Array antenna device
By designing a symmetrically configured multi-layer board carrier and a detachable welding structure in the array antenna device, the problem in the prior art that the printed circuit board is warped and the antenna module cannot be replaced individually is solved, achieving more efficient antenna performance and maintenance. sex.
Patent Information
- Application Number
- CN202411507436.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-28
- Publication Date
- 2025-01-21
AI Technical Summary
When the existing array antenna devices use thicker dielectric layers to optimize the performance of patch antennas, they lead to asymmetry of the stacking of printed circuit boards, causing bending problems, and the damaged patch antennas cannot be replaced separately, resulting in reduced performance.
A carrier is designed with a symmetrical shaft with a symmetrical shaft with a vertical thickness direction with a stack. The welding structure is used to connect the line site to disassemble the antenna area to support the separate replacement of the circular polarized antenna module.
Effectively avoid the tie of the printing circuit board, and allow the damaged circular polarized antenna module to replace separately, thereby improving the effectiveness and maintenance of the array antenna device.
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Figure CN119340643A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to an antenna device, and in particular to an array antenna device. Background Art
[0002] The structure of the existing array antenna device is that multiple patch antennas and radio frequency circuits are integrated on the same printed circuit board. However, when the existing array antenna device uses a thicker dielectric layer to optimize the performance of the patch antenna, the stacking structure of the printed circuit board will be asymmetric, causing the circuit board to bend. In addition, when one of the patch antennas of the existing array antenna device is damaged, the damaged patch antenna cannot be replaced separately, resulting in a decrease in the performance of the existing array antenna device.
[0003] Therefore, the inventors believe that the above defects can be improved, and have devoted themselves to research and applied scientific principles, and finally proposed the present invention which has a reasonable design and effectively improves the above defects. Summary of the invention
[0004] The technical problem to be solved by the present invention is to provide an array antenna device in view of the deficiencies in the prior art.
[0005] An embodiment of the present invention discloses an array antenna device, comprising: a carrier having a thickness direction, the carrier comprising: a line portion having a plurality of stacked layer plates, the plurality of layer plates being symmetrically arranged with a symmetry axis perpendicular to the thickness direction; a plurality of antenna portions arranged on the line portion; and a plurality of welding structures; each of the antenna portions being detachably connected to the line portion via the welding structure; a plurality of circularly polarized antenna modules respectively arranged on the plurality of antenna portions; at least one beamforming chip electrically connecting the plurality of circularly polarized antenna modules; and a plurality of amplifiers arranged on the line portion.
[0006] To summarize, the array antenna device disclosed in the embodiment of the present invention can, through the designs of "the plurality of layer plates are symmetrically arranged with a symmetry axis perpendicular to the thickness direction" and "each of the antenna parts is detachably connected to the line part through the welding structure", not only avoid warping, but also allow damaged circularly polarized antenna modules to be replaced individually.
[0007] To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are only for reference and description and are not intended to limit the present invention. BRIEF DESCRIPTION OF THE DRAWINGS
[0008] Figure 1 It is a three-dimensional schematic diagram of the array antenna device of the present invention.
[0009] Figure 2 For along Figure 1 Schematic diagram of the cross section along line II-II.
[0010] Figure 3 It is a cross-sectional schematic diagram of the array antenna device of the present invention in another aspect.
[0011] Figure 4 It is a cross-sectional schematic diagram of another aspect of the array antenna device of the present invention.
[0012] Figure 5 for Figure 4 A bottom-up schematic diagram of an array antenna device.
[0013] The reference numerals of the above drawings are:
[0014] 100, 100', 100": Array antenna installation
[0015] 1: Carrier
[0016] 11: Line location
[0017] 111A: First layer
[0018] 111B: Second layer board
[0019] 111C: The third layer
[0020] 111D: The fourth layer
[0021] 112: Set the slot
[0022] 12: Antenna part
[0023] 13: Welding structure
[0024] 14: Grounding conductive column
[0025] 2: Circular polarization antenna module
[0026] 21: Patch antenna
[0027] 22: RF line
[0028] 3: Amplifier
[0029] 4: Beamforming chip
[0030] DT: thickness direction DETAILED DESCRIPTION
[0031] The following is an explanation of the implementation of the "array antenna device" disclosed in the present invention through specific embodiments. Those skilled in the art can understand the advantages and effects of the present invention from the contents disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only simple schematic illustrations and are not depicted according to actual dimensions. It is stated in advance. The following implementations will further explain the relevant technical contents of the present invention in detail, but the disclosed contents are not intended to limit the scope of protection of the present invention.
[0032] It should be understood that, although the terms "first", "second", "third", etc. may be used in this document to describe various components or signals, these components or signals should not be limited by these terms. These terms are mainly used to distinguish one component from another component, or one signal from another signal. In addition, the term "or" used in this document may include any one or more combinations of the associated listed items depending on the actual situation.
[0033] In addition, in the following description, if it is indicated to refer to a specific figure or as shown in a specific figure, it is only used to emphasize that most of the related content described in the subsequent description appears in the specific figure, but it does not limit the subsequent description to only refer to the specific figure.
[0034] See also Figures 1 to 5 As shown, this embodiment provides an array antenna device. Figure 1 and Figure 2 As shown, the array antenna device 100 comprises a carrier 1, and a plurality of circular polarization antenna modules 2 and a plurality of amplifiers 3 disposed on the carrier 1. Next, the components of the array antenna device 100 and their connection relationships are introduced below.
[0035] Cooperate Figure 1 and Figure 2 As shown, the carrier 1 is a multi-layer structure, and the carrier 1 includes a circuit part 11, multiple antenna parts 12, and multiple welding structures 13. Specifically, the carrier 1 has a thickness direction DT, each of the antenna parts 12 is installed on the circuit part 11 along the thickness direction, and the multiple antenna parts 12 are arranged at intervals from each other.
[0036] The circuit portion 11 has a plurality of layer plates (e.g., 111A to 111D) stacked along the thickness direction DT, and the plurality of layer plates are symmetrically arranged with a symmetry axis perpendicular to the thickness direction DT. For example, from the cross-section of the circuit portion 11 along the thickness direction DT, when the circuit portion 11 has a first layer plate 111A, a second layer plate 111B, a third layer plate 111C, and a fourth layer plate 111D stacked in sequence, the thickness of the first layer plate 111A may be equal to the thickness of the fourth layer plate 111D, and the thickness of the second layer plate 111B may be equal to the thickness of the third layer plate 111C. In other words, the first layer plate 111A and the second layer plate 111B are one group, the third layer plate 111C and the fourth layer plate 111D are another group, and the two groups can be symmetrical with a contact line (not shown) located between the second layer plate 111B and the third layer plate 111C as the symmetry axis.
[0037] In addition, the plurality of soldering structures 13 are used as connecting media for the plurality of antenna parts 12 and the circuit part 11. That is, each antenna part 12 is detachably connected to the circuit part 11 through the soldering structure 13. Accordingly, each antenna part 12 can be selectively detached from the circuit part 11 by desoldering.
[0038] Re-reference Figure 1 and Figure 2 As shown, the plurality of circularly polarized antenna modules 2 are respectively arranged on the plurality of antenna parts 12. In other words, each antenna part 12 is installed with a circularly polarized antenna module 2. In practice, each circularly polarized antenna module 2 includes a plurality of patch antennas 21 exposed in the antenna part 12, a beamforming chip 23 electrically coupled to the plurality of patch antennas 21, and a radio frequency circuit 22 buried in the antenna part 12. Among them, each circularly polarized antenna module 2 is illustrated with two patch antennas 21 in this embodiment, but the present invention is not limited to this. The radio frequency circuit 22 electrically couples the two patch antennas 21, so that each circularly polarized antenna module 2 can generate a circularly polarized field pattern. It should be noted that the way in which each circularly polarized antenna module 2 realizes a circularly polarized field pattern is a well-known technology in the art, and is not the technical focus of the present invention, so it is not specifically described here.
[0039] In addition, in this embodiment, the number of the at least one beamforming chip 4 is two, each of the beamforming chips 4 is connected to eight of the patch antennas 21 , and each of the beamforming chips 4 can integrate a plurality of the circularly polarized antenna modules 2 .
[0040] Cooperate Figure 2As shown, the multiple amplifiers 3 in this embodiment are, for example, low noise amplifiers and electrically coupled to the RF circuit 22 of the circular polarization antenna module 2. The multiple amplifiers 3 can be arranged on a side surface of the circuit portion 11 away from the multiple antenna portions 12. That is to say, the multiple amplifiers 3 are also exposed on the circuit portion 11. In practice, each amplifier 3 is connected to the beamforming chip 4, and is connected to one of the patch antennas 21 in the circular polarization antenna module 2 through the RF circuit 22, and the other patch antenna 21 in the circular polarization antenna module 2 is connected to the beamforming chip 4 by a line.
[0041] It is worth noting that Figures 3 to 5 As shown, in order to ensure that the noise ratio between each amplifier 3 and the circularly polarized antenna module 2 is affected by the length of the RF line 22 , the line portion 11 is further provided with a slot 112 for accommodating each amplifier 3 .
[0042] Specifically, the plurality of circularly polarized antenna modules 2 (for example, the plurality of patch antennas 21) have a plurality of predetermined ranges (not shown) when projected on the line portion 11 along the thickness direction DT, and the line portion 11 has a plurality of arrangement slots 112 in the plurality of predetermined ranges, respectively, and the plurality of amplifiers 3 are respectively accommodated in the plurality of arrangement slots 112. Accordingly, the RF line 22 connecting the patch antenna 21 and the amplifier can be effectively reduced in length through the arrangement slots 112, thereby ensuring that the noise figure of the array antenna device 100 is reduced.
[0043] In addition, Figure 4 and Figure 5 As shown, each amplifier 3 is susceptible to environmental interference, so the carrier 1 of the array antenna device 100" further includes a plurality of grounding conductive posts 14. The plurality of grounding conductive posts 14 are buried in the line portion 11, and the plurality of grounding conductive posts 14 surround the respective setting slots 112, so that the plurality of grounding conductive posts 14 can generate a shielding for each amplifier 3. Accordingly, each amplifier 3 can suppress environmental noise through the plurality of grounding conductive posts 14.
[0044] Preferably, the plurality of grounding conductive pillars 14 may be radially arranged with the amplifier 3 as the center, and the height of the plurality of grounding conductive pillars 14 along the thickness direction DT may also be greater than the height of each amplifier 3 along the thickness direction DT, so that each amplifier 3 can be more evenly surrounded by the shielding.
[0045] In practice, in order to ensure the shielding effect, two adjacent grounding conductive pillars 14 are spaced apart by a predetermined distance, and the predetermined distance is preferably less than Wherein, C is the speed of light, F is the expected noise frequency, and DK is the dielectric constant of the line portion 11. In addition, the diameter of each of the grounding conductive pillars 14 is preferably not less than 8 mils, but the present invention is not limited thereto. It should be particularly noted that the expected noise frequency can be adjusted (or changed) according to the expected use environment of the array antenna device.
[0046] The technical effects of the embodiments of the present invention are as follows:
[0047] In summary, the array antenna device disclosed in the embodiment of the present invention can avoid warping and simultaneously replace damaged circularly polarized antenna modules individually through the designs of "the plurality of layer plates are symmetrically arranged with a symmetry axis perpendicular to the thickness direction" and "each antenna part is detachably connected to the line part through the welding structure".
[0048] The contents disclosed above are only preferred feasible embodiments of the present invention and are not intended to limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made using the contents of the specification and drawings of the present invention are included in the scope of the patent application of the present invention.
Claims
1. An array antenna device, comprising: A carrier having a thickness direction, the carrier comprising: A circuit portion having a plurality of stacked layer plates, wherein the plurality of layer plates are symmetrically arranged about a symmetry axis perpendicular to the thickness direction; A plurality of antenna parts are arranged on the line part; and Multiple welded structures; Each of the antenna parts is detachably connected to the line part via the welding structure; A plurality of circularly polarized antenna modules are respectively arranged on the plurality of antenna positions; At least one beam-type chip electrically connected to the plurality of circularly polarized antenna modules; as well as A plurality of amplifiers are arranged on the line portion, and each of the amplifiers is electrically coupled to the circular polarization antenna module.
2. The array antenna device according to claim 1, characterized in that: The circularly polarized antenna modules have a plurality of predetermined ranges when projected onto the line portion along the thickness direction. The line portion has a plurality of setting slots within the plurality of predetermined ranges. The amplifiers are respectively accommodated in the plurality of setting slots.
3. The array antenna device according to claim 2, characterized in that: The carrier includes a plurality of grounding conductive posts, the plurality of grounding conductive posts are buried in the circuit portion, and the plurality of grounding conductive posts surround each of the setting slots.
4. The array antenna device according to claim 3, characterized in that: The height of the plurality of grounding conductive pillars along the thickness direction is greater than the height of each amplifier along the thickness direction.
5. The array antenna device according to claim 3, characterized in that: The plurality of grounding conductive pillars are radially arranged with the amplifier as the center.
6. The array antenna device according to claim 3, characterized in that: There is a predetermined distance between two adjacent grounding conductive pillars, and the predetermined distance is less than C is the speed of light, F is the expected noise frequency, and DK is the dielectric constant of the line portion.
7. The array antenna device according to claim 3, characterized in that: The diameter of each grounding conductive column is not less than 8 mils.
8. The array antenna device according to claim 1, characterized in that: Each of the circularly polarized antenna modules includes at least one patch antenna exposed at the antenna portion and a radio frequency circuit buried in the antenna portion. The amplifier is connected to the at least one beamforming chip by a wire and is electrically coupled to the at least one patch antenna through the radio frequency circuit.