Packaging method and packaging structure for realizing electromagnetic shielding

Abstract

The invention discloses a packaging method and a packaging structure for realizing electromagnetic shielding, which are applied to the field of semiconductor packaging, and the method comprises the following steps: providing a packaging prefabricated member; the packaging prefabricated member comprises a packaging body and at least one packaging chip; and circularly executing the steps of preparing a sub-shielding layer groove surrounding the packaging chip along the circumferential direction in the packaging body at the side part of each packaging chip, and electroplating in the sub-shielding layer groove by utilizing an electroplating process to form a sub-shielding layer side wall until the preparation of the shielding layer side wall surrounding all the side parts of the packaging chip along the circumferential direction is completed. And obtaining the electromagnetic shielding packaging device. According to the invention, the preparation of the sub-shielding layer grooves is circularly executed, and the sub-shielding layer side walls are formed in the sub-shielding layer grooves through electroplating by using an electroplating process until the preparation of the shielding layer side walls surrounding all the side parts of the packaged chip along the circumferential direction is completed, so that the packaging size of the shielding layer side walls can be reduced while electromagnetic interference is shielded, and the packaging efficiency is improved. And the yield of shielding layer side wall preparation is improved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor packaging, and in particular to a packaging method and a packaging structure for realizing electromagnetic shielding. Background Art

[0002] With the continuous update of the demand for electronic products, the products are becoming more and more complex, the integration of chip packaging is getting higher and higher, and more and more are moving towards the system-level package (System in Package, abbreviated as SiP) structure. In the system-level package structure, multiple RF chips, analog chips or passive components are integrated together, and the distance between chips and devices is gradually reduced, resulting in the problem of electromagnetic interference between devices in the system-level package structure becoming more and more prominent. The existing packaging method uses the method of pouring conductive fillers to form a shielding wall to solve the problem of prominent electromagnetic interference between devices, but this method is costly and has poor reliability, which is not conducive to preparation.

[0003] Therefore, how to provide a method that can solve the prominent problem of electromagnetic interference between devices while improving the reliability of preparation is a technical problem that technical personnel in this field urgently need to solve. Summary of the invention

[0004] In view of this, an object of the present invention is to provide a packaging method and packaging structure for achieving electromagnetic shielding, which solves the problem that the method of preparing a shielding wall in the prior art is high in cost, poor in reliability, and not conducive to preparation.

[0005] In order to solve the above technical problems, the present invention provides a packaging method for achieving electromagnetic shielding, comprising:

[0006] A packaging preform is provided; the packaging preform comprises a packaging body and at least one packaging chip, the packaging chip is packaged inside the packaging body, the packaging chip exposed on the back side of the packaging body is connected to a back side carrier; the back side of the packaging body is the outer surface of the packaging body on a side away from the conductive lead-out terminal of the packaging chip;

[0007] The steps of preparing a sub-shielding layer groove surrounding the packaged chip in the circumferential direction in the package body on each side of the packaged chip and forming a sub-shielding layer side wall by electroplating in the sub-shielding layer groove by using an electroplating process are cyclically performed until the preparation of the shielding layer side wall surrounding all sides of the packaged chip in the circumferential direction is completed to obtain the electromagnetic shielding package device;

[0008] Each of the sub-shielding layer side walls is a partial height of the shielding layer side wall, and all of the sub-shielding layer side walls correspondingly constitute the shielding layer side wall; each of the sub-shielding layer grooves is a partial height of the shielding layer groove, and all of the sub-shielding layer grooves correspondingly constitute the shielding layer groove.

[0009] Optionally, the cycle is performed to prepare a sub-shielding layer groove circumferentially surrounding the packaged chip in the package body on the side of each packaged chip, and to form a sub-shielding layer side wall by electroplating in the sub-shielding layer groove using an electroplating process until the electromagnetic shielding package device is obtained, comprising:

[0010] A first sub-shielding layer groove is formed inwardly on the front side of the package body, corresponding to the side position of the package chip; the front side of the package body is the outer surface of the package body on the side close to the conductive lead-out terminal of the package chip;

[0011] Using an electroplating process to electroplatingly form a first sub-shielding layer side wall in the first sub-shielding layer groove as a first package to be processed;

[0012] The front side of the package body in the first package to be processed is connected to a front side carrier, and the back side carrier is removed to form a second package to be processed;

[0013] In the second package to be processed, a second sub-shielding layer groove is prepared inwardly at a position on the back side of the package body corresponding to the side wall of the first sub-shielding layer until the side wall of the first sub-shielding layer is exposed;

[0014] The second sub-shielding layer sidewall is formed by electroplating in the groove of the second sub-shielding layer using an electroplating process to obtain the electromagnetic shielding packaging device.

[0015] Optionally, the first sub-shielding layer groove and the second sub-shielding layer groove are both half the depth of the shielding layer groove.

[0016] Optionally, using an electroplating process to electroplating in the first sub-shielding layer groove to form a first sub-shielding layer sidewall as a first package to be processed includes:

[0017] The first sub-shielding layer sidewall is formed by electroplating in the first sub-shielding layer groove by using an electroplating process, and a lead layer conductively connected to the conductive lead-out terminal is prepared to obtain the first package to be processed.

[0018] Optionally, after obtaining the first package to be processed, the method further includes:

[0019] Performing a plastic encapsulation process on the front side of the package body to obtain a final package body, so as to encapsulate the lead layer in the final package body;

[0020] The final package is thinned to expose the lead layer.

[0021] Optionally, the electromagnetic shielding packaging device is obtained by electroplating the second sub-shielding layer groove to form a second sub-shielding layer side wall by electroplating, including:

[0022] The second sub-shielding layer sidewall is formed by electroplating in the groove of the second sub-shielding layer by using an electroplating process, and a shielding layer back plate is formed by electroplating on the back side of the packaging body to obtain the electromagnetic shielding packaging device.

[0023] Optionally, providing a packaging preform includes:

[0024] Connecting the packaged chip to the back-carrying carrier on the side facing away from the conductive lead-out terminal to serve as a preform to be packaged;

[0025] The preform to be packaged is subjected to plastic packaging to obtain the packaged preform.

[0026] Optionally, the step of preparing a shielding layer groove circumferentially surrounding the packaged chip includes:

[0027] The sub-shielding layer groove surrounding the packaged chip in the circumferential direction is prepared by using a laser grooving process.

[0028] Optionally, after obtaining the electromagnetic shielding packaging device, the method further includes:

[0029] The electromagnetic shielding packaging device is cut between adjacent packaging chips corresponding to the symmetry axis of the shielding layer side wall to obtain a single electromagnetic shielding packaging product with the same thickness of the shielding layer side wall.

[0030] The present invention also provides a packaging structure for achieving electromagnetic shielding, comprising:

[0031] A package body and at least one packaged chip, wherein the packaged chip is packaged inside the package body, and at least a portion of the packaged chip is exposed on the back side of the package body; the back side of the package body is an outer surface of the package body on a side away from the conductive lead-out terminal of the packaged chip;

[0032] In the packaging body located on the side of each of the packaged chips, there is a shielding layer side wall that circumferentially surrounds the corresponding packaged chip; the shielding layer side wall is a structure obtained by cyclically executing the steps of preparing a sub-shielding layer groove that circumferentially surrounds the corresponding packaged chip in the packaging body on the side of each of the packaged chips, and electroplating the sub-shielding layer side wall in the sub-shielding layer groove using an electroplating process; each of the sub-shielding layer side walls is a partial height of the shielding layer side wall, and all of the sub-shielding layer side walls constitute the shielding layer side wall; each of the sub-shielding layer grooves is a partial height of the shielding layer groove, and all of the sub-shielding layer grooves correspond to and constitute the shielding layer groove.

[0033] Optionally, the shielding layer side walls between adjacent packaged chips are shielding layer side walls formed by electroplating the same shielding layer groove.

[0034] It can be seen that the packaging method for achieving electromagnetic shielding provided by the present invention includes providing a packaging preform, the packaging preform includes a packaging body and at least one packaging chip, the packaging chip is packaged inside the packaging body, the packaging chip exposed on the back side of the packaging body is connected to the back carrier, and the back side of the packaging body is the outer surface of the side of the packaging body away from the conductive lead-out terminal of the packaging chip; cyclically executing the steps of preparing a sub-shielding layer groove circumferentially surrounding the packaging chip in the packaging body on the side of each packaging chip, and using an electroplating process to electroplate a sub-shielding layer side wall in the sub-shielding layer groove until the preparation of the shielding layer side wall circumferentially surrounding all sides of the packaging chip is completed to obtain an electromagnetic shielding packaging device; each sub-shielding layer side wall is a shielding layer side wall of partial height, and all sub-shielding layer side walls correspond to the shielding layer side wall; each sub-shielding layer groove is a shielding layer groove of partial height, and all sub-shielding layer grooves correspond to the shielding layer groove. The present invention cyclically executes the steps of preparing a sub-shielding layer groove that circumferentially surrounds the packaged chip in the package body on the side of each packaged chip, and electroplating to form a sub-shielding layer side wall in the sub-shielding layer groove using an electroplating process, so as to form the shielding layer side wall by electroplating, thereby shielding the side of the packaged chip of the system-level package. While shielding the electromagnetic interference between the packaged chips and the external electromagnetic interference, the packaging size of the shielding layer side wall can be reduced, and the convenience and stability of preparing the shielding layer side wall can be improved.

[0035] In addition, the present invention also provides a packaging structure for achieving electromagnetic shielding, which also has the above-mentioned beneficial effects. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying creative work.

[0037] Figure 1 A flow chart of a packaging method for achieving electromagnetic shielding provided by an embodiment of the present invention;

[0038] Figure 2 A flow chart of a method for preparing a packaging preform in a packaging method for achieving electromagnetic shielding provided by an embodiment of the present invention;

[0039] Figure 3 A flow chart of preparing a shielding layer side wall in a packaging method for achieving electromagnetic shielding provided by an embodiment of the present invention;

[0040] Figure 4A flow chart of completing packaging of a lead layer in a packaging method for achieving electromagnetic shielding provided by an embodiment of the present invention;

[0041] Figure 5 A flow chart of another packaging method for achieving electromagnetic shielding provided by an embodiment of the present invention;

[0042] Figures 6 to 18 An example flow chart of a packaging method for achieving electromagnetic shielding provided by an embodiment of the present invention;

[0043] Fig.19 A schematic structural diagram of a packaging structure for achieving electromagnetic shielding provided by an embodiment of the present invention;

[0044] Figures 6 to 19 In the figure, the reference numerals are described as follows:

[0045] 1-front side of the package body, 2-back side of the package body, 10-package body, 11-final package body, 20-package chip, 30-back side carrier, 31-front side carrier, 41-first sub-shielding layer groove, 42-first sub-shielding layer side wall, 43-second sub-shielding layer groove, 44-shielding layer side wall, 45-shielding layer backplane, 51-first lead layer, 52-second lead layer, 60-gold solder ball, 70-nanosilver layer. DETAILED DESCRIPTION

[0046] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0047] Please refer to Figure 1 , Figure 1 A flowchart of a packaging method for achieving electromagnetic shielding provided by an embodiment of the present invention. The method may include:

[0048] S101: Provide a packaging preform; the packaging preform includes a packaging body 10 and at least one packaging chip 20, the packaging chip 20 is packaged inside the packaging body 10, and the packaging chip 20 exposed on the back side 2 of the packaging body is connected to the back side carrier 30; the back side 2 of the packaging body is the outer surface of the side of the packaging body 10 away from the conductive lead end of the packaging chip 20.

[0049] The structures formed during the preparation process of each step in this embodiment can be referred to Figures 6 to 18 , Figures 6 to 18This is a flowchart of a packaging method for implementing electromagnetic shielding provided by an embodiment of the present invention. Fig.10 , Fig.10 That is, it is a packaged preform. The executor of this embodiment is a packaging system. In this embodiment, the packaged chip 20 is packaged inside the package body 10, that is, the outer contour of the packaged chip 20 does not exceed the outer surface of the package body 10, and when part of the surface of the packaged chip 20 is exposed to the package body 10, it is still considered in this application that the packaged chip 20 is packaged inside the package body 10. It can be seen that in this application, the back side 2 of the package body exposes the packaged chip 20, and it is still considered that the packaged chip 20 is packaged inside the package body 10, which is not contradictory. In this embodiment, the packaged chip 20 with the back side exposed is generally the back side of the packaged chip 20, and the back side of the packaged chip 20 is the side surface of the packaged chip 20 that is away from its own conductive lead-out terminal, and the back side 2 of the package body is defined as the outer surface of the side of the package body 10 away from the conductive lead-out terminal of the packaged chip 20, that is, the back side of the packaged chip 20 and the back side 2 of the package body are surfaces facing the same side in space. Accordingly, in this embodiment, it is not limited whether the front side 1 of the package body exposes the package chip 20. In this embodiment, the front side 1 of the package body is the outer surface of the package body 10 on the side close to the conductive lead-out terminal of the package chip 20. Therefore, when the front side 1 of the package body exposes the package chip 20, that is, the front side of the package chip 20 with the conductive lead-out terminal is exposed on the front side 1 of the package body. In order to facilitate the conductive lead-out terminal of the package chip 20 to be connected to the outside, in this embodiment, the front side 1 of the package body can be set to expose at least the conductive lead-out terminal of the package chip 20. In this embodiment, during preparation, the back side of the package chip 20 is generally connected to the back side carrier 30, and the back side of the package chip 20 does not exceed the outer surface of the package body 10. In general, the back side of the package chip 20 is flush with the back side 2 of the package body, and is connected to the back side carrier 30 together. In this embodiment, the conductive lead-out terminal can be set as a metal solder ball, specifically, it can be set as a gold solder ball 60, or it can also be set as a copper solder ball, or it can also be set as a tin solder ball. In this embodiment, the package chip 20 can be arranged as a plurality of package chips 20.

[0050] Furthermore, in order to ensure the convenience of packaging preform preparation, reference can be made to Figure 2 , Figure 2 A flowchart of a method for preparing a packaging preform in a packaging method for achieving electromagnetic shielding provided by an embodiment of the present invention. The above-mentioned provision of the packaging preform may include the following steps:

[0051] S201: Connect the packaged chip 20 to the back side of the conductive lead-out terminal to the back side carrier 30 as a preform to be packaged;

[0052] S202: performing plastic encapsulation on the preform to be encapsulated to obtain the encapsulated preform.

[0053] It should be noted that in this embodiment, the packaged chip 20 is first connected to the carrier, and then the packaged chip 20 is plastic-sealed using the package body 10. When the packaged chip 20 is packaged, the packaged chip 20 and the carrier are pre-fixed, which can avoid the position of the packaged chip 20 from shifting during the packaging process, thereby ensuring the stability of device preparation and improving preparation efficiency. The structure obtained in step S201 in this embodiment can refer to Figure 8 .

[0054] S102: The steps of preparing a sub-shielding layer groove circumferentially surrounding the packaged chip 20 in the package body 10 on the side of each packaged chip 20 in a loop, and forming a sub-shielding layer side wall by electroplating in the sub-shielding layer groove using an electroplating process, until the preparation of the shielding layer side wall 44 circumferentially surrounding all sides of the packaged chip 20 is completed, thereby obtaining an electromagnetic shielding package device.

[0055] In this embodiment, each sub-shielding layer side wall is a part of the height of the shielding layer side wall 44, and all the sub-shielding layer side walls correspond to the shielding layer side wall 44, each sub-shielding layer groove is a part of the height of the shielding layer groove, and all the sub-shielding layer grooves correspond to the shielding layer groove. The electromagnetic shielding packaging device obtained in this embodiment can refer to Fig.17 . In this embodiment, a sub-shielding layer groove is formed at the position of the package body 10 on the side of each packaged chip 20, which circumferentially surrounds the corresponding packaged chip 20. Specifically, in order to ensure the shielding effect of the shielding layer side wall 44 prepared later on the packaged chip 20, the shielding layer groove formed by the sub-shielding layer groove is generally arranged to completely surround the side of the packaged chip 20, that is, the shielding layer groove surrounds the four sides of the packaged chip 20, and both ends of the front and back sides of the packaged chip 20 exceed the packaged chip 20. Preferably, the sub-shielding layer side wall formed by electroplating in the sub-shielding layer groove can be arranged in the direction from the front side of the package body 10 to the back side of the package body 10, and penetrates the package body 10 at this position, so as to improve the shielding effect of the interference shielding structure formed on the side of the packaged chip 20.

[0056] In addition, it should be noted that in this embodiment, the sub-shielding layer side wall is formed by electroplating in the sub-shielding layer groove using an electroplating process, which can ensure the accuracy of the sub-shielding layer side wall formed in the sub-shielding layer groove. Compared with the existing method of preparing the shielding layer by injecting conductive filler, this embodiment can reduce the cross-sectional size of the sub-shielding layer groove, while ensuring that the shielding layer side wall 44 with stable structure and stable shielding effect is prepared. When the spacing between the packaged chips 20 is reduced, the adaptation of the shielding layer side wall 44 can also be completed, which can avoid the groove closing during preparation, thereby causing the problem of uneven distribution of shielding material in the shielding layer.

[0057] In the present embodiment, a specific method of cyclically executing the steps of preparing a sub-shielding layer groove circumferentially surrounding the packaged chip 20 in the package body 10 on the side of each packaged chip 20, and electroplating to form a sub-shielding layer side wall in the sub-shielding layer groove by using an electroplating process is completed in multiple steps. The steps of preparing a sub-shielding layer groove circumferentially surrounding the packaged chip 20 in the package body 10 on the side of each packaged chip 20, and correspondingly performing one electroplating to form the sub-shielding layer side wall can avoid the problem of uneven distribution of the plated shielding layer material due to excessive depth of the shielding layer groove. In this embodiment, the steps of preparing the sub-shielding layer groove and electroplating the sub-shielding layer side wall in the sub-shielding layer groove are cyclically performed to complete the preparation of the shielding layer side wall 44 in multiple times. Compared with the method of completing the preparation of the shielding layer groove and the preparation of the shielding layer side wall 44 in one step, the cyclic multiple preparation can effectively reduce the preparation height of the single shielding layer side wall 44, thereby avoiding the closing phenomenon at the notch of the shielding layer groove during preparation, ensuring the uniformity of the shielding layer material in the shielding layer side wall 44, and thus reducing the interference of the external to the inner packaged chip 20. This embodiment does not limit the specific number of cyclic executions of the steps of preparing a sub-shielding layer groove circumferentially surrounding the packaged chip 20 in the package body 10 on the side of each packaged chip 20, and electroplating the sub-shielding layer side wall in the sub-shielding layer groove using an electroplating process. For example, the above steps can be set to be executed in a loop twice to complete the preparation of the shielding layer side wall 44, or the above steps can be set to be executed in a loop three times to complete the preparation of the shielding layer side wall 44, or the number of times the above steps are executed in a loop can be set according to actual conditions to efficiently complete the preparation of the shielding layer side wall 44.

[0058] Furthermore, in order to ensure the stability of the preparation of the shielding layer side wall 44 and the efficiency of the preparation of the shielding layer side wall 44, reference may be made to Figure 3 , Figure 3 A flowchart of preparing a shielding layer side wall in a packaging method for realizing electromagnetic shielding provided by an embodiment of the present invention. The above-mentioned cycle is performed in the packaging body 10 on the side of each packaged chip 20, and a sub-shielding layer groove surrounding the packaged chip 20 along the circumferential direction is prepared, and a sub-shielding layer side wall is formed by electroplating in the sub-shielding layer groove by an electroplating process until an electromagnetic shielding packaging device is obtained, which may include the following steps:

[0059] S301: preparing a first sub-shielding layer groove 41 inwardly on the front side 1 of the package body, corresponding to the side position of the package chip 20; the front side 1 of the package body is the outer surface of the side of the package body 10 close to the conductive lead-out terminal of the package chip 20.

[0060] The structure prepared by S301 in this embodiment can be referred to Fig.11. In this embodiment, since the back side 2 of the package body is connected to the back side carrier 30, the first sub-shielding layer groove 41 can be first prepared inwardly on the front side 1 of the package body, corresponding to the side position of the packaged chip 20. It should be pointed out that when the front side 1 of the package body is first connected to the front side carrier 31, the sub-shielding layer groove can also be first prepared on the back side 2 of the package body. In this embodiment, the first sub-shielding layer groove 41 is prepared inwardly, that is, the first sub-shielding layer groove 41 extending toward the back side 2 of the package body is prepared along the front side 1 of the package body.

[0061] S302 : forming a first sub-shielding layer sidewall 42 in the first sub-shielding layer groove 41 by electroplating using an electroplating process as a first package to be processed.

[0062] The structure prepared by S202 in this embodiment can be referred to Fig.15 In this embodiment, after the first sub-shielding layer groove 41 is prepared, that is, immediately in the first sub-shielding layer groove 41, the first sub-shielding layer sidewall 42 is prepared by electroplating.

[0063] Further, in order to improve the efficiency of package preparation, the above-mentioned electroplating process is used to electroplating the first sub-shielding layer groove 41 to form the first sub-shielding layer sidewall 42 as the first package to be processed, which may include:

[0064] The first sub-shielding layer sidewall 42 is formed by electroplating in the first sub-shielding layer groove 41 by using an electroplating process, and a lead layer conductively connected to the conductive lead-out terminal is prepared to obtain a first package to be processed.

[0065] The structure prepared in this example can be referred to Fig.13. It should be noted that, in this embodiment, the first sub-shielding layer side wall 42 is formed by electroplating in the first sub-shielding layer groove 41, and the lead layer conductively connected to the conductive lead end is prepared simultaneously. In this embodiment, the lead layer can be composed of a first lead layer 51 and a second lead layer 52 to achieve rewiring of the packaged chip 20, reduce the preparation process, and improve the preparation efficiency. In this embodiment, the shielding cavity is divided into small cavities by rewiring, which reduces the size of the shielding cavity. Its resonant frequency is much higher than the system noise frequency, avoiding electromagnetic resonance, so that the use system is more stable, wherein the shielding cavity is a structure surrounded by the shielding layer side wall 44 as a shielding cavity. Specifically, in this embodiment, the rewiring method in the fan-out package can be used to reduce the package size and improve reliability. In order to ensure the regularity of the structure and improve the shielding effect of the shielding layer side wall 44 on interference, the height of the prepared lead layer can be set to be consistent with the height of the first sub-shielding layer side wall 42. In this embodiment, the lead layer may include multiple sub-lead layers, and this embodiment does not limit the specific number of sub-lead layers in the lead layer. For example, the sub-lead layer in the lead layer may be two layers, for example, may include an inner lead layer and an outer lead layer, or the sub-lead layer in the lead layer may be three layers.

[0066] Furthermore, in order to ensure the sealing of electromagnetic shielding packaging devices, you can refer to Figure 4 , Figure 4 A flowchart of completing the packaging of the lead layer in a packaging method for achieving electromagnetic shielding provided by an embodiment of the present invention. After obtaining the first package to be processed, the following steps may also be included:

[0067] S401: performing a plastic encapsulation process on the front side 1 of the package body to obtain a final package body 11, so as to encapsulate the lead layer in the final package body 11;

[0068] S402: thinning the final package body 11 to expose the lead layer.

[0069] The structure prepared in step S401 in this embodiment can be referred to Fig.14 , and the structure prepared in step S402 can refer to Fig.15. It should be noted that, in this embodiment, the front side of the packaged chip 20 is conductively connected to the conductive lead-out terminal through the lead layer. After the rewiring is completed, the height of the lead layer is plastic-sealed, and the package body 10 obtained after the plastic-sealing process is used as the final package body 11 to avoid the lead layer being exposed and reducing the stability of the device. Further, in this embodiment, due to the limited control of the precision of the plastic-sealing process, the front lead layer and the side wall 42 of the first sub-shielding layer will be wrapped inside, resulting in a weakened side shielding effect. At the same time, the lead layer after rewiring is not exposed to the outside, which is not conducive to conductive connection with the outside. Therefore, in this embodiment, it is necessary to thin the front side of the final package body 11 to expose the lead layer. Since the height of the side wall 42 of the first sub-shielding layer is consistent with the lead layer, the side wall 42 of the first sub-shielding layer is exposed during the thinning process. Among them, the front side of the final package body 11 can refer to the front side 1 of the package body, that is, the outer surface of the side of the final package body 11 close to the conductive lead-out terminal of the packaged chip 20.

[0070] S303: The front side 1 of the package body in the first package to be processed is connected to the front side carrier 31, and the back side carrier 30 is removed to form a second package to be processed.

[0071] The structure prepared in step S303 in this embodiment can be referred to Fig.16 . It should be noted that, in this embodiment, after the first sub-shielding layer groove 41 is prepared by groove preparation on the front side 1 of the package body, the remaining shielding layer side wall 44 is grooved on the back side 2 of the package body to ensure the convenience of preparation. Therefore, the back support carrier 30 needs to be removed to facilitate the groove preparation. The support carrier is required as a support during device preparation. Therefore, in the first package to be processed, the front side 1 of the package body is connected to the front support carrier 31 to facilitate the preparation of the remaining shielding layer side wall 44 on the back side 2 of the package body. In this embodiment, both the front support carrier and the back support carrier can be set as metal carriers.

[0072] S304 : in the second package to be processed, a second sub-shielding layer groove 43 is prepared inwardly at a position of the back side 2 of the package body corresponding to the first sub-shielding layer side wall 42 until the first sub-shielding layer side wall 42 is exposed.

[0073] The structure prepared in step S304 in this embodiment can be referred to Fig.16. It should be noted that, in the second package to be processed in the present embodiment, a second sub-shielding layer groove 43 is prepared inwardly at the position of the first sub-shielding layer side wall 42 on the back side 2 of the package body until the first sub-shielding layer side wall 42 is exposed, which can avoid damage to the front support carrier 31 during grooving. Correspondingly, when the front side 1 of the package body is grooved, only a shielding layer groove of a partial depth is prepared, which also does not damage the back support carrier 30, thereby improving the preparation process and avoiding the problem of damaging the support carrier during the preparation of the shielding layer groove. It should be further noted that, in the present embodiment, when preparing the second sub-shielding layer groove 43, in order to reduce the complexity of the preparation process, part of the first sub-shielding layer side wall 42 can be removed when preparing the second sub-shielding layer groove 43, and the preparation of the shielding layer side wall 44 can also be completed, thereby improving the fault tolerance of the preparation process. In the present embodiment, the second sub-shielding layer groove 43 is prepared inwardly, that is, the second sub-shielding layer groove 43 extending to the front side 1 of the package body is prepared along the back side 2 of the package body.

[0074] S305: forming a second sub-shielding layer side wall by electroplating in the second sub-shielding layer groove 43 using an electroplating process to obtain an electromagnetic shielding packaging device.

[0075] The structure prepared in step S305 in this embodiment can be referred to Fig.17 In this embodiment, after the preparation of the second sub-shielding layer groove 43 is completed, the second sub-shielding layer side wall filling the second sub-shielding layer groove 43 can be electroplated in the second sub-shielding layer groove 43. At this time, the first sub-shielding layer side wall 42 and the second sub-shielding layer side wall formed constitute a complete shielding layer side wall 44, completing the preparation of the electromagnetic shielding packaging device.

[0076] Further, in order to improve the shielding effect of the electromagnetic shielding packaging device and improve the convenience of preparing the electromagnetic shielding packaging device, the above-mentioned electroplating process is used to electroplating the second sub-shielding layer side wall in the second sub-shielding layer groove 43 to obtain the electromagnetic shielding packaging device, which may include:

[0077] The second sub-shielding layer sidewall is formed by electroplating in the second sub-shielding layer groove 43 by electroplating process, and the shielding layer back plate 45 is formed by electroplating on the back side 2 of the package body to obtain an electromagnetic shielding package device.

[0078] The structure prepared in this example can be referred to Fig.17. It should be noted that, in this embodiment, when the second sub-shielding layer side wall is prepared by electroplating in the second sub-shielding layer groove 43, a shielding layer backplane 45 is formed on the back side 2 of the package body at the same time. Since no conductive lead terminal is provided on the back side of the packaged chip 20, the shielding layer backplane 45 can be provided on the entirety to improve the shielding effect against external interference. It should be further noted that, in this embodiment, since the packaged chip 20 is exposed on the back side 2 of the package body, the package body 10 may not be provided between the packaged chip 20 and the shielding layer backplane 45, and there may be at most one adhesive layer, which is then connected to the back side of the packaged chip 20 through the shielding layer backplane 45, so that the packaged chip 20 dissipates heat upward, thereby improving the heat dissipation efficiency.

[0079] Furthermore, in order to ensure uniformity in the preparation of the shielding layer sidewall 44 , the first sub-shielding layer groove 41 and the second sub-shielding layer groove 43 may both be shielding layer grooves with a half depth.

[0080] It should be noted that, in the present embodiment, when preparing the first sub-shielding layer groove 41, only half of the depth of the package body 10 from the front side to the back side is prepared inward, that is, half of the depth of the shielding layer groove finally formed. Correspondingly, when preparing the second sub-shielding layer groove 43, the remaining depth is prepared, which can ensure that the depths of the sub-shielding layer grooves prepared twice are consistent, thereby being able to evenly improve the uniformity of the shielding layer material in the shielding layer side wall 44 prepared by electroplating.

[0081] Further, in order to improve the convenience of the groove processing in the package body 10, the above-mentioned preparation of the sub-shielding layer groove surrounding the package chip 20 along the circumferential direction may include:

[0082] A laser grooving process is used to prepare a sub-shielding layer groove that circumferentially surrounds the packaged chip 20 .

[0083] In this embodiment, the sub-shielding layer groove is prepared by laser grooving process, which ensures the simplicity of preparing the sub-shielding layer groove, does not require the preparation of a mask, improves the preparation efficiency, and ensures the preparation accuracy of the sub-shielding layer groove.

[0084] Furthermore, in order to improve the quality rate of products formed after the device is cut, after obtaining the electromagnetic shielding packaging device, the following steps may also be included:

[0085] Between adjacent packaged chips 20 , the electromagnetic shielding packaged device is cut along the symmetry axis of the shielding layer side wall 44 to obtain a single electromagnetic shielding packaged product with the shielding layer side wall 44 of the same thickness.

[0086] It should be noted that, in the present embodiment, between adjacent packaged chips 20, corresponding shielding layer side walls 44 are formed on the corresponding packaged chips 20 on both sides, and in the present embodiment, between adjacent packaged chips 20, the symmetry axis of the corresponding shielding layer side wall 44 is used to cut the electromagnetic shielding package device, that is, adjacent packaged chips 20 obtain shielding layer side walls 44 of the same thickness after segmentation, thereby ensuring the parameter stability of a single electromagnetic shielding package product.

[0087] The packaging method for achieving electromagnetic shielding provided by the embodiment of the present invention includes providing a packaging preform, the packaging preform including a packaging body 10 and at least one packaging chip 20, the packaging chip 20 is packaged inside the packaging body 10, the packaging chip 20 exposed on the back side 2 of the packaging body is connected to the back side carrier 30, and the back side 2 of the packaging body is the outer surface of the side of the packaging body 10 away from the conductive lead-out terminal of the packaging chip 20; cyclically executing the steps of preparing a sub-shielding layer groove surrounding the packaging chip 20 along the circumferential direction in the packaging body 10 on the side of each packaging chip 20, and using an electroplating process to electroplate a sub-shielding layer side wall in the sub-shielding layer groove until the preparation of the shielding layer side wall 44 surrounding all sides of the packaging chip 20 along the circumferential direction is completed, so as to obtain an electromagnetic shielding packaging device, each sub-shielding layer side wall is a shielding layer side wall 44 of a partial height, and all the sub-shielding layer side walls correspond to the shielding layer side wall 44, each sub-shielding layer groove is a shielding layer groove of a partial height, and all the sub-shielding layer grooves correspond to the shielding layer groove. The present invention cyclically executes the steps of preparing a sub-shielding layer groove that circumferentially surrounds the packaged chip 20 in the package body 10 on the side of each packaged chip 20, and using an electroplating process to electroplate a sub-shielding layer side wall in the sub-shielding layer groove, so as to form a shielding layer side wall 44 by electroplating, and shield the side of the packaged chip 20 of the system-level package. While shielding the electromagnetic interference between the packaged chips 20 and the external electromagnetic interference, the packaging size of the shielding layer side wall 44 can be reduced, and the preparation convenience and stability of the shielding layer side wall 44 can be improved. By completing the preparation of the shielding layer side wall 44 in multiple times, the preparation height of a single shielding layer side wall 44 can be effectively reduced, thereby avoiding the phenomenon of closing at the notch of the shielding layer groove during preparation, and at the same time reducing the duration of a single electroplating process, ensuring the uniformity of the shielding layer material in the shielding layer side wall 44.

[0088] In addition, the embodiment of the present invention connects the packaged chip 20 to the carrier first, so that the packaged chip 20 and the carrier are pre-fixed, and then uses the package body 10 to perform plastic sealing on the packaged chip 20, thereby avoiding the position of the packaged chip 20 from being offset during the packaging process; the preparation of the shielding layer side wall 44 is set to be completed twice on the front and back sides respectively, and when the groove processing is performed on the front side 1 of the package body, only a shielding layer groove of a partial depth is prepared, and when the second sub-shielding layer groove 43 is correspondingly prepared on the back side 2 of the package body, it is only performed until the first sub-shielding layer side wall 42 is exposed, so that when preparing the shielding layer side wall 44, it is possible to avoid the groove processing causing damage to the carrier; the first sub-shielding layer side wall 42 is formed by electroplating in the first sub-shielding layer groove 41, and the lead layer conductively connected to the conductive lead end is simultaneously prepared to realize the rewiring of the packaged chip 20, thereby reducing the preparation process and improving the preparation efficiency; the plastic sealing processing is performed on the front side of the packaged chip 20, which can avoid the lead layer being completely exposed to the outside and reducing the stability of the device, and the front side of the final package body 11 is processed. A thinning process is performed to expose the lead layer, which can ensure that the lead layer is conductively connected to the outside; when the second sub-shielding layer side wall is prepared by electroplating in the second sub-shielding layer groove 43, a shielding layer backplane 45 is prepared on the back side 2 of the package body, which can improve the shielding effect against external interference. The shielding layer backplane 45 is connected to the back of the packaged chip 20, so that the packaged chip 20 dissipates heat upward, thereby improving the heat dissipation efficiency; by setting the first sub-shielding layer groove 41 and the second sub-shielding layer groove 43 to be shielding layer grooves of half depth, the depth of the sub-shielding layer grooves prepared twice can be guaranteed to be consistent, thereby evenly improving the uniformity of the shielding layer material in the shielding layer side wall 44 prepared by electroplating; the sub-shielding layer groove is prepared by a laser grooving process, which ensures the simplicity and efficiency of the preparation of the sub-shielding layer groove, and at the same time ensures the accuracy of the preparation of the sub-shielding layer groove; between adjacent packaged chips 20, the electromagnetic shielding packaging device is cut corresponding to the symmetry axis of the shielding layer side wall 44, so as to ensure the parameter stability of the formed single electromagnetic shielding packaging product.

[0089] In a feasible embodiment, the above-mentioned packaging method for realizing electromagnetic shielding can refer to Figure 5 , Figure 5 A flowchart of another packaging method for achieving electromagnetic shielding provided by an embodiment of the present invention. Specifically, the method may include the following steps:

[0090] S501 : planting a gold solder ball 60 on the front solder pad of the packaged chip 20 .

[0091] The structure prepared in step S501 in this embodiment can be referred to Figure 6 .

[0092] S502: Printing a nanosilver layer 70 on the back of the packaged chip 20, and placing the packaged chip 20 in an oven for baking, so that the nanosilver is fully sintered and tightly bonded to the back of the chip.

[0093] The structure prepared in step S502 in this embodiment can be referred to Figure 7 In this embodiment, a nano silver layer 70 is printed on the back of the package chip 20 to enhance the heat dissipation effect of the package chip 20 .

[0094] S503: attaching the packaged chip 20 to a metal carrier with weak adhesion through the nanosilver layer 70, with the front side of the packaged chip 20 facing upward.

[0095] The structure prepared in step S503 in this embodiment can be referred to Figure 8 .

[0096] S504 : performing a first plastic encapsulation process on the packaged chip 20 , encapsulating the packaged chip 20 and the gold solder balls 60 in the package body 10 .

[0097] The structure prepared in step S504 in this embodiment can be referred to Fig. 9 .

[0098] S505 : performing a first thinning process on the front side 1 of the package body to expose the heads of the gold solder balls 60 on the front side of the packaged chip 20 .

[0099] The structure prepared in step S505 in this embodiment can be referred to Fig.10 The front side 1 of the package body is the outer surface of the package body 10 on a side close to the gold solder balls 60 of the packaged chip 20 .

[0100] S506 : On the front side 1 of the package body, at a position corresponding to the side of the packaged chip 20 , a first sub-shielding layer groove 41 is prepared inwardly by using a laser grooving process.

[0101] The structure prepared in step S506 in this embodiment can be referred to Fig.11 .

[0102] S507: using an electroplating process to electroplate a first sub-shielding layer side wall 42 in the first sub-shielding layer groove 41, and preparing a lead layer conductively connected to the conductive lead-out terminal, and making the first sub-shielding layer side wall 42 and the lead layer height consistent, as a first package to be processed.

[0103] The structure prepared in step S507 in this embodiment can be referred to Figure 12 to Figure 13 .

[0104] S508 : performing a second plastic encapsulation process on the front side 1 of the package body in the first package to be processed to obtain a final package body 11 , so as to encapsulate the lead layer in the final package body 11 .

[0105] The structure obtained in step S508 in this embodiment can be referred to Fig.14 .

[0106] S509 : Thinning the front side of the final package body 11 to expose the lead layer and the head of the gold solder ball 60 .

[0107] The structure prepared in step S509 in this embodiment can be referred to Fig.15 The front side of the final package body 11 is the outer surface of the final package body 11 on the side close to the gold solder balls 60 of the packaged chip 20 .

[0108] S510: Connect the front side carrier 31 to the front side of the final package body 11 and remove the back side carrier 30 to prepare a second package to be processed.

[0109] The structure prepared in step S510 in this embodiment can be referred to Fig.16 .

[0110] S511 : in the second package to be processed, a second sub-shielding layer groove 43 is prepared inwardly at a position of the back side 2 of the package body corresponding to the first sub-shielding layer side wall 42 until the first sub-shielding layer side wall 42 is exposed.

[0111] The structure prepared in step S511 in this embodiment can be referred to Fig.17 .

[0112] S512: forming a second sub-shielding layer side wall in the second sub-shielding layer groove 43 by electroplating using an electroplating process to obtain an electromagnetic shielding packaging device.

[0113] The structure prepared in step S512 in this embodiment can be referred to Fig.18 .

[0114] It should be noted that, after the electromagnetic shielding packaging device is obtained in the above step S512, the present embodiment may also include electroplating pure tin or nickel gold on the shielding layer side wall 44, the shielding layer back plate 45 and the lead layer; stamping the product name on the surface of the shielding layer back plate 45 by laser; cutting the electromagnetic shielding packaging device between adjacent packaged chips 20 along the symmetry axis corresponding to the shielding layer side wall 44 to obtain a single electromagnetic shielding packaging product with the same thickness of the shielding layer side wall 44; and packaging the electromagnetic shielding packaging products that have been cut into single chips.

[0115] A packaging structure for implementing electromagnetic shielding provided by an embodiment of the present invention is introduced below. The packaging structure for implementing electromagnetic shielding described below and the packaging method for implementing electromagnetic shielding described above can refer to each other.

[0116] Please refer to Fig.19 , Fig.19 A schematic structural diagram of a packaging structure for implementing electromagnetic shielding provided by an embodiment of the present invention may include:

[0117] A package body 10 and at least one packaged chip 20, wherein the packaged chip 20 is packaged inside the package body 10, and the back side 2 of the package body at least exposes a portion of the packaged chip 20; the back side 2 of the package body is the outer surface of the package body 10 away from the conductive lead-out terminal of the packaged chip 20;

[0118] A shielding layer side wall 44 is provided in the package body 10 located on the side of each packaged chip 20, which circumferentially surrounds the corresponding packaged chip 20; the shielding layer side wall 44 is a structure obtained by cyclically executing the steps of preparing a sub-shielding layer groove circumferentially surrounding the corresponding packaged chip 20 in the package body 10 located on the side of each packaged chip 20, and electroplating the sub-shielding layer side wall in the sub-shielding layer groove using an electroplating process; each sub-shielding layer side wall is a shielding layer side wall 44 of a partial height, and all sub-shielding layer side walls constitute the shielding layer side wall 44; each sub-shielding layer groove is a shielding layer groove of a partial height, and all sub-shielding layer grooves correspond to constitute a shielding layer groove.

[0119] It should be noted that, in this embodiment, generally, multiple packaged chips 20 are arranged in the same plane. In this embodiment, by cyclically executing in the package body 10 on the side of each packaged chip 20, a sub-shielding layer groove surrounding the corresponding packaged chip 20 is prepared, and the step of electroplating the sub-shielding layer side wall in the sub-shielding layer groove by electroplating using an electroplating process is performed, that is, the formed shielding layer side wall 44 also surrounds the corresponding packaged chip 20 along the circumferential direction. It should be further noted that, in order to improve the heat dissipation effect of the packaged chip 20, a shielding layer back plate 45 can be arranged on the back side of the packaged chip 20 to improve the shielding effect of the packaged chip 20 against external interference, and at the same time, the shielding layer back plate 45 can be arranged to be connected to the packaged chip 20 to achieve heat dissipation of the packaged chip 20 upward. Specifically, in this embodiment, the back of the packaged chip 20 can be directly connected to the shielding layer back plate 45 through the nanosilver layer 70, or the back of the packaged chip 20 can be directly connected to the shielding layer back plate 45 through a high thermal conductivity and conductive adhesive. In this embodiment, the shielding layer side wall 44 and the shielding layer back plate 45 can be used together to form a shielding layer. In this embodiment, the shielding layer side wall 44 and the shielding layer back plate 45 can be set as tin shielding layer side wall 44 and tin shielding layer back plate 45, or can also be set as nickel-gold shielding layer side wall 44 and nickel-gold shielding layer back plate 45. Fig.16 shown.

[0120] Furthermore, in order to improve the preparation efficiency of the shielding layer sidewalls 44 , the shielding layer sidewalls 44 between adjacent packaged chips 20 may be provided, and the shielding layer sidewalls 44 may be formed by electroplating the same shielding layer groove.

[0121] In the present embodiment, a shielding layer side wall 44 is provided between adjacent packaged chips 20. The shielding layer side wall 44 is formed by electroplating the same shielding layer groove. Only one shielding layer groove needs to be prepared between adjacent packaged chips 20, and one shielding layer side wall 44 needs to be formed by electroplating. On the one hand, the size of the shielding layer groove between adjacent packaged chips 20 is increased, and the uniformity of the shielding layer material inside the shielding layer side wall 44 formed by electroplating is improved. On the other hand, only one shielding layer groove needs to be electroplated to prepare the shielding layer side wall 44 between adjacent packaged chips 20, thereby improving the preparation efficiency.

[0122] The packaging structure for achieving electromagnetic shielding provided by the embodiment of the present invention includes a packaging body 10 and at least one packaging chip 20, wherein the packaging chip 20 is packaged inside the packaging body 10, and the back side 2 of the packaging body at least exposes a portion of the packaging chip 20, and the back side 2 of the packaging body is the outer surface of the side of the packaging body 10 away from the conductive lead-out terminal of the packaging chip 20; in the packaging body 10 located on the side of each packaging chip 20, a shielding layer side wall 44 is provided which circumferentially surrounds the corresponding packaging chip 20, and the shielding layer side wall 44 is a structure obtained by cyclically executing the steps of preparing a sub-shielding layer groove which circumferentially surrounds the corresponding packaging chip 20 in the packaging body 10 on the side of each packaging chip 20, and electroplating the sub-shielding layer side wall in the sub-shielding layer groove by an electroplating process, each sub-shielding layer side wall is a shielding layer side wall 44 of a partial height, and all the sub-shielding layer side walls constitute the shielding layer side wall 44; each sub-shielding layer groove is a shielding layer groove of a partial height, and all the sub-shielding layer grooves correspond to the shielding layer groove. The present invention cyclically executes in the packaging body 10 on the side of each packaged chip 20, prepares a sub-shielding layer groove that circumferentially surrounds the packaged chip 20, and uses an electroplating process to electroplate a sub-shielding layer side wall in the sub-shielding layer groove, so as to form a shielding layer side wall 44 by electroplating, so as to shield the side of the packaged chip 20 of the system-level package. While shielding the electromagnetic interference between the packaged chips 20 and the external electromagnetic interference, it is possible to reduce the packaging size of the shielding layer side wall 44 and improve the convenience and stability of preparing the shielding layer side wall 44.

[0123] In addition, the embodiment of the present invention sets a shielding layer side wall 44 between adjacent packaged chips 20, which is a shielding layer side wall 44 formed by electroplating in the same shielding layer groove. On the one hand, it increases the size of the shielding layer groove between adjacent packaged chips 20 and improves the uniformity of the shielding layer material inside the shielding layer side wall 44 formed by electroplating. On the other hand, it improves the preparation efficiency.

[0124] In this specification, each embodiment is described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the embodiments can be referred to each other. For the device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant parts can be referred to the method part.

[0125] In addition, it should be noted that, in this article, relationships such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprises" or any other variations are intended to cover non-exclusive inclusion, so that a process, method, article or device that includes a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0126] The above is a detailed introduction to a packaging method and packaging structure for achieving electromagnetic shielding provided by the present invention. Specific examples are used in this article to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea; at the same time, for general technical personnel in this field, according to the idea of ​​the present invention, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the present invention.

Claims

1. A packaging method for achieving electromagnetic shielding, characterized in that: include: Provide packaging preforms; The package preform comprises a package body (10) and at least one package chip (20), wherein the package chip (20) is packaged inside the package body (10), and the package chip (20) exposed on the back side of the package body (10) is connected to a back side carrier (30); the back side of the package body (10) is the outer surface of the package body (10) on a side away from the conductive lead-out terminal of the package chip (20); The steps of preparing a sub-shielding layer groove circumferentially surrounding the packaged chip (20) in the package body (10) on the side of each packaged chip (20), and forming a sub-shielding layer side wall by electroplating in the sub-shielding layer groove using an electroplating process, are cyclically performed until the preparation of the shielding layer side wall (44) circumferentially surrounding all the side portions of the packaged chip (20) is completed, thereby obtaining the electromagnetic shielding package device; Each of the sub-shielding layer side walls is a partial height of the shielding layer side wall (44), and all of the sub-shielding layer side walls correspondingly constitute the shielding layer side wall (44); each of the sub-shielding layer grooves is a partial height of the shielding layer groove, and all of the sub-shielding layer grooves correspondingly constitute the shielding layer groove.

2. The packaging method for achieving electromagnetic shielding according to claim 1, characterized in that: The cycle is performed in the package body (10) on the side of each packaged chip (20), a sub-shielding layer groove is prepared that circumferentially surrounds the packaged chip (20), and a sub-shielding layer side wall is formed by electroplating in the sub-shielding layer groove using an electroplating process until the electromagnetic shielding package device is obtained, comprising: A first sub-shielding layer groove (41) is formed inwardly on the front side of the package body (10), corresponding to the side position of the package chip (20); the front side of the package body (10) is the outer surface of the package body (10) on a side close to the conductive lead-out terminal of the package chip (20); Using an electroplating process to electroplatingly form a first sub-shielding layer side wall (42) in the first sub-shielding layer groove (41) as a first package to be processed; The front side of the package body (10) in the first package to be processed is connected to a front side carrier (31), and the back side carrier (30) is removed to form a second package to be processed; In the second package to be processed, a second sub-shielding layer groove (43) is prepared inwardly at a position on the back side of the package body (10) corresponding to the first sub-shielding layer side wall (42) until the first sub-shielding layer side wall (42) is exposed; The second sub-shielding layer side wall is formed by electroplating in the second sub-shielding layer groove (43) using an electroplating process to obtain the electromagnetic shielding packaging device.

3. The packaging method for achieving electromagnetic shielding according to claim 2, characterized in that: The first sub-shielding layer groove (41) and the second sub-shielding layer groove (43) are both shielding layer grooves with a depth of half.

4. The packaging method for achieving electromagnetic shielding according to claim 2, characterized in that: Using an electroplating process to electroplate in the first sub-shielding layer groove (41) to form a first sub-shielding layer side wall (42) as a first package to be processed, comprising: The first sub-shielding layer side wall (42) is formed by electroplating in the first sub-shielding layer groove (41) using an electroplating process, and a lead layer conductively connected to the conductive lead-out terminal is prepared to obtain the first package to be processed.

5. The packaging method for achieving electromagnetic shielding according to claim 4, characterized in that: After obtaining the first package to be processed, the method further includes: Performing a plastic encapsulation process on the front surface of the package body (10) to obtain a final package body (11), so as to encapsulate the lead layer in the final package body (11); The final package (11) is thinned to expose the lead layer.

6. The packaging method for achieving electromagnetic shielding according to claim 2, characterized in that: The second sub-shielding layer side wall is formed by electroplating in the second sub-shielding layer groove (43) using an electroplating process to obtain the electromagnetic shielding packaging device, comprising: The second sub-shielding layer side wall is formed by electroplating in the second sub-shielding layer groove (43) using an electroplating process, and a shielding layer back plate (45) is formed by electroplating on the back side of the packaging body (10), thereby obtaining the electromagnetic shielding packaging device.

7. The packaging method for achieving electromagnetic shielding according to claim 1, characterized in that: The method of providing a packaging preform comprises: Connecting the packaged chip (20) with the side facing away from the conductive lead-out terminal to the back-side carrier (30) to form a preform to be packaged; The preform to be packaged is subjected to plastic packaging to obtain the packaged preform.

8. The packaging method for achieving electromagnetic shielding according to claim 1, characterized in that: The method of preparing a sub-shielding layer groove that circumferentially surrounds the packaged chip (20) comprises: The sub-shielding layer groove surrounding the packaged chip (20) in the circumferential direction is prepared by using a laser grooving process.

9. The packaging method for achieving electromagnetic shielding according to claim 1, characterized in that: After obtaining the electromagnetic shielding packaging device, the method further includes: The electromagnetic shielding packaging device is cut between adjacent packaging chips (20) corresponding to the symmetry axis of the shielding layer side wall (44) to obtain a single electromagnetic shielding packaging product with the same thickness of the shielding layer side wall (44).

10. A packaging structure for achieving electromagnetic shielding, characterized in that: include: A package body (10) and at least one packaged chip (20), wherein the packaged chip (20) is packaged inside the package body (10), and the back side of the package body (10) exposes at least a portion of the packaged chip (20); the back side of the package body (10) is an outer surface of the package body (10) on a side away from a conductive lead-out terminal of the packaged chip (20); The package body (10) located on the side of each packaged chip (20) is provided with a shielding layer side wall (44) surrounding the corresponding packaged chip (20) in a circumferential direction; the shielding layer side wall (44) is a structure obtained by cyclically executing the steps of preparing a sub-shielding layer groove surrounding the corresponding packaged chip (20) in the package body (10) located on the side of each packaged chip (20), and electroplating the sub-shielding layer side wall (44) in the sub-shielding layer groove using an electroplating process; each of the sub-shielding layer side walls is a shielding layer side wall (44) of a partial height, and all of the sub-shielding layer side walls constitute the shielding layer side wall (44); each of the sub-shielding layer grooves is a shielding layer groove of a partial height, and all of the sub-shielding layer grooves correspond to constitute the shielding layer groove.

11. The packaging structure for achieving electromagnetic shielding according to claim 10, characterized in that: The shielding layer side walls (44) between adjacent packaged chips (20) are shielding layer side walls (44) formed by electroplating the same shielding layer groove.

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