydrogel material based on dynamic acylhydrazone bonds and hydrogen bonds, belonging to the field of flexible electronic materials. Acrylamide is used as a monomer, a carbon-based material is used as a conductive filler, and a hydrophobic monomer is combined to prepare a polymer network skeleton by a free radical polymerization method. An oxidant and a hydrazide modifier are used to modify and graft natural polysaccharides to obtain formaldehyde polysaccharides and hydrazide polysaccharides. The formaldehyde polysaccharides and hydrazide polysaccharides are introduced into the polymer network skeleton to prepare a self-healing conductive hydrogel based on a dynamic acylhydrazone bond and hydrogen bond network structure. The prepared self-healing conductive hydrogel not only has the mechanical properties of high ionic conductivity and high tensile strength at break, but also has the characteristics of good repairability, high sensitivity and stable electrical properties. The present invention is simple to operate and has concise steps, and is suitable for multiple related fields such as wearable electronic devices, flexible strain sensors, and electronic skin.

Description

Technical Field

[0001] The present invention belongs to the technical field of functional materials and relates to flexible electronic materials, in particular to a self-repairing conductive hydrogel material based on dynamic acylhydrazone bonds and hydrogen bonds, and a preparation method and application thereof. Background Art

[0002] Hydrogels, polymer materials with three-dimensional cross-linked networks, have become important materials in fields such as energy, agriculture, and materials science due to their high water content, excellent biocompatibility, and mechanical properties. By adding conductive fillers such as conductive polymers, carbon-based materials, metal salts, and ionic liquids to the hydrogel matrix, hydrogels are endowed with conductive properties, showing great potential for applications in flexible sensor technology, biomedical engineering, and smart materials.

[0003] At present, the research results of conductive hydrogels are remarkable, but they still face some challenges. When conductive hydrogels are squeezed by external forces, micro cracks will appear on the surface of the material, which will affect the integrity and electrical properties of the hydrogel structure, thereby greatly shortening the life of the material, and the damaged hydrogel is difficult to repair by artificial methods. Self-repairing hydrogels can spontaneously repair damage or repair through the intervention of external stimuli (such as pH, light, temperature), so the self-repair process can be divided into spontaneous and non-spontaneous. Among them, non-spontaneous self-repairing materials are microcapsules, nanocontainers or microvascular systems containing monomers, cross-linking agents or catalysts placed inside the gel material. When damage occurs, these repair agents will be released into the gel matrix, thereby inducing in situ polymerization to repair the damage of the hydrogel. However, this method is difficult to prepare hydrogels, and the repair agent can only be implanted once or self-repair can only be performed once, which greatly limits the service life of the material. Therefore, efficient and spontaneously repairable conductive hydrogel materials have become a research hotspot. Summary of the Invention

[0004] In view of the shortcomings of the existing technology, the purpose of the present invention is to provide a self-healing conductive hydrogel material based on dynamic acylhydrazone bonds and hydrogen bonds, as well as its preparation method and application. It has high ionic conductivity, high mechanical properties of breaking tensile strength, excellent self-healing and conductive stability, and is applied to flexible sensors with high sensitivity, high ionic conductivity and high breaking tensile strength.

[0005] In order to achieve the above object, the present invention adopts the following technical solutions:

[0006] A method for preparing a self-repairing conductive hydrogel material based on dynamic acylhydrazone bonds and hydrogen bonds comprises the following steps:

[0007] Step 1, dissolving 2 to 8 parts of natural polysaccharide in 70 to 90 parts of deionized water by mass, adding 4 to 6 parts of oxidant, stirring at 30 to 50° C. for 2 to 4 hours, separating the solid, washing, and drying to obtain the formaldehyde-modified polysaccharide; dissolving 2 to 8 parts of natural polysaccharide in 70 to 90 parts of deionized water, adding 0.3 to 0.5 parts of hydrazide modifier, stirring at 35 to 45° C. for 2 to 3 hours, separating the solid, washing, and drying to obtain the hydrazide-modified polysaccharide;

[0008] Step 2: Dissolve 2 to 6 parts of carbon-based material in 70 to 90 parts of deionized water by mass, add 4 to 6 parts of reducing agent, stir and react at 40 to 50° C. for 1 to 2 hours, separate the solid, wash, and dry to obtain a conductive filler;

[0009] Step 3: Dissolve 3 to 8 parts of acrylamide in 70 to 90 parts of deionized water by mass, stir and dissolve at 50 to 60°C, then add 2 to 4 parts of hydrophobic monomer, 0.06 to 0.08 parts of cross-linker MBA and 2 to 5 parts of aldehyde-modified polysaccharide prepared in step 1, 1 to 6 parts of hydrazide-modified polysaccharide prepared in step 1 and 2 to 5 parts of conductive filler prepared in step 2, react at 50 to 60°C with N2 for 1 to 3 hours, add 0.1 to 0.5 parts of initiator dropwise, and react at 60 to 70°C for 1 to 2 hours to obtain a self-healing conductive hydrogel material based on dynamic acylhydrazone bonds and hydrogen bonds.

[0010] The present invention also has the following technical features:

[0011] Preferably, the natural polysaccharide includes any one of pectin, guar gum, starch, agar and lignin.

[0012] Preferably, the oxidant includes any one of sodium periodate, sodium hypochlorite, hydrogen peroxide and ferric oxychloride.

[0013] Preferably, the hydrazide modifier includes any one of adipic acid dihydrazide, succinic acid dihydrazide, maleic acid dihydrazide and p-nitrobenzoyl hydrazide.

[0014] Preferably, the carbon-based material includes any one of graphene, graphene oxide, silicon carbide fiber, carbon powder and multi-walled carbon nanotubes.

[0015] Preferably, the reducing agent includes any one of polydopamine, sodium sulfite and L-cysteine.

[0016] Preferably, the hydrophobic monomer includes any one of octadecyl methacrylate, isooctyl acrylate, isobutyl acrylate, isodecyl acrylate, isobutyl methacrylate and octyl methacrylate.

[0017] Preferably, the initiator comprises one of sodium persulfate, ammonium persulfate and potassium persulfate.

[0018] The present invention also protects a self-repairing conductive hydrogel material based on dynamic acylhydrazone bonds and hydrogen bonds prepared by the method as described above, and its application in flexible strain sensors.

[0019] Compared with the prior art, the present invention has the following technical effects:

[0020] The present invention uses acrylamide, hydrophobic monomers, natural polysaccharides, carbon-based conductive fillers, etc. as main raw materials. Natural polysaccharides have good biodegradability and biocompatibility, are non-toxic, and have good adsorption and moisturizing properties. The natural polysaccharides are modified by an oxidant and a hydrazide modifier to obtain aldehyde-modified polysaccharides and hydrazide-modified polysaccharides, wherein the aldehyde group and the hydrazide group react to form a reversible dynamic acylhydrazone bond. Then, acrylamide, a hydrophobic monomer, and a carbon-based conductive filler are introduced to successfully prepare a hydrogel material with stable conductive properties and excellent self-healing properties through free radical polymerization. The introduction of reversible dynamic acylhydrazone bonds and hydrogen bonds in the hydrogel gives the hydrogel excellent self-healing properties. The prepared self-healing conductive hydrogel not only has high ionic conductivity and high tensile strength at break mechanical properties, but also has the characteristics of good repairability, high sensitivity, stable electrical properties, etc.

[0021] The invention is simple to operate and has concise steps. It is applicable to multiple related fields such as wearable electronic devices, flexible strain sensors, and electronic skin. When applied to flexible strain sensors, the sensors have excellent sensitivity, high ionic conductivity, and high breaking elongation, providing a new solution for the development of flexible electronic devices.

[0022] The biocompatibility and self-repairing properties of the present invention provide new possibilities for application in multiple fields such as flexible electronic devices and biomedical engineering, and are expected to become an important component of future flexible electronic devices and biomedical engineering. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 This is a self-repairing effect diagram of Example 1 of the present invention;

[0024] Figure 2 This is a diagram showing the conductive effect of Example 1 of the present invention;

[0025] Figure 3 1 is a reaction mechanism diagram of Example 1 of the present invention. DETAILED DESCRIPTION

[0026] The specific contents of the present invention are further explained in detail below with reference to the embodiments.

[0027] Example 1

[0028] This embodiment provides a method for preparing a self-repairing conductive hydrogel material based on dynamic acylhydrazone bonds and hydrogen bonds, which includes the following steps. The reaction mechanism is as follows: Figure 3As shown:

[0029] Step 1, dissolving 5 parts of pectin in 70 parts of deionized water by mass, adding 4 parts of sodium periodate, stirring at 40°C for 4 hours, filtering, washing, and drying to obtain formaldehyde-modified pectin; dissolving 5 parts of pectin in 70 parts of deionized water, adding 0.3 parts of adipic acid dihydrazide, stirring at 40°C for 3 hours, centrifuging or filtering, washing and purifying with water and ethanol, and then freeze-drying to obtain hydrazide-modified pectin;

[0030] Step 2: dissolving 3 parts of graphene oxide in 70 parts of deionized water by mass, adding 4 parts of polydopamine, stirring and reacting at 45° C. for 2 hours, centrifuging or filtering, washing with water and ethanol, purifying, and then freeze-drying to obtain a conductive filler;

[0031] Step 3: Dissolve 4 parts of acrylamide in 70 parts of deionized water by mass, stir and dissolve at 60°C, then add 2 parts of octadecyl methacrylate, 0.06 parts of crosslinker MBA, 2 parts of formaldehyde-modified pectin, 1 part of hydrazide-modified pectin and 2 parts of conductive fillers, react at 60°C with N2 for 1 hour, add 0.1 parts of initiator ammonium persulfate dropwise, and react at 70°C for 2 hours to obtain a self-healing conductive hydrogel material based on dynamic acylhydrazone bonds and hydrogen bonds.

[0032] Example 2

[0033] This embodiment provides a method for preparing a self-healing conductive hydrogel material based on dynamic acylhydrazone bonds and hydrogen bonds, comprising the following steps:

[0034] Step 1, dissolving 5 parts of starch in 80 parts of deionized water by mass, adding 5 parts of sodium periodate and stirring at 30°C for 2 hours, filtering, washing, and drying to obtain formaldehyde starch; dissolving 5 parts of starch in 80 parts of deionized water, adding 0.4 parts of succinic acid dihydrazide and stirring at 35°C for 2 hours, centrifuging or filtering, washing and purifying with water and ethanol, and then freeze-drying to obtain hydrazide starch;

[0035] Step 2: Dissolve 4 parts of carbon powder in 80 parts of deionized water by mass, add 5 parts of sodium sulfite, stir and react at 40° C. for 1 hour, separate by centrifugation or filtration, wash with water and ethanol, purify, and then freeze-dry to obtain a conductive filler;

[0036] Step 3: Dissolve 5 parts of acrylamide in 80 parts of deionized water by mass, stir and dissolve at 60°C, then add 3 parts of isooctyl acrylate, 0.07 parts of crosslinker MBA, 3 parts of formaldehyde-modified starch, 2 parts of hydrazide-modified starch and 3 parts of conductive filler, react at 50°C with N2 for 3 hours, add 0.2 parts of initiator ammonium persulfate dropwise, and react at 60°C for 1 hour to obtain a self-healing conductive hydrogel material based on dynamic acylhydrazone bonds and hydrogen bonds.

[0037] Example 3

[0038] This embodiment provides a method for preparing a self-healing conductive hydrogel material based on dynamic acylhydrazone bonds and hydrogen bonds, comprising the following steps:

[0039] Step 1, dissolving 6 parts of agar in 90 parts of deionized water by mass, adding 6 parts of hydrogen peroxide and stirring at 50° C. for 3 hours, filtering, washing, and drying to obtain aldehyde-modified agar; dissolving 6 parts of agar in 90 parts of deionized water, adding 0.5 parts of maleic acid dihydrazide and stirring at 45° C. for 2.5 hours, centrifuging or filtering, washing and purifying with water and ethanol, and then freeze-drying to obtain hydrazide-modified agar;

[0040] Step 2: dissolving 5 parts of graphene in 70 parts of deionized water by mass, adding 6 parts of L-cysteine, stirring and reacting at 50° C. for 1.5 hours, separating by centrifugation or filtration, washing with water and ethanol, purifying, and then freeze-drying to obtain a conductive filler;

[0041] Step 3: Dissolve 6 parts of acrylamide in 70 parts of deionized water by mass, stir and dissolve at 60°C, then add 4 parts of isodecyl acrylate, 0.08 parts of crosslinker MBA, 4 parts of formaldehyde-modified agar, 3 parts of hydrazide-modified agar and 4 parts of conductive filler, react at 55°C with N2 for 2h, add 0.3 parts of initiator, and react at 65°C for 2h to obtain a self-healing conductive hydrogel material based on dynamic acylhydrazone bonds and hydrogen bonds.

[0042] Example 4

[0043] This embodiment provides a method for preparing a self-healing conductive hydrogel material based on dynamic acylhydrazone bonds and hydrogen bonds, comprising the following steps:

[0044] Step 1, dissolving 7 parts of guar gum in 80 parts of deionized water by mass, adding 4 parts of hydrogen peroxide and stirring at 40° C. for 4 hours, filtering, washing, and drying to obtain formaldehyded guar gum; dissolving 7 parts of guar gum in 80 parts of deionized water, adding 0.3 parts of oxalic acid dihydrazide and stirring at 40° C. for 3 hours, centrifuging or filtering, washing and purifying with water and ethanol, and then freeze-drying to obtain hydrazide guar gum;

[0045] Step 2: Dissolve 6 parts of multi-walled carbon nanotubes in 80 parts of deionized water by mass, add 4 parts of L-cysteine, stir and react at 45° C. for 2 hours, separate by centrifugation or filtration, wash with water and ethanol, purify, and then freeze-dry to obtain a conductive filler;

[0046] Step 3: Dissolve 7 parts of acrylamide in 80 parts of deionized water by mass, stir and dissolve at 60°C, then add 2 parts of isobutyl acrylate, 0.06 parts of crosslinker MBA, 5 parts of formaldehyde-modified guar gum, 5 parts of hydrazide-modified guar gum and 5 parts of conductive filler, react at 60°C with N2 for 1h, add 0.4 parts of initiator sodium persulfate dropwise, and react at 70°C for 2h to obtain a self-healing conductive hydrogel material based on dynamic acylhydrazone bonds and hydrogen bonds.

[0047] Example 5

[0048] This embodiment provides a method for preparing a self-healing conductive hydrogel material based on dynamic acylhydrazone bonds and hydrogen bonds, comprising the following steps:

[0049] Step 1, dissolving 8 parts of pectin in 90 parts of deionized water by mass, adding 5 parts of ferric chloride and stirring at 40°C for 4 hours, filtering, washing, and drying to obtain formaldehyde-modified pectin; dissolving 8 parts of pectin in 90 parts of deionized water, adding 0.4 parts of p-nitrobenzoic acid hydrazide and stirring at 40°C for 3 hours, centrifuging or filtering, washing and purifying with water and ethanol, and then freeze-drying to obtain hydrazide-modified pectin;

[0050] Step 2: dissolving 4 parts of silicon carbide fiber in 90 parts of deionized water by mass, adding 5 parts of polydopamine, stirring and reacting at 45° C. for 2 hours, separating by centrifugation or filtration, washing with water and ethanol for purification, and then freeze-drying to obtain a conductive filler;

[0051] Step 3: Dissolve 8 parts of acrylamide in 90 parts of deionized water by mass, stir and dissolve at 55°C, then add 3 parts of octyl methacrylate, 0.07 parts of crosslinker MBA, 4 parts of formaldehyde-modified pectin, 5 parts of hydrazide-modified pectin and 2 parts of conductive filler, react at 60°C with N2 for 1 hour, add 0.5 parts of initiator sodium persulfate dropwise, and react at 70°C for 2 hours to obtain a self-healing conductive hydrogel material based on dynamic acylhydrazone bonds and hydrogen bonds.

[0052] Example 6

[0053] This embodiment provides a method for preparing a self-healing conductive hydrogel material based on dynamic acylhydrazone bonds and hydrogen bonds, comprising the following steps:

[0054] Step 1, dissolving 2 parts of lignin in 70 parts of deionized water by mass, adding 4 parts of sodium hypochlorite and stirring at 40° C. for 4 hours, filtering, washing, and drying to obtain formaldehyde-modified lignin; dissolving 2 parts of lignin in 70 parts of deionized water, adding 0.3 parts of adipic acid dihydrazide and stirring at 40° C. for 3 hours, centrifuging or filtering, washing and purifying with water and ethanol, and then freeze-drying to obtain hydrazide-modified lignin;

[0055] Step 2: dissolving 2 parts of graphene oxide in 70 parts of deionized water by mass, adding 4 parts of reducing agent L-cysteine, stirring and reacting at 45° C. for 2 hours, separating by centrifugation or filtration, washing with water and ethanol for purification, and then freeze-drying to obtain a conductive filler;

[0056] Step 3: Dissolve 3 parts of acrylamide in 70 parts of deionized water by mass, stir and dissolve at 50°C, then add 3 parts of isobutyl methacrylate, 0.06 parts of crosslinker MBA, 3 parts of formaldehyde-modified lignin, 6 parts of hydrazide-modified lignin and 3 parts of conductive filler, react at 60°C with N2 for 1 hour, add 0.3 parts of initiator potassium persulfate dropwise, and react at 70°C for 2 hours to obtain a self-healing conductive hydrogel material based on dynamic acylhydrazone bonds and hydrogen bonds.

[0057] The performance tests of the self-healing conductive hydrogel materials based on dynamic acylhydrazone bonds and hydrogen bonds prepared in Examples 1-6 above were conducted as follows:

[0058] 1. Self-repair performance test:

[0059] The self-healing properties of the hydrogels prepared in Examples 1-6 were quantitatively characterized, and tensile tests were performed on the hydrogels before and after self-healing. First, long strips of hydrogel measuring 35 mm × 4 mm × 4 mm were prepared in a homemade mold. Then, tensile tests were performed on the hydrogels before and after they were cut to quantitatively characterize their self-healing behavior. The tensile test results are shown in Table 1.

[0060] Table 1 Tensile strength test results

[0061]

[0062] Figure 1 and Figure 2 This is a real picture of the self-repairing performance test of Example 1. It can be seen from the figure that the hydrogel prepared in Example 1 has good self-repairing performance.

[0063] The self-healing efficiency of the hydrogels prepared in Examples 1-6 was calculated using the following formula:

[0064] Self-healing efficiency (%) = H t / H o ×100%

[0065] H o : original tensile strength without damage (KPa); H t :Tensile strength after repair (KPa).

[0066] The self-healing efficiency test results are shown in Table 2.

[0067] Table 2 Self-healing efficiency test results

[0068]

[0069] It can be seen from Tables 1 and 2 that the self-repairing performance of the self-repairing conductive hydrogel material based on dynamic acylhydrazone bonds and hydrogen bonds of the present invention can reach more than 85%, which shows that the self-repairing conductive hydrogel has good repair performance.

[0070] 2. Conductivity test:

[0071] The conductivity of the hydrogels prepared in Examples 1-6 was tested using an electrochemical workstation. The conductive hydrogels were cut into 35 mm × 4 mm × 4 mm samples and clamped between the electrodes. The voltage was set to 1.5 V. The conductivity (σ) of the hydrogel samples was calculated using the following formula:

[0072] σ=d / (R×A)

[0073] d: distance between adjacent electrodes (mm); R: resistance of hydrogel sample (Ω); A: cross-sectional area of ​​hydrogel sample (mm 2 ).

[0074] The test results of the electrical conductivity are shown in Table 3.

[0075] Table 3 Conductivity test results

[0076]

[0077] It can be seen from Table 3 that the conductive properties of the self-healing conductive hydrogel material based on dynamic acylhydrazone bonds and hydrogen bonds of the present invention are shown, which indicates that the self-healing conductive hydrogel has good conductive properties and can effectively and accurately transmit electrical signals when applied to strain sensors.

[0078] 3. Strain sensing performance test:

[0079] The strain sensing performance of the hydrogels prepared in Examples 1-6 was tested as follows: a digital multimeter was connected to a universal tensile testing machine. A 35 mm × 4 mm × 4 mm conductive hydrogel sample was clamped between the ends of the tensile machine and connected to the digital multimeter's leads. The relative resistance change and sensitivity of the hydrogel sample under different strains were measured. The strain was set to 150% and the voltage was set to 1.5 V. The sensitivity of the hydrogel was calculated as follows:

[0080] GF=(ΔR / R0) / ε

[0081] ε: applied strain; R0: initial resistance of the hydrogel sample; R: resistance under applied stress.

[0082] Table 4 Strain sensing performance test results

[0083] Performance indicators Example 1 Example 2 Example 3 Example 4 Example 5 Example 6 Sensitivity 2.0 1.8 2.7 2.5 2.3 2.5

[0084] It can be seen from Table 4 that the sensitivity factor of the self-healing conductive hydrogel material based on dynamic acylhydrazone bonds and hydrogen bonds of the present invention is greater than 1.5 when the strain is as low as 150%, which shows that the conductive hydrogel has excellent strain sensitivity and a wide response range, and can be used in strain sensors.

[0085] In summary, the present invention discloses a self-healing conductive hydrogel material based on dynamic acylhydrazone bonds and hydrogen bonds. The material comprises natural polysaccharides modified with oxidants and hydrazide modifiers to obtain aldehyde-modified polysaccharides and hydrazide-modified polysaccharides, wherein the aldehyde groups and hydrazide groups react to form acylhydrazone bonds. Acrylamide, a hydrophobic monomer, and a carbon-based conductive filler are then introduced to successfully prepare a hydrogel material with stable conductive properties and excellent self-healing properties through free radical polymerization. The material is applied to strain sensors, which have the characteristics of high sensitivity and a wide response range, and can detect aspects such as human motion and health.

[0086] The above content is only for explaining the technical idea of ​​the present invention and cannot be used to limit the protection scope of the present invention. Any changes made on the basis of the technical solution in accordance with the technical idea proposed by the present invention shall fall within the protection scope of the claims of the present invention.

Claims

1. A method for preparing a self-healing conductive hydrogel material based on dynamic acylhydrazone bonds and hydrogen bonds, characterized in that: The following steps are involved: Step 1, dissolving 2 to 8 parts of natural polysaccharide in 70 to 90 parts of deionized water by mass, adding 4 to 6 parts of oxidant, stirring at 30 to 50° C. for 2 to 4 hours, separating the solid, washing, and drying to obtain the formaldehyde-modified polysaccharide; dissolving 2 to 8 parts of natural polysaccharide in 70 to 90 parts of deionized water, adding 0.3 to 0.5 parts of hydrazide modifier, stirring at 35 to 45° C. for 2 to 3 hours, separating the solid, washing, and drying to obtain the hydrazide-modified polysaccharide; Step 2: Dissolve 2-6 parts of carbon-based material in 70-90 parts of deionized water by mass, add 4-6 parts of reducing agent, stir and react at 40-50° C. for 1-2 hours, separate the solid, wash and dry to obtain a conductive filler; Step 3: Dissolve 3 to 8 parts of acrylamide in 70 to 90 parts of deionized water by mass, stir and dissolve at 50 to 60° C., add 2 to 4 parts of a hydrophobic monomer, 0.06 to 0.08 parts of a cross-linker MBA, 2 to 5 parts of the aldehyde-modified polysaccharide prepared in step 1, 1 to 6 parts of the hydrazide-modified polysaccharide prepared in step 1, and 2 to 5 parts of the conductive filler prepared in step 2, and react at 50 to 60° C. with N2 for 1 to 3 hours, add 0.1 to 0.5 parts of an initiator dropwise, and react at 60 to 70° C. for 1 to 2 hours to obtain a self-healing conductive hydrogel material based on dynamic acylhydrazone bonds and hydrogen bonds; The natural polysaccharide includes any one of pectin, guar gum, starch, agar and lignin; The carbon-based material includes any one of graphene, graphene oxide, silicon carbide fiber, carbon powder and multi-walled carbon nanotubes.

2. The method for preparing a self-healing conductive hydrogel material based on dynamic acylhydrazone bonds and hydrogen bonds according to claim 1, wherein: The oxidant includes any one of sodium periodate, sodium hypochlorite, hydrogen peroxide and ferric oxychloride.

3. The method for preparing a self-healing conductive hydrogel material based on dynamic acylhydrazone bonds and hydrogen bonds according to claim 1, wherein: The hydrazide modifier includes any one of adipic acid dihydrazide, succinic acid dihydrazide, maleic acid dihydrazide and p-nitrobenzoyl hydrazide.

4. The method for preparing a self-healing conductive hydrogel material based on dynamic acylhydrazone bonds and hydrogen bonds according to claim 1, wherein: The reducing agent includes any one of polydopamine, sodium sulfite and L-cysteine.

5. The method for preparing a self-repairing conductive hydrogel material based on dynamic acylhydrazone bonds and hydrogen bonds according to claim 1, wherein: The hydrophobic monomer includes any one of octadecyl methacrylate, isooctyl acrylate, isobutyl acrylate, isodecyl acrylate, isobutyl methacrylate and octyl methacrylate.

6. The method for preparing a self-healing conductive hydrogel material based on dynamic acylhydrazone bonds and hydrogen bonds according to claim 1, wherein: The initiator includes one of sodium persulfate, ammonium persulfate and potassium persulfate.

7. A self-healing conductive hydrogel material based on dynamic acylhydrazone bonds and hydrogen bonds prepared by the method according to any one of claims 1 to 6.

8. Use of the self-healing conductive hydrogel material based on dynamic acylhydrazone bonds and hydrogen bonds as claimed in claim 7 in a flexible strain sensor.

Images