Semi-flexible board manufacturing method

Abstract

The invention discloses a semi-flexible board manufacturing method, and relates to the technical field of semi-flexible boards, and the method comprises the following steps: S1, cutting; s2, pre-processing is carried out; s3, performing press fit; s4, processing the whole board; s5, cleaning the plate surface; s6, surface treatment and forming; and S7, testing and packaging a finished product. According to the manufacturing method, an original design stacking structure is changed, a sheet material of a sheet bending area is used for manufacturing, core plates are saved, only a single core plate is exposed, the outer layer exposure of other laminates is based on the inner layer, layer deviation is completely eradicated, manufacturing is carried out in the mode that depth control milling and multiple times of pressing are combined with non-flowing PP, and the manufacturing cost is reduced. According to the semi-flexible board, the board is not affected by different core board thicknesses, different core board copper thicknesses and different core board residual copper rates, the interlayer alignment degree reaches + / -0.05 mm, the semi-flexible board has greater advantages in the aspect of quality, and by optimizing and improving a conventional semi-flexible board structure, production and manufacturing are facilitated, the product quality is improved, and the risk of quality failure is avoided.

Description

Technical Field

[0001] The invention relates to the technical field of semi-flexible boards, and in particular to a method for manufacturing a semi-flexible board. Background Art

[0002] Semi-flexible PCB is a printed circuit board that can be partially bent based on a rigid printed circuit board. It combines the advantages of rigid and flexible boards. It can provide the support of a rigid circuit board and achieve local bending. It is widely used in the three-dimensional assembly of electronic products.

[0003] For example, the publication number is CN106455339B, “A semi-flexible printed circuit board with bending function and its manufacturing method”, the manufacturing method includes the following steps: A. After the semi-flexible printed circuit board is manufactured to the character process, the semi-flexible printed circuit board is laser cut to ablate and remove the excess substrate in the bending area to achieve the bending function; B. After laser ablation, the residual thickness of the bending area is measured to detect whether the semi-flexible printed circuit board is qualified.

[0004] In the prior art, since it is difficult to ensure the interlayer alignment of the semi-flexible board during the manufacturing and pressing process, the board will be affected by different core board thicknesses, different core board copper thicknesses, and different core board residual copper rates. In addition, the forming depth control gong method will cause the board insulation layer to have unqualified bending resistance due to mechanical stress problems, affecting the performance and quality of the semi-flexible board. Summary of the invention

[0005] The purpose of the present invention is to provide a method for manufacturing a semi-flexible board to solve the problem raised in the above background technology that the interlayer alignment of the semi-flexible board is difficult to ensure during the manufacturing and lamination process, and the forming depth control gong method will cause the board's insulating layer to have unqualified bending resistance due to mechanical stress problems.

[0006] To achieve the above object, the present invention provides the following technical solution: a method for manufacturing a semi-flexible plate, comprising the following steps:

[0007] S1. Cutting: Position and cut the copper clad laminate raw materials and cut them into production sizes with the same size;

[0008] S2, Pre-processing: Clean and process the board surface, remove the non-flowing prepreg and uncovering area;

[0009] S3, pressing: heating is used to gradually soften the non-flowing prepreg and make it fit tightly to the plate, applying pressure to fuse the plates, riveting to connect the plates, and placing them on the stacking platform for pressing;

[0010] S4, whole board processing: drilling, copper deposition and electroplating;

[0011] S5. Board surface cleaning: Use different processes to clean and treat the board surface;

[0012] S6, surface treatment and molding: the surface is treated with text and tin spraying, the depth of the gong is controlled and the cover is opened to obtain the molded product;

[0013] S7. Finished product testing and packaging: Test, inspect and package the products.

[0014] Preferably, in step S2, the prepreg preprocessing comprises the following steps:

[0015] S21, using micro-etching solution to clean the board surface, covering the board surface with photosensitive ink, and drying and curing;

[0016] S22, using an exposure machine to irradiate with ultraviolet light to cause a polymerization reaction;

[0017] S23, after exposure, use the DES line to perform development, etching, and film removal processing to present the required graphics and the gong groove positioning hole ring required for the next process on the copper clad laminate;

[0018] S24, use a gong machine to gong off the area of ​​the non-flowing prepreg that needs to be uncovered;

[0019] S25. Use a depth control gong to 50% of the depth of the semi-bend area that is not needed.

[0020] Preferably, in step S22, the exposure energy of the exposure machine is selected to be 5-7 grids, and the expansion and shrinkage compensation is adjusted according to different board thicknesses and copper thicknesses. Conventional X compensation is 4 / 10000, and Y compensation is 8 / 10000. The expansion and shrinkage method is to shrink evenly from the four sides of the board to the center of the board.

[0021] Preferably, in step S23, using the DES line includes placing the exposed semi-flexible board material into a developer, dissolving the photosensitive material in the exposed area under the action of the developer to expose the circuit pattern to be retained, etching the board with an etching solution to corrode the copper foil portion not protected by the photosensitive material to form the desired circuit pattern, removing the photosensitive material on the board to completely expose the circuit after etching.

[0022] Preferably, in step S4, the whole board processing includes the following steps:

[0023] S41. Select different drilling parameters according to different types of product materials and copper thickness, and drill holes in the entire board;

[0024] S42, placing the whole board to be treated in a specific treatment device, ensuring that its position is stable and the surface is flat, preparing a certain concentration of chemical copper chloride solution, allowing the copper chloride solution to fully contact the surface of the whole board and the inside of the hole, controlling the temperature, time and flow rate of the solution, and allowing the copper ions in the solution to be deposited on the whole board and in the hole to form a uniform copper layer with a thickness of 1-3um;

[0025] S43. Through the electrical reaction mechanism, the copper phosphorus balls gradually release copper ions under the action of the electric field. On the cathode plate surface, the copper ions gradually accumulate on the plate surface and form a uniform copper layer, continuously increasing the thickness of the copper layer.

[0026] Preferably, in step S5, the board surface cleaning comprises the following steps:

[0027] S51. Use micro-etching solution and abrasive brushing process to clean the board surface, apply a layer of photosensitive dry film, use an exposure machine to irradiate with ultraviolet light to make it polymerize, and use 6-8 grids of exposure energy. After exposure, use a DES line to develop, etch, and remove the film to present the required pattern on the copper clad board;

[0028] S52. Use volcanic ash and abrasive brushing to clean the board surface, print a layer of photosensitive ink on the board surface, dry and pre-bake it, use an exposure machine to irradiate it with ultraviolet light to make it polymerize, and use 8-11 grids of exposure energy. After exposure, use a developing line to develop the required window.

[0029] Preferably, in step S6, the surface treatment and molding comprises the following steps:

[0030] S61. Use a text printing machine to print text on the surface of the product;

[0031] S62, allowing gold ions to gradually deposit on the surface of the product to form a gold layer, and then evenly covering the surface of the product with molten tin by high-pressure spraying;

[0032] S63, the product is finally formed by a molding device.

[0033] Preferably, in step S63, the product forming accuracy is ±0.1 mm, and the special control accuracy is ±0.05 mm.

[0034] Preferably, in step S7, the finished product testing and packaging includes the following steps:

[0035] S71. Conduct the product to test whether it can conduct electricity normally. Perform insulation test on the product to verify the insulation performance between different circuit parts of the semi-flexible board and between the circuit and the external environment;

[0036] S72, start the automatic visual inspection equipment to scan and compare 100% of the products. If a product that does not meet the requirements is found, if the problem with the product is minor, it will be repaired. If the defect of the product is serious, it will be judged as scrapped;

[0037] S73. Package and protect the products that pass the inspection.

[0038] Compared with the prior art, the present invention has the following beneficial effects:

[0039] The present invention changes the original design stacking structure and uses a thin plate in the bending area itself for production. The early production by pressing can be cancelled, the number of core boards of the multi-layer board is reduced, the core boards are saved, and only a single core board is exposed. The exposure of the outer layers of other layer boards is based on the inner layer to eliminate layer deviation. The board is produced by combining depth-controlled gongs and multiple pressings with non-flowing PP. Multiple pressing processes are used to prevent the board from being affected by different core board thicknesses, different core board copper thicknesses, and different core board residual copper rates. The inter-layer alignment reaches ±0.05mm, and the uniformity of the board thickness can be controlled to more than 90%. It has greater advantages in quality. By optimizing and improving the conventional semi-flexible board structure, production is convenient, product quality is improved, and the risk of quality failure is avoided. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] Figure 1 A flow chart of a method for manufacturing a semi-flexible plate according to the present invention;

[0041] Figure 2 The present invention is a structural design diagram of a method for manufacturing a semi-flexible plate. DETAILED DESCRIPTION

[0042] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the implementation regulations described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0043] Embodiment: A method for manufacturing a semi-flexible plate comprises the following steps:

[0044] Step 1: Cutting: Position and cut the copper clad laminate raw material into production sizes of the same size;

[0045] Step 2: Pre-processing: Clean and process the board surface, remove the non-flowing prepreg and uncovering area;

[0046] Prepreg preprocessing includes the following steps:

[0047] 21. Use micro-etching solution to clean the board surface, cover the board surface with photosensitive ink, and dry and solidify it;

[0048] 22. Use an exposure machine to irradiate with ultraviolet light to cause polymerization reaction;

[0049] The exposure energy of the exposure machine is 6 grids, and the expansion and shrinkage compensation is adjusted according to different board thickness and copper thickness. The conventional X compensation is 4 / 10000, and the Y compensation is 8 / 10000. The expansion and shrinkage method is to shrink evenly from the four sides of the board to the center of the board.

[0050] 23. After exposure, use the DES line for development, etching, and film removal to present the required graphics and the gong groove positioning hole ring required for the next process on the copper clad laminate, which is convenient for equipment identification;

[0051] Using the DES line includes placing the exposed semi-flexible board into a developer, dissolving the photosensitive material in the exposed area under the action of the developer to expose the circuit pattern to be retained, etching the board with an etching solution to corrode the copper foil part not protected by the photosensitive material to form the required circuit pattern, removing the photosensitive material on the board to completely expose the circuit after etching;

[0052] 24. Use a gong machine to gong off the area where the non-flowing prepreg needs to be uncovered;

[0053] 25. Use a depth-controlled gong to 50% of the depth of the unnecessary area at the semi-bend. Do not gong it all off. Make preliminary preparations for uncovering the finished product so as not to damage the semi-bend area when uncovering.

[0054] Step 3, pressing: heating is used to gradually soften the non-flowing prepreg and make it fit tightly with the board. The non-flowing prepreg has unique properties and can ensure that the connection between the semi-flexible area core board and the board to be uncovered is more firm and stable under specific process conditions. Pressure is applied to fuse the boards, making the boards more tightly bonded, eliminating possible gaps and bubbles, and then riveting the boards to further enhance the connection strength between the boards, providing reliable protection for subsequent processing and use. It is placed on the stacking platform for pressing, so that the semi-flexible area core board and the board to be uncovered can be tightly combined together, laying a solid foundation for the production of semi-flexible boards;

[0055] Step 4: Whole board processing: drilling, copper deposition and electroplating;

[0056] The whole board processing includes the following steps:

[0057] 41. Select different drilling parameters according to different types of product materials and copper thickness, and drill holes in the entire board;

[0058] 42. Place the whole board to be treated in a specific treatment device, ensure that its position is stable and the surface is flat, prepare a certain concentration of chemical copper chloride solution, let the copper chloride solution fully contact the surface of the whole board and the inside of the hole, control the temperature, time and flow rate of the solution, and the copper ions in the solution are deposited on the whole board and the hole to form a uniform copper layer with a thickness of 2um;

[0059] 43. Through the electrical reaction mechanism, the copper phosphorus balls gradually release copper ions under the action of the electric field. On the cathode plate surface, the copper ions gradually accumulate on the plate surface and form a uniform copper layer, continuously increasing the thickness of the copper layer.

[0060] Step 5: Board cleaning: Use different processes to clean and treat the board surface;

[0061] Panel cleaning includes the following steps:

[0062] 51. Use micro-etching solution and brushing process to clean the board surface, press a layer of photosensitive dry film, use ultraviolet light exposure machine to make it polymerize, and use 7 grids of exposure energy. After exposure, use DES line to develop, etch and remove the film to present the required pattern on the copper clad board;

[0063] 52. Use volcanic ash and abrasive brushing to clean the board surface, print a layer of photosensitive ink on the board surface, dry and pre-bake it, use an exposure machine to irradiate it with ultraviolet light to make it polymerize, and use 10 grids of exposure energy. After exposure, use a developing line to develop the required window;

[0064] Step 6: Surface treatment and molding: Carry out text and tin spraying treatment on the surface, control the depth of the gong and open the cover to obtain the molded product;

[0065] Surface treatment and molding include the following steps:

[0066] 61. Use a text printer to print text on the surface of the product;

[0067] 62. Let the gold ions gradually deposit on the surface of the product to form a gold layer. The gold treatment can not only improve the appearance quality of the product and make it present a noble golden luster, but also enhance the welding performance and corrosion resistance of the product, providing reliable protection for the subsequent use of the product. Then the molten tin material is evenly covered on the surface of the product by high-pressure spraying. The surface of the product after tin spraying has good solderability and can be easily welded to other electronic components. At the same time, the tin layer can also protect the surface of the product, prevent oxidation and improve the conductivity;

[0068] 63. The product is finally formed by molding equipment.

[0069] Product molding accuracy is ±0.1mm, special control accuracy is ±0.05mm.

[0070] Step 7. Finished product testing and packaging: Test, inspect and package the product.

[0071] Finished product testing and packaging includes the following steps:

[0072] 71. Conduct the product to test whether it can conduct electricity normally, and conduct insulation test on the product to verify the insulation performance between different circuit parts of the semi-flexible board and between the circuit and the external environment;

[0073] 72. Start the automatic visual inspection equipment to scan and compare 100% of the products. If the product does not meet the requirements, if the problem is minor, it will be repaired. If the defect is serious, it will be judged as scrapped to ensure the efficiency of the production process and the rational use of resources;

[0074] 73. Provide packaging protection for products that pass the inspection.

[0075] The present invention performs positioning cutting and opening of copper clad laminate raw materials and processes the board surface, so as to realize the presentation of the required graphics and the gong groove positioning hole ring required for the next process on the copper clad laminate, which is convenient for equipment identification, and uses a gong machine to gong off the area where the non-flowing semi-cured sheet needs to be uncovered, and uses a controlled depth gong to 50% of the depth of the unnecessary area at the semi-bend to make preliminary preparations for the uncovering of the finished product, so that the semi-bend area is not damaged when uncovering, and the core board of the semi-bend area and the board to be uncovered are fused and riveted with the non-flowing semi-cured sheet, and then directly placed on the stacking platform for pressing, so that the core board of the semi-bend area and the board to be uncovered are The boards can be tightly combined together, laying a solid foundation for the production of semi-flexible boards. Multiple pressing processes are used to prevent the boards from being affected by different core board thicknesses, different core board copper thicknesses, and different core board residual copper rates. After drilling, copper deposition and electroplating treatments are performed on the entire board, different processes are used to clean and process the board surface. After the required graphics are presented on the copper clad board, the required windows are developed, the surface is treated with text and tin spraying, and the depth of the gong is controlled to open the cover to obtain a molded product. By optimizing and improving the structure of conventional semi-flexible boards, production is facilitated, product quality is improved, and the risk of quality failure is avoided.

[0076] Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments, or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A method for manufacturing a semi-flexible plate, characterized in that: The following steps are involved: S1. Cutting: Position and cut the copper clad laminate raw materials and cut them into production sizes with the same size; S2, Pre-processing: Clean and process the board surface, remove the non-flowing prepreg and uncovering area; S3, pressing: heating is used to gradually soften the non-flowing prepreg and make it fit tightly to the plate, applying pressure to fuse the plates, riveting to connect the plates, and placing them on the stacking platform for pressing; S4, whole board processing: drilling, copper deposition and electroplating; S5. Board surface cleaning: Use different processes to clean and treat the board surface; S6, surface treatment and molding: the surface is treated with text and tin spraying, the depth of the gong is controlled and the cover is opened to obtain the molded product; S7. Finished product testing and packaging: Test, inspect and package the products.

2. A method for manufacturing a semi-flexible plate according to claim 1, characterized in that: In step S2, the prepreg preprocessing includes the following steps: S21, using micro-etching solution to clean the board surface, covering the board surface with photosensitive ink, and drying and curing; S22, using an exposure machine to irradiate with ultraviolet light to cause a polymerization reaction; S23, after exposure, use the DES line to perform development, etching, and film removal processing to present the required graphics and the gong groove positioning hole ring required for the next process on the copper clad laminate; S24, use a gong machine to gong off the area of ​​the non-flowing prepreg that needs to be uncovered; S25. Use a depth control gong to 50% of the depth of the semi-bend area that is not needed.

3. A method for manufacturing a semi-flexible plate according to claim 2, characterized in that: In step S22, the exposure energy of the exposure machine is selected to be 5-7 grids, and the expansion and shrinkage compensation is adjusted according to different board thicknesses and copper thicknesses. Conventionally, the X compensation is 4 / 10000, and the Y compensation is 8 / 10000. The expansion and shrinkage method is to shrink evenly from the four sides of the board to the center of the board.

4. A method for manufacturing a semi-flexible plate according to claim 2, characterized in that: In step S23, using the DES line includes placing the exposed semi-flexible board material into a developer, dissolving the photosensitive material in the exposed area under the action of the developer to expose the circuit pattern that needs to be retained, etching the board with an etching solution to corrode the copper foil portion that is not protected by the photosensitive material to form the desired circuit pattern, removing the photosensitive material on the board to completely expose the circuit after etching.

5. A method for manufacturing a semi-flexible plate according to claim 1, characterized in that: In step S4, the whole board processing includes the following steps: S41. Select different drilling parameters according to different types of product materials and copper thickness, and drill holes in the entire board; S42, placing the whole board to be treated in a specific treatment device, ensuring that its position is stable and the surface is flat, preparing a certain concentration of chemical copper chloride solution, allowing the copper chloride solution to fully contact the surface of the whole board and the inside of the hole, controlling the temperature, time and flow rate of the solution, and allowing the copper ions in the solution to be deposited on the whole board and in the hole to form a uniform copper layer with a thickness of 1-3um; S43. Through the electrical reaction mechanism, the copper phosphorus balls gradually release copper ions under the action of the electric field. On the cathode plate surface, the copper ions gradually accumulate on the plate surface and form a uniform copper layer, continuously increasing the thickness of the copper layer.

6. A method for manufacturing a semi-flexible plate according to claim 1, characterized in that: In step S5, the board surface cleaning includes the following steps: S51. Use micro-etching solution and abrasive brushing process to clean the board surface, apply a layer of photosensitive dry film, use an exposure machine to irradiate with ultraviolet light to make it polymerize, and use 6-8 grids of exposure energy. After exposure, use a DES line to develop, etch, and remove the film to present the required pattern on the copper clad board; S52. Use volcanic ash and abrasive brushing to clean the board surface, print a layer of photosensitive ink on the board surface, dry and pre-bake it, use an exposure machine to irradiate it with ultraviolet light to make it polymerize, and use 8-11 grids of exposure energy. After exposure, use a developing line to develop the required window.

7. A method for manufacturing a semi-flexible plate according to claim 1, characterized in that: In step S6, the surface treatment and molding includes the following steps: S61. Use a text printing machine to print text on the surface of the product; S62, allowing gold ions to gradually deposit on the surface of the product to form a gold layer, and then evenly covering the surface of the product with molten tin by high-pressure spraying; S63, the product is finally formed by a molding device.

8. A method for manufacturing a semi-flexible plate according to claim 7, characterized in that: In step S63, the product forming accuracy is ±0.1mm, and the special control accuracy is ±0.05mm.

9. A method for manufacturing a semi-flexible plate according to claim 1, characterized in that: In step S7, the finished product testing and packaging includes the following steps: S71. Conduct the product to test whether it can conduct electricity normally. Perform insulation test on the product to verify the insulation performance between different circuit parts of the semi-flexible board and between the circuit and the external environment; S72, start the automatic visual inspection equipment to scan and compare 100% of the products. If a product that does not meet the requirements is found, if the problem with the product is minor, it will be repaired. If the defect of the product is serious, it will be judged as scrapped; S73. Package and protect the products that pass the inspection.

Images