A manufacturing method of a waveguide radar substrate

Abstract

The present invention relates to the technical field of waveguide radar substrates, and discloses a manufacturing method of a waveguide radar substrate, including opening grooves in a plate, electroplating the plate, combining two plates, and opening through holes; in actual use, the gas contained in the waveguide cavity of the radar substrate manufactured by the method of the present invention can communicate with the outside world through a sheet made of expanded polytetrafluoroethylene, such as the through holes, so that the waveguide cavity can effectively avoid pressure damage caused by thermal expansion and contraction, and external moisture or pollutants can also be blocked by the sheet outside the waveguide cavity, thereby maintaining the stability of the waveguide cavity to be applicable to application fields with high electrical performance requirements and harsh environmental conditions.

Description

Technical Field

[0001] The present invention relates to the technical field of waveguide radar substrates, and particularly to a manufacturing method of a waveguide radar substrate. Background Art

[0002] The radar substrate is a key component in the radar system, carrying the radar antenna and other electronic components, and has an important impact on the performance and stability of the radar.

[0003] The existing radar substrate will form a cavity inside it. Firstly, the cavity can suppress the propagation of surface waves generated during the operation of the radar, reduce signal interference, and improve the performance of the radar; secondly, it can also help to broaden the impedance bandwidth of the radar antenna, enable the radar system to work in a wider frequency range, and improve the adaptability and flexibility of the radar system; finally, it can optimize the electric field distribution in the radar substrate, confine the electric field in a specific area, reduce electric field leakage and interference, and improve the stability and accuracy of the radar system.

[0004] For the cavity in the radar substrate, it is designed to be closed to avoid being affected by external moisture or pollutants. However, the gas contained in the closed cavity is isolated from the outside world, making the gas in the cavity easily expand and contract due to heat, causing pressure damage to the cavity, thereby affecting the performance of the radar substrate. Summary of the Invention

[0005] In view of the deficiencies in the background art, the present invention provides a manufacturing method of a waveguide radar substrate. The technical problem to be solved is that the cavity in the radar substrate manufactured by the existing radar substrate manufacturing method is designed to be closed, and the gas in the cavity is easily damaged by pressure due to thermal expansion and contraction.

[0006] To solve the above technical problems, in the first aspect, the present invention provides the following technical solution: A manufacturing method of a waveguide radar substrate, comprising the following steps:

[0007] S1: Form grooves on two opposite processing surfaces of two plates respectively. On the processing surface of each plate, a first processing area and a second processing area are respectively provided on both sides of the groove, and the vertical distance between the second processing area and the bottom of the groove is greater than the vertical distance between the first processing area and the bottom of the groove;

[0008] S2: Electroplate each plate so that a first metal layer is formed in the first processing area, a second metal layer is formed in the second processing area, and a third metal layer is formed on the wall surface of the groove; the first metal layer and the second metal layer are connected to both sides of the third metal layer;

[0009] S3: Combine two plates along the thickness direction of the plates, making the grooves on the two processing surfaces approach each other, and clamping the waterproof and breathable sheet between the first metal layers on the two processing surfaces. Finally, make the two second metal layers abut against each other, and make the two third metal layers and the sheet jointly form a waveguide cavity;

[0010] S4: Form a through hole that penetrates through the two plates, the two first metal layers, and the sheet along the thickness direction of the plates, and the waveguide cavity communicates with the through hole through the sheet.

[0011] In a certain implementation manner of the first aspect, the present invention further includes step S5, and step S5 is as follows:

[0012] S5: On the inner wall of the through hole, conduction layers are respectively formed on both sides of the sheet.

[0013] In a certain implementation manner of the first aspect, in step S1, each of the plates includes an insulating layer formed with the groove and an inner conductive layer formed on the inner surface of the insulating layer, and the inner conductive layer is located on the second processing area;

[0014] In step S2, the first metal layer is located on the inner surface of the insulating layer, and the second metal layer is located on the inner conductive layer.

[0015] In a certain implementation manner of the first aspect, the sheet includes an inner edge defining a partial through hole and an outer edge surrounding the outside of the through hole, and a part of the outer edge protrudes out of the adjacent third metal layer.

[0016] In a certain implementation manner of the first aspect, the sheet is circular in shape, the protruding distance of a part of the outer edge is between 0.5% and 3% of the outer diameter of the sheet, and the part has a central angle of 20° to 35° compared with the center of the circle; the center of the sheet is inside or outside the through hole.

[0017] In a certain implementation manner of the first aspect, the material of the sheet is expanded polytetrafluoroethylene, and the dielectric constant of the sheet is between 1.3 and 1.4.

[0018] In a certain implementation manner of the first aspect, the thickness of the sheet is between 18% and 30% of the height of the waveguide cavity along the thickness direction, and at least 25% of the area of the through hole is formed on the sheet.

[0019] In the second aspect, the present invention provides another method for manufacturing a waveguide radar substrate, including the following steps:

[0020] S1: Form a groove in one of the two facing processing surfaces of two plates. On the processing surface with the groove, there are a first processing area and a second processing area on both sides of the groove respectively. The vertical distance between the second processing area and the bottom of the groove is greater than the vertical distance between the first processing area and the bottom of the groove;

[0021] S2: Electroplate the plate with the groove so that a first metal layer is formed in the first processing area, a second metal layer is formed in the second processing area, and a third metal layer is formed on the wall surface of the groove of the plate with the groove; the first metal layer and the second metal layer are connected to both sides of the third metal layer;

[0022] Electroplate another plate to form a fourth metal layer on the processing surface of the other plate;

[0023] S3: Combine the two plates along the thickness direction of the plates, and clamp the waterproof and breathable sheet between the first metal layer and the fourth metal layer. Finally, make the second metal layer and the fourth metal layer abut against each other, so that the third metal layer, the corresponding part of the fourth metal layer and the sheet together constitute a waveguide cavity;

[0024] S4: Form a through hole penetrating the two plates, the first metal layer, the fourth metal layer and the sheet along the thickness direction of the plates. The waveguide cavity communicates with the through hole through the sheet.

[0025] In a certain implementation manner of the second aspect, it further includes step S5, and step S5 is as follows:

[0026] S5: Form conduction layers on both sides of the sheet on the hole wall of the through hole.

[0027] In a certain implementation manner of the second aspect, the material of the sheet is expanded polytetrafluoroethylene, the dielectric constant of the sheet is between 1.3 and 1.4, and at least 25% of the area of the through hole is formed on the sheet.

[0028] The beneficial effects of the present invention compared with the prior art are as follows: The gas contained in the waveguide cavity of the radar substrate manufactured by the method of the present invention can communicate with the outside world, such as the through hole, through the sheet made of expanded polytetrafluoroethylene, so that the waveguide cavity can effectively avoid pressure damage caused by thermal expansion and contraction, and external water vapor or pollutants can also be blocked by the sheet outside the waveguide cavity, thereby maintaining the stability of the waveguide cavity to be applicable to application fields with high electrical performance requirements and harsh environmental conditions. Description of the Drawings

[0029] Figure 1 It is a flowchart of the method of the present invention in Embodiment 1;

[0030] Figure 2 Schematic diagram of forming a groove in the sheet in the first embodiment;

[0031] Figure 3 Schematic diagram of electroplating the sheet in the first embodiment;

[0032] Figure 4 Schematic diagram before combining two sheets in the first embodiment;

[0033] Figure 5 Schematic diagram after combining two sheets in the first embodiment;

[0034] Figure 6 Schematic diagram of forming a through hole in the first embodiment;

[0035] Figure 7 For Figure 6 Top view schematic diagram of the sheet and the metal coating located above is omitted;

[0036] Figure 8 For Figure 7 A variant schematic diagram;

[0037] Figure 9 Schematic diagram of forming a conduction layer on the sheet in the first embodiment;

[0038] Figure 10 Flow chart of the method of the present invention in the second embodiment;

[0039] Figure 11 Schematic diagram of the basic waveguide radar manufactured by the method in the second embodiment.

[0040] Wherein: 1: sheet; 1a: first sheet; 10: processing surface; 11: first processing area; 12: second processing area; 13: groove; 14: insulating layer; 15: inner conductive layer; 1b: second sheet;

[0041] 2: metal coating; 2a: first metal coating; 21: first metal layer; 22: second metal layer; 23: third metal layer; 2b: fourth metal layer;

[0042] 3: sheet body; 31: center of circle; 32: inner edge; 33: outer edge; 331: local

[0043] 4: conduction layer;

[0044] 5: through hole;

[0045] 100: waveguide radar substrate;

[0046] W: width direction; T: thickness direction; C: waveguide cavity; D: outer diameter; D331: protruding distance;

[0047] σ331: Central angle; T3: Thickness; Hc: Height. Detailed implementation manners

[0048] The following are the implementation manners of the method for manufacturing a waveguide radar substrate disclosed in the present invention through specific specific embodiments. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only for simple schematic illustration and are not drawn according to actual dimensions, which is stated in advance. The following implementation manners will further detail the related technical content of the present invention, but the disclosed content is not intended to limit the protection scope of the present invention.

[0049] It should be understood that although terms such as first, second, and third may be used herein to describe various components or features, these components or features should not be limited by these terms. These terms are mainly used to distinguish one component from another, or one feature from another. In addition, the term "or" used herein may, depending on the actual situation, include any one or a combination of more of the associated listed items.

[0050] Embodiment 1

[0051] In order to enable the waveguide cavity of the waveguide radar substrate 100 to effectively avoid pressure damage caused by thermal expansion and contraction, as Figure 1 shown, this embodiment provides a method for manufacturing a waveguide radar substrate, including the following steps:

[0052] S1: Referring to Figure 2 , grooves 13 are respectively formed on two opposite processing surfaces 10 of two plates 1. On each processing surface 10 of the plate 1, a first processing area 11 and a second processing area 12 are respectively provided on both sides of the groove 13. The vertical distance between the second processing area 12 and the bottom of the groove 13 is greater than the vertical distance between the first processing area 11 and the bottom of the groove 13.

[0053] In a certain implementation manner, the manner or structure for realizing that the vertical distance between the second processing area 12 and the bottom of the groove 13 is greater than the vertical distance between the first processing area 11 and the bottom of the groove 13 can be adjusted and changed according to actual needs, and the present invention does not limit this here.

[0054] In step S1, each plate 1 includes an insulating layer 14 formed with a groove 13 and an inner conductive layer 15 formed on the inner surface of the insulating layer 14. The inner conductive layer 15 is located on the second processing area 12 but not on the first processing area 11 so that the second processing area 12 is higher than the first processing area 11;

[0055] That is to say, the highest point of the second processing area 12 is on the inner conductive layer 15, while the highest point of the first processing area 11 is on the inner surface of the insulating layer 14. Therefore, the height difference between the second processing area 12 and the first processing area 11 is the thickness of the inner conductive layer 15.

[0056] S2: Refer to Figure 3 , in this embodiment, each sheet 1 is electroplated so that a first metal layer 21 is formed on the first processing area 11 of the sheet 1, a second metal layer 22 is formed on the second processing area 12, and a third metal layer 23 is formed on the wall surface of the groove 13; the first metal layer 21 and the second metal layer 22 are connected to both sides of the third metal layer 23.

[0057] More specifically, in step S2, the first metal layer 21 is formed on the inner surface of the insulating layer 14, while the second metal layer 22 is formed on the inner conductive layer 15. Furthermore, the first metal layer 21, the second metal layer 22, and the third metal layer 23 formed on any one sheet 1 can be jointly defined as a metal coating 2.

[0058] S3: Refer to Figure 4 and Figure 5 , two sheets 1 are combined along the thickness direction T of the sheet 1, so that the grooves 13 on the two processing surfaces 10 are close to each other, and the sheet 3 with waterproof and breathable properties is clamped between the first metal layers 21 on the two processing surfaces. Finally, the two second metal layers 22 are abutted against each other, and the two third metal layers 23 and the sheet 3 jointly form a waveguide cavity C.

[0059] Specifically, in this embodiment, the material of the sheet 3 is expanded polytetrafluoroethylene, which has a porous structure and has chemical stability and high-temperature resistance characteristics, and the dielectric constant of the sheet is between 1.3 and 1.4.

[0060] Specifically, in this embodiment, as Figure 5 , Figure 6 and Figure 7 shown, the sheet 3 is a circular sheet in this embodiment and has a center 31, and the sheet 3 (such as: the part of the expanded polytetrafluoroethylene sheet 3 clamped between the two first metal layers 21) has a thickness T3 along the thickness direction T, which is between 18% and 30% of a height Hc of the waveguide cavity C in the thickness direction T, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the sheet 3 can be non-circular according to actual needs.

[0061] S4: Refer to Figure 6 , a through hole 5 is formed along the thickness direction T of the sheet 1 through the two sheets 1, the two first metal layers 21, and the sheet 3, and the waveguide cavity C can only communicate with the through hole 5 through the sheet 3.

[0062] Accordingly, the gas contained in the waveguide cavity C can communicate with the outside through the sheet body 3, so that the waveguide cavity C can effectively avoid pressure damage caused by thermal expansion and contraction, and external water vapor or pollutants can also be blocked by the sheet body 3 outside the waveguide cavity C, thereby maintaining the stability of the waveguide cavity C to be applicable to application fields with high electrical performance requirements and harsh environmental conditions.

[0063] It should be additionally noted that, in order for the sheet body 3 to provide better technical effects for the waveguide cavity C, the sheet body 3 preferably has at least part of the following conditions, but the present invention is not limited thereto:

[0064] In step S4 of this embodiment: at least 25% of the area of the through hole 5 is formed on the sheet body 3. For example: as Figure 7 shown, the through hole 5 can be entirely formed on the sheet body 3, and the center 31 of the sheet body 3 is located within the through hole 5; or, as Figure 8 shown, the through hole 5 can also be partially formed on the sheet body 3, and the center 31 of the sheet body 3 is located outside the through hole 5.

[0065] More specifically, as Figure 6 shown, the sheet body 3 has an inner edge 32 defining a partial through hole 5 and an outer edge 33 surrounding the outside of the through hole 5, and a part 331 of the outer edge 33 protrudes from the part of the third metal layer 23 adjacent thereto;

[0066] That is to say, a part 331 of the outer edge 33 of the sheet body 3 is located within the waveguide cavity C. Among them, the thickness of the sheet body 3 corresponding to the part 331 of the outer edge 33 is greater than the thickness T3 of the part of the sheet body 3 clamped between the two first metal layers 21.

[0067] Furthermore, the sheet body 3 has an outer diameter D, and a protruding distance D331 of a part 331 of the outer edge 33 of the sheet body 3 along the width direction W is between 0.5% and 3% of the outer diameter D. The part 331 of the outer edge 33 of the sheet body 3 has a central angle σ331 between 20 degrees and 35 degrees with respect to the center 31.

[0068] S5: As Figure 9 shown, on the hole wall of the through hole 5, conduction layers 4 are respectively formed on both sides of the sheet body 3. For the conduction layers 4, they are not formed on the inner edge 32 of the expanded polytetrafluoroethylene sheet body 3, so that the conduction layers 4 are separated by the expanded polytetrafluoroethylene sheet body 3 to form two separated sections.

[0069] Combining the above, the gas contained in the waveguide cavity C of the waveguide radar substrate 100 manufactured by the method of the present invention can communicate with the outside through the sheet 3 made of expanded polytetrafluoroethylene, such as the through hole 5, so that the waveguide cavity C can effectively avoid pressure damage caused by thermal expansion and contraction, and external water vapor or pollutants can also be blocked by the sheet 3 outside the waveguide cavity C, thereby maintaining the stability of the waveguide cavity C to be applicable to application fields with high electrical performance requirements and harsh environmental conditions.

[0070] Embodiment 2

[0071] As Figure 10 and 11 shown, the present embodiment provides another method for manufacturing a waveguide radar substrate, including the following steps:

[0072] S1: A groove 13 is formed in one of the two processing surfaces 10 of the two plates 1 facing each other. The plate with the groove 13 is denoted as the first plate 1a, and the other plate is denoted as the second plate 1b. The first plate 1a has a first processing area 11 and a second processing area 12 on both sides of the groove 13 respectively. The vertical distance between the second processing area 12 and the bottom of the groove 13 is greater than the vertical distance between the first processing area 11 and the bottom of the groove 13.

[0073] In step S1, the first plate 1 includes an insulating layer 14 formed with the groove 13 and an inner conductive layer 15 formed on the inner surface of the insulating layer 14. The inner conductive layer 15 is located on the second processing area 12 but not on the first processing area 11 so that the second processing area 12 is higher than the first processing area 11;

[0074] That is to say, the highest point of the second processing area 12 is on the inner conductive layer 15, and the highest point of the first processing area 11 is on the inner surface of the insulating layer 14. Therefore, the height difference between the second processing area 12 and the first processing area 11 is the thickness of the inner conductive layer 15;

[0075] In addition, the processing surface of the second plate 1b should be set as the insulating layer 14.

[0076] S2: The first plate 1a is electroplated so that a first metal layer 21 is formed on the first processing area 11, a second metal layer 22 is formed on the second processing area 12, and a third metal layer 23 is formed on the wall surface of the groove 13 of the first plate 1a; the first metal layer 21 and the second metal layer 22 are connected to both sides of the third metal layer 23;

[0077] The second plate 1b is electroplated to form a fourth metal layer 2b on the processing surface of the second plate 1b;

[0078] S3: Combine two plates along the thickness direction of the plate, and clamp the waterproof and breathable sheet 3 between the first metal layer 21 and the fourth metal layer 2b. Finally, make the second metal layer 22 and the fourth metal layer 2b abut against each other, so that the third metal layer 23, the corresponding part of the fourth metal layer 2b to the third metal layer 23 and the sheet 3 together form a waveguide cavity C.

[0079] Specifically, in this embodiment, the material of the sheet is expanded polytetrafluoroethylene, and the dielectric constant of the sheet is between 1.3 and 1.4.

[0080] S4: Form a through hole 5 that penetrates through the two plates 1, the first metal layer 21, the fourth metal layer 2b and the sheet 3 along the thickness direction T of the plate 1. The waveguide cavity C communicates with the through hole through the sheet 3; at least 25% of the area of the through hole is formed on the sheet.

[0081] S5: On the hole wall of the through hole 5, conduction layers 4 are respectively formed on both sides of the sheet 3.

[0082] Based on the inspiration of the present invention, through the above description, relevant staff can completely make various changes and modifications without departing from the technical idea of the present invention. The technical scope of the present invention is not limited to the content in the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. A method for manufacturing a waveguide radar substrate, characterized in that: The steps include: S1: Grooves (13) are respectively formed on two facing processing surfaces (10) of two plates (1), and the processing surface (10) of each plate (1) has a first processing area (11) and a second processing area (12) on both sides of the groove (13), and the vertical distance between the second processing area (12) and the bottom of the groove (13) is greater than the vertical distance between the first processing area (11) and the bottom of the groove (13); S2: electroplating each plate (1) so that the plate (1) forms a first metal layer (21) in the first processing area (11), forms a second metal layer (22) in the second processing area (12), and forms a third metal layer (23) on the wall surface of the groove (13); the first metal layer (21) and the second metal layer (22) are connected to both sides of the third metal layer (23); S3: combining two plates (1) along the thickness direction of the plates (1) so that the grooves (13) on the two processed surfaces (10) are close to each other, and the waterproof and breathable sheet (3) is clamped between the first metal layers (21) on the two processed surfaces (10), and finally the two second metal layers (22) are abutted against each other, so that the two third metal layers (23) and the sheet (3) together form a waveguide cavity; S4: forming a through hole (5) penetrating the two plates (1), the two first metal layers (21) and the sheet body (3) along the thickness direction of the plate (1), wherein the waveguide cavity is connected to the through hole (5) through the sheet body (3); The step S5 is further included, and the step S5 is as follows: S5: forming conductive layers (4) on the hole wall of the through hole (5) and on both sides of the sheet body (3); In step S1, each of the plates (1) comprises an insulating layer (14) formed with the groove (13), and an inner conductive layer (15) formed on the inner surface of the insulating layer (14), wherein the inner conductive layer (15) is located on the second processing area (12); In step S2, the first metal layer (21) is located on the inner surface of the insulating layer (14), and the second metal layer (22) is located on the inner conductive layer (15).

2. The method for manufacturing a waveguide radar substrate according to claim 1, characterized in that: The sheet body (3) comprises an inner edge (32) defining a partial through hole (5) and an outer edge (33) surrounding the outside of the through hole (5), wherein a portion (331) of the outer edge (33) protrudes out of an adjacent third metal layer (23).

3. The method for manufacturing a waveguide radar substrate according to claim 2, characterized in that: The sheet body (3) is circular in shape, a protrusion distance of a portion (331) of the outer edge (33) is between 0.5% and 3% of the outer diameter of the sheet body (3), and the portion (331) has a central angle of 20° to 35° compared to the center (31) of the sheet body (3); the center (31) of the sheet body (3) is inside the through hole (5) or outside the through hole (5).

4. A method for manufacturing a waveguide radar substrate according to claim 1, 2 or 3, characterized in that: The sheet body (3) is made of expanded polytetrafluoroethylene, and the dielectric constant of the sheet body (3) is between 1.3 and 1.

4.

5. The method for manufacturing a waveguide radar substrate according to claim 1, characterized in that: The thickness of the sheet body (3) is between 18% and 30% of the height of the waveguide cavity along the thickness direction, and at least 25% of the area of ​​the through hole (5) is formed on the sheet body (3).

6. A method for manufacturing a waveguide radar substrate, characterized in that: The steps include: S1: A groove (13) is formed in one of two facing processing surfaces (10) of two plates (1), the processing surface (10) having the groove (13) having a first processing area (11) and a second processing area (12) on both sides of the groove (13), respectively, and a vertical distance between the second processing area (12) and the bottom of the groove (13) is greater than a vertical distance between the first processing area (11) and the bottom of the groove (13); The plate (1) with a groove (13) comprises an insulating layer (14) formed with the groove (13), and an inner conductive layer (15) formed on the inner surface of the insulating layer (14), wherein the inner conductive layer (15) is located on the second processing area (12); S2: electroplating the plate (1) with the groove (13) so that the plate (1) with the groove (13) forms a first metal layer (21) in the first processing area (11), a second metal layer (22) in the second processing area (12), and a third metal layer (23) on the wall surface of the groove (13); the first metal layer (21) and the second metal layer (22) are connected to both sides of the third metal layer (23); electroplating another plate (1) to form a fourth metal layer (2b) on the processing surface of the other plate (1); S3: combining two plates (1) along the thickness direction of the plates (1), and clamping a waterproof and breathable sheet (3) between the first metal layer (21) and the fourth metal layer (2b), finally making the second metal layer (22) and the fourth metal layer (2b) abut against each other, so that the third metal layer (23), a portion of the fourth metal layer (2b) corresponding to the third metal layer (23), and the sheet (3) together form a waveguide cavity; S4: forming a through hole (5) penetrating the two plates (1), the first metal layer (21), the fourth metal layer (2b) and the sheet body (3) along the thickness direction of the plate (1), wherein the waveguide cavity is connected to the through hole (5) through the sheet body (3); The step S5 is further included, and the step S5 is as follows: S5: forming a conducting layer (4) on the hole wall of the through hole (5) and on both sides of the sheet body (3).

7. A method for manufacturing a waveguide radar substrate according to claim 6, characterized in that: The sheet body (3) is made of expanded polytetrafluoroethylene, the dielectric constant of the sheet body (3) is between 1.3 and 1.4, and at least 25% of the area of ​​the through hole (5) is formed on the sheet body (3).

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