Audio playing system and method, terminal equipment and storage medium

Abstract

The invention relates to an audio playing system and method, terminal equipment and a storage medium, the audio playing system comprises an on-chip system, an audio coding and decoding chip and an intelligent power amplifier chip which are electrically connected in sequence, and the audio coding and decoding chip is provided with a first electrical interface and a second electrical interface. The audio coding and decoding chip is connected with the system-on-chip through the first electrical interface, the audio coding and decoding chip is electrically connected with the intelligent power amplifier chip through the second electrical interface, and the audio coding and decoding chip is used for receiving an audio data stream sent by the system-on-chip through the first electrical interface, converting the audio data stream into audio data in a preset format and sending the audio data to the intelligent power amplifier chip through the second electrical interface. The audio data in the preset format is sent to the intelligent power amplifier chip through the second electrical interface, the intelligent power amplifier chip is used for amplifying the audio data in the preset format and outputting the audio data through the loudspeaker interface, and the output capability of the loudspeaker interface can be greatly enhanced through the independently arranged intelligent power amplifier chip; and the method is no longer limited by the audio coding chip.

Description

Technical Field

[0001] The present application relates to the field of electronic devices, and in particular to an audio playback system, method, terminal device and storage medium. Background Art

[0002] The audio interface currently used in personal computers is usually HDA (High Definition Audio, high-resolution audio interface). The system-on-chip SOC expands the headphone interface and speaker interface from the audio encoding chip CODEC through the HDA interface.

[0003] The output power of the speaker expanded from the audio coding chip is limited by the output capacity of the speaker interface of the audio coding chip, and the output capacity of the speaker interface is limited.

[0004] The above contents are only used to assist in understanding the technical solution of the present application and do not constitute an admission that the above contents are prior art. Summary of the invention

[0005] In view of this, the present application provides an audio playback system, method, terminal device and storage medium, which can greatly enhance the output capacity of the speaker interface and is no longer limited by the above-mentioned audio encoding chip.

[0006] An audio playback system comprises a system on chip, an audio codec chip and an intelligent power amplifier chip which are electrically connected in sequence; The audio codec chip is provided with a first electrical interface and a second electrical interface, the audio codec chip is connected to the system on chip through the first electrical interface, and the audio codec chip is electrically connected to the smart power amplifier chip through the second electrical interface; The audio codec chip is used in the system on chip to send and receive the audio data stream sent by the system on chip through the first electrical interface; The audio codec chip is used to convert the audio data stream into audio data in a preset format, and send the audio data in the preset format to the smart power amplifier chip through the second electrical interface; The intelligent power amplifier chip is used to amplify the audio data in a preset format and output it through the speaker interface.

[0007] In one embodiment, the second electrical interface is I 2 C and I 2 S-bus interface.

[0008] In one embodiment, the first electrical interface is I 2 C and I 2 S-bus interface.

[0009] In one embodiment, the first electrical interface is a high-resolution audio interface.

[0010] In one embodiment, the audio codec chip is further provided with an earphone output port.

[0011] In addition, an audio playback method is provided, which is applied to an audio codec chip, wherein the audio codec chip is provided with a first electrical interface and a second electrical interface, and the audio playback method comprises: Receiving an audio data stream sent by the system on chip through a first electrical interface; The audio data stream is converted into audio data in a preset format and sent to the smart power amplifier chip through the second electrical interface, so that the smart power amplifier chip amplifies the audio data in the preset format and outputs it through the speaker interface.

[0012] In one embodiment, before the step of receiving the audio data stream sent by the system on chip through the first electrical interface, the step further includes: Receiving an initialization configuration command sent by the system on chip through the first electrical interface; Convert the initialization configuration command into command data in a preset format; The command data in a preset format is sent to the intelligent power amplifier chip through the second electrical interface, so that the intelligent power amplifier chip performs an initialization configuration operation.

[0013] In one embodiment, the second electrical interface is I 2 C and I 2 The step of sending the command data in a preset format to the smart power amplifier chip through the second electrical interface so that the smart power amplifier chip performs an initialization configuration operation also includes: The second electrical interface is driven and configured.

[0014] In addition, a terminal device is provided, which is provided with the above-mentioned audio playing system.

[0015] In addition, a storage medium is also provided, on which a computer program is stored, and when the computer program is executed by a processor, the steps of the above-mentioned audio playback method are implemented.

[0016] The above-mentioned audio playback system includes an on-chip system, an audio codec chip and an intelligent power amplifier chip which are electrically connected in sequence, the audio codec chip is provided with a first electrical interface and a second electrical interface, the audio codec chip is connected to the on-chip system via the first electrical interface, the audio codec chip is electrically connected to the intelligent power amplifier chip via the second electrical interface, the audio codec chip is used to receive the audio data stream sent by the on-chip system via the first electrical interface, convert the audio data stream into audio data in a preset format, and send the audio data in the preset format to the intelligent power amplifier chip via the second electrical interface, the intelligent power amplifier chip is used to convert the audio data stream into audio data in a preset format The audio data is amplified and output through the speaker interface. The audio playback system uses the second electrical interface of the audio encoding chip to connect with the set intelligent power amplifier chip, converts the audio data stream into audio data in a preset format, and drives the second electrical interface of the audio encoding chip itself to send the audio data in the preset format to the intelligent power amplifier chip. On the one hand, it does not occupy the interface resources of the system on chip SOC, reducing the design complexity of the SOC system on chip. On the other hand, through the separately set intelligent power amplifier chip, the output capacity of the speaker interface can be greatly enhanced and is no longer restricted by the audio encoding chip itself. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a structural block diagram of an audio playback system provided in one embodiment of the present application; Figure 2 A flowchart of an audio playback method provided in an embodiment of the present application; Figure 3 A flowchart of another audio playback method provided in an embodiment of the present application; Figure 4 A flowchart of another audio playback method provided in an embodiment of the present application; Figure 5 This is a schematic block diagram of the internal structure of a terminal device according to an embodiment of the present application.

[0018] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0019] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present application, and should not be construed as limiting the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0020] In addition, if the descriptions of "first", "second", etc. are involved in this application, they are only used for descriptive purposes (such as for distinguishing the same or similar elements), and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in this field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by this application.

[0021] like Figure 1 As shown, an audio playback system 100 is provided, including a system on chip 110, an audio codec chip 120 and a smart power amplifier chip 130 which are electrically connected in sequence.

[0022] The audio codec chip 120 is provided with a first electrical interface 2a and a second electrical interface 2b. The audio codec chip 120 is connected to the system on chip 110 via the first electrical interface 2a, and the audio codec chip 120 is electrically connected to the smart power amplifier chip 130 via the second electrical interface 2b.

[0023] The audio codec chip 120 is used in the system on chip 110 to send and receive audio data streams sent by the system on chip 110 through the first electrical interface 2 a.

[0024] The audio codec chip 120 is used to convert the audio data stream into audio data in a preset format, and send the audio data in the preset format to the smart power amplifier chip 130 through the second electrical interface 2 b.

[0025] The intelligent power amplifier chip 130 is used to amplify the audio data in a preset format and output it through the speaker interface.

[0026] The system on chip 110 is usually a SOC (System on Chip, SOC), and the first electrical interface 2 a and the second electrical interface 2 b are of different types.

[0027] The above-mentioned audio playback system 100 includes a system on chip 110, an audio codec chip 120 and an intelligent power amplifier chip 130 that are electrically connected in sequence. The second electrical interface 2b of the audio coding chip is used to connect to the set intelligent power amplifier chip 130, and the audio data stream is converted into audio data in a preset format. The audio coding chip itself drives the second electrical interface 2b to send the audio data in the preset format to the intelligent power amplifier chip 130. On the one hand, it does not occupy the interface resources of the system on chip 110 SOC, reducing the design complexity of the SOC system on chip 110. On the other hand, through the separately set intelligent power amplifier chip 130, the output capacity of the speakers can be greatly enhanced and is no longer restricted by the audio codec chip 120 itself.

[0028] In one embodiment, the second electrical interface 2b is I 2 C and I 2 S-bus interface.

[0029] In one embodiment, the first electrical interface 2a is I 2 C and I 2 S-bus interface.

[0030] In one embodiment, the first electrical interface 2a is a high-resolution audio interface.

[0031] The high-resolution audio interface is an HDA interface. The system on chip 110 and the first electrical interface 2a may be electrically connected via HDA or via I 2 C and I 2 S bus interface is electrically connected.

[0032] In one embodiment, Figure 1 As shown, the audio codec chip 120 is also provided with an earphone output port 2c.

[0033] The use of the second electrical interface 2 b of the audio codec chip 120 to access the intelligent power amplifier chip 130 does not affect the headphone output port 2 c provided on the audio codec chip 120 .

[0034] In addition, if Figure 2 As shown, an audio playback method is also provided, which is applied to the above-mentioned audio codec chip 120, and the audio codec chip 120 is provided with a first electrical interface 2a and a second electrical interface 2b. The audio playback method includes: Step S210: receiving an audio data stream sent by the system on chip through a first electrical interface.

[0035] Step S220, converting the audio data stream into audio data in a preset format; Step S230: sending the audio data in the preset format to the smart power amplifier chip through the second electrical interface, so that the smart power amplifier chip amplifies the audio data in the preset format and outputs it through the speaker interface.

[0036] In one embodiment, Figure 3 As shown, before step 230, the following steps are also included: Step S240: receiving an initialization configuration command sent by the system on chip through the first electrical interface.

[0037] Step S250: converting the initialization configuration command into command data in a preset format.

[0038] Step S260: sending command data in a preset format to the smart power amplifier chip through the second electrical interface, so that the smart power amplifier chip performs an initialization configuration operation.

[0039] In this embodiment, the audio codec chip 120 usually executes steps S240 to S260 before sending the audio data in a preset format to the smart power amplifier chip 130 through the second electrical interface 2 b, so that the smart power amplifier chip 130 performs an initialization configuration operation.

[0040] In one embodiment, Figure 4 As shown, the second electrical interface is I 2 C and I 2 S bus interface, before step S260, further comprising: Step S270: performing drive configuration on the second electrical interface.

[0041] In addition, a terminal device is also provided in an embodiment of the present application. The internal structure of the terminal device can be as follows: Figure 5 As shown. The terminal device includes a processor, a memory, a communication interface and a database connected via a system bus. The processor is used to provide computing and control capabilities. The memory of the terminal device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system, a computer program and a database. The internal memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The database of the terminal device is used to store data called by the computer program. The communication interface of the terminal device is used to communicate data with an external terminal. The input device of the terminal device is used to receive a signal input by an external device. When the computer program is executed by the processor, an audio playback method as described in the above embodiment is implemented.

[0042] Those skilled in the art will understand that Figure 5 The structure shown in is merely a block diagram of a portion of the structure related to the solution of the present application, and does not constitute a limitation on the terminal device to which the solution of the present application is applied.

[0043] In addition, the present application also proposes a storage medium, the storage medium includes a computer program, and when the computer program is executed by a processor, the steps of the audio playback method described in the above embodiment are implemented. It can be understood that the storage medium in this embodiment can be a volatile readable storage medium or a non-volatile readable storage medium.

[0044] Those of ordinary skill in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be implemented by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to memory, storage, database or other media provided in this application and used in the embodiments may include non-volatile and / or volatile memory. Non-volatile memory may include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM) or flash memory. Volatile memory may include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in many forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (SSRSDRAM), enhanced SDRAM (ESDRAM), synchronous link (Synchlink) DRAM (SLDRAM), memory bus (Rambus) direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM), etc.

[0045] It should be noted that, in this article, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, device, article or method including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, device, article or method. In the absence of further restrictions, an element defined by the sentence "includes a ..." does not exclude the presence of other identical elements in the process, device, article or method including the element.

[0046] The above description is only a preferred embodiment of the present application, and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. An audio playback system, characterized in that: It includes a system on chip, an audio codec chip and an intelligent power amplifier chip which are electrically connected in sequence; The audio codec chip is provided with a first electrical interface and a second electrical interface, the audio codec chip is connected to the system on chip through the first electrical interface, and the audio codec chip is electrically connected to the smart power amplifier chip through the second electrical interface; The audio codec chip is used in the system on chip to send and receive an audio data stream sent by the system on chip through the first electrical interface; The audio codec chip is also used to convert the audio data stream into audio data in a preset format, and send the audio data in the preset format to the smart power amplifier chip through the second electrical interface; The intelligent power amplifier chip is used to amplify the audio data in the preset format and output it through the speaker interface.

2. The audio playback system according to claim 1, characterized in that: The second electrical interface is I 2 C and I 2 S-bus interface.

3. The audio playback system according to claim 1, characterized in that: The first electrical interface is I 2 C and I 2 S-bus interface.

4. The audio playback system according to claim 1, characterized in that: The first electrical interface is a high-resolution audio interface.

5. The audio playback system according to claim 1, characterized in that: The audio codec chip is also provided with a headphone output port.

6. An audio playback method, characterized in that: Applied to an audio codec chip, the audio codec chip is provided with a first electrical interface and a second electrical interface, and the audio playing method includes: receiving an audio data stream sent by the system on chip through the first electrical interface; Converting the audio data stream into audio data in a preset format; The audio data in the preset format is sent to the smart power amplifier chip through the second electrical interface, so that the smart power amplifier chip amplifies the audio data in the preset format and outputs it through the speaker interface.

7. The audio playback method according to claim 6, characterized in that: Before the step of receiving the audio data stream sent by the system on chip through the first electrical interface, the step further includes: Receiving an initialization configuration command sent by the system on chip through the first electrical interface; Converting the initialization configuration command into command data in a preset format; The command data in the preset format is sent to the smart power amplifier chip through the second electrical interface, so that the smart power amplifier chip performs an initialization configuration operation.

8. The audio playing method according to claim 6, characterized in that: The second electrical interface is I 2 C and I 2 S bus interface, before the step of sending the command data in the preset format to the smart power amplifier chip through the second electrical interface so that the smart power amplifier chip performs an initialization configuration operation, the step also includes: The second electrical interface is driven and configured.

9. A terminal device, characterized in that: An audio playback system as claimed in claim 1 is provided.

10. A storage medium, characterized in that: The storage medium stores a computer program, which, when executed by a processor, implements the steps of the audio playback method according to any one of claims 6 to 8.

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