Electroplating device and electroplating method

Abstract

The present invention relates to a plating apparatus and a plating method for plating at least one main surface of a rectangular substrate. The present invention is provided with: a treatment tank that stores a plating solution; an anode electrode that comes into contact with the plating solution in the treatment tank; and a substrate holding unit that holds a substrate in a horizontal posture in which one main surface faces upward in the treatment tank. The substrate holding part is provided with a plurality of clamp mechanisms, the clamp mechanisms are provided with cathode electrodes, and the cathode electrodes are in contact with one main surface while holding the substrate; at least two opposite sides of the sides of the substrate are respectively provided with at least one clamp mechanism. Even if a large substrate is used, the posture can be properly maintained, and a uniform coating film can be obtained.

Description

Technical Field

[0001] The present invention relates to an electroplating device and an electroplating method for performing electroplating on one main surface of a rectangular substrate such as a printed circuit board or a glass substrate. Background Art

[0002] The technology of forming a metal thin film by electroplating is widely used on the surfaces of various substrates such as semiconductor substrates, printed circuit boards, and glass substrates. For example, in the electroplating device described in Patent Document 1, one end of a substrate transported to a treatment tank storing an electroplating solution is gripped by a clamp provided with a cathode electrode. Then, the clamp is moved to transport the substrate in the treatment tank while performing the electroplating treatment.

[0003] Furthermore, in the electroplating device described in Patent Document 2, the peripheral edge of the substrate is held by a substrate support frame having a cathode electrode and an opening in the center. Then, the substrate support frame is suspended and immersed in a treatment tank storing an electroplating solution, and the substrate is treated with the electroplating solution.

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent No. 4268874

[0007] Patent Document 2: Japanese Patent Application Publication No. 2021-031718 Summary of the invention

[0008] Problems to be solved by the invention

[0009] In recent years, the substrate has evolved towards larger sizes, for example, large substrates with a side exceeding 1 meter are also manufactured. However, the above-mentioned prior art is not suitable for processing such large substrates. That is, the technical structure described in Patent Document 1 is to use a clamp to hold only a part of the peripheral portion of the substrate to transport the substrate. If this structure is used, the substrate is in a cantilevered state, and it is difficult to maintain the posture of the large substrate. In addition, the contact area between the substrate and the cathode electrode is small, and the distance from the electrode will vary greatly depending on the position on the surface of the substrate. Therefore, it is difficult to form a uniform film using electroplating.

[0010] Furthermore, in the technology described in Patent Document 2, if the substrate is large, the substrate support frame surrounding it must also be a large support frame. As a result, the device scale of the electroplating device becomes extremely large. In addition, the substrate support frame must be prepared in accordance with the size and shape of the substrate, and it is not easy to cope with changes in the substrate.

[0011] Technical means of solving problems

[0012] The present invention has been made in view of the above problems, and an object of the present invention is to provide an electroplating apparatus and an electroplating method that can maintain an appropriate posture even for a large substrate and obtain a uniform film.

[0013] One embodiment of the present invention is an electroplating device for electroplating at least one main surface of a rectangular substrate, comprising: a treatment tank storing an electroplating solution; an anode electrode in contact with the electroplating solution in the treatment tank; and a substrate holding portion in the treatment tank for holding the substrate in a horizontal position with the one main surface facing upward. Here, the substrate holding portion has a plurality of clamping mechanisms, each of which is provided with a cathode electrode, and holds the substrate while making the cathode electrode contact with the one main surface; at least one of the clamping mechanisms is respectively arranged for at least two sides of the substrate that are opposite to each other.

[0014] Furthermore, another embodiment of the present invention is an electroplating method for electroplating at least one main surface of a rectangular substrate, wherein in a treatment tank storing an electroplating solution, a substrate holding portion holds the substrate in a horizontal position with the one main surface facing upward, and immerses the substrate in the electroplating solution. Here, the substrate holding portion has a plurality of clamping mechanisms, each of which is provided with a cathode electrode, and the substrate is held while the cathode electrode is in contact with the one main surface; at least one clamping mechanism is respectively arranged for at least two sides of the substrate that are opposite to each other. Furthermore, the one main surface is electroplated by passing electricity between the anode electrode in contact with the electroplating solution in the treatment tank and the cathode electrode.

[0015] In the invention thus constituted, the rectangular substrate is electroplated in a horizontal posture with at least two sides facing each other being held by a clamp mechanism. By holding the two sides facing each other, the substrate can be stably maintained in a horizontal posture. In addition, since the cathode electrodes can be brought into contact with one main surface at both ends of the substrate, the distance between each position of the substrate and the electrode is reduced, and a uniform film can be formed.

[0016] Effects of the Invention

[0017] As described above, in the present invention, at least two sides of the horizontal rectangular substrate facing each other are held by a clamp mechanism having a cathode electrode. Therefore, even a large substrate can be stably maintained in position and a uniform film can be obtained by electroplating.

[0018] The above and other objects and novel features of the present invention will become more fully apparent from the following detailed description with reference to the accompanying drawings. However, the accompanying drawings are for illustrative purposes only and do not limit the scope of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a diagram showing a schematic configuration of a first embodiment of an electroplating apparatus according to the present invention.

[0020] Figure 2 It is a front view showing the schematic structure of the plating processing unit.

[0021] Figure 3 yes Figure 2 AA line section view.

[0022] Figure 4A It is a diagram showing a schematic structure of a clamp mechanism.

[0023] Figure 4B It is a diagram showing a schematic structure of a clamp mechanism.

[0024] Figure 5 It is a diagram showing the mechanism structure of the supporting clamp mechanism.

[0025] Fig. 6A It is a figure which shows the lower structure of the upper clamp.

[0026] Figure 6B It is a figure which shows the lower structure of the upper clamp.

[0027] Figure 6C It is a figure which shows the lower structure of the upper clamp.

[0028] Figure 7 This is a diagram schematically showing the operation of each part.

[0029] Fig. 8A It is a diagram showing the gripping action of the substrate by the clamp mechanism.

[0030] Figure 8B It is a diagram showing the gripping action of the substrate by the clamp mechanism.

[0031] Figure 8C It is a diagram showing the gripping action of the substrate by the clamp mechanism.

[0032] Fig.8D It is a diagram showing the gripping action of the substrate by the clamp mechanism.

[0033] Fig.9A This is an enlarged view showing the movements of the upper and lower clamps during the gripping operation.

[0034] Fig. 9B This is an enlarged view showing the movements of the upper and lower clamps during the gripping operation.

[0035] Fig. 9C This is an enlarged view showing the movements of the upper and lower clamps during the gripping operation.

[0036] Fig.9D This is an enlarged view showing the movements of the upper and lower clamps during the gripping operation.

[0037] Fig. 10A It is a figure which shows the shape and function of a positioning member.

[0038] Fig. 10B It is a figure which shows the shape and function of a positioning member.

[0039] Fig. 10C It is a figure which shows the shape and function of a positioning member.

[0040] Fig.11 It is a diagram for explaining the swinging action.

[0041] Fig. 12A It is a figure explaining the jig cleaning process.

[0042] Fig. 12B It is a figure explaining the jig cleaning process.

[0043] Fig. 12C It is a figure explaining the jig cleaning process.

[0044] Fig.12D It is a figure explaining the jig cleaning process.

[0045] Fig.13A It is a diagram for explaining a modified example of the electroplating apparatus according to the first embodiment.

[0046] Fig. 13B It is a diagram for explaining a modified example of the electroplating apparatus according to the first embodiment.

[0047] Fig.14A It is a diagram for explaining the second embodiment of the electroplating apparatus of the present invention.

[0048] Fig. 14B It is a diagram for explaining the second embodiment of the electroplating apparatus of the present invention.

[0049] Fig. 14C It is a diagram for explaining the second embodiment of the electroplating apparatus of the present invention.

[0050] Fig.15A It is a diagram showing the structure of a third embodiment of the electroplating apparatus of the present invention.

[0051] Fig. 15B It is a diagram showing the structure of a third embodiment of the electroplating apparatus of the present invention. DETAILED DESCRIPTION

[0052] Hereinafter, several embodiments of the electroplating device of the present invention will be described with reference to the examples.

[0053] <First embodiment>

[0054] Figure 11 is a diagram showing a schematic structure of a first embodiment of an electroplating device of the present invention. The electroplating device 1 is a device for forming a metal (e.g., gold) film on at least one main surface of various substrates S (hereinafter referred to as "substrates") such as semiconductor substrates, printed circuit boards, and glass substrates by electrolytic plating. For the following description, Figure 1 The XYZ orthogonal coordinates are defined as shown. Figure 1 is a side view showing the electroplating device 1, with the horizontal Figure 1 The direction perpendicular to the paper is set as the X direction, and the horizontal direction perpendicular to it and along Figure 1 The direction of the paper surface is set to Y direction. In addition, the vertical direction is set to Z direction. In addition, in each figure, the dotted arrow indicates the movement direction of each member.

[0055] The electroplating device 1 has a structure in which each part described later is assembled in a frame 10 composed of a plurality of frame members. Figure 1 In the following figures, in order to avoid the complexity of the drawings, the description of some structures that do not hinder the description will be appropriately omitted. Specifically, the structure that has a low contribution to the establishment of the invention and its structure can also adopt appropriate known technology and is considered not to require special description, such as the holding mechanism for holding the parts, the cover body for covering the parts, and the mechanism for installing them on the frame 10, will be omitted from the illustration.

[0056] Figure 1 It is a front view of the electroplating device 1. The electroplating device 1 is provided with a conveying section 2 for conveying a substrate S along the Y direction. The conveying section 2 has a plurality of conveying rollers 21 arranged along the Y direction. The conveying rollers 21 are respectively supported by a supporting mechanism not shown in the figure so as to be rotatable with the X direction as the axial direction. The conveying rollers 21 are rotated by a driving mechanism not shown in the figure, and the conveying section 2 conveys the substrate S in a horizontal posture toward the Y direction. The rectangular substrate S is conveyed with one of the four surrounding sides as the front. In the following, the conveying path of the substrate S is represented by the figure symbol P, and the conveying direction is represented by the figure symbol Dt.

[0057] The electroplating apparatus 1 further includes: a loading unit 3, a plating treatment unit 4, a cleaning treatment unit 5, a unloading unit 6, a power supply unit 7, and a control unit 8. The loading unit 3, the plating treatment unit 4, the cleaning treatment unit 5, and the unloading unit 6 are arranged in this order along the conveying direction Dt (Y direction) of the substrate by the conveying unit 2. That is, in the electroplating apparatus 1, the substrate S is conveyed in the Y direction by the conveying unit 2 while the necessary processing is performed in the above-mentioned processing units.

[0058] The loading unit 3 receives the unprocessed substrate S transferred from the outside and temporarily holds it, and supplies the substrate S to the electroplating unit 4 when necessary. The electroplating unit 4 is a processing body for performing the electroplating method of the present invention, and immerses the substrate S in the electroplating solution to perform the electroplating treatment. Its structure and operation will be described in detail later.

[0059] The cleaning processing unit 5 includes a cleaning tank 51, a barrel 52, and a cleaning liquid supply and discharge unit 59. The cleaning tank 51 can store cleaning liquid in an internal space having a size sufficient to accommodate the substrate S. An opening is provided at a portion overlapping the conveying path P in the side surface on the Y direction side of the cleaning tank 51, and gates 51a and 51b that can be opened and closed are provided at the opening.

[0060] The barrel 52 is arranged below the cleaning tank 51 to receive the cleaning liquid overflowing from the cleaning tank 51. The cleaning liquid supply and discharge unit 59 supplies the cleaning liquid to the cleaning tank 51 as needed, and discharges the cleaning liquid from the cleaning tank 51. The cleaning processing unit 5 performs a cleaning process on the substrate S immersed in the plating liquid in the plating processing unit 4. For example, water is used as the cleaning liquid. The unloading unit 6 temporarily retains the substrate S after the cleaning process until it is transported to the subsequent processing step by an external transport device.

[0061] The power supply unit 7 supplies necessary power to each part of the device. The control unit 8 controls each part of the device configured as described above, so that the electroplating device 1 performs predetermined processing. The hardware configuration of the control unit 8 can use, for example, the same hardware configuration as a general computer device. That is, the various processing described below can be realized by executing a pre-prepared control program through the CPU (not shown) provided in the control unit 8. Although not specifically described below, each part of the device operates according to the control instruction from the control unit 8.

[0062] Figure 2 1 is a front view showing the schematic structure of the electroplating processing unit. Figure 3 yes Figure 2 The AA line cross-sectional view is equivalent to a side view of the electroplating processing unit 4 viewed in the Y direction. The electroplating processing unit 4 includes: a plating tank 41, barrels 42, 44, a fixture unit 40, and a plating liquid supply and discharge unit 49. The plating tank 41 can store the plating liquid in an internal space having a size sufficient to accommodate the substrate S. The barrel 42 is arranged below the plating tank 41 to receive the overflowing plating liquid. The fixture unit 40 is arranged above the plating tank 41 to hold the substrate S to be electroplated. The barrel 44 is arranged adjacent to the barrel 42 below the plating tank 41 on the (-Y) side. The plating liquid supply and discharge unit 49 supplies the plating liquid to the plating tank 41 and discharges the plating liquid from the plating tank 41 as needed.

[0063] like Figure 2As shown, openings are provided at the portions of the (-Y) side and (+Y) side of the plating tank 41 that overlap with the transport path P, and gates 41a and 41b that can be opened and closed are provided at the openings, respectively. When the gates 41a and 41b are open, the substrate S transported in the transport path P by the transport unit 2 can pass through the opening provided at the side of the plating tank 41. Thus, unprocessed substrates S can be carried into the plating tank 41, and processed substrates S can be carried out from the plating tank 41.

[0064] On the other hand, in the closed state, the opening provided on the side of the plating tank 41 is blocked. At this time, the conveying path P of the substrate S is blocked, and the plating liquid can be stored inside the plating tank 41 to a height exceeding the opening. After the substrate S is accommodated in the plating tank 41 with the gate 41a on the (-Y) side in an open state, the gate 41a is closed. The internal space of the plating tank 41 is filled with the plating liquid L, and the substrate S is immersed in the plating liquid L to perform the electroplating treatment. Then, if the plating liquid is discharged and the gate 41b on the (+Y) side is opened, the substrate S after the electroplating treatment is carried out to the cleaning section 5. The actions of the relevant gates 41a and 41b can be opened and closed independently of each other, or can be opened and closed as a whole.

[0065] In the plating tank 41, an anode electrode 45 is arranged above the conveying path P. The anode electrode 45 is electrically connected to the power supply unit 7. The plating solution L is stored in the plating tank 41 in a sufficient amount to contact the anode electrode 45. As described later, a cathode electrode is provided on a clamp mechanism that holds the substrate S in the plating tank 41. By applying a DC voltage between these electrodes from the power supply unit 7, a film is formed on the surface of the substrate S by electrolytic plating.

[0066] like Figure 3 As shown in the figure, two sets of clamping parts 40 are respectively arranged corresponding to the two ends of the substrate S in the X direction received in the plating tank 41. The two sets of clamping parts 40 are arranged symmetrically with respect to the YZ plane and have the same basic structure. That is, each clamping part 40 has: at least one clamping mechanism 400, a support frame 430 supporting the clamping mechanism 400, and a moving mechanism 43 for moving the support frame 430 in the Y direction.

[0067] In this embodiment, three sets of clamp mechanisms 400 are installed on one support frame 430. They move in the Y direction as a whole as the support frame 430 moves. Figure 2As shown in the figure, each clamp mechanism 400 can reciprocate in the Y direction between a "plating position" (shown by a solid line) located above the plating tank 41 and a "cleaning position" (shown by a dotted line) located above the barrel 44. As described later, the clamp mechanism 400 holds the substrate S and stably maintains the posture of the substrate S in the plating tank 41. Along with this, a film is formed on one main surface of the substrate S by contacting the built-in cathode electrode with the main surface of the substrate S through electrolytic plating.

[0068] like Figure 3 As shown, a rotary motor 23 is coupled to the rotary shaft 22 of the transport roller 21. The rotary motor 23 is rotated in accordance with a control command from the control unit 8 to rotate the transport roller 21, thereby transporting the substrate S in the Y direction. In addition, some of the rollers may be driven rollers not connected to a driving source.

[0069] Figure 4A and Figure 4B : is a diagram showing the schematic structure of the clamp mechanism. Figure 5 is a diagram showing the structure of the mechanism supporting the clamp mechanism. More specifically, Figure 4A is a perspective view schematically showing the structure of the clamp mechanism 400. Figure 4B 4 is a diagram showing the state of the clamp mechanism 400 holding the substrate S. In addition, when the structure and function of the clamp mechanism 400 are described below, the clamp mechanism 400 holding the (-X) side end of the substrate S is mainly used as an example. However, by reversing the same structure around the Z axis, the structure and function of the clamp mechanism holding the (+X) side end of the substrate S can be understood. In addition, in order to improve the recognition of the figure, Figure 4A The diagram of a part of the structure of the clamp mechanism 400 is omitted, and the description thereof is given in Figure 5 middle.

[0070] The clamp mechanism 400 holds the X-direction end of the substrate S by means of an upper clamp (chuck) 411 and a lower clamp 421 that can be raised and lowered independently of each other. Specifically, the upper clamp 411 and the lower clamp 421 are flat plate-shaped members that are slender and extend with the Y direction as the long side direction. The substrate S is held by the lower surface 411b of the upper clamp 411 abutting against the (-X) side end of the upper surface Sa of the substrate S, and the upper surface 421a of the lower clamp 421 abutting against the (-X) side end of the lower surface Sb of the substrate S. In fact, a cathode electrode 412 is installed on the lower surface 411b of the upper clamp 411, and the cathode electrode 412 contacts the upper surface Sa of the substrate S.

[0071] That is, Figure 4BAs shown in FIG. 1 , the lower clamp 421 has the function of defining the position of the substrate S in the height direction (Z direction). Accordingly, when the cathode electrode 412 provided on the upper clamp 411 is brought into contact with the substrate S, the lower clamp 421 also has a supporting function. Thus, the height direction position of the substrate S is stably maintained, and the cathode electrode 412 can be brought into electrical contact with the upper surface Sa of the substrate reliably.

[0072] An axis member 413 extending in the Z direction is mounted on the upper surface 411a of the upper clamp 411. The axis member 413 is supported by a lifting mechanism 414 so that it can be raised and lowered freely. The upper clamp 411 is fixed to the axis member 413 using, for example, screws, and can be freely loaded and unloaded, that is, replaced. The lifting mechanism 414 has an appropriate direct-acting mechanism such as a solenoid, a linear motor or a ball screw mechanism to lift and lower the axis member 413. As a result, the upper clamp 411 mounted on the lower end of the axis member 413 is lifted and lowered. Here, the unit including the upper clamp 411, the axis member 413, the lifting mechanism 414, etc., which is integrally formed, is referred to as the "upper clamp unit 410'.

[0073] Similarly, an axis member 423 extending in the Z direction is installed on the upper surface 421a of the lower clamp 421. The axis member 423 is supported by the lifting mechanism 424 so that it can be lifted and lowered freely. The lower clamp 421 is fixed to the axis member 423 using, for example, screws, and can be loaded and unloaded freely. The lifting mechanism 424 has a suitable direct-acting mechanism such as a solenoid, a linear motor or a ball screw mechanism to lift and lower the axis member 423. As a result, the lower clamp 421 installed at the lower end of the axis member 423 is lifted and lowered. Here, the unit that includes the lower clamp 421, the axis member 423, the lifting mechanism 424, etc. as an integral part is referred to as the "lower clamp unit 420".

[0074] The upper clamp unit 410 is mounted on the support member 401. Specifically, the upper clamp unit 410 is fixed to the support member 401 via a fixing member 404. Therefore, the upper clamp 411 can only be moved up and down relative to the support member 401. On the other hand, the lower clamp unit 420 is mounted on the support member 401 via an advance and retreat mechanism 402. Specifically, the support member 403 on which the lower clamp unit 420 is mounted is coupled to a movable portion of the advance and retreat mechanism 402 whose movable direction is the X direction. The advance and retreat mechanism 402 has an appropriate direct-acting mechanism such as a solenoid, a cylinder, a linear motor or a ball screw mechanism, and its main body is fixed to the support member 401. A guide rail 405 is provided at the lower portion of the support member 401, and a sliding member 406 engaged with the guide rail 405 is coupled to the lower clamp unit 420.

[0075] Therefore, the lower clamp unit 420 can move in the X direction within the movable range defined by the stopper (not shown) by the action of the advance and retreat mechanism 402. Therefore, the lower clamp 421 can move up and down relative to the support member 401 by the lifting mechanism 424 and move forward and backward in the X direction by the advance and retreat mechanism 402.

[0076] When the lower clamp 421 is within the movable range and is closest to the (+X) side, Figure 4B As shown by the solid line, the top end of the (+X) side of the lower clamp 421 is closer to the (+X) side than the end surface of the substrate S, and the upper surface 421a of the lower clamp 421 can support the lower surface Sb of the substrate S. Figure 4B As shown by the dotted line in , when the lower clamp 421 is within the movable range and retreated to the most (-X) side, the top end of the (+X) side of the lower clamp 421 retreats to the (-X) side relative to the end surface of the substrate S. Therefore, it is possible to avoid contact with the substrate S when the lower clamp 421 is raised or lowered.

[0077] In the clamp mechanism 400, the upper clamp 411 and the lower clamp 421 interact and cooperate to hold the substrate S in the plating tank 41. Specifically, the upper clamp 411 and the lower clamp 421 are lowered from the clamp mechanism 400 positioned at the plating position into the plating tank 41. The end of the substrate S is held at the same height as the height of the substrate S supported by the conveying roller 21. Therefore, in the plating tank 41, the substrate S is maintained in a horizontal posture with a flat upper surface. Hereinafter, the Z-direction position of the upper clamp 411 and the lower clamp 421 at this time is referred to as the "lower position".

[0078] The clamp mechanism 400 is mounted on a support frame 430 formed by combining a plurality of parts into a frame shape. Specifically, the clamp mechanism 400 is supported by the support frame 430 by fixing the support member 401 of the clamp mechanism 400 to the support frame 430. Figure 2 As shown, in this embodiment, three sets of clamp mechanisms 400 are mounted on a support frame 430 extending in the Y direction as the longitudinal direction.

[0079] The support frame 430 is supported by the travel mechanism 43 so as to be movable in the Y direction. More specifically, the travel mechanism 43 comprises: a guide rail 431, a slider 432, and a driving source not shown. The guide rail 431 is fixed to the frame 10 above the electroplating processing unit 4 and extends along the Y direction. The slider 432 is engaged with the guide rail 431. The driving source moves the slider 432 along the guide rail 431 in the Y direction. These structures can be applied with appropriate direct drive mechanisms, such as: linear motors, chain drive mechanisms, or belt drive mechanisms. For example, it is suitable to apply a single-axis robot arm pre-formed as an integrated whole by these structures.

[0080] A clamp support member 433 extending downward is mounted on the slider 432. The support frame 430 is coupled to the lower end of the clamp support member 433. Therefore, when the slider 432 moves in the Y direction along the guide rail 431, the support frame 430 and the clamp mechanism 400 mounted thereon move in the Y direction as a whole. That is, in accordance with the control command from the control unit 8, the travel mechanism 43 is actuated to move the slider 432, thereby moving the clamp mechanism 400 in the Y direction.

[0081] When a plurality of clamp mechanisms 400 are mounted on the support frame 430, these clamp mechanisms 400 move in the Y direction as a whole. Thus, each clamp mechanism 400 can reciprocate between the plating position located above the plating tank 41 and the cleaning position located above the barrel 44. Figure 1 , Figure 2 As shown, a plurality of sets of sliders 432 and jig support members 433 may be installed on one support frame 430. Thus, even when a plurality of jig mechanisms 400 are installed, the support frame 430 can be stabilized and reliably moved.

[0082] With this structure, the upper clamp 411 and the lower clamp 421 can perform the following actions. That is, the upper clamp 411 and the lower clamp 421 can be raised and lowered independently of each other by the actions of the lifting mechanisms 414 and 424. In addition, by the action of the advance and retreat mechanism 402, the lower clamp 421 can be moved forward and backward relative to the upper clamp 411 in the X direction. Then, by the action of the travel mechanism 43, the upper clamp 411 and the lower clamp 421 can be moved in the Y direction as a whole.

[0083] When the travel mechanism 43 moves the clamp mechanism 400 in the Y direction, the upper clamp 411 and the lower clamp 421 are retracted to the upper side by the lifting mechanisms 414 and 424. Thus, during the movement, the upper clamp 411 and the lower clamp 421 can be prevented from contacting the wall surface of the electroplating tank 41 in a predictable manner. The Z-direction position of the upper clamp 411 and the lower clamp 421 at this time is hereinafter referred to as the "upper position".

[0084] As described later, in this embodiment, the plurality of clamp mechanisms 400 basically perform the same operation at the same timing. Therefore, the control of the clamp mechanisms 400 by the control unit 8 may be performed independently for each clamp mechanism 400 or in parallel.

[0085] Figure 6A to Figure 6C : is a diagram showing the lower structure of the upper clamp. Fig. 6AAs shown, a plate-shaped cathode electrode 412 extending in the Y direction is provided on the lower surface 411b of the upper clamp 411. The cathode electrode is electrically connected to the power supply unit 7. In addition, a sealing member 415 formed in an annular shape by an elastic material is provided so as to surround the cathode electrode 412. Figure 6B As shown, the lower end of the sealing member 415 extends to the lower side than the lower surface of the cathode electrode 412 .

[0086] Therefore, if Figure 6C As shown in FIG. 1 , when the cathode electrode 412 contacts the upper surface Sa of the substrate S, the sealing member 415 is elastically deformed to surround the cathode electrode 412 in an airtight state. Therefore, even when the substrate S is immersed in the electroplating solution, the cathode electrode 412 does not contact the electroplating solution and remains dry. Therefore, the cathode electrode 412 can be prevented from being corroded and a film formed due to contact with the electroplating solution.

[0087] In this way, the cathode electrode 412 provided on the lower surface of the upper clamp 411 contacts one main surface of the substrate S, specifically, the upper surface Sa, and the anode electrode 45 is arranged above the substrate S in a manner opposite to the upper surface Sa. By applying a DC voltage between these electrodes from the power supply unit 7, a metal film can be formed on the upper surface Sa of the substrate S by electrolytic plating.

[0088] The clamp mechanism 400 holds the substrate S at both ends of the substrate S in the X direction, that is, at both ends in the width direction orthogonal to the conveying direction Dt. In addition, by setting a plurality of clamp mechanisms 400 along the Y direction, that is, the conveying direction Dt of the substrate S, most of the substrate S is held at both ends in the X direction. The clamp mechanism 400 helps to stably maintain the posture of the substrate S by holding the substrate S. In addition, by making the cathode electrode 412 extending in the Y direction contact the substrate S, a uniform potential can be applied to a wide range. Therefore, the electroplating device 1 can form a well-uniform electroplated film on the substrate S.

[0089] Furthermore, the plating apparatus 1 is provided with a cleaning mechanism for removing the plating solution adhering to the jig mechanism 400 and cleaning the jig mechanism 400. The configuration and operation of the cleaning mechanism will be described in detail later.

[0090] Next, the operation of the electroplating device 1 constructed as described above will be described. The basic operation flow of the electroplating device 1 is briefly described as follows. An unprocessed substrate S is carried into the carrying-in section 3. The substrate S is transported from the carrying-in section 3 to the electroplating treatment section 4. The electroplating treatment section 4 performs electrolytic plating on the substrate S to form a metal film on the surface (upper surface Sa). The electroplated substrate S is cleaned in the cleaning treatment section 5 and finally carried out to the carrying-out section 6.

[0091] Figure 7is a diagram schematically showing the operation of each part. More specifically, Figure 7 The time axis is from top to bottom, showing the actions of each part as time T passes. At time T0, after the unprocessed substrate S is loaded into the loading section 3, each part of the device performs the following actions. The brackets in the figure show the initial state of each part. In addition, Figure 7 In FIG. 1 , the portion in which the vertical line of each processing section is indicated by a bold line means that the substrate S is present in the processing section.

[0092] In the initial state, the clamp mechanism 400 is positioned at the electroplating position above the electroplating tank 41. On the other hand, the upper clamp 411 and the lower clamp 421 are positioned so as not to interfere with the upper portion of the electroplating tank 41. In addition, the upper clamp 411 and the lower clamp 421 may be positioned further downward than shown in the figure, provided that they do not become obstacles to the transport of the substrate S along the transport path P.

[0093] The carried-in substrate S is temporarily left in the carrying-in section 3. In the plating treatment section 4, the gates 41a and 41b of the plating tank 41 are opened, and the substrate S can be transported along the transport path P. At this time, the plating solution supplied from the plating solution supply and discharge section 49 is stored in the plating tank 41 to a height that does not flow out from the opening. In the cleaning treatment section 5, the gates 51a and 51b of the cleaning tank 51 are also opened, and the substrate S can be transported along the transport path P. At this point in time, there is no substrate S in the carrying-out section 6.

[0094] At time T1 , the transport unit 2 starts transporting the substrate S. The substrate S is transported along the transport path P in the transport direction Dt (Y direction), and is finally transported to the plating tank 41 . Figure 7 The dotted arrow in denoted that the substrate S is transferred by the conveying unit 2 .

[0095] When the substrate S is moved into the plating tank 41 and the conveyance is stopped, the gates 41a and 41b are closed. At the same time, the upper clamp 411 and the lower clamp 421 of the clamp mechanism 400 are lowered to hold the substrate S. Then, the plating solution L is supplied from the plating solution supply and discharge unit 49 to the plating tank 41. While the substrate S is held by the clamp mechanism 400, a DC voltage is applied between the anode electrode 45 and the cathode electrode 412 to perform electrolytic plating.

[0096] Figures 8A to 8D 2 is a diagram showing the clamping action of the substrate. FIG. 9A to FIG. 9D This is an enlarged view showing the movement of the upper and lower clamps at this time. Fig. 8A and Figure 8B As shown, the substrate S that has been carried into the carrying unit 3 is carried in the carrying direction Dt by the rotation of the carrying roller 21 of the carrying unit 2, and finally as shown in FIG. Figure 8CWhen the substrate S is moved into the electroplating tank 41, the gates 41a and 41b are closed. The upper clamp 411 and the lower clamp 421 of the clamp mechanism 400 are lowered toward the substrate S received in the electroplating tank 41. Fig.8D As shown, the substrate S is held. In this state, by supplying the plating solution L to the plating tank 41 , the substrate S is immersed in the plating solution.

[0097] The upper clamp 411 and the lower clamp 421 in the holding operation are as follows. Fig.9A As shown, from the state where the upper clamp 411 and the lower clamp 421 are in the upper position, the lower clamp 421 is first moved to the lower position. At this time, the lower clamp 421 is lowered in a state of retreating toward the (-X) direction so as not to interfere with the (-X) side end of the substrate S. Fig. 9B As shown, the lower clamp 421 moves toward the substrate S in the (+X) direction after descending to a position lower than the lower surface Sb of the substrate S indicated by the two-dot chain line.

[0098] like Fig. 9C As shown in the figure, after the lower clamp 421 enters the predetermined position, it rises slightly. As a result, the upper surface 421a of the lower clamp 421 abuts against the lower surface Sb of the substrate S. At this time, the position of the lower clamp 421 is set in such a way that the upper surface Sa of the substrate S is maintained in a flat horizontal posture. That is, the height direction position of the lower clamp 421 is determined in such a way that the height of the end of the substrate S held by the clamp mechanism 400 and the height of the central part of the substrate S supported by the conveying roller 21 are determined.

[0099] On the other hand, Fig. 9C and Fig.9D As shown, the upper clamp 411 also descends from the upper position to the lower position and contacts the upper surface Sa of the substrate S whose lower surface Sb is supported by the lower clamp 421. At this time, the lower surface of the upper clamp 411, strictly speaking, the lower surface of the cathode electrode 412 provided on the lower surface 411b of the upper clamp 411, contacts the upper surface Sa of the substrate S. In this way, the clamp mechanism 400 completes the gripping of the substrate S and the electrical contact between the upper surface Sa of the substrate S and the cathode electrode 412.

[0100] During the conveying process along the conveying path P, the posture of the substrate S may change. In addition, the stopping position of the substrate S in the plating tank 41 may deviate from the predetermined position. In order to suppress the change of the processing result caused by these, it is preferable to install a positioning member on the lower clamp 421 as shown below.

[0101] Figure 10A to Figure 10C4 is a diagram showing the shape and function of the positioning member. The positioning member 426 is a member mounted on the upper surface 421a of the lower clamp 421. The cross-sectional shape of the positioning member 426 itself in the XZ cross section is an inverted trapezoid. That is, its (+X) side end face is as shown in FIG. Fig. 10A As shown, a tapered shape is formed which retreats downward and toward the (-X) side. In addition, as for the positioning member 426, as long as the (+X) side end face is such a push-out shape, the shape of other parts is not limited to the shape shown in the figure.

[0102] In order to hold the substrate S, the lower clamp 421 moves toward the substrate S in the (+X) direction. Fig. 10B As shown, the positioning member 426 abuts against the (-X) side end face of the substrate S. Thus, the position of the substrate S in the X direction is restricted. By making the positioning member 426 abut against the end face of the substrate S at the (-X) side end and the (+X) side end of the substrate S, respectively, the position of the substrate S in the X direction can be appropriately adjusted.

[0103] When the lower clamp 421 is raised from this state and abuts against the lower surface Sb of the substrate S, since the (+X) side end surface of the positioning member 426 is in a push-pull shape, Fig. 10C As shown, the positioning member 426 is away from the end surface of the substrate S. Therefore, when the lower clamp 421 rises, the positioning member 426 can be prevented from rubbing against the end surface of the substrate S.

[0104] The positioning member 426 may be provided to extend long in the X direction. In addition, a plurality of shorter positioning members 426 may be provided at intervals in the X direction. With these configurations, the substrate S can be prevented from tilting about the vertical axis relative to the conveying path P, that is, from being skewed.

[0105] return Figure 7 The operation of the device is further described. The plating solution L is supplied to the plating tank 41, and a voltage is applied between the electrodes while the substrate S is immersed, so that the substrate S is subjected to plating. The cathode electrodes 412 extending long in the Y direction are in contact with the two ends in the X direction of the upper surface Sa of the substrate S. Thus, the variation of the electric field intensity on the upper surface Sa of the substrate S is suppressed, and a plating film with good uniformity can be formed. At this time, the substrate S is swung in the plating tank 41 by the clamp mechanism 400 being linked to the conveying roller 21, which can further improve the uniformity of the plating film.

[0106] Fig.11 The support frame 430 supporting the clamp mechanism 400 alternately repeats the swinging motion by the movement of the traveling mechanism 43. Fig.11 The movement in the (+Y) direction shown in the figure above is Fig.11As shown in the figure below, the clamp mechanism 400 mounted on the support frame 430 moves back and forth in the Y direction as a whole, and the substrate S held by the clamp mechanism 400 swings in the plating solution L in the Y direction.

[0107] At this time, the conveying roller 21 is linked with the supporting frame 430. Fig.11 As shown in the figure above, when the support frame 430 moves in the (+Y) direction and the clamp mechanism 400 moves the substrate S in the (+Y) direction, the conveying roller 21 rotates forward, that is, rotates in the direction of conveying the substrate S in the conveying direction Dt. Fig.11 As shown in the figure below, when the support frame 430 moves in the (-Y) direction and the clamping mechanism 400 moves the substrate S in the (-Y) direction, the conveying roller 21 reverses, that is, rotates in the direction of conveying the substrate S in the opposite direction (-Dt) of the conveying direction Dt.

[0108] In this way, by swinging the substrate S in the plating solution L and stirring the plating solution L, the deviation of the ion concentration in the solution can be reduced and the uniformity of the plated film can be improved. The swinging of the substrate S in the plating tank 41 is achieved by the linkage of the clamp mechanism 400 holding the end of the substrate S and the conveying roller 21 supporting the central part of the substrate S from the lower surface. Therefore, it is possible to prevent the substrate S from being subjected to local stress and to swing the substrate S while maintaining a horizontal posture.

[0109] Return again Figure 7 The substrate S is immersed in the electroplating solution L, and a voltage is applied between the electrodes while the substrate S is swung for a certain period of time. Then, the electroplating process is stopped by stopping the voltage application and draining the electroplating solution L. Then, the clamping mechanism 400 releases the grip of the substrate S and opens the gate 41b. At time T2, the conveying unit 2 moves the substrate S from the electroplating processing unit 4 to the cleaning processing unit 5. The clamping mechanism 400 releases the grip of the substrate and the gate 41b is opened. FIG. 9A to FIG. 9D The actions shown can be performed in reverse order.

[0110] In the cleaning processing section 5, when the substrate S is received in the cleaning tank 51, the gates 51a and 51b are closed. The cleaning liquid is supplied from the cleaning liquid supply and discharge section 59, and the substrate S is cleaned. After the cleaning process is performed for a predetermined time, the cleaning liquid is discharged and the gate 51b is opened, and the substrate S is discharged to the unloading section 6 at time T3.

[0111] In addition, when discharging the plating liquid from the plating tank 41 and the cleaning liquid from the cleaning tank 51, it is not necessary to completely discharge the liquid in the tank. That is, as long as the liquid is discharged to the extent that the substrate S supported in the tank is exposed from the liquid and can be moved out, there is no problem with residual liquid in the tank. On the contrary, by residual liquid, the amount of liquid required to fill the tank when processing the next substrate S can be reduced. This helps to reduce liquid consumption and reduce environmental load.

[0112] On the other hand, the clamp mechanism 400 that has released the grip of the substrate S is subjected to a cleaning process for removing the plating solution attached to the upper clamp 411 and the lower clamp 421. The clamp cleaning process is performed as follows.

[0113] FIG. 12A to FIG. 12D 1 is a diagram for explaining the cleaning process of the jig. Although not shown in the figure so far, the electroplating apparatus 1 is provided with a cleaning mechanism 9. The cleaning mechanism 9 includes: a first cleaning section 91 arranged on the (-Y) side of the electroplating tank 41 and arranged above the barrel 42, a second cleaning section 92 arranged above the barrel 44, and a third cleaning section 93. Fig. 12A As shown in FIG. 1 , the upper clamp 411 and the lower clamp 421 of the clamp mechanism 400 retreat upward after releasing the substrate S. If the support frame 430 is moved in the (-Y) direction to the cleaning position, as shown in FIG. Fig. 12B As shown, the upper clamp 411 and the lower clamp 421 of each clamp mechanism 400 pass through relative positions to the first cleaning section 91 , the second cleaning section 92 , and the third cleaning section 93 in sequence.

[0114] Fig. 12C 1 is a more detailed structure of the first cleaning section 91. The first cleaning section 91 is equipped with air nozzles 911, 912, and 913, which spray airflow to the upper fixture 411 and the lower fixture 421 to blow away the electroplating solution remaining attached to the upper fixture 411 and the lower fixture 421. Specifically, the air nozzle 911 sprays airflow from the side of the upper fixture 411, mainly toward its upper surface 411a. The air nozzle 912 sprays airflow from the bottom of the upper fixture 411 toward the lower surface 411b of the upper fixture 411. Because there is a situation where the electroplating solution dropped from the upper fixture 411 and the lower fixture 421 adheres, it is best to provide a mechanism for cleaning the air nozzle 912 with cleaning water. The air nozzle 913 sprays airflow from the side of the lower fixture 421, mainly toward its upper surface 421a. The blown-off plating solution and cleaning water are received by the bucket 42 and recovered.

[0115] The second cleaning section 92 mainly sprays cleaning water to the upper fixture 411 to clean the lower surface 411b and the cathode electrode 412 provided on the lower surface 411b. Fig. 12CThe position of the air nozzle 912 shown is provided with a cleaning water nozzle, and cleaning water is supplied from the cleaning water nozzle toward the lower surface 411b of the upper fixture 411. Thus, the lower surface 411b of the upper fixture 411, the cathode electrode 412 and the sealing member 415 are cleaned. The third cleaning part 93 has the same structure as the first cleaning part 91, and the cleaning water remaining attached to the upper fixture 411 and the lower fixture 421 is removed by the spray of airflow, so that they are dried. In the third cleaning part 93, there is no need for a mechanism for cleaning the air nozzle.

[0116] like Fig.12D As shown in the figure, when all the fixture mechanisms 400 installed by the support frame 430 pass through the relative position with the cleaning mechanism 9, the cleaning of the upper fixture 411 and the lower fixture 421 set in each fixture mechanism 400 is completed. Then, the support frame 430 moves in the (+Y) direction, and each fixture mechanism 400 returns to the electroplating position. In this way, the fixture mechanism 400 is cleaned, and when the next substrate S is processed, the residual electroplating solution can be prevented from being attached to the substrate S.

[0117] Next, the operation of each unit when the plating process is sequentially performed on a plurality of substrates S is reviewed. The substrates S are sequentially transported to the loading unit 3, the plating processing unit 4, the cleaning processing unit 5, and the unloading unit 6. Figure 7 As shown by the thick lines in the middle, the substrate S stays in each of these processing sections for a certain period of time. In principle, after the substrate S is unloaded from these processing sections, the next substrate to be processed can be immediately loaded. Therefore, by loading the next substrate S every time a substrate S is unloaded, multiple substrates S can be processed efficiently.

[0118] However, when the clamp mechanism 400 passes the substrate S below it while receiving the cleaning treatment at the cleaning position, there is a concern that the scattered cleaning water and the like may adhere to the substrate S. In order to prevent this phenomenon, it is best to carry the substrate S from the carrying-in section 3 to the plating treatment section 4 after the cleaning treatment is completed. In addition, if a structure is adopted in which the substrate S to be transported is isolated from the cleaning mechanism 9 by providing a cover or shielding member (not shown), the cleaning of the clamp mechanism 400 and the transport of the substrate S can be carried out in parallel.

[0119] <Example of Change>

[0120] Fig.13A and Fig. 13B 1 is a diagram for explaining a modified example of the plating apparatus of the first embodiment. In the plating apparatus 1 of the above embodiment, both ends of the substrate S in the X direction are gripped by three sets of clamp mechanisms 400 each including cathode electrodes 412 extending in the Y direction. Fig.13AIn FIG. 1 , the hatched region R indicates a region of the upper surface Sa of the substrate S that is gripped by the clamp mechanism 400 and contacts the cathode electrode 412. The substrate S contacts the cathode electrode 412 at three locations at each of the two ends in the X direction.

[0121] Since each cathode electrode 412 is formed to be elongated along the Y direction, it contacts most of the two sides on both sides of the rectangular substrate S in the X direction. In this way, since the cathode electrode 412 contacts most of the two opposite sides of the substrate S, a uniform potential can be applied to a wide range of the upper surface Sa of the substrate S, and a uniform electroplated film can be obtained.

[0122] Here, a variation example is described in which the same effect can be obtained even when the size of the substrate S is different. Fig. 13B As shown, when the Y-direction length of the substrate S is larger than that of the substrate in the above example, the length can be covered by increasing the number of clamp mechanisms arranged in the Y-direction. Conversely, when the Y-direction length of the substrate S is shorter than that of the substrate in the above example, the number of clamp mechanisms arranged in the Y-direction can also be reduced.

[0123] In this way, by adjusting the length of the side of the substrate S and increasing or decreasing the number of clamp mechanisms arranged in the Y direction, substrates S of various sizes can be handled. Figure 4A As shown, if the clamp mechanism 400 is set as an independent unit and can be attached and detached relative to the support frame 430, the size change of the substrate S can be flexibly responded to by adjusting the number and arrangement of the clamp mechanism 400.

[0124] A plurality of clamp mechanisms 400 may be configured as the same structural unit and modularized, and a plurality of structures (such as screw holes) for installing the clamp mechanisms 400 may also be pre-set on the support frame 430, so that such adjustment can be easily performed.

[0125] <Second embodiment>

[0126] Figures 14A to 14C FIG. 2 is a diagram for explaining a second embodiment of the electroplating apparatus of the present invention. Fig.13A and Fig. 13B same, Figures 14A to 14C The area R of the upper surface Sa of the substrate S that is held by the clamp mechanism 400 is also marked with oblique lines. Fig.13A As shown, two sides in the X direction, that is, the width direction perpendicular to the conveying direction Dt of the substrate S are gripped by the clamp mechanism 400. Thus, the posture of the substrate S in the plating tank 41 can be stabilized and the potential can be uniformly applied.

[0127] The same effect can be obtained by holding both ends of the substrate S in the Y direction. Fig.14AAs shown, the two ends of the substrate S in the Y direction, that is, the front end and the rear end in the conveying direction Dt, are gripped by the clamp mechanism. Here, two sets of clamp mechanisms are respectively provided at the front end and the rear end, but as mentioned above, the number of clamp mechanisms provided can be optimized according to the length of each side. In addition, as the configuration of the clamp mechanism, the same clamp mechanism as the clamp mechanism 400 of the above embodiment can be used in a manner that the arrangement direction is rotated 90 degrees.

[0128] Here, in particular, by using a clamp mechanism provided at the front end portion of the substrate S, that is, the (+Y) side end portion, Fig. 10A The clamp mechanism 400 including the positioning member 426 shown can obtain the following effects.

[0129] When the substrate S is carried into the electroplating tank 41, the stop position of the substrate S in the conveying direction Dt varies. The reason is that even if a sensor for detecting the substrate S is provided at an appropriate position of the conveying path P, and the conveying is stopped when the sensor detects the substrate S, it is still difficult to stop the substrate S at a predetermined position due to the time lag and the variation until the stop. Such deviation of the stop position will cause the positional relationship between the substrate S and the cathode electrode to vary, thereby damaging the stability of the electroplating quality.

[0130] In the configuration where the clamp mechanism 400 holds both ends of the substrate S in the width direction, even if the positioning member 426 is provided, for example, the positional deviation of the substrate S in the conveying direction Dt cannot be corrected. On the other hand, when the clamp mechanism 400 is provided at both ends of the substrate S corresponding to the conveying direction Dt, the positioning member 426 can correct such positional deviation in the conveying direction Dt.

[0131] In particular, when the clamp mechanism 400 is provided at the front end of the substrate S corresponding to the conveying direction Dt, the design may be as follows. Fig. 14B As shown, before the substrate S is carried into the processing tank 41, the lower clamp 421 of the clamp mechanism 400 is lowered to the lower position so that the front end of the carried substrate S abuts against the positioning member 426. In this way, the stopping position of the substrate S can be kept constant.

[0132] <Example of Change>

[0133] As a variation of the first and second embodiments, Fig. 14C As shown in FIG. 1 , clamping mechanisms may be configured on all four sides of the substrate S. Each clamping mechanism may be configured in the same manner as Figure 4A The clamp mechanism has the same structure as the clamp mechanism 400 shown in FIG. 4. With this structure, since the four sides of the substrate S are in contact with the cathode electrode, the potential uniformity applied to the upper surface Sa of the substrate S is optimized, and the quality of the obtained electroplated film is also optimized.

[0134] Thus, it is preferred to set a clamp mechanism for at least two of the four sides of the rectangular substrate. Thus, by stably maintaining the posture of the substrate and imparting a uniform potential over a wide range, the quality of electroplating can be improved. This effect is maximized when all four sides are gripped by the clamp mechanism.

[0135] <Third embodiment>

[0136] In the electroplating apparatus 1 of the first embodiment, in order to clean the upper clamp 411 and the lower clamp 421 immersed in the electroplating solution together with the substrate S, the clamp mechanism 400 must be moved in the (-Y) direction to the cleaning position to perform the cleaning process. However, this action may hinder the reduction of the cycle time when a plurality of substrates are processed continuously. In order to eliminate this problem, the following embodiment can be considered.

[0137] Fig.15A and Fig. 15B 1 is a diagram showing the structure of the third embodiment of the electroplating device of the present invention. More specifically, Fig.15A 1 is a front view showing a schematic structure of a plating processing unit of a plating apparatus 1A according to a third embodiment. Fig. 15B 1 is a side view thereof. As for the parts that can use the same structure as the electroplating apparatus 1 of the first embodiment, the same figure marks as the first embodiment are used as much as possible and the description is omitted. In addition to the two sets of clamp parts 40 that are the same as the clamp parts provided in the electroplating apparatus 1 of the first embodiment, the electroplating apparatus 1A of this embodiment is equipped with another two sets of clamp parts 47 in a manner of sandwiching the two sets of clamp parts 40.

[0138] That is, one of the clamp parts 47 is arranged on the outer side of the clamp part 40 on the (-X) side, that is, on the (-X) side. The other clamp part 47 is arranged on the (+X) side of the clamp part 40. The common point of each clamp part 47 and the clamp part 40 is that they have Figure 4A The clamp mechanism 400 shown in FIG. Figure 5 The traveling mechanism 43 shown in the figure is different in that a retracting mechanism 470 for moving the clamp mechanism 400 in the X direction is further provided.

[0139] More specifically, the retracting mechanism 470 includes a guide rail 471 that is mounted on the clamp support member 433 of the travel mechanism 43 and extends in the X direction. The support frame 430 is engaged with the guide rail 471 and can be moved in the X direction by an appropriate direct-acting mechanism 472 provided in the retracting mechanism 470. That is, in the clamp portion 47, the retracting mechanism 470 is operated so that the clamp mechanism 400 mounted on the support frame 430 can be moved in the X direction within a predetermined movable range.

[0140] When the clamp mechanism 400 of the clamp unit 47 moves to the innermost position in the X direction, the upper clamp 411 and the lower clamp 421 can enter the plating tank 41 and hold the substrate S, similarly to the clamp unit 40. On the other hand, when the clamp mechanism 400 of the clamp unit 47 moves to the outermost position in the X direction ( Fig. 15B In the state shown in the figure), the clamp mechanism 400 retreats to the outer side of the clamp mechanism 400 of the clamp part 40.

[0141] According to this structure, the two pairs of clamps 40 and 47 are alternately located at the plating position, and during this period, the other is moved to the cleaning position for cleaning, thereby improving the cycle time. When the clamps 40 and 47 are switched, in order to avoid interference between the clamp mechanisms 400, the clamp mechanism 400 of the clamp 47 needs to be retracted. In order to achieve this purpose, a retraction mechanism 470 may also be provided.

[0142] <Other>

[0143] As described above, in each of the above-mentioned embodiments, the plating apparatus 1, 1A is equivalent to the "plating apparatus" of the present invention. The substrate S to be processed is equivalent to the "substrate" of the present invention, and the upper surface Sa of the substrate S is equivalent to the "one main surface" of the present invention. Moreover, the plating tank 41 storing the plating solution L functions as the "processing tank" of the present invention. In addition, the clamp mechanism 40 functions as the "clamp mechanism" of the present invention, and the clamp parts 40, 47 containing it function as the "substrate holding part" of the present invention. In addition, the support frame 430 functions as the "support member" of the present invention.

[0144] Furthermore, in the clamp mechanism 400, the upper clamp 411 and the lower clamp 421 function as the "first member" and the "second member" of the present invention, respectively. The lifting mechanisms 413 and 423 that lift and lower these members function as the "lifting mechanism" of the present invention. In addition, the advance and retreat mechanism 402 functions as the "advance and retreat mechanism" of the present invention. In addition, the retreat mechanism 470 of the third embodiment functions as the "retreat mechanism" of the present invention.

[0145] Furthermore, the travel mechanism 43 of the present embodiment moves the clamp mechanism 400 in the Y direction, and has the function of moving the clamp mechanism 400 between the plating position and the cleaning position, and the function of swinging the clamp mechanism 400 during the plating process. Therefore, the travel mechanism 43 functions as the "moving mechanism" and "swinging mechanism" of the present invention.

[0146] In addition, the present invention is not limited to the above-mentioned embodiment, and various changes other than the above-mentioned can be implemented without departing from the main purpose. For example, in the above-mentioned embodiment, the clamp mechanism 400 is set for the two opposite sides or all four sides of the rectangular substrate S. However, the clamp mechanism of the present invention only needs to be set at least on the two opposite sides. This means that three of the four sides can also be gripped by the clamp mechanism. In this case, from the perspective of substrate positioning, it is best to grip one side of the front end in the conveying direction and two opposite sides in the direction orthogonal to the conveying direction.

[0147] Furthermore, for example, the above embodiment is configured to use the clamp mechanism 400 to hold the substrate S transported by the transport roller 21 to the electroplating tank 41. However, the transport mechanism is not limited to the roller, and can be any mechanism. On the other hand, it is also possible to consider a method of transporting the substrate while being held by the clamp mechanism. In this case, the transport mechanism is not a necessary structure. However, in order to stably maintain the posture of the large substrate, it is best to provide a certain support mechanism that supports the central part of the substrate S from below.

[0148] Furthermore, for example, in the above-mentioned embodiment, when the substrate S is swung in the plating tank 41, the rotation direction of the conveying roller 21 is switched in conjunction with the reciprocating movement of the clamp mechanism 400. At this time, instead of switching the driving direction of the conveying roller 21, the conveying roller 21 may be disconnected from the driving source so that the conveying roller 21 is driven to rotate relative to the swing caused by the clamp mechanism 400.

[0149] In addition, the substrate to be processed does not need to be a strict geometrical rectangular shape. For example, even if any side of the substrate has some irregularities, it can be any substrate as long as the outer shape of the substrate can be roughly rectangular.

[0150] As described above with reference to the specific embodiments, the electroplating apparatus of the present invention may also be configured to include, for example, a conveying unit that supports the substrate from below and conveys it in a horizontal direction, and the clamping mechanism holds the substrate at the same position as the position of the substrate supported by the conveying unit in the vertical direction. According to this configuration, the conveying unit and the clamping mechanism can maintain the substrate in a flatter and horizontal posture.

[0151] Furthermore, for example, when the conveying unit conveys the substrate in a direction parallel to two sides of the substrate that are parallel to each other, at least one clamp mechanism may be configured for each of the two parallel sides. That is, the clamp mechanism may be configured to respectively grip two sides in the width direction that are orthogonal to the conveying direction of the substrate. According to this configuration, the support and conveying of the substrate by the conveying unit and the gripping of the substrate by the clamp mechanism are combined, so that the substrate can be smoothly moved into the processing layer, the electroplating process can be carried out, and the processed substrate can be moved out, and the processing of multiple substrates can be efficiently implemented.

[0152] In this case, for example, at least one clamp mechanism may be provided for each of the two parallel sides and at least one other side. The more sides are held, the more effective it is to maintain the substrate posture and to improve the plating quality by imparting a uniform potential.

[0153] Furthermore, for example, two or more clamp mechanisms may be arranged for one side of the substrate. According to such a configuration, the ratio of the area gripped by the clamp mechanism in the length of each side becomes larger, which helps to maintain the posture stably.

[0154] Furthermore, for example, the substrate holding portion may also have a plurality of clamp mechanisms having the same structure and shape. According to this configuration, the plurality of clamp mechanisms can be manufactured with the same specifications, which can reduce the manufacturing cost and the management cost of replacement parts.

[0155] In this case, for example, the substrate holding portion has a support member on which a plurality of clamp mechanisms are mounted, and the support member can also change at least one of the arrangement position and the arrangement number of the clamp mechanisms. According to this configuration, the arrangement of the clamp mechanisms can be easily optimized for substrates of various sizes.

[0156] Furthermore, for example, the clamp mechanism may also include: a first member abutting against one main surface of the substrate, a second member abutting against another main surface of the substrate opposite to the one main surface, and a lifting mechanism that lifts and lowers the first member and the second member relative to each other to hold and release the substrate; and the cathode electrode is mounted on the lower surface of the first member. According to this structure, the substrate is held by sandwiching the substrate between the first member and the second member, and the cathode electrode is also in contact with the substrate. Therefore, the clamp mechanism can stabilize the posture of the substrate while stabilizing the electrical connection with the cathode electrode.

[0157] In this case, an annular sealing member surrounding the cathode electrode may be provided on the lower surface of the first member. According to this configuration, an airtight space is formed around the cathode electrode in the plating solution, and the cathode electrode can be prevented from contacting the plating solution.

[0158] Furthermore, for example, the clamp mechanism may also have an advance and retreat mechanism that allows the second member to move relative to the first member in the horizontal direction. According to this configuration, by changing the interval between the first member and the second member in the horizontal direction, it is possible to switch between a state in which the second member is wound around the lower surface of the substrate and can hold the substrate, and a state in which the second member is retracted from the substrate to the outside and can be raised and lowered without contacting the substrate. That is, when the lifting mechanism moves the second member upward, it is possible to avoid interference between the second member and the substrate.

[0159] Furthermore, for example, a positioning member that defines the horizontal position of the substrate by abutting against the end face of the substrate may be provided on the second member. The position of the substrate brought into the processing tank from the outside may change. If a positioning member is provided on the second member, when the clamp mechanism is used for holding, the end face of the substrate abuts against the positioning member to perform position correction, and there is no need to perform alignment adjustment separately.

[0160] In this case, the side of the side of the positioning member facing the substrate can also be a tapered surface that is farther away from the substrate as it moves downward. According to this structure, after the end face of the substrate abuts against the positioning member, the positioning member can be prevented from rubbing against the end face of the substrate during the movement for making the second member abut against the lower surface of the substrate.

[0161] Furthermore, for example, the substrate holding portion may also have a swing mechanism that allows a plurality of clamp mechanisms that hold the substrates to move back and forth in a horizontal direction as a whole. According to this configuration, by swinging the substrate held in the plating solution by the clamp mechanisms, the uniformity of the film formed by the plating process can be further improved.

[0162] In this case, it is also possible to have a conveying roller that supports the substrate from below and rotates to convey the substrate in the horizontal direction, and when the swing mechanism causes the clamp mechanism to reciprocate, the rotation direction of the conveying roller can be changed synchronously with the reciprocating movement. According to this configuration, by linking the conveying roller that supports the central part of the substrate from below and the clamp mechanism that holds the end of the substrate, the substrate can be kept in a stable state without applying excessive stress to the substrate and causing the substrate to swing.

[0163] Furthermore, for example, the lifting mechanism may be configured to lift the first member and the second member between a lower position where the first member and the second member enter the processing tank and contact the electroplating solution, and an upper position where the first member and the second member retreat to a position higher than the processing tank, and further provide a cleaning mechanism for spraying at least one of an airflow and a cleaning liquid on the first member and the second member located at the upper position. According to such a configuration, the first member and the second member pulled up from the electroplating solution can be cleaned, and the residual electroplating liquid can be removed. Therefore, when a plurality of substrates are processed sequentially, it is possible to prevent the residual electroplating liquid from being attached to the substrates, thereby reducing the processing quality.

[0164] Here, for example, when the substrate holding portion has a moving mechanism that moves the clamp mechanism in the horizontal direction, the cleaning mechanism can also be provided along the movement path of the moving mechanism to the clamp mechanism, and at least one of the air flow and the cleaning liquid can be sprayed on the first member and the second member passing through the relative position to the cleaning mechanism. In particular, when a plurality of clamp mechanisms are provided, the first member and the second member can be efficiently cleaned by sequentially passing through the relative position to the cleaning mechanism.

[0165] Furthermore, two groups of substrate holding parts each having a plurality of clamping mechanisms may be provided, and a moving mechanism provided on one of the two groups of substrate holding parts and a moving mechanism provided on the other substrate holding part selectively position the clamping mechanisms provided on the two groups of substrate holding parts above the processing tank. In this case, the cleaning mechanism may also be configured to spray at least one of an air flow and a cleaning liquid on the first member and the second member of the clamping mechanism different from the clamping mechanism positioned above the processing tank. According to this configuration, by alternately using the two groups of substrate holding parts to perform the plating process and the cleaning process, the process cycle time can be shortened.

[0166] Furthermore, in this case, a retracting mechanism may be provided on one of the two substrate holding parts to make the clamping mechanism retract in a direction orthogonal to the moving direction of the clamping mechanism by the moving mechanism. According to this configuration, when the two substrate holding parts are exchanged, interference between the clamping mechanisms can be avoided.

[0167] The invention has been described above with reference to specific embodiments, but this description is not intended to be interpreted restrictively. With reference to the description of the invention, as with other embodiments of the invention, various variations disclosed will be clear to those skilled in the art. Therefore, the appended claims may be considered to cover such variations or embodiments without departing from the true scope of the invention.

[0168] Industrial Applicability

[0169] The present invention is suitable for the technology of forming a film by electroplating one main surface of a substrate, and has a significant effect when a large rectangular substrate is used as the processing object.

[0170] [Description of Reference Numerals]

[0171] 1: Electroplating equipment

[0172] 2: Transport Department

[0173] 4: Electroplating treatment department

[0174] 9: Cleaning mechanism

[0175] 21: Conveying roller

[0176] 41: Processing tank

[0177] 40, 47: Clamp part (substrate holding part)

[0178] 43: Traveling mechanism (swinging mechanism, moving mechanism)

[0179] 45: Anode electrode

[0180] 400: Clamping mechanism

[0181] 402: Advance and Retreat

[0182] 411: Component 1

[0183] 412: Cathode electrode

[0184] 413, 423: Lifting mechanism

[0185] 415: Sealing member

[0186] 421: Component 2

[0187] 426: Positioning components

[0188] 430: Support frame (support member)

[0189] 470: Retreat Agency

[0190] L: Plating solution

[0191] S: Substrate

[0192] Sa: upper surface (one main surface) (of substrate S)

Claims

1. An electroplating device for electroplating at least one main surface of a rectangular substrate, wherein: have: Processing tank, storing plating solution; an anode electrode, contacting the electroplating solution in the treatment tank; and A substrate holding portion, in the processing tank, holding the substrate in a horizontal position with the one main surface facing upward; The substrate holding portion has a plurality of clamping mechanisms, each of which is provided with a cathode electrode, and holds the substrate while bringing the cathode electrode into contact with the one main surface; At least one of the clamp mechanisms is disposed on each of at least two sides of the substrate that are opposite to each other.

2. The electroplating device according to claim 1, wherein: have: A conveying unit, which supports the substrate from below and conveys it in a horizontal direction; The clamp mechanism holds the substrate at the same position as the position of the substrate supported by the conveying unit in the up-down direction.

3. The electroplating device according to claim 1, wherein: The conveying unit conveys the substrate in a direction parallel to two sides of the substrate that are parallel to each other; At least one of the clamp mechanisms is disposed on each of the two parallel sides.

4. The electroplating device according to claim 3, wherein: At least one of the clamp mechanisms is disposed on each of the two parallel sides and at least one side other than the two parallel sides.

5. The electroplating device according to any one of claims 1 to 4, wherein: Two or more of the clamp mechanisms are arranged on one side of the substrate.

6. The electroplating device according to any one of claims 1 to 4, wherein: The substrate holding portion includes a plurality of the clamp mechanisms having the same structure and shape.

7. The electroplating device according to claim 6, wherein: The substrate holding portion includes a support member on which a plurality of the clamp mechanisms are mounted; the support member can change at least one of the arrangement position and the arrangement number of the clamp mechanisms.

8. The electroplating device according to claim 6, wherein: The above-mentioned clamping mechanism respectively has: A first member abutting against the one main surface of the substrate; a second member abutting against another main surface of the substrate opposite to the one main surface; and A lifting mechanism is used to lift the first member and the second member relative to each other to hold and release the substrate; The cathode electrode is mounted on the lower surface of the first member.

9. The electroplating device according to claim 8, wherein: An annular sealing member surrounding the cathode electrode is provided on the lower surface of the first member.

10. The electroplating device according to claim 7, wherein: The clamp mechanisms each include an advance / retract mechanism for moving the second member in a horizontal direction relative to the first member.

11. The electroplating device according to any one of claims 1 to 4, wherein: The second member is provided with a positioning member that regulates the horizontal position of the substrate by coming into contact with the end surface of the substrate.

12. The electroplating device according to claim 11, wherein: Among the side surfaces of the positioning member, the side surface facing the substrate is a tapered surface that becomes increasingly distant from the substrate as it moves downward.

13. The electroplating device according to any one of claims 1 to 4, wherein: The substrate holding portion includes a swing mechanism that integrally reciprocates the plurality of clamp mechanisms that respectively hold the substrate in a horizontal direction.

14. The electroplating device according to claim 13, wherein: The substrate includes: a conveying roller for conveying the substrate in a horizontal direction by supporting the substrate from below and rotating the substrate; When the swing mechanism reciprocates the clamp mechanism, the transport roller changes its rotation direction in synchronization with the reciprocating movement.

15. The electroplating device according to claim 8, wherein: The lifting mechanism lifts the first member and the second member between a lower position where the first member and the second member enter the treatment tank and contact the electroplating solution and an upper position where the first member and the second member retreat to a position above the treatment tank. The electroplating apparatus further includes a cleaning mechanism that sprays at least one of an air flow and a cleaning liquid onto the first member and the second member located at the upper position.

16. The electroplating device according to claim 15, wherein: The substrate holding portion has a moving mechanism for moving the clamp mechanism in a horizontal direction; The cleaning mechanism is provided along a moving path of the moving mechanism with respect to the clamp mechanism, and sprays at least one of the airflow and the cleaning liquid onto the first member and the second member passing through a position facing the cleaning mechanism.

17. The electroplating device according to claim 16, wherein: The device comprises: two sets of the substrate holding parts each comprising a plurality of the clamping mechanisms; The moving mechanism provided on one of the substrate holding parts of the two groups and the moving mechanism provided on the other of the substrate holding parts of the two groups selectively position the clamping mechanisms provided on the substrate holding parts of the two groups above the processing tank; The cleaning mechanism sprays at least one of the airflow and the cleaning liquid onto the first member and the second member of the clamp mechanism different from the clamp mechanism positioned above the processing tank.

18. The electroplating device according to claim 17, wherein: One of the two sets of substrate holding portions is provided with a retracting mechanism for retracting the clamp mechanism in a direction orthogonal to a moving direction of the clamp mechanism by the moving mechanism.

19. An electroplating method for electroplating at least one main surface of a rectangular substrate, wherein: In a treatment tank storing a plating solution, the substrate is held in a horizontal position with the one main surface facing upward by a substrate holding portion, and the substrate is immersed in the plating solution; The substrate holding portion has a plurality of clamping mechanisms, each of which is provided with a cathode electrode, and holds the substrate while bringing the cathode electrode into contact with the one main surface; At least one of the clamping mechanisms is respectively arranged for at least two sides of the substrate that are opposite to each other; The one main surface is subjected to electroplating treatment by passing electricity between the anode electrode in contact with the electroplating solution in the treatment tank and the cathode electrode.

20. The electroplating method according to claim 19, wherein: The substrate holding portion causes the plurality of clamp mechanisms that respectively hold the substrate to reciprocate in a horizontal direction in an integrated manner to swing the substrate in the processing tank.

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