Array antenna forming temperature control method and system using solid wax glue

Abstract

The invention provides an array antenna forming temperature control method and system using solid wax glue, belongs to the technical field of equipment control, and is used for bonding a polarized antenna array and a metal base through a solid glue layer through high-temperature hot press forming operation so as to realize stable fixation. The method comprises the following steps: a control device determines a position adjacent relation between partially polarized antenna arrays according to positions of the partially polarized antenna arrays in a plurality of polarized antenna array pairs; the control equipment controls the thermocompression bonding equipment to sequentially execute high-temperature thermocompression molding operation at the position of each polarized antenna array in the partially polarized antenna arrays according to the position adjacent relation between the partially polarized antenna arrays, and the high-temperature thermocompression molding operation is used for bonding the partially polarized antenna arrays and the metal base through the solid glue layer.

Description

Technical Field

[0001] The present invention relates to the technical field of equipment control, and in particular to a method and system for controlling the molding temperature of an array antenna using solid wax glue. Background Art

[0002] Antenna arrays play an important role in modern communication systems, and their performance directly affects the coverage, signal quality, and data transmission rate of communication systems. Therefore, the antenna array needs to be accurately positioned and stably installed during its production and manufacturing process. Fixing the antenna array to a metal base is one of the key links. The metal base not only provides a stable support structure, but also effectively reduces the vibration and displacement of the antenna array, thereby ensuring the stability and reliability of its performance. Traditional fixing methods include welding, bolting, etc. However, these methods have certain limitations. For example, welding may reduce the structural strength of the metal base, and bolting may cause the connection to loosen due to vibration. Therefore, studying a new, efficient, and reliable fixing method is of great significance to improving the production efficiency and product quality of antenna arrays. Summary of the invention

[0003] The embodiment of the present invention provides an array antenna molding temperature control method using solid wax glue, which is used to bond the polarized antenna array to the metal base through a solid glue layer through a high-temperature hot pressing molding operation, thereby achieving stable fixation.

[0004] In order to achieve the above object, the present invention adopts the following technical scheme:

[0005] In a first aspect, a method for controlling the molding temperature of an array antenna using solid wax glue is provided, which is applied to a control device, wherein a hot pressing device is controlled by the control device, wherein a metal base and an array antenna are clamped in the hot pressing device, wherein the array antenna comprises a plurality of polarized antenna array pairs, wherein a solid glue layer is coated between some of the polarized antenna arrays in the plurality of polarized antenna array pairs and the metal base, and wherein the method comprises: the control device determines the positional proximity relationship between the partially polarized antenna arrays according to the positions of the partially polarized antenna arrays in the plurality of polarized antenna array pairs; the control device controls the hot pressing device to perform a high-temperature hot pressing molding operation at the position of each polarized antenna array in the partially polarized antenna array in turn according to the positional proximity relationship between the partially polarized antenna arrays, wherein the high-temperature hot pressing molding operation is used to bond the partially polarized antenna array to the metal base through the solid glue layer.

[0006] Optionally, the multiple polarized antenna array pairs are N*N polarized antenna arrays, N is an integer greater than 2, the N*N polarized antenna arrays are arranged on a metal base in the form of an N*N matrix, the partially polarized antenna arrays are polarized antenna arrays that are at least one polarized antenna array apart from each other among the N*N polarized antenna arrays, and the positions of the partially polarized antenna arrays in the multiple polarized antenna array pairs are the positions in the N*N matrix; the control device determines the positional proximity relationship between the partially polarized antenna arrays according to the positions of the partially polarized antenna arrays in the multiple polarized antenna array pairs, including: the control device determines the polarized antenna arrays closest to each two positions in the partially polarized antenna arrays according to the positions of the partially polarized antenna arrays in the N*N matrix and in accordance with a preset traversal order; the preset traversal order is to traverse two adjacent rows in the N*N matrix from left to right and then from right to left.

[0007] Optionally, the control device controls the hot pressing device to perform high-temperature hot pressing forming operations at the position of each polarized antenna array in the partial polarized antenna array in turn according to the positional proximity relationship between the partial polarized antenna arrays, including: the control device regards every two nearest polarized antenna arrays in the partial polarized antenna array as a polarized antenna array pair, with a total of multiple polarized antenna array pairs; the control device controls the hot pressing device to perform high-temperature hot pressing forming operations at the position of each polarized antenna array pair in the multiple polarized antenna array pairs in turn according to a preset traversal order, wherein, for any polarized antenna array in the multiple polarized antenna array pairs, the two polarized antenna arrays in the polarized antenna array are successively subjected to high-temperature hot pressing forming operations according to the preset traversal order, and the time periods during which the two polarized antenna arrays are subjected to high-temperature hot pressing forming operations overlap.

[0008] Optionally, the positions of the partially polarized antenna arrays in the N*N matrix satisfy the following relationship: there is a row between two adjacent polarized antenna arrays in the partially polarized antenna arrays that are located in the same column of the N*N matrix, there is a column between two adjacent polarized antenna arrays in the partially polarized antenna arrays that are located in the same row of the N*N matrix, and the polarized antenna arrays in the partially polarized antenna arrays that are located in two adjacent columns of the N*N matrix are not located in the same row; accordingly, in the case of following a preset traversal order, in the N*N matrix, the first polarized antenna array pair among the multiple polarized antenna array pairs includes the polarized antenna array in the first row and the first column and the polarized antenna array in the first row and the third column; on this basis, if N is a cardinality greater than 3, then the second polarized antenna array among the multiple polarized antenna array pairs The sub-pair includes the polarized antenna array in the 3rd column of the 1st row and the polarized antenna array in the 5th column of the 1st row, and so on. The (N / 2)Ceiling polarized antenna array pair among the multiple polarized antenna array pairs includes the polarized antenna array in the Nth column of the 1st row and the polarized antenna array in the N-1th column of the 2nd row, and so on. ()Ceiling represents rounding up. If N is an even number greater than 4, the second polarized antenna array pair among the multiple polarized antenna array pairs includes the polarized antenna array in the 3rd column of the 1st row and the polarized antenna array in the 5th column of the 1st row, and so on. The N / 2th polarized antenna array pair among the multiple polarized antenna array pairs includes the polarized antenna array in the N-1th column of the 1st row and the polarized antenna array in the N-1th column of the 2nd row, and so on.

[0009] Optionally, the multiple polarized antenna array pairs are M polarized antenna array pairs, M is an integer greater than 1, and for the xth polarized antenna array pair and the x+1th polarized antenna array pair among the M polarized antenna array pairs, x is an integer ranging from 1 to M-1; the two polarized antenna array pairs included in the xth polarized antenna array pair are the first polarized antenna array and the second polarized antenna array in a preset traversal order, and the two polarized antenna array pairs included in the x+1th polarized antenna array pair are the second polarized antenna array and the third polarized antenna array in a preset traversal order; the control device controls the hot pressing device to perform high-temperature hot pressing molding operations at the position of each polarized antenna array pair in the multiple polarized antenna array pairs in accordance with the preset traversal order, including: at the beginning of the first time period, the control device traverses to the xth polarized antenna array pair in accordance with the preset traversal order; the control device controls the hot pressing device to place the polarized antenna array pair in the first time period. The temperature at the position of the first polarized antenna element rises uniformly from the first temperature to the second temperature; at the beginning of the second time period, the control device traverses to the x+1th polarized antenna element pair according to the preset traversal order; the control device controls the hot pressing device to uniformly increase the temperature at the position of the first polarized antenna element from the second temperature to the third temperature within the second time period, and simultaneously controls the hot pressing device to uniformly increase the temperature at the position of the second polarized antenna element from the first temperature to the second temperature within the second time period, and the end time of the first time period is the same as the start time of the second time period; the control device controls the hot pressing device to uniformly increase the temperature at the position of the second polarized antenna element from the second temperature to the third temperature within the third time period, and simultaneously controls the hot pressing device to uniformly increase the temperature at the position of the third polarized antenna element from the first temperature to the second temperature within the third time period, and the end time of the second time period is the same as the start time of the third time period.

[0010] Optionally, the first temperature is 170°C, the second temperature is 185°C, and the third temperature is 200°C.

[0011] Optionally, N is an even number greater than 2, and the partially polarized antenna array includes a first partially polarized antenna array and a second partially polarized antenna array, the first partially polarized antenna array is located on the first diagonal of the N*N matrix, and the second partially polarized antenna array is located on the second diagonal of the N*N matrix; accordingly, in the case of following a preset traversal order, in the N*N matrix, the first polarized antenna array pair located on the first diagonal among the multiple polarized antenna array pairs includes: the polarized antenna array in the first row and the first column and the polarized antenna array in the second row and the second column, and the multiple polarized antenna arrays The second polarized antenna array pair on the first diagonal line among the sub-pairs includes: the polarized antenna array in the second row and the second column and the polarized antenna array in the third row and the third column, and so on; the first polarized antenna array pair on the second diagonal line among the multiple polarized antenna array pairs includes: the polarized antenna array in the first row and the Nth column and the polarized antenna array in the second row and the N-1th column, the second polarized antenna array pair on the second diagonal line among the multiple polarized antenna array pairs includes: the polarized antenna array in the second row and the N-1th column and the polarized antenna array in the third row and the N-3rd column, and so on.

[0012] Optionally, there are M polarized antenna array pairs located on the first diagonal or the second diagonal among the multiple polarized antenna array pairs, where M is an integer greater than 1, and for the x-th polarized antenna array pair and the x+1-th polarized antenna array pair among the M polarized antenna array pairs, x is an integer ranging from 1 to M-1; the two polarized antenna array pairs included in the x-th polarized antenna array pair are the first polarized antenna array and the second polarized antenna array in a preset traversal order, and the two polarized antenna array pairs included in the x+1-th polarized antenna array pair are the second polarized antenna array and the third polarized antenna array in a preset traversal order; the control device controls the hot pressing device to perform high-temperature hot pressing molding operations at the position of each polarized antenna array pair in the multiple polarized antenna array pairs in accordance with the preset traversal order, including: at the beginning of the first time period, the control device traverses to the x-th polarized antenna array pair in accordance with the preset traversal order; the control device controls the hot pressing device to perform high-temperature hot pressing molding operations at the position of each polarized antenna array pair in the multiple polarized antenna array pairs in accordance with the preset traversal order; The pressing device uniformly increases the temperature at the position of the first polarized antenna element from the first temperature to the second temperature within the first time period; the control device traverses to the x+1th polarized antenna element pair according to the preset traversal order at the beginning of the second time period; the control device controls the hot pressing device to uniformly increase the temperature at the position of the first polarized antenna element from the second temperature to the third temperature within the second time period, and simultaneously controls the hot pressing device to uniformly increase the temperature at the position of the second polarized antenna element from the first temperature to the second temperature within the second time period, and the end time of the first time period is the same as the start time of the second time period; the control device controls the hot pressing device to uniformly increase the temperature at the position of the second polarized antenna element from the second temperature to the third temperature within the third time period, and simultaneously controls the hot pressing device to uniformly increase the temperature at the position of the third polarized antenna element from the first temperature to the second temperature within the third time period, and the end time of the second time period is the same as the start time of the third time period.

[0013] Optionally, the first temperature is 170°C, the second temperature is 185°C, and the third temperature is 200°C.

[0014] In a second aspect, a temperature control system for array antenna molding using solid wax glue is provided, the system comprising a control device and a hot pressing device controlled by the control device, a metal base and an array antenna being clamped in the hot pressing device, the array antenna comprising a plurality of polarized antenna array pairs, a solid glue layer being coated between some of the polarized antenna arrays in the plurality of polarized antenna array pairs and the metal base, the system being configured as follows: the control device determines the positional proximity relationship between the partially polarized antenna arrays according to the positions of the partially polarized antenna arrays in the plurality of polarized antenna array pairs; the control device controls the hot pressing device to perform a high-temperature hot pressing molding operation at the position of each polarized antenna array in the partially polarized antenna array in turn according to the positional proximity relationship between the partially polarized antenna arrays, the high-temperature hot pressing molding operation being used to bond the partially polarized antenna array to the metal base through the solid glue layer.

[0015] In summary, since the hot pressing equipment can be controlled by the control device, the hot pressing equipment clamps a metal base and an array antenna, and the array antenna includes a plurality of polarized antenna array pairs, and a solid glue layer is coated between some of the polarized antenna arrays and the metal base in the plurality of polarized antenna array pairs. On this basis, the control device first determines the positional proximity relationship between some of the polarized antenna arrays according to the positions of the some of the polarized antenna arrays in the plurality of polarized antenna array pairs, and then controls the hot pressing equipment to perform high-temperature hot pressing molding operations at the positions of each polarized antenna array in the partial polarized antenna arrays according to the positional proximity relationship between these partial polarized antenna arrays, that is, the high-temperature hot pressing molding operations are performed accurately to the positions of each polarized antenna array, so that the high-temperature hot pressing molding operations can more stably bond these partial polarized antenna arrays to the metal base through the solid glue layer, thereby achieving stable fixation. In addition, only some of the polarized antenna arrays are bonded to the metal base through the solid glue layer, which can reduce production costs and improve production efficiency on the basis of ensuring the stability of fixation. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 A schematic diagram of the architecture of a temperature control system for array antenna molding using solid wax glue provided by an embodiment of the present invention;

[0017] Figure 2 A schematic flow chart of a method for controlling the temperature of an array antenna molding using solid wax glue provided by an embodiment of the present invention;

[0018] Figure 3 A schematic diagram of an application scenario of a method for controlling the molding temperature of an array antenna using solid wax glue provided in an embodiment of the present invention;

[0019] Figure 4 A schematic diagram of the structure of a control device provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0020] In the embodiment of the present invention, "indication" may include direct indication and indirect indication, and may also include explicit indication and implicit indication. The information indicated by a certain information (such as the first indication information, the second indication information, or the third indication information, etc. below) is called information to be indicated. In the specific implementation process, there are many ways to indicate the information to be indicated, such as but not limited to, the information to be indicated can be directly indicated, such as the information to be indicated itself or the index of the information to be indicated. The information to be indicated can also be indirectly indicated by indicating other information, wherein the other information has an association relationship with the information to be indicated. It is also possible to indicate only a part of the information to be indicated, while the other parts of the information to be indicated are known or agreed in advance. For example, the indication of specific information can also be realized by means of the arrangement order of each information agreed in advance (such as specified by the protocol), thereby reducing the indication overhead to a certain extent. At the same time, the common parts of each information can also be identified and uniformly indicated to reduce the indication overhead caused by indicating the same information separately.

[0021] In addition, the specific indication method may also be various existing indication methods, such as but not limited to the above-mentioned indication methods and various combinations thereof. The specific details of the various indication methods can refer to the prior art and will not be repeated herein. As can be seen from the above, for example, when it is necessary to indicate multiple information of the same type, different indication methods may be used for different information. In the specific implementation process, the desired indication method can be selected according to specific needs. The embodiment of the present invention does not limit the selected indication method. In this way, the indication method involved in the embodiment of the present invention should be understood to cover various methods that can enable the party to be indicated to obtain the information to be indicated.

[0022] "Pre-definition" or "pre-configuration" can be implemented by pre-saving corresponding codes, tables or other methods that can be used to indicate relevant information in the device, and the embodiments of the present invention do not limit the specific implementation method. Among them, "saving" can mean saving in one or more memories. The one or more memories can be set separately or integrated in an encoder or decoder, a processor, or a communication device. The one or more memories can also be partially set separately and partially integrated in a decoder, a processor, or a communication device. The type of memory can be any form of storage medium, which is not limited by the embodiments of the present invention.

[0023] The "protocol" involved in the embodiments of the present invention may refer to a protocol family in the communication field, a standard protocol with a similar protocol family frame structure, or a related protocol applied in future communication systems, and the embodiments of the present invention do not specifically limit this.

[0024] In the embodiments of the present invention, descriptions such as "when...", "in the case of...", "if" and "if" all mean that the device will perform corresponding processing under certain objective circumstances, but do not limit the time, nor do they require the device to perform judgment actions when implementing, nor do they mean the existence of other limitations.

[0025] In the description of the embodiments of the present invention, unless otherwise specified, " / " indicates that the objects associated before and after are in an "or" relationship, for example, A / B can represent A or B; "and / or" in the embodiments of the present invention is only a kind of association relationship describing the associated objects, indicating that there can be three relationships, for example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone, where A and B can be singular or plural. In addition, in the description of the embodiments of the present invention, unless otherwise specified, "multiple" refers to two or more than two. "At least one of the following" or similar expressions refers to any combination of these items, including any combination of single items or plural items. For example, at least one of a, b or c can represent: a, b, c, ab, ac, bc, or abc, where a, b, c can be single or multiple. In addition, in order to facilitate the clear description of the technical solution of the embodiments of the present invention, in the embodiments of the present invention, the words "first" and "second" are used to distinguish the same items or similar items with basically the same functions and effects. Those skilled in the art will appreciate that words such as "first" and "second" do not limit the quantity and execution order, and words such as "first" and "second" do not necessarily limit the difference. At the same time, in the embodiments of the present invention, words such as "exemplary" or "for example" are used to indicate examples, illustrations or explanations. Any embodiment or design described as "exemplary" or "for example" in the embodiments of the present invention should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as "exemplary" or "for example" is intended to present related concepts in a concrete way for easy understanding.

[0026] The network architecture and business scenarios described in the embodiments of the present invention are intended to more clearly illustrate the technical solutions of the embodiments of the present invention, and do not constitute a limitation on the technical solutions provided by the embodiments of the present invention. A person of ordinary skill in the art can appreciate that with the evolution of the network architecture and the emergence of new business scenarios, the technical solutions provided by the embodiments of the present invention are equally applicable to similar technical problems.

[0027] To facilitate understanding of the embodiments of the present invention, first Figure 1 The control system applicable to the embodiment of the present invention is described in detail by taking the dynamic update system of the wireless communication configuration shown in FIG. Figure 1A schematic diagram of the architecture of a temperature control system for array antenna molding using solid wax glue applicable to the method provided in an embodiment of the present invention.

[0028] like Figure 1 As shown in (a) in FIG. 1 , the array antenna molding temperature control system using solid wax glue may include: a control device 10 and a heat pressing device 11 controlled by the control device 10 .

[0029] The heat pressing device 11 holds a metal base 101 and an array antenna 102. Figure 1 As shown in (b) of FIG. 1 , the array antenna 102 includes a plurality of polarized antenna array pairs 1021. Specifically, the plurality of polarized antenna array pairs 1021 are N*N polarized antenna arrays 1021, where N is an integer greater than 2, and the N*N polarized antenna arrays 1021 are arranged on the metal base in the form of an N*N matrix. A solid glue layer 103 is coated between some of the polarized antenna arrays 1021 in the plurality of polarized antenna array pairs 1021 and the metal base 101, that is, each solid glue layer 103 is only located between one polarized antenna array 1021 and the metal base 101. Above the N*N polarized antenna arrays 1021 is a heating component 110 of a hot pressing device 11, which can implement differentiated heating operations in high-temperature hot pressing operations, so that the heating position can be accurate to each polarized antenna array 1021, such as heating only the position of the polarized antenna array 1021 located at the 1st row and 1st column in the N*N matrix.

[0030] The control device 10 is in communication connection with the heat pressing device 11 and can control the heat pressing device 11 to perform a high-temperature heat pressing molding operation, such as specifically controlling the heating component 110 to perform the above-mentioned differentiated heating operation.

[0031] The control device 10 may be a terminal, which may be a terminal having a communication control function, or a chip or chip system that may be provided in the terminal. The terminal may also be referred to as a user equipment (UE), an access terminal, a subscriber unit, a user station, a mobile station (MS), a mobile station, a remote station, a remote terminal, a mobile device, a user terminal, a terminal, a wireless communication device, a user agent or a user device. The terminal in the embodiments of the present invention may be a mobile phone, a cellular phone, a smartphone, a tablet computer, a wireless data card, a personal digital assistant (PDA), a wireless modem, a handset, a laptop computer, a machine type communication (MTC) terminal, a computer with a wireless transceiver function, a virtual reality (VR) terminal, an augmented reality (AR) terminal, a wireless terminal in industrial control, a wireless terminal in self driving, a wireless terminal in remote medical, a wireless terminal in smart grid, a wireless terminal in transportation safety, a wireless terminal in a smart city, a wireless terminal in a smart home, a vehicle-mounted terminal, a road side unit (RSU) with a terminal function, etc. The terminal of the present invention may also be an on-board module, an on-board module, an on-board component, an on-board chip or an on-board unit built into a vehicle as one or more components or units.

[0032] The following will be combined Figure 2 The interaction process between the devices in the above system is specifically introduced through the method embodiment. The array antenna molding temperature control method using solid wax glue provided by the embodiment of the present invention can be applied to the above system, which is specifically introduced below.

[0033] Figure 2 A schematic diagram of a process flow of a method for controlling the temperature of an array antenna formed using solid wax glue provided by an embodiment of the present invention. Figure 1 ,like Figure 2 As shown, the process of the array antenna molding temperature control method using solid wax glue is as follows:

[0034] S201: A control device determines a positional proximity relationship between partially polarized antenna elements according to positions of the partially polarized antenna elements in a plurality of polarized antenna element pairs.

[0035] It should be understood that the multiple polarized antenna array pairs are N*N polarized antenna arrays, and N is an integer greater than 2, and the N*N polarized antenna arrays are arranged on the metal base in the form of an N*N matrix. On this basis, the above-mentioned partial polarized antenna arrays are polarized antenna arrays that are at least one polarized antenna array apart from each other among the N*N polarized antenna arrays, that is, these partial polarized antenna arrays are selected relatively sparsely and evenly from the N*N polarized antenna arrays, so that the array antenna can be firmly bonded to the metal base through the solid glue layer through the partial polarized antenna arrays. On this basis, the position of this partial polarized antenna array in the multiple polarized antenna array pairs is the position in the N*N matrix, that is, the position of each polarized antenna array in the multiple polarized antenna array pairs can be described by the index of the rows and columns in the N*N matrix, such as the polarized antenna array in the 1st row and the 1st column, the polarized antenna array in the 3rd row and the 2nd column, etc.

[0036] The control device can determine the polarized antenna arrays that are closest to each other in the partially polarized antenna arrays according to the positions of the partially polarized antenna arrays in the N*N matrix and in a preset traversal order. The preset traversal order is to traverse two adjacent rows in the N*N matrix from left to right and then from right to left. For example, Figure 1 As shown, first traverse the first row of the N*N matrix from left to right, then traverse the second row of the N*N matrix from right to left, then traverse the third row of the N*N matrix from left to right, and so on.

[0037] Method 1:

[0038] The positions of the partially polarized antenna arrays in the N*N matrix satisfy the following relationship: there is one row between two adjacent polarized antenna arrays in the partially polarized antenna arrays located in the same column in the N*N matrix, there is one column between two adjacent polarized antenna arrays in the partially polarized antenna arrays located in the same row in the N*N matrix, and polarized antenna arrays in the partially polarized antenna arrays located in two adjacent columns in the N*N matrix are not located in the same row. For example, Figure 3 As shown in (a) of FIG. 1 , the black block represents the aforementioned partially polarized antenna array. In this partially polarized antenna array, a solid glue layer is coated between each polarized antenna array and the metal base.

[0039] Method 2:

[0040] N is an even number greater than 2, and the partially polarized antenna array includes a first partially polarized antenna array and a second partially polarized antenna array, the first partially polarized antenna array is located on the first diagonal of the N*N matrix, and the second partially polarized antenna array is located on the second diagonal of the N*N matrix. For example, Figure 3 As shown in (b), the diagonal line from left to right and from top to bottom is the first part of the polarized antenna array, which is represented by a black block, and the diagonal line from right to left and from top to bottom is the second part of the polarized antenna array, which is also represented by a black block. In this part of the polarized antenna array, a solid glue layer is coated between each polarized antenna array and the metal base.

[0041] S202, the control device controls the hot pressing device to perform high-temperature hot pressing operations at the position of each polarized antenna array in the partially polarized antenna array in turn according to the positional proximity relationship between the partially polarized antenna arrays.

[0042] Among them, high-temperature hot pressing molding operation can be used to bond a partial polarized antenna array to a metal base through a solid glue layer.

[0043] Specifically, the control device can treat every two polarized antenna arrays that are located closest to each other in the partial polarized antenna arrays as a polarized antenna array pair, with a total of multiple polarized antenna array pairs. Among them, the distance between two polarized antenna arrays can be represented by the number of spaced polarized antenna arrays. For example, the polarized antenna array in the first row and the first column is separated from the polarized antenna array in the first row and the third column by the polarized antenna array in the first row and the second column, that is, the distance is 1 unit length. The polarized antenna array in the first row and the first column is separated from the polarized antenna array in the second row and the second column by the polarized antenna array in the second row and the first column or the polarized antenna array in the first row and the second column, that is, the distance is also 1 unit length. Although the distances are both 1 unit length, since the polarized antenna array in the first row and the first column and the polarized antenna array in the first row and the third column belong to the same row, the polarized antenna array in the first row and the first column and the polarized antenna array in the second row and the second column belong to different rows, when selecting the polarized antenna array with the closest distance, polarized antenna arrays in the same row are given priority. When there are no optional polarized antenna arrays in the same row, polarized antenna arrays in different rows are considered. In other words, among the partially polarized antenna arrays, the polarized antenna array in the first row and the first column is closest to the polarized antenna array in the first row and the third column, rather than the polarized antenna array in the second row and the second column.

[0044] Continue with method 1 above:

[0045] In the case of following the preset traversal order, in the N*N matrix, the first polarized antenna array pair among the multiple polarized antenna array pairs includes the polarized antenna array in the first row and the first column and the polarized antenna array in the first row and the third column; on this basis, if N is a cardinality greater than 3, the second polarized antenna array pair among the multiple polarized antenna array pairs includes the polarized antenna array in the first row and the third column and the polarized antenna array in the first row and the fifth column, and so on, the (N / 2)th Ceiling polarized antenna array pair among the multiple polarized antenna array pairs includes the polarized antenna array in the first row and the third column and the polarized antenna array in the first row and the fifth column. The polarized antenna array in the Nth row and the polarized antenna array in the N-1th column of the second row, and so on, ()Ceiling means rounding up; if N is an even number greater than 4, then the second polarized antenna array pair in the multiple polarized antenna array pairs includes the polarized antenna array in the 3rd row and the 5th column of the first row, and so on, the N / 2th polarized antenna array pair in the multiple polarized antenna array pairs includes the polarized antenna array in the N-1th column of the first row and the Nth column of the second row, and so on.

[0046] For example, Figure 3 As shown in (a), the first polarization antenna array pair includes the polarization antenna array in the first row and the first column and the polarization antenna array in the first row and the third column, the second polarization antenna array pair includes the polarization antenna array in the first row and the third column and the polarization antenna array in the first row and the fifth column, the third polarization antenna array pair includes the polarization antenna array in the first row and the third column and the polarization antenna array in the second row and the sixth column, the fourth polarization antenna array pair includes the polarization antenna array in the second row and the sixth column and the polarization antenna array in the second row and the fourth column, the fifth polarization antenna array pair includes the polarization antenna array in the second row and the fourth column and the polarization antenna array in the second row and the fourth column, the sixth polarization antenna array pair includes the polarization antenna array in the second row and the second column and the polarization antenna array in the third row and the first column, and so on.

[0047] The control device can control the hot pressing device to perform high-temperature hot pressing forming operations at the position of each polarized antenna array pair in a plurality of polarized antenna array pairs in accordance with a preset traversal order, wherein, for any polarized antenna array in the plurality of polarized antenna array pairs, the two polarized antenna arrays in the polarized antenna array are successively subjected to high-temperature hot pressing forming operations in accordance with the preset traversal order, and the time periods during which the two polarized antenna arrays are subjected to high-temperature hot pressing forming operations overlap.

[0048] For example, the multiple polarized antenna array pairs are M polarized antenna array pairs, M is an integer greater than 1, and for the x-th polarized antenna array pair and the x+1-th polarized antenna array pair among the M polarized antenna array pairs, x is an integer ranging from 1 to M-1; the two polarized antenna array pairs included in the x-th polarized antenna array pair are the first polarized antenna array and the second polarized antenna array in a preset traversal order, and the two polarized antenna array pairs included in the x+1-th polarized antenna array pair are the second polarized antenna array and the third polarized antenna array in a preset traversal order.

[0049] At the beginning of the first time period, the control device traverses to the xth polarized antenna array pair according to the preset traversal order. The control device controls the heat pressing device to uniformly increase the temperature at the position of the first polarized antenna array from the first temperature to the second temperature within the first time period. The duration of the first time period can be set according to actual conditions, such as 30 seconds or 15 seconds. At the beginning of the second time period, the control device traverses to the x+1th polarized antenna array pair according to the preset traversal order. In addition, if the first polarized antenna array is the polarized antenna array in the first row and the first column, since no heat from other positions can be radiated when the position where the first polarized antenna array is located is heated within the first time period, the duration of the first time period can be relatively longer. The control device can control the heat pressing device to uniformly increase the temperature at the position of the first polarized antenna array from the second temperature to the third temperature within the second time period, and at the same time control the heat pressing device to uniformly increase the temperature at the position of the second polarized antenna array from the first temperature to the second temperature within the second time period. The end time of the first time period is the same as the start time of the second time period, and the duration of the first time period is the same as the duration of the second time period. The control device controls the thermal compression device to uniformly increase the temperature at the position of the second polarized antenna element from the second temperature to the third temperature within the third time period, and simultaneously controls the thermal compression device to uniformly increase the temperature at the position of the third polarized antenna element from the first temperature to the second temperature within the third time period. The end time of the second time period is the same as the start time of the third time period, and the duration of the second time period is the same as the duration of the third time period.

[0050] For example, the first temperature may be 170°C, the second temperature may be 185°C, and the third temperature may be 200°C.

[0051] It can be understood that when the temperature at the position of the first polarized antenna array is uniformly increased from the second temperature to the third temperature within the second time period, since the second polarized antenna array is very close to the first polarized antenna array (this is the reason why multiple polarized antenna array pairs are grouped), the heat of this temperature can be radiated to the second polarized antenna array, so that when the temperature at the position of the second polarized antenna array is uniformly increased from the first temperature to the second temperature within the second time period, the bonding time of the solid glue layer can be shortened, that is, relative to the case where the first polarized antenna array is the polarized antenna array in the first row and the first column, the second time period can be relatively shorter.

[0052] Continue with method 2 above:

[0053] In accordance with the preset traversal order, in the N*N matrix, the first polarized antenna array pair among the multiple polarized antenna array pairs located on the first diagonal line includes: the polarized antenna array in the first row and the first column and the polarized antenna array in the second row and the second column, the second polarized antenna array pair among the multiple polarized antenna array pairs located on the first diagonal line includes: the polarized antenna array in the second row and the second column and the polarized antenna array in the third row and the third column, and so on; the first polarized antenna array pair among the multiple polarized antenna array pairs located on the second diagonal line includes: the polarized antenna array in the first row and the Nth column and the polarized antenna array in the second row and the N-1th column, the second polarized antenna array pair among the multiple polarized antenna array pairs located on the second diagonal line includes: the polarized antenna array in the second row and the N-1th column and the polarized antenna array in the third row and the N-3th column, and so on.

[0054] For example, Figure 3 As shown in (b), on the first diagonal line, the first polarized antenna array pair includes the polarized antenna array in the first row and the first column and the polarized antenna array in the second row and the second column, the second polarized antenna array pair includes the polarized antenna array in the second row and the second column and the polarized antenna array in the third row and the third column, the third polarized antenna array pair includes the polarized antenna array in the third row and the third column and the polarized antenna array in the fourth row and the fourth column, the fourth polarized antenna array pair includes the polarized antenna array in the fourth row and the fourth column and the polarized antenna array in the fifth row and the fifth column, and the fifth polarized antenna array pair includes the polarized antenna array in the fifth row and the fifth column and the polarized antenna array in the sixth row and the sixth column. For reference on the second diagonal line, no further description is given.

[0055] Among the multiple polarized antenna array pairs, the polarized antenna array pairs located on the first diagonal or the second diagonal are M polarized antenna array pairs, M is an integer greater than 1, and for the x-th polarized antenna array pair and the x+1-th polarized antenna array pair among the M polarized antenna array pairs, x is an integer ranging from 1 to M-1; the two polarized antenna array pairs included in the x-th polarized antenna array pair are the first polarized antenna array and the second polarized antenna array in a preset traversal order, and the two polarized antenna array pairs included in the x+1-th polarized antenna array pair are the second polarized antenna array and the third polarized antenna array in a preset traversal order.

[0056] At the beginning of the first time period, the control device traverses to the xth polarized antenna element pair according to the preset traversal order; the control device controls the heat pressing device to uniformly increase the temperature at the position of the first polarized antenna element from the first temperature to the second temperature within the first time period; at the beginning of the second time period, the control device traverses to the x+1th polarized antenna element pair according to the preset traversal order; the control device controls the heat pressing device to uniformly increase the temperature at the position of the first polarized antenna element from the second temperature to the third temperature within the second time period, and simultaneously controls the heat pressing device to uniformly increase the temperature at the position of the second polarized antenna element from the first temperature to the second temperature within the second time period, and the end time of the first time period is the same as the start time of the second time period; the control device controls the heat pressing device to uniformly increase the temperature at the position of the second polarized antenna element from the second temperature to the third temperature within the third time period, and simultaneously controls the heat pressing device to uniformly increase the temperature at the position of the third polarized antenna element from the first temperature to the second temperature within the third time period, and the end time of the second time period is the same as the start time of the third time period.

[0057] Exemplarily, the first temperature is 170°C, the second temperature is 185°C, and the third temperature is 200°C.

[0058] It can be understood that the principle of method 2 is similar to that of method 1, and can be understood by reference, so it will not be repeated here.

[0059] In summary, since the hot pressing equipment can be controlled by the control device, the hot pressing equipment clamps a metal base and an array antenna, and the array antenna includes a plurality of polarized antenna array pairs, and a solid glue layer is coated between some of the polarized antenna arrays and the metal base in the plurality of polarized antenna array pairs. On this basis, the control device first determines the positional proximity relationship between some of the polarized antenna arrays according to the positions of the some of the polarized antenna arrays in the plurality of polarized antenna array pairs, and then controls the hot pressing equipment to perform high-temperature hot pressing molding operations at the positions of each polarized antenna array in the partial polarized antenna arrays according to the positional proximity relationship between these partial polarized antenna arrays, that is, the high-temperature hot pressing molding operations are performed accurately to the positions of each polarized antenna array, so that the high-temperature hot pressing molding operations can more stably bond these partial polarized antenna arrays to the metal base through the solid glue layer, thereby achieving stable fixation. In addition, only some of the polarized antenna arrays are bonded to the metal base through the solid glue layer, which can reduce production costs and improve production efficiency on the basis of ensuring the stability of fixation.

[0060] Figure 4 The electronic device provided in the embodiment of the present invention is a schematic diagram of the structure of the electronic device. For example, the electronic device may be a terminal, or a chip (system) or other components or assemblies that can be set in the terminal. Figure 4 As shown, the electronic device 400 may include a processor 401. Optionally, the electronic device 400 may further include a memory 402 and / or a transceiver 403. The processor 401 is coupled with the memory 402 and the transceiver 403, such as being connected via a communication bus.

[0061] Combine the following Figure 4 The components of the electronic device 400 are described in detail:

[0062] The processor 401 is the control center of the electronic device 400, and may be a processor or a general term for multiple processing elements. For example, the processor 401 is one or more central processing units (CPUs), or may be application specific integrated circuits (ASICs), or may be one or more integrated circuits configured to implement the embodiments of the present invention, such as one or more microprocessors (digital signal processors, DSPs), or one or more field programmable gate arrays (FPGAs).

[0063] Optionally, the processor 401 can execute various functions of the electronic device 400 by running or executing the software program stored in the memory 402 and calling the data stored in the memory 402, such as executing the above Figure 2 The array antenna molding temperature control method using solid wax glue is shown.

[0064] In a specific implementation, as an embodiment, the processor 401 may include one or more CPUs, such as Figure 4 CPU0 and CPU1 are shown in FIG.

[0065] In a specific implementation, as an embodiment, the electronic device 400 may also include multiple processors. Each of these processors may be a single-core processor (single-CPU) or a multi-core processor (multi-CPU). The processor here may refer to one or more devices, circuits, and / or processing cores for processing data (e.g., computer program instructions).

[0066] The memory 402 is used to store the software program for executing the solution of the present invention, and the execution is controlled by the processor 401. The specific implementation method can refer to the above method embodiment, which will not be repeated here.

[0067] Optionally, the memory 402 may be a read-only memory (ROM) or other types of static storage devices that can store static information and instructions, a random access memory (RAM) or other types of dynamic storage devices that can store information and instructions, or an electrically erasable programmable read-only memory (EEPROM), a compact disc read-only memory (CD-ROM) or other optical disc storage, optical disc storage (including compressed optical disc, laser disc, optical disc, digital versatile disc, Blu-ray disc, etc.), a magnetic disk storage medium or other magnetic storage device, or any other medium that can be used to carry or store the desired program code in the form of instructions or data structures and can be accessed by a computer, but is not limited thereto. The memory 402 may be integrated with the processor 401, or may exist independently and access the computer through the interface circuit ( Figure 4 (not shown) is coupled to the processor 401, which is not specifically limited in this embodiment of the present invention.

[0068] The transceiver 403 is used for communication with other electronic devices. For example, if the electronic device 400 is a terminal, the transceiver 403 can be used to communicate with a network device, or with another terminal device. For another example, if the electronic device 400 is a network device, the transceiver 403 can be used to communicate with a terminal, or with another network device.

[0069] Optionally, the transceiver 403 may include a receiver and a transmitter ( Figure 4 The receiver is used to implement a receiving function, and the transmitter is used to implement a sending function.

[0070] Optionally, the transceiver 403 may be integrated with the processor 401, or may exist independently and communicate with the electronic device 400 through an interface circuit ( Figure 4 (not shown) is coupled to the processor 401, which is not specifically limited in this embodiment of the present invention.

[0071] Understandably, Figure 4 The structure of the electronic device 400 shown in the figure does not constitute a limitation on the electronic device, and the actual electronic device may include more or fewer components than those shown in the figure, or combine certain components, or arrange the components differently.

[0072] In addition, the technical effects of the electronic device 400 can refer to the technical effects of the methods described in the above method embodiments, which will not be repeated here.

[0073] It should be understood that the processor in the embodiment of the present invention may be a central processing unit (CPU), and the processor may also be other general-purpose processors, digital signal processors (DSP), application specific integrated circuits (ASIC), field programmable gate arrays (FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. The general-purpose processor may be a microprocessor or the processor may also be any conventional processor, etc.

[0074] It should also be understood that the memory in the embodiments of the present invention may be a volatile memory or a non-volatile memory, or may include both volatile and non-volatile memories. Among them, the non-volatile memory may be a read-only memory (ROM), a programmable read-only memory (PROM), an erasable programmable read-only memory (EPROM), an electrically erasable programmable read-only memory (EEPROM), or a flash memory. The volatile memory may be a random access memory (RAM), which is used as an external cache. By way of example and not limitation, many forms of random access memory (RAM) are available, such as static RAM (SRAM), dynamic random access memory (DRAM), synchronous DRAM (SDRAM), double data rate synchronous dynamic random access memory (DDR SDRAM), enhanced synchronous dynamic random access memory (ESDRAM), synchronous link DRAM (SLDRAM), and direct rambus RAM (DR RAM).

[0075] The above embodiments can be implemented in whole or in part by software, hardware (such as circuits), firmware or any other combination. When implemented by software, the above embodiments can be implemented in whole or in part in the form of a computer program product. The computer program product includes one or more computer instructions or computer programs. When the computer instructions or computer programs are loaded or executed on a computer, the process or function described in the embodiment of the present invention is generated in whole or in part. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable device. The computer instructions can be stored in a computer-readable storage medium, or transmitted from one computer-readable storage medium to another computer-readable storage medium. For example, the computer instructions can be transmitted from one website, computer, server or data center to another website, computer, server or data center by wired (such as infrared, wireless, microwave, etc.). The computer-readable storage medium can be any available medium that can be accessed by a computer or a data storage device such as a server or data center that contains one or more available media sets. The available medium can be a magnetic medium (for example, a floppy disk, a hard disk, a tape), an optical medium (for example, a DVD), or a semiconductor medium. The semiconductor medium can be a solid-state hard disk.

[0076] It should be understood that the term "and / or" in this article is only a description of the association relationship of associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. A and B can be singular or plural. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship, but it may also indicate an "and / or" relationship. Please refer to the context for specific understanding.

[0077] In the present invention, "at least one" means one or more, and "more than one" means two or more. "At least one of the following" or similar expressions refers to any combination of these items, including any combination of single or plural items. For example, at least one of a, b, or c can be represented by: a, b, c, ab, ac, bc, or abc, where a, b, c can be single or multiple.

[0078] It should be understood that in various embodiments of the present invention, the size of the serial numbers of the above-mentioned processes does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present invention.

[0079] Those skilled in the art will appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of the present invention.

[0080] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working processes of the systems, devices and units described above can refer to the corresponding processes in the aforementioned method embodiments and will not be repeated here.

[0081] In the several embodiments provided by the present invention, it should be understood that the disclosed systems, devices and methods can be implemented in other ways. For example, the device embodiments described above are only schematic. For example, the division of the units is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or units, which can be electrical, mechanical or other forms.

[0082] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0083] In addition, each functional unit in each embodiment of the present invention may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.

[0084] If the functions are implemented in the form of software functional units and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention can be essentially or partly embodied in the form of a software product that contributes to the prior art. The computer software product is stored in a storage medium and includes several instructions for enabling a computer device (which can be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the methods described in various embodiments of the present invention. The aforementioned storage medium includes: various media that can store program codes, such as a USB flash drive, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk.

[0085] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed by the present invention, which should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims

1. A method for controlling the molding temperature of an array antenna using solid wax glue, characterized in that: Applied to a control device, a heat pressing device is controlled by the control device, a metal base and an array antenna are clamped in the heat pressing device, the array antenna includes a plurality of polarized antenna array pairs, a solid glue layer is coated between some polarized antenna arrays in the plurality of polarized antenna array pairs and the metal base, and the method includes: The control device determines the positional proximity relationship between the partially polarized antenna elements according to the positions of the partially polarized antenna elements in the plurality of polarized antenna element pairs; The control device controls the hot pressing device to perform high-temperature hot pressing operations at the position of each polarized antenna array in the partially polarized antenna array in turn according to the positional proximity relationship between the partially polarized antenna arrays. The high-temperature hot pressing operations are used to bond the partially polarized antenna array to the metal base through the solid glue layer.

2. The method according to claim 1, characterized in that The multiple polarized antenna array pairs are N*N polarized antenna arrays, where N is an integer greater than 2, and the N*N polarized antenna arrays are arranged on the metal base in the form of an N*N matrix. The partially polarized antenna arrays are polarized antenna arrays among the N*N polarized antenna arrays that are at least one polarized antenna array apart from each other, and the position of the partially polarized antenna array in the multiple polarized antenna array pairs is the position in the N*N matrix; The control device determines, according to the positions of the partially polarized antenna elements in the plurality of polarized antenna element pairs, a positional proximity relationship between the partially polarized antenna elements, including: The control device determines, according to the positions of the partially polarized antenna arrays in the N*N matrix and in a preset traversal order, the polarized antenna arrays that are closest to each other in the partially polarized antenna arrays; The preset traversal order is to traverse two adjacent rows in the N*N matrix from left to right and then from right to left.

3. The method according to claim 2, characterized in that The control device controls the hot pressing device to perform high-temperature hot pressing molding operations at the position of each polarized antenna array in the partially polarized antenna array in turn according to the positional proximity relationship between the partially polarized antenna arrays, including: The control device regards every two closest polarized antenna arrays in the partial polarized antenna arrays as a polarized antenna array pair, with a total of multiple polarized antenna array pairs; The control device controls the hot pressing device to perform the high-temperature hot pressing forming operation at the position of each polarized antenna array pair in the multiple polarized antenna array pairs in sequence according to the preset traversal order, wherein, for any polarized antenna array in the multiple polarized antenna array pairs, the two polarized antenna arrays in the polarized antenna array are successively subjected to the high-temperature hot pressing forming operation in sequence according to the preset traversal order, and the time periods during which the two polarized antenna arrays are subjected to the high-temperature hot pressing forming operation overlap.

4. The method according to claim 3, characterized in that The positions of the partially polarized antenna arrays in the N*N matrix satisfy the following relationship: there is a row between two adjacent polarized antenna arrays in the partially polarized antenna arrays located in the same column of the N*N matrix, there is a column between two adjacent polarized antenna arrays in the partially polarized antenna arrays located in the same row of the N*N matrix, and the polarized antenna arrays in the partially polarized antenna arrays located in two adjacent columns of the N*N matrix are not located in the same row; Correspondingly, in accordance with the preset traversal order, in the N*N matrix, the first polarized antenna array pair among the multiple polarized antenna array pairs includes the polarized antenna array in the first row and first column and the polarized antenna array in the first row and third column; on this basis, if N is a cardinality greater than 3, the second polarized antenna array pair among the multiple polarized antenna array pairs includes the polarized antenna array in the first row and third column and the polarized antenna array in the first row and fifth column, and so on, the (N / 2)th polarized antenna array in the multiple polarized antenna array pairs For the polarized antenna array including the 1st row and the Nth column and the polarized antenna array in the 2nd row and the N-1th column, and so on, ()Ceiling represents rounding up; if N is an even number greater than 4, the second polarized antenna array pair among the multiple polarized antenna array pairs includes the polarized antenna array in the 1st row and the 3rd column and the polarized antenna array in the 1st row and the 5th column, and so on, the N / 2th polarized antenna array pair among the multiple polarized antenna array pairs includes the polarized antenna array in the 1st row and the N-1th column and the polarized antenna array in the 2nd row and the Nth column, and so on.

5. The method according to claim 4, characterized in that The multiple polarized antenna array pairs are M polarized antenna array pairs, M is an integer greater than 1, and for the xth polarized antenna array pair and the x+1th polarized antenna array pair among the M polarized antenna array pairs, x is an integer ranging from 1 to M-1; the two polarized antenna array pairs included in the xth polarized antenna array pair are, in order, a first polarized antenna array and a second polarized antenna array according to the preset traversal order, and the two polarized antenna array pairs included in the x+1th polarized antenna array pair are, in order, the second polarized antenna array and a third polarized antenna array according to the preset traversal order; The control device controls the hot pressing device to perform the high-temperature hot pressing forming operation at the position of each polarized antenna array pair in the plurality of polarized antenna array pairs in sequence according to the preset traversal order, including: At the beginning of the first time period, the control device traverses to the xth polarized antenna array pair according to the preset traversal order; The control device controls the thermal compression device to uniformly increase the temperature at the position of the first polarized antenna element from a first temperature to a second temperature within the first time period; At the beginning of the second time period, the control device traverses to the x+1th polarized antenna array pair according to the preset traversal order; The control device controls the thermal pressing device to uniformly increase the temperature at the position of the first polarized antenna element from the second temperature to a third temperature within the second time period, and simultaneously controls the thermal pressing device to uniformly increase the temperature at the position of the second polarized antenna element from the first temperature to the second temperature within the second time period, and the end time of the first time period is the same as the start time of the second time period; The control device controls the hot pressing device to uniformly increase the temperature at the position of the second polarized antenna element from the second temperature to the third temperature within a third time period, and simultaneously controls the hot pressing device to uniformly increase the temperature at the position of the third polarized antenna element from the first temperature to the second temperature within the third time period, and the end time of the second time period is the same as the start time of the third time period.

6. The method according to claim 5, characterized in that The first temperature is 170°C, the second temperature is 185°C, and the third temperature is 200°C.

7. The method according to claim 3, characterized in that N is an even number greater than 2, the partially polarized antenna array includes a first partially polarized antenna array and a second partially polarized antenna array, the first partially polarized antenna array is located on a first diagonal of the N*N matrix, and the second partially polarized antenna array is located on a second diagonal of the N*N matrix; Correspondingly, in accordance with the preset traversal order, in the N*N matrix, the first polarized antenna array pair among the multiple polarized antenna array pairs located on the first diagonal line includes: the polarized antenna array in the 1st row and the 1st column and the polarized antenna array in the 2nd row and the 2nd column, the second polarized antenna array pair among the multiple polarized antenna array pairs located on the first diagonal line includes: the polarized antenna array in the 2nd row and the 2nd column and the polarized antenna array in the 3rd row and the 3rd column, and so on; the first polarized antenna array pair among the multiple polarized antenna array pairs located on the second diagonal line includes: the polarized antenna array in the 1st row and the Nth column and the polarized antenna array in the 2nd row and the N-1th column, the second polarized antenna array pair among the multiple polarized antenna array pairs located on the second diagonal line includes: the polarized antenna array in the 2nd row and the N-1th column and the polarized antenna array in the 3rd row and the N-3rd column, and so on.

8. The method according to claim 7, characterized in that The number of polarized antenna array pairs located on the first diagonal line or the second diagonal line among the multiple polarized antenna array pairs is M polarized antenna array pairs, where M is an integer greater than 1, and for the xth polarized antenna array pair and the x+1th polarized antenna array pair among the M polarized antenna array pairs, x is an integer ranging from 1 to M-1; the two polarized antenna array pairs included in the xth polarized antenna array pair are, in sequence, the first polarized antenna array and the second polarized antenna array according to the preset traversal order, and the two polarized antenna array pairs included in the x+1th polarized antenna array pair are, in sequence, the second polarized antenna array and the third polarized antenna array according to the preset traversal order; The control device controls the hot pressing device to perform the high-temperature hot pressing forming operation at the position of each polarized antenna array pair in the plurality of polarized antenna array pairs in sequence according to the preset traversal order, including: At the beginning of the first time period, the control device traverses to the xth polarized antenna array pair according to the preset traversal order; The control device controls the thermal compression device to uniformly increase the temperature at the position of the first polarized antenna element from a first temperature to a second temperature within the first time period; At the beginning of the second time period, the control device traverses to the x+1th polarized antenna array pair according to the preset traversal order; The control device controls the thermal pressing device to uniformly increase the temperature at the position of the first polarized antenna element from the second temperature to a third temperature within the second time period, and simultaneously controls the thermal pressing device to uniformly increase the temperature at the position of the second polarized antenna element from the first temperature to the second temperature within the second time period, and the end time of the first time period is the same as the start time of the second time period; The control device controls the hot pressing device to uniformly increase the temperature at the position of the second polarized antenna element from the second temperature to the third temperature within a third time period, and simultaneously controls the hot pressing device to uniformly increase the temperature at the position of the third polarized antenna element from the first temperature to the second temperature within the third time period, and the end time of the second time period is the same as the start time of the third time period.

9. The method according to claim 8, characterized in that The first temperature is 170°C, the second temperature is 185°C, and the third temperature is 200°C.

10. A temperature control system for array antenna molding using solid wax glue, characterized in that: The system includes a control device and a heat pressing device controlled by the control device, wherein the heat pressing device clamps a metal base and an array antenna, wherein the array antenna includes a plurality of polarized antenna array pairs, wherein a solid glue layer is coated between some of the polarized antenna arrays in the plurality of polarized antenna array pairs and the metal base, and the system is configured as follows: The control device determines the positional proximity relationship between the partially polarized antenna elements according to the positions of the partially polarized antenna elements in the plurality of polarized antenna element pairs; The control device controls the hot pressing device to perform high-temperature hot pressing operations at the position of each polarized antenna array in the partially polarized antenna array in turn according to the positional proximity relationship between the partially polarized antenna arrays. The high-temperature hot pressing operations are used to bond the partially polarized antenna array to the metal base through the solid glue layer.

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