An air-cooled heat dissipation module structure based on ASAAC standard

Abstract

The present application relates to airborne air-cooled equipment technical field, and disclose a kind of based on ASAAC standard's airborne air-cooled heat dissipation module structure, including: high-efficiency air-cooled heat dissipation module structure;The high-efficiency air-cooled heat dissipation module structure includes frame assembly, cover plate assembly and carrier plate, the cover plate assembly is connected with the frame assembly, the side of the frame assembly close to the cover plate assembly is provided with structure assembly and cold plate assembly, the structure assembly is connected with the frame assembly, the cold plate assembly is arranged at the side of the structure assembly away from the frame assembly, and the cold plate assembly is connected with the structure assembly, the electrically-conductive sealing strip is connected inside the cold plate assembly, a plurality of copper metal heat pipes are arranged between the electrically-conductive sealing strip and the cold plate assembly;The side of the cover plate assembly close to the frame assembly is provided with loose heat dissipation fin structure, the side of the loose heat dissipation fin structure away from the cover plate assembly is connected with the carrier plate.

Description

Technical Field

[0001] This invention relates to the field of airborne air-cooled equipment technology, and more specifically, to an airborne air-cooled heat dissipation module structure based on the ASAAC standard. Background Technology

[0002] The core processing subsystem of an aircraft is a crucial subsystem within the aircraft mission system. As the center for information transmission, processing, and management within the mission system, it needs to perform functions such as general data processing, intelligent processing, signal processing, and network switching. The entire system is physically based on the interconnection of ASAAC standard modules, thus placing higher demands on the hardware and software resources of each module, which in turn means higher heat dissipation requirements. The power consumption of a single chip can reach up to 62W. If the heat source area of ​​this chip is analyzed separately from the casing area, the power density of the chip's heat source will be as high as 5 W / cm² or more. In practice, to maximize the reliability and lifespan of electronic equipment, the chip junction temperature generally needs to be controlled below 100°C to meet the requirements of Level II derating design.

[0003] In existing technologies, the ASAAC standard defines the external dimensions and mounting methods of avionics electronic equipment modules. In traditional ASAAC air-cooled modules, the total power consumption of the module is usually no more than 100W, and the maximum power consumption of a single chip is controlled within 30W. The appropriate selection of fans, thermal interface materials, structural heat dissipation bosses, and machined fins are sufficient to meet the heat dissipation requirements of the module. However, this conventional heat dissipation structure is inadequate for modules with a total power consumption of over 160W and a maximum power consumption of 62W per chip, failing to efficiently and promptly dissipate the heat of the devices into the air-cooled airflow. Summary of the Invention

[0004] To overcome the shortcomings of existing technologies, this invention provides an airborne air-cooled heat dissipation module structure based on the ASAAC standard, which has the advantage of more precise operation.

[0005] To achieve the above objectives, the present invention provides the following technical solution: an airborne air-cooled heat dissipation module structure based on the ASAAC standard, comprising: a high-efficiency air-cooled heat dissipation module structure; the high-efficiency air-cooled heat dissipation module structure includes a frame assembly, a cover plate assembly, and a carrier plate; the cover plate assembly is connected to the frame assembly; a structural component and a cold plate assembly are disposed on the side of the frame assembly near the cover plate assembly; the structural component is connected to the frame assembly; the cold plate assembly is disposed on the side of the structural component away from the frame assembly and is connected to the structural component; a conductive sealing strip is internally connected to the cold plate assembly; a plurality of copper heat pipes are disposed between the conductive sealing strip and the cold plate assembly; a loose heat dissipation fin structure is disposed on the side of the cover plate assembly near the frame assembly; the loose heat dissipation fins... The side of the finned structure away from the cover plate assembly is connected to the carrier plate. A first sub-card, a second sub-card, and a third sub-card are connected between the carrier plate and the loose heat dissipation fin structure. A high-power device is mounted on the side of the carrier plate away from the loose heat dissipation fin structure. Thermal grease is applied to the side of the high-power device away from the carrier plate. A support plate structure is provided on the side of the thermal grease away from the high-power device. Both sides of the support plate structure are connected to the conductive sealing strip. A lettered panel structure is provided between the structural assembly and the loose heat dissipation fin structure. A high-density heat dissipation fin structure is provided on the side of the structural assembly near the lettered panel structure. Both sides of the lettered panel structure are respectively attached to the loose heat dissipation fin structure and the high-density heat dissipation fin structure. Fixing brackets are mounted on the first sub-card and the third sub-card.

[0006] As a preferred embodiment of the present invention, a flip cover is provided on one side of the frame assembly, and a pin is connected to the end of the flip cover away from the frame assembly. A connecting groove is provided on one side of the cover plate assembly, and the flip cover corresponds to the connecting groove; this facilitates the disassembly and assembly of the high-efficiency air-cooled heat dissipation module structure.

[0007] As a preferred embodiment of the present invention, the high-efficiency air-cooled heat dissipation module structure is provided with a number of standard screws, which are distributed on the side of the frame assembly and fix the cold plate assembly; thus facilitating the fixing of the cold plate assembly inside the frame assembly.

[0008] As a preferred embodiment of the present invention, the surface of the copper heat pipe is nickel-plated, an aluminum alloy frame is provided inside the cold plate assembly, the copper heat pipe is welded to the aluminum alloy frame, and the cross-section of the aluminum alloy frame is U-shaped.

[0009] As a preferred embodiment of the present invention, the bearing plate structure is provided with a plurality of grooves, and the conductive sealing strip is adhered to the grooves on the bearing plate structure by conductive adhesive.

[0010] As a preferred embodiment of the present invention, the second sub-card and the third sub-card are both fixed to the fixing bracket via an inter-board connector. The fixing bracket is fixed to the carrier plate. The gaps between the components on the first sub-card, the second sub-card, and the third sub-card and the cover plate assembly are filled with thermal pads with a thickness of 0.9~1mm.

[0011] As a preferred embodiment of the present invention, the gap between the high-power device and the cold plate assembly is filled with thermal grease, and the gap filled by the thermal grease is 0.1 mm.

[0012] As a preferred embodiment of the present invention, the thickness of the bearing plate structure is 1~1.2mm, the thickness of the loose heat dissipation fin structure and the high-density heat dissipation fin structure is 2.5~3mm, and the thickness of the copper metal heat pipe is 2mm.

[0013] As a preferred embodiment of the present invention, the high-power device is a rectangle with a side length of 40mm, and a heat source is provided at the center of the high-power device, wherein the power consumption of the heat source is 62W.

[0014] As a preferred embodiment of the present invention, the thermal conductivity of the thermal pad is 12 W / (m•K), the thermal resistance of the thermal grease is 0.5 K•cm2 / W, and the thermal conductivity of the copper heat pipe is not less than 1500 W / (m•K).

[0015] Compared with existing technologies, the beneficial effects of this invention are as follows: By optimizing the heat dissipation module, setting multiple daughter cards, and setting inter-board connectors and fixing brackets between the daughter cards, the daughter cards can be stably placed inside the heat dissipation module structure. This allows the loose heat dissipation fin structure and the high-density heat dissipation fin structure to work together to dissipate heat in a timely manner. Based on actual data, thermal simulation analysis and calculation improve the heat dissipation effect of the left and right air ducts, ensuring that the surface temperature of the components does not exceed 95°C. This meets the heat dissipation performance requirements for high-power, high-heat-flux-density module products that are not available in traditional ASAAC module structures. Furthermore, the invention adopts a unique debugging flip-top design, a light guide structure design, and a daughter card fixing design, ensuring the disassembly and maintenance of the module products. This is a brand-new air-cooled heat dissipation structure based on ASAAC standard modules, which has great application prospects in next-generation airborne core processing subsystems. Attached Figure Description

[0016] Figure 1 This is an isometric view of the present invention;

[0017] Figure 2 This is a schematic diagram of the structure of the present invention;

[0018] Figure 3 This is a schematic diagram of the frame assembly of the present invention;

[0019] Figure 4 This is a schematic diagram illustrating the principle of the heat dissipation solution of the present invention.

[0020] In the diagram: 1. High-efficiency air-cooled heat dissipation module structure; 2. Frame assembly; 3. Cover plate assembly; 4. Carrier plate; 5. First daughter card; 6. Second daughter card; 7. Third daughter card; 8. Standard screws; 9. Structural assembly; 10. Cold plate assembly; 11. Loose heat dissipation fin structure; 12. Thermal pad; 13. Fixing bracket; 14. Engraved panel structure; 15. Support plate structure; 16. High-power device; 17. Thermal grease; 18. High-density heat dissipation fin structure; 19. Copper heat pipe; 20. Conductive sealing strip. Detailed Implementation

[0021] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0022] like Figures 1 to 4As shown, this invention provides an airborne air-cooled heat dissipation module structure based on the ASAAC standard, comprising: a high-efficiency air-cooled heat dissipation module structure 1; the high-efficiency air-cooled heat dissipation module structure 1 includes a frame assembly 2, a cover plate assembly 3, and a carrier plate 4. The cover plate assembly 3 is connected to the frame assembly 2. A structural component 9 and a cold plate assembly 10 are disposed on the side of the frame assembly 2 near the cover plate assembly. The structural component 9 is connected to the frame assembly. The cold plate assembly 10 is disposed on the side of the structural component 9 away from the frame assembly 2, and is connected to the structural component 9. A conductive sealing strip 20 is connected inside the cold plate assembly 10. A plurality of copper heat pipes 19 are disposed between the conductive sealing strip 20 and the cold plate assembly 10. A loose heat dissipation fin structure 11 is disposed on the side of the cover plate assembly 3 near the frame assembly 2. The loose heat dissipation fin structure 11 is disposed on the side of the cover plate assembly 3 away from the cover plate assembly 4. The carrier plate 4 is connected to the loose heat dissipation fin structure 11. A first sub-card 5, a second sub-card 6, and a third sub-card 7 are connected between the carrier plate 4 and the loose heat dissipation fin structure 11. A high-power device 16 is installed on the side of the carrier plate 4 away from the loose heat dissipation fin structure 11. Thermal grease 17 is provided on the side of the high-power device 16 away from the carrier plate 4. A support plate structure 15 is provided on the side of the thermal grease 17 away from the high-power device 16. Both sides of the support plate structure 15 are connected to the conductive sealing strip 20. A lettered panel structure 14 is provided between the structural component 9 and the loose heat dissipation fin structure 11. A high-density heat dissipation fin structure 18 is provided on the side of the structural component 9 near the lettered panel structure 14. Both sides of the lettered panel structure 14 are respectively attached to the loose heat dissipation fin structure 11 and the high-density heat dissipation fin structure 18. Fixing brackets 13 are installed on the first sub-card 5 and the third sub-card 7.

[0023] The frame assembly 2 has a flip cover on one side, and a pin is connected to the end of the flip cover away from the frame assembly 2. The cover plate assembly 3 has a connecting groove on one side, and the flip cover corresponds to the connecting groove; this facilitates the disassembly and assembly of the high-efficiency air-cooled heat dissipation module structure 1.

[0024] The high-efficiency air-cooled heat dissipation module structure 1 is provided with a number of standard screws 8, which are distributed on the side of the frame assembly and fix the cold plate assembly 10; thus facilitating the fixing of the cold plate assembly 10 inside the frame assembly 2.

[0025] The copper heat pipes 19 are all nickel-plated, and the cold plate assembly 10 has an aluminum alloy frame inside. The copper heat pipes 19 are welded to the aluminum alloy frame, and the cross-section of the aluminum alloy frame is U-shaped.

[0026] The bearing plate structure 15 has several grooves, and the conductive sealing strip 20 is adhered to the grooves on the bearing plate structure 15 by conductive adhesive.

[0027] The second sub-card 6 and the third sub-card 7 are both fixed to the fixing bracket 13 via an inter-board connector. The fixing bracket 13 is fixed to the carrier plate 4. The gap between the components on the first sub-card 5, the second sub-card 6 and the third sub-card 7 and the cover plate assembly 3 is filled with a thermal pad 12, the thickness of which is 0.9~1mm.

[0028] The gap between the high-power device 16 and the cold plate assembly 10 is filled by the thermal grease 17, and the gap of the thermal grease 17 is 0.1 mm.

[0029] The thickness of the bearing plate structure 15 is 1~1.2mm, the thickness of the loose heat dissipation fin structure 11 and the high-density heat dissipation fin structure 18 is 2.5~3mm, and the thickness of the copper metal heat pipe 19 is 2mm.

[0030] The high-power device 16 is a rectangle with a side length of 40mm, and a heat source is provided at the center of the high-power device 16, wherein the power consumption of the heat source is 62W.

[0031] The thermal conductivity of the thermal pad 12 is 12 W / (m•K), the thermal resistance of the thermal grease 17 is 0.5 K•cm2 / W, and the thermal conductivity of the copper heat pipe 19 is not less than 1500 W / (m•K).

[0032] The working principle and usage process of this invention are as follows: The gaps between the components on the first daughter card 5, the second daughter card 6 and the third daughter card 7 and the cover plate assembly 3 are filled with a thermal pad 12 with a reference thickness of 1mm, while controlling the gap to be 0.7mm; the gap between the high power consumption device 16 on the carrier board 4 and the cold plate assembly 10 is filled with thermal grease 17, while controlling the gap to be 0.1mm. The aluminum alloy frame of the cold plate assembly 10 has a carrier plate 4 with a wall thickness of 1.2 mm, a loose heat dissipation fin structure 11 and a high-density heat dissipation fin structure 18 with a thickness of 3 mm, and a copper heat pipe 19 with a thickness of 2 mm. A high-power device 16 is set as a square with a side length of 40 mm, and a heat source is a square with a side length of 15 mm located in the center of the device, with a heat source power consumption of 62 W. A thermal pad 12 with a thermal conductivity of 12 W / (m·K) and thermal grease 17 with a thermal resistance of 0.5 K·cm² / W are used. The equivalent thermal conductivity of the copper heat pipe 19 should not be less than 1500 W / (m·K). The aluminum alloy frame material is aluminum alloy 6063. The total power consumption of other components and daughter card components on the carrier plate 4 is approximately 100 W. Thermal simulation analysis is then performed. During the simulation analysis, identical module models are placed on both sides of the module, with a 1.5 mm gap between the modules and an airflow of 6 kW on each side. The system operates at m³ / s, with 100W heat sources on each side of the module. The external environment is one standard atmosphere at a temperature of 70°C. The simulation results show that the surface temperatures of the components do not exceed 95°C, meeting the Level II derating requirements for airborne equipment thermal design.

[0033] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0034] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An airborne air-cooled heat dissipation module structure based on the ASAAC standard, characterized in that, The system includes: a high-efficiency air-cooled heat dissipation module structure (1); the high-efficiency air-cooled heat dissipation module structure (1) includes a frame assembly (2), a cover plate assembly (3), and a carrier plate (4). The cover plate assembly (3) is connected to the frame assembly (2). A structural component (9) and a cold plate assembly (10) are provided on the side of the frame assembly (2) near the cover plate assembly. The structural component (9) is connected to the frame assembly. The cold plate assembly (10) is located on the structural component (9) away from the frame assembly (2). On one side, the cold plate assembly (10) is connected to the structural assembly (9), and a conductive sealing strip (20) is connected inside the cold plate assembly (10). A plurality of copper metal heat pipes (19) are provided between the conductive sealing strip (20) and the cold plate assembly (10); a loose heat dissipation fin structure (11) is provided on the side of the cover plate assembly (3) near the frame assembly (2), and the loose heat dissipation fin structure (11) is connected to the carrier plate (4) on the side away from the cover plate assembly. The carrier plate (4) is connected to the... A first sub-card (5), a second sub-card (6), and a third sub-card (7) are connected between the loose heat dissipation fin structure (11). A high-power device (16) is mounted on the side of the carrier plate (4) away from the loose heat dissipation fin structure (11). Thermal grease (17) is provided on the side of the high-power device (16) away from the carrier plate (4). A support plate structure (15) is provided on the side of the thermal grease (17) away from the high-power device (16). Both sides of the support plate structure (15) are connected to the conductive... A sealing strip (20) is connected; a lettered panel structure (14) is provided between the structural component (9) and the loose heat dissipation fin structure (11), and a high-density heat dissipation fin structure (18) is provided on the side of the structural component (9) near the lettered panel structure (14). The two sides of the lettered panel structure (14) are respectively attached to the loose heat dissipation fin structure (11) and the high-density heat dissipation fin structure (18), and a fixing bracket (13) is installed on the first sub-card (5) and the third sub-card (7).

2. The airborne air-cooled heat dissipation module structure based on the ASAAC standard according to claim 1, characterized in that: The high-efficiency air-cooled heat dissipation module structure (1) is provided with a number of standard screws (8), which are distributed on the side of the frame assembly and fix the cold plate assembly (10).

3. The airborne air-cooled heat dissipation module structure based on the ASAAC standard according to claim 1, characterized in that: The copper heat pipes (19) are all nickel-plated. The cold plate assembly (10) has an aluminum alloy frame inside. The copper heat pipes (19) are welded to the aluminum alloy frame, and the cross-section of the aluminum alloy frame is U-shaped.

4. The airborne air-cooled heat dissipation module structure based on the ASAAC standard according to claim 1, characterized in that: The bearing plate structure (15) has several grooves, and the conductive sealing strip (20) is glued to the grooves on the bearing plate structure (15) by conductive adhesive.

5. The airborne air-cooled heat dissipation module structure based on the ASAAC standard according to claim 1, characterized in that: The second sub-card (6) and the third sub-card (7) are both fixed to the fixed bracket (13) by the board connector. The fixed bracket (13) is fixed to the carrier plate (4). The gap between the components on the first sub-card (5), the second sub-card (6) and the third sub-card (7) and the cover plate assembly (3) is filled with a thermal pad (12). The thickness of the thermal pad (12) is 0.9~1mm.

6. The airborne air-cooled heat dissipation module structure based on the ASAAC standard according to claim 1, characterized in that: The gap between the high-power device (16) and the cold plate assembly (10) is filled by the thermal grease (17), and the thermal grease (17) fills the gap by 0.1 mm.

7. The airborne air-cooled heat dissipation module structure based on the ASAAC standard according to claim 1, characterized in that: The thickness of the bearing plate structure (15) is 1~1.2mm, the thickness of the loose heat dissipation fin structure (11) and the high-density heat dissipation fin structure (18) is 2.5~3mm, and the thickness of the copper metal heat pipe (19) is 2mm.

8. The airborne air-cooled heat dissipation module structure based on the ASAAC standard according to claim 1, characterized in that: The high-power device (16) is a rectangle with a side length of 40mm. A heat source is provided at the center of the high-power device (16), and the power consumption of the heat source is 62W.

9. The airborne air-cooled heat dissipation module structure based on the ASAAC standard according to claim 5, characterized in that: The thermal conductivity of the thermal pad (12) is 12 W / (m•K), the thermal resistance of the thermal grease (17) is 0.5 K•cm2 / W, and the thermal conductivity of the copper heat pipe (19) is not less than 1500 W / (m•K).

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