Liquid pipeline, heat dissipation device and electronic equipment

Abstract

The invention provides a liquid pipeline, a heat dissipation device and electronic equipment, and relates to the technical field of heat dissipation. The liquid pipeline comprises a pipe body and a pipe joint, the pipe body comprises a first-layer pipe and a second-layer pipe, and the second-layer pipe is arranged outside the first-layer pipe in a sleeving mode. The first-layer pipe is connected with the pipe joint, and a first sealing structure is arranged at the joint of the first-layer pipe and the pipe joint. The second-layer pipe is connected with the pipe connector, and a second sealing structure is arranged at the joint of the second-layer pipe and the pipe connector. According to the liquid pipeline, the liquid leakage risk of the liquid pipeline can be effectively reduced through sealing design between the two layers of pipelines and the pipe joint, so that the reliability of the structure and the heat dissipation performance of the heat dissipation device applying the liquid pipeline can be improved, and the loss of electronic equipment caused by liquid leakage of the liquid pipeline is avoided; and the heat dissipation reliability of the heat dissipation device on the electronic equipment can be improved.

Description

Technical Field

[0001] The present application relates to the field of heat dissipation, and in particular to a liquid pipeline, a heat dissipation device and an electronic device. Background Art

[0002] In the era of the Internet, big data and cloud computing, higher requirements are placed on the transmission and processing speed, storage capacity and high-performance computing capabilities of massive data. The chips of electronic devices such as servers generate a lot of heat during intensive computing. Overheating of the chips will reduce their processing capabilities or even damage them.

[0003] In order to achieve chip heat dissipation, a heat dissipation device is usually set up for the chip. At present, liquid cooling has gradually become the mainstream solution for chip heat dissipation of electronic equipment. Among them, the liquid cooling device mainly utilizes the circulation of liquid working fluid in the liquid pipeline to achieve heat dissipation of the chip through heat exchange between the liquid working fluid and the chip. As one of the core components of the liquid cooling device, the structural reliability of the liquid pipeline plays a vital role in the performance and life of the entire liquid cooling device. Therefore, how to improve the structural reliability of the liquid pipeline has become a technical problem that needs to be solved urgently in the field of liquid cooling devices. Summary of the invention

[0004] The present application provides a liquid pipeline, a heat dissipation device and an electronic device to reduce the risk of liquid leakage in the liquid pipeline, thereby improving the performance of the heat dissipation device, so as to facilitate the effective heat dissipation of the electronic device by the heat dissipation device.

[0005] In a first aspect, the present application provides a liquid pipeline, which includes a pipe body and a pipe joint, wherein the pipe body includes a first layer of pipes and a second layer of pipes, and the second layer of pipes is sleeved on the outside of the first layer of pipes. The first layer of pipes is connected to the pipe joint, and the connection between the first layer of pipes and the pipe joint has a first sealing structure. The second layer of pipes is connected to the pipe joint, and the connection between the second layer of pipes and the pipe joint has a second sealing structure. The liquid pipeline provided by the present application can effectively reduce the risk of leakage of the liquid pipeline by designing sealing structures at the connection between the two layers of pipes and the pipe joint, thereby improving the structural reliability of the liquid pipeline.

[0006] In the present application, the specific arrangement of the first sealing structure at the connection between the first layer of pipe and the pipe joint is not limited. Exemplarily, the first sealing structure may include at least one of a first sealing ring, a first clamp or a first buckle.

[0007] In one possible implementation, the pipe joint may include a pagoda plug-in portion, at least a portion of which is inserted into the tube cavity of the first layer of tube, and the pagoda structure of the pagoda plug-in portion is interference fit with the tube wall of the first layer of tube to form a first sealing structure, thereby achieving connection and sealing between the first layer of tube and the pipe joint.

[0008] In another possible implementation of the present application, the first sealing structure also includes a first sealing ring, which is sleeved on the pipe joint. The pipe wall of the first layer of pipe and the outer wall of the pipe joint squeeze the first sealing ring, thereby achieving connection and sealing between the first layer of pipe and the pipe joint.

[0009] In another possible implementation of the present application, the pipe joint includes a threaded connection portion, and the pipe wall of the first layer of pipe is provided with a threaded connection surface. The threaded connection portion and the threaded connection surface are screwed together to form a first sealing structure, thereby realizing the connection and sealing of the first layer of pipe and the pipe joint, which can effectively simplify the connection and sealing method of the first layer of pipe and the pipe joint, and make the connection between the first layer of pipe and the pipe joint more reliable.

[0010] In another possible implementation of the present application, the pipe joint is provided with a first clamping portion, and the first clamping portion has a first groove that is recessed toward the axial direction of the pipe joint. The first layer of pipe includes a first recessed portion, the first recessed portion is recessed toward the first groove, and the first recessed portion and the first groove are clamped to form a first sealing structure, thereby achieving connection and sealing between the first layer of pipe and the pipe joint.

[0011] In addition, the second layer of pipe may include a second recessed portion, which is recessed toward the first recessed portion and is clamped with the first recessed portion, which can effectively improve the reliability of the seal between the first layer of pipe and the pipe joint.

[0012] In order to improve the reliability of the connection between the pipe body and the pipe joint, the first sealing structure may further include a first clamp, which is sleeved on the outside of the pipe body, and the first clamp presses the first recessed portion and the second recessed portion toward the first groove, so that the connection between the pipe body and the pipe joint is more reliable under the extrusion force of the first clamp, and can effectively improve the reliability of the seal between the first layer of pipe and the pipe joint.

[0013] It can be understood that in the present application, the first sealing structure can also be set as a combination of multiple sealing structures. For example, the first layer of pipe and the pipe joint can simultaneously form a first sealing structure at the connection between them through the interference fit between the pagoda structure of the pagoda joint and the pipe wall of the first layer of pipe and the outer wall of the pipe joint by squeezing the first sealing ring, which can effectively improve the reliability of the connection and sealing between the first layer of pipe and the pipe joint.

[0014] In the present application, the second sealing structure may be provided in various forms. Exemplarily, the second sealing structure includes at least one of a second sealing ring, a second clamp or a second buckle.

[0015] In a possible implementation, the second sealing structure includes a second sealing ring, which is sleeved on the pipe joint. The pipe wall of the second layer pipe and the outer wall of the pipe joint squeeze the second sealing ring, thereby achieving connection and sealing between the second layer pipe and the pipe joint.

[0016] In another possible implementation of the present application, the pipe joint is further provided with a second clamping portion, the second clamping portion has a second groove, and the second groove is recessed toward the axis direction of the pipe joint. The second layer of pipe also includes a third recessed portion, the third recessed portion is recessed toward the second groove, and the third recessed portion and the second groove are clamped to form a second sealing structure, thereby achieving connection and sealing between the second layer of pipe and the pipe joint.

[0017] In addition, the second sealing structure also includes a second clamp, which is sleeved on the outside of the second layer of pipe, and the second clamp presses the third recessed portion toward the second groove, so that under the extrusion force of the second clamp, the connection between the second layer of pipe and the pipe joint is more reliable, and the reliability of the seal between the second layer of pipe and the pipe joint can be effectively improved.

[0018] In another possible implementation of the present application, when the pipe joint includes a pagoda plug-in portion, the pipe wall of the second layer of pipe and the pagoda structure of the pagoda plug-in portion can be interference fit to form a second sealing structure, thereby achieving connection and sealing between the second layer of pipe and the pipe joint.

[0019] It can be understood that in the present application, the second sealing structure can also be set as a combination of multiple sealing structures. For example, the second layer of pipe and the pipe joint can simultaneously form a second sealing structure at the connection between them through the interference fit between the pagoda structure of the pagoda joint and the pipe wall of the second layer of pipe and the outer wall of the pipe joint by squeezing the second sealing ring, which can effectively improve the reliability of the connection and sealing between the second layer of pipe and the pipe joint.

[0020] In a possible implementation of the present application, the liquid pipeline may also include a liquid leakage alarm device, which includes a water receiving component and a liquid leakage alarm component. Among them, the water receiving component includes a water receiving trough, and the notch of the water receiving trough faces the connection between the second layer of pipes and the pipe joint, so that the water receiving trough can be used to collect liquid leaked from the connection between the second layer of pipes and the pipe joint. In addition, at least part of the liquid leakage alarm component is accommodated in the water receiving trough, and when liquid is collected in the water receiving trough, the liquid leakage alarm component can be used to send an alarm signal. In this way, the staff can replace the liquid pipeline with a leakage problem according to the alarm signal sent by the liquid leakage alarm component, which can effectively improve the safety of the heat dissipation device using the liquid pipeline.

[0021] In a second aspect, the present application further provides a heat dissipation device, which includes a liquid pipeline as described in any possible implementation of the first aspect. The risk of leakage of the liquid pipeline of the heat dissipation device is low, and the reliability of the structure and heat dissipation performance of the heat dissipation device is better, thereby improving the safety of use of the heat dissipation device.

[0022] In a third aspect, the present application further provides an electronic device, which includes a chip and the heat dissipation device of the second aspect, wherein the heat dissipation device is used to dissipate heat from the chip. In the electronic device, the heat dissipation device can effectively dissipate heat from the chip, and the liquid pipeline of the heat dissipation device has a better structural reliability, which can effectively avoid the loss of the electronic device caused by leakage of the liquid pipeline. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 A schematic diagram of the structure of a heat dissipation device provided in an embodiment of the present application;

[0024] Figure 2 A schematic diagram of the structure of a liquid pipeline provided in an embodiment of the present application;

[0025] Figure 3 for Figure 2 A cross-sectional view of the liquid pipeline at A shown in FIG.

[0026] Figure 4 for Figure 3 The schematic diagram of the principle structure of the liquid pipeline shown;

[0027] Figure 5 Another structural schematic diagram of a liquid pipeline provided in an embodiment of the present application;

[0028] Figure 6 Another structural schematic diagram of a liquid pipeline provided in an embodiment of the present application;

[0029] Figure 7 Another structural schematic diagram of a liquid pipeline provided in an embodiment of the present application;

[0030] Figure 8 Another structural schematic diagram of a liquid pipeline provided in an embodiment of the present application;

[0031] Fig. 9 Another structural schematic diagram of a liquid pipeline provided in an embodiment of the present application;

[0032] Fig.10 Another structural schematic diagram of a liquid pipeline provided in an embodiment of the present application;

[0033] Fig.11 Another structural schematic diagram of a liquid pipeline provided in an embodiment of the present application.

[0034] Reference numerals:

[0035] 1-liquid pipeline; 101-tube body; 1011-first layer of tube; 10111-first limiting portion; 10112-threaded connection surface;

[0036] 10113-first recessed portion; 1012-second layer tube; 10121-second limiting portion; 10122-second recessed portion;

[0037] 10123-third recessed portion; 102-pipe joint;

[0038] 1021- pagoda plug-in portion; 1022- limiting groove; 1023- threaded connection portion; 1024- first clamping portion; 10241- first groove;

[0039] 1025 - second clamping portion; 10251 - second groove; 103 - first sealing structure; 1031 - first sealing ring;

[0040] 104-second sealing structure; 1041-second sealing ring; 105-first clamp; 106-second clamp;

[0041] 107-liquid leakage alarm device; 1071-water receiving component; 10711-water receiving tank; 1072-liquid leakage alarm component;

[0042] 2- Condenser. DETAILED DESCRIPTION

[0043] The terms used in the following embodiments are only for the purpose of describing specific embodiments and are not intended to be limiting of the present application. As used in the specification and appended claims of the present application, the singular expressions "a", "an", and "the" are intended to also include expressions such as "one or more", unless the context clearly indicates otherwise. In this specification, the terms "including", "having", and their variations all mean "including but not limited to", unless otherwise specifically emphasized.

[0044] In order to facilitate the understanding of the liquid pipeline and heat sink provided by the embodiment of the present application, the application scenario of the liquid pipeline and heat sink provided by the embodiment of the present application is first described below. The heat sink provided by the present application can be, but is not limited to, used for dissipating heat to high-power electronic devices with high heat generation, mainly dissipating heat to the chip of the electronic device. Taking the electronic device as a server as an example, the chip of the server can be a bare chip or a non-bare chip, and can include a central processing unit (CPU), artificial intelligence (AI), a system on chip (SoC), and other high-power chips. These high-power chips will generate a lot of heat during work, and it is difficult to meet their heat dissipation requirements only through natural heat dissipation, and overheating of the chip will cause its processing capacity to be reduced or even damaged. Therefore, heat sinks are usually provided for these chips in the server to ensure the efficient operation of the chip.

[0045] Liquid cooling has the advantages of high heat dissipation efficiency, low noise and low energy consumption. Currently, liquid cooling devices are mostly used in servers to dissipate heat from chips. Figure 1 , Figure 1 Schematic diagram of a heat dissipation device provided in an embodiment of the present application. The heat dissipation device may include a condenser 2 and a drive device ( Figure 1 ) and other structures to form a heat dissipation circulation loop in the heat dissipation device. Among them, the condenser 2 can be used to cool the liquid working medium, and the driving device can be used to drive the liquid working medium to circulate in the above-mentioned heat dissipation circulation loop. When the heat dissipation device is applied to electronic equipment such as servers, the cooled liquid working medium exchanges heat with the chip and enters the above-mentioned heat dissipation circulation loop after the temperature rises. When it flows to the condenser 2 driven by the driving device, it will be cooled again and can be used again to exchange heat with the chip, thereby realizing the heat dissipation of the chip through the flow of the liquid working medium in the heat dissipation circulation loop.

[0046] As one of the core components of the liquid cooling device to achieve the heat dissipation function, the structural reliability of the liquid pipe plays a vital role in the reliability of the overall structure, heat dissipation performance and life of the liquid cooling device. At present, the liquid pipes are mainly divided into three categories: the first category is metal pipes, such as copper pipes or aluminum pipes; the second category is rubber pipes, such as ethylene propylene diene monomer (EPDM) pipes; the third category is plastic pipes, such as fluorinated ethylene propylene (FEP) pipes, polytetrafluoroethylene (PTFE) pipes or polypropylene (PP) pipes. Plastic pipes such as FEP pipes and PTFE pipes have been widely used in the field of liquid cooling due to their advantages such as chemical stability, flexibility, processability, small size and flexible turning. However, since current plastic pipes are usually single-layer pipes, they are affected by factors such as the consistency and uniformity of molding materials, changes in raw material composition, variations in control parameters, embedded impurities, external force damage in the application environment, and bending stress. Small defects such as micro-damage or local cracks inside, combined with creep aging caused by large internal stress of bending, will cause the reliability of plastic pipes to drop sharply, leading to liquid leakage and huge losses to the server. In addition, rubber pipes are usually large in size and have a large turning radius, which cannot solve the layout of small turning scenarios. Rubber pipes also have defects such as large space occupied by joints and large evaporation. Metal pipes have no floating tolerance capability, and their connection bridging force is large. Metal pipes need to be welded and fixed, and there are many welds, making it difficult to ensure the yield. Welds are prone to cracking after being stressed, and their impact resistance is poor.

[0047] In view of the defects of the above-mentioned single-layer pipeline, a combined pipeline solution of double-layer pipeline has been proposed in the art. However, in the current double-layer pipeline, when it is specifically set up, a sealing design is usually only performed between the inner layer pipeline and the pipe joint, and there is no sealing structure between the outer layer pipeline and the pipe joint. This results in the outer layer pipeline having no secondary protection capability at the pipe joint. When the inner layer pipeline leaks, the liquid working fluid will leak out between the outer layer pipeline and the pipe joint, thereby reducing the heat dissipation performance of the entire liquid cooling device and may cause damage to the server using the liquid cooling device.

[0048] In view of this, the liquid pipeline provided by the present application adopts a double-layer pipeline structure design, and a sealing design is performed between the two layers of pipelines and the pipe joints to effectively reduce the risk of liquid leakage in the liquid pipeline, thereby improving the reliability of the structure and heat dissipation performance of the heat dissipation device using the liquid pipeline, so as to improve the reliability of the heat dissipation of the heat dissipation device for electronic equipment. In order to make the purpose, technical solution and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the drawings and specific embodiments.

[0049] Reference Figure 2 , Figure 2 A schematic diagram of the structure of a liquid pipeline 1 provided in an embodiment of the present application. The liquid pipeline 1 includes a pipe body 101 and a pipe joint 102, such as Figure 2 As shown, the liquid pipeline 1 may include two pipe joints 102 , the pipe body 101 is located between the two pipe joints 102 , and both ends of the pipe body 101 are respectively connected to the corresponding pipe joints 102 .

[0050] Reference Figure 3 , Figure 3 for Figure 2 The cross-sectional view of the liquid pipeline 1 at A shown in FIG. In the present application, the pipe body 101 includes a first layer of pipe 1011 and a second layer of pipe 1012, wherein the second layer of pipe 1012 is sleeved on the outside of the first layer of pipe 1011. The present application does not limit the material of the first layer of pipe 1011, which can be a metal pipe such as a copper pipe, an aluminum pipe, a stainless steel pipe, or a non-metallic pipe such as a plastic pipe, a rubber pipe, etc. In addition, the first layer of pipe 1011 can be a single-layer pipe or a combination of multiple layers of pipes. The second layer of pipe 1012 can also be a metal pipe such as a copper pipe, an aluminum pipe, a stainless steel pipe, or a non-metallic pipe such as a plastic pipe, a rubber pipe, etc., and the second layer of pipe 1012 can be a single-layer pipe or a combination of multiple layers of pipes. In the present application, the materials of the first layer of pipe 1011 and the second layer of pipe 1012 can be the same or different.

[0051] In addition, the liquid pipeline 1 provided in the embodiment of the present application can be set as a straight pipeline, or can be set as a curved pipeline according to specific application scenarios. When the liquid pipeline 1 is set as a curved pipeline, the first layer of pipe 1011 can be a corrugated pipe, or can be pre-bent according to specific bending requirements, and the second layer of pipe 1012 can be pre-bent to meet the requirements.

[0052] You can continue to refer to Figure 3 The first layer of pipe 1011 is connected to the pipe joint 102, and a first sealing structure 103 is provided at the connection between the first layer of pipe 1011 and the pipe joint 102. The second layer of pipe 1012 is connected to the pipe joint 102, and a second sealing structure 104 is provided at the connection between the second layer of pipe 1012 and the pipe joint 102. Figure 3In the liquid pipeline 1 shown, the pipe joint 102 includes a pagoda plug-in portion 1021, at least part of which is inserted into the tube cavity of the first layer tube 1011 to achieve the connection between the first layer tube 1011 and the pipe joint 102. In addition, at the connection between the first layer tube 1011 and the pipe joint 102, the pagoda structure of the pagoda plug-in portion 1021 is interference-fitted with the tube wall of the first layer tube 1011 to form a first sealing structure 103, thereby achieving the connection and sealing between the first layer tube 1011 and the pipe joint 102 at their connection.

[0053] In this application, in order to facilitate the connection between the pipe joint 102 and the first layer pipe 1011, reference may be made to Figure 4 , Figure 4 for Figure 3 The schematic diagram of the principle structure of the liquid pipeline 1 is shown. Among them, the first layer of the tube 1011 can be provided with a first limiting portion 10111, and the first limiting portion 10111 is recessed into the tube cavity of the first layer of the tube 1011. In the present application, the recessed shape of the first limiting portion 10111 is not limited, and its exemplary shape can be trapezoidal, triangular, semicircular, spiral, wavy or rectangular, etc. When the pipe joint 102 is plugged into the first layer of the tube 1011, the first limiting portion 10111 can be clamped and fixed by the clamping structure, so that the first layer of the tube 1011 can be better stressed during the process of inserting the pipe joint 102 into the first layer of the tube 1011, so as to achieve a reliable connection between the pipe joint 102 and the first layer of the tube 1011.

[0054] You can continue to refer to Figure 3 and Figure 4 The second sealing structure 104 may include a second sealing ring 1041, which is located at the connection between the second layer tube 1012 and the pipe joint 102. The second sealing ring 1041 can be sleeved on the pipe joint 102 so that the second sealing ring 1041 is located between the tube wall of the second layer tube 1012 and the outer side wall of the pipe joint 102, and the tube wall of the second layer tube 1012 and the outer side wall of the pipe joint 102 squeeze the second sealing ring 1041 and deform the second sealing ring 1041, so as to realize the connection between the second layer tube 1012 and the pipe joint 102 and realize the sealing of the second layer tube 1012 and the pipe joint 102 at their connection.

[0055] You can continue to refer to Figure 3 In the embodiment of the present application, the pipe joint 102 can also be provided with a limiting groove 1022, and the second sealing ring 1041 can be installed in the limiting groove 1022, so that the limiting groove 1022 limits the axial movement of the second sealing ring 1041 along the pipe joint 102, thereby improving the reliability of the connection and sealing between the second layer pipe 1012 and the pipe joint 102.

[0056] In addition, if Figure 4 As shown, the second layer tube 1012 may also be provided with a second limiting portion 10121, which is arranged opposite to the first limiting portion 10111, and the second limiting portion 10121 is recessed toward the first limiting portion 10111, so that the second limiting portion 10121 is engaged with the first limiting portion 10111, thereby achieving the limitation of the first layer tube 1011 and the second layer tube 1012 in the arrangement direction of the two pipe joints 102 in the tube body 101.

[0057] It can be understood that during the assembly of the liquid pipeline 1, the second limiting portion 10121 of the second layer tube 1012 can be formed by an extrusion molding process after the second layer tube 1012 is sleeved on the first layer tube 1011. For example, when the second layer tube 1012 is set as a metal tube, it can effectively simplify the processing and assembly process of the liquid pipeline 1.

[0058] In the liquid pipeline 1 provided in the present application, the first layer pipe 1011 and the second layer pipe 1012 can adopt the above Figure 3 In addition to the illustrated method for achieving connection and sealing with the pipe joint 102, other possible methods may also be used. Figure 5 , Figure 5 Another structural schematic diagram of the liquid pipeline 1 provided in an embodiment of the present application. Figure 5 The liquid pipeline 1 shown is Figure 3 The difference of the liquid pipeline 1 shown is mainly that the first layer pipe 1011 and the pipe joint 102 can be connected and sealed by means of threaded connection. In specific implementation, the pipe joint 102 may include a threaded connection portion 1023. In addition, the pipe wall of the first layer pipe 1011 is provided with a threaded connection surface 10112, and the threaded connection portion 1023 and the threaded connection portion 1023 are screwed together to form a first sealing structure 103, so that the first layer pipe 1011 and the pipe joint 102 can be connected and sealed by means of threaded connection, which can effectively simplify the assembly process of the first layer pipe 1011 and the pipe joint 102. It can be understood that when the first layer pipe 1011 and the pipe joint 102 are connected by means of threaded connection, the first layer pipe 1011 can be, but is not limited to, a metal pipe.

[0059] It is worth mentioning that Figure 5 Other structures of the liquid pipeline 1 shown can refer to the above Figure 3 The liquid pipeline 1 shown is set up and will not be described in detail here.

[0060] Another example Figure 6 As shown, Figure 6Another structural schematic diagram of the liquid pipeline 1 provided in an embodiment of the present application, wherein the pipe joint 102 is provided with a first clamping portion 1024, and the first clamping portion 1024 has a first groove 10241 recessed toward the axial direction of the pipe joint 102. The first clamping portion 1024 can be provided as an annular structure, or a discontinuous structure including a multi-segment structure provided at intervals.

[0061] You can continue to refer to Figure 6 The first layer tube 1011 also includes a first recessed portion 10113, which is recessed toward the first groove 10241, and the first recessed portion 10113 and the first groove 10241 are snap-fitted to form a first sealing structure 103, thereby achieving connection and sealing between the first layer tube 1011 and the pipe joint 102.

[0062] In addition, if Figure 6 As shown, the second layer tube 1012 also includes a second recessed portion 10122, which is recessed toward the first recessed portion 10113, and the second recessed portion 10122 is clamped with the first recessed portion 10113, which can also be understood as the second recessed portion 10122 is clamped with the first groove 10241.

[0063] It is understandable that in Figure 6 In the liquid pipeline 1 shown, the first recessed portion 10113 of the first layer tube 1011 and the second recessed portion 10122 of the second layer tube 1012 can be prefabricated before being assembled with the pipe joint 102. Alternatively, the first recessed portion 10113 of the first layer tube 1011 can also be formed by extrusion after the pipe joint 102 is plugged into the first layer tube 1011, and the first layer tube 1011 can be a metal tube, or a non-metallic tube such as a plastic tube or a rubber tube. The second recessed portion 10122 of the second layer tube 1012 can also be formed by an extrusion molding process after the second layer tube 1012 is sleeved on the first layer tube 1011, and the second layer tube 1012 can be a metal tube. In addition, the first recessed portion 10113 of the first layer tube 1011 and the second recessed portion 10122 of the second layer tube 1012 can also be formed by a one-time extrusion molding process after the second layer tube 1012 is sleeved on the first layer tube 1011. In this case, the second layer tube 1012 can be set as a metal tube, and the first layer tube 1011 can be a metal tube or a non-metal tube, which can effectively simplify the assembly process of the tube body 101 and the pipe joint 102.

[0064] It is worth mentioning that Figure 6 The other structures of the liquid pipeline 1 shown can be arranged with reference to the liquid pipeline 1 shown in the above embodiments, and will not be described in detail here.

[0065] based on Figure 6In order to improve the connection reliability between the first recessed portion 10113 of the first layer tube 1011 and the second recessed portion 10122 of the fourth layer tube and the first clamping portion 1024 of the pipe joint 102, the liquid pipe 1 may also be provided with a structure for fixing the pipe body 101 and the pipe joint 102. Figure 7 , Figure 7 Another structural schematic diagram of the liquid pipeline 1 provided in an embodiment of the present application. In the liquid pipeline 1, the first sealing structure 103 may further include a first clamp 105, which may be set as an annular structure, and the first clamp 105 is sleeved on the outside of the pipe body 101, and the first clamp 105 presses the first recessed portion 10113 and the second recessed portion 10122 toward the first groove 10241 of the first clamping portion 1024, thereby achieving a reliable connection between the pipe body 101 and the pipe joint 102.

[0066] It is understandable that in Figure 7 In the liquid pipeline 1 shown, the first layer of pipe 1011 and the second layer of pipe 1012 can be set as non-metallic pipes, and the first recessed portion 10113 and the second recessed portion 10122 can be formed under the extrusion force of the first clamp 105. In addition, Figure 7 The other structures of the liquid pipeline 1 shown can be arranged with reference to the liquid pipeline 1 shown in the above embodiments, and will not be described in detail here.

[0067] In the liquid pipeline 1 provided in the above embodiments, the second layer pipe 1012 and the pipe joint 102 can be connected and sealed by an elastic material member such as a sealing ring that can be squeezed and deformed. In addition, the second layer pipe 1012 and the pipe joint 102 can also be connected and sealed by other possible methods, for example, refer to Figure 8 , Figure 8 Another structural schematic diagram of the liquid pipeline 1 provided in the embodiment of the present application. Figure 8 In the liquid pipeline 1 shown, the pipe joint 102 can also be provided with a second clamping portion 1025, which has a second groove 10251, and the second groove 10251 is recessed toward the axial direction of the pipe joint 102. The second layer tube 1012 also includes a third recessed portion 10123, which is recessed toward the second groove 10251, and the third recessed portion 10123 is clamped with the second groove 10251 to form a second sealing structure 104, thereby realizing the connection and sealing between the second layer tube 1012 and the pipe joint 102.

[0068] In addition, in order to improve the connection reliability between the second layer pipe 1012 and the pipe joint 102, as Figure 8As shown, the second sealing structure 104 also includes a second clamp 106, which can be set as an annular structure. The second clamp 106 is sleeved on the outside of the second layer tube 1012, and the second clamp 106 presses the third recessed portion 10123 toward the second groove 10251 of the second clamping portion 1025, thereby realizing a reliable connection between the tube body 101 and the pipe joint 102. Figure 8 The other structures of the liquid pipeline 1 shown can be arranged with reference to the liquid pipeline 1 shown in the above embodiments, and will not be described in detail here.

[0069] In the liquid pipeline 1 provided in the embodiment of the present application, in order to improve the sealing reliability between the first layer pipe 1011 and the pipe joint 102, the first sealing structure 103 at the connection between the first layer pipe 1011 and the pipe joint 102 can also be set as a combination of multiple sealing structures. Fig. 9 , Fig. 9 Another structural schematic diagram of the liquid pipeline 1 provided in the embodiment of the present application. Among them, when the first sealing structure 103 is specifically set, the pipe joint 102 is provided with a pagoda plug-in portion 1021, and in addition, a first sealing ring 1031 may be provided at the connection between the first layer pipe 1011 and the pipe joint 102, and the first sealing ring 1031 may be sleeved on the pagoda plug-in portion 1021, then at the connection between the first layer pipe 1011 and the pipe joint 102, the pagoda structure of the pagoda plug-in portion 1021 and the first layer pipe 1011 are interference fit, and the tube wall of the first layer pipe 1011 and the outer side wall of the pipe joint 102 squeeze the first sealing ring 1031 and deform the first sealing ring 1031, thereby forming a first sealing structure 103 at the connection between the first layer pipe 1011 and the pipe joint 102, so that the connection and sealing of the first layer pipe 1011 and the pipe joint 102 can be achieved through the above-mentioned interference fit and the first sealing ring 1031.

[0070] In addition, the second sealing structure 104 at the connection between the second layer pipe 1012 and the pipe joint 102 may also be arranged in a combination of multiple sealing structures. Fig.10 , Fig.10 Another structural schematic diagram of the liquid pipeline 1 provided in the embodiment of the present application. The tube wall of the second tube 1012 can also be interference fit with the pagoda structure of the pagoda plug-in portion 1021 of the pipe joint 102, and the second tube 1012 and the pipe joint 102 are also sealed by a second sealing ring 1041 to form a second sealing structure 104 at the connection between the first tube 1011 and the pipe joint 102, thereby effectively improving the reliability of the connection and sealing between the second tube 1012 and the pipe joint 102.

[0071] It can be understood that the present application does not specifically limit the manner in which the first layer of tube 1011 and the second layer of tube 1012 are connected and sealed to the pipe joint 102. In addition to the several methods provided in the above embodiments of the present application, bonding, snap-on pressing, etc., or other combinations of sealing structures can also be used to achieve the connection and sealing of the first layer of tube 1011 and the second layer of tube 1012 and the pipe joint 102. They will not be introduced one by one here, and they should all be understood to fall within the scope of protection of the present application.

[0072] The liquid pipeline 1 provided in the embodiment of the present application has a sealing structure at the connection between the first layer of pipe 1011 and the pipe joint 102, and at the connection between the second layer of pipe 1012 and the pipe joint 102, which can effectively improve the reliability of the connection and sealing between the pipe body 101 and the pipe joint 102, thereby reducing the risk of leakage of the liquid pipeline 1. In addition, the liquid pipeline 1 is configured as a double-layer pipeline structure, and the second layer of pipe 1012 can protect the first layer of pipe 1011, thereby helping to improve the structural reliability of the liquid pipeline 1.

[0073] It is understandable that when liquid leakage occurs in the liquid pipeline 1, if the leakage can be discovered in time and the liquid pipeline 1 can be replaced, the loss of the heat dissipation device and the electronic equipment using the liquid pipeline 1 can be reduced to a great extent.

[0074] Based on this, we can refer to Fig.11 , Fig.11 Another structural schematic diagram of the liquid pipeline 1 provided in the embodiment of the present application. The liquid pipeline 1 may further include a liquid leakage alarm device 107, and the liquid leakage alarm device 107 includes a water receiving component 1071 and a liquid leakage alarm component 1072. Fig.11 As shown, the water receiving component 1071 can be arranged at the connection between the pipe body 101 and the pipe joint 102 of the liquid pipeline 1, wherein the water receiving component 1071 includes a water receiving groove 10711, and the notch of the water receiving groove 10711 is arranged toward the connection between the pipe body 101 and the pipe joint 102 of the liquid pipeline 1, and specifically, the notch of the water receiving groove 10711 can be arranged toward the connection between the second layer pipe 1012 and the pipe joint 102. In this way, when liquid leakage occurs at the connection between the pipe body 101 and the pipe joint 102, the water receiving component 1071 can collect the leaked liquid.

[0075] In the present application, the specific configuration of the leakage alarm component 1072 is not limited, and it can be, but is not limited to, a water-immersed rope or a leakage sensor. Fig.11At least a portion of the liquid leakage alarm component 1072 can be accommodated in the water receiving tank 10711. When liquid is collected in the water receiving tank 10711, the liquid leakage alarm component 1072 is used to send an alarm signal, which can be but is not limited to a color signal, a light signal or a sound signal.

[0076] It is understandable that in the present application, the liquid leakage alarm component 1072 can be selected according to the requirements of the specific application scenario for liquid leakage, and the alarm triggering condition of the liquid leakage alarm component 1072 can be set. Exemplarily, the volume of the liquid collected in the water tank 10711 can be used as the alarm triggering condition, and when the volume of the liquid collected in the water tank 10711 is greater than the first set volume, the liquid leakage alarm component 1072 alarms.

[0077] Fig.11 The other structures of the liquid pipeline 1 shown can be arranged with reference to the liquid pipeline 1 shown in the above embodiments, and will not be described in detail here.

[0078] In the liquid pipeline 1 provided in the present application, by providing a leakage alarm device 107, the staff can promptly replace the liquid pipeline 1 with a leakage problem according to the alarm signal emitted by the leakage alarm device 107, which can improve the safety of use of the heat dissipation device using the liquid pipeline 1, thereby effectively reducing the loss of electronic equipment.

[0079] When the liquid pipeline 1 provided by the present application is applied to Figure 1 In the heat dissipation device shown, since the risk of leakage of the liquid pipeline 1 is low, the reliability of the structure and heat dissipation performance of the heat dissipation device can be better, thereby improving the safety of use of the heat dissipation device. When the heat dissipation device is used to dissipate heat for the chip of the electronic device, the damage to the electronic device caused by leakage of the liquid pipeline can be effectively avoided.

[0080] The above are only specific implementations of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A liquid pipeline, characterized in that: It includes a pipe body and a pipe joint, wherein: The tube body includes a first tube layer and a second tube layer, wherein the second tube layer is sleeved on the outside of the first tube layer; the first tube layer is connected to the tube joint, and the connection between the first tube layer and the tube joint has a first sealing structure; the second tube layer is connected to the tube joint, and the connection between the second tube layer and the tube joint has a second sealing structure.

2. The liquid pipeline according to claim 1, characterized in that: The first sealing structure includes at least one of a first sealing ring, a first clamp and a first buckle; the second sealing structure includes at least one of a second sealing ring, a second clamp and a second buckle.

3. The liquid pipeline according to claim 1 or 2, characterized in that: The pipe joint includes a pagoda plug-in portion, at least a portion of which is inserted into the tube cavity of the first layer of tube, and the pagoda structure of the pagoda plug-in portion is interference fit with the tube wall of the first layer of tube to form the first sealing structure.

4. The liquid pipeline according to any one of claims 1 to 3, characterized in that: The first sealing structure comprises a first sealing ring, the first sealing ring is sleeved on the pipe joint, and the pipe wall of the first layer of pipe and the outer side wall of the pipe joint squeeze the first sealing ring.

5. The liquid pipeline according to any one of claims 1 to 4, characterized in that: The pipe joint comprises a threaded connection portion, the pipe wall of the first layer of pipe is provided with a threaded connection surface, and the threaded connection portion and the threaded connection surface are screwed together to form the first sealing structure.

6. The liquid pipeline according to any one of claims 1 to 5, characterized in that: The pipe joint is provided with a first clamping portion, which has a first groove recessed toward the axial direction of the pipe joint; the first layer of tube includes a first recessed portion, which is recessed toward the first groove, and the first recessed portion is clamped with the first groove to form the first sealing structure.

7. The liquid pipeline according to claim 6, characterized in that The second layer tube includes a second recessed portion, the second recessed portion is recessed toward the first recessed portion, and the second recessed portion is clamped with the first recessed portion.

8. The liquid pipeline according to claim 7, characterized in that: The first sealing structure further includes a first clamp, which is sleeved on the outside of the tube body, and the first clamp presses the first recessed portion and the second recessed portion toward the first groove.

9. The liquid pipeline according to any one of claims 1 to 8, characterized in that: The second sealing structure comprises a second sealing ring, the second sealing ring is sleeved on the pipe joint, and the pipe wall of the second layer of pipe and the outer side wall of the pipe joint squeeze the second sealing ring.

10. The liquid pipeline according to any one of claims 1 to 9, characterized in that: The pipe joint is also provided with a second clamping portion, which has a second groove, and the second groove is recessed toward the axial direction of the pipe joint; the second layer tube also includes a third recessed portion, which is recessed toward the second groove, and the third recessed portion is clamped with the second groove to form the second sealing structure.

11. The liquid pipeline according to claim 10, characterized in that The second sealing structure further includes a second clamp, which is sleeved on the outside of the second layer tube, and the second clamp presses the third recessed portion toward the second groove.

12. The liquid pipeline according to any one of claims 1 to 11, characterized in that: The pipe joint comprises a pagoda plug-in portion, and the tube wall of the second layer of tube is interference-fitted with the pagoda structure of the pagoda plug-in portion to form the second sealing structure.

13. The liquid pipeline according to any one of claims 1 to 12, characterized in that: The liquid pipeline also includes a liquid leakage alarm device, which includes a water receiving component and a liquid leakage alarm component. The water receiving component includes a water receiving trough, and the notch of the water receiving trough faces the connection between the second layer of pipe and the pipe joint; at least part of the liquid leakage alarm component is accommodated in the water receiving trough, and when liquid is collected in the water receiving trough, the liquid leakage alarm component is used to send an alarm signal.

14. A heat dissipation device, characterized in that: Comprising the liquid pipeline as described in any one of claims 1 to 13.

15. An electronic device, characterized in that: The invention comprises a chip and the heat dissipation device as claimed in claim 14, wherein the heat dissipation device is used to dissipate heat for the chip.

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