Acceleration test system and method based on weak link of electronic component

Abstract

The invention relates to an accelerated test system and method based on a weak link of an electronic component, and belongs to the technical field of electronic product testing, and the method comprises the steps: carrying out the hierarchy analysis and modeling preparation of a whole machine structure, and carrying out the structural layering of a target whole machine system; weak link identification: identifying a key failure path influencing the reliability in the whole machine, and determining a weak component; acceleration pre-test: carrying out acceleration pre-test on the identified weak component, and obtaining degradation behavior data of the weak component through multi-stage acceleration stress loading; constructing a complete machine acceleration model, and calculating the influence of temperature stress, electric stress and vibration stress on the failure degradation rate of the product; acceleration factor calculation: calculating an acceleration factor based on the activation energy of the weak link part; and predicting the service life of the whole machine through acceleration factors, failure mode analysis and component service life data. The failure of the whole machine is converted into the failure of a weak link; the service degradation process of the whole machine can be reflected more truly, and the accuracy of a prediction result is improved.

Description

Technical Field

[0001] This invention belongs to the field of electronic product testing technology, and in particular relates to an accelerated testing system and method based on the weak points of electronic components. Background Technology

[0002] With the increasing integration of electronic products and the growing complexity of application environments, the reliability requirements for products are rising, especially in high-reliability fields such as aerospace and military, where higher standards are being set for the life prediction and verification of complete system-level products. Traditional life assessment methods are mostly based on single stress tests at the device or system level, but these methods are insufficient to comprehensively reflect the service degradation characteristics of the entire system under various stress conditions. Therefore, conducting research on accelerated life testing modeling for complete electronic products is of great significance for improving the scientific rigor and accuracy of overall system reliability assessment.

[0003] The commonly used "conversion method" involves identifying the weak points in the overall system's reliability, converting system failure into failure of its key components or parts, and then conducting accelerated testing at the component level. Finally, the system's lifespan is estimated using an acceleration factor model. Determining the acceleration factor is crucial to the accuracy of the accelerated testing model. Summary of the Invention

[0004] The purpose of this invention is to provide an accelerated testing system and method based on the weak points of electronic components, thereby improving the accuracy of the accelerated testing model.

[0005] To solve the above-mentioned technical problems, the present invention is achieved through the following technical solution:

[0006] An accelerated testing method based on weak points in electronic components, the method comprising the following steps:

[0007] Overall structural hierarchical analysis and modeling preparation, including structural layering of the target system;

[0008] Weakness identification involves identifying critical failure paths affecting the reliability of the entire system and determining the weak components.

[0009] Accelerated pre-testing involves conducting accelerated pre-testing on identified weak components, obtaining degradation behavior data through multi-level accelerated stress loading;

[0010] Accelerate the construction of the whole machine model and calculate the effects of temperature stress, electrical stress, and vibration stress on the product failure and degradation rate.

[0011] Acceleration factor calculation: The acceleration factor is calculated based on the activation energy of the weak link.

[0012] The lifespan of the entire machine can be predicted by using acceleration factors, failure mode analysis, and component lifespan data.

[0013] Furthermore, the acceleration factor calculation includes the following steps:

[0014] The acceleration factor calculation based on weak links is based on the activation energy of each key component of a single machine, and comprehensively considers the location of weak links based on expert experience and prior conditions to calculate the acceleration factor of a single machine.

[0015] Furthermore, the overall structure is layered into the following levels: overall system level, subsystem level, module level, board level, and component level.

[0016] Furthermore, the identification of the weak components is carried out using a random combination of methods such as similar product method, statistical analysis of usage information, Pareto chart method, fault tree analysis method, and fault mode effect and hazard analysis method.

[0017] Furthermore, the accelerated pre-test includes the following steps: determining the test object and failure mechanism; selecting the step-down accelerated stress level; gradually applying stress and observing product degradation and failure; real-time monitoring and data recording to determine the high-temperature operating limit and destructive limit; calculating the acceleration factor and predicting the lifespan; verifying and summarizing the test results and optimizing the accelerated test design.

[0018] Furthermore, in the construction of the overall acceleration model, the temperature stress acceleration model adopts the Arrhenius model, and the electrical stress and vibration stress acceleration models adopt the inverse power law model.

[0019] Furthermore, the identification steps for weak components include identifying key components affecting the reliability of the entire machine by reviewing historical failure data, performing failure mode and impact analysis, constructing a fault tree, and combining expert evaluation methods.

[0020] On the other hand, an accelerated testing system based on the weak points of electronic components is proposed, the system comprising:

[0021] The structural modeling module is used to perform structural hierarchical analysis on the whole system and establish a hierarchical model from the whole system level to the component level.

[0022] The weak link identification module is used to identify key components that affect the reliability of the whole machine based on historical data analysis, failure mode and effect analysis, fault tree modeling and expert evaluation methods.

[0023] The accelerated pre-testing module is used to apply multi-level accelerated stress conditions to the identified weak components and collect degradation behavior data;

[0024] The degradation analysis module is used to select a degradation model based on degradation data and fit the degradation rate under various stress conditions through regression analysis.

[0025] The acceleration factor calculation module is used to select a suitable acceleration factor model and calculate the acceleration factor under various stress conditions based on degradation data.

[0026] The overall system life prediction module is used to predict the life of the entire system based on the calculated acceleration factor, failure mode analysis results, and component life data.

[0027] Beneficial effects:

[0028] The failure of the entire machine is transformed into the failure of its weakest link; at the same time, the competitive failure model based on the accelerated model of the whole machine can more realistically reflect the service degradation process of the whole machine and improve the accuracy of the prediction results.

[0029] Of course, any product implementing this invention does not necessarily need to achieve all of the advantages described above at the same time. Attached Figure Description

[0030] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0031] Figure 1 This is a flowchart of a method according to an embodiment of the present disclosure. Detailed Implementation

[0032] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0033] An accelerated testing method based on the weak points of electronic components is proposed. This method utilizes the "conversion method" from the theory of accelerated life testing of electronic products, transforming overall system failure into the failure of its weak points. Simultaneously, based on a competitive failure model of the overall accelerated testing model, the failure of a critical component in the electronic product is considered a complete system failure. Based on this accelerated testing theory, an accelerated testing model for the entire electronic product is constructed, and the corresponding acceleration coefficient is calculated.

[0034] like Figure 1 As shown, this invention discloses an accelerated testing system and method based on weak points in electronic components. The device includes:

[0035] S1: Overall structural hierarchy analysis and modeling preparation;

[0036] First, a structural layered analysis of the target system is performed to ensure modeling accuracy. Electronic products typically consist of several subsystems, functional modules, boards, and components, and their degradation behavior involves physical field coupling between different levels.

[0037] In some embodiments, the entire device can be divided from top to bottom into the overall device level, subsystem level, board level, and component material level. This includes metallic materials, non-metallic materials, electronic components, and energy-containing products. Structural decomposition clarifies the overall structural relationships, providing a basic framework for weak link identification and transformation modeling.

[0038] S2: Identification of weak links;

[0039] The whole-system life test is transformed into an accelerated life test of its weak components, which reduces modeling complexity and improves calculation accuracy.

[0040] In some embodiments, the following steps are used to identify critical failure paths affecting the reliability of the entire system:

[0041] Historical data screening: Review failure records of similar products and identify common failure locations;

[0042] FMECA analysis: Using failure mode, effects and hazard analysis methods, we identify the potential failure modes, failure probabilities and their impact on each component.

[0043] Fault tree construction: Expand the overall system failure downwards to construct a failure cause-effect tree and locate the failure propagation path;

[0044] Expert scoring method to assist in confirmation: Combining the experience of R&D, testing and on-site maintenance experts, the importance and sensitivity of each component are assessed, and the reliability impact factors are quantified.

[0045] The bottleneck components for the overall system's reliability were finally identified, and these components will be used as the main modeling objects in subsequent experiments.

[0046] Understandably, weak points in product reliability can be identified through a random combination of the following methods: similar product method, statistical analysis of usage information, Pareto chart method, fault tree analysis method, and Failure Mode and Effects and Criticality Analysis (FMECA).

[0047] S3: Accelerated Pre-testing. Accelerated pre-testing is performed on the identified weak components. Through multi-level accelerated stress loading, data on their degradation behavior is obtained. Specific steps are as follows:

[0048] Determine the test object and failure mechanism; select the step-down accelerated stress level; apply stress gradually and observe product degradation and failure; monitor and record data in real time to determine the high-temperature operating limit and destructive limit; calculate the acceleration factor and predict the lifespan; verify and summarize the test results and optimize the accelerated test design.

[0049] S4: Accelerated Model Building for the Whole Machine;

[0050] For temperature stress, the Arrhenius model can be used to effectively describe the effect of temperature stress on the product failure degradation rate A(T):

[0051]

[0052] In the formula, 'a' is a constant related to the properties of the product itself, and 'k' is the Boltzmann constant, K = 8.623 × 10⁻⁶. -5 eV / K, E a The activation energy (eV) is related to the material properties, and T is the absolute temperature (K). During the design and experimental phase, empirical values ​​of the parameters can be obtained through pre-experiments or by consulting historical data, such as the activation energy E of tin-lead solder. a = 80 kJ / mol. Correspondingly, the formula for calculating the acceleration factor of temperature stress is:

[0053]

[0054] Among them, T n For normal storage temperature stress, T s To accelerate temperature stress, the unit is K.

[0055] The influence of electrical stress (current, voltage, electrical power, etc.) and vibration stress on the failure and degradation rate of electromechanical products can be expressed by an inverse power-law model:

[0056] θ(V)=a·V -b

[0057] In the formula, θ represents the lifetime characteristic, a and b are constant coefficients greater than zero, and V represents electrical stress or vibration stress. The corresponding electrical stress acceleration factor is calculated as follows:

[0058]

[0059] In the formula: V n This is the normal operating voltage; V s To accelerate the test voltage.

[0060] By consulting historical data or empirical values, or by determining the model parameters of the single-stress acceleration model through preliminary experiments, and using the single-stress model with determined parameters, the acceleration factor AF is calculated for each selected single-stress acceleration level. i The calculation.

[0061] In some publicly available publications, for ground-based telemetry and control (TT&C) integrated products, the activation energy parameter E for the temperature model is selected. a =80KJ / mol. The electrical stress is selected as one times the conventional electrical stress, so it has no accelerating effect. Vibration stress is used as the stress loading to be considered. Therefore, the acceleration factor is calculated as follows.

[0062] Room temperature (K) Accelerated temperature (K) Acceleration factor (AF) 298(25℃) <![CDATA[S1]]> <![CDATA[AF1]]> 298(25℃) <![CDATA[S2]]> <![CDATA[AF2]]> 298(25℃) <![CDATA[S3]]> <![CDATA[AF3]]> 298(25℃) <![CDATA[S4]]> <![CDATA[AF4]]> 298(25℃) <![CDATA[S5]]> <![CDATA[AF5]]>

[0063] S5: Acceleration factor calculation;

[0064] The acceleration factor calculation method based on weak points is mainly used to identify and evaluate the most vulnerable parts of electronic products. By conducting accelerated testing on these weak points, their failure modes and degradation rates under different stress conditions are determined. Then, based on this data, the acceleration factor is calculated, ultimately predicting their operational lifespan under normal conditions. The main steps are as follows:

[0065] 1) Identify weak points

[0066] First, it is necessary to identify the weak points of the system. Weak points are the parts of the entire system most prone to failure or degradation. This is typically determined using methods such as historical failure data, FMECA (Failure Mode and Effects Analysis), and stress analysis. FMECA analyzes individual components of the system, identifies failure modes, assesses their impact, and finds the parts with the highest failure frequency. Stress analysis analyzes the operating conditions of electronic products during use to determine which parts are subjected to the greatest stress or operate in the most extreme environments.

[0067] 2) Calculate the acceleration factor based on the activation energy of weak links.

[0068] The acceleration factor calculation based on weak links is based on the activation energy of each key component of the single machine, and comprehensively considers the weak link location based on expert experience and prior conditions, and calculates the single machine's acceleration factor using the following formula.

[0069]

[0070] Ea1, Ea2, ..., Ea n The activation energy corresponds to the component with weak links, where Ea is the activation energy and T is the activation energy. U For the applied temperature stress, T A The reference temperature stress is α, the correction factor is k, and the Boltzmann constant is k.

[0071] S6 Overall Lifespan Prediction and Test Design;

[0072] By calculating the S5 acceleration factor and combining it with failure mode analysis and component life data, the expected lifespan of the entire machine under different stress conditions can be obtained.

[0073] Some publications propose an accelerated testing system based on the weak points of electronic components. This system includes:

[0074] The structural modeling module is used to perform structural hierarchical analysis on the whole system and establish a hierarchical model from the whole system level to the component level.

[0075] The weak link identification module is used to identify key components that affect the reliability of the whole machine based on historical data analysis, failure mode and effect analysis, fault tree modeling and expert evaluation methods.

[0076] The accelerated pre-testing module is used to apply multi-level accelerated stress conditions to the identified weak components and collect degradation behavior data;

[0077] The degradation analysis module is used to select a degradation model based on degradation data and fit the degradation rate under various stress conditions through regression analysis.

[0078] The acceleration factor calculation module is used to select a suitable acceleration factor model and calculate the acceleration factor under various stress conditions based on degradation data.

[0079] The overall system life prediction module is used to predict the life of the entire system based on the calculated acceleration factor, failure mode analysis results, and component life data.

[0080] In the description of this specification, references to terms such as "an embodiment," "example," "specific example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0081] The preferred embodiments of the present invention disclosed above are merely illustrative of the invention. These preferred embodiments do not exhaustively describe all details, nor do they limit the invention to the specific implementations described. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of the invention, thereby enabling those skilled in the art to better understand and utilize the invention. The invention is limited only by the claims and their full scope and equivalents.

Claims

1. An accelerated test method based on weak link of electronic components, characterized in that: The method comprises the following steps: ​ Whole machine structure hierarchical analysis and modeling preparation, the target whole machine system is structurally layered; Weak link identification, identifying the key failure path that affects reliability in the whole machine, and determining the weak components; Accelerated pre-test, accelerated pre-test on the identified weak components, obtaining the degradation behavior data through multi-level accelerated stress loading; Whole machine acceleration model construction, calculating the influence of temperature stress, electric stress and vibration stress on product failure degradation rate; Acceleration factor calculation, calculating the acceleration factor based on the activation energy of the weak link part; Through the acceleration factor, failure mode analysis and component life data, the life of the whole machine is predicted.

2. The method according to claim 1, wherein the method is characterized by: The acceleration factor calculation comprises the following steps: The acceleration factor calculation based on the weak link part is based on the activation energy of each key component of the single machine, and the weak link part positioning based on expert experience and prior conditions is integrated to calculate the acceleration factor of the single machine.

3. The method according to claim 1, wherein the method is characterized by: The whole machine structure layering comprises the whole machine level, the subsystem level, the module level, the board card level and the component level.

4. The method according to claim 1, wherein the method is characterized by: The identification of the weak components adopts the random combination method of the similar product method, the statistical analysis method in use information, the arrangement chart method, the fault tree analysis method and the failure mode, effects and criticality analysis method.

5. The method according to claim 1, wherein the method is characterized by: The accelerated pre-test comprises the following steps: determining the test object and the failure mechanism; selecting the step-down accelerated stress level; gradually applying stress, observing product degradation and failure; real-time monitoring and data recording, judging the high temperature working limit and the destruction limit; calculating the acceleration factor, predicting the life; verifying and summarizing the test results, optimizing the accelerated test design.

6. The method for accelerating test of weak link of electronic components based on electronic components according to claim 1, characterized in that: In the whole machine acceleration model construction, the temperature stress acceleration model adopts the Arrhenius model, and the electric stress and vibration stress acceleration models adopt the inverse power law model.

7. The method according to claim 1, wherein the method is characterized by: The weak component identification step comprises identifying the key components that affect the reliability of the whole machine by consulting historical failure data, performing failure mode and effect analysis, constructing a fault tree, and combining expert evaluation methods.

8. An acceleration test system based on weak link of electronic components, characterized in that, The system comprises: A structure modeling module for performing structure hierarchical analysis on the whole machine system and establishing a hierarchical model from the whole machine level to the component level; A weak link identification module for identifying the key components that affect the reliability of the whole machine based on historical data analysis, failure mode and effect analysis, fault tree modeling and expert evaluation methods; An accelerated pre-test module for applying multi-level accelerated stress conditions to the identified weak components and collecting degradation behavior data; A degradation analysis module for selecting a degradation model according to the degradation data and fitting the degradation rate under each stress condition through regression analysis; An acceleration factor calculation module for selecting a suitable acceleration factor model and calculating the acceleration factor under each stress condition based on the degradation data; A whole machine life prediction module for predicting the life of the whole machine system according to the calculated acceleration factor, failure mode analysis results and component life data.

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