Laser drilling control method, device and equipment and storage medium

Abstract

The invention discloses a laser drilling control method and device, equipment and a storage medium. The laser drilling control method comprises the steps that a target hole coordinate data set is obtained; based on a preset filtering model, the target hole coordinate data set is decomposed into a first hole coordinate data set and a second hole coordinate data set, the first hole coordinate data set is used for representing a coordinate data set to be distributed to a mobile platform, and the second hole coordinate data set is used for representing a coordinate data set to be distributed to a galvanometer assembly; performing path smoothing processing on the first hole coordinate data set to obtain a smooth path data set; determining a control speed data set of the mobile platform based on the smooth path data set and a preset line segment transition speed regulation model; and based on the target hole coordinate data set, the first hole coordinate data set, the second hole coordinate data set and the control speed data set, performing synchronous control on the modulation deflector, the galvanometer assembly and the mobile platform. According to the laser drilling device, the laser drilling efficiency can be improved through synchronous cooperation of the modulation deflector, the galvanometer assembly and the moving platform.

Description

Technical Field

[0001] The present invention relates to the technical field of automation equipment, and in particular to a laser drilling control method, device, equipment and storage medium. Background Art

[0002] Laser drilling equipment is a commonly used processing equipment in circuit board processing. As the number of holes that need to be processed in circuit boards continues to increase, the requirements for the processing efficiency of laser drilling equipment are also getting higher and higher. Laser drilling equipment usually includes a mobile platform and a galvanometer assembly, and the function of switching the drilling position of the circuit board is achieved through the cooperation of the mobile platform and the galvanometer assembly. However, the processing efficiency of laser drilling equipment can no longer meet the requirements of the increasingly developed circuit board manufacturing process. Summary of the invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention provides a laser drilling control method, device, equipment and storage medium, which can improve the efficiency of laser drilling by modulating the synchronous cooperation of a deflector, a galvanometer assembly and a mobile platform.

[0004] In a first aspect, an embodiment of the present invention provides a laser drilling control method, which is applied to a laser drilling device having a modulation deflector, a galvanometer assembly and a mobile platform, comprising: Obtain target hole coordinate data set; Based on a preset filtering model, the target hole coordinate data set is decomposed into a low-frequency part and a high-frequency part, the low-frequency part is used as a first hole coordinate data set and the high-frequency part is used as a second hole coordinate data set, the first hole coordinate data set is used to represent a coordinate data set with smoother motion to be assigned to the mobile platform, and the second hole coordinate data set is used to represent a coordinate data set to be assigned to the galvanometer assembly; Performing path smoothing processing on the first hole coordinate data set to obtain a smoothed path data set; Determining a control speed data set of the mobile platform based on the smooth path data set and a preset line segment transition speed control model; Based on the target hole coordinate data set, the first hole coordinate data set, the second hole coordinate data set and the control speed data set, the modulation deflector, the galvanometer assembly and the moving platform are synchronously controlled.

[0005] According to some embodiments of the present invention, the step of obtaining the target hole coordinate data set also includes: Get the original hole coordinate data set; The original hole coordinate data set is processed by path planning to obtain a target hole coordinate data set.

[0006] According to some embodiments of the present invention, performing path planning processing on the original hole coordinate data set to obtain a target hole coordinate data set includes: Based on the global path optimization principle, the original hole coordinate data set is processed by path planning to obtain a target hole coordinate data set.

[0007] According to some embodiments of the present invention, performing path planning processing on the original hole coordinate data set to obtain a target hole coordinate data set includes: According to the scanning range of the galvanometer assembly, the original hole coordinate data set is divided into a plurality of local hole coordinate data sets; Performing path planning processing on the multiple local hole coordinate data sets in sequence to obtain a target hole coordinate data set; During the path planning process: Based on the local path optimal principle, taking one of the hole coordinates as the path starting point, performing path planning processing on the first local hole coordinate data set to obtain an intermediate hole coordinate data set; Based on the shortest distance principle, determining the starting hole coordinates of the next local hole coordinate data set, wherein, among all the hole coordinates of the local hole coordinate data set, the distance between the starting hole coordinates and the last hole coordinates of the intermediate hole coordinate data set is the shortest; Based on the local path optimal principle, the starting hole coordinates are used as the path starting point, and the path planning process is performed on the local hole coordinate data set.

[0008] According to some embodiments of the present invention, the target hole coordinate data set includes an X-axis hole coordinate data set and a Y-axis hole coordinate data set, and the target hole coordinate data set is decomposed into a low-frequency part and a high-frequency part based on a preset filtering model, and the low-frequency part is used as a first hole coordinate data set and the high-frequency part is used as a second hole coordinate data set, including: Based on a preset filtering model, decomposing the X-axis hole coordinate data set into a first X-coordinate data set and a second X-coordinate data set; Based on a preset filtering model, decomposing the Y-axis hole coordinate data set into a first Y-coordinate data set and a second Y-coordinate data set; Combining the first X-coordinate data set and the first Y-coordinate data set to obtain a first hole coordinate data set; The second X-coordinate data set and the second Y-coordinate data set are combined to obtain a second hole coordinate data set.

[0009] According to some embodiments of the present invention, decomposing the target hole coordinate data set into a low-frequency part and a high-frequency part based on a preset filtering model, using the low-frequency part as a first hole coordinate data set and using the high-frequency part as a second hole coordinate data set includes: Based on a preset EMA low-pass filter, filtering is performed on the target hole coordinate data to determine a low-frequency component in the target hole coordinate data; The low-frequency components in the target hole coordinate data are used as the first hole coordinate data set, and the remaining components in the target hole coordinate data are used as the second hole coordinate data set.

[0010] According to some embodiments of the present invention, performing path smoothing on the first hole coordinate data set to obtain a smoothed path data set includes: Based on the Bezier curve model, path smoothing processing is performed on the first hole coordinate data set to obtain a smoothed path data set. In a second aspect, an embodiment of the present invention provides a laser drilling control device, which is applied to a laser drilling device having a modulation deflector, a galvanometer assembly and a mobile platform, including: An acquisition module, used to acquire a target hole coordinate data set; A coordinate decomposition module, for decomposing the target hole coordinate data set into a low-frequency part and a high-frequency part based on a preset filtering model, using the low-frequency part as a first hole coordinate data set and the high-frequency part as a second hole coordinate data set, wherein the first hole coordinate data set is used to represent a coordinate data set with smoother motion to be assigned to the mobile platform, and the second hole coordinate data set is used to represent a coordinate data set to be assigned to the galvanometer assembly; A path smoothing processing module, used for performing path smoothing processing on the first hole coordinate data set to obtain a smoothed path data set; A speed control module, used to determine a control speed data set of the mobile platform based on the smooth path data set and a preset line segment transition speed control model; A control module is used to synchronously control the modulation deflector, the galvanometer assembly and the moving platform based on the target hole coordinate data set, the first hole coordinate data set, the second hole coordinate data set and the control speed data set.

[0011] In a third aspect, an embodiment of the present invention provides a laser drilling device, comprising a processor, a memory, a modulation deflector, a galvanometer assembly and a mobile platform, wherein the memory stores a computer program, and the processor is used to implement the laser drilling control method as described above when running the computer program.

[0012] In a fourth aspect, an embodiment of the present invention provides a storage medium, wherein a computer program is stored in the storage medium, and when the computer program is executed, the above-mentioned laser drilling control method is implemented.

[0013] The embodiments of the present invention have at least the following beneficial effects: Based on the filtering model, the target hole coordinate data set is decomposed into a first hole coordinate data set to be assigned to the mobile platform and a second hole coordinate data set to be assigned to the galvanometer assembly, and the first hole coordinate data set is path-smoothed and speed-controlled. Based on the target hole coordinate data set, the first hole coordinate data set, the second hole coordinate data set and the control speed data set, the modulation deflector, the galvanometer assembly and the mobile platform are synchronously controlled, which is beneficial to improving the efficiency of laser drilling.

[0014] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which: Figure 1 A schematic diagram of a laser drilling device according to an embodiment of the present invention; Figure 2 A flowchart of the steps of the laser drilling control method according to an embodiment of the present invention; Figure 3 A schematic top view of a mobile platform and a target workpiece according to an embodiment of the present invention; Figure 4 This is one of the working principle block diagrams of the filtering model according to an embodiment of the present invention; Figure 5 This is the second working principle block diagram of the filtering model of an embodiment of the present invention; Figure 6 4 is a principle block diagram of a laser drilling control device according to an embodiment of the present invention.

[0016] Reference numerals: The target workpiece 10 , the modulation deflector 110 , the galvanometer assembly 120 , the moving platform 130 , the acquisition module 210 , the coordinate decomposition module 220 , the path smoothing processing module 230 , the speed control module 240 , and the control module 250 . DETAILED DESCRIPTION

[0017] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0018] In the description of the present invention, "several" means one or more, "multiple" means more than two, greater than, less than, and exceeding are understood as not including the number itself, and "above", "below", and "within" are understood as including the number itself. If there is a description of "first", "second", etc., it is only used for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0019] In the description of the present invention, unless otherwise clearly defined, words such as “setting”, “installation” and “connection” should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above words in the present invention in combination with the specific content of the technical solution.

[0020] Please refer to Figure 1 In the related art, the laser drilling equipment usually includes a galvanometer assembly 120 and a mobile platform 130. The galvanometer assembly 120 is used to control the position of the laser spot on the target workpiece 10 (such as a circuit board). The mobile platform 130 is used to place the target workpiece 10 and drive the target workpiece 10 to move in the XY plane. Through the cooperation of the galvanometer assembly 120 and the mobile platform 130, laser drilling is achieved at different positions of the target workpiece 10. However, in the related art, the movement control of the galvanometer assembly 120 and the mobile platform 130 is usually separated, that is, the mobile platform 130 starts from rest, then moves to the target position and stops, and then the galvanometer assembly 120 scans and drills the local position of the target workpiece 10. Compared with the time-consuming laser drilling, the start-stop and movement process of the mobile platform 130 is time-consuming, which becomes a bottleneck for improving processing efficiency.

[0021] In order to improve the processing efficiency, the laser drilling equipment of the related art adds a modulator deflector 110, such as an electro-optical deflector, an acousto-optical deflector, a liquid crystal phased array, a liquid crystal polarization grating, an optical phased array, etc. The modulator deflector 110 uses the electro-optic effect, acousto-optic effect or liquid crystal birefringence to change the refractive index of the transparent medium to achieve the deflection of the transmitted light, or uses the optical phased array to achieve the beam deflection scanning. Compared with the mechanical deflection structure such as the galvanometer assembly 120, the scanning speed of the modulator deflector 110 is very fast, but the scanning range is narrow. Therefore, the related art adds a modulator deflector 110 on the basis of the galvanometer assembly 120 and the mobile platform 130, which can combine the advantages of the modulator deflector 110 and the mechanical deflection structure, thereby improving the processing efficiency.

[0022] Although adding a modulation deflector 110 can improve processing efficiency to a certain extent, it still cannot well meet the requirements of the increasingly developed circuit board manufacturing process. To this end, this embodiment provides a laser drilling control method, device, equipment and storage medium, which can improve the efficiency of laser drilling through the synchronous cooperation of the modulation deflector 110, the galvanometer assembly 120 and the mobile platform 130.

[0023] Please refer to Figure 1 and Figure 2 This embodiment discloses a laser drilling control method, which is applied to a laser drilling device having a modulating deflector 110, a galvanometer assembly 120 and a moving platform 130. The laser drilling control method includes steps S100 to S500. It should be noted that the steps in this embodiment are numbered only for the convenience of review and understanding, and do not limit the execution order of the steps.

[0024] Before describing in detail the laser drilling control method of the present embodiment, the inventive concept of the present embodiment is described first to facilitate a better understanding of the laser drilling control method of the present embodiment.

[0025] Taking an acousto-optic deflector (AOD) as an example of the modulation deflector 110, compared with the galvanometer assembly 120, the scanning speed of the AOD is faster, but the scanning range of the AOD (e.g. Figure 3 The scanning speed of the galvanometer assembly 120 is relatively slow, but the scanning range of the galvanometer assembly 120 (as shown by the mark Z2 in the figure) is usually only a few microns. Figure 3 The scanning range of the galvanometer assembly 120 is larger than the scanning range of the acousto-optic deflector, for example, the scanning range of the galvanometer assembly 120 is 30×30 microns, where the scanning range refers to the range in which the acousto-optic deflector or the galvanometer assembly 120 can drive the laser to change the position of the light spot on the target plane (such as the surface of the target workpiece 10) when other conditions remain unchanged. Generally speaking, the scanning range of the galvanometer assembly 120 is smaller than the size of the target workpiece 10, so the target workpiece 10 needs to be driven to move in the XY plane by the mobile platform 130.

[0026] Assuming that the laser drilling time is T1, the time taken for the acousto-optic deflector to jump from one hole position to the next hole position is T2, the time taken for the galvanometer assembly 120 to jump is T3, and the time taken for the mobile platform 130 to move is T4, then the processing time T=T1+T2+T3+T4. As mentioned above, the acousto-optic deflector has the fastest jumping speed, the galvanometer assembly 120 is the second fastest, and the mobile platform 130 is the slowest. Therefore, the better control strategy is to make the most of the acousto-optic deflector to jump between holes. When the hole position exceeds the jumping range of the acousto-optic deflector, the galvanometer assembly 120 is used to jump. When the hole position exceeds the jumping range of the galvanometer assembly 120, the mobile platform 130 is used to jump. Considering that the mobile platform 130 starts and stops slowly, and frequent starts and stops take a lot of time, the ideal control strategy is: during the drilling process, the galvanometer assembly 120 and the mobile platform 130 are controlled to move continuously so that new holes (holes outside the scanning range of the acousto-optic deflector) continuously enter the scanning range of the acousto-optic deflector. Therefore, it is necessary to decompose the drilling path composed of all holes into the galvanometer assembly 120 and the mobile platform 130 to facilitate the synchronous control of the galvanometer assembly 120 and the mobile platform 130.

[0027] The following is a detailed description of the contents of each step of the laser drilling control method: S100, obtaining a target hole coordinate data set; Exemplarily, the laser drilling control method of this embodiment can be executed in a host computer (such as a personal electronic computer) or in a laser drilling device (which requires a high computing power of the laser drilling device). When executed in a host computer, the target hole coordinate data set can be a hole coordinate data set of the target workpiece 10 to be produced, or a hole coordinate data set after path planning, wherein path planning refers to a processing method in which the hole positions are arranged in a certain order to achieve the best drilling efficiency. The target hole coordinate data set contains the coordinates of a series of holes. Assuming the coordinates of each hole are P(x, y), the target hole coordinate data set is a data set in which all holes are arranged and stored in a certain order, and the arrangement order is usually the order of drilling, such as P0(x0, y0), P1(x1, y1), P2(x2, y2), .....P n (x n ,y n ), n is a positive integer. The target hole coordinate data set can be obtained by manual import by the user, or by an intermediate data set generated after the original hole coordinate data set is calculated by the previous program.

[0028] S200, based on a preset filtering model, decompose the target hole coordinate data set into a low-frequency part and a high-frequency part, use the low-frequency part as a first hole coordinate data set and use the high-frequency part as a second hole coordinate data set, the first hole coordinate data set is used to represent a coordinate data set with smoother motion to be assigned to the mobile platform 130, and the second hole coordinate data set is used to represent a coordinate data set to be assigned to the galvanometer assembly 120; Exemplarily, the mobile platform 130 is driven by a motor, for example, the mobile platform 130 has an X-axis motor and a Y-axis motor, which are used to move along the X-axis direction under the drive of the X-axis motor, and move along the Y-axis direction under the drive of the Y-axis motor, so as to achieve movement in the XY plane under the cooperation of the X-axis motor and the Y-axis motor. During the movement, it takes a certain amount of time for the motor to drive the mobile platform 130 to accelerate or decelerate. Therefore, the control of the mobile platform 130 is as smooth as possible to avoid the impact of rapid acceleration or deceleration on the mobile platform 130 and reduce the time consumption of the acceleration and deceleration process.

[0029] The galvanometer assembly 120 has an X-axis galvanometer motor and a Y-axis galvanometer motor, the X-axis galvanometer motor is connected to the X-axis galvanometer, and the Y-axis galvanometer motor is connected to the Y-axis galvanometer, and the X-axis galvanometer motor and the Y-axis galvanometer motor drive the X-axis galvanometer motor and the Y-axis galvanometer motor to deflect, thereby realizing the laser spot jump in the XY plane. Compared with the X-axis motor and the Y-axis motor, the X-axis galvanometer motor and the Y-axis galvanometer motor have a faster response speed and can jump the hole position faster within a certain range.

[0030] Please refer to Figure 4 In this embodiment, the target hole coordinate data set is filtered through a filtering model, and the low-frequency part (smooth part) and the high-frequency part (part with large changes) are distinguished. The low-frequency part is used as the first hole coordinate data set, and the remaining high-frequency part is used as the second hole coordinate data set. The motion represented by the first hole coordinate data set as the low-frequency part is smoother and suitable for jumping through the mobile platform 130, while the motion represented by the second hole coordinate data set as the high-frequency part has relatively large changes. Jumping through the galvanometer assembly 120 can avoid the sudden change of the speed of the mobile platform 130, which is conducive to saving the time of rapid acceleration and deceleration of the mobile platform 130. Among them, the filtering model can be a conventional low-pass filter or a high-pass filter, and the specific filtering model is determined according to the actual application requirements.

[0031] S300, performing path smoothing processing on the first hole coordinate data set to obtain a smoothed path data set; Exemplarily, the motion represented by the first hole coordinate data set obtained after filtering is relatively smooth, but the hole coordinates in the first hole coordinate data set represent discrete points. If the mobile platform 130 moves according to the hole coordinates in the first hole coordinate data set, the motion path will appear as continuous micro-segments in the plane, and smooth motion cannot be achieved well. For this reason, it is necessary to perform path smoothing on the first hole coordinate data set. For example, based on the Bezier curve model, the first hole coordinate data set is path smoothed to obtain a smoothed path data set. Alternatively, path smoothing is performed based on an exponential smoothing model to make the transition between adjacent micro-segments in the moving path smoother and reduce the speed change of the motor. It should be noted that the model of path smoothing has been fully disclosed in the relevant technology, and this embodiment will not exemplify them one by one.

[0032] S400, determining a control speed data set of the mobile platform 130 based on a smooth path data set and a preset line segment transition speed control model; Exemplarily, after the path smoothing is completed, the movement of the mobile platform 130 still needs to be speed controlled. The smoothed path data set is input into the preset line segment transition speed control model, and the control speed data set of the mobile platform 130 can be determined to control the speed of the mobile platform 130. Among them, the mobile platform 130 is driven by an X-axis motor and a Y-axis motor. In actual applications, the control speed data set can be decomposed into a speed data set of the X-axis motor and a data set of the Y-axis motor based on the rules of speed synthesis and decomposition. The synthesis and decomposition of speed are fully disclosed in the relevant technology, and this embodiment will not be described in detail. It is worth mentioning that the line segment transition speed control model can refer to the relevant technology, such as the line segment transition, arc transition, spline curve transition, and line segment and arc hybrid transition disclosed in Zhu Changfeng's thesis "Research on Path and Speed ​​Forward Planning Algorithm of Continuous Micro-Segment Height Processing CNC System".

[0033] S500 , based on the target hole coordinate data set, the first hole coordinate data set, the second hole coordinate data set and the control speed data set, synchronously control the modulation deflector 110 , the galvanometer assembly 120 and the moving platform 130 .

[0034] Exemplarily, when the laser drilling method of this embodiment is executed in a host computer, the generated target hole coordinate data set, the first hole coordinate data set, the second hole coordinate data set, and the control speed data set can be imported into the laser drilling device, and after data analysis, the modulation deflector 110, the galvanometer assembly 120, and the mobile platform 130 can be synchronously controlled. When the laser drilling method of this embodiment is executed in a laser drilling device, the modulation deflector 110, the galvanometer assembly 120, and the mobile platform 130 can be synchronously controlled according to the generated target hole coordinate data set, the first hole coordinate data set, the second hole coordinate data set, and the control speed data set.

[0035] The modulation deflector 110 determines the position of the hole to be processed on the target workpiece 10 according to the target hole coordinate data set, the mobile platform 130 performs motion control according to the first hole coordinate data set and the control speed data set, and the galvanometer assembly 120 performs motion control according to the second hole coordinate data set. It should be noted that during the movement process, the mobile platform 130 and the galvanometer assembly 120 are in a state of continuous movement, so as to switch the hole beyond the scanning range of the modulation deflector 110 into the scanning range of the modulation deflector 110.

[0036] Based on the filtering model, the target hole coordinate data set is decomposed into a first hole coordinate data set to be assigned to the mobile platform 130 and a second hole coordinate data set to be assigned to the galvanometer assembly 120, and the first hole coordinate data set is path smoothed and speed controlled. Based on the target hole coordinate data set, the first hole coordinate data set, the second hole coordinate data set and the control speed data set, the modulation deflector 110, the galvanometer assembly 120 and the mobile platform 130 are synchronously controlled, which is beneficial to improving the efficiency of laser drilling.

[0037] Step S100, obtaining a target hole coordinate data set, which also includes: S110, obtaining an original hole coordinate data set; S120 , performing path planning processing on the original hole coordinate data set to obtain a target hole coordinate data set.

[0038] For example, the processing of circuit boards usually provides the coordinate data of the holes to be processed, that is, the original hole coordinate data set. However, the original hole coordinate data set only records the coordinate data of the holes, and does not plan the processing order of the holes. In order to improve the processing efficiency, it is necessary to perform path planning processing on the original hole coordinate data set so that the holes to be processed are arranged in a certain order to obtain the target hole coordinate data set. In this way, the distance between two adjacent holes to be processed is shortened, and the processing efficiency is improved. Among them, the path planning processing method can adopt ant colony algorithm, ant colony optimization algorithm, genetic algorithm and A algorithm, etc.

[0039] In some application examples, step S120, performing path planning processing on the original hole coordinate data set to obtain the target hole coordinate data set, includes: S121. Based on the global path optimization principle, path planning is performed on the original hole coordinate data set to obtain a target hole coordinate data set.

[0040] For example, in order to achieve the best efficiency, the coordinate data of all holes in the original hole coordinate data set are regarded as input data for path planning processing, and the optimal path passing through all holes, that is, the global path optimality, is determined. All holes are sorted and output in the order of the path to obtain the target hole coordinate data set.

[0041] In practical applications, the number of holes to be processed is very large, and the path planning processing method based on the global path optimization principle requires high computing power of the device. When the computing power of the device is limited, the original hole coordinate data set can be processed by path planning based on the principle of local path optimization to obtain the target hole coordinate data set. For example, in other application examples, step S120, path planning processing is performed on the original hole coordinate data set to obtain the target hole coordinate data set, including: S122, dividing the original hole coordinate data set into a plurality of local hole coordinate data sets according to the scanning range of the galvanometer assembly 120; S123, performing path planning processing on multiple local hole coordinate data sets in sequence to obtain a target hole coordinate data set; For example, please refer to Figure 2 The scanning range of the galvanometer assembly 120 is usually smaller than the size of the target workpiece 10, and the scanning range of the galvanometer assembly 120 is used as a processing unit (eg Figure 2 As shown by the mark D in the figure, the target workpiece 10 is divided into multiple processing units, and the coordinate data of all holes in each processing unit constitute a local hole coordinate data set, that is, the original hole coordinate data set is divided into multiple local hole coordinate data sets. In order to achieve the local path optimization, the optimal drilling path is planned in each processing unit to improve the processing efficiency of each processing unit, that is, each local hole coordinate data set is used as a path planning processing unit to achieve the local path optimization.

[0042] Among them, during the path planning process: Based on the local path optimal principle, one of the hole coordinates is used as the path starting point, and the path planning process is performed on the first local hole coordinate data set to obtain the intermediate hole coordinate data set; Based on the shortest distance principle, determine the starting hole coordinates of the next local hole coordinate data set, wherein, among all the hole coordinates of the local hole coordinate data set, the distance between the starting hole coordinates and the last hole coordinates of the intermediate hole coordinate data set is the shortest; Based on the principle of local path optimization, the starting hole coordinates are used as the path starting point to perform path planning on the local hole coordinate data set.

[0043] For example, the upper left corner of the target workpiece 10 is used as the origin of the XY coordinates, as shown in FIG. Figure 2 As shown, multiple processing units are divided, and the moving path between each processing unit is shown by the dotted arrow L in the figure, that is, moving from left to right, and then returning from right to left, so that the switching distance between two rows of processing units can be shortened (that is, the distance between the last processing unit in the first row and the first processing unit in the second row). In the process of path planning, path planning starts from the first processing unit in the upper left corner. After completing the path planning of the first processing unit, there must be a hole in the first processing unit (the last hole, such as Figure 2 Mark P k As shown in the figure, the hole is located at the end of the punching sequence. In the second processing unit, there may be multiple holes adjacent to the last hole. Based on the shortest distance principle, the hole with the shortest distance to the last hole is selected as the starting hole of the path planning of the second processing unit (as shown in the figure). Figure 2 Mark P k+1 As shown), based on the principle of local path optimization, the starting hole coordinates are used as the path starting point to perform path planning processing on all holes in the second processing unit, and so on. After completing the path planning of all processing units, a better path for all holes of the target workpiece 10 can be obtained.

[0044] The target hole coordinate data set includes an X-axis hole coordinate data set and a Y-axis hole coordinate data set. Step S200, based on a preset filtering model, decomposes the target hole coordinate data set into a low-frequency part and a high-frequency part, uses the low-frequency part as a first hole coordinate data set and uses the high-frequency part as a second hole coordinate data set, including: S210, decomposing the X-axis hole coordinate data set into a first X-coordinate data set and a second X-coordinate data set based on a preset filtering model; S220, decomposing the Y-axis hole coordinate data set into a first Y-coordinate data set and a second Y-coordinate data set based on a preset filtering model; S230, combining the first X coordinate data set and the first Y coordinate data set to obtain a first hole coordinate data set; S240: Combine the second X coordinate data set and the second Y coordinate data set to obtain a second hole coordinate data set.

[0045] For example, taking one of the holes P0 in the target hole coordinate data set as an example, assuming that the coordinates of hole P0 are (x0, y0), for the data x0 of the X-axis dimension, two components can be obtained after filtering by the filtering model. The first component is recorded as (one of the elements in the first X coordinate data set), and the second component is recorded as (One of the elements in the second X coordinate data set). Similarly, for the Y-axis data y0, two components can be obtained after filtering by the filtering model. The first component is recorded as (one of the elements in the first Y coordinate data set), and the second component is recorded as (One of the elements in the second Y coordinate data set). and quantity Combining them gives the coordinate components ( , ), the amount and quantity Combining them gives the coordinate components ( , ). The other coordinate data of the X-axis hole coordinate data set and the Y-axis hole coordinate data set are processed as in hole P0, and the first X-coordinate data set and the second X-coordinate data set, as well as the first Y-coordinate data set and the second Y-coordinate data set, are obtained, and then the first hole coordinate data set and the second hole coordinate data set are obtained by combining. Filter decomposition through the filter model can be simply understood as decomposing the coordinates of a hole into two parts, one part is realized by the movement of the galvanometer assembly, and the other part is realized by the movement of the mobile platform. Since the movement speed of the galvanometer assembly is fast but the movement range is small, and the movement speed of the mobile platform is slow but the movement range is wide, the combination of the two can realize the complementary advantages of the galvanometer assembly as the main and the mobile platform as the auxiliary.

[0046] In some application examples, step S200, based on a preset filtering model, decomposing the target hole coordinate data set into a low-frequency part and a high-frequency part, using the low-frequency part as a first hole coordinate data set and using the high-frequency part as a second hole coordinate data set, includes: S201, filtering the target hole coordinate data based on a preset EMA (exponential moving average) low-pass filter to determine a low-frequency component in the target hole coordinate data; S202: taking the low-frequency components in the target hole coordinate data as the first hole coordinate data set, and taking the remaining components in the target hole coordinate data as the second hole coordinate data set.

[0047] Exemplarily, the model relationship of the EMA low-pass filter is: y(t)=KdGain*u(t)+(1-KdGain)*y(t-1), KdGain∈[0,1]; In the formula, y(t) is the output signal; u(t) is the input signal at time t; KdGain is a coefficient that affects the cutoff frequency of the filter. The low-frequency component after passing through the EMA low-pass filter is used as the first hole coordinate data set for allocation to the mobile platform 130; and the remaining movement is used as the second hole coordinate data set for allocation to the galvanometer assembly 120, so that both high travel and high response can be achieved.

[0048] Specifically, for step S210, based on the EMA low-pass filter, the X-axis hole coordinate data set is decomposed into a first X-coordinate data set and a second X-coordinate data set, wherein the first X-coordinate data set is a low-frequency component passing through the EMA low-pass filter, and the second X-coordinate data set is a remaining component in the X-axis hole coordinate data set; similarly, for step S220, based on the EMA low-pass filter, the Y-axis hole coordinate data set is decomposed into a first Y-coordinate data set and a second Y-coordinate data set, wherein the first Y-coordinate data set is a low-frequency component passing through the EMA low-pass filter, and the second Y-coordinate data set is a remaining component in the Y-axis hole coordinate data set.

[0049] Please refer to Figure 6 This embodiment also provides a laser drilling control device, which is applied to a laser drilling device having a modulation deflector 110, a galvanometer assembly 120 and a moving platform 130. The laser drilling control device includes an acquisition module 210, a coordinate decomposition module 220, a path smoothing processing module 230, a speed control module 240 and a control module 250.

[0050] The acquisition module 210 is used to acquire a target hole coordinate data set; The coordinate decomposition module 220 is used to decompose the target hole coordinate data set into a low-frequency part and a high-frequency part based on a preset filtering model, and use the low-frequency part as a first hole coordinate data set and the high-frequency part as a second hole coordinate data set. The first hole coordinate data set is used to represent a coordinate data set with smoother motion to be assigned to the mobile platform 130, and the second hole coordinate data set is used to represent a coordinate data set to be assigned to the galvanometer assembly 120; The path smoothing processing module 230 is used to perform path smoothing processing on the first hole coordinate data set to obtain a smoothed path data set; The speed control module 240 is used to determine a control speed data set of the mobile platform 130 based on the smooth path data set and a preset line segment transition speed control model; The control module 250 is used to synchronously control the modulation deflector 110, the galvanometer assembly 120 and the moving platform 130 based on the target hole coordinate data set, the first hole coordinate data set, the second hole coordinate data set and the control speed data set.

[0051] The inventive concept of the present laser drilling control device embodiment is the same as the inventive concept of the above-mentioned laser drilling control method embodiment. The contents not involved in the present laser drilling control device embodiment can be referred to the above-mentioned laser drilling control method embodiment and will not be repeated here.

[0052] Based on the filtering model, the target hole coordinate data set is decomposed into a first hole coordinate data set to be assigned to the mobile platform 130 and a second hole coordinate data set to be assigned to the galvanometer assembly 120, and the first hole coordinate data set is path smoothed and speed controlled. Based on the target hole coordinate data set, the first hole coordinate data set, the second hole coordinate data set and the control speed data set, the modulation deflector 110, the galvanometer assembly 120 and the mobile platform 130 are synchronously controlled, which is beneficial to improving the efficiency of laser drilling.

[0053] Please refer to Figure 1 This embodiment also provides a laser drilling device, including a processor, a memory, a modulation deflector 110, a galvanometer assembly 120 and a mobile platform 130. The memory stores a computer program, and the processor is used to implement the laser drilling control method as described above when running the computer program. The specific content of the laser drilling control method is detailed above and will not be repeated here. Based on the filtering model, the target hole coordinate data set is decomposed into a first hole coordinate data set to be assigned to the mobile platform 130 and a second hole coordinate data set to be assigned to the galvanometer assembly 120, and the first hole coordinate data set is path-smoothed and speed-controlled. Based on the target hole coordinate data set, the first hole coordinate data set, the second hole coordinate data set and the control speed data set, the modulation deflector 110, the galvanometer assembly 120 and the mobile platform 130 are synchronously controlled, which is beneficial to improving the efficiency of laser drilling.

[0054] This embodiment also provides a storage medium, in which a computer program is stored, and when the computer program is executed, the above-mentioned laser drilling control method is implemented. The specific content of the laser drilling control method is detailed above and will not be repeated here. Based on the filtering model, the target hole coordinate data set is decomposed into a first hole coordinate data set to be assigned to the mobile platform 130 and a second hole coordinate data set to be assigned to the galvanometer assembly 120, and the first hole coordinate data set is path-smoothed and speed-controlled. Based on the target hole coordinate data set, the first hole coordinate data set, the second hole coordinate data set and the control speed data set, the modulation deflector 110, the galvanometer assembly 120 and the mobile platform 130 are synchronously controlled, which is conducive to improving the efficiency of laser drilling.

[0055] The embodiments of the present invention are described in detail above with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of ordinary technicians in the relevant technical field without departing from the purpose of the present invention.

Claims

1. A laser drilling control method, applied to a laser drilling device having a modulation deflector, a galvanometer assembly and a mobile platform, characterized in that: include: Obtain target hole coordinate data set; Based on a preset filtering model, the target hole coordinate data set is decomposed into a low-frequency part and a high-frequency part, the low-frequency part is used as a first hole coordinate data set and the high-frequency part is used as a second hole coordinate data set, the first hole coordinate data set is used to represent a coordinate data set with smoother motion to be assigned to the mobile platform, and the second hole coordinate data set is used to represent a coordinate data set to be assigned to the galvanometer assembly; Performing path smoothing processing on the first hole coordinate data set to obtain a smoothed path data set; Determining a control speed data set of the mobile platform based on the smooth path data set and a preset line segment transition speed control model; Based on the target hole coordinate data set, the first hole coordinate data set, the second hole coordinate data set and the control speed data set, the modulation deflector, the galvanometer assembly and the moving platform are synchronously controlled.

2. The laser drilling control method according to claim 1, characterized in that: The step of obtaining the target hole coordinate data set also includes: Get the original hole coordinate data set; The original hole coordinate data set is processed by path planning to obtain a target hole coordinate data set.

3. The laser drilling control method according to claim 2, characterized in that: Performing path planning processing on the original hole coordinate data set to obtain a target hole coordinate data set includes: Based on the global path optimization principle, the original hole coordinate data set is processed by path planning to obtain a target hole coordinate data set.

4. The laser drilling control method according to claim 2, characterized in that: Performing path planning processing on the original hole coordinate data set to obtain a target hole coordinate data set includes: According to the scanning range of the galvanometer assembly, the original hole coordinate data set is divided into a plurality of local hole coordinate data sets; Performing path planning processing on the multiple local hole coordinate data sets in sequence to obtain a target hole coordinate data set; During the path planning process: Based on the local path optimal principle, taking one of the hole coordinates as the path starting point, performing path planning processing on the first local hole coordinate data set to obtain an intermediate hole coordinate data set; Based on the shortest distance principle, determining the starting hole coordinates of the next local hole coordinate data set, wherein, among all the hole coordinates of the local hole coordinate data set, the distance between the starting hole coordinates and the last hole coordinates of the intermediate hole coordinate data set is the shortest; Based on the local path optimal principle, the starting hole coordinates are used as the path starting point, and the path planning process is performed on the local hole coordinate data set.

5. The laser drilling control method according to claim 1, characterized in that: The target hole coordinate data set includes an X-axis hole coordinate data set and a Y-axis hole coordinate data set. Based on a preset filtering model, the target hole coordinate data set is decomposed into a low-frequency part and a high-frequency part, the low-frequency part is used as a first hole coordinate data set, and the high-frequency part is used as a second hole coordinate data set, including: Based on a preset filtering model, decomposing the X-axis hole coordinate data set into a first X-coordinate data set and a second X-coordinate data set; Based on a preset filtering model, decomposing the Y-axis hole coordinate data set into a first Y-coordinate data set and a second Y-coordinate data set; Combining the first X-coordinate data set and the first Y-coordinate data set to obtain a first hole coordinate data set; The second X-coordinate data set and the second Y-coordinate data set are combined to obtain a second hole coordinate data set.

6. The laser drilling control method according to claim 1 or 5, characterized in that: The method of decomposing the target hole coordinate data set into a low-frequency part and a high-frequency part based on a preset filtering model, using the low-frequency part as a first hole coordinate data set and using the high-frequency part as a second hole coordinate data set includes: Based on a preset EMA low-pass filter, filtering is performed on the target hole coordinate data to determine a low-frequency component in the target hole coordinate data; The low-frequency components in the target hole coordinate data are used as the first hole coordinate data set, and the remaining components in the target hole coordinate data are used as the second hole coordinate data set.

7. The laser drilling control method according to claim 1, characterized in that: The performing path smoothing processing on the first hole coordinate data set to obtain a smoothed path data set includes: Based on the Bezier curve model, path smoothing processing is performed on the first hole coordinate data set to obtain a smoothed path data set.

8. A laser drilling control device, applied to a laser drilling device having a modulation deflector, a galvanometer assembly and a moving platform, characterized in that: include: An acquisition module, used to acquire a target hole coordinate data set; A coordinate decomposition module, for decomposing the target hole coordinate data set into a low-frequency part and a high-frequency part based on a preset filtering model, using the low-frequency part as a first hole coordinate data set and the high-frequency part as a second hole coordinate data set, wherein the first hole coordinate data set is used to represent a coordinate data set with smoother motion to be assigned to the mobile platform, and the second hole coordinate data set is used to represent a coordinate data set to be assigned to the galvanometer assembly; A path smoothing processing module, used for performing path smoothing processing on the first hole coordinate data set to obtain a smoothed path data set; A speed control module, used to determine a control speed data set of the mobile platform based on the smooth path data set and a preset line segment transition speed control model; A control module is used to synchronously control the modulation deflector, the galvanometer assembly and the moving platform based on the target hole coordinate data set, the first hole coordinate data set, the second hole coordinate data set and the control speed data set.

9. A laser drilling device, comprising a processor, a memory, a modulation deflector, a galvanometer assembly and a mobile platform, wherein a computer program is stored in the memory, characterized in that: When the processor runs the computer program, it is used to implement the laser drilling control method according to any one of claims 1 to 7.

10. A storage medium storing a computer program, wherein: When the computer program is executed, the laser drilling control method according to any one of claims 1 to 7 is implemented.

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