Multi-protocol compatible semiconductor device communication system
By designing a multi-protocol compatible semiconductor equipment communication system that can convert between SECS-I and SECS-II protocols and has automatic fault diagnosis and prediction functions, it solves the problem of communication incompatibility and fault diagnosis in the semiconductor equipment manufacturing process. It solves difficult problems, achieves efficient and stable data transmission and fault prediction, and significantly reduces the difficulty of equipment upgrades and system integration.
Patent Information
- Application Number
- CN202411538987.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-31
- Publication Date
- 2025-01-21
AI Technical Summary
During the manufacturing process of semiconductor equipment, old equipment only supports the SECS-I protocol, while new equipment moves to the SECS-II protocol, resulting in communication incompatibility, increasing the complexity of system integration and the limitations of device automation upgrades. Existing protocol conversion devices have problems such as poor communication stability, delay in data transmission and difficulty in troubleshooting.
Design a multi-protocol compatible semiconductor equipment communication system that can be converted between the SECS-I and SECS-II protocols, supports multiple communication interfaces, and has automatic fault diagnosis and predictive functions. The system implements protocol conversion and fault diagnosis through the first communication module, the second communication module, the configuration module, and the test module, and uses the diagram neural network, transformer network, meta learning, strengthening learning and automation machine learning technology for fault prediction and communication optimization.
The protocol conversion and compatibility communication between different equipment has been realized, and the problem of incompatibility between the agreement between the old equipment and the new equipment is solved, reducing the difficulty of equipment upgrades and system integration, and reducing the cost of hardware. Through real -time monitoring of the dynamic buffer mechanism and communication status, the data packet loss rate and communication errors are significantly reduced, and the stability and efficiency of data transmission are improved. The accuracy of fault prediction reaches 96.5%, which significantly improves the reliability and operating efficiency of the system.
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Abstract
Description
Technical Field
[0001] The present invention relates to the field of semiconductor device communication technology, and in particular to a multi-protocol compatible semiconductor device communication system and remote communication function testing of various instruments in the semiconductor industry during the packaging and testing phase. Background Art
[0002] The manufacturing process of semiconductor equipment relies on real-time communication between various automated equipment. Currently, SECS-I and SECS-II are the two most common communication protocols in the semiconductor industry, using serial interfaces and TCP / IP protocols respectively. However, as equipment is updated and iterated, old equipment usually only supports the SECS-I protocol, while new equipment gradually turns to the SECS-II protocol, which often leads to communication incompatibility problems during the integration process. In addition, the SECS-I protocol has a slow transmission speed and limited communication distance, and although SECS-II supports more efficient network transmission, there are compatibility issues in its application on old equipment. This phenomenon that new and old equipment cannot communicate seamlessly increases the complexity of system integration and limits the automation upgrade of semiconductor manufacturing equipment.
[0003] Although there are some protocol conversion devices on the market to solve the problem of multi-protocol communication, these devices generally have problems such as poor communication stability, data transmission delays, and difficult fault diagnosis. Due to the different communication protocols and interface types used by different devices, it is difficult for protocol converters to ensure stable two-way data exchange in actual operation. In addition, data delays often occur during multi-protocol conversion, which seriously affects real-time control and data analysis of production. This unstable communication environment not only reduces production efficiency, but also increases the difficulty of equipment maintenance, affecting the overall automation level of the enterprise.
[0004] In addition, existing equipment usually only supports the conversion of a single protocol and cannot flexibly switch between multiple protocols. Therefore, when multiple devices need to be integrated at the same time, companies often need to configure independent protocol converters for each device, which not only increases hardware costs, but also brings complexity to management and maintenance. With the continuous development of semiconductor manufacturing equipment, the industry urgently needs a communication system that is compatible with multiple protocols and provides efficient and stable data transmission to reduce integration costs and improve system compatibility and automation levels. Summary of the invention
[0005] In order to solve the problems of protocol compatibility, poor communication stability, data transmission delay, and insufficient multi-protocol support, the present invention provides a multi-protocol compatible semiconductor equipment communication system, which can convert between different communication protocols such as SECS-I and SECS-II, support multiple communication interfaces, and realize the interconnection and interoperability of equipment. In addition, the system has automatic fault diagnosis and prediction functions, can monitor the communication status and adjust parameters in real time during the communication process, and ensure the stability and security of data transmission.
[0006] In order to achieve the above object, the present invention is implemented by the following technical solutions:
[0007] A multi-protocol compatible semiconductor device communication system, comprising:
[0008] A first communication module, used for performing data communication with the semiconductor device according to a first protocol;
[0009] A second communication module, used for performing data communication with the semiconductor device according to a second protocol;
[0010] A configuration module, used for selecting the first protocol or the second protocol and converting between different protocols;
[0011] Test module, used for equipment communication configuration, communication testing, command sending, communication status monitoring and fault diagnosis.
[0012] Preferably, the first protocol is the SECS-I protocol, and the second protocol is the SECS-II protocol.
[0013] Preferably, the first communication module communicates with the semiconductor device through a serial port interface, the serial port interface includes a DP9 interface or a DP25 interface, uses an RS232 transmission layer to implement data transmission, and relies on hardware-controlled timing control, wherein the communication process of the SECS-I protocol includes the following steps:
[0014] The master device initiates a request, the slave device replies with a ready-to-receive status, the master device sends data, and the slave device confirms the reception result;
[0015] If a master-slave relationship exists, the communication direction is determined based on the master-slave relationship.
[0016] Preferably, the second communication module communicates with the semiconductor device through a network interface, the network interface is an RJ45 interface, the HSMS protocol is used to realize data transmission, and no timing control is required, and bidirectional data transmission is supported; the SECS-II protocol is implemented through the HSMS protocol based on TCP / IP, using byte stream transmission form, and the data processing flow includes data encapsulation, byte stream unpacking, and status feedback confirmation steps to ensure real-time data transmission and support device status feedback.
[0017] Preferably, the configuration module implements serial port to network port conversion through additional hardware to achieve network communication of serial port devices based on RS232. The additional hardware is a serial port to network port converter, which can convert serial port signals into network signals and ensure signal stability.
[0018] Preferably, the test module includes:
[0019] Configuration unit, used to set communication parameters, protocol type and device connection information;
[0020] The test unit is used to send communication commands and receive device responses, supporting the command interaction process;
[0021] The log unit is used to record the communication log, including the instructions and response information during the communication process, including the sending time, receiving status, execution result and response time of each instruction, including communication log and error log, which are used for fault analysis;
[0022] Fault diagnosis unit, used to analyze log records, detect and diagnose faults in communication, and automatically identify communication anomalies.
[0023] Preferably, the fault diagnosis unit includes a fault prediction model, which is implemented by the following steps:
[0024] Step 1: Automatically collect multi-source data from the equipment's operating status, historical fault records, communication logs, and sensor data, and clean and standardize the data. The data cleaning process includes outlier detection, missing value filling, and noise data filtering.
[0025] Step 2: Use graph neural network (GNN) to model the dependency relationship between devices and communication modules. By aggregating the features of each node and its neighboring nodes, global and local dependency features are extracted. Each node represents a communication module of a device, and the neighboring nodes represent the devices that directly interact with the module. The dependency relationship reflects the communication status and dependency between different devices.
[0026] Step 3: Process the device’s time series data through a transformer network, use the self-attention mechanism to capture long-range dependencies in the sequence, predict communication interruptions or delays that may occur in the long-term operation of the device, and dynamically adjust the device’s communication parameters based on the prediction;
[0027] Step 4: Optimize the initial parameters of the model through Meta-learning technology, so that the model can quickly adapt and converge when facing different devices and communication protocols, and dynamically adjust the communication strategy according to the changes in the device communication protocol to reduce the retraining time;
[0028] Step 5: Through the reinforcement learning method, dynamically adjust the communication parameters and device operation parameters according to the real-time operation status of the device. Specifically, when the device load increases, automatically adjust the communication bandwidth, data packaging rate and retransmission mechanism to ensure the stability and real-time performance of communication.
[0029] Step 6: Use the automated machine learning (AutoML) module to automatically adjust the hyperparameters of the fault prediction model to optimize the real-time fault prediction capability of the communication system, and automatically adjust the communication frequency, signal strength, and retransmission strategy of the device based on the model prediction results to reduce the possibility of faults.
[0030] Step 7: The fault prediction model monitors the real-time operating status of the equipment and automatically adjusts the operating parameters and communication strategies of the equipment based on the prediction results to prevent the occurrence of potential faults. When a fault prediction occurs, the operator is notified through the communication module of the equipment to start the fault handling procedure of communication recovery or equipment restart.
[0031] Preferably, the fault prediction model of the fault diagnosis unit is implemented by the following algorithm formula and optimized in combination with the communication process of the device:
[0032] The graph neural network (GNN) node feature update formula is:
[0033]
[0034] in, is the feature vector of node v at the k+1th layer; is the set of neighbor nodes of node v; and are the learnable weight matrices of the kth layer; σ is the activation function; Norm is the normalization operation used to maintain the stability of model training;
[0035] Each node v represents a communication module of a device, the dependencies between nodes represent the communication links between different devices, and the feature vector update is used to identify potential bottlenecks in the communication links;
[0036] The formula of the self-attention mechanism is:
[0037]
[0038] Among them, Q is the query matrix after the input data is linearly transformed; K is the key matrix after the input data is linearly transformed; V is the value matrix after the input data is linearly transformed; is the dimension of the key matrix K; is the dot product of the query matrix Q and the key matrix K, which represents the similarity between the two matrices and is used to calculate the correlation between different positions; softmax is a normalization function that converts the dot product result into a probability distribution for generating attention weights; V is a value matrix, which generates the final attention output after weighted summation;
[0039] Through this mechanism, the remote dependencies in the device communication link are predicted, and the link blocking and data loss problems that may occur during long-term communication operation are identified;
[0040] The meta-learning parameter update formula is:
[0041]
[0042] Among them: θ is the initial parameter of the model; α is the inner layer learning rate; L is the loss function; θ′ is the model parameter after one task update;
[0043] The Q value update formula for reinforcement learning is:
[0044]
[0045] in, Status and actions Q value; is the immediate reward obtained at the current step; α is the learning rate; γ is the discount factor, which is used to weigh the importance of current rewards and future rewards;
[0046] The formula for automated hyperparameter optimization is:
[0047]
[0048] in, To calculate the expected value of input x and target output y on the data set D; The model with hyperparameter λ is used to predict the input x; is the loss function, which measures the model prediction value The gap between the target output y; To find the hyperparameter combination that minimizes the loss function.
[0049] Preferably, the system supports network connection and device communication by setting IP addresses and ports, and the communication instructions are composed of instruction length, instruction header and instruction body, and the instruction header includes device ID, instruction group and specific instructions.
[0050] Preferably, the device communication process includes multiple instructions, including: instruction S1F1 for verifying device communication, instruction S1F3 for obtaining SVID, instruction S5F1 for device alarm reporting, instruction S6F11 for device event reporting, instruction S1F4 for device status reporting, and instruction S2F41 for device reset.
[0051] The present invention relates to a multi-protocol compatible semiconductor equipment communication system, which aims to solve the problems of poor compatibility and insufficient communication stability between different communication protocols (such as SECS-I and SECS-II protocols) in the prior art. Through the present invention, the system can support two commonly used protocols, SECS-I and SECS-II, and use the HSMS (High-Speed Message Services) protocol to encapsulate the communication of SECS-II to achieve high-speed data transmission and two-way communication. In addition, the system supports multiple communication modes, such as SECS / COM (serial communication mode) and SECS / TCP (network communication mode), and can communicate with semiconductor equipment through a serial port or a TCP / IP network, thereby improving the flexibility and compatibility of the system.
[0052] The device in the present invention uniquely identifies and interacts with instructions through fields such as DeviceId, Stream, Function, and MessageId, ensuring that the device can efficiently and accurately transmit data in a complex manufacturing environment. The system also has a retransmission mechanism that can automatically start the retransmission process when the instruction is not successfully transmitted, ensuring the integrity and reliability of communication.
[0053] Compared with the prior art, the beneficial effects of the present invention are as follows: the present invention supports two commonly used semiconductor device communication protocols, SECS-I and SECS-II, and can realize protocol conversion and compatible communication between different devices, solving the problem of protocol incompatibility between old and new devices. This not only reduces the difficulty of equipment upgrade and system integration, but also reduces the hardware cost required by enterprises to adapt to the communication needs of different devices. Compared with the prior art, the present invention significantly reduces the packet loss rate and communication errors through a dynamic buffer mechanism and real-time monitoring of communication status. Experiments show that the multi-protocol compatible system of the present invention reduces the packet loss rate to 0.02%, the number of transmission errors to 0.1 times per hour, and the stability of communication is significantly better than the existing single-protocol device communication system. While achieving protocol compatibility, the present invention ensures the high efficiency of data transmission. On the basis of the SECS-II protocol, by optimizing the mechanisms of data encapsulation, byte stream unpacking and network transmission, the maximum transmission rate is close to the theoretical value of the SECS-II protocol, reaching 890KB / s, which hardly affects the data transmission efficiency. However, traditional protocol conversion equipment usually produces significant transmission delay and speed reduction due to protocol conversion. The semiconductor equipment communication system in the prior art usually relies on manual intervention for fault diagnosis, which easily leads to long downtime and low efficiency. The present invention introduces a fault diagnosis and prediction module, which can automatically identify communication faults according to the communication log and sensor data of the equipment, and adjust the communication parameters of the equipment in real time to prevent the occurrence of faults. The fault prediction accuracy reaches 96.5%, which significantly improves the reliability and operation efficiency of the system. The multi-protocol compatible system of the present invention can achieve fast switching between SECS-I and SECS-II protocols, and the conversion time is controlled within 40 milliseconds. This performance has not been achieved in the prior art. The protocol converter in the prior art usually takes a long time to switch protocols, which affects the real-time communication requirements of the equipment, and the present invention effectively solves this problem. The present invention reduces the risk of manual intervention and system downtime through automated fault diagnosis, protocol compatibility and communication optimization functions, thereby reducing equipment maintenance costs. In addition, the system's integrated multi-protocol compatibility function reduces the company's dependence on external hardware devices (such as independent protocol converters), further reducing hardware procurement and management costs. BRIEF DESCRIPTION OF THE DRAWINGS
[0054] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative labor. Among them:
[0055] Figure 1 A schematic diagram of the overall structure of a system according to an embodiment of the present invention; Figure 2This is a schematic diagram of the SECS-I protocol communication process in an embodiment of the present invention; Figure 3 This is a schematic diagram of the SECS-II protocol communication process in an embodiment of the present invention;
[0056] Figure 4 This is a flow chart of instruction interaction in an embodiment of the present invention. DETAILED DESCRIPTION
[0057] In order to make the purpose, technical solution and advantages of the embodiment of the present invention clearer, the technical solution of the embodiment of the present invention will be clearly and completely described below in conjunction with the drawings of the embodiment of the present invention. Obviously, the described embodiment is a part of the embodiment of the present invention, not all of the embodiments. Based on the described embodiment of the present invention, all other embodiments obtained by ordinary technicians in this field belong to the scope of protection of the present invention.
[0058] Example 1
[0059] like Figure 1 FIG. 1 is an embodiment of the present invention, which provides a multi-protocol compatible semiconductor device communication system, including:
[0060] A first communication module, used for performing data communication with the semiconductor device according to a first protocol;
[0061] Furthermore, the first protocol is the SECS-I protocol, and the second protocol is the SECS-II protocol.
[0062] Specifically, the first communication module communicates with the semiconductor device through a serial port interface, the serial port interface includes a DP9 interface or a DP25 interface, uses an RS232 transmission layer to implement data transmission, and relies on hardware-controlled timing control, wherein the communication process of the SECS-I protocol includes the following steps:
[0063] The master device initiates a request, the slave device replies with a ready-to-receive status, the master device sends data, and the slave device confirms the reception result;
[0064] If a master-slave relationship exists, the communication direction is determined based on the master-slave relationship.
[0065] Further, a second communication module is used to perform data communication with the semiconductor device according to a second protocol;
[0066] Specifically, the second communication module communicates with the semiconductor device through a network interface, and the network interface is an RJ45 interface. The HSMS protocol is used to realize data transmission, and no timing control is required, and bidirectional data transmission is supported; the SECS-II protocol is implemented through the HSMS protocol based on TCP / IP, and adopts the byte stream transmission form. The data processing process includes data encapsulation, byte stream unpacking, and status feedback confirmation steps to ensure real-time data transmission and support device status feedback.
[0067] Further, a configuration module is used to select the first protocol or the second protocol and convert between different protocols;
[0068] Specifically, the configuration module implements serial port to network port conversion through additional hardware to achieve network communication of serial port devices based on RS232. The additional hardware is a serial port to network port converter, which can convert serial port signals into network signals and ensure signal stability.
[0069] Furthermore, the test module is used for equipment communication configuration, communication testing, command sending, communication status monitoring and fault diagnosis.
[0070] Specifically, the test module includes:
[0071] Configuration unit, used to set communication parameters, protocol type and device connection information;
[0072] The test unit is used to send communication commands and receive device responses, supporting the command interaction process;
[0073] The log unit is used to record the communication log, including the instructions and response information during the communication process, including the sending time, receiving status, execution result and response time of each instruction, including communication log and error log, which are used for fault analysis;
[0074] Fault diagnosis unit, used to analyze log records, detect and diagnose faults in communication, and automatically identify communication anomalies.
[0075] Furthermore, the fault diagnosis unit includes a fault prediction model, which is implemented by the following steps:
[0076] Step 1: Automatically collect multi-source data from the equipment's operating status, historical fault records, communication logs, and sensor data, and clean and standardize the data. The data cleaning process includes outlier detection, missing value filling, and noise data filtering.
[0077] Step 2: Use graph neural network (GNN) to model the dependency relationship between devices and communication modules. By aggregating the features of each node and its neighboring nodes, global and local dependency features are extracted. Each node represents a communication module of a device, and the neighboring nodes represent the devices that directly interact with the module. The dependency relationship reflects the communication status and dependency between different devices.
[0078] Step 3: Process the device’s time series data through a transformer network, use the self-attention mechanism to capture long-range dependencies in the sequence, predict communication interruptions or delays that may occur in the long-term operation of the device, and dynamically adjust the device’s communication parameters based on the prediction;
[0079] Step 4: Optimize the initial parameters of the model through Meta-learning technology, so that the model can quickly adapt and converge when facing different devices and communication protocols, and dynamically adjust the communication strategy according to the changes in the device communication protocol to reduce the retraining time;
[0080] Step 5: Through the reinforcement learning method, dynamically adjust the communication parameters and device operation parameters according to the real-time operation status of the device. Specifically, when the device load increases, automatically adjust the communication bandwidth, data packaging rate and retransmission mechanism to ensure the stability and real-time performance of communication.
[0081] Step 6: Use the automated machine learning (AutoML) module to automatically adjust the hyperparameters of the fault prediction model to optimize the real-time fault prediction capability of the communication system, and automatically adjust the communication frequency, signal strength, and retransmission strategy of the device based on the model prediction results to reduce the possibility of faults.
[0082] Step 7: The fault prediction model monitors the real-time operating status of the equipment and automatically adjusts the operating parameters and communication strategies of the equipment based on the prediction results to prevent the occurrence of potential faults. When a fault prediction occurs, the operator is notified through the communication module of the equipment to start the fault handling procedure of communication recovery or equipment restart.
[0083] Furthermore, the fault prediction model of the fault diagnosis unit is implemented by the following algorithm formula and optimized in combination with the communication process of the device:
[0084] The graph neural network (GNN) node feature update formula is:
[0085]
[0086] in, is the feature vector of node v at the k+1th layer; is the set of neighbor nodes of node v; and are the learnable weight matrices of the kth layer; σ is the activation function; Norm is the normalization operation used to maintain the stability of model training;
[0087] Each node v represents a communication module of a device, the dependencies between nodes represent the communication links between different devices, and the feature vector update is used to identify potential bottlenecks in the communication links;
[0088] The formula of the self-attention mechanism is:
[0089]
[0090] Among them, Q is the query matrix after the input data is linearly transformed; K is the key matrix after the input data is linearly transformed; V is the value matrix after the input data is linearly transformed; is the dimension of the key matrix K; is the dot product of the query matrix Q and the key matrix K, which represents the similarity between the two matrices and is used to calculate the correlation between different positions; softmax is a normalization function that converts the dot product result into a probability distribution for generating attention weights; V is a value matrix, which generates the final attention output after weighted summation;
[0091] Through this mechanism, the remote dependencies in the device communication link are predicted, and the link blocking and data loss problems that may occur during long-term communication operation are identified;
[0092] The meta-learning parameter update formula is:
[0093]
[0094] Among them: θ is the initial parameter of the model; α is the inner layer learning rate; L is the loss function; θ′ is the model parameter after one task update;
[0095] The Q value update formula for reinforcement learning is:
[0096]
[0097] in, Status and actions Q value; is the immediate reward obtained at the current step; α is the learning rate; γ is the discount factor, which is used to weigh the importance of current rewards and future rewards;
[0098] The formula for automated hyperparameter optimization is:
[0099]
[0100] in, To calculate the expected value of input x and target output y on the data set D; The model with hyperparameter λ is used to predict the input x; is the loss function, which measures the model prediction value The gap between the target output y; To find the hyperparameter combination that minimizes the loss function.
[0101] Furthermore, the system supports network connection and device communication by setting IP addresses and ports, and the communication instructions are composed of instruction length, instruction header and instruction body, and the instruction header includes device ID, instruction group and specific instructions.
[0102] Furthermore, the device communication process includes multiple instructions, including: an instruction for verifying device communication (S1F1), an instruction for obtaining SVID (S1F3), an instruction for reporting device alarms (S5F1), an instruction for reporting device events (S6F11), and an instruction for reporting device status (S1F4), and an instruction for resetting the device (S2F41).
[0103] Example 2
[0104] like Figure 2 As shown, this embodiment details the communication process of SECS-I and SECS-II protocols in a multi-protocol compatible semiconductor device communication system. The SECS-I protocol is mainly transmitted through a serial interface, and its timing control is crucial to the stability of communication. This system monitors the sending and receiving status of data packets in real time through a timing controller to ensure that when data packets are lost or the timing is misaligned, the automatic retransmission mechanism can be triggered, thereby ensuring data integrity and communication continuity.
[0105] The SECS-II protocol uses TCP / IP protocol for data transmission and HSMS (High-Speed Message Services) for data encapsulation and decapsulation. While realizing two-way data communication, this system adopts a dynamic buffer mechanism to adjust the data flow in high concurrency to avoid data congestion or delay. In the actual communication process, the system can automatically detect network delays and adjust the data transmission rate according to the delay to ensure real-time performance.
[0106] Example 3
[0107] like Figure 3 As shown, in this embodiment, the communication process of the SECS-II protocol and the composition of its data packet are described in detail, including the detailed composition of the Head part and the Body part.
[0108] 1. SECS-II protocol communication process
[0109] The SECS-II protocol uses the TCP / IP network interface for bidirectional data transmission and the HSMS (High-Speed Message Services) protocol for data encapsulation and decapsulation. The communication process between devices includes data encapsulation, transmission, decapsulation, and status confirmation to ensure real-time data transmission and feedback on device status.
[0110] 2. Data packet structure The data packet of the SECS-II protocol is mainly composed of the Head part and the Body part:
[0111] Head composition: The Head part is used to transmit the control information of the data packet and contains the following fields:
[0112] DeviceId: Device ID, used to identify the device involved in communication.
[0113] Stream: Instruction group, indicating the instruction stream to which the data packet belongs.
[0114] Function: a specific instruction, indicating a specific operation. "S" indicates the instruction initiated by the master device, and "F" indicates the response of the slave device.
[0115] MessageId: A unique identifier for the command, used to distinguish different communication sessions.
[0116] For example, the Head part of the SECS-II protocol data packet may contain device ID, command group, function number and message ID. The device ID is used to identify the device involved in the communication, the command group and function number identify the operation category and specific command of the data packet respectively, and the message ID ensures the uniqueness of different communication sessions.
[0117] 3. Body composition
[0118] The Body part carries the actual data content, and its structure is divided into the following types:
[0119] List: It is used to store different types of data collections.
[0120] Integer: used to store numeric data, including unsigned integers and floating-point numbers.
[0121] String: used to store character data in ASCII encoding format.
[0122] For example, the Body section can contain the following types of data:
[0123] The string "Zifuchuan" indicates the text message sent by the device;
[0124] The number 100 indicates the device status value;
[0125] Unsigned integer 0, indicating some device parameter;
[0126] The floating point number 3.14 represents the measurement result of the device.
[0127] Through the collection structure, these different types of data can be stored and transmitted simultaneously, ensuring efficient and accurate information exchange between devices.
[0128] 4. Complete communication process During the communication process of the SECS-II protocol, the master device sends a data packet containing Head and Body through the network, and the slave device receives and parses it. The Head part is used to ensure that the device correctly identifies the source of the data packet and the communication instructions, and the Body part carries the actual operation data of the communication. After each communication is completed, the device will also feedback status information through the network to ensure the integrity and accuracy of data transmission.
[0129] Example 4
[0130] like Figure 4 As shown, in this embodiment, the system communicates with the semiconductor device through the SECS-II protocol. The communication process includes the sending, receiving and confirmation of device instructions. In order to ensure the integrity and efficiency of communication, this system adopts a detailed instruction interaction process to ensure that the instruction is confirmed by the device after sending and to handle the errors that occur during the transmission process accordingly.
[0131] The following will describe the command interaction process of this system in detail and further explain each step of the process.
[0132] Instruction interaction process
[0133] The instruction interaction process can be divided into two main parts: the instruction sending part and the instruction receiving and confirmation part.
[0134] Sending instructions
[0135] The master device sends a command request to the slave device. This command contains the device ID, the Stream and Function fields of the data packet, which are used to identify the initiated command.
[0136] During the instruction sending process, the master device will monitor to ensure that the instruction reaches the slave device smoothly.
[0137] If no response is received from the slave device within the specified time, the system will trigger the retransmission mechanism and resend the command to ensure the integrity of data transmission.
[0138] Receipt and confirmation
[0139] After receiving the instruction, the sub-device first parses the Head part of the data packet and extracts the DeviceId, Stream and Function information of the instruction.
[0140] After the data parsing is completed, the slave device will send a confirmation message to the master device, indicating that the command has been successfully received. At this time, the master device will stop the retransmission mechanism and consider the command to have been successfully transmitted.
[0141] If the slave device cannot successfully receive the command, or an error occurs during the reception process, the slave device will send a failure message to the master device, triggering the master device to resend the command.
[0142] Exception handling and retransmission mechanism
[0143] When the master device does not receive confirmation information from the slave device within the specified time, the system will trigger the retransmission mechanism and send the instruction again.
[0144] If the confirmation is not successfully received after multiple retransmissions, the system will record the communication error and notify the operator for manual intervention.
[0145] Figure 4 The complete flow of command interaction is shown, including the sending, receiving, confirming and retransmitting of commands. The command processing logic of the present invention in device communication can be more intuitively understood through this figure.
[0146] Sending part: The process starts from the left side. After the master device sends the command, it enters the listening state and waits for the response of the slave device.
[0147] Receiving and confirming part: When the sub-device receives the instruction, it will parse and feedback the confirmation message. If the instruction is received successfully, the process enters the normal end state.
[0148] Exception handling part: If no response is received within the specified time or a transmission error occurs, the process will enter the retransmission mechanism to ensure the complete transmission of the instruction.
[0149] Example 5
[0150] This embodiment introduces the specific process of achieving compatible communication between old equipment and new equipment through a serial port to network port device. The system achieves seamless communication of different protocols through a signal converter between the serial port (SECS-I) and the network port (SECS-II). The signal converter includes a high-speed data buffer module that can cache and integrate the signals received from the serial port to ensure that the signal maintains integrity and smoothness when converted to network port data.
[0151] The system first sets the communication parameters of the serial port and the network port, including the baud rate, data bit, stop bit, check mode of the serial port, and the IP address and port number of the network port. Next, the device connection test is performed to detect the communication between the devices by sending test data packets. If signal distortion or data packet loss is detected, the system will automatically adjust the communication parameters of the serial port and the network port to ensure the accuracy of data transmission. During the test, the system can also check each frame of data to ensure that each transmitted data can be correctly parsed and processed.
[0152] Example 6
[0153] In order to verify the beneficial effects of the multi-protocol compatible semiconductor device communication system of the present invention in practical applications, experimental tests were carried out to simulate the communication conditions of semiconductor devices under SECS-I and SECS-II protocols, and to evaluate the system's performance in terms of data transmission speed, communication stability, fault prediction accuracy, and protocol conversion time.
[0154] Experimental environment:
[0155] Device A: An old semiconductor device that supports the SECS-I protocol and uses RS232 serial port communication.
[0156] Device B: A modern semiconductor device that supports the SECS-II protocol and uses TCP / IP network communication.
[0157] Multi-protocol compatible communication system: Use a multi-protocol converter between device A and device B to achieve data communication and monitor the communication status in real time.
[0158] Test indicators:
[0159] Communication stability: Monitor the packet loss rate and number of transmission errors during the test.
[0160] Data transmission speed: measures the maximum transmission volume per second under SECS-I and SECS-II protocols respectively.
[0161] Fault prediction accuracy: The system predicts faults based on historical data and sensor information and records the accuracy of the predictions.
[0162] Protocol conversion time: Measures the time it takes the system to switch between SECS-I and SECS-II protocols.
[0163] Experimental data:
[0164]
[0165] Experimental results analysis:
[0166] Communication stability:
[0167] SECS-I protocol: Due to the use of serial communication, the packet loss rate of data transmission is high (1.5%), and the number of transmission errors reaches 5 times / hour. Although this protocol can meet basic device communication, it is prone to instability during high concurrency or long-distance transmission.
[0168] SECS-II protocol: Through TCP / IP network communication, the packet loss rate is significantly reduced to 0.08%, and the number of transmission errors is reduced to 0.5 times / hour, indicating that it performs better in data transmission speed and stability.
[0169] Multi-protocol compatible system: The system further optimizes the stability of data transmission during the protocol conversion process, with a packet loss rate of only 0.02% and the number of transmission errors reduced to 0.1 times / hour, demonstrating the system's excellent performance.
[0170] Data transfer speed:
[0171] SECS-I protocol: Limited by the physical bandwidth of the RS232 interface, the maximum data transmission rate is 115KB / s, which is much lower than modern network communications.
[0172] SECS-II protocol: Through high-speed data transmission based on TCP / IP, it can reach a transmission rate of 920KB / s, which is suitable for efficient transmission of large amounts of data.
[0173] Multi-protocol compatible system: Achieve seamless conversion of data streams between SECS-I devices and SECS-II devices, with a maximum transmission rate of 890KB / s, slightly lower than directly using the SECS-II protocol, but still maintaining efficient data exchange capabilities.
[0174] Fault prediction accuracy:
[0175] The multi-protocol compatible system predicts possible future communication problems through log analysis, sensor data and historical fault information, with a fault prediction accuracy of 96.5%, showing that the system can effectively prevent and reduce potential faults.
[0176] Protocol conversion time:
[0177] The system's conversion time between SECS-I and SECS-II protocols is 40 milliseconds, which hardly affects real-time communication, indicating that the system has extremely high protocol switching efficiency.
[0178] The experimental results show that the multi-protocol compatible semiconductor device communication system of the present invention has significant advantages in data transmission stability, transmission speed and fault prediction ability. In particular, during the protocol conversion process, the system can significantly reduce data loss and transmission errors, improve transmission efficiency, and can quickly switch between protocols, effectively solving the communication compatibility problem in the prior art.
[0179] In summary, the multi-protocol compatible semiconductor device communication system of the present invention shows significant beneficial effects in many aspects: First, the communication compatibility is significantly improved. The present invention supports two mainstream communication protocols, SECS-I and SECS-II, and solves the problem of protocol incompatibility between old equipment and new equipment in existing semiconductor equipment communication. Through the multi-protocol compatible system, SECS-I and SECS-II devices can achieve seamless communication, avoiding the problem of enterprises needing to purchase additional protocol converters when integrating equipment, and greatly reducing the compatibility challenges brought about by equipment upgrades. Secondly, the stability and efficiency of data transmission are greatly improved. Experimental data show that the communication stability of the system of the present invention is extremely high, and the packet loss rate is reduced to 0.02%, which is significantly lower than the packet loss rate when SECS-I and SECS-II are running alone. At the same time, under high load and multi-device communication conditions, the present invention optimizes the data transmission flow through a dynamic buffer mechanism, and the maximum data transmission rate is close to 920KB / s of the SECS-II protocol, ensuring efficient data exchange between devices. In addition, the present invention also has automatic fault diagnosis and prediction functions. The fault diagnosis and prediction module integrated in the system can accurately predict possible faults that may occur during the device communication process by analyzing device logs and sensor data, with a fault prediction accuracy of 96.5%. The system can not only adjust the device communication parameters in time before the fault occurs, but also reduce system downtime and maintenance time, reducing the operation and maintenance costs of the equipment. At the same time, the system has the characteristics of fast protocol conversion. The conversion time between SECS-I and SECS-II protocols is only 40 milliseconds, ensuring the efficiency of protocol switching. Users will hardly perceive delays when switching between different protocols, greatly improving the interoperability between devices and the flexibility of the system. Finally, the present invention can also reduce system integration and maintenance costs. Through multi-protocol compatible design, the need for enterprises to configure protocol converters for each device is avoided. Regardless of the communication protocol used by the device, the system can support seamless communication between devices, thereby reducing hardware costs and the complexity of system management. In addition, the automatic fault diagnosis and prediction function further reduces manual maintenance costs and downtime risks.
[0180] In general, the multi-protocol compatible semiconductor device communication system of the present invention has not only achieved significant technical improvements in protocol compatibility, communication stability and data transmission speed, but also enhanced the intelligence level of the system through automatic fault diagnosis and prediction functions. In the context of frequent updates and replacements of modern semiconductor equipment and diversified communication protocols, the present invention provides an efficient, stable and widely applicable communication solution with extremely high market application value.
[0181] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine different embodiments or examples described in this specification and the features of different embodiments or examples, unless they are contradictory.
[0182] Any process or method description in the flow chart or otherwise described herein can be understood to represent a module, fragment or portion of a code including one or more executable instructions for implementing the steps of a specific logical function or process. And the scope of the preferred embodiment of the present application includes other implementations, in which the functions may not be performed in the order shown or discussed, including in a substantially simultaneous manner or in a reverse order according to the functions involved.
[0183] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of various changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.
Claims
1. A multi-protocol compatible semiconductor device communication system, characterized in that: include: A first communication module, used for performing data communication with the semiconductor device according to a first protocol; A second communication module, used for performing data communication with the semiconductor device according to a second protocol; A configuration module, used for selecting the first protocol or the second protocol and converting between different protocols; Test module, used for equipment communication configuration, communication testing, command sending, communication status monitoring and fault diagnosis.
2. The multi-protocol compatible semiconductor device communication system according to claim 1, characterized in that: The first protocol is the SECS-I protocol, and the second protocol is the SECS-II protocol.
3. The multi-protocol compatible semiconductor device communication system according to claim 1, characterized in that: The first communication module communicates with the semiconductor device through a serial port interface, the serial port interface includes a DP9 interface and a DP25 interface, uses an RS232 transmission layer to implement data transmission, and relies on hardware-controlled timing control, wherein the communication process of the SECS-I protocol includes the following steps: The master device initiates a request, the slave device replies with a ready-to-receive status, the master device sends data, and the slave device confirms the reception result; If a master-slave relationship exists, the communication direction is determined based on the master-slave relationship.
4. The multi-protocol compatible semiconductor device communication system according to claim 1, characterized in that: The second communication module communicates with the semiconductor device through a network interface, and the network interface is an RJ45 interface. The HSMS protocol is used to realize data transmission, and no timing control is required, and bidirectional data transmission is supported. The SECS-II protocol is implemented through the HSMS protocol based on TCP / IP, and adopts the byte stream transmission form. The data processing process includes data encapsulation, byte stream unpacking, and status feedback confirmation steps to ensure real-time data transmission and support device status feedback.
5. The multi-protocol compatible semiconductor device communication system according to claim 1, characterized in that: The configuration module realizes the conversion of serial port to network port through additional hardware, and realizes network communication of serial port devices based on RS232. The additional hardware is a serial port to network port converter, which can convert serial port signals into network signals and ensure signal stability.
6. The multi-protocol compatible semiconductor device communication system according to claim 1, characterized in that: The test module includes: Configuration unit, used to set communication parameters, protocol type and device connection information; The test unit is used to send communication commands and receive device responses, supporting the command interaction process; The log unit is used to record the communication log, including the instructions and response information during the communication process, including the sending time, receiving status, execution result and response time of each instruction, including communication log and error log, which are used for fault analysis; Fault diagnosis unit, used to analyze log records, detect and diagnose faults in communication, and automatically identify communication anomalies.
7. The multi-protocol compatible semiconductor device communication system according to claim 6, characterized in that: The fault diagnosis unit includes a fault prediction model, which is implemented by the following steps: Step 1: Automatically collect multi-source data from the equipment's operating status, historical fault records, communication logs, and sensor data, and clean and standardize the data. The data cleaning process includes outlier detection, missing value filling, and noise data filtering. Step 2: Use graph neural network (GNN) to model the dependency relationship between devices and communication modules. By aggregating the features of each node and its neighboring nodes, global and local dependency features are extracted. Each node represents a communication module of a device, and the neighboring nodes represent the devices that directly interact with the module. The dependency relationship reflects the communication status and dependency between different devices. Step 3: Process the device’s time series data through the transformer network, use the self-attention mechanism to capture the long-range dependencies in the sequence, predict the communication interruption or delay that may occur in the long-term operation of the device, and dynamically adjust the device’s communication parameters based on the prediction; Step 4: Optimize the initial parameters of the model through meta-learning technology, so that the model can quickly adapt and converge when facing different devices and communication protocols, and dynamically adjust the communication strategy according to the changes in the device communication protocol to reduce the retraining time; Step 5: Through reinforcement learning methods, dynamically adjust communication parameters and device operating parameters according to the real-time operating status of the device. Specifically, when the device load increases, automatically adjust the communication bandwidth, data packaging rate and retransmission mechanism to ensure the stability and real-time performance of communication. Step 6: Through the automated machine learning module, the hyperparameters of the fault prediction model are automatically adjusted to optimize the real-time fault prediction capability of the communication system. The communication frequency, signal strength, and retransmission strategy of the equipment are automatically adjusted according to the model prediction results to reduce the possibility of faults. Step 7: The fault prediction model monitors the real-time operating status of the equipment and automatically adjusts the operating parameters and communication strategies of the equipment based on the prediction results to prevent the occurrence of potential faults. When a fault prediction occurs, the operator is notified through the communication module of the equipment to start the fault handling procedure of communication recovery or equipment restart.
8. The multi-protocol compatible semiconductor device communication system according to claim 7, characterized in that: The fault prediction model of the fault diagnosis unit is implemented by the following algorithm formula and optimized in combination with the communication process of the device: The graph neural network node feature update formula is: in, is the feature vector of node v at the k+1th layer; is the set of neighbor nodes of node v; and are the learnable weight matrices of the kth layer respectively; is the activation function; Norm is the normalization operation, which is used to maintain the stability of model training; Each node v represents a communication module of a device, the dependencies between nodes represent the communication links between different devices, and the feature vector update is used to identify potential bottlenecks in the communication links; The formula of the self-attention mechanism is: Among them, Q is the query matrix after the input data is linearly transformed; K is the key matrix after the input data is linearly transformed; V is the value matrix after the input data is linearly transformed; is the dimension of the key matrix K; is the dot product of the query matrix Q and the key matrix K, which represents the similarity between the two matrices and is used to calculate the correlation between different positions; softmax is a normalization function that converts the dot product result into a probability distribution for generating attention weights; V is a value matrix, which generates the final attention output after weighted summation; Through this mechanism, the remote dependencies in the device communication link are predicted, and the link blocking and data loss problems that may occur during long-term communication operation are identified; The meta-learning parameter update formula is: Among them: θ is the initial parameter of the model; α is the inner layer learning rate; L is the loss function; θ′ is the model parameter after one task update; The Q value update formula for reinforcement learning is: in, Status and actions Q value; is the immediate reward obtained at the current step; α is the learning rate; γ is the discount factor, which is used to weigh the importance of current rewards and future rewards; the automatic hyperparameter optimization formula is: in, To calculate the expected value of input x and target output y on the data set D; The model with hyperparameter λ is used to predict the input x; is the loss function, which measures the model prediction value The gap between the target output y; To find the hyperparameter combination that minimizes the loss function.
9. The multi-protocol compatible semiconductor device communication system according to claim 1, characterized in that: The system supports network connection and device communication by setting IP addresses and ports. The communication instructions are composed of instruction length, instruction header and instruction body. The instruction header includes device ID, instruction group and specific instructions.
10. The multi-protocol compatible semiconductor device communication system according to claim 1, characterized in that: The device communication process includes multiple instructions, including: instruction S1F1 for verifying device communication, instruction S1F3 for obtaining SVID, instruction S5F1 for reporting device alarm, instruction S6F11 for reporting device event, instruction S1F4 for reporting device status, and instruction S2F41 for resetting device.
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