Multi-layer board automatic pre-overlapping device
By using robotic arms and CCD image sensors in the lamination process of multi-layer printed circuit boards, the automatic lamination of PP sheets and inner circuit boards is realized, which solves the problem of hot-melt bonding and improves production efficiency.
Patent Information
- Application Number
- CN202310886475.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-07-19
- Publication Date
- 2025-01-21
AI Technical Summary
The overlapping process of existing multi-layer printed circuit boards mainly relies on manual labor, and automated overlapping is difficult to overcome the hot melt bonding phenomenon between PP sheets, resulting in the inability to achieve single-piece material collection operations one by one.
A robotic arm is used instead of manual work to stack the plates, and the PP sheets are punched piece by piece to avoid hot melt adhesion. At the same time, a CCD image sensor is used to capture the image coordinates of the hole positions to ensure the positioning of the plate hole positions and the jig board. The pins automatically overlap.
It realizes the automated lamination of PP sheets and inner circuit boards, avoids hot-melt adhesion problems, improves production efficiency, and meets the needs of modern mass production.
Smart Images
Figure CN119342715A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to a plate stacking device, and more particularly to a multi-layer plate automatic pre-stacking device which uses a punching mechanism, a CCD image sensor and a mechanical arm to automatically stack a PP sheet, an inner layer circuit board and a fixture board to form a pre-stacking structure. Background Art
[0002] Printed circuit boards are indispensable materials in electronic products. As the demand for electronic products to be light, thin, short and small grows, multi-layer printed circuit boards have become the mainstream of the electronics industry. A multi-layer printed circuit board looks like a multi-layer cake. It is made by laminating the inner circuit board with the upper and lower PP sheets as insulation and then hot pressing them. The pre-laminated structure is as follows: Figure 1A to Figure 1B As shown, a jig plate 91 with a positioning pin 911 is a jig for stacking operations; an inner circuit board 92 with a circuit and a PP sheet 93 stacked on the upper and lower layers thereof as insulation need to be provided with an inner positioning hole 921 and an outer positioning hole 931 corresponding to the positioning pin 911, respectively; the stacking sequence is to place the jig plate 91 at the bottom layer, stack a PP sheet 93 (lower layer) upwards in sequence, then stack an inner circuit board 92 upwards, and then stack another PP sheet 93 (upper layer), and the stacked panels thus completed form a pre-stacked structure 94 (wherein the inner circuit boards 92 located at the upper and lower PP sheets 93, respectively, can be stacked in unlimited numbers according to the requirements of the circuit board, that is, a multi-layer board structure can be required).
[0003] Secondly, the stacking operation of the existing pre-stacked structure 94 is mostly performed manually, and the outer positioning holes 931 of the PP sheet 93 are pre-drilled in the stacked sheets, and then manually separated and stacked one by one. Figure 1C to Figure 1DAs shown in the figure; since the raw material of the PP sheet 93 contains resin, the accumulated heat of drilling will melt the resin therein at the edge of the hole of the outer positioning hole 931, resulting in the adhesion between the upper and lower sheets of the whole stack of PP sheets 93; however, this hot melt bonding phenomenon may not cause trouble for manual material removal (because manual material removal adopts the method of tearing off one sheet at a time and stacking one sheet at a time), but if automatic stacking is to be used instead, it is difficult to overcome the hot melt bonding phenomenon between the upper and lower sheets of the whole stack of PP sheets 93 with the current automatic machines, so that it is still impossible to automatically stack the PP sheets 93. The automated machine performs the single-piece material removal operation on the whole stack of PP sheets 93; however, the manual stacking of panels in the past can no longer meet the needs of modern mass production; therefore, if a robotic arm can be introduced to replace manual labor, and the drilling of the whole stack of PP sheets 93 is changed to single-piece punching to avoid hot-melt bonding between the panels, and a CCD image sensor is used to capture the image coordinates of the hole position, so that the positioning holes of the panel can coincide with the positioning pins of the jig plate, thereby achieving the effect of automated stacking, it has become a topic that the inventors want to actively work on. Summary of the invention
[0004] Therefore, the main purpose of the present invention is to provide a multi-layer board automatic pre-lamination device which can punch holes in PP sheets one by one and laminate them with inner layer circuit boards.
[0005] Another object of the present invention is to provide a multi-layer board automatic pre-stacking device that uses CCD to capture the image coordinates of the hole positions so that the board holes and the fixture plate positioning pins can automatically coincide with each other during the stacking process.
[0006] To achieve the above-mentioned purpose, the present invention provides an automatic pre-stacking device for multi-layer boards, which punches PP sheets one by one and automatically stacks them with at least one inner layer circuit board to form a pre-stacking structure; wherein the inner layer circuit board is pre-set with an inner positioning hole; and the automatic pre-stacking device comprises: a frame; three working areas, which are arranged adjacently in the X-axial area of the frame in sequence, including a PP sheet punching area, a plate stacking area and an inner layer board whole board area; the three working areas are sequentially placed with a punching platform, a stacking platform and an inner layer board whole board platform; two feeding areas, including a PP sheet placement area and an inner layer circuit board placement area, which are respectively arranged on the front sides of the PP sheet punching area and the inner layer board whole board area; a plurality of robotic arms, which at least include a feeding robotic arm and a stacking robotic arm, which are arranged in the X-axial direction of the frame. and Y-axis area, and performs the workpiece moving operation between the feeding area and the working area accordingly; the plurality of robotic arms respectively have displacement mechanisms and an adsorption mechanism in the X, Y, and Z axes; at least one punching mechanism is arranged in the PP sheet punching area, and is used to punch the PP sheet so that it has an external positioning hole; the punching mechanism includes a slide and a punching frame; and the punching platform has a vacuum suction function, which can adsorb and position the PP sheet; the slide is arranged below the punching platform, and has the displacement function in the X and Y axes; the punching frame is fixed above the slide, and is provided with a group of upper and lower corresponding upper punches and lower punches for punching the PP sheet; a controller is arranged on the frame, and is electrically connected to the plurality of robotic arms and the punching mechanism, and is used to control its actuation timing and drive-related instruction actions.
[0007] The present invention further provides a multi-layer board automatic pre-stacking device, which punches holes in PP sheets one by one, and automatically stacks them with a jig plate and at least one inner layer circuit board to form a pre-stacking structure; wherein the jig plate is preset with at least two positioning pins, and the inner layer circuit board is preset with inner positioning holes corresponding to the positioning pins; and the automatic pre-stacking device comprises: a frame; three feeding areas, which are sequentially and adjacently arranged in the X-axial area of the frame, including a PP sheet placement area, a jig plate placement area and an inner layer circuit board placement area; three working areas, which are sequentially and correspondingly arranged in the X-axial area of the frame, It is arranged at the rear side of the three feeding areas, including a PP sheet punching area, a plate stacking area and an inner layer plate whole plate area; and a finished product placement area, which is correspondingly arranged at the rear side of the plate stacking area; wherein the three working areas are sequentially placed with a punching platform, a stacking fixture whole plate platform and an inner layer plate whole plate platform; a plurality of robotic arms, which at least include a feeding robotic arm, a stacking robotic arm and a discharging robotic arm, are arranged in the X-axis and Y-axis areas of the frame, and are used to perform the workpiece moving operation between the feeding area, the working area and the finished product area; the The plurality of mechanical arms respectively have displacement mechanisms in the X, Y, and Z axes, and the feeding mechanical arm is provided with an adsorption mechanism, the overlapping mechanical arm is provided with an adsorption mechanism with a rotation function, and the discharging mechanical arm is provided with a clamping mechanism; at least one punching mechanism is arranged in the punching area of the PP sheet to punch the PP sheet so that it has an external positioning hole corresponding to the positioning pin; the punching mechanism includes a slide and a punching frame; and the punching platform has a vacuum suction function, which can adsorb and position the PP sheet; the slide is arranged below the punching platform, and has X, Y Axial displacement function; the punching frame is fixedly arranged above the slide, and is provided with a set of upper and lower punches corresponding to each other, for punching the PP sheet; a set of CCD image sensors is arranged above the adsorption mechanism of the stacking robot arm, for capturing the image coordinates including the positioning pins of the jig plate, the positioning holes outside the PP sheet and the positioning holes inside the inner circuit board; a controller is arranged on the frame, electrically connected to the plurality of robot arms, the punching mechanism and the CCD image sensor, so as to control the actuation timing and the driving-related instruction actions.
[0008] According to the above-mentioned features, the upper and lower punches of the punching mechanism in the present invention are respectively connected to a pneumatic cylinder so that they can move up and down. The upper punch is provided with a bushing and a punch needle, and the lower punch is provided with a support and a chip removal hole. When the punching operation is performed, the lower punch moves upward so that the support is placed on the PP sheet, and then the bushing of the upper punch and the punch needle move downward in conjunction, so that the bushing pre-presses the PP sheet, and the punch needle continues to punch downward to complete the punching, and the waste of the PP sheet is discharged from the chip removal hole of the lower punch. Furthermore, the bushing of the upper punch is provided with an air hole, which can be connected to an air pipe to introduce high-pressure air, and the punch needle is provided with a connected radial hole and axial hole, and the radial hole is connected to the air hole; when the punch needle punches down, the high-pressure air will blow from the outlet of the axial hole to the chip discharge hole, so that the waste of PP sheets can be discharged smoothly; at the same time, the high-pressure air will fill the gap between the bushing and the punch needle to prevent the waste of PP sheets and dust from entering the structure of the upper punch.
[0009] According to the aforementioned features, in the present invention, the stacking jig whole plate platform is provided with whole plate rods around it to carry out the whole plate operation of the jig plate, and the whole plate rods also have a buckling function to fix the jig plate, so that it is convenient for the stacking operation to be carried out; and the stacking whole plate platform is provided with grooves around it to facilitate the clamping mechanism of the discharging robot arm to penetrate under the groove to clamp the pre-stacked structure; in addition, the clamping mechanism of the discharging robot arm is provided with four claws, and each of the claws is driven by a cylinder to act synchronously to clamp the pre-stacked structure.
[0010] According to the aforementioned features, the jig plate placement area in the present invention can be used to place a trolley to place the jig plate, and a material placement slide is arranged on the frame of the jig plate placement area. A sensor is installed on its upper edge, and a tooth fork that can be moved up and down is arranged on its side edge, so that the tooth fork is placed under the jig plate, and when each jig plate is taken away, the sensor will cause the material placement slide to drive the tooth fork to move upward one grid to ensure that the top jig plate of the trolley is at the same height.
[0011] According to the above-mentioned features, the finished product placement area in the present invention can be used to place a cart to place the pre-folded structure. A loading slide is arranged on the frame of the finished product placement area. A sensor is installed on its upper edge, and a tooth fork that can be moved up and down is arranged on its side edge, so that the tooth fork is placed under the pre-folded structure. When each pre-folded structure is added, the sensor will cause the loading slide to drive the tooth fork to move downward one grid to ensure that the top pre-folded structure of the cart is at the same height.
[0012] According to the aforementioned features, the multilayer board automatic pre-lamination device of the present invention comprises punching holes one by one at least one inner layer circuit board and upper and lower PP sheets as insulation and automatically laminating them on a jig plate to form a pre-lamination structure; however, the lamination device and the principle and method of lamination of the multilayer board structure formed by multiple inner layer circuit boards and one inner layer circuit board are the same; but in order to make the description simple and concise, the following multilayer board structure is carried out in the form of punching holes one by one on an inner layer circuit board and the upper and lower PP sheets thereon and automatically laminating them on a jig plate; at the beginning of the operation of the present invention, the controller needs to first set the lamination order of each board and the reference coordinates of the positioning pins of the jig plate, and set the plurality of P sheets to the same position. The P sheet, the jig plate, and the inner layer circuit board are placed in the three feeding areas respectively; the operation steps include, step 1: calibrating the mechanical coordinates of the punching platform, the overlapping jig whole board platform and the inner layer board whole board platform, and storing the reference coordinates of the outer positioning holes of the PP sheet, the jig plate positioning pins and the inner layer circuit board positioning holes placed thereon in the controller; then setting the mechanical coordinates of the punching platform and the mechanical coordinates of the overlapping jig whole board platform to have a center distance of X1; and the mechanical coordinates of the inner layer board whole board platform and the mechanical coordinates of the overlapping jig whole board platform to have a center distance of X2; step 2: the feeding robot arm moves a jig plate from the jig plate placement area to the overlapping jig whole board platform, and the overlapping jig whole board platform performs whole board processing on the jig plate and gives to fix; the stacking robot arm uses the CCD image sensor to capture the image coordinates of the fixture plate locating pin, and the controller calculates the XYR offset value (i.e., the X-axis offset value, the Y-axis offset value, and the offset value of the angle R) of the image coordinates and the reference coordinates of the fixture plate locating pin, and sets the XYR offset value of the locating pin to a first offset value; step 3: the feeding robot arm moves a PP sheet from the PP sheet placement area to the punching platform, and the punching platform absorbs and positions the PP sheet, and the punching mechanism moves the upper and lower punches one by one to complete the punching operation of the outer locating holes according to the reference coordinate values of the outer locating holes; step 4: the stacking robot arm uses the CCD image sensor to capture the image coordinates of the outer locating holes of the PP sheet, and the The controller calculates the XYR offset value (i.e., the X-axis offset value, the Y-axis offset value, and the offset value of the angle R) of the image coordinates and the reference coordinates of the outer positioning hole of the PP sheet, and drives the stacking robot arm to grab the PP sheet and adjust the XYR offset value of the outer positioning hole so that the image coordinates of the outer positioning hole of the PP sheet coincide with the reference coordinates, and then moves the stacking robot arm a distance of X1 to the board stacking area and adjusts the first offset value so that the image coordinates of the outer positioning hole of the PP sheet coincide with the image coordinates of the positioning pin of the jig plate, and then stacks the PP sheet on the jig plate; Step 5: The feeding robot arm moves an inner layer circuit board from the inner layer board placement area to the inner layer board whole board platform, and the inner layer board whole board platform then performs whole board operation on the inner layer circuit board;Step 6: The stacking robot arm uses the CCD image sensor to capture the image coordinates of the positioning hole in the inner layer board. The controller calculates the XYR offset value (i.e., the X-axis offset value, the Y-axis offset value, and the offset value of the angle R) of the image coordinates and the reference coordinates of the positioning hole in the inner layer circuit board, and drives the stacking robot arm to grab the inner layer circuit board and adjust the XYR offset value of the inner positioning hole so that the image coordinates of the positioning hole in the inner layer circuit board coincide with the reference coordinates, and then drives the stacking robot arm to grasp the inner layer circuit board and adjust the XYR offset value of the inner positioning hole so that the image coordinates of the positioning hole in the inner layer circuit board coincide with the reference coordinates. The robot arm moves a distance of X2 to the board stacking area and adjusts the first offset value, so that the image coordinates of the positioning hole in the inner circuit board and the positioning pin of the jig plate coincide, and then the inner circuit board is stacked on the PP sheet; Step 7: According to the number of PP sheets N required above the inner circuit board, repeat steps 3 and 4 N times; Step 8: The unloading robot arm moves to the board stacking area to grab the pre-stacked structure to the finished product placement area, and the multi-layer board automatic stacking operation is completed. ;
[0013] With the aforementioned features, the "multi-layer board automatic pre-lapping device" of the present invention provides a device for automatically laminating an inner layer circuit board with a circuit and an upper and lower layer PP sheet as an insulator to form a pre-lapped structure; wherein, a jig plate with a preset positioning pin is first moved into and fixed on the lamination jig whole-board platform by a robot arm as a bottom jig; secondly, the inner layer circuit board with a preset inner positioning hole is moved to the inner layer board whole-board platform for whole-board, and the PP sheet is moved to the punching platform for adsorption and positioning, and then a punching mechanism is used to punch its outer positioning hole; Next, a group of CCD image sensors are used to capture the image coordinates of the positioning pins of the jig plate, and the robot arm is driven to adjust the position and angle after grabbing the PP sheet and the inner circuit board, so that the outer positioning holes of the PP sheet and the inner positioning holes of the inner circuit board can be inserted into the outer edges of the positioning pins of the jig plate; because the present invention introduces a robot arm to perform plate stacking, and changes the punching of the PP sheet into a single-piece processing, and uses CCD image sensors to capture the image coordinates of the hole positions, the positioning holes of the plate can coincide with the positioning pins of the jig plate, thereby achieving the effect of automated stacking. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1A It is a schematic diagram of the structure before the multilayer boards are stacked.
[0015] Figure 1B It is a schematic diagram of the structure after the multilayer boards are stacked.
[0016] Figure 1C It is a schematic diagram of the existing drilling and manual picking of a whole stack of PP sheets.
[0017] Figure 1D It is a schematic diagram of drilling external positioning holes in a stack of PP sheets.
[0018] Figure 2AThis is a regional distribution diagram of the second embodiment of the automatic pre-folding device of the present invention. Figure 2B It is a top view of the assembly of the second embodiment of the automatic pre-folding device of the present invention.
[0019] Figure 2C It is a combined stereogram of the second embodiment of the automatic pre-folding device of the present invention.
[0020] Figure 3A It is a structural stereogram of the feeding robot arm in the present invention.
[0021] Figure 3B It is a structural stereogram of the discharging robot arm in the present invention.
[0022] Figure 3C It is a structural stereogram of the folding robot arm according to the second embodiment of the present invention.
[0023] Figure 3D It is a structural front view of the folding robot arm according to the second embodiment of the present invention.
[0024] Figure 4A It is a combined stereogram of the punching mechanism in the present invention.
[0025] Figure 4B It is a cross-sectional view of the punching platform in the present invention.
[0026] Figure 4C It is a front view of the assembly of the punching machine frame in the present invention.
[0027] Figure 4D It is a structural cross-sectional view of the upper punch in the present invention.
[0028] Figure 4E It is a structural cross-sectional view of the lower punch in the present invention.
[0029] Figure 4F It is a structural stereogram of the punch pin in the present invention.
[0030] Figure 4G It is a three-dimensional diagram of the punching blade structure of the punching needle in the present invention.
[0031] Figure 4H It is a schematic diagram of the punching action in the present invention.
[0032] Fig. 4I This is a second schematic diagram of the punching action in the present invention.
[0033] Figure 5A It is a structural stereogram of the whole plate platform of the overlapping fixture in the present invention.
[0034] Figure 5B It is a schematic diagram of the whole board of the stacking fixture whole board platform in the present invention.
[0035] Figure 5C It is a schematic diagram of positioning the whole plate platform of the stacking fixture in the present invention.
[0036] Fig. 6A It is a schematic diagram of the operating state of the feeding trolley in the present invention.
[0037] Figure 6B This is a second schematic diagram of the operating state of the feeding trolley in the present invention.
[0038] Fig. 7A It is a schematic diagram of the reference coordinates of the working platform in the present invention.
[0039] Figure 7B Schematic diagram of the coordinate relationship between the plate image and the reference in the present invention.
[0040] Figure 7C It is a schematic diagram of the coordinate relationship of the stacking of panels in the present invention.
[0041] Description of reference numerals: 10-frame; 11-PP sheet placement area; 12-jig board placement area; 13-inner circuit board placement area; 14-PP sheet punching area; 15-board stacking area; 16-inner board whole board area; 17-finished product placement area; 21-punching platform; 211-suction cup; 212-vacuum chamber; 213-groove; 22-stack jig whole board platform; 221-whole board rod; 222-groove; 23-inner board whole board platform; 3 1-feeding robot arm; 32-overlapping robot arm; 33-discharging robot arm; 34-X-axis slide rail; 35-Y-axis slide rail; 36-Z-axis slide rail; 37-clamping mechanism; 371-cylinder; 372-claw; 38-adsorption mechanism; 381-suction cup frame; 382-suction cup; 39-rotating axis; 40-punching mechanism; 41-slide table; 41A-Y-axial slide rail; 41B-X-axial slide rail; 42-punching frame; 43-upper punch ;44-lower punch;45a-pneumatic cylinder;45b-pneumatic cylinder;46-punch needle;461-radial hole;462-axial hole;463-punch blade;47-bushing;471-air hole;472-air pipe;48-compression spring;49-top holder;490-cutting edge;491-chip removal hole;50-CCD image sensor;51-sensor;60-trolley;61-material slide;62-tooth fork;91-jig plate;9 11-locating pin; 92-inner layer circuit board; 921-inner positioning hole; 93-PP sheet; 931-outer positioning hole; 94-pre-stacking structure; 100-automatic pre-stacking device for multi-layer boards; A-high pressure air; N-number of PP sheet layers; P0-reference coordinate; P1-image coordinate; X1-center distance from the punching platform to the whole board platform of the stacking jig; X2-center distance from the whole board platform of the inner layer board to the whole board platform of the stacking jig; Z1-first offset value. DETAILED DESCRIPTION
[0042] First, see Figure 2A to Figure 2C As shown, the structure of the second embodiment of the multilayer board automatic pre-lapping device 100 in the present invention comprises: a frame 10 for spacing related areas and installing related components; three feeding areas, as the placement areas of the multilayer board (i.e., the jig plate 91, the inner layer circuit board 92 and the PP sheet 93), which are arranged in sequence and adjacent to each other in the X-axial area of the frame 10, including a PP sheet placement area 11, a jig plate placement area 12 and an inner layer circuit board placement area 13; three working areas, which are arranged in sequence and correspondingly at the rear side of the three feeding areas, including a PP sheet punching area 14, a board lamination area 15 and an inner layer board whole board area 16; and a finished product placement area 17, which is correspondingly arranged at the rear side of the board lamination area 15; wherein the three working areas are sequentially placed with a punching platform 21, a lamination jig whole board platform 22 and an inner layer board whole board platform 23; a plurality of robotic arms, including at least one feeding robotic arm 31, A stacking robot arm 32 and a discharging robot arm 33 are arranged in the X-axis and Y-axis regions of the frame. The plurality of robots respectively have displacement mechanisms in the X, Y, and Z axes and an adsorption mechanism 38 or a clamping mechanism 37, and perform the workpiece transfer operation between the feeding area, the working area, and the finished product area accordingly; that is, the feeding robot arm 31 is responsible for moving the fixture plate 91 in the fixture plate placement area 12 onto the stacking fixture whole plate platform 22, The inner layer circuit board 92 in the inner layer circuit board placement area 13 is moved onto the inner layer board whole board platform 23, and the PP sheet 93 in the PP sheet placement area 11 is moved onto the punching platform 21; the stacking robot arm 32 respectively moves the PP sheet 93 in the PP sheet punching area 14 and the inner layer circuit board 92 in the inner layer board whole board area 16 into the board stacking area 15; and the discharging robot arm 33 is responsible for moving the pre-stacking structure 94 in the board stacking area 15 into the finished product placement area 17. There is at least one punching mechanism 40, which has a punching frame 42, arranged in the PP board punching area 14, for punching the outer positioning holes 931 of the PP sheet 93 (the punching mechanism 40 in the present invention is provided with four groups, which are respectively arranged around the punching platform 21); a group of CCD image sensors 50, arranged above the adsorption mechanism 38 of the stacking robot arm 32, for capturing the image coordinates of the positioning pin 911 of the fixture plate 91, the image coordinates of the outer positioning hole 931 of the PP sheet 93 and the image coordinates of the inner positioning hole 921 of the inner circuit board 92; and a controller (not shown), arranged on the frame 10, electrically connected to the feeding robot arm 31, the stacking robot arm 32, the discharging robot arm 33, the punching mechanism 40 and the CCD image sensor 50, so as to control the actuation timing and drive-related instruction actions.
[0043] The structure of the first embodiment of the multilayer board automatic pre-lapping device 100 of the present invention is similar to that of the second embodiment ( Figure 2A to Figure 2CAs shown), the first embodiment does not have a jig plate placement area 12, a finished product placement area 17, a discharging robot arm 33 and a CCD image sensor 50, and the first embodiment does not need a jig plate 91 as a bottom jig for stacking; at the same time, the first embodiment uses a stacking platform to replace the stacking jig whole board platform 22 of the second embodiment; thus, the feeding robot arm 31 is responsible for moving the inner layer circuit board 92 of the inner layer circuit board placement area 13 to the inner layer board whole board platform 23 for whole board, and moving the PP sheet 93 of the PP sheet placement area 11 to the punching platform 21 for punching; The stacking robot arm 32 moves the PP sheets 93 punched piece by piece in the PP sheet punching area 14 and the inner layer circuit board 92 in the inner layer board whole board area 16 to the stacking platform of the board stacking area 15 to complete a pre-stacked structure 94. In the first embodiment, the pre-stacked structure 94 on the stacking platform does not include the fixture plate 91, so the next pre-stacked structure 94 can be stacked on top of the previous pre-stacked structure 94 in an offset manner. After a plurality of pre-stacked structures 94 are stacked on the stacking platform, they can be manually moved out of the board stacking area 15.
[0044] In the present invention, the structure of the feeding robot arm 31 is as follows: Figure 3A As shown, it is fixed in the frame 10, and has an X-axis slide rail 34, a Y-axis slide rail 35 and a Z-axis slide rail 36. An adsorption mechanism 38 is provided at the lower end of the Z-axis slide rail 36. The adsorption mechanism 38 has a suction cup frame 381 and a plurality of suction cups 382, which are used to adsorb and move the fixture plate 91 (the fixture plate 91 is not required in the first embodiment), the inner circuit board 92 and the PP sheet 93; the structure of the unloading robot arm 33 (the first embodiment does not have this setting) is as shown Figure 3B As shown, it is fixed in the frame 10, and has an X-axis slide rail 34, a Y-axis slide rail 35 and a Z-axis slide rail 36. A clamping mechanism 37 is provided at the lower end of the Z-axis slide rail 36. The clamping mechanism 37 has four clamping claws 372, and each of the clamping claws 372 is driven by a cylinder 371 to synchronously move to clamp and move the pre-folding structure 94; Furthermore, the structure of the folding robot arm 32 in the second embodiment of the present invention is as shown in FIG. Figure 3C to Figure 3DAs shown, it is fixed in the frame 10, and has an X-axis slide 34, a Y-axis slide (not shown) and a Z-axis slide 36. A rotating shaft 39 is connected to the Z-axis slide 36, and an adsorption mechanism 38 is arranged at the lower end of the rotating shaft 39, so that the adsorption mechanism 38 can rotate relative to the Z-axis slide 36, so as to facilitate the movement of the PP sheet 93 and the inner layer circuit board 92 and the angle adjustment in response to the coordinate offset when the overlapping operation is performed; and a group of CCD image sensors 50 are arranged above the adsorption mechanism 38. Since in the present invention, the overlapping robot arm 32 is displaced between the PP sheet punching area 14, the inner layer board whole board area 16 and the board overlapping area 15, the CCD image sensor 50 can be used to capture the image coordinates of the outer positioning hole 931 of the PP sheet 93, the image coordinates of the inner positioning hole 921 of the inner layer circuit board 92 and the image coordinates of the positioning pin 911 of the fixture plate 91. The stacking robot arm 32 of the first embodiment of the present invention moves the PP sheets 93 punched piece by piece in the PP sheet punching area 14 and the inner layer circuit board 92 in the inner layer board whole board area 16 into the stacking platform of the board stacking area 15. Therefore, the rotating shaft 39 and the CCD image sensor 50 are not required in its structure.
[0045] Figure 4A As shown in the figure, it is the configuration state of the punching mechanism 40 in the PP sheet punching area, a punching platform 21 is built into the area, and a plurality of groups of hollow grooves 213 are arranged on its periphery, and the grooves 213 are used as the field for punching the external positioning holes 931 of the PP sheet 93; the present invention includes at least one punching mechanism 40, and in this embodiment, four groups are provided, which are respectively arranged around the punching platform 21, and each of the punching mechanisms 40 includes a slide 41 and a punching frame 42; wherein, the slide 41 is arranged below the punching platform 21, and has an X-axis slide rail 41B and a Y-axis slide rail 41A, and the slide rails are fixed on the frame 10; the punching frame 42 is arranged above the slide 41, so the punching frame 42 can be displaced in the X-axis and Y-axis directions in the PP sheet punching area 14; and the punching platform 21 (such as Figure 4B ) is provided with a plurality of suction cups 211 and an exhaust chamber 212 at its lower edge, which can be evacuated to make the punching platform 21 have an adsorption force, so that the PP sheet 93 moved in is adsorbed and positioned on the punching platform 21, and at the same time, the plurality of grooves 213 at its peripheral edge are used to perform the punching operation of the positioning holes 931 outside the PP sheet 93; the punching frame 42 (such as Figure 4C ), a set of upper punches 43 and lower punches 44 are provided, and when punching, the punching frame 42 will be displaced so that the upper and lower punches 43 / 44 are respectively located at the upper and lower parts of the groove 213 of the punching platform 21, and the upper and lower punches 43 / 44 are respectively connected to a pneumatic cylinder 45a / 45b so that they can be displaced up and down; the upper punch 43 (such as Figure 4D) is provided with a bushing 47, the inner edge of which is provided with a punching needle 46, the upper edge of which is provided with a compression spring 48, and the tube wall is provided with an air hole 471, which can be connected to an air pipe 472 to introduce a high-pressure air A; and the punching needle 43 is provided with a radial hole 461 and an axial hole 462 connected to each other, and the radial hole 461 is connected to the air hole 471; the lower punch 44 (such as Figure 4E ) is provided with a top holding member 49, and its inner edge is provided with a cutting edge 490 and a chip removal hole 491; the punching edge 463 of the punching needle 43 of the present invention is provided with an inverted V-shaped section (such as Figure 4F to Figure 4G Furthermore, when the punching operation is performed, the pneumatic cylinder 45b of the lower punch 44 is actuated to move it upward (such as Figure 4H ), and the supporting member 49 is placed on the PP sheet 93, and the pneumatic cylinder 45a of the upper punch 43 is continuously actuated to move the bushing 47 and the punch needle 46 downward in conjunction (such as Fig. 4I ), the bushing 47 will pre-press the PP sheet 93, and the punch needle 46 will continue to punch down. When the punch needle 46 quickly contacts the top holding member 49, the punch blade 463 will interact with the cutting edge 490 to shear the cohesive force of the PP sheet 93, thereby producing an excellent shearing effect on the PP sheet 93; at this time, the high-pressure air A blows from the outlet of the axial hole 462 to the chip discharge hole 491 of the lower punch 44, so that the waste of the PP sheet 93 is discharged smoothly; at the same time, the high-pressure air A will fill the gap between the bushing 47 and the punch needle 46, thereby preventing the waste and dust of the PP sheet 93 from entering the structure of the upper punch 43 (see Figure 4D When the punching operation is completed, the pneumatic cylinder 45a / 45b connected to the upper and lower punches 43 / 44 will be activated to return to their original positions, and the compression spring 48 will also cause the punching needle 43 to return to its starting position.
[0046] The structure of the stacking fixture whole plate platform 22 of the present invention is as follows Figure 5A to Figure 5C As shown, a whole plate rod 221 is arranged around it, and the whole plate rod 221 has a buckle function. In addition, a groove 222 (such as Figure 5A ); When the jig plate 91 is moved into the feeding robot arm 31 and placed on the stacking jig whole plate platform 22, the whole plate rod 221 is actuated to perform the whole plate operation of the jig plate 91 (such as Figure 5B ), the whole plate is ready, and the whole plate rod 221 will be pressed to fix the fixture plate 91, so that the positioning pin 911 of the fixture plate 91 is completely positioned (such as Figure 5C), to facilitate the subsequent lamination of the PP sheet 93 and the inner circuit board 92; and after the lamination is completed, the groove 222 of the lamination jig whole board platform 22 facilitates the clamping mechanism 37 of the discharging robot arm 33 to penetrate and clamp the pre-lamination structure 94 that has completed the lamination operation. In the first embodiment of the present invention, the lamination jig whole board platform 22 of the second embodiment is replaced by a lamination platform; and the lamination platform is used to lamination the PP sheet 93 and the inner circuit board 92 to complete the pre-lamination structure 94, without the need for whole board and fixing actions, so the lamination platform of the first embodiment does not have the whole board rod 221 and the groove 222.
[0047] Please read further Figure 6A to Figure 6B As shown, in the present invention, the jig plate placement area 12 can be used to place a trolley 60 to place the jig plate 91; wherein a material placement slide 61 is arranged on the frame 10 of the jig plate placement area 12, a sensor 51 is installed on its upper edge, and a tooth fork 62 that can move up and down is arranged on its side edge, so that the trolley 60 is placed and the tooth fork 62 is placed under the jig plate 91 (such as Fig. 6A ); When each piece of the jig plate 91 is taken away, the sensor 51 will cause the loading slide 61 to drive the tooth fork 62 to move upward by one grid to ensure that the top piece of the jig plate 91 of the trolley 60 is at the same height (such as Figure 6B ).
[0048] In the present invention, the finished product placement area can be used to place a vehicle 60 to place the pre-assembled structure 94, and its state is similar to Figure 6A to Figure 6B As shown; wherein, a loading slide 61 is arranged on the frame 10 of the finished product placement area 17, a sensor 51 is installed on its upper edge, and a tooth fork 62 that can be moved up and down is arranged on its side edge, so that the trolley 60 is placed and the tooth fork 62 is placed under the pre-folded structure 94, and when each pre-folded structure 94 is added, the sensor 51 will make the loading slide 61 drive the tooth fork 62 to move downward one grid to ensure that the top pre-folded structure 94 of the trolley 60 is at the same height.
[0049] The operation mode of the second embodiment of the multi-layer board automatic lamination device 100 of the present invention is to use the jig plate 91 as a combined jig, and to automatically insert the outer positioning hole 931 of the PP sheet 93 and the inner positioning hole 921 of the inner circuit board 92 into the outer edge of the positioning pin 911, thereby completing the automatic lamination operation of the pre-lamination structure 94; furthermore, the present invention uses a CCD image sensor 50 to capture the image coordinates of the hole positions of the PP sheet 93 and the inner circuit board 92, and drives the lamination robot arm 32 to adjust the offset value of the plate hole position during the lamination process, thereby achieving the effect of coinciding the plate hole position with the lamination jig positioning pin; wherein, the principle and method of adjusting the plate coordinates are as follows: first, as Fig. 7AThe figure shows the arrangement of the inner layer board platform 23, the stacking jig platform 22 and the punching platform 21. Before the automatic stacking of the multilayer board is performed, the system needs to calibrate its mechanical coordinates, and the reference coordinates of the inner positioning hole 921 of the inner layer circuit board 92, the positioning pin 911 of the jig plate 91, and the outer positioning hole 931 of the PP sheet 93 also need to be set in advance and stored in the controller. Furthermore, the mechanical coordinates of the punching platform 21 and the stacking jig platform 22 are aligned. 2, the center distance of the mechanical coordinates is set as X1, and the center distance of the mechanical coordinates of the inner layer board platform 23 and the mechanical coordinates of the stacking jig whole board platform 22 is set as X2; the X1 value is the displacement distance of the stacking robot arm 32 moving the PP sheet 93 from the punching platform 21 to the stacking jig whole board platform 22; and the X2 value is the displacement distance of the stacking robot arm 32 moving the inner layer circuit board 92 from the inner layer board whole board platform 23 to the stacking jig whole board platform 22. Secondly, Figure 7B The figure shows an operation mode of adjusting the offset value so that the image coordinates coincide with the reference coordinates; wherein, when the inner layer circuit board 92 is moved to the inner layer board whole board platform 23, or the PP sheet 93 completes the punching operation on the punching platform 21, the image coordinates P1 of the inner positioning hole 921 of the inner layer circuit board 92 or the outer positioning hole 931 of the PP sheet 93 will be offset from the reference coordinates P0 of the hole position set in advance; in the present invention, the CCD image sensor 50 on the stacking robot arm 32 is used to capture the image coordinates P1 of the outer positioning hole 931 of the PP sheet 93 or the inner positioning hole 921 of the inner layer circuit board 92, and the controller calculates the XYR offset value (i.e., the X-axis offset value, the Y-axis offset value and the offset value of the angle R) of the image coordinates P1 and the reference coordinates P0, and then the stacking robot arm must adjust the XYR offset value when grabbing the PP sheet 93 and the inner layer circuit board 92, so that the image coordinates P1 coincide with the reference coordinates P0; finally, as shown in FIG. Figure 7CAs shown, when the feeding robot arm 31 moves a jig plate 91 into the stacking jig plate platform 22 and performs the plate stacking, the image coordinate P1 of the positioning pin 911 and the pre-set reference coordinate P0 will also be offset; and the CCD image sensor 50 on the stacking robot arm 32 will also capture the image coordinate P1 of the positioning pin 911 of the jig plate 91, and the controller calculates the XYR offset value (i.e., the X-axis offset value, the Y-axis offset value and the offset value of the angle R) of the positioning pin of the reference coordinate P0; when the PP sheet 93 is to be stacked, The placement coordinate of the stacking robot arm 32 when it moves to the stacking jig whole board platform 22 is X1 plus the XYR offset value of the positioning pin; and when the inner layer circuit board 92 is to be stacked, the placement coordinate of the stacking robot arm 32 when it moves to the stacking jig whole board platform 22 is X2 plus the XYR offset value of the positioning pin; accordingly, the outer positioning hole 931 of the PP sheet 93 and the inner positioning hole 921 of the inner layer circuit board 92 can be automatically inserted into the jig plate 91 and the outer edge of the positioning pin 911 thereof located at the image coordinate P1, thereby completing the automatic stacking operation of the pre-stacking structure 94.
[0050] At the beginning of the operation of the second embodiment of the multi-layer board automatic lamination device 100 of the present invention, the controller needs to set the lamination order of each board first, and place the plurality of PP sheets 93, the fixture board 91 and the inner circuit board 92 into the three feeding areas 11 / 12 / 13 respectively; and the steps of automatic lamination of the multi-layer board include:
[0051] Step 1: calibrate the mechanical coordinates of the punching platform 21, the stacking jig whole board platform 22 and the inner layer board whole board platform 23, and store the reference coordinates of the outer positioning hole 931 of the PP sheet 93 placed thereon, the positioning pin 911 of the jig plate 91 and the inner positioning hole 921 of the inner layer circuit board 92 in the controller; then set the center distance between the mechanical coordinates of the punching platform 21 and the mechanical coordinates of the stacking jig whole board platform 22 to X1; and the center distance between the mechanical coordinates of the inner layer board whole board platform 23 and the mechanical coordinates of the stacking jig whole board platform 22 to X2;
[0052] Step 2: The feeding robot arm 31 moves a jig plate 91 from the jig plate placement area 12 to the stacking jig plate whole-plate platform 22, and the stacking jig plate whole-plate platform 22 whole-plates and fixes the jig plate 91; the stacking robot arm 32 uses the CCD image sensor 50 to capture the image coordinates of the positioning pin 911 of the jig plate 91, and the controller calculates the XYR offset value (i.e., the X-axis offset value, the Y-axis offset value, and the offset value of the angle R) of the image coordinates and the reference coordinates of the positioning pin 911 of the jig plate 91, and sets the XYR offset value of the positioning pin to the first offset value Z1;
[0053] Step 3: The feeding robot arm 31 moves a PP sheet 93 from the PP sheet placement area 11 to the punching platform 21, and the punching platform 21 absorbs and positions the PP sheet 93. The punching mechanism 40 moves the upper and lower punches 43 / 44 one by one according to the reference coordinate values of the outer positioning holes 931 to complete the punching operation of the outer positioning holes 931;
[0054] Step 4: The stacking robot arm 32 uses the CCD image sensor 50 to capture the image coordinates of the outer positioning hole 931 of the PP sheet 93. The controller calculates the XYR offset value (i.e., the X-axis offset value, the Y-axis offset value, and the offset value of the angle R) of the image coordinates and the reference coordinates of the outer positioning hole 931 of the PP sheet 93. The stacking robot arm 32 is driven to grab the PP sheet 93 and adjust the XYR offset value of the outer positioning hole so that the image coordinates of the outer positioning hole 931 of the PP sheet 93 coincide with the reference coordinates. The stacking robot arm 32 is then moved a distance of X1 to the plate stacking area 15 and the first offset value Z1 is adjusted so that the image coordinates of the outer positioning hole 931 of the PP sheet 93 coincide with the image coordinates of the positioning pin 911 of the fixture plate 91. Then, the PP sheet 93 is stacked on the fixture plate 91.
[0055] Step 5: The feeding robot arm 31 moves an inner layer circuit board 92 from the inner layer circuit board placement area 13 to the inner layer board whole board platform 23, and the inner layer board whole board platform 23 then whole boards the inner layer circuit board 92;
[0056] Step 6: The stacking robot arm 32 uses the CCD image sensor 50 to capture the image coordinates of the positioning hole 921 in the inner circuit board 92. The controller calculates the XYR offset value (i.e., the X-axis offset value, the Y-axis offset value, and the offset value of the angle R) of the image coordinates and the reference coordinates of the positioning hole 921 in the inner circuit board 92. The stacking robot arm 32 is driven to grab the inner circuit board 92 and adjust the XYR offset value of the inner positioning hole so that the image coordinates of the positioning hole 921 in the inner circuit board 92 coincide with the reference coordinates. The stacking robot arm 32 is then moved a distance of X2 to the board stacking area 15 and the first offset value Z1 is adjusted so that the image coordinates of the positioning hole 921 in the inner circuit board 92 coincide with the image coordinates of the positioning pin 911 of the fixture plate 91. Then, the inner circuit board 92 is stacked on the PP sheet 93.
[0057] Step 7: Repeat Step 3 and Step 4 N times according to the number of PP sheets 93 layers N required on the inner circuit board 92; and
[0058] Step 8: The unloading robot arm 33 moves to the panel stacking area 15 to grab the pre-stacked structure 94 and place it in the finished product placement area 17, thus completing the multi-layer panel automatic stacking operation.
[0059] The second embodiment of the multilayer board automatic pre-stacking device 100 of the present invention provides a device for automatically stacking an inner layer circuit board 92 provided with a circuit and an upper and lower layer PP sheet 93 as an insulator to form a pre-stacking structure 94; wherein, a jig plate 91 with a preset positioning pin 911 is first moved into and fixed on the stacking jig whole board platform 22 by a feeding robot arm 31 as a bottom jig; secondly, the inner layer circuit board 92 with a preset inner positioning hole 921 is moved to the inner layer board whole board platform 23 for whole board, and the PP sheet 93 is moved to the punching platform 21 for positioning, and then a punching mechanism 40 is used to punch its outer positioning hole 931; subsequently, a group of CCD image sensors 50 are used to The image coordinates of the positioning pin 911 of the jig plate 91, the outer positioning hole 931 of the PP sheet 93 and the inner positioning hole 921 of the inner circuit board 92 are captured, and the overlapping robot arm 32 is driven to adjust the position and angle after grabbing the PP sheet 93 and the inner circuit board 92, so that the outer positioning hole 931 of the PP sheet 93 and the inner positioning hole 921 of the inner circuit board 92 can be inserted into the outer edge of the positioning pin 911 of the jig plate 91; since the present invention introduces a robot arm to perform plate-sheet overlapping, and changes the punching of the PP sheet 93 into a single-piece processing, and uses a CCD image sensor 50 to capture the image coordinates of the hole position, the positioning hole of the plate can coincide with the positioning pin of the overlapping jig, thereby achieving the effect of automated overlapping.
[0060] The above-mentioned drawings and descriptions are only preferred embodiments of the present invention. Any modification or equivalent changes made by those skilled in the art within the spirit and scope of the present invention should still be included in the scope of the claims of the present invention.
Claims
1. A multi-layer board automatic pre-lamination device, which is a device for punching a plurality of PP sheets one by one and automatically laminating them with at least one inner layer circuit board to form a pre-lamination structure; characterized in that: The inner circuit board is pre-set with inner positioning holes; and the automatic pre-lapping device comprises: One rack; Three operating areas are arranged in sequence and adjacent to each other in the X-axis region of the frame, including a PP sheet punching area, a plate stacking area and an inner layer board whole plate area; the three operating areas are also placed in sequence with a punching platform, a stacking platform and an inner layer board whole plate platform; two feeding areas, including a PP sheet placement area and an inner layer circuit board placement area, are respectively arranged at the front side of the PP sheet punching area and the inner layer board whole plate area; A plurality of robotic arms, including at least one feeding robotic arm and one stacking robotic arm, are arranged in the X-axis and Y-axis regions of the frame and are used to perform the workpiece transfer operation between the feeding area and the operation area; the plurality of robotic arms are respectively provided with displacement mechanisms in the X-axis, Y-axis, and Z-axis directions and an adsorption mechanism; At least one punching mechanism is arranged in the punching area of the PP sheet, and is used to punch the PP sheet so that it has an external positioning hole; the punching mechanism includes a slide and a punching frame; and the punching platform has a vacuum suction function, and is used to absorb and position the PP sheet; the slide is arranged below the punching platform, and has a displacement function in the X and Y axes; the punching frame is fixed above the slide, and is provided with a group of upper and lower corresponding punches, and is used to perform the punching operation of the PP sheet; A controller is arranged on the frame and electrically connected to the plurality of mechanical arms and the punching mechanism to control the actuation timing and driving-related instruction actions.
2. An automatic pre-lamination device for multi-layer boards, which is a device for punching a plurality of PP sheets one by one and automatically laminating them with a jig plate and at least one inner layer circuit board to form a pre-lamination structure; characterized in that: The jig plate is preset with at least two positioning pins, and the inner circuit board is preset with inner positioning holes corresponding to the two positioning pins; and the automatic pre-lapping device comprises: One rack; Three feeding areas are arranged in sequence and adjacent to each other in the X-axis region of the frame, including a PP sheet placement area, a jig plate placement area and an inner layer circuit board placement area; three operation areas are arranged in sequence and correspondingly at the rear side of the three feeding areas, including a PP sheet punching area, a plate stacking area and an inner layer board whole plate area; and a finished product placement area is arranged correspondingly at the rear side of the plate stacking area; wherein the three operation areas are sequentially placed with a punching platform, a stacking jig whole plate platform and an inner layer board whole plate platform; A plurality of robotic arms, including at least one feeding robotic arm, one folding robotic arm and one discharging robotic arm, are arranged in the X-axis and Y-axis regions of the frame and are used to carry out the workpiece transfer operation between the feeding area, the operation area and the finished product area; the plurality of robotic arms respectively have displacement mechanisms in the X-axis, Y-axis and Z-axis directions, and the feeding robotic arm is provided with an adsorption mechanism, the folding robotic arm is provided with an adsorption mechanism with a rotation function, and the discharging robotic arm is provided with a clamping mechanism; At least one punching mechanism is arranged in the punching area of the PP sheet, and is used to punch the PP sheet so that it has an outer positioning hole corresponding to the positioning pin; the punching mechanism includes a slide and a punching frame; and the punching platform has a vacuum suction function, which is used to absorb and position the PP sheet; the slide is arranged below the punching platform, and has a displacement function in the X and Y axes; the punching frame is fixed above the slide, and is provided with a group of upper and lower corresponding punches, which are used to perform the punching operation of the PP sheet; A set of CCD image sensors is arranged above the adsorption mechanism of the stacking robot arm to capture the image coordinates of the positioning pins of the jig plate, the image coordinates of the positioning holes outside the PP sheet, and the image coordinates of the positioning holes inside the inner circuit board; A controller is arranged on the frame and electrically connected to the plurality of mechanical arms, the punching mechanism and the CCD image sensor to control the actuation timing and driving-related instruction actions.
3. The automatic pre-stacking device for multi-layer boards according to claim 1 or 2, characterized in that: The upper and lower punches of the punching mechanism are respectively connected to a pneumatic cylinder so that they can move up and down. The upper punch is provided with a bushing and a punch needle, and the lower punch is provided with a support and a chip removal hole. When the punching operation is performed, the lower punch moves upward so that the support is placed on the PP sheet, and then the bushing of the upper punch moves downward in conjunction with the punch needle, so that the bushing pre-presses the PP sheet, and the punch needle continues to punch downward to complete the punching, and the waste of the PP sheet is discharged from the chip removal hole of the lower punch.
4. The multi-layer board automatic pre-stacking device according to claim 3, characterized in that: The bushing is provided with an air hole connected to an air pipe to introduce high-pressure air. The punch needle is provided with a connected radial hole and axial hole, and the radial hole is connected to the air hole. When the punch needle punches downward, the high-pressure air will blow from the outlet of the axial hole to the chip discharge hole, so that the waste of the PP sheet can be discharged smoothly. At the same time, the high-pressure air will fill the gap between the bushing and the punch needle to prevent the waste of the PP sheet and dust from entering the structure of the upper punch.
5. The multi-layer board automatic pre-stacking device according to claim 2, characterized in that: The stacking jig whole-plate platform is provided with whole-plate rods around it for whole-plate operation of the jig plate. The whole-plate rods also have a buckling function for fixing the jig plate, making it easier for the stacking operation to proceed. Grooves are provided around the stacking jig whole-plate platform to facilitate the clamping mechanism of the discharging robot arm to penetrate under the groove to clamp the pre-stacked structure.
6. The multi-layer board automatic pre-stacking device according to claim 5, characterized in that: The clamping mechanism of the discharging robot arm is provided with four clamping claws, and each of the clamping claws is driven by a cylinder to synchronously actuate to clamp the pre-folded structure.
7. The multi-layer board automatic pre-stacking device according to claim 2, characterized in that: The jig plate placement area is for placing a trolley to place the jig plate. A material placement slide is set on the frame of the jig plate placement area. A sensor is installed on its upper edge, and a tooth fork that can move up and down is set on its side edge, so that the tooth fork is placed under the jig plate. When each jig plate is taken away, the sensor will cause the material placement slide to drive the tooth fork to move upward one grid to ensure that the top jig plate of the trolley is at the same height.
8. The multi-layer board automatic pre-stacking device according to claim 2, characterized in that: The finished product placement area is used to place a cart to place the pre-folded structure. A loading slide is arranged on the frame of the finished product placement area. A sensor is installed on its upper edge, and a tooth fork that can be moved up and down is arranged on its side edge, so that the tooth fork is placed under the pre-folded structure. When each pre-folded structure is added, the sensor will make the loading slide drive the tooth fork to move downward one grid to ensure that the top pre-folded structure of the cart is at the same height.
9. The multi-layer board automatic pre-stacking device according to claim 2, characterized in that: The lamination steps of the multilayer board include: Step 1: calibrate the mechanical coordinates of the punching platform, the stacking jig whole board platform and the inner layer board whole board platform, and store the reference coordinates of the outer positioning holes of the PP sheet, the jig plate positioning pins and the inner layer circuit board positioning holes placed thereon in the controller; then set the center distance between the mechanical coordinates of the punching platform and the mechanical coordinates of the stacking jig whole board platform to X1; and the center distance between the mechanical coordinates of the inner layer board whole board platform and the mechanical coordinates of the stacking jig whole board platform to X2; Step 2: The feeding robot arm moves a jig plate from the jig plate placement area to the stacking jig plate whole-plate platform, and the stacking jig plate whole-plate platform whole-plates and fixes the jig plate; the stacking robot arm uses the CCD image sensor to capture the image coordinates of the jig plate locating pin, and the controller calculates the XYR offset value of the image coordinates and the reference coordinates of the jig plate locating pin, that is, the X-axis offset value, the Y-axis offset value and the offset value of the angle R, and sets the XYR offset value of the locating pin to the first offset value; Step 3: The feeding robot arm moves a PP sheet from the PP sheet placement area to the punching platform, and the punching platform absorbs and positions the PP sheet. The punching mechanism moves the upper and lower punches one by one according to the reference coordinate value of the external positioning hole to complete the punching operation of the external positioning hole; Step 4: The stacking robot uses the CCD image sensor to capture the image coordinates of the outer positioning hole of the PP sheet, and the controller calculates the XYR offset value of the image coordinates and the reference coordinates of the outer positioning hole of the PP sheet, and drives the stacking robot to grab the PP sheet and adjust the XYR offset value of the outer positioning hole so that the image coordinates of the outer positioning hole of the PP sheet coincide with the reference coordinates, and then moves the stacking robot a distance of X1 to the plate stacking area and adjusts the first offset value so that the image coordinates of the outer positioning hole of the PP sheet coincide with the image coordinates of the positioning pin of the jig plate, and then the PP sheet is stacked on the jig plate; Step 5: The feeding robot arm moves an inner layer circuit board from the inner layer circuit board placement area to the inner layer circuit board whole board platform, and the inner layer circuit board whole board platform then whole boards the inner layer circuit board; Step 6: The stacking robot arm uses the CCD image sensor to capture the image coordinates of the positioning hole in the inner circuit board. The controller calculates the XYR offset value of the image coordinates and the reference coordinates of the positioning hole in the inner circuit board, and drives the stacking robot arm to grab the inner circuit board and adjust the XYR offset value of the inner positioning hole so that the image coordinates of the positioning hole in the inner circuit board coincide with the reference coordinates. Then, the stacking robot arm moves a distance of X2 to the board stacking area and adjusts the first offset value so that the image coordinates of the positioning hole in the inner circuit board coincide with the image coordinates of the positioning pin of the jig plate, and then the inner circuit board is stacked on the PP sheet; Step 7: Repeat steps 3 and 4 N times according to the number of PP sheets N required on the inner circuit board; Step 8: The unloading robot arm moves into the panel stacking area to grab the pre-stacked structure and move it to the finished product placement area, thus completing the multi-layer panel automatic stacking operation.