A testing fixture for cold plates of directly cooled and heated battery packs

Abstract

This utility model provides a testing fixture for a direct-cooling and direct-heating battery pack cold plate, belonging to the field of new energy batteries. The fixture includes a cooling and heating device and a cold plate under test. The cooling and heating device is mounted on the cold plate. Multiple temperature sensors and multiple flow channels are arranged at the bottom of the cold plate, with the temperature sensors positioned between the flow channels. The cooling and heating device includes a semiconductor group, a first metal conductor, and a second metal conductor. The semiconductor group includes N-type semiconductors and P-type semiconductors. The first metal conductor is located on top of the semiconductor group and connects the N-type and P-type semiconductors. The second metal conductor is located at the bottom of the N-type and P-type semiconductors and connects either the N-type or P-type semiconductor to an external power source. Using the direct-cooling and direct-heating battery pack cold plate testing fixture provided by this utility model can solve the problems of complex operation and low testing efficiency in existing technologies.

Description

Technical Field

[0001] This utility model relates to the field of new energy batteries, and in particular to a testing fixture for a cold plate of a direct-cooling and direct-heating battery pack. Background Technology

[0002] As direct cooling and heating technology matures and battery packs using this technology become more widespread, thermal performance testing is required after the cold plate of the direct cooling and heating battery pack is produced. This test verifies the rationality of the flow channel design and facilitates adjustments to the flow channel, enabling the cold plate to heat or cool the battery pack most efficiently.

[0003] In existing technologies, thermal performance testing of cold plates typically only allows for testing under direct cooling conditions. This is achieved by attaching a heating film to the cold plate to provide a constant heating power, simulating cell heating. However, the lack of a constant cold source to provide constant cooling for the cold plate makes thermal performance testing under direct heating conditions quite difficult. Verification can only be done through actual battery pack testing, but because the accuracy of direct cooling technology is very low, it often fails on the first try and requires repeated adjustments to the flow channels and temperature uniformity testing.

[0004] In existing technologies, thermal performance testing of cold plates under direct heating conditions requires assembling the battery pack and the cold plate before testing. This process may lead to battery pack failure, increasing production costs. Furthermore, each adjustment of the cold plate's flow channels necessitates disassembling and reassembling the battery pack, resulting in complex operations and low testing efficiency. Utility Model Content

[0005] This utility model provides a testing fixture for a direct-cooling and direct-heating battery pack cold plate, which solves the problems of complex operation and low testing efficiency in the prior art. The technical solution is as follows:

[0006] A testing fixture for a direct-cooling and direct-heating battery pack cold plate includes: a cooling and heating device and a cold plate to be tested.

[0007] The cooling and heating device is mounted on the cold plate to be tested. Multiple temperature sensors and multiple flow channels are located at the bottom of the cold plate, with the temperature sensors positioned between the flow channels.

[0008] The cooling and heating device includes a semiconductor group, a first metal conductor, and a second metal conductor. The semiconductor group includes N-type semiconductors and P-type semiconductors. The first metal conductor is disposed on the top of the semiconductor group and is used to connect the N-type semiconductors and the P-type semiconductors. The second metal conductor is disposed at the bottom of the N-type semiconductors and the P-type semiconductors and is used to connect the N-type semiconductors or the P-type semiconductors to an external power source.

[0009] Optionally, multiple semiconductor groups are provided, and the multiple semiconductor groups are arranged along a first direction. The P-type semiconductor of the previous semiconductor group and the N-type semiconductor of the next semiconductor group are connected through the second metal conductor.

[0010] Optionally, the N-type semiconductor and the P-type semiconductor are arranged in multiple rows along a second direction, which is perpendicular to the first direction.

[0011] Optionally, the bottom of the cold plate to be tested is provided with bottom insulation cotton, and the top of the cold plate to be tested is provided with top insulation cotton.

[0012] Optionally, a thermal pad is provided between the cooling and heating device and the cold plate to be tested.

[0013] Optionally, a heat insulation component is provided on the top of the cold plate to be tested. The heat insulation component includes fins and a fan. The fins are disposed on the cold plate to be tested, and the fan is disposed on the fins and arranged facing upward.

[0014] Optionally, an insulator is provided at the top of the first metal conductor and at the bottom of the second metal conductor.

[0015] Optionally, the N-type semiconductor and the P-type semiconductor are bismuth telluride devices.

[0016] The beneficial effects of the technical solution provided by this utility model embodiment include at least the following:

[0017] This utility model provides a direct-cooling / direct-heating battery pack cold plate testing fixture. When a direct current passes through a circuit composed of different conductors, heat absorption or release occurs at the contact point of the two materials due to the different current directions. This method is reversible; that is, when the current direction is reversed, the heat-absorbing and heat-releasing ends are interchanged. By setting up a semiconductor group and placing a first metal conductor on top of it, and then connecting a second metal conductor below it to a power source, when the current flows from the N-type semiconductor to the P-type semiconductor, the first metal conductor is the cold end, and the second metal conductor is the hot end. Since the second metal conductor is in contact with the cold plate under test, the cold plate can be tested under direct cooling conditions. When the current flow direction inside the semiconductor group is changed, i.e., when the current flows from the P-type semiconductor to the N-type semiconductor, the first metal conductor becomes the hot end, and the second metal conductor becomes the cold end, allowing for the testing of the cold plate under direct heating conditions. Multiple temperature sensors located at the bottom of the cold plate under test detect the temperature at different locations on the cold plate under direct cooling or direct heating conditions. This allows for measurement of the flow channel uniformity, thereby determining the rationality of the flow channel design at the bottom of the cold plate. By incorporating a cooling and heating device, a constant heat or cold source can be provided to the cold plate under test, enabling the assessment of the flow channel design rationality under direct cooling or direct heating conditions. During the test, only the direction of current flow needs to be changed to achieve testing under direct cooling or direct heating conditions, effectively solving the problems of complex operation and low testing efficiency in existing technologies. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is an exploded view of the overall structure provided in an embodiment of this utility model;

[0020] Figure 2 This is a schematic diagram of the bottom of the cold plate to be tested provided in this embodiment of the utility model;

[0021] Figure 3 This is provided by the embodiment of the present utility model. Figure 2 Enlarged view of point A;

[0022] Figure 4 This is a side view of the refrigeration and heating device provided in this embodiment of the utility model;

[0023] Figure 5 This is a three-dimensional structural diagram of the refrigeration and heating device provided in an embodiment of this utility model.

[0024] In the diagram: 1-Refrigeration and heating device; 11-Semiconductor group; 111-N-type semiconductor; 112-P-type semiconductor; 12-First metal conductor; 13-Second metal conductor; 2-Cold plate to be tested; 21-Temperature sensor; 22-Flow channel; 31-Bottom insulation cotton; 32-Top insulation cotton; 4-Heat conductive pad; 5-Insulation component; 51-Fin; 52-Fan; 6-Insulator. Detailed Implementation

[0025] To make the objectives, technical solutions, and advantages of this utility model clearer, the embodiments of this utility model will be described in further detail below with reference to the accompanying drawings.

[0026] Figure 1 This is an exploded view of the overall structure provided in an embodiment of this utility model; Figure 2 This is a schematic diagram of the bottom of the cold plate to be tested provided in this embodiment of the utility model; Figure 3 This is provided by the embodiment of the present utility model. Figure 2 Enlarged view of point A; Figure 4 This is a side view of the refrigeration and heating device provided in this embodiment of the utility model; Figure 5 This is a three-dimensional structural diagram of the refrigeration and heating device provided in an embodiment of this utility model. Figures 1 to 5 The present invention relates to a direct-cooling and direct-heating battery pack cold plate testing fixture, characterized in that it comprises: a cooling and heating device 1 and a cold plate 2 to be tested. The cooling and heating device 1 is disposed on the cold plate 2 to be tested. The bottom of the cold plate 2 to be tested is provided with multiple temperature sensors 21 and multiple flow channels 22. The temperature sensors 21 are disposed between the multiple flow channels 22. The cooling and heating device 1 includes a semiconductor group 11, a first metal conductor 12 and a second metal conductor 13. The semiconductor group 11 includes an N-type semiconductor 111 and a P-type semiconductor 112. The first metal conductor 12 is disposed on the top of the semiconductor group 11 and is used to connect the N-type semiconductor 111 and the P-type semiconductor 112. The second metal conductor 13 is disposed on the bottom of the N-type semiconductor 111 and the P-type semiconductor 112 and is used to connect the N-type semiconductor 111 or the P-type semiconductor 112 to an external power source.

[0027] For example, in this embodiment of the present invention, temperature sensors 21 are distributed in a rectangular array on the bottom of the cold plate 2 to be tested. The first metal conductor 12 is placed above the semiconductor group 11, so that the first metal conductor 12 connects the N-type semiconductor 111 and the P-type semiconductor 112. Then, the second metal conductor 13 below the N-type semiconductor 111 is connected to the positive terminal of the power supply, and the second metal conductor 13 below the P-type semiconductor 112 is connected to the negative terminal of the power supply. After the power switch is turned on, the current flows from the N-type semiconductor 111 to the P-type semiconductor 112. At this time, the temperature of the first metal conductor 12 decreases and the temperature of the second metal conductor 13 increases. Since the cooling and heating device 1 is placed on the cold plate 2 to be tested, the second metal conductor 13 contacts the upper surface of the cold plate 2 to be tested and heats the cold plate 2. At this time, the direct cooling condition of the cold plate 2 to be tested is simulated. Coolant needs to be introduced into the flow channel 22 to cool down. By using the temperature sensor 21 at the bottom of the cold plate 2 to detect different positions of the cold plate 2 to be tested, the temperature uniformity of the cold plate 2 under this flow channel 22 condition can be obtained. If the temperature difference between different positions is too large, the design of the flow channel 22 is unreasonable and needs to be readjusted. When simulating the direct heating condition of the cold plate 2 under test, the current flow direction is reversed, with the current flowing from the P-type semiconductor 112 to the N-type semiconductor 111. At this time, the temperature of the first metal conductor 12 rises, and the temperature of the second metal conductor 13 decreases, thus providing a constant cold source for the upper surface of the cold plate 2 under test. Heating liquid needs to be introduced into the flow channel 22 to raise the temperature. The temperature sensor 21, located at the bottom of the cold plate 2, detects different positions on the cold plate 2, allowing the determination of the temperature uniformity of the cold plate 2 under this flow channel 22 condition. If the temperature difference between different positions is too large, the flow channel 22 design is unreasonable and needs to be readjusted. Compared to traditional technologies, which struggle to test the cold plate 2 under direct heating conditions, the cooling and heating device 1 in this embodiment can provide a constant cold source for the cold plate 2 simply by adjusting the current flow direction, thereby improving the ease of operation and testing efficiency of this fixture.

[0028] This utility model provides a direct-cooling and direct-heating battery pack cold plate testing fixture. When a direct current passes through a circuit composed of different conductors, heat absorption or release phenomena will occur at the contact point of the two materials due to the different current directions. This method is reversible; that is, when the current direction is reversed, the heat-absorbing end and the heat-releasing end will be interchanged. By setting up a semiconductor group 11, placing a first metal conductor 12 on top of it, and then connecting a second metal conductor 13 below it to a power source, when the current flows from the N-type semiconductor 111 to the P-type semiconductor 112, the first metal conductor 12 is the cold end, and the second metal conductor 13 is the hot end. Since the second metal conductor 13 is in contact with the cold plate 2 under test, the cold plate 2 under test can be tested under direct cooling conditions. When the current flow direction inside the semiconductor group 11 is changed, that is, when the current flows from the P-type semiconductor 112 to the N-type semiconductor 111, the first metal conductor 12 is the hot end, and the second metal conductor 13 is the cold end. At this time, the cold plate 2 under test can be tested under direct heating conditions. Multiple temperature sensors 21 located at the bottom of the cold plate 2 under test are used to detect the temperature of different parts of the cold plate 2 under direct cooling or direct heating conditions. The temperature sensors 21 should be positioned away from the flow channel 22 to ensure the accuracy of the temperature measurement of the cold plate 2. This method is used to measure the temperature uniformity of the flow channel 22, thereby determining whether the flow channel 22 at the bottom of the cold plate 2 is reasonably designed. By setting up the cooling and heating device 1, a constant heat source or cold source can be provided to the cold plate 2 under test, thus enabling the determination of the rationality of the flow channel design under direct cooling or direct heating conditions. During the test, switching between direct cooling and direct heating conditions can be achieved simply by changing the direction of the current flow, effectively solving the problems of complex operation and low testing efficiency in existing technologies.

[0029] Optionally, multiple semiconductor groups 11 are provided, and the multiple semiconductor groups 11 are arranged along a first direction. The P-type semiconductor 112 of the previous semiconductor group 11 and the N-type semiconductor 111 of the next semiconductor group 11 are connected through a second metal conductor 13.

[0030] Exemplary, in embodiments of this utility model, such as Figure 4 and Figure 5 As shown, the solid arrow indicates the first direction. Through this structure, multiple semiconductor groups 11 are connected in series into the circuit. When DC power is applied, the top first metal conductor 12 of each semiconductor group 11 is simultaneously the cold end or the hot end, and the bottom second metal conductor 13 between two adjacent semiconductor groups 11 is simultaneously the hot end or the cold end. This can increase the area of ​​the cold end or the hot end, thereby allowing the cold plate 2 under test to be cooled or heated more quickly, thus further improving the testing efficiency of this fixture.

[0031] Optionally, N-type semiconductor 111 and P-type semiconductor 112 are arranged in multiple rows along a second direction, which is perpendicular to the first direction.

[0032] Exemplary, in embodiments of this utility model, such as Figure 5 As shown, the dashed arrow indicates the second direction. By setting multiple rows of N-type semiconductors 111 and P-type semiconductors 112, the area of ​​the first metal conductor 12 and the second metal conductor 13 is further increased, thereby further rapidly cooling or heating the cold plate 2 under test, thus further improving the testing efficiency of this fixture.

[0033] Optionally, a bottom insulation cotton 31 is provided at the bottom of the cold plate 2 to be tested, and a top insulation cotton 32 is provided at the top of the cold plate 2 to be tested.

[0034] Exemplary, in embodiments of this utility model, such as Figure 1 As shown, by setting the bottom insulation cotton 31 and the top insulation cotton 32 to surround the cold plate 2 to be tested, the cold plate 2 to be tested can be insulated, preventing the external environment from transferring heat to the cold plate 2 to be tested, thereby interfering with the test results. By setting this structure, the accuracy of the test results of this fixture is improved.

[0035] Optionally, a thermal pad 4 is provided between the cooling and heating device 1 and the cold plate 2 to be tested.

[0036] Exemplary, in embodiments of this utility model, such as Figure 1 As shown, the thermal pad 4 is made of a material with high thermal conductivity. By setting the thermal pad 4 between the cooling and heating device 1 and the cold plate 2 to be tested, the cooling and heating device 1 can transfer heat to the cold plate 2 to be tested more quickly. This allows the cold plate 2 to be tested to be tested to be tested to be tested to be tested to be tested to be tested more quickly and to be tested to be tested to be tested to be tested to be tested to be tested to be tested, thereby further improving the testing efficiency of this fixture.

[0037] Optionally, a heat insulation component 5 is provided on the top of the cold plate 2 to be tested. The heat insulation component 5 includes fins 51 and a fan 52. The fins 51 are disposed on the cold plate 2 to be tested, and the fan 52 is disposed on the fins 51 and arranged upward.

[0038] Exemplary, in an embodiment of this utility model, such as Figure 1 As shown, the fins 51 and fan 52 can blow away the heat from the side of the cold plate 2 to be tested away from the cooling and heating device 1 when the cooling and heating device 1 is cooling, thereby preventing the heat in the external environment from affecting the top of the cold plate 2 to be tested and thus interfering with the test results. By setting this structure, the accuracy of the test results of this fixture is further improved.

[0039] Optionally, an insulator 6 is provided at the top of the first metal conductor 12 and the bottom of the second metal conductor 13.

[0040] Exemplary, in embodiments of this utility model, such as Figure 4As shown, the insulator 6 can be a ceramic sheet. By setting the insulator 6 at the top of the first metal conductor 12 and the bottom of the second metal conductor 13, the top of the first metal conductor 12 and the second metal conductor 13 can be insulated from other structures, thereby improving the safety of this tooling.

[0041] Optionally, the N-type semiconductor 111 and the P-type semiconductor 112 are bismuth telluride devices.

[0042] For example, in this embodiment of the present invention, bismuth telluride allows electrons to move on its surface without energy loss at room temperature, thus giving it excellent conductivity. In addition, bismuth telluride is a good thermoelectric material, which can realize the direct conversion of electrical energy and thermal energy based on the Seebeck effect and Peltier effect. Therefore, by setting the N-type semiconductor 111 and the P-type semiconductor 112 as bismuth telluride components, the N-type semiconductor 111 and the P-type semiconductor 112 can conduct electricity and heat more quickly, thereby further improving the testing efficiency of this tooling.

[0043] Unless otherwise defined, the technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this invention pertains. The terms “first,” “second,” and similar terms used in this patent application specification and claims do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms “an” or “a” and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms “comprising” or “including” and similar terms mean that the elements or objects preceding “comprising” or “including” encompass the elements or objects listed following “comprising” or “including” and their equivalents, and do not exclude other elements or objects. The terms “connected” or “linked” and similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. The terms “upper,” “lower,” “left,” and “right” are used only to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0044] The above description is only an optional embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A testing fixture for a cold plate of a direct-cooling and direct-heating battery pack, characterized in that, include: Refrigeration and heating device (1) and cold plate to be tested (2), The refrigeration and heating device (1) is installed on the cold plate (2) to be tested. The bottom of the cold plate (2) to be tested is provided with multiple temperature sensors (21) and multiple flow channels (22). The temperature sensors (21) are arranged between the multiple flow channels (22). The cooling and heating device (1) includes a semiconductor group (11), a first metal conductor (12), and a second metal conductor (13). The semiconductor group (11) includes an N-type semiconductor (111) and a P-type semiconductor (112). The first metal conductor (12) is disposed on the top of the semiconductor group (11) and is used to connect the N-type semiconductor (111) and the P-type semiconductor (112). The second metal conductor (13) is disposed at the bottom of the N-type semiconductor (111) and the P-type semiconductor (112) and is used to connect the N-type semiconductor (111) or the P-type semiconductor (112) to an external power source.

2. The testing fixture for a direct-cooling and direct-heating battery pack cold plate according to claim 1, characterized in that, The semiconductor group (11) is provided in multiple ways, and the multiple semiconductor groups (11) are arranged along a first direction. The P-type semiconductor (112) of the previous semiconductor group (11) and the N-type semiconductor (111) of the next semiconductor group (11) are connected through the second metal conductor (13).

3. The testing fixture for a direct-cooling and direct-heating battery pack cold plate according to claim 2, characterized in that, The N-type semiconductor (111) and the P-type semiconductor (112) are arranged in multiple rows along a second direction, which is perpendicular to the first direction.

4. The testing fixture for a direct-cooling and direct-heating battery pack cold plate according to claim 1, characterized in that, The bottom of the cold plate to be tested (2) is provided with bottom insulation cotton (31), and the top of the cold plate to be tested (2) is provided with top insulation cotton (32).

5. The testing fixture for a direct-cooling and direct-heating battery pack cold plate according to claim 1, characterized in that, A thermal pad (4) is provided between the refrigeration and heating device (1) and the cold plate to be tested (2).

6. The testing fixture for a direct-cooling and direct-heating battery pack cold plate according to claim 1, characterized in that, The top of the cold plate (2) to be tested is provided with a heat insulation component (5). The heat insulation component (5) includes fins (51) and a fan (52). The fins (51) are disposed on the cold plate (2) to be tested, and the fan (52) is disposed on the fins (51) and arranged upwards.

7. The testing fixture for a direct-cooling and direct-heating battery pack cold plate according to claim 1, characterized in that, An insulator (6) is provided at the top of the first metal conductor (12) and at the bottom of the second metal conductor (13).

8. The testing fixture for a direct-cooling and direct-heating battery pack cold plate according to claim 1, characterized in that, The N-type semiconductor (111) and the P-type semiconductor (112) are bismuth telluride devices.

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