Pick-up mechanism

Abstract

A piece taking mechanism comprises a piece taking arm and an elastic liner. The pick-up arm comprises a frame, an air exhaust sleeve and a sucker. The frame is provided with an internal space and an opening. The opening is formed in one side of the frame and communicates with the internal space. The air exhaust sleeve is located on the frame and used for being connected with a vacuum pump device. The suction cup is arranged at one end of the air exhaust sleeve in a sleeving mode, located in the inner space and faces the opening. The elastic pad comprises a flexible pad body and a through hole. The flexible pad body is fixedly attached to the side of the frame. The through hole penetrates through the flexible pad body and is coaxially aligned with the opening and the suction cup. When the flexible pad body directly covers a packaged wafer, and the suction nozzle opening of the suction cup covers the opening, the air exhaust sleeve absorbs the packaged wafer to the flexible pad body in a vacuum mode through the through hole. Through the above structure, the pickup mechanism can improve the success rate of vacuum adsorption of the packaged wafer, thereby reducing the risk of failure of adsorption of the packaged wafer or damage caused by falling in the process of pickup and placement of the packaged wafer.

Description

Technical Field

[0001] The invention relates to a pick-up mechanism, in particular to a pick-up mechanism capable of picking up a packaged chip with a coating layer. Background Art

[0002] Generally speaking, when performing electrical testing on a semiconductor package chip, a pick-and-place arm is used to absorb the top surface of the semiconductor package chip by vacuum adsorption so that the semiconductor package chip can undergo corresponding electrical testing.

[0003] However, if the top surface of some packaged chips has a porous structure, it is difficult for the pick-and-place arm to vacuum adsorb the packaged chips, resulting in an increased risk of the packaged chips failing to adsorb or falling and being damaged during the pick-and-place process.

[0004] It can be seen that the above technology still has inconveniences and defects, and needs to be further improved. Therefore, how to effectively solve the above inconveniences and defects is one of the important research and development topics at present, and has also become a goal that urgently needs to be improved in the current related fields. Summary of the invention

[0005] An object of the present invention is to provide a piece taking mechanism to solve the difficulties mentioned in the above prior art.

[0006] One embodiment of the present invention provides a pickup mechanism. The pickup mechanism includes a pickup arm and an elastic pad. The pickup arm includes a frame, an exhaust sleeve and a suction cup. The frame has an internal space and a first opening. The first opening is formed on one side of the frame and connected to the internal space. The exhaust sleeve is located on the frame and is used to connect a vacuum pump device. The suction cup is sleeved on one end of the exhaust sleeve and is located in the internal space, and a suction nozzle of the suction cup faces the first opening. The elastic pad includes a flexible pad body and a through hole. The flexible pad body has a flat surface and an attachment surface opposite to each other. The attachment surface is fixedly attached to this side of the frame. The through hole passes through the flexible pad body and is coaxially aligned with the first opening and the suction cup. When the flat surface of the flexible pad body directly covers a packaged chip and the suction nozzle of the suction cup covers the first opening, the exhaust sleeve vacuum absorbs the packaged chip onto the flexible pad body through the through hole.

[0007] According to one or more embodiments of the present invention, in the above-mentioned pickup mechanism, there is a spacing space between the suction nozzle and the first opening, and the suction sleeve is slidably located on the frame, so that the suction nozzle can be driven by the suction sleeve to directly contact the frame and cover the first opening.

[0008] According to one or more embodiments of the present invention, in the above-mentioned retrieval mechanism, the vacuum sleeve includes a first arm and a second arm. The first arm has a first air channel and a first joint portion, the first air channel runs through the first arm, and the long axis direction of the first arm is coaxial with the long axis direction of the first air channel. The second arm is located in the internal space, and has a second air channel and a second joint portion. The second air channel runs through the second arm, and the long axis direction of the second arm, the long axis direction of the second air channel, and the long axis direction of the first arm are coaxial with each other. Therefore, when the second joint portion is combined with the first joint portion, one end of the first arm is connected to one end of the second arm, and the first air channel is connected to the second air channel.

[0009] According to one or more embodiments of the present invention, in the above-mentioned pickup mechanism, the frame further has a limit frame and a second opening. The second opening is formed on the other side of the frame and is connected to the internal space. The limit frame is located on the other side of the frame and is aligned with the second opening. The first arm includes a first tube body and a second tube body. The first tube body is located outside the internal space and is stopped by the limit frame. The second tube body extends outward from one end of the first tube body and extends into the second opening from the limit frame. The diameter of the second tube body is smaller than the diameter of the first tube body. The first air duct passes through the first tube body and the second tube body in sequence, and the first joint is located on the second tube body. The second joint and the suction cup are respectively located at two opposite ends of the second arm, and the end surface of one end of the second arm facing away from the suction cup is larger than the diameter of the second opening.

[0010] According to one or more embodiments of the present invention, in the above-mentioned pick-up mechanism, the second joint portion includes an internal thread located in the second air passage, and the first joint portion includes an external thread located on the outer surface of the second tube for threading with the external thread.

[0011] According to one or more embodiments of the present invention, the above-mentioned pickup mechanism further includes a stepping motor. The stepping motor is connected to the pickup arm to lift and lower the pickup arm.

[0012] According to one or more embodiments of the present invention, in the above-mentioned pickup mechanism, the suction sleeve is fixed on the frame so that the suction nozzle is fixedly in contact with the frame and directly covers the first opening.

[0013] According to one or more embodiments of the present invention, in the above-mentioned pick-up mechanism, the top surface of the packaged wafer has a coating layer, the area of ​​the coating layer is smaller than the area of ​​the flat surface of the flexible pad, and the coating layer is one of a porous structure layer and a mesh structure layer. When the flat surface of the flexible pad directly covers the top surface of the packaged wafer and the coating layer, the suction cup, the flexible pad and the packaged wafer together define a closed space, and the coating layer is completely located in the closed space.

[0014] According to one or more embodiments of the present invention, in the above-mentioned pickup mechanism, the pickup arm further includes at least one supporting arm. The supporting arm is connected to the air extraction sleeve and abuts against the flexible pad.

[0015] According to one or more embodiments of the present invention, in the above-mentioned pick-up mechanism, the support arm includes an extension arm and a support portion. The extension arm extends from the air extraction sleeve to the flexible pad. The support portion is located at the end of the extension arm and abuts against the attachment surface of the flexible pad.

[0016] Thus, through the above structure, the present invention can improve the success rate of vacuum adsorption of the packaged chip, thereby reducing the risk of failure of adsorption of the packaged chip, or the risk of falling and being damaged during placement.

[0017] The above description is only used to illustrate the problems to be solved by the present invention, the technical means to solve the problems, and the effects produced, etc. The specific details of the present invention will be introduced in detail in the following implementation methods and related drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to make the above and other objects, features, advantages and embodiments of the present invention more clearly understood, the accompanying drawings are described as follows:

[0019] Figure 1 A schematic diagram of a pickup mechanism according to an embodiment of the present invention;

[0020] Figure 2 for Figure 1 An exploded view of the pickup mechanism;

[0021] Figure 3A for Figure 2 A top view of the frame;

[0022] Figure 3B for Figure 2 A bottom view of the frame;

[0023] Figure 3C for Figure 2 A front view of a flat surface of the elastic pad;

[0024] FIG. 4A to FIG. 4D They are Figure 1 A schematic diagram of the continuous operation of the pickup mechanism;

[0025] Figure 5 A schematic diagram of a pickup mechanism according to an embodiment of the present invention;

[0026] Figure 6 Schematic diagram of a pickup mechanism according to an embodiment of the present invention.

[0027]

Explanation of symbols

[0028] 10,11,12: Pick-up agency

[0029] 100: Pick-up arm

[0030] 200:Frame

[0031] 210: Top

[0032] 220: Bottom

[0033] 221:Inner bottom wall

[0034] 230: Side

[0035] 231: Frame

[0036] 240:Interior Space

[0037] 250: Limit frame

[0038] 251:Through groove

[0039] 260: First Opening

[0040] 270: Second opening

[0041] 300:Exhaust sleeve

[0042] 310: First arm

[0043] 311:First tube body

[0044] 312: Second tube body

[0045] 313: First Airway

[0046] 314: First joint

[0047] 320: Second arm

[0048] 320A: End face

[0049] 321:Third tube body

[0050] 322:The fourth tube body

[0051] 323: Second Airway

[0052] 324: Second joint

[0053] 325: Slot

[0054] 330: Suction cup

[0055] 331: Suction nozzle

[0056] 340: Support arm

[0057] 341: Extension arm

[0058] 342: abutment

[0059] 400: Elastic pad

[0060] 410: Flexible pad

[0061] 411: Flat surface

[0062] 412: Attachment surface

[0063] 420:Through hole

[0064] 430: Dashed line

[0065] 500:Packaging chip

[0066] 510: chip body

[0067] 511: Top

[0068] 520: coating layer

[0069] 600: Vacuum pump equipment

[0070] 700: Stepper Motor

[0071] A: Caliber

[0072] G: Interval space

[0073] L: Long axis direction

[0074] P1,P2,P3,P4: pipe diameter

[0075] S: Enclosed space

[0076] T:Pipeline DETAILED DESCRIPTION

[0077] The following will disclose multiple embodiments of the present invention with the accompanying drawings. For the purpose of clear description, many practical details will be described together in the following description. However, it should be understood that these practical details should not be used to limit the present invention. In other words, in each embodiment of the present invention, these practical details are not necessary. In addition, in order to simplify the drawings, some conventional structures and elements will be depicted in a simple schematic manner in the drawings.

[0078] Figure 1 FIG. 1 is a schematic diagram of a pickup mechanism 10 according to an embodiment of the present invention. Figure 2 for Figure 1 An exploded view of the pickup mechanism 10. Figure 3A for Figure 2 A top view of the frame 200. Figure 3B for Figure 2 A bottom view of the frame 200. Figure 3C for Figure 2 A front view of the flat surface 411 of the elastic pad 400.

[0079] like Figures 1 to 3CAs shown, in this embodiment, the pickup mechanism 10 includes a pickup arm 100 and an elastic pad 400. The pickup arm 100 includes a frame 200, a suction sleeve 300 and a suction cup 330. The frame 200 surrounds an internal space 240. The frame 200 has a top surface 210 and a bottom surface 220 opposite to each other. The bottom surface 220 of the frame 200 is provided with a first opening 260, and the first opening 260 is connected to the internal space 240 of the frame 200. For example, the frame 200 is a rectangular body, including the top surface 210, the bottom surface 220 and a plurality of (for example, 4) side surfaces 230. The top surface 210 and the bottom surface 220 are opposite to each other, and the side surfaces 230 surround the top surface 210 and the bottom surface 220. Each side surface 230 has a frame opening 231. Therefore, the top surface 210, the bottom surface 220 and these side surfaces 230 are connected to each other and form this internal space 240 together.

[0080] The suction sleeve 300 is suspended on the top surface 210 of the frame 200, and a portion of the suction sleeve 300 extends into the internal space 240 of the frame 200. One end of the suction sleeve 300 is connected to a vacuum pump device 600 through a pipeline T. The suction cup 330 is located in the internal space 240 and is sleeved on one end of the suction sleeve 300 opposite to the vacuum pump device 600, that is, the suction cup 330 is connected to the channel of the suction sleeve 300 and the suction nozzle 331 of the suction cup 330 faces the first opening 260.

[0081] The elastic pad 400 includes a flexible pad body 410 and a through hole 420. The flexible pad body 410 has a flat surface 411 and an attachment surface 412 opposite to each other. The attachment surface 412 of the flexible pad body 410 is fixedly attached to the bottom surface 220 of the frame 200. The flexible pad body 410 is, for example, a rubber pad or a silicone pad, however, the present invention is not limited thereto. The through hole 420 passes through the flexible pad body 410 and connects the flat surface 411 and the attachment surface 412 respectively. In addition, the suction nozzle 331 of the suction cup 330 overlaps the first opening 260 and the through hole 420, that is, the axis line of the through hole 420 (such as the dotted line 430) is coaxial with the axis line of the first opening 260 (such as the dotted line 430), and is exactly coaxially aligned with the suction nozzle 331 of the suction cup 330.

[0082] More specifically, the top surface 210 of the frame 200 is provided with a second opening 270, and the second opening 270 is connected to the internal space 240 of the frame 200. The frame 200 further has a limiting frame 250. The limiting frame 250 is disposed on the top surface 210 of the frame 200 and is aligned with the second opening 270. In this embodiment, the limiting frame 250 surrounds a through slot 251, and the through slot 251 is aligned with and coaxial with the second opening 270, and is connected to the second opening 270.

[0083] In addition, a spacing space G is defined between the suction nozzle 331 of the suction cup 330 and the first opening 260. The suction sleeve 300 is slidably located on the frame 200, so that the suction sleeve 300 can drive the suction cup 330 to descend, thereby directly contacting the inner bottom wall 221 of the frame 200 and directly covering the first opening 260, or drive the suction cup 330 to rise and move away from the first opening 260.

[0084] For example, the suction sleeve 300 includes a first arm 310 and a second arm 320. The first arm 310 has a first air channel 313 and a first joint portion 314. The first air channel 313 penetrates the first arm 310 along the long axis direction L of the first arm 310, that is, the long axis direction L of the first arm 310 is coaxial with the long axis direction L of the first air channel 313. The second arm 320 is located in the internal space 240, and the second arm 320 has a second air channel 323, a second joint portion 324 and a slot 325. The slot 325 is recessed in the end surface 320A of the second arm 320 facing away from the suction cup 330. The second air channel 323 penetrates the second arm 320 along the long axis direction L of the second arm 320 and is connected to the slot 325. The slot 325 and the suction cup 330 are respectively located at two opposite ends of the second arm 320, and the second connecting portion 324 is located in the slot 325. The long axis direction L of the slot 325, the long axis direction L of the second arm 320, the long axis direction L of the second air channel 323, and the long axis direction L of the first arm 310 are coaxial with each other. Therefore, when the second connecting portion 324 is connected to the first connecting portion 314, one end of the first arm 310 is connected to one end of the second arm 320, and the first air channel 313 is connected to the second air channel 323.

[0085] Furthermore, the first arm 310 includes a first tube body 311 and a second tube body 312. The first tube body 311 is located outside the internal space 240 and is stopped by the limit frame 250. The second tube body 312 extends outward from one end of the first tube body 311 and extends into the second opening 270 from the limit frame 250. The tube diameter P2 of the second tube body 312 is smaller than the tube diameter P1 of the first tube body 311. The first air channel 313 sequentially passes through the first tube body 311 and the second tube body 312, and the first joint portion 314 is located on the second tube body 312. For example, the first joint portion 314 includes an external thread, and the external thread is located on the outer surface of the second tube body 312, however, the present invention is not limited to this.

[0086] The second arm 320 includes a third tube body 321 and a fourth tube body 322. The third tube body 321 is located in the internal space 240 and is connected to the second tube body 312. The fourth tube body 322 extends outward from one end of the third tube body 321 and extends into the suction cup 330. The tube diameter P4 of the fourth tube body 322 is smaller than the tube diameter P3 of the third tube body 321. The second air channel 323 sequentially passes through the third tube body 321 and the fourth tube body 322, and the second joint portion 324 is located in the third tube body 321. The frame 200 is suspended on the third tube body 321 of the exhaust sleeve 300 by gravity. For example, the second joint portion 324 includes an internal thread, and the internal thread is located on the inner surface of the slot 325, however, the present invention is not limited to this.

[0087] Thus, in this embodiment, since the diameter P1 of the first tube 311 of the first arm 310 is larger than the diameter A of the second opening 270, the limit frame 250 of the frame 200 can stop the first tube 311 of the first arm 310 from continuing to descend. Since the end surface 320A of one end of the second arm 320 facing away from the suction cup 330 (i.e., the diameter P3 of the third tube 321) is larger than the diameter A of the second opening 270, the limit frame 250 of the frame 200 can stop the third tube 321 of the second arm 320 from continuing to ascend. Therefore, in other words, the second tube 312 of the first arm 310 can only be slidably located in the second opening 270.

[0088] Moreover, in this embodiment, the pickup mechanism 10 further includes a stepper motor 700. The stepper motor 700 is connected to the pickup arm 100. For example, the stepper motor 700 is connected to the frame 200 and / or the suction sleeve 300 of the pickup arm 100, so that the stepper motor 700 can quickly or gradually drive the pickup arm 100 to rise or fall.

[0089] FIG. 4A to FIG. 4D They are Figure 1 Schematic diagram of the continuous operation of the pickup mechanism 10. Figure 4A As shown, when the pick-up mechanism 10 starts to pick up a wafer, the pick-up mechanism 10 first moves above a packaged wafer 500. At this time, the frame 200 of the pick-up mechanism 10 is suspended on the third tube 321 of the second arm 320, so that the suction nozzle 331 of the suction cup 330 and the first opening 260 are separated from each other.

[0090] In the present embodiment, the package chip 500 includes a chip body 510 and a coating layer 520. The coating layer 520 is located on the top surface 511 of the chip body 510, and the area of ​​the coating layer 520 is smaller than the area of ​​the flat surface 411 of the flexible pad 410. The coating layer 520 is, for example, a porous structure layer having a porous structure. For example, the coating layer 520 (additional coating layer) is, for example, a boiling enhancement coating (BEC) layer and / or a surface treatment layer, however, the present invention is not limited thereto, and in other embodiments, the coating layer 520 may also be a mesh structure layer.

[0091] Then, if Figure 4A and Figure 4B As shown, when the frame 200 of the pickup mechanism 10 is lowered, the flat surface 411 of the flexible pad 410 directly covers the coating layer 520 of the package wafer 500. At this time, the suction nozzle 331 of the suction cup 330 and the first opening 260 are still separated ( Figure 4B Therefore, since the suction nozzle 331 of the suction cup 330 has not yet descended to the inner bottom wall 221 of the frame 200, the operator may still make slight adjustments to the position or state of the packaged wafer 500 during this stage without having to raise the frame 200 again.

[0092] Then, if Figure 4B and Figure 4C As shown, when the suction nozzle 331 of the suction cup 330 descends and presses the inner bottom wall 221 of the frame 200 and completely and directly covers the first opening 260, since the flat surface 411 of the flexible pad 410 directly covers the chip body 510 and the coating layer 520, a closed space S is jointly defined between the suction cup 330, the flexible pad 410 and the packaged chip 500, and the coating layer 520 is completely located in the closed space S.

[0093] Thus, since the coating layer 520 is completely located in the closed space S, the porous structure of the coating layer 520 cannot communicate with the outside world. Therefore, the vacuum pump device 600 ( Figure 1 ) can start to provide vacuum suction, that is, the air between the flexible pad 410 and the packaging chip 500 begins to return to the vacuum pump equipment 600 through the through hole 420, the first opening 260 and the vacuum sleeve 300 in sequence, so that the vacuum sleeve 300 vacuum absorbs the packaging chip 500 onto the flexible pad 410 through the through hole 420.

[0094] In addition, if Figure 4B As shown, the exhaust sleeve 300 is driven by the stepper motor 700 to gradually move to the first opening 260 to avoid directly falling and hitting the inner bottom wall 221 of the frame 200 .

[0095] Then, if Figure 4C and Figure 4D As shown, finally, when the picking mechanism 10 rises, since the packaged wafer 500 is effectively vacuum-adsorbed onto the flexible pad 410 , the packaged wafer 500 can be picked up by the picking arm 100 to complete the picking operation.

[0096] Figure 5 FIG. 1 is a schematic diagram of a pickup mechanism 11 according to an embodiment of the present invention. Figure 5 As shown, the pickup mechanism 11 of this embodiment is Figure 1 The embodiment of the present invention is substantially the same as that of the embodiment of the present invention, the difference being that the suction sleeve 300 is fixed on the frame 200, and is not movably suspended on the frame 200. Therefore, the suction sleeve 300 is fixed in the internal space 240, and the suction sleeve 300 is locked to the top surface 210 of the frame 200. The suction nozzle 331 of the suction cup 330 continuously contacts the inner bottom wall 221 of the frame 200, directly covers the first opening 260, and is connected to the through hole 420 through the first opening 260.

[0097] Figure 6 FIG. 1 is a schematic diagram of a pickup mechanism 12 according to an embodiment of the present invention. Figure 6 As shown, the pickup mechanism 12 of this embodiment is Figure 1 The embodiment is substantially the same, the difference being that the frame 200 does not have the above-mentioned bottom surface and inner bottom wall, that is, the bottom surface of the frame 200 is entirely the first opening 260, so that the internal space 240 of the frame 200 is directly connected to the attachment surface 412 and the through hole 420 of the flexible pad 410.

[0098] In addition, the picking arm 100 further has one or more supporting arms 340, which are symmetrically connected to the long sides of the exhaust sleeve 300 and abut against the flexible pad 410. More specifically, each supporting arm 340 includes an extension arm 341 and a supporting portion 342. The extension arm 341 extends from the long side of the exhaust sleeve 300 to the flexible pad 410. The supporting portion 342 is located at the end of the extension arm 341 and is used to directly abut against the attachment surface 412 of the flexible pad 410, thereby dispersing and uniformizing the downward pressure of the exhaust sleeve 300, which helps maintain the above-mentioned closed space S. For example, the supporting portion 342 is a spherical or tubular body to reduce the chance of the flexible pad 410 being damaged.

[0099] Therefore, when the flexible pad 410 is driven to descend to the packaging chip 500, and the suction nozzle 331 of the suction cup 330 directly contacts and covers the through hole 420 of the flexible pad 410, since the suction nozzle 331 of the suction cup 330 and the abutment portion 342 of the support arm 340 abut against the flexible pad 410 symmetrically, the flexible pad 410 can be more stably clamped between the packaging chip 500 and the picking arm 100, thereby more stably assisting the above-mentioned vacuum adsorption.

[0100] Thus, through the above structure, the present invention can improve the success rate of vacuum adsorption of the packaged chip, thereby reducing the risk of failure of adsorption of the packaged chip, or the risk of falling and being damaged during placement.

[0101] Finally, the above disclosed embodiments are not intended to limit the present invention. Anyone skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention, and all of them can be protected by the present invention. Therefore, the scope of protection of the present invention shall be determined by the definition of the attached claims.

Claims

1. A pickup mechanism, characterized in that: Include: A pickup arm, including: A frame having an inner space and a first opening, wherein the first opening is formed on one side of the frame and connected to the inner space; A vacuum sleeve, located on the frame, for connecting to a vacuum pump device; as well as a suction cup, sleeved on one end of the suction sleeve and located in the internal space, with a suction nozzle of the suction cup facing the first opening; and An elastic pad comprising: a flexible pad having a flat surface and an attachment surface opposite to each other, the attachment surface being fixedly attached to the side of the frame; and A through hole passes through the flexible pad and is coaxially aligned with the first opening and the suction cup, wherein when the flat surface of the flexible pad directly covers a packaging chip and the suction nozzle of the suction cup covers the first opening, the vacuum sleeve vacuum absorbs the packaging chip onto the flexible pad through the through hole.

2. The pickup mechanism according to claim 1, characterized in that: There is a spacing space between the suction nozzle and the first opening, and the suction sleeve is slidably located on the frame, so that the suction nozzle can be driven by the suction sleeve to directly contact the frame and cover the first opening.

3. The pickup mechanism according to claim 2, characterized in that: The exhaust sleeve comprises: a first arm having a first air channel and a first joint portion, wherein the first air channel runs through the first arm, and the long axis of the first arm is coaxial with the long axis of the first air channel; and a second arm, located in the internal space, having a second air channel and a second joint portion, wherein the second air channel runs through the second arm, and the long axis direction of the second arm, the long axis direction of the second air channel and the long axis direction of the first arm are coaxial with each other, When the second combining portion is combined with the first combining portion, one end of the first arm is connected to one end of the second arm, and the first airway is connected to the second airway.

4. The pickup mechanism according to claim 3, characterized in that: The frame further comprises a limiting frame and a second opening, wherein the second opening is formed on the other side of the frame and connected to the internal space, and the limiting frame is located on the other side of the frame and aligned with the second opening; The first arm includes a first tube and a second tube, the first tube is located outside the internal space and is stopped by the limit frame, the second tube extends outward from one end of the first tube and extends from the limit frame into the second opening, the diameter of the second tube is smaller than the diameter of the first tube, wherein the first air passage sequentially passes through the first tube and the second tube, and the first joint is located on the second tube; and The second combining portion and the suction cup are respectively located at two opposite ends of the second supporting arm, and an end surface of one of the two opposite ends of the second supporting arm facing away from the suction cup is larger than the diameter of the second opening.

5. The pickup mechanism according to claim 4, characterized in that: The second joint portion includes an internal thread, and the internal thread is located in the second air passage; and The first connecting portion includes an external thread, and the external thread is located on the outer surface of the second tube body and is used for threading the external thread.

6. The pickup mechanism according to claim 1, characterized in that: Also includes: A stepper motor is connected to the picking arm and is used for lifting the picking arm.

7. The pickup mechanism according to claim 1, characterized in that: The suction sleeve is fixed on the frame so that the suction nozzle is fixedly in contact with the frame and directly covers the first opening.

8. The pickup mechanism according to claim 1, characterized in that: A coating layer is formed on a top surface of the package chip, the area of ​​the coating layer is smaller than the area of ​​the flat surface of the flexible pad, and the coating layer is one of a porous structure layer and a mesh structure layer. When the flat surface of the flexible pad directly covers the top surface of the package chip and the coating layer, a closed space is defined between the suction cup, the flexible pad and the package chip, and the coating layer is completely located in the closed space.

9. The pickup mechanism according to claim 1, characterized in that: The picking arm further comprises: at least one supporting arm connected to the air extraction sleeve and resting against the flexible pad.

10. The pickup mechanism according to claim 9, characterized in that: The support arm comprises: an extension arm extending from the air extraction sleeve to the flexible pad; and A supporting portion is located at the end of the extension arm and supports the attachment surface of the flexible pad.

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