Deep low temperature refrigeration device and refrigeration method thereof

Abstract

The invention discloses a deep low temperature refrigeration device and a refrigeration method thereof, and relates to the field of refrigeration equipment. The circulating refrigeration equipment comprises a refrigeration chamber, a first heat exchange assembly and a second heat exchange assembly, wherein the first heat exchange assembly has a medium outlet, a first medium inlet and a second medium inlet; the second heat exchange assembly comprises a main throttling element, a main evaporator and a first heat exchanger; the medium outlet, a high pressure pipeline, a first heat exchanger, a bypass pipeline and a second medium inlet can be connected in sequence, and the medium outlet, the high pressure pipeline, the main throttling element, the main evaporator, the low pressure pipeline and the first medium inlet can be connected in sequence; the main evaporator and the first heat exchanger can cool the temperature platform; the vibration reduction device has a pipeline channel, and the pipeline inlets and outlets of the refrigeration chamber and the test chamber are respectively connected to the two ends of the pipeline channel, and the high pressure pipeline, the low pressure pipeline and the bypass pipeline are all arranged in the pipeline channel, and the vibration reduction device can reduce the vibration of the high pressure pipeline, the low pressure pipeline and the bypass pipeline. The refrigeration efficiency is high and the vibration is low.

Description

Technical Field

[0001] The present invention relates to the technical field of refrigeration equipment, and in particular to a deep-cryogenic refrigeration device and a refrigeration method thereof. Background Art

[0002] The development of technologies such as cryo-electron microscopy, quantum measurement, and mid- and far-infrared detection not only puts forward the demand for a deep-low temperature working environment, but also imposes strict requirements on indicators such as temperature stability, vibration, and cooling time of refrigeration equipment.

[0003] Compared with the wet refrigeration technology of the cryogenic medium dewar, the dry refrigeration technology based on mechanical refrigeration has the advantages of long life, economy, small size and light weight, and has become the mainstream refrigeration device for low-temperature testing instruments. However, mechanical refrigerators have problems such as low temperature stability, high vibration, long cooling time and rewarming time, which restricts their application in instruments with ultra-high temperature stability, ultra-low vibration and fast sample replacement.

[0004] Existing cryogenic refrigeration devices generally include a refrigerator, a test platform and a cold chain. The refrigeration end of the refrigerator is connected to the test platform through a cold chain, and the test platform is cooled by the cold chain. This type of cryogenic refrigeration device only relies on the cold chain for heat conduction and vibration reduction, and has poor low temperature stability, large vibration and slow cooling speed. Summary of the invention

[0005] The object of the present invention is to provide a deep-cryogenic refrigeration device and a refrigeration method thereof, so as to solve the problems existing in the prior art, improve the refrigeration efficiency, and reduce the vibration of the circulating refrigeration equipment.

[0006] To achieve the above object, the present invention provides the following solutions:

[0007] The present invention provides a cryogenic refrigeration device, comprising a circulating refrigeration device, a vibration reduction device and a test platform device, wherein:

[0008] The circulating refrigeration equipment includes a refrigeration chamber, a first heat exchange component and a second heat exchange component, the first heat exchange component is connected to the refrigeration chamber, the first heat exchange component has a medium outlet, a first medium inlet and a second medium inlet, the medium outlet, the first medium inlet and the second medium inlet are all arranged in the refrigeration chamber; the second heat exchange component includes a main throttling element, a main evaporator and a No. 1 heat exchanger, the inlet of the main throttling element and the inlet of the No. 1 heat exchanger are both connected to the medium outlet through a high-pressure pipeline, the outlet of the main throttling element is connected to the inlet of the main evaporator, the outlet of the main evaporator is connected to the first medium inlet through a low-pressure pipeline, and the outlet of the No. 1 heat exchanger is connected to the second medium inlet through a bypass pipeline; the medium outlet, the high-pressure pipeline, the No. 1 heat exchanger, the bypass pipeline, and the second medium inlet can be connected in sequence to form a first cooling circuit, and the medium outlet, the high-pressure pipeline, the main throttling element, the main evaporator, the low-pressure pipeline and the first medium inlet can be connected in sequence to form a second cooling circuit;

[0009] The test platform device comprises a test chamber and a temperature platform, wherein the temperature platform is arranged in the test chamber; the main evaporator and the first heat exchanger can both cool the temperature platform;

[0010] The vibration damping device has a pipeline channel, the pipeline inlet and outlet of the refrigeration chamber and the pipeline inlet and outlet of the test chamber are respectively sealed and connected to the two ends of the pipeline channel, the high-pressure pipeline, the low-pressure pipeline and the bypass pipeline are all penetrated in the pipeline channel, the high-pressure pipeline, the low-pressure pipeline and the bypass pipeline are all fixedly connected to the vibration damping device, and the vibration damping device can reduce vibration of the high-pressure pipeline, the low-pressure pipeline and the bypass pipeline.

[0011] Preferably, the vibration damping device includes a vibration damping body and a partition, the vibration damping body has the pipeline channel, the partition is fixedly connected to the pipeline channel of the vibration damping body and divides the vibration damping body into two cavities, the partition has three through holes, the high-pressure pipeline, the low-pressure pipeline and the bypass pipeline each pass through one of the through holes, the high-pressure pipeline, the low-pressure pipeline and the bypass pipeline are all sealed and connected to the corresponding through holes, and the vibration damping body can reduce vibration of the high-pressure pipeline, the low-pressure pipeline and the bypass pipeline.

[0012] Preferably, it further comprises a first vibration-damping base, the partition is fixedly connected to the first vibration-damping base, and the first vibration-damping base can reduce vibration of the partition.

[0013] Preferably, the test platform device further comprises a second vibration damping base, the temperature platform is connected to the second vibration damping base, and the second vibration damping base can dampen the vibration of the temperature platform.

[0014] Preferably, the refrigeration chamber is provided with a refrigerator, and the first heat exchange component includes a gaseous medium storage tank, a compressor, a first-stage heat exchanger, a second-stage heat exchanger, a third-stage heat exchanger, a second heat exchanger, a third heat exchanger, a secondary throttling element, a secondary evaporator, a liquid medium storage tank, a first valve, a second valve and a third valve; the first-stage heat exchanger has a first heat exchange channel, a second heat exchange channel, a third heat exchange channel and a fourth heat exchange channel, the second-stage heat exchanger has a fifth heat exchange channel and a sixth heat exchange channel, and the third-stage heat exchanger has a seventh heat exchange channel and an eighth heat exchange channel; the third heat exchanger has a first medium channel, and the second heat exchanger has a second medium channel; the refrigerator has a first cold head and a second cold head; the third heat exchanger and the second heat exchanger are in contact with the first cold head and the second cold head respectively; the inlet of the compressor is connected to the outlet of the gaseous medium storage tank; the outlet of the compressor, the first heat exchange channel, the first medium channel, the fifth heat exchange channel, the second medium channel, the seventh The heat exchange channel, the secondary throttling element, the secondary evaporator, the eighth heat exchange channel, the sixth heat exchange channel, the second heat exchange channel, the No. 1 valve and the inlet of the compressor can be connected in sequence to form a heat exchange circuit; the outlet of the compressor, the first heat exchange channel, the first medium channel, the fifth heat exchange channel, the second medium channel, the seventh heat exchange channel, the liquid medium storage tank, the high-pressure pipeline, the No. 1 heat exchanger, the bypass pipeline, the fourth heat exchange channel, the No. 3 valve, and the inlet of the compressor can be connected in sequence to form the first cooling circuit; the outlet of the compressor, the first heat exchange channel, the first medium channel, the fifth heat exchange channel, the second medium channel, the seventh heat exchange channel, the liquid medium storage tank, the high-pressure pipeline, the main throttling element, the main evaporator, the low-pressure pipeline, the third heat exchange channel, the No. 2 valve and the inlet of the compressor can be connected in sequence to form the second cooling circuit.

[0015] Preferably, it also includes a primary refrigeration base plate, a secondary refrigeration base plate, a primary refrigeration cold screen and a secondary refrigeration cold screen, the primary refrigeration base plate and the secondary refrigeration base plate are fixedly connected to the primary cold head and the secondary cold head respectively, the primary refrigeration base plate and the primary refrigeration cold screen can be fixedly connected to form a first cooling cover, the secondary refrigeration base plate and the secondary refrigeration cold screen can be fixedly connected to form a second cooling cover, the primary refrigeration base plate and the primary refrigeration cold screen are both arranged in the refrigeration room, the secondary refrigeration base plate and the secondary refrigeration cold screen are both arranged in the first cooling cover, the primary heat exchanger is arranged between the inner wall of the refrigeration room and the outer wall of the first cooling cover, the secondary heat exchanger is arranged between the inner wall of the first cooling cover and the outer wall of the second cooling cover, the tertiary heat exchanger, the secondary throttling element, the secondary evaporator and the liquid medium storage tank are arranged in the second cooling cover.

[0016] Preferably, the temperature platform includes a first-level temperature platform, a first-level platform cold screen, a second-level temperature platform, a second-level platform cold screen, a third-level temperature platform and a third-level platform cold screen arranged in the test chamber; the first-level platform cold screen can be fixedly connected to the first-level temperature platform to form a first test cover, the second-level platform cold screen can be fixedly connected to the second-level temperature platform to form a second test cover, the third-level platform cold screen can be fixedly connected to the third-level temperature platform to form a third test cover, the first test cover is arranged in the test chamber, the second test cover is arranged in the first test cover, and the third test cover is arranged in the second test cover; the third test cover is connected to the second test cover, the second test cover is connected to the first test cover, and the first test cover is connected to the second vibration damping base.

[0017] Preferably, the second heat exchange component also includes a fourth-stage heat exchanger, a fourth heat exchanger, a fifth heat exchanger, a sixth heat exchanger, and a seventh heat exchanger, and the first heat exchange component also includes an eighth heat exchanger and a ninth heat exchanger; the fourth-stage heat exchanger has a ninth heat exchange channel and a tenth heat exchange channel, the first heat exchanger has a third medium channel, the fourth heat exchanger has a fourth medium channel, the fifth heat exchanger has a fifth medium channel, the sixth heat exchanger has a sixth medium channel, the seventh heat exchanger has a seventh medium channel, the eighth heat exchanger has an eighth medium channel, and the ninth heat exchanger has a ninth medium channel; the outlet of the compressor, the first heat exchange channel, the first medium channel, the fifth heat exchange channel, the second medium channel, the seventh heat exchange channel, the liquid medium storage tank, the high-pressure pipeline, The tenth heat exchange channel, the third medium channel, the fifth medium channel, the seventh medium channel, the bypass pipeline, the ninth medium channel, the fourth heat exchange channel, the No. 3 valve, and the inlet of the compressor can be connected in sequence to form the first cooling circuit; the outlet of the compressor, the first heat exchange channel, the first medium channel, the fifth heat exchange channel, the second medium channel, the seventh heat exchange channel, the liquid medium storage tank, the high-pressure pipeline, the tenth heat exchange channel, the main throttling element, the main evaporator, the ninth heat exchange channel, the fourth medium channel, the sixth medium channel, the low-pressure pipeline, the eighth medium channel, the third heat exchange channel, the No. 2 valve, and the inlet of the compressor can be connected in sequence to form the second cooling circuit.

[0018] The present invention also provides a cryogenic refrigeration method based on the cryogenic refrigeration device, comprising the following steps:

[0019] Placing a sample and / or a test instrument on the temperature platform, allowing a cooling medium to circulate in the first cooling circuit, and cooling the temperature platform through the first heat exchanger;

[0020] When the temperature of the temperature platform reaches the set temperature, the cooling medium is circulated in the second cooling circuit, and the temperature platform is cooled by the main evaporator; the sample is tested and / or the test instrument is tested;

[0021] In the process of cooling the temperature platform, the vibration of the high-pressure pipeline, the low-pressure pipeline and the bypass pipeline is reduced by the vibration reduction device.

[0022] Preferably, the first heat exchange component includes a gas medium storage tank, a refrigerator, a compressor, a primary heat exchanger, a secondary heat exchanger, a tertiary heat exchanger, a No. 3 heat exchanger, a No. 2 heat exchanger, a secondary throttling element, a secondary evaporator, a liquid medium storage tank, a No. 1 valve, a No. 2 valve and a No. 3 valve; the primary heat exchanger has a first heat exchange channel, a second heat exchange channel, a third heat exchange channel and a fourth heat exchange channel, the secondary heat exchanger has a fifth heat exchange channel and a sixth heat exchange channel, and the third heat exchanger has a seventh heat exchange channel and an eighth heat exchange channel; the No. 3 heat exchanger has a first medium channel, and the No. 2 heat exchanger has a second medium channel; the refrigerator has a primary cold head and a secondary cold head; the No. 3 heat exchanger and the No. 2 heat exchanger are in contact with the primary cold head and the secondary cold head respectively; the inlet of the compressor is connected to the outlet of the gas medium storage tank; the outlet of the compressor, the first heat exchange channel, the first medium channel, the fifth heat exchange channel, the second medium channel, the seventh heat exchange channel , the secondary throttling element, the secondary evaporator, the eighth heat exchange channel, the sixth heat exchange channel, the second heat exchange channel, the No. 1 valve and the inlet of the compressor can be connected in sequence to form a heat exchange circuit; the outlet of the compressor, the first heat exchange channel, the first medium channel, the fifth heat exchange channel, the second medium channel, the seventh heat exchange channel, the liquid medium storage tank, the high-pressure pipeline, the No. 1 heat exchanger, the bypass pipeline, the fourth heat exchange channel, the No. 3 valve, and the inlet of the compressor can be connected in sequence to form the first cooling circuit; the outlet of the compressor, the first heat exchange channel, the first medium channel, the fifth heat exchange channel, the second medium channel, the seventh heat exchange channel, the liquid medium storage tank, the high-pressure pipeline, the main throttling element, the main evaporator, the low-pressure pipeline, the third heat exchange channel, the No. 2 valve and the inlet of the compressor can be connected in sequence to form the second cooling circuit;

[0023] Turn on the refrigerator, open the No. 1 valve, close the No. 2 valve and the No. 3 valve, drive the cooling medium in the gaseous medium storage tank to flow in the heat exchange circuit through the compressor, when the cooling medium flows through the No. 3 heat exchanger, the first-level cold head performs first-level cooling on the cooling medium, when the cooling medium flows through the No. 2 heat exchanger, the second-level cold head performs second-level cooling on the cooling medium, the cooling medium changes from gas to liquid after flowing through the secondary throttling element, and when the cooling medium flows through the secondary evaporator, the secondary evaporator performs tertiary cooling on the cooling medium;

[0024] When the cooling medium in the heat exchange circuit reaches the set temperature, the No. 1 valve is closed, the No. 3 valve is opened, and the cooling medium is driven to flow in the first cooling circuit by the compressor. When the cooling medium flows through the No. 1 heat exchanger, it can absorb the heat of the temperature platform;

[0025] When the temperature of the temperature platform reaches the set temperature, the No. 3 valve is closed, the No. 2 valve is opened, and the compressor drives the cooling medium to flow in the second cooling circuit. The main throttling element reduces the temperature of the cooling medium flowing through the main throttling element, and the cooling medium can absorb the heat of the temperature platform when flowing through the main evaporator.

[0026] Compared with the prior art, the present invention has achieved the following technical effects:

[0027] The present invention provides a deep-cryogenic refrigeration device and a refrigeration method thereof, comprising a circulating refrigeration device, a vibration reduction device and a test platform device, wherein the circulating refrigeration device comprises a refrigeration chamber, a first heat exchange component and a second heat exchange component, wherein the first heat exchange component has a medium outlet, a first medium inlet and a second medium inlet, and the medium outlet, the first medium inlet and the second medium inlet are all arranged in the refrigeration chamber; the second heat exchange component comprises a main throttling element, a main evaporator and a No. 1 heat exchanger, wherein the inlet of the main throttling element is connected to the medium outlet through a high-pressure pipeline, the two outlets of the main throttling element are respectively connected to the inlet of the main evaporator and the inlet of the No. 1 heat exchanger, the outlet of the main evaporator is connected to the first medium inlet through a low-pressure pipeline, and the outlet of the No. 1 heat exchanger is connected to the second medium inlet through a bypass pipeline; the medium outlet, the high-pressure pipeline, The No. 1 heat exchanger, the bypass pipeline, and the second medium inlet can be connected in sequence to form a first cooling circuit, and the medium outlet, the high-pressure pipeline, the main throttling element, the main evaporator, the low-pressure pipeline and the first medium inlet can be connected in sequence to form a second cooling circuit; the test platform device includes a test chamber and a three-level temperature platform, and the three-level temperature platform is arranged in the test chamber; the main evaporator and the No. 1 heat exchanger can both cool the three-level temperature platform; the vibration reduction device has a pipeline channel, and the pipeline inlet and outlet of the refrigeration chamber and the pipeline inlet and outlet of the test chamber are respectively sealed and connected to the two ends of the pipeline channel, and the high-pressure pipeline, the low-pressure pipeline and the bypass pipeline are all arranged in the pipeline channel, and the high-pressure pipeline, the low-pressure pipeline and the bypass pipeline are all fixedly connected to the vibration reduction device, and the vibration reduction device can reduce the vibration of the high-pressure pipeline, the low-pressure pipeline and the bypass pipeline.

[0028] The present invention first allows the cooling medium to circulate in the first cooling circuit, and cools the three-level temperature platform through the No. 1 heat exchanger in the first cooling circuit. When the temperature of the three-level temperature platform reaches the set temperature, the cooling medium is circulated in the second cooling circuit, and the three-level temperature platform is cooled through the main evaporator; the present invention divides the refrigeration of the three-level temperature platform into two stages, and performs graded refrigeration, which can improve the refrigeration efficiency. The present invention uses a vibration reduction device to reduce the vibration of the high-pressure pipeline, the low-pressure pipeline and the bypass pipeline, thereby reducing the influence of the vibration of the circulating refrigeration equipment on the three-level temperature platform. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0030] Figure 1 A schematic diagram of the structure of a cryogenic refrigeration device provided in Example 1;

[0031] Figure 2 A schematic diagram of the structure of a refrigerator provided in Example 1;

[0032] Figure 3 A schematic diagram of the structure of the test platform device provided in Example 1;

[0033] Figure 4 A schematic diagram of the structure of the vibration reduction device provided in Example 1;

[0034] Figure 5 A schematic diagram of the structure of the circulating refrigeration equipment provided in Example 1;

[0035] In the figure: 100, cryogenic refrigeration device; 1, refrigeration chamber; 1.1, refrigerator; 1.2, refrigeration base plate; 1.3, refrigeration cover; 1.4, primary refrigeration base plate; 1.5, secondary refrigeration base plate; 1.6, primary refrigeration cold screen; 1.7, secondary refrigeration cold screen; 2, test platform device; 2.1, second vibration reduction base; 2.2, test base plate; 2.3, test cover; 2.4, primary temperature platform; 2.5, primary platform cold screen; 2.6, secondary temperature platform; 2.7, secondary platform Cold shield; 2.8, three-level temperature platform; 2.9, three-level platform cold shield; 2.10, first-level support; 2.11, second-level support; 2.12, third-level support; 3, vibration reduction device; 3.1, first vibration reduction base; 3.2, left outer bellows; 3.3, right outer bellows; 3.4, left inner bellows; 3.5, right inner bellows; 3.6, partition; 3.7, through-plate joint; 4, helium throttling cycle refrigeration module; 4.1, compressor; 4.2, gaseous medium storage tank; 4. 3.1, valve No. 1; 4.3.2, valve No. 2; 4.3.3, valve No. 3; 4.3.4, valve No. 4; 4.4.1, primary heat exchanger; 4.4.2, secondary heat exchanger; 4.4.3, third heat exchanger; 4.4.4, fourth heat exchanger; 4.5.1, heat exchanger No. 1; 4.5.2, heat exchanger No. 2; 4.5.3, heat exchanger No. 3; 4.5.4, heat exchanger No. 4; 4.5.5, heat exchanger No. 5; 4.5.6, heat exchanger No. 6; 4.5.7, heat exchanger No. 7 No. 1 heat exchanger; 4.5.8, No. 8 heat exchanger; 4.5.9, No. 9 heat exchanger; 4.6, main throttling element; 4.7, main evaporator; 4.8, secondary throttling element; 4.9, secondary evaporator; 4.10, liquid medium storage tank; 4.11, high-pressure pipeline; 4.12, low-pressure pipeline; 4.13, bypass pipeline; 4.14.1, No. 1 cold chain; 4.14.2, No. 2 cold chain; 4.14.3, No. 3 cold chain; 4.14.4, No. 4 cold chain; 4.14.5, No. 5 cold chain. DETAILED DESCRIPTION

[0036] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0037] The object of the present invention is to provide a deep-cryogenic refrigeration device and a refrigeration method thereof, so as to solve the problems existing in the prior art, improve the refrigeration efficiency, and reduce the vibration of the circulating refrigeration equipment.

[0038] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0039] Example 1

[0040] like Figures 1 to 5 As shown, this embodiment provides a deep low temperature refrigeration device 100, including a circulating refrigeration device, a test platform device 2 and a vibration reduction device 3, wherein: the circulating refrigeration device includes a refrigeration chamber 1, a first heat exchange component and a second heat exchange component, the first heat exchange component is connected to the refrigeration chamber 1, the first heat exchange component has a medium outlet, a first medium inlet and a second medium inlet, and the medium outlet, the first medium inlet and the second medium inlet are all arranged in the refrigeration chamber 1; the second heat exchange component includes a main throttling element 4.6, a main evaporator 4.7 and a first heat exchanger 4.5.1, the inlet of the main throttling element 4.6 and the inlet of the first heat exchanger 4.5.1 are both connected to the medium outlet through a high-pressure pipeline 4.11, the outlet of the main throttling element 4.6 is connected to the inlet of the main evaporator 4.7, the outlet of the main evaporator 4.7 is connected to the first medium inlet through a low-pressure pipeline 4.12, and the outlet of the first heat exchanger 4.5.1 is connected to the second medium inlet through a bypass pipeline 4.13; the medium outlet, the high-pressure pipeline 4.11 , the first heat exchanger 4.5.1, the bypass pipeline 4.13, and the second medium inlet can be connected in sequence to form a first cooling circuit, and the medium outlet, the high-pressure pipeline 4.11, the main throttling element 4.6, the main evaporator 4.7, the low-pressure pipeline 4.12 and the first medium inlet can be connected in sequence to form a second cooling circuit; the test platform device 2 includes a test room and a temperature platform, and the temperature platform is arranged in the test room; the main evaporator 4.7 and the first heat exchanger 4.5.1 can both control the temperature platform Cooling; the vibration reduction device 3 has a pipeline channel, the pipeline inlet and outlet of the refrigeration chamber 1 and the pipeline inlet and outlet of the test chamber are respectively sealed and connected to the two ends of the pipeline channel, the high-pressure pipeline 4.11, the low-pressure pipeline 4.12 and the bypass pipeline 4.13 are all penetrated in the pipeline channel, the high-pressure pipeline 4.11, the low-pressure pipeline 4.12 and the bypass pipeline 4.13 are all fixedly connected to the vibration reduction device 3, and the vibration reduction device 3 can reduce the vibration of the high-pressure pipeline 4.11, the low-pressure pipeline 4.12 and the bypass pipeline 4.13.

[0041] In this embodiment, the cooling medium is first circulated in the first cooling circuit, and its flow rate is relatively large. The temperature platform can be cooled through the No. 1 heat exchanger 4.5.1 in the first cooling circuit, so that the temperature of the temperature platform is quickly reduced from room temperature to the set temperature; then, the cooling medium is circulated in the second cooling circuit, and the temperature platform is further cooled through the main evaporator 4.7 and the main throttling element 4.6; this embodiment divides the refrigeration of the temperature platform into two stages, and performs graded refrigeration, which can reduce power consumption and improve refrigeration efficiency. The refrigeration chamber 1 and the test chamber of this embodiment are sealed and connected through the pipeline channel of the vibration reduction device 3, so that the three can form a closed chamber. By evacuating the closed chamber, the vacuum degree requirement of deep low temperature test can be met; the high pressure pipeline 4.11, the low pressure pipeline 4.12 and the bypass pipeline 4.13 are damped by the vibration reduction device 3, so as to reduce the influence of the vibration of the circulating refrigeration equipment on the temperature platform.

[0042] In this embodiment, the vibration reduction device 3 includes a vibration reduction body and a partition 3.6, the vibration reduction body has a pipeline channel, the partition 3.6 is fixedly connected to the pipeline channel of the vibration reduction body and divides the vibration reduction body into two cavities, the partition 3.6 has three through holes, the high-pressure pipeline 4.11, the low-pressure pipeline 4.12 and the bypass pipeline 4.13 each pass through a through hole, the high-pressure pipeline 4.11, the low-pressure pipeline 4.12 and the bypass pipeline 4.13 are all sealed and connected to the corresponding through holes, the high-pressure pipeline 4.11, the low-pressure pipeline 4.12 and the bypass pipeline 4.13 are all fixedly connected to the vibration reduction body, and the vibration reduction body can reduce the vibration of the high-pressure pipeline 4.11, the low-pressure pipeline 4.12 and the bypass pipeline 4.13. The vibration reduction body is preferably a bellows.

[0043] In this embodiment, a first vibration damping base 3.1 is further included, and a partition 3.6 is fixedly connected to the first vibration damping base 3.1. The first vibration damping base 3.1 can dampen the vibration of the partition 3.6. It should be noted that the lower end of the partition 3.6 extends out of the vibration damping body to be connected to the first vibration damping base 3.1, and the partition 3.6 is sealed to the vibration damping body.

[0044] In this embodiment, the test platform device 2 further includes a second vibration damping base 2.1, the temperature platform is connected to the second vibration damping base 2.1, and the second vibration damping base 2.1 can dampen the vibration of the temperature platform.

[0045] In this embodiment, the refrigeration chamber 1 is provided with a refrigerator 1.1, and the first heat exchange assembly includes a gas medium storage tank 4.2, a compressor 4.1, a primary heat exchanger 4.4.1, a secondary heat exchanger 4.4.2, a tertiary heat exchanger 4.4.3, a second heat exchanger 4.5.2, a third heat exchanger 4.5.3, a secondary throttling element 4.8, a secondary evaporator 4.9, a liquid medium storage tank 4.10, a first valve 4.3.1, a second valve 4.3.2 and a third valve 4.3.3; the primary heat exchanger 4.4.1 has a first heat exchange channel, a second heat exchange channel, The third heat exchange channel and the fourth heat exchange channel, the secondary heat exchanger 4.4.2 has the fifth heat exchange channel and the sixth heat exchange channel, the third heat exchanger 4.4.3 has the seventh heat exchange channel and the eighth heat exchange channel; the third heat exchanger 4.5.3 has the first medium channel, and the second heat exchanger 4.5.2 has the second medium channel; the refrigerator 1.1 has a primary cold head and a secondary cold head; the third heat exchanger 4.5.3 and the second heat exchanger 4.5.2 are in contact with the primary cold head and the secondary cold head respectively; the inlet of the compressor 4.1 is connected to the outlet of the gaseous medium storage tank 4.2; the compressor The outlet of 4.1, the first heat exchange channel, the first medium channel, the fifth heat exchange channel, the second medium channel, the seventh heat exchange channel, the secondary throttling element 4.8, the secondary evaporator 4.9, the eighth heat exchange channel, the sixth heat exchange channel, the second heat exchange channel, the No. 1 valve 4.3.1 and the inlet of the compressor 4.1 can be connected in sequence to form a heat exchange loop; the outlet of the compressor 4.1, the first heat exchange channel, the first medium channel, the fifth heat exchange channel, the second medium channel, the seventh heat exchange channel, the liquid medium storage tank 4.10, the high-pressure pipeline 4.11, the No. 1 heat exchanger 4.5 .1, bypass pipeline 4.13, the fourth heat exchange channel, No. 3 valve 4.3.3, and the inlet of the compressor 4.1 can be connected in sequence to form a first cooling circuit; the outlet of the compressor 4.1, the first heat exchange channel, the first medium channel, the fifth heat exchange channel, the second medium channel, the seventh heat exchange channel, the liquid medium storage tank 4.10, the high-pressure pipeline 4.11, the main throttling element 4.6, the main evaporator 4.7, the low-pressure pipeline 4.12, the third heat exchange channel, No. 2 valve 4.3.2 and the inlet of the compressor 4.1 can be connected in sequence to form a second cooling circuit.

[0046] In this embodiment, it also includes a primary refrigeration base plate 1.4, a secondary refrigeration base plate 1.5, a primary refrigeration cold shield 1.6 and a secondary refrigeration cold shield 1.7. The primary refrigeration base plate 1.4 and the secondary refrigeration base plate 1.5 are fixedly connected to the primary cold head and the secondary cold head respectively. The primary refrigeration base plate 1.4 and the primary refrigeration cold shield 1.6 are fixedly connected to form a first cooling cover. The secondary refrigeration base plate 1.5 and the secondary refrigeration cold shield 1.7 are fixedly connected to form a second cooling cover. The primary refrigeration base plate 1.4 and the primary refrigeration cold shield 1.6 are both arranged in the refrigeration chamber 1, the secondary refrigeration base plate 1.5 and the secondary refrigeration cold shield 1.7 are both arranged in the first cooling cover, the primary heat exchanger 4.4.1 is arranged between the inner wall of the refrigeration chamber 1 and the outer wall of the first cooling cover, the secondary heat exchanger 4.4.2 is arranged between the inner wall of the first cooling cover and the outer wall of the second cooling cover, and the tertiary heat exchanger 4.4.3, the secondary throttling element 4.8, the secondary evaporator 4.9 and the liquid medium storage tank 4.10 are arranged in the second cooling cover.

[0047] In this embodiment, the temperature platform includes a first-level temperature platform 2.4, a second-level temperature platform 2.6, a first-level platform cold screen 2.5, a second-level platform cold screen 2.7, a third-level temperature platform 2.8 and a third-level platform cold screen 2.9 arranged in the test room. The first-level platform cold screen 2.5 is fixedly connected to the first-level temperature platform 2.4 to form a first test cover, the second-level platform cold screen 2.7 is fixedly connected to the second-level temperature platform 2.6 to form a second test cover, the third-level platform cold screen 2.9 is fixedly connected to the third-level temperature platform 2.8 to form a third test cover, the first test cover is arranged in the test room, the second test cover is arranged in the first test cover, and the third test cover is arranged in the second test cover; the third test cover is connected to the second test cover, the second test cover is connected to the first test cover, and the first test cover is connected to the second vibration damping base 2.1. The test platform device 2 has a multi-stage radiation cold shield structure. By controlling the temperature of the first-stage cold shield 2.5 and the second-stage cold shield 2.7, the temperature influence of the external temperature change on the third-stage temperature platform 2.8 and the third-stage cold shield 2.9 can be effectively reduced, and the temperature stability of the third-stage temperature platform 2.8 and the third-stage cold shield 2.9 can be improved. At the same time, setting three temperature platforms can ensure a wider range of deep low temperature temperature testing.

[0048] In this embodiment, the second heat exchange component also includes a fourth-stage heat exchanger 4.4.4, a fourth heat exchanger 4.5.4, a fifth heat exchanger 4.5.5, a sixth heat exchanger 4.5.6, and a seventh heat exchanger 4.5.7, and the first heat exchange component also includes an eighth heat exchanger 4.5.8 and a ninth heat exchanger 4.5.9; the fourth-stage heat exchanger 4.4.4 has a ninth heat exchange channel and a tenth heat exchange channel, the first heat exchanger 4.5.1 has a third medium channel, the fourth heat exchanger 4.5.4 has a fourth medium channel, the fifth heat exchanger 4.5.5 has a fifth medium channel, the sixth heat exchanger 4.5.6 has a sixth medium channel, the seventh heat exchanger 4.5.7 has a seventh medium channel, the eighth heat exchanger 4.5.8 has an eighth medium channel, and the ninth heat exchanger 4.5.9 has a ninth medium channel; the outlet of the compressor 4.1, the first heat exchange channel, the first medium channel, the fifth heat exchange channel The first heat exchange channel, the second medium channel, the seventh heat exchange channel, the liquid medium storage tank 4.10, the high-pressure pipeline 4.11, the tenth heat exchange channel, the third medium channel, the fifth medium channel, the seventh medium channel, the bypass pipeline 4.13, the ninth medium channel, the fourth heat exchange channel, the No. 3 valve 4.3.3, and the inlet of the compressor 4.1 can be connected in sequence to form a first cooling circuit; the outlet of the compressor 4.1, the first heat exchange channel, the first medium channel, the fifth heat exchange channel, the second medium channel, the seventh heat exchange channel, the liquid medium storage tank 4.10, the high-pressure pipeline 4.11, the tenth heat exchange channel, the main throttling element 4.6, the main evaporator 4.7, the ninth heat exchange channel, the fourth medium channel, the sixth medium channel, the low-pressure pipeline 4.12, the eighth medium channel, the third heat exchange channel, the No. 2 valve 4.3.2 and the inlet of the compressor 4.1 can be connected in sequence to form a second cooling circuit.

[0049] As a preferred embodiment, the vibration damping body includes a left outer bellows 3.2, a right outer bellows 3.3, a left inner bellows 3.4, and a right inner bellows 3.5. The left outer bellows 3.2 is sleeved on the outside of the left inner bellows 3.4, and both are arranged on one side of the partition 3.6; the right outer bellows 3.3 is sleeved on the outside of the right inner bellows 3.5, and both are arranged on the other side of the partition 3.6; the two ends of the left outer bellows 3.2 are respectively sealedly connected to the pipeline inlet and outlet of the test chamber and the partition 3.6, and the two ends of the left inner bellows 3.4 are respectively sealedly connected to the pipeline inlet and outlet of the first test cover and the partition 3.6; the two ends of the right outer bellows 3.3 are respectively sealedly connected to the pipeline inlet and outlet of the refrigeration chamber 1 and the partition 3.6, and the two ends of the right inner bellows 3.5 are respectively sealedly connected to the pipeline inlet and outlet of the first cooling cover and the partition 3.6.

[0050] As a preferred embodiment, a through-plate joint 3.7 is provided at each through hole, and the high-pressure pipeline 4.11, the low-pressure pipeline 4.12 and the bypass pipeline 4.13 are all connected to the partition plate 3.6 through a through-plate joint 3.7 and sealed.

[0051] As a preferred embodiment, the test chamber includes a detachably connected test base plate 2.2 and a test cover 2.3, and a second vibration damping base 2.1 is fixedly connected below the test base plate 2.2. The test platform device 2 also includes a primary support 2.10, a secondary support 2.11, and a tertiary support 2.12. The two ends of the primary support 2.10 are respectively fixedly connected to the test base plate 2.2 and the primary temperature platform 2.4, and the primary support 2.10 is used to support the primary temperature platform 2.4; the two ends of the secondary support 2.11 are respectively fixedly connected to the secondary temperature platform 2.6 and the primary temperature platform 2.4, and the secondary support 2.11 is used to support the secondary temperature platform 2.6; the two ends of the tertiary support 2.12 are respectively fixedly connected to the secondary temperature platform 2.6 and the tertiary temperature platform 2.8, and the tertiary support 2.12 is used to support the tertiary temperature platform 2.8. The test cover 2.3 is used to be set outside the test platform device 2, and the test cover 2.3 is provided with a pipeline inlet and outlet of the test chamber.

[0052] As a preferred embodiment, the gaseous medium storage tank 4.2 is used to store helium, and the liquid medium storage tank 4.10 is used to store liquid helium; the compressor 4.1 is a DC compressor; a No. 4 valve 4.3.4 is provided on the pipeline between the gaseous medium storage tank 4.2 and the compressor 4.1; the No. 1 valve 4.3.1, the No. 2 valve 4.3.2, the No. 3 valve 4.3.3, and the No. 4 valve 4.3.4 are all stop valves; the first-stage heat exchanger 4.4.1, the second-stage heat exchanger 4.4.2, the third-stage heat exchanger 4.4.3, and the fourth-stage heat exchanger 4.4.4 are all countercurrent multi-channel heat exchangers.

[0053] As a preferred embodiment, the third heat exchanger 4.5.3, the eighth heat exchanger 4.5.8 and the ninth heat exchanger 4.5.9 are fixedly connected to the primary refrigeration base plate 1.4 to achieve thermal coupling connection; the second heat exchanger 4.5.2 is fixedly connected to the secondary refrigeration base plate 1.5 to achieve thermal coupling connection; the secondary evaporator 4.9 is thermally coupled to the liquid medium storage tank 4.10; the main evaporator 4.7 is thermally coupled to the third temperature platform 2.8; the first heat exchanger 4.5.1 is thermally coupled to the third temperature platform 2.8 through the first cold chain 4.14.1, and the cold capacity of the first heat exchanger 4.5.1 is transmitted to the third temperature platform 2.8 through the first cold chain 4.14.1 to cool the third temperature platform 2.8; the fourth heat exchanger 4.5.4 and the fifth heat exchanger 4.5.5 are thermally coupled to the second heat exchanger 4.5.6. The first-level temperature platform 2.6 is fixedly connected to realize thermal coupling connection; the sixth heat exchanger 4.5.6 and the seventh heat exchanger 4.5.7 are thermally coupled to the first-level temperature platform 2.4 through the second cold chain 4.14.2 and the third cold chain 4.14.3 respectively, and the second cold chain 4.14.2 and the third cold chain 4.14.3 are used to transfer the cold capacity of the sixth heat exchanger 4.5.6 and the seventh heat exchanger 4.5.7 respectively to cool the first-level temperature platform 2.4; the low-pressure pipeline 4.12 is fixedly connected to the right side inner bellows 3.5 and the left side inner bellows 3.4 through the fourth cold chain 4.14.4 to realize thermal coupling connection; the bypass pipeline 4.13 is fixedly connected to the right side inner bellows 3.5 and the left side inner bellows 3.4 through the fifth cold chain 4.14.5 to realize thermal coupling connection. It should be noted that the thermal coupling connection in this embodiment refers to heat exchange by contact heat exchange.

[0054] As a preferred embodiment, the first vibration-damping base 3.1 and the second vibration-damping base 2.1 are both made of heavy solid materials. The first vibration-damping base 3.1 can reduce the mechanical vibration of the refrigerator 1.1 and the helium throttling cycle refrigeration module 4 (including all components forming the first cooling circuit and the second cooling circuit), and the second vibration-damping base 2.1 can reduce the impact of external environmental vibration on the test platform device 2. The first vibration-damping base 3.1 and the second vibration-damping base 2.1 can use vibration-damping materials such as rubber and foam for vibration reduction, and can also be combined with active vibration reduction measures to isolate vibration.

[0055] Example 2

[0056] This embodiment provides a cryogenic refrigeration method based on the cryogenic refrigeration device 100 of Embodiment 1, comprising the following steps:

[0057] Place the sample and / or the test instrument on the temperature platform, allow the cooling medium to circulate in the first cooling loop, and cool the temperature platform through the No. 1 heat exchanger 4.5.1; when the temperature of the temperature platform reaches the set temperature, allow the cooling medium to circulate in the second cooling loop, and cool the temperature platform through the main evaporator 4.7; test the sample and / or test the test instrument; in the process of cooling the temperature platform, use the vibration reduction device 3 to reduce vibration of the high-pressure pipeline 4.11, the low-pressure pipeline 4.12 and the bypass pipeline 4.13.

[0058] In this embodiment, the first heat exchange assembly includes a gas medium storage tank 4.2, a refrigerator 1.1, a compressor 4.1, a first heat exchanger 4.4.1, a second heat exchanger 4.4.2, a third heat exchanger 4.4.3, a third heat exchanger 4.5.3, a second heat exchanger 4.5.2, a secondary throttling element 4.8, a secondary evaporator 4.9, a liquid medium storage tank 4.10, a first valve 4.3.1, a second valve 4.3.2 and a third valve 4.3.3; the first heat exchanger 4.4.1 has a first heat exchange channel, a second heat exchange channel, a third heat exchange channel and The fourth heat exchange channel, the second heat exchanger 4.4.2 has the fifth heat exchange channel and the sixth heat exchange channel, the third heat exchanger 4.4.3 has the seventh heat exchange channel and the eighth heat exchange channel; the third heat exchanger 4.5.3 has the first medium channel, the second heat exchanger 4.5.2 has the second medium channel; the refrigerator 1.1 has a first cold head and a second cold head; the third heat exchanger 4.5.3 and the second heat exchanger 4.5.2 are in contact with the first cold head and the second cold head respectively; the inlet of the compressor 4.1 is connected to the outlet of the gaseous medium storage tank 4.2; the outlet of the compressor 4.1 The inlet of the compressor 4.1, the first heat exchange channel, the first medium channel, the fifth heat exchange channel, the second medium channel, the seventh heat exchange channel, the secondary throttling element 4.8, the secondary evaporator 4.9, the eighth heat exchange channel, the sixth heat exchange channel, the second heat exchange channel, the No. 1 valve 4.3.1 and the inlet of the compressor 4.1 can be connected in sequence to form a heat exchange loop; the outlet of the compressor 4.1, the first heat exchange channel, the first medium channel, the fifth heat exchange channel, the second medium channel, the seventh heat exchange channel, the liquid medium storage tank 4.10, the high-pressure pipeline 4.11, the No. 1 heat exchanger 4.5.1, The bypass pipeline 4.13, the fourth heat exchange channel, the No. 3 valve 4.3.3, and the inlet of the compressor 4.1 can be connected in sequence to form a first cooling circuit; the outlet of the compressor 4.1, the first heat exchange channel, the first medium channel, the fifth heat exchange channel, the second medium channel, the seventh heat exchange channel, the liquid medium storage tank 4.10, the high-pressure pipeline 4.11, the main throttling element 4.6, the main evaporator 4.7, the low-pressure pipeline 4.12, the third heat exchange channel, the No. 2 valve 4.3.2 and the inlet of the compressor 4.1 can be connected in sequence to form a second cooling circuit.

[0059] Turn on the refrigerator 1.1, open the No. 1 valve 4.3.1, close the No. 2 valve 4.3.2 and the No. 3 valve 4.3.3, drive the cooling medium in the gaseous medium storage tank 4.2 to flow in the heat exchange circuit through the compressor 4.1, when the cooling medium flows through the No. 3 heat exchanger 4.5.3, the first-stage cold head performs the first-stage cooling (first-stage pre-cooling) on ​​the cooling medium, when the cooling medium flows through the No. 2 heat exchanger 4.5.2, the second-stage cold head performs the second-stage cooling (second-stage pre-cooling) on ​​the cooling medium, after the cooling medium flows through the secondary throttling element 4.8, it changes from gas to liquid, when the cooling medium flows through the secondary evaporator 4.9, the secondary evaporator 4.9 performs the third-stage cooling on the cooling medium;

[0060] When the cooling medium in the heat exchange loop reaches the set temperature, the No. 1 valve 4.3.1 is closed, the No. 3 valve 4.3.3 is opened, and the cooling medium is driven to flow in the first cooling loop through the compressor 4.1. When the cooling medium flows through the No. 1 heat exchanger 4.5.1, it can absorb the heat of the temperature platform;

[0061] When the temperature of the temperature platform reaches the set temperature, the No. 3 valve 4.3.3 is closed, the No. 2 valve 4.3.2 is opened, and the cooling medium is driven to flow in the second cooling circuit through the compressor 4.1. The temperature of the cooling medium flowing through the main throttling element 4.6 is reduced, and the cooling medium can absorb the heat of the temperature platform when flowing through the main evaporator 4.7.

[0062] As a preferred embodiment, the temperature of the cooling medium after heat exchange in the third heat exchanger 4.5.3 is the same or approximately the same as the temperature of the first-stage cold head, which is about 80K, and the temperature of the cooling medium after heat exchange in the second heat exchanger 4.5.2 is the same or approximately the same as the temperature of the second-stage cold head, which is about 10K~20K.

[0063] As a preferred embodiment, the refrigeration chamber 1 comprises a refrigeration base plate 1.2 and a refrigeration cover 1.3 which are detachably fixedly connected.

[0064] The deep cryogenic refrigeration method of this embodiment specifically includes:

[0065] 1. Rapid cooling method:

[0066] Before the deep low temperature test, place the sample and / or test instrument on the third-level temperature platform 2.8, and install the third-level platform cold shield 2.9, the second-level platform cold shield 2.7, the first-level platform cold shield 2.5 and the test cover 2.3 in sequence;

[0067] The test platform device 2 and the refrigeration chamber 1 are evacuated, and after reaching the rated vacuum degree, the first cooling process begins;

[0068] In the first cooling process, the refrigerator 1.1 and the compressor 4.1 are turned on, the No. 3 stop valve (No. 3 valve 4.3.3) is opened, the No. 1 stop valve (No. 1 valve 4.3.1) and the No. 2 stop valve (No. 2 valve 4.3.2) are closed, and the cooling medium circulates in the first cooling circuit, entering the bypass rapid cooling stage;

[0069] When the temperature of the third-level temperature platform 2.8 drops below 40 K, the No. 2 stop valve is opened, the No. 3 stop valve is closed, the No. 1 stop valve remains closed, and the cooling medium flows in the second cooling circuit, entering the platform throttling and cooling stage;

[0070] When the temperature of the third-level temperature platform 2.8 drops to the set temperature, the No. 1 stop valve and the No. 3 stop valve are closed, the No. 2 stop valve remains open, and the cooling medium circulates in the second cooling circuit, entering the deep low temperature refrigeration stage; the test sample or test instrument starts testing.

[0071] When it is necessary to replace the test sample or test instrument in the three-stage temperature platform 2.8, keep the refrigerator 1.1 turned on and the vacuum degree of the refrigeration chamber 1, close the No. 2 stop valve and the No. 3 stop valve, and open the No. 1 stop valve. At this time, the helium throttling and cooling cycle still operates normally, and the high-pressure helium enters the secondary evaporator 4.9 after throttling by the secondary throttling element 4.8, providing deep low temperature zone cold capacity for cooling the liquid medium storage tank 4.10. The helium working medium in the device is liquefied in the liquid medium storage tank 4.10 and stored therein.

[0072] Under the action of the partition 3.6, the test platform device 2 and the refrigeration chamber 1 can work in different vacuum environments respectively. When replacing the test sample or test instrument in the three-level temperature platform 2.8, the test platform device 2 needs to be restored to normal temperature and pressure, and the partition 3.6 can keep the refrigeration chamber 1 in a low temperature and vacuum state, so as to quickly start the next round of testing. The method for restoring the test platform device 2 to normal temperature and pressure includes: filling a certain amount of helium into the test platform device 2 to reduce its vacuum and restore it to normal pressure, and at the same time using the convection of helium to quickly return it to temperature.

[0073] After the test platform device 2 is restored to normal temperature and pressure, the test cover 2.3, the first-level platform cold screen 2.5, the second-level platform cold screen 2.7 and the third-level platform cold screen 2.9 are opened in sequence, and the test sample or test instrument is replaced. After the replacement is completed, they are installed in sequence, and the test platform device 2 is vacuumed; after the vacuum degree of the test platform device 2 reaches the requirement, the No. 3 stop valve is opened, the No. 1 stop valve and the No. 2 stop valve are closed, and the device enters the liquid helium cooling bypass rapid cooling stage; the subsequent operating procedures are consistent with the subsequent procedures of the bypass rapid cooling stage, and the throttling cooling stage and the deep low temperature refrigeration stage are entered in sequence.

[0074] 2. Method for realizing deep low temperature variable temperature zone:

[0075] When the test sample or test instrument has a variable temperature zone requirement, the device enters the variable temperature zone stage. Considering the particularity of the refrigeration characteristics of the helium throttling refrigeration system, the variable temperature zone stage is divided into the throttling variable temperature zone stage and the bypass variable temperature zone stage;

[0076] In the throttling temperature change zone stage, keep the No. 1 stop valve and the No. 3 stop valve closed, and the No. 2 stop valve open. By adjusting the DC compressor, the throttling cycle low pressure is changed to adjust the refrigeration temperature of the main evaporator 4.7, thereby achieving the temperature adjustment of the three-level temperature platform 2.8;

[0077] When the temperature required for the third-level temperature platform 2.8 is high, the throttling temperature-changing zone method is not applicable. Open the No. 3 stop valve, close the No. 1 stop valve and the No. 2 stop valve. At this time, the device enters the bypass temperature-changing zone stage. At this time, the third-level temperature platform 2.8 is provided with cooling capacity by the No. 1 heat exchanger 4.5.1. The temperature of the third-level temperature platform 2.8 is regulated by adjusting the temperature of the refrigerator 1.1 and the DC compressor.

[0078] As a preferred embodiment, a heating module, a temperature detection module and a controller are arranged on the three-level temperature platform 2.8. The heating module and the temperature detection module are connected to the controller. The temperature detection module is used to detect the temperature of the three-level temperature platform 2.8 and transmit the temperature signal to the controller. The controller compares the tested temperature with the preset temperature. When the detected temperature is lower than the preset temperature, the heating module is controlled to turn on; when the detected temperature is higher than the preset temperature, the heating module is controlled to turn off, so as to perform thermal compensation temperature control.

[0079] The present invention uses specific examples to illustrate the principles and implementation methods of the present invention. The above examples are only used to help understand the method and core ideas of the present invention. At the same time, for those skilled in the art, according to the ideas of the present invention, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as limiting the present invention.

Claims

1. A cryogenic refrigeration device, characterized in that: It includes circulating refrigeration equipment, vibration reduction device and test platform device, among which: The circulating refrigeration equipment includes a refrigeration chamber, a first heat exchange component and a second heat exchange component, the first heat exchange component is connected to the refrigeration chamber, the first heat exchange component has a medium outlet, a first medium inlet and a second medium inlet, the medium outlet, the first medium inlet and the second medium inlet are all arranged in the refrigeration chamber; the second heat exchange component includes a main throttling element, a main evaporator and a No. 1 heat exchanger, the inlet of the main throttling element and the inlet of the No. 1 heat exchanger are both connected to the medium outlet through a high-pressure pipeline, the outlet of the main throttling element is connected to the inlet of the main evaporator, the outlet of the main evaporator is connected to the first medium inlet through a low-pressure pipeline, and the outlet of the No. 1 heat exchanger is connected to the second medium inlet through a bypass pipeline; the medium outlet, the high-pressure pipeline, the No. 1 heat exchanger, the bypass pipeline, and the second medium inlet can be connected in sequence to form a first cooling circuit, and the medium outlet, the high-pressure pipeline, the main throttling element, the main evaporator, the low-pressure pipeline and the first medium inlet can be connected in sequence to form a second cooling circuit; The test platform device comprises a test chamber and a temperature platform, wherein the temperature platform is arranged in the test chamber; the main evaporator and the first heat exchanger can both cool the temperature platform; The vibration damping device has a pipeline channel, the pipeline inlet and outlet of the refrigeration chamber and the pipeline inlet and outlet of the test chamber are respectively sealed and connected to the two ends of the pipeline channel, the high-pressure pipeline, the low-pressure pipeline and the bypass pipeline are all penetrated in the pipeline channel, the high-pressure pipeline, the low-pressure pipeline and the bypass pipeline are all fixedly connected to the vibration damping device, and the vibration damping device can reduce vibration of the high-pressure pipeline, the low-pressure pipeline and the bypass pipeline.

2. The cryogenic refrigeration device according to claim 1, characterized in that: The vibration damping device includes a vibration damping body and a partition, the vibration damping body has the pipeline channel, the partition is fixedly connected to the pipeline channel of the vibration damping body and divides the vibration damping body into two cavities, the partition has three through holes, the high-pressure pipeline, the low-pressure pipeline and the bypass pipeline each pass through one of the through holes, the high-pressure pipeline, the low-pressure pipeline and the bypass pipeline are all sealed and connected to the corresponding through holes, and the vibration damping body can reduce vibration of the high-pressure pipeline, the low-pressure pipeline and the bypass pipeline.

3. The cryogenic refrigeration device according to claim 2, characterized in that: It also includes a first vibration-damping base, the partition is fixedly connected to the first vibration-damping base, and the first vibration-damping base can reduce vibration of the partition.

4. The cryogenic refrigeration device according to claim 1, characterized in that: The test platform device also includes a second vibration-damping base, the temperature platform is connected to the second vibration-damping base, and the second vibration-damping base can reduce the vibration of the temperature platform.

5. The cryogenic refrigeration device according to claim 4, characterized in that: The refrigeration chamber is provided with a refrigerator, and the first heat exchange component includes a gas medium storage tank, a compressor, a first heat exchanger, a second heat exchanger, a third heat exchanger, a second heat exchanger, a third heat exchanger, a secondary throttling element, a secondary evaporator, a liquid medium storage tank, a first valve, a second valve and a third valve; the first heat exchanger has a first heat exchange channel, a second heat exchange channel, a third heat exchange channel and a fourth heat exchange channel, the second heat exchanger has a fifth heat exchange channel and a sixth heat exchange channel, and the third heat exchanger has a seventh heat exchange channel and an eighth heat exchange channel; the third heat exchanger has a first medium channel, and the second heat exchanger has a second medium channel; the refrigerator has a first cold head and a second cold head; the third heat exchanger and the second heat exchanger are in contact with the first cold head and the second cold head respectively; the inlet of the compressor is connected to the outlet of the gas medium storage tank; the outlet of the compressor, the first heat exchange channel, the first medium channel, the fifth heat exchange channel, the second medium channel, the seventh heat exchange channel The channel, the secondary throttling element, the secondary evaporator, the eighth heat exchange channel, the sixth heat exchange channel, the second heat exchange channel, the No. 1 valve and the inlet of the compressor can be connected in sequence to form a heat exchange circuit; the outlet of the compressor, the first heat exchange channel, the first medium channel, the fifth heat exchange channel, the second medium channel, the seventh heat exchange channel, the liquid medium storage tank, the high-pressure pipeline, the No. 1 heat exchanger, the bypass pipeline, the fourth heat exchange channel, the No. 3 valve, and the inlet of the compressor can be connected in sequence to form the first cooling circuit; the outlet of the compressor, the first heat exchange channel, the first medium channel, the fifth heat exchange channel, the second medium channel, the seventh heat exchange channel, the liquid medium storage tank, the high-pressure pipeline, the main throttling element, the main evaporator, the low-pressure pipeline, the third heat exchange channel, the No. 2 valve and the inlet of the compressor can be connected in sequence to form the second cooling circuit.

6. The cryogenic refrigeration device according to claim 5, characterized in that: It also includes a primary refrigeration base plate, a secondary refrigeration base plate, a primary refrigeration cold screen and a secondary refrigeration cold screen, the primary refrigeration base plate and the secondary refrigeration base plate are fixedly connected to the primary cold head and the secondary cold head respectively, the primary refrigeration base plate and the primary refrigeration cold screen can be fixedly connected to form a first cooling cover, the secondary refrigeration base plate and the secondary refrigeration cold screen can be fixedly connected to form a second cooling cover, the primary refrigeration base plate and the primary refrigeration cold screen are both arranged in the refrigeration room, the secondary refrigeration base plate and the secondary refrigeration cold screen are both arranged in the first cooling cover, the primary heat exchanger is arranged between the inner wall of the refrigeration room and the outer wall of the first cooling cover, the secondary heat exchanger is arranged between the inner wall of the first cooling cover and the outer wall of the second cooling cover, the tertiary heat exchanger, the secondary throttling element, the secondary evaporator and the liquid medium storage tank are arranged in the second cooling cover.

7. The cryogenic refrigeration device according to claim 6, characterized in that: The temperature platform includes a first-level temperature platform, a first-level platform cold screen, a second-level temperature platform, a second-level platform cold screen, a third-level temperature platform and a third-level platform cold screen arranged in the test chamber; the first-level platform cold screen can be fixedly connected to the first-level temperature platform to form a first test cover, the second-level platform cold screen can be fixedly connected to the second-level temperature platform to form a second test cover, the third-level platform cold screen can be fixedly connected to the third-level temperature platform to form a third test cover, the first test cover is arranged in the test chamber, the second test cover is arranged in the first test cover, and the third test cover is arranged in the second test cover; the third test cover is connected to the second test cover, the second test cover is connected to the first test cover, and the first test cover is connected to the second vibration damping base.

8. The cryogenic refrigeration device according to claim 7, characterized in that: The second heat exchange component also includes a fourth-stage heat exchanger, a fourth heat exchanger, a fifth heat exchanger, a sixth heat exchanger, and a seventh heat exchanger, and the first heat exchange component also includes an eighth heat exchanger and a ninth heat exchanger; the fourth-stage heat exchanger has a ninth heat exchange channel and a tenth heat exchange channel, the first heat exchanger has a third medium channel, the fourth heat exchanger has a fourth medium channel, the fifth heat exchanger has a fifth medium channel, the sixth heat exchanger has a sixth medium channel, the seventh heat exchanger has a seventh medium channel, the eighth heat exchanger has an eighth medium channel, and the ninth heat exchanger has a ninth medium channel; the outlet of the compressor, the first heat exchange channel, the first medium channel, the fifth heat exchange channel, the second medium channel, the seventh heat exchange channel, the liquid medium storage tank, the high-pressure pipeline, the The tenth heat exchange channel, the third medium channel, the fifth medium channel, the seventh medium channel, the bypass pipeline, the ninth medium channel, the fourth heat exchange channel, the No. 3 valve, and the inlet of the compressor can be connected in sequence to form the first cooling circuit; the outlet of the compressor, the first heat exchange channel, the first medium channel, the fifth heat exchange channel, the second medium channel, the seventh heat exchange channel, the liquid medium storage tank, the high-pressure pipeline, the tenth heat exchange channel, the main throttling element, the main evaporator, the ninth heat exchange channel, the fourth medium channel, the sixth medium channel, the low-pressure pipeline, the eighth medium channel, the third heat exchange channel, the No. 2 valve, and the inlet of the compressor can be connected in sequence to form the second cooling circuit.

9. A cryogenic refrigeration method based on the cryogenic refrigeration device according to any one of claims 1 to 8, characterized in that: The steps include: Placing a sample and / or a test instrument on the temperature platform, allowing a cooling medium to circulate in the first cooling circuit, and cooling the temperature platform through the first heat exchanger; When the temperature of the temperature platform reaches a set temperature, the cooling medium is circulated in the second cooling circuit, and the temperature platform is cooled by the main evaporator; performing a test on the sample and / or causing the testing instrument to perform a test; In the process of cooling the temperature platform, the vibration of the high-pressure pipeline, the low-pressure pipeline and the bypass pipeline is reduced by the vibration reduction device.

10. The deep cryogenic refrigeration method according to claim 9, characterized in that: The first heat exchange component includes a gas medium storage tank, a refrigerator, a compressor, a first-stage heat exchanger, a second-stage heat exchanger, a third-stage heat exchanger, a third heat exchanger, a second heat exchanger, a secondary throttling element, a secondary evaporator, a liquid medium storage tank, a first valve, a second valve and a third valve; the first-stage heat exchanger has a first heat exchange channel, a second heat exchange channel, a third heat exchange channel and a fourth heat exchange channel, the second-stage heat exchanger has a fifth heat exchange channel and a sixth heat exchange channel, the third-stage heat exchanger has a seventh heat exchange channel and an eighth heat exchange channel; the third heat exchanger has a first medium channel, and the second heat exchanger has a second medium channel; the refrigerator has a first cold head and a second cold head; the third heat exchanger and the second heat exchanger are in contact with the first cold head and the second cold head respectively; the inlet of the compressor is connected to the outlet of the gas medium storage tank; the outlet of the compressor, the first heat exchange channel, the first medium channel, the fifth heat exchange channel, the second medium channel, the seventh heat exchange channel, the The secondary throttling element, the secondary evaporator, the eighth heat exchange channel, the sixth heat exchange channel, the second heat exchange channel, the No. 1 valve and the inlet of the compressor can be connected in sequence to form a heat exchange circuit; the outlet of the compressor, the first heat exchange channel, the first medium channel, the fifth heat exchange channel, the second medium channel, the seventh heat exchange channel, the liquid medium storage tank, the high-pressure pipeline, the No. 1 heat exchanger, the bypass pipeline, the fourth heat exchange channel, the No. 3 valve, and the inlet of the compressor can be connected in sequence to form the first cooling circuit; the outlet of the compressor, the first heat exchange channel, the first medium channel, the fifth heat exchange channel, the second medium channel, the seventh heat exchange channel, the liquid medium storage tank, the high-pressure pipeline, the main throttling element, the main evaporator, the low-pressure pipeline, the third heat exchange channel, the No. 2 valve and the inlet of the compressor can be connected in sequence to form the second cooling circuit; Turn on the refrigerator, open the No. 1 valve, close the No. 2 valve and the No. 3 valve, drive the cooling medium in the gaseous medium storage tank to flow in the heat exchange circuit through the compressor, when the cooling medium flows through the No. 3 heat exchanger, the first-level cold head performs first-level cooling on the cooling medium, when the cooling medium flows through the No. 2 heat exchanger, the second-level cold head performs second-level cooling on the cooling medium, the cooling medium changes from gas to liquid after flowing through the secondary throttling element, and when the cooling medium flows through the secondary evaporator, the secondary evaporator performs tertiary cooling on the cooling medium; When the cooling medium in the heat exchange circuit reaches the set temperature, the No. 1 valve is closed, the No. 3 valve is opened, and the cooling medium is driven to flow in the first cooling circuit by the compressor. When the cooling medium flows through the No. 1 heat exchanger, it can absorb the heat of the temperature platform; When the temperature of the temperature platform reaches the set temperature, the No. 3 valve is closed, the No. 2 valve is opened, and the compressor drives the cooling medium to flow in the second cooling circuit. The main throttling element reduces the temperature of the cooling medium flowing through the main throttling element, and the cooling medium can absorb the heat of the temperature platform when flowing through the main evaporator.

Images