SMT chip bonding device and feeding method thereof

Abstract

The present invention belongs to the technical field of manufacturing electrical component assemblies, and specifically relates to a patch bonding device for SMT feeding and a feeding method thereof. The device comprises: a bonding rail, which has a bonding station; a bonding mechanism, which is arranged on one side of the bonding station, and a glue box is installed at the movable end of the bonding mechanism; two levers are arranged in a mirror image inside the glue box; one end of the lever is connected to the glue box in a transmission manner, and the other end faces the bonding station; after the glue box moves to the top of the tape, the two levers rotate away from each other to stretch the tape, and when the two tapes are transported to the bonding station along both sides of the bonding rail, the glue box drives the lever to keep the tape stretched and attached to the bonding ends of the two tapes. By setting a glue box and a lever, and setting a power source inside the glue box, the lever is driven to rotate by the power source to stretch the tape, so that when the tape is attached to the new and old tapes, the tape can tighten the new and old tapes under the action of the rebound force to maintain the bonding state.

Description

Technical Field

[0001] The present invention belongs to the technical field of manufacturing electrical component assemblies, and specifically relates to the installation technology of electrical component assemblies, and more particularly to a patch bonding device for SMT feeding and a feeding method thereof. Background Art

[0002] SMT (Surface Mount Technology) is a commonly used assembly technology and process in the current electronic equipment production industry. In the patch process, a tape is needed, which is bundled on top and used continuously. When a roll of tape is almost used up, the reel and the reel loaded with a new roll of tape need to be placed on both sides of the device of the bonding equipment, and the tapes are pulled out and placed together. Then the bonding equipment sticks the tape between the two tapes to bond the two sections of tapes, so that the roll can be changed without stopping the conveying of the tape.

[0003] However, there are grid points set at equal intervals on the tape. When the new and old tapes are joined, if the tapes are not joined tightly and the interval between the two tapes is large after joining, the subsequent tapes may have grid point misalignment problems, affecting the normal operation of the placement machine.

[0004] Therefore, a patch bonding device and a feeding method for SMT feeding are designed to solve the technical problem of grid point misalignment caused by loose bonding of material strips.

[0005] It should be noted that the above information disclosed in this background technology section is only for understanding the background technology of the present application concept, and therefore, it may contain information that does not constitute the prior art. Summary of the invention

[0006] The embodiments of the present disclosure at least provide a patch bonding device for SMT feeding and a feeding method thereof.

[0007] In a first aspect, an embodiment of the present disclosure provides a patch bonding device for SMT feeding, comprising: a bonding rail having a bonding station;

[0008] A bonding mechanism is arranged at one side of the bonding station, and a glue sticking box is installed at the movable end of the bonding mechanism;

[0009] Wherein, the interior of the adhesive box is mirror-imaged with two levers;

[0010] One end of the lever is in driving connection with the glue sticking box, and the other end faces the joining station;

[0011] Also, after the glue box moves to above the tape, the two levers rotate away from each other to stretch the tape. When the two tapes are transported to the joining station along both sides of the joining guide rail, the glue box drives the lever to keep the tape stretched and attached to the joining ends of the two tapes.

[0012] In an optional implementation, two expansion slots are mirror-imaged on the adhesive tape, and the expansion slots correspond to the lever.

[0013] In an optional embodiment, the SMT feeding patch bonding device further comprises a tape reel and a waste shaft arranged in parallel, a release paper is wound on the tape reel, and a plurality of adhesive tapes are spaced apart on the release paper;

[0014] A parting table is provided between the tape reel and the glue box;

[0015] And, the release paper on the tape reel passes through the parting table and is connected to the waste shaft.

[0016] In an optional embodiment, the parting table is provided with two bending grooves, the adhesive box is provided with two matching blocks, and the bending grooves correspond to the matching blocks;

[0017] The two matching blocks are respectively located on the outer sides of the two shifting rods.

[0018] In an optional embodiment, a winding motor is installed on one side of the waste shaft, and the winding motor is drivingly connected to the waste shaft.

[0019] In an optional embodiment, one side of the joint guide rail further has a leveling assembly, and the leveling assembly includes a leveling cylinder and a leveling claw installed at a movable end of the leveling cylinder;

[0020] The movable end of the leveling cylinder faces downwardly of the engaging guide rail.

[0021] In an optional embodiment, a conveying motor is installed at both ends of the joint guide rail, and a material-diverting disk is installed at the movable end of the conveying motor;

[0022] The material-diverting disc is provided with a plurality of material-diverting teeth in the circumference direction, and the material-diverting teeth correspond to the grid points of the material belt.

[0023] In an optional embodiment, the joining mechanism further includes a vertical cylinder, and the glue box is mounted on the movable end of the vertical cylinder.

[0024] In an optional embodiment, the engagement mechanism further comprises a horizontal slide rail and a translation plate, and the translation plate is slidably disposed on the horizontal slide rail;

[0025] The vertical cylinder is mounted on the translation plate.

[0026] In a second aspect, the embodiments of the present disclosure further provide a material strip joining device, comprising: a joining guide rail having a joining station;

[0027] A joining rail having a joining station;

[0028] The adhesive tape box has two levers arranged in a mirror image inside, and the levers are suitable for clamping the adhesive tape;

[0029] The adhesive tape is provided with two expansion slots mirrored to each other, and the expansion slots correspond to the levers;

[0030] One end of the lever is in driving connection with the glue sticking box, and the other end faces the joining station;

[0031] And, after the two levers are respectively inserted into the two expansion slots of the adhesive tape, the two levers are respectively rotated away from each other to stretch the adhesive tape and attach it to the measuring tape.

[0032] In an optional embodiment, the SMT feeding patch bonding device further comprises a tape reel and a waste shaft arranged in parallel, a release paper is wound on the tape reel, and a plurality of adhesive tapes are spaced apart on the release paper;

[0033] A parting table is provided between the tape reel and the glue box;

[0034] And, the release paper on the reel passes through the parting table and is connected to the waste shaft;

[0035] The parting table is provided with two bending grooves, the adhesive box is provided with two matching blocks, and the bending grooves correspond to the matching blocks;

[0036] The two matching blocks are respectively located on the outer sides of the two shifting rods.

[0037] In a third aspect, the present disclosure also provides a feeding method, which is performed using the SMT feeding patch bonding device as described above, and includes the following steps:

[0038] Step S1, the robot places the new reel and the old reel at the two ends of the joining guide rail respectively, pulls the material strips to the joining station respectively, and makes the joining ends of the two material strips fit together;

[0039] Step S2, after the engaging mechanism drives the adhesive box to move above the adhesive tape, the two levers rotate away from each other to spread the adhesive tape;

[0040] Step S3, the bonding mechanism drives the glue sticking box to move above the bonding station;

[0041] Step S4, the joining mechanism drives the adhesive box to descend, and the adhesive tape in the expanded state is attached to the joining ends of the two material tapes.

[0042] The beneficial effect of the present invention is that, by providing a glue sticking box and a lever, and providing a power source inside the glue sticking box, the lever is driven to rotate by the power source to stretch the tape, so that when the tape is attached to the new and old tapes, the tape can tighten the new and old tapes under the action of the rebound force to maintain the fitting state.

[0043] Other features and advantages of the present invention will be described in the following description, and partly become apparent from the description, or understood by practicing the present invention. The purpose and other advantages of the present invention are realized and obtained by the structures particularly pointed out in the description, claims and drawings.

[0044] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0046] Figure 1 A three-dimensional diagram of a patch bonding device for SMT feeding provided in an embodiment of the present disclosure;

[0047] Figure 2 A three-dimensional diagram of a reel provided in an embodiment of the present disclosure;

[0048] Figure 3 A schematic diagram of the structure of an adhesive tape provided in an embodiment of the present disclosure;

[0049] Figure 4 A schematic diagram of the installation position of a lever provided in an embodiment of the present disclosure;

[0050] Figure 5 A schematic diagram of the structure of a tape reel provided in an embodiment of the present disclosure;

[0051] Figure 6 A schematic diagram of the structure of a material dial provided in an embodiment of the present disclosure;

[0052] Figure 7 for Figure 6 A partial enlarged view of part A;

[0053] Figure 8 A schematic diagram of a state of removing tape from a glue box provided in an embodiment of the present disclosure.

[0054] In the figure:

[0055] 1. Joining guide rail; 11. Joining station; 12. Leveling assembly; 121. Leveling cylinder; 122. Leveling claw;

[0056] 2. Joint mechanism; 21. Vertical cylinder; 22. Horizontal slide rail; 23. Translation plate;

[0057] 3. Glue box; 31. lever; 32. matching block;

[0058] 4. Adhesive tape; 41. Expansion slot; 42. Release paper;

[0059] 5. Material strip; 51. Grid point;

[0060] 6. Tape reel; 61. Waste shaft; 62. Winding motor;

[0061] 7. Parting table; 71. Bending groove;

[0062] 8. Conveying motor; 81. Material shifting plate; 82. Material shifting gear;

[0063] 9. Robotic arm. DETAILED DESCRIPTION

[0064] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0065] It has been found through research that in the patch process, a material tape 5 is needed. The material tape 5 is gathered on a reel and used continuously. When a roll of material tape 5 is almost used up, the reel and a reel loaded with a new roll of material need to be placed on both sides of the device of the bonding equipment, and the material tape 5 is pulled out and placed together. Then the bonding equipment sticks adhesive between the two material tapes 5 to bond the two sections of the material tape 5, so as to achieve the roll change without stopping the conveying of the material tape 5. However, the material tape 5 has grid points 51 set at equal intervals. When the new and old rolls of material tape 5 are bonded, if the material tape 5 is not bonded tightly, and the interval between the two material tapes 5 is large after bonding, the subsequent material tape 5 may have the problem of misalignment of the grid points 51, thereby affecting the normal operation of the patch machine.

[0066] The defects existing in the above solutions are the results obtained by the inventor after practice and careful research. Therefore, the discovery process of the above problems and the solutions proposed by the present disclosure for the above problems below should be the contributions made by the inventor to the present disclosure during the disclosure process.

[0067] In the following, some embodiments of the present invention are described in detail in conjunction with the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other. In addition, in the accompanying drawings, in order to effectively describe the technical content, the thickness of the components can be exaggerated or reduced.

[0068] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0069] Based on the above research, the present disclosure provides a SMT feeding patch bonding device, referring to Figure 1 The workbench comprises a manipulator 9 and a bracket installed on the workbench, a joining rail 1 is provided on the bracket, and a joining station 11 is provided in the middle of the joining rail 1. When a reel 5 is almost used up, the manipulator 9 can place a new reel and an old reel at the two ends of the joining rail 1 respectively, and make the reel 5 on the reel rest on the joining rail 1. Figure 2 , the material strip 5 has lattice points 51 arranged at equal intervals. Figure 6 , conveying motors 8 are respectively installed at both ends of the joining guide rail 1, and a material-digging disc 81 is installed at the movable end of the conveying motor 8. The material-digging disc 81 has a plurality of material-digging teeth 82 in the circumferential direction, and the material-digging teeth 82 correspond to the grid points 51 of the material strip 5. Through the above arrangement, after the material strip 5 is loaded onto the joining guide rail 1, the conveying motor 8 drives the material-digging disc 81 to rotate, so that the material-digging teeth 82 on the material-digging disc 81 are inserted into the grid points 51 of the material strip, and the material strip 5 is driven to be transported along the joining guide rail 1 by digging the grid points 51, thereby achieving the effect of transporting the material strip 5 from both ends to the joining station 11.

[0070] Reference Figure 1 In at least one embodiment, a bonding mechanism 2 is provided on one side of the bonding station 11. The bonding mechanism 2 is provided on one side of the bonding station 11. A glue sticking box 3 is installed on the movable end of the bonding mechanism 2. The bonding mechanism 2 can drive the glue sticking box 3 to move horizontally and vertically. Specifically, referring to Figure 5 In some embodiments, the joining mechanism 2 includes a horizontal slide rail 22, a translation plate 23 and a vertical cylinder. The translation plate 23 is slidably arranged on the horizontal slide rail 22. The vertical cylinder 21 is installed on the translation plate 23. The movable end of the vertical cylinder 21 is arranged downward, that is, toward the joining station 11. The glue box 3 is installed at the movable end of the vertical cylinder 21. The translation plate 23 can be driven by the cylinder to slide along the horizontal slide rail 22.

[0071] Reference Figure 5In at least one embodiment, a tape reel 6 and a waste shaft 61 are rotatably arranged on the bracket, a release paper 42 is wound on the tape reel 6, a plurality of adhesive tapes 4 are spaced apart on the release paper 42, and the adhesive surface of the adhesive tape 4 is attached to the release paper 42, a parting table 7 is arranged between the tape reel 6 and the adhesive box 3, and the tape reel 6 and the waste shaft 61 are respectively located on the upper and lower sides of the parting table 7, and the free end of the release paper on the tape reel 6 passes through the parting table 7, is bent toward the waste shaft 61, and is connected to the waste shaft 61. A winding motor 62 is installed on one side of the waste shaft 61, and the winding motor 62 is in transmission connection with the waste shaft 61. The winding motor 62 can drive the release paper 42 from the tape reel 6 through the parting table 7 and be wound onto the waste shaft 61. Through the above arrangement, after the release paper 42 passes through the front end of the parting table 7, the front end of the tape 4 is separated from the parting table 7. At this time, the coupling mechanism 2 can drive the glue box 3 to move to the front end of the parting table 7 and clamp the tape 4.

[0072] It should be noted that if the tape 4 on the release paper 42 is too tightly attached and is not separated from the release paper 42 when passing through the parting table 7, the tape 4 will pass over the folded corner of the parting table 7, resulting in the inability of the adhesive box 3 to correctly remove the tape 4 from the release paper 42.

[0073] Reference Figure 7 In order to solve the above problems, in at least one embodiment, referring to Figure 7 In at least one embodiment, the splitting table 7 is provided with two bending grooves 71, and the adhesive box 3 is provided with two matching blocks 32, and the bending grooves 71 correspond to the matching blocks 32. When the winding motor 62 drives the next adhesive tape 4 to move to the folding corner of the splitting table 7, the winding motor 62 rotates slightly in the opposite direction to loosen the release paper 42, and then the vertical cylinder 21 drives the adhesive box 3 to descend so that the matching blocks 32 are inserted into the bending grooves 71. In the process of inserting the matching blocks 32 into the bending grooves 71, the two sides of the release paper 42 can be bent respectively, so that the two sides of the release paper 42 are bent, and the release paper 42 is lifted through the bending part, thereby lifting the adhesive tape 4, making it convenient for the adhesive box 3 to take away the adhesive tape 4.

[0074] Reference Figure 4 In at least one embodiment, the glue box 3 is mirror-imaged with two levers 31, one end of which is connected to the glue box 3 and the other end is facing the joining station 11. Optionally, the glue box 3 has a micro motor inside and is connected to one end of the lever 31, and the lever 31 can rotate under the drive of the micro motor. Figure 3 In at least one embodiment, the adhesive tape 4 is provided with two expansion slots 41 in mirror image, and the expansion slots 41 correspond to the levers 31. The two matching blocks 32 are located on the outer sides of the two levers 31 respectively.

[0075] Reference Figure 8In at least one embodiment, after the adhesive box 3 moves to the top of the adhesive tape, the two levers 31 are respectively inserted into the two expansion slots 41 corresponding to the adhesive tape 4, and then the two levers 31 are respectively rotated apart to stretch the adhesive tape 4, and then the adhesive box 3 drives the levers 31 to keep the adhesive tape 4 stretched and attached to the joint ends of the two material strips 5. When the levers 31 loosen the adhesive tape 4, the adhesive tape 4 can rebound under the action of elastic force, tightening the two material strips 5 to keep them tightly attached.

[0076] Reference Figure 7 In at least one embodiment, one side of the joint guide rail 1 further has a leveling component 12, and the leveling component 12 includes a leveling cylinder 121 and a leveling claw 122 installed at the movable end of the leveling cylinder 121. The movable end of the leveling cylinder 121 faces the bottom of the joint guide rail 1. After the adhesive tape 4 is attached to the upper surface of the material belt 5, the leveling cylinder 121 drives the leveling claw 122 to make the leveling claw 122 push the adhesive tape 4 to bend toward the lower surface of the material belt 5 and attach to the lower surface of the material belt 5, thereby achieving the effect of stably attaching the adhesive tape 4 to the material belt 5.

[0077] In addition, at least one disclosed embodiment further provides a feeding method, which is performed using the SMT feeding patch bonding device as described above, and includes the following steps:

[0078] Step S1, the robot places the new reel and the old reel at the two ends of the joining guide rail 1 respectively, pulls the material strip 5 to the joining station respectively, and makes the joining ends of the two material strips 5 fit together;

[0079] Step S2, after the engaging mechanism 2 drives the adhesive box 3 to move above the adhesive tape 4, the two levers 31 rotate away from each other to open the adhesive tape 4;

[0080] Step S3, the bonding mechanism 2 drives the glue box 3 to move above the bonding station 11;

[0081] In step S4 , the joining mechanism 2 drives the adhesive box 3 to descend, and the adhesive tape 4 in the expanded state is attached to the joining ends of the two material tapes 5 .

[0082] In the several embodiments provided in this application, it should be understood that the disclosed systems, devices and methods can be implemented in other ways. The device embodiments described above are merely schematic. For example, the division of the units is only a logical function division. There may be other division methods in actual implementation. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Inspired by the above-mentioned ideal embodiments of the present invention and through the above-mentioned description, relevant staff can make various changes and modifications without departing from the technical idea of ​​the present invention. The technical scope of the present invention is not limited to the contents of the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. A patch bonding device for SMT feeding, characterized in that: include: A joining guide rail (1) having a joining station (11); A joining mechanism (2) is arranged on one side of the joining station (11), and a glue sticking box (3) is installed at the movable end of the joining mechanism (2); Wherein, the glue sticking box (3) is provided with two levers (31) in a mirror-image manner inside; One end of the lever (31) is drivingly connected to the glue sticking box (3), and the other end faces the joining station (11); Furthermore, after the adhesive box (3) moves to the top of the adhesive tape, the two levers (31) rotate away from each other to stretch the adhesive tape (4), and when the two material tapes (5) are respectively transported to the joining station (11) along the two sides of the joining guide rail (1), the adhesive box (3) drives the levers (31) to keep the adhesive tape (4) in a stretched state and adhere it to the joining ends of the two material tapes (5); The adhesive tape (4) is provided with two expansion slots (41) in a mirror-like manner, and the expansion slots (41) correspond to the lever (31); The SMT supply patch bonding device also includes a tape reel (6) and a waste shaft (61) arranged in parallel, a release paper (42) is rolled up on the tape reel (6), and a plurality of adhesive tapes (4) are spaced apart on the release paper (42); A parting table (7) is provided between the tape reel (6) and the glue sticking box (3); And, the release paper (42) on the reel (6) passes through the parting table (7) and is connected to the waste shaft (61); The splitting table (7) is provided with two bending grooves (71), the adhesive box (3) is provided with two matching blocks (32), and the bending grooves (71) correspond to the matching blocks (32); The two matching blocks (32) are respectively located outside the two shifting rods (31).

2. The SMT feeding patch bonding device according to claim 1, characterized in that: A winding motor (62) is installed on one side of the waste shaft (61), and the winding motor (62) is drivingly connected to the waste shaft (61).

3. The SMT feeding patch bonding device according to claim 1, characterized in that: One side of the joint guide rail (1) further comprises a leveling assembly (12), wherein the leveling assembly (12) comprises a leveling cylinder (121) and a leveling claw (122) mounted on a movable end of the leveling cylinder (121); The movable end of the leveling cylinder (121) faces downwardly of the joining guide rail (1).

4. The SMT feeding patch bonding device according to claim 1, characterized in that: Conveying motors (8) are respectively installed at both ends of the joining guide rail (1), and a material shifting plate (81) is installed at the movable end of the conveying motor (8); The material shifting disc (81) has a plurality of material shifting teeth (82) in the circumferential direction, and the material shifting teeth (82) correspond to the grid points (51) of the material strip (5).

5. The SMT feeding patch bonding device according to claim 1, characterized in that: The joining mechanism (2) further comprises a vertical cylinder (21), and the glue box (3) is mounted on the movable end of the vertical cylinder (21).

6. The SMT feeding patch bonding device according to claim 5, characterized in that: The engaging mechanism (2) further comprises a horizontal slide rail (22) and a translation plate (23), wherein the translation plate (23) is slidably disposed on the horizontal slide rail (22); The vertical cylinder (21) is mounted on a translation plate (23).

7. A strip joining device, characterized in that: include: A joining guide rail (1) having a joining station (11); The adhesive tape box (3) has two levers (31) arranged in a mirror-like manner inside, and the levers (31) are suitable for clamping the adhesive tape (4); The adhesive tape (4) is provided with two expansion slots (41) in a mirror-like manner, and the expansion slots (41) correspond to the lever (31); One end of the lever (31) is drivingly connected to the glue sticking box (3), and the other end faces the joining station (11); Furthermore, after the two levers (31) are respectively inserted into the two expansion slots (41) of the adhesive tape (4), the two levers (31) are respectively rotated away from each other to stretch out the adhesive tape (4) and attach it to the two material tapes (5); The material tape joining device further comprises a tape reel (6) and a waste material shaft (61) arranged in parallel, a release paper (42) being rolled up on the tape reel (6), and a plurality of adhesive tapes (4) being spaced apart on the release paper (42); A parting table (7) is provided between the tape reel (6) and the glue sticking box (3); And, the release paper (42) on the reel (6) passes through the parting table (7) and is connected to the waste shaft (61); The splitting table (7) is provided with two bending grooves (71), the adhesive box (3) is provided with two matching blocks (32), and the bending grooves (71) correspond to the matching blocks (32); The two matching blocks (32) are respectively located outside the two shifting rods (31).

8. A feeding method, characterized in that: The feeding method is performed using the SMT feeding patch bonding device as described in any one of claims 1 to 6, which includes the following steps: Step S1, the robot (9) places the new reel and the old reel at the two ends of the joining guide rail (1), respectively, pulls the material strip (5) to the joining station, and makes the joining ends of the two material strips (5) fit together; Step S2, after the engaging mechanism (2) drives the adhesive tape box (3) to move above the adhesive tape (4), the two levers (31) rotate away from each other to open the adhesive tape (4); Step S3, the bonding mechanism (2) drives the glue sticking box (3) to move above the bonding station (11); Step S4: the joining mechanism (2) drives the adhesive box (3) to descend, and adheres the adhesive tape (4) in the stretched state to the joining ends of the two material tapes (5).

Images