Multi-channel low-cost tile type TR component architecture based on SIP

Abstract

The multi-channel low-cost tile type TR component architecture based on the SIP comprises a metal framework, the SIP, an adapter plate and a low-heat functional component, the adapter plate is fixedly connected in the metal frame, and the low-heat functional component is arranged on the front surface of the adapter plate; a plurality of groups of SIPs are arranged on the back side of the adapter plate at intervals; all high-heat functional components in the system are integrated in the SIP; the TR assembly is simple in circuit form and high in reliability. The radio frequency SIP with high integration level is adopted, the TR assembly is subjected to function splitting, the low-heat functional parts are arranged on one side of the adapter plate in a centralized manner, and the high-heat functional parts are arranged on the other side of the adapter plate in a centralized manner, so that the overall heat dissipation problem can be solved only by performing centralized heat dissipation on the high-heat functional parts; and then, the high-heat functional component and the low-heat functional component are associated and integrally packaged through radio frequency, control and power supply components electrically connected with the SIP, so that a standardized radio frequency SIP is formed.

Description

Technical Field

[0001] The present application belongs to the technical field of microwave electronic products, and in particular to a multi-channel low-cost tile-type TR component architecture based on SIP. Background Art

[0002] Low cost, miniaturization, high integration and high reliability are the current development direction of TR components. In order to achieve miniaturization and high integration, a large number of independent bare chips are currently used in TR components to realize functions such as transceiver switching, phase shift attenuation, signal amplification, power modulation, and logic control. However, there are often problems with input and output matching and power supply between independent chips, so a large number of peripheral circuits are required to serve the chips to ensure that all chips work normally, which will increase the complexity of the circuit and reduce the reliability of the components. A large number of devices will increase the size of the components and increase the material cost; a large number of devices themselves will also put forward high requirements on the assembly process of the components, resulting in a long production cycle, high cost and low yield.

[0003] For conventional metal-packaged TR components, after the chip is assembled on the printed circuit board, it is necessary to wrap a layer of metal shell on the outside to protect the internal chip and printed circuit board. This will increase the volume of the component and add the step of sintering the printed circuit board and the component shell. This step has high process requirements. Generally, the sintered surface of the printed circuit board and the shell has large voids, which will seriously affect the electrical performance and heat dissipation performance of the TR component. The component shell itself also needs to be considered for airtight design. These will increase the overall cost of the component, complicate the process, extend the processing cycle, and reduce the yield rate. Therefore, traditional TR components are subject to assembly processes and have limited integration. Therefore, one or several channels of the main active RF circuit part inside the component can be made into a separate package (SIP), and then the package can be assembled on the PCB board, matched with connectors, etc. to adapt to the needs of the antenna system.

[0004] Therefore, it is necessary to study the use of low-cost tile-type TR components based on SIP in order to reduce the size of components, reduce component costs, simplify the TR component structure, and achieve higher reliability and higher electrical performance requirements. Summary of the invention

[0005] The purpose of this application is to provide a multi-channel low-cost tile-type TR component architecture based on SIP to solve the shortcomings of existing TR components in the prior art, such as high manufacturing cost, complex circuits, and difficult processes.

[0006] The technical solution of the present application is: a multi-channel low-cost tile-type TR component architecture based on SIP, including a metal frame, a SIP, an adapter plate and low-heat functional components; the adapter plate is fixedly connected to the metal frame, and the low-heat functional components are arranged on the front side of the adapter plate; the SIP has a total of multiple groups and is arranged at intervals on the back side of the adapter plate; the SIP integrates all high-heat functional components in the system, and signals are transmitted between the low-heat functional components and the high-heat functional components through the adapter plate; a heat dissipation component connected to the SIP is provided at the bottom of the metal frame; a radio frequency, control and power supply component electrically connected to the SIP is provided in the middle of the adapter plate.

[0007] Preferably, the SIP includes a modular shell, an upper functional cavity and a lower functional cavity are provided in the modular shell, a radio frequency amplitude and phase control component is provided in the upper functional cavity, and a high power amplification component is provided in the lower functional cavity; the modular shell is composed of three layers of integrally arranged ceramic sheets; each ceramic sheet is provided with a plurality of wiring holes; signals are transmitted between the radio frequency amplitude and phase control component and the high power amplification component, and between the radio frequency amplitude and phase control component and the adapter board through the wiring holes.

[0008] Preferably, the RF amplitude and phase control component includes a phase shifter, an attenuator, a transmit and receive switching component and a low-power amplifier; the RF amplitude and phase control component has four RF channels and is concentrated on the same chip; a low-noise amplification component is also provided in the upper functional cavity; the high-power amplification component includes a number of power amplifiers and corresponding modulation circuits.

[0009] Preferably, a power sensor, a temperature sensor and a voltage sensor are provided inside the SIP, and the power sensor, the temperature sensor and the voltage sensor are connected to the adapter board in a data multiplexing form.

[0010] Preferably, the heat dissipation assembly includes a heat dissipation back plate and a thermal pad; the heat dissipation back plate is fixed to the metal frame and connected to the heat dissipation temperature plate; the thermal pad is connected to the high-power amplifier component inside the SIP through metallized vias.

[0011] Preferably, a plurality of BGA balls are arranged side by side between the upper surface of the SIP and the adapter board, the upper part of the BGA balls is connected to the circuit board in the adapter board, and the lower part is connected to the high-heat functional component inside the SIP.

[0012] Preferably, metal partition walls are provided on both sides of the interior of the modular shell, and the metal partition walls are connected to the BGA balls through ceramic sheets; heat transfer can be performed between the metal partition walls, the ceramic sheets, the BGA balls and the metal structure inside the adapter board.

[0013] Preferably, the adapter board includes a multi-layer PCB board, a power chip and a data transceiver chip arranged on the PCB board; the multi-layer PCB boards are vertically interconnected, and the multi-layer PCB boards are connected by metallized vias; a metal layer connected to the metallized vias is buried inside the PCB board; the thickness of the metal layer is greater than the thickness of the metal plate in the PCB board used to transmit signals.

[0014] Preferably, the low-heat functional component includes an antenna board and a circulator; the circulator is welded and fixed on the adapter board in a single ring form, the wire on the circulator ferrite is connected to the bottom of the circulator through a metallized via, and a metal conductor is provided through the metallized via to be connected to the PCB board; the bottom of the circulator is provided with a gasket connected to the ferrite, and the iron gasket is connected to the PCB board; the antenna board is fixed on the adapter board and wired through the adapter board, and the outside of the antenna board is connected to the antenna.

[0015] Preferably, the RF, control and power supply components include a multi-core connector and a RF SMP; the multi-core connector is connected to the adapter board and can power and control the SIP, and the RF SMP is connected to the adapter board and can provide or receive signals from the SIP; the multi-core connector has one or more groups, and the RF SMP is arranged in the middle of the adapter board.

[0016] The multi-channel low-cost tile-type TR component architecture based on SIP of the present application has high reliability due to the simple circuit form of the TR component. A highly integrated RF SIP is adopted, and the functions of the TR component are split, and the low-heat functional components are concentrated on one side of the adapter board, and the high-heat functional components are concentrated on the other side of the adapter board. In this way, only the high-heat functional components need to be centrally cooled to solve the overall heat dissipation problem, and then the high-heat functional components and the low-heat functional components are associated and integrated through the RF, control and power supply components electrically connected by the SIP, so as to form a standardized RF SIP, which can reduce the complexity of the circuit from the perspective of the TR component. The entire electrical assembly process only requires a reflow soldering step, avoiding the complex processes required for assembling different components such as gluing and bonding, shortening the processing cycle, and greatly improving the reliability of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solution provided by the present application, the following is a brief introduction to the accompanying drawings. Obviously, the accompanying drawings described below are only some embodiments of the present application.

[0018] Figure 1 This is a schematic diagram of the overall structure of this application;

[0019] Figure 2 This is a top view of the multi-channel low-cost tile-type TR component antenna based on SIP for this application;

[0020] Figure 3 This is a top view of the heat dissipation surface of the multi-channel low-cost tile-type TR component based on SIP in this application.

[0021] 1. Metal frame; 2. SIP; 3. Adapter board; 4. Modular housing; 5. Upper functional cavity; 6. Lower functional cavity; 7. Heat dissipation backplane; 8. Thermal pad; 9. BGA ball; 10. Antenna board; 11. Circulator; 12. Multi-core connector; 13. RF SMP; 14. Power chip; 15. RF, control and power supply components. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0023] A multi-channel low-cost tiled TR component architecture based on SIP, such as Figure 1 As shown, it includes a metal frame 1, SIP2, an adapter board 3 and low-heat functional components; the adapter board 3 is fixedly connected to the metal frame 1, and the low-heat functional components are arranged on the front side of the adapter board 3; there are multiple groups of SIP2 and they are arranged at intervals on the back side of the adapter board 3; all high-heat functional components in the system are integrated in the SIP2, and signals are transmitted between the low-heat functional components and the high-heat functional components through the adapter board 3; a heat dissipation component connected to the SIP2 is provided at the bottom of the metal frame 1; a radio frequency, control and power supply component 15 electrically connected to the SIP2 is provided in the middle of the adapter board 3.

[0024] Since the TR component has a simple circuit form and high reliability, a highly integrated RF SIP2 is used, and the TR component is functionally split, and the low-heat functional components are concentrated on one side of the adapter board 3, and the high-heat functional components are concentrated on the other side of the adapter board 3. In this way, only the high-heat functional components need to be centrally cooled to solve the overall heat dissipation problem, and then the high-heat functional components and the low-heat functional components are associated and integrated through the RF, control and power supply components 15 electrically connected to the SIP2, thereby forming a standardized RF SIP2, which can reduce the complexity of the circuit from the perspective of the TR component. The entire electrical assembly process only requires a reflow soldering step, avoiding the complex processes required for assembling different components such as gluing and bonding, shortening the processing cycle, and greatly improving the reliability of the product.

[0025] Preferably, SIP2 includes a modular shell 4, in which an upper functional cavity 5 and a lower functional cavity 6 are arranged, the upper functional cavity 5 is provided with a radio frequency amplitude and phase control component, and the lower functional cavity 6 is provided with a high-power amplification component; the modular shell 4 is composed of three layers of integrally arranged ceramic sheets; each ceramic sheet is provided with a plurality of wiring holes; signals are transmitted between the radio frequency amplitude and phase control component and the high-power amplification component, and between the radio frequency amplitude and phase control component and the adapter board 3 through the wiring holes.

[0026] Conventional TR components have a complex structure, with a large number of bare chips, gold wire bonding, etc. Once a fault occurs, the laser-sealed shell must first be opened by mechanical processing. After opening the cover, the fault point must be located among a large number of components and gold wires for repair. After repair, laser sealing must be performed again. The maintenance is difficult and the cycle is long. If the cover is opened many times, the component is at risk of being scrapped.

[0027] The ceramic on the SIP2 shell has good thermal conductivity. By modularizing the SIP2, it can be assembled and disassembled as a whole. Once a fault occurs, it is only necessary to remove the faulty SIP2 chip or other surface-mount devices and reassemble new devices. The component itself has fewer components and a simple structure, making it easier to locate problems. There is no problem of opening the cover, and only ordinary electrical welding tools are needed to complete the repair. There is no need for complex steps such as adhesive bonding and laser welding, which greatly reduces the difficulty of maintenance and saves time and cost.

[0028] Preferably, the RF amplitude and phase control component includes a phase shifter, an attenuator, a transmit and receive switching component and a low-power amplifier, etc.; the RF amplitude and phase control component has four RF channels and is concentrated on the same chip; a low-noise amplification component is also provided in the upper functional cavity 5; the high-power amplification component includes several power amplifiers and corresponding modulation circuits, and the circuit structure is effectively simplified by performing functional integration.

[0029] Preferably, a power sensor, a temperature sensor and a voltage sensor are provided inside the SIP2, and the power sensor, the temperature sensor and the voltage sensor are connected to the adapter board 3 in the form of data multiplexing. They are used to transmit back the data of the RF amplitude and phase control component and the high-power amplification component, realize data and status monitoring, and timely judge the working status inside the SIP2, so as to handle the abnormality in time.

[0030] Preferably, the heat dissipation assembly includes a heat dissipation back plate 7 and a thermal pad 8; the heat dissipation back plate 7 is fixed to the metal frame 1 and the heat dissipation back plate 7 is connected to the heat dissipation uniform temperature plate; the thermal pad is connected to the high-power amplification component inside the SIP2 through metallized vias, which can achieve overall uniform heat dissipation of high-heat functional components.

[0031] Preferably, a plurality of BGA balls 9 are arranged side by side between the upper surface of the SIP 2 and the adapter board 3, the upper part of the BGA ball 9 is connected to the circuit board in the adapter board 3, and the lower part is connected to the high-heat functional component inside the SIP 2. The BGA ball 9 has the characteristics of high roundness, high brightness, high purity and high mechanical properties. Mechanical connection and data communication are performed through the BGA ball 9, which has the characteristics of small structure and high communication efficiency, and can also achieve auxiliary heat dissipation.

[0032] Preferably, metal partition walls are provided on both sides of the modular housing 4, and the metal partition walls are connected to the BGA balls 9 through the ceramic sheets; heat can be transferred between the metal partition walls, the ceramic sheets, the BGA balls 9 and the metal structure inside the adapter board 3. The metal partition walls can conduct heat between the adapter board 3 and the high-power amplifier components to ensure uniform heat dissipation.

[0033] Combination Figure 2-Figure 3 Preferably, the adapter board 3 includes a multi-layer PCB board, a power chip 14 and a data transceiver chip arranged on the PCB board; the multi-layer PCB boards are vertically interconnected, and the multi-layer PCB boards are connected by metallized vias; a metal layer connected to the metallized vias is buried inside the PCB board; the thickness of the metal layer is greater than the thickness of the metal plate used for transmitting signals in the PCB board. The metallized vias are used to transmit signals, and the metal layer is used for heat dissipation. The structure is simple and stable, and it is easier to adapt to different TR component requirements.

[0034] The main functions of one or four-channel TR components are encapsulated in a smaller and more integrated SIP2 to form a standardized device, and then the SIP2 is mounted on the PCB. Because the airtightness of the internal environment has been achieved at the SIP2 level, this architecture no longer needs to consider the airtight metal shell and internal isolation frame required by conventional components. This makes it easier to reduce the size of the component and flexibly configure the surface-mount RF connector to adapt it to the needs of the antenna system. It also has good channel scalability, which can more conveniently and reliably expand the number of channels of the TR component.

[0035] At the same time, it is more conducive to reducing the cost of TR components. The main functions of one or four channel TR components are encapsulated in a smaller and more integrated SIP2 to form a standardized device. SIP2 has high versatility and can be used for different TR component requirements, so the material cost of SIP2 can be reduced based on quantity advantage. From the perspective of TR components, in addition to SIP2, it is only necessary to make PCBs, purchase conventional surface mount resistors and capacitors, power management modules, surface mount connectors, and frame covers that are only used to increase structural strength. The types and quantities of materials are fewer, and there is no need for a metal shell that wraps the entire component. From the perspective of process and assembly, only the reflow process is required to assemble conventional BGA, QFN and other surface mount devices. The assembly steps are simple and the time is short, which is more conducive to reducing process and production costs.

[0036] Preferably, the low-heat functional component includes an antenna board 10 and a circulator 11; the circulator 11 is welded and fixed on the adapter board 3 in a single ring form, the wire on the ferrite of the circulator 11 is connected to the bottom of the circulator 11 through a metallized via, and a metal conductor is provided through the metallized via to connect to the PCB board; the bottom of the circulator 11 is provided with a gasket connected to the ferrite, and the iron gasket is connected to the PCB board; the antenna board 10 is fixed on the adapter board 3 and wired through the adapter board 3, the outside of the antenna board 10 is connected to the antenna, ensuring the reliable connection between the wiring on the ferrite and the PCB board.

[0037] Preferably, the RF, control and power supply component 15 includes a multi-core connector 12 and a RF SMP13; the multi-core connector 12 is connected to the adapter board 3 and can power and control SIP2, and the RF SMP13 is connected to the adapter board 3 and can provide or receive signals from SIP2; the multi-core connector 12 has one or more groups, and the RF SMP13 is arranged in the middle of the adapter board 3, with flexible and reliable configuration and small space occupation.

[0038] Finally, it should be noted that: the drawings of the embodiments disclosed in the present invention only involve structures related to the embodiments disclosed in the present invention, and other structures can refer to the general design. In the absence of conflict, the same embodiment and different embodiments of the present invention can be combined with each other;

[0039] Finally: The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A multi-channel low-cost tiled TR component architecture based on SIP, characterized by: The invention comprises a metal frame (1), a SIP (2), an adapter plate (3) and a low-heat functional component; the adapter plate (3) is fixedly connected to the metal frame (1), and the low-heat functional component is arranged on the front side of the adapter plate (3); there are a plurality of SIPs (2) arranged at intervals on the back side of the adapter plate (3); all high-heat functional components in the system are integrated in the SIP (2), and signals are transmitted between the low-heat functional component and the high-heat functional component via the adapter plate (3); a heat dissipation component connected to the SIP (2) is arranged at the bottom of the metal frame (1); and a radio frequency, control and power supply component (15) electrically connected to the SIP (2) is arranged in the middle of the adapter plate (3).

2. The SIP-based multi-channel low-cost tiled TR component architecture as claimed in claim 1, characterized in that: The SIP (2) comprises a modular housing (4), wherein an upper functional cavity (5) and a lower functional cavity (6) are arranged in the modular housing (4), wherein a radio frequency amplitude and phase control component is arranged in the upper functional cavity (5), and a high power amplification component is arranged in the lower functional cavity (6); the modular housing (4) is composed of three layers of ceramic sheets arranged in one piece; each ceramic sheet is provided with a plurality of wiring holes; and signals are transmitted between the radio frequency amplitude and phase control component and the high power amplification component, and between the radio frequency amplitude and phase control component and the adapter plate (3) through the wiring holes.

3. The SIP-based multi-channel low-cost tiled TR component architecture as claimed in claim 2, characterized in that: The radio frequency amplitude and phase control component comprises a phase shifter, an attenuator, a transceiver switching component and a low power amplifier; the radio frequency amplitude and phase control component has four radio frequency channels and is concentrated on the same chip; a low noise amplification component is also arranged in the upper functional cavity (5); the high power amplification component comprises a plurality of power amplifiers and corresponding modulation circuits.

4. The SIP-based multi-channel low-cost tiled TR component architecture as claimed in claim 2, characterized in that: A power sensor, a temperature sensor and a voltage sensor are arranged inside the SIP (2), and the power sensor, the temperature sensor and the voltage sensor are connected to the adapter board (3) in a data multiplexing form.

5. The SIP-based multi-channel low-cost tiled TR component architecture as claimed in claim 2, characterized in that: The heat dissipation component comprises a heat dissipation back plate (7) and a heat conductive pad (8); the heat dissipation back plate (7) is fixed to the metal frame (1) and the heat dissipation back plate (7) is connected to a heat dissipation temperature equalizing plate; the heat conductive plate is connected to a high-power amplification component inside the SIP (2) through a metallized via.

6. The SIP-based multi-channel low-cost tiled TR component architecture as claimed in claim 2, characterized in that: A plurality of BGA balls (9) are arranged side by side between the upper surface of the SIP (2) and the adapter plate (3); the upper part of the BGA balls (9) is connected to the circuit board in the adapter plate (3), and the lower part is connected to the high-heat functional component inside the SIP (2).

7. The SIP-based multi-channel low-cost tiled TR component architecture as claimed in claim 6, characterized in that: Metal partition walls are also provided on both sides of the interior of the modular housing (4), and the metal partition walls are connected to the BGA balls (9) via ceramic sheets; heat transfer can be performed between the metal partition walls, the ceramic sheets, the BGA balls (9) and the metal structure inside the adapter plate (3).

8. The SIP-based multi-channel low-cost tiled TR component architecture as claimed in claim 1, characterized in that: The adapter board (3) comprises a multi-layer PCB board, a power chip (14) and a data transceiver chip arranged on the PCB board; the multi-layer PCB boards are vertically interconnected, and the multi-layer PCB boards are connected with metallized vias; a metal layer connected to the metallized vias is buried inside the PCB board; the thickness of the metal layer is greater than the thickness of the metal plate in the PCB board used for transmitting signals.

9. The SIP-based multi-channel low-cost tiled TR component architecture as claimed in claim 1, characterized in that: The low-heat functional component comprises an antenna board (10) and a circulator (11); the circulator (11) is welded and fixed on the adapter board (3) in a single ring form; the wire on the ferrite of the circulator (11) is connected to the bottom of the circulator (11) through a metallized via hole, and a metal conductor is provided through the metallized via hole to be connected to the PCB board; the bottom of the circulator (11) is provided with a gasket connected to the ferrite, and the iron gasket is connected to the PCB board; the antenna board (10) is fixed on the adapter board (3) and wired through the adapter board (3); the outside of the antenna board (10) is connected to the antenna.

10. The SIP-based multi-channel low-cost tiled TR component architecture as claimed in claim 1, characterized in that: The radio frequency, control and power supply component (15) comprises a multi-core connector (12) and a radio frequency SMP (13); the multi-core connector (12) is connected to the adapter board (3) and is capable of supplying power to and controlling the SIP (2); the radio frequency SMP (13) is connected to the adapter board (3) and is capable of providing or receiving signals from the SIP (2); the multi-core connector (12) has one or more groups, and the radio frequency SMP (13) is arranged in the middle of the adapter board (3).

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