Non-contact picking device and control method

Abstract

The present invention relates to the field of semiconductor packaging technology, and to a non-contact pickup device and a control method. The present invention comprises: a shell, an ultrasonic energy converter, a nozzle adapter and a nozzle body, wherein the main body of the ultrasonic energy converter is arranged inside the shell and one end of the ultrasonic energy converter is extended outward, the nozzle body is installed on the front end of the nozzle adapter through interference fit and a closed cavity is formed between the two, the rear end of the nozzle adapter is fixedly connected to the front end of the ultrasonic energy converter, a channel for introducing a vacuum airflow is provided inside the ultrasonic energy converter, a negative pressure interface is connected to the outside of the channel, the inside of the channel connects the inside of the nozzle adapter to the closed cavity, air guide holes connecting the closed cavity are distributed on the end surface of the nozzle body, and a handover module is provided on the shell, and the handover module is used to transfer and handover a non-contact ultrasonic nozzle between two independent equipment station racks.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor packaging, and in particular to a non-contact picking device and a control method. Background Art

[0002] Non-contact chip picking nozzle technology is a high-precision, non-destructive handling technology used in semiconductor manufacturing and packaging. Traditional chip handling methods usually rely on mechanical nozzles to pick up and place chips through physical contact. However, with the reduction in chip size and the increase in complexity, mechanical nozzles are prone to physical damage to the delicate chip structure, resulting in reduced product yield. Against this background, non-contact nozzle technology came into being and became one of the key technologies to solve the problem of chip damage during handling. Among them, the airflow nozzle (Bernoulli nozzle) is a type of non-contact nozzle. Its working principle is that the airflow nozzle forms a stable negative pressure area under the nozzle through the guidance of high-speed airflow, so that the chip is suspended under the nozzle. The speed and direction of the airflow are precisely controlled to keep the chip suspended while preventing it from contacting the nozzle surface. The Bernoulli principle is usually used, that is, the pressure in the high-speed air flow area is reduced, thereby generating a negative pressure to fix the chip under the nozzle; its advantages: it is suitable for lightweight and thin chips, can reduce damage to the chip surface, and the middle area does not directly contact the chip surface to avoid contamination or scratches. Although the application of Bernoulli nozzles in semiconductor die bonders has the advantages of reducing chip damage and improving handling accuracy, there are also some problems and challenges, especially when dealing with more complex processes and higher precision requirements. The following are some common application problems:

[0003] 1. When reaching the nozzle surface, the suction force needs to be reduced to prevent the chip from colliding with the nozzle. However, it is difficult to accurately control and adjust the air pressure during operation. Therefore, the conventional practice is to use multiple PINs (cylindrical pins) to contact the edge of the chip to prevent collision. This makes it impossible to achieve completely non-contact picking, which will cause contamination and affect the yield rate.

[0004] 2. Problems of insufficient adsorption force and instability: The Bernoulli nozzle relies on airflow to generate negative pressure to adsorb the chip. However, when the chip is too thin or has a complex surface structure, the adsorption force generated by the airflow may be insufficient, causing the chip to be unable to stably suspend during transportation, or even to shift or fall. This adsorption instability may cause the chip position to shift during the bonding process, affecting the bonding accuracy and even causing chip damage. It is mainly limited by factors such as airflow speed, inaccurate pressure regulation, and chip surface characteristics. This problem is more obvious when transporting tiny or thin chips.

[0005] 3. The impact of airflow on chips: The impact force of high-speed airflow sometimes affects the surface structure of the chip, especially tiny chips or semiconductor devices with microstructures, which may be deformed or damaged by the airflow. The damage to the microstructure will directly affect the performance of the chip and lead to a decrease in production yield. The operation of the Bernoulli nozzle depends on high-speed airflow, and the impact force of the airflow may have an adverse effect on thin chips or chips with complex surface structures.

[0006] 4. Problem of poor adaptability: Bernoulli nozzle is suitable for processing flat and rigid chips, but its adsorption effect is poor for chips with irregular shapes and uneven surfaces, and it is easy to have problems such as loose adsorption of chips or position displacement. For special-shaped chips or flexible chips, the nozzle may not be able to effectively fix them, causing instability and errors in production. The nozzle design and airflow characteristics determine that it has high requirements for the shape and surface of the chip, and the handling of irregular chips or flexible chips is more complicated.

[0007] 5. Environmental dependence: The performance of the Bernoulli nozzle is easily affected by the working environment, especially when the ambient humidity, air quality, etc. are unstable. The negative pressure generated by the nozzle may be insufficient, resulting in a decrease in adsorption force. The semiconductor manufacturing environment has strict requirements on humidity and temperature, but these conditions may fluctuate in actual production, affecting the stability of the equipment. Changes in air flow velocity, temperature and humidity will affect the fluidity of the gas, thereby affecting the negative pressure and adsorption effect generated by the nozzle.

[0008] 6. The problem of high energy consumption: The Bernoulli nozzle relies on high-speed airflow to generate negative pressure, so a large amount of compressed air is required. Especially in high-frequency operations, the energy consumption of the equipment is relatively large. High energy consumption not only increases production costs, but may also affect the long-term stable operation of the equipment. The operation of the Bernoulli nozzle depends on aerodynamics. Frequent airflow supply and exhaust will increase the energy consumption and maintenance requirements of the equipment.

[0009] Therefore, how to further optimize the design and control of non-contact nozzles and improve their applicability in high-end chip manufacturing has become the focus of current research and development. Summary of the invention

[0010] The present invention provides a non-contact picking device and a control method to solve the problems in the prior art.

[0011] The objective of the present invention can be achieved through the following technical scheme: a non-contact picking device comprises: a shell, an ultrasonic energy converter, a nozzle adapter and a nozzle body, the main body of the ultrasonic energy converter is arranged inside the shell and one end of the ultrasonic energy converter is extended outward, the nozzle body is installed on the front end of the nozzle adapter by interference fit and a closed cavity is formed between the two, the rear end of the nozzle adapter is fixedly connected to the front end of the ultrasonic energy converter, a channel for introducing vacuum airflow is provided inside the ultrasonic energy converter, a negative pressure interface is connected to the outside of the channel, the inside of the channel connects the inside of the nozzle adapter to the closed cavity, air guide holes connecting the closed cavity are distributed on the end face of the nozzle body, and a handover module is provided on the shell, and the handover module is used to transfer and handover the non-contact ultrasonic nozzle between two independent equipment station racks.

[0012] A further improvement is that the handover module includes a structural member, a positioning plate and a positioning seat, the positioning plate is located on the rear side of the structural member, the positioning seat is located on the front side of the structural member, the non-contact ultrasonic suction nozzle is fixed to the inner side of the structural member, a positioning ball head is provided on each of the front and rear sides of the structural member, a pulling arm is provided on the side of the structural member, and tension spring seats are provided in pairs on the positioning plates of the structural member and the rack of the workstation on one side, each pair of the tension spring seats includes a tension spring, the positioning plate and the positioning seat are provided with a long groove matching the positioning ball head, and a cylinder is provided inside the positioning seat of the rack of the workstation on the other side, the cylinder is connected with a pulling hook, and the pulling arm gap is arranged on the inner side of the pulling hook.

[0013] A further improvement is that the pulling arm and the pulling hook are symmetrically arranged in two groups, the cylinder and the positioning seat are symmetrically arranged in two groups, the positioning ball head and the long groove are arranged in three groups at intervals of 120 degrees, the cross-sectional shape of the pulling hook is "C" shaped, the cross-sectional shape of the pulling arm is "T" shaped, and the structural parts and the positioning plates of the frame of the one side workstation are provided with a total of six groups of tension spring seats.

[0014] As a further improvement, a leaf spring is fixed inside the housing, and an ultrasonic energy converter is fixedly connected to the inner side of the leaf spring. As a further improvement, two groups of leaf springs are arranged in the upper and lower parts.

[0015] As a further improvement, the rear end of the nozzle adapter is fixedly connected to the ultrasonic energy converter via threads.

[0016] As a further improvement, the air guide holes are distributed in a ring array on the end surface of the nozzle body.

[0017] A control method for a non-contact pickup device comprises the following steps:

[0018] S1: The cylinder does not work in the free state, and the tension spring of the tension spring seat is tightened, so that the positioning ball head on the rear side of the structural part is closely attached to the inside of the long slot of the positioning plate and the positioning ball head on the front side of the structural part is separated from the long slot of the positioning seat, and the positioning ball head in front of the structural part and the positioning seat as well as the hook and the arm are suspended, so that the two station frames of the equipment remain relatively independent, and the non-contact suction nozzle is located at the chip picking position;

[0019] S2: Turn on the ultrasonic energy converter in the non-contact nozzle, input electrical energy into it and convert it into high-frequency mechanical vibration energy. The vibration energy is transmitted to the nozzle adapter and the nozzle body connected to the ultrasonic energy converter through resonance. The high-frequency vibration of the nozzle body generates a tiny air cushion between the nozzle surface and the picked-up chip, which generates an outward thrust on the chip through the tiny air cushion.

[0020] S3: The external negative pressure gas source is connected to the device through the negative pressure interface, and the vacuum airflow generates adsorption force on the chip through the channel and the air guide hole;

[0021] S4: Adjust the vacuum flow rate and vacuum pressure of the external negative pressure gas source, adjust the ultrasonic vibration frequency and ultrasonic amplitude of the ultrasonic energy converter, so that the vacuum adsorption force, ultrasonic thrust and chip mass acting on the chip are balanced, so that the chip is suspended without touching the nozzle;

[0022] S5: The cylinder drives the hook to pull the arm, and pulls the structural part and the non-contact ultrasonic suction nozzle toward the cylinder side, so that the positioning ball head on the rear side of the structural part is separated from the long slot of the positioning plate and the positioning ball head on the front side of the structural part is closely attached to the inside of the long slot of the positioning seat, and the non-contact ultrasonic suction nozzle is accurately positioned with the station frame on the other side of the equipment;

[0023] S6: The nozzle turns off the vacuum and the chip placement is completed.

[0024] Compared with the prior art, the non-contact picking device and control method of the present invention have the following beneficial effects:

[0025] The non-contact chip pickup device using ultrasonic technology realizes non-contact pickup and transportation of chips, avoiding physical damage or contamination to the precise chip structure through physical contact. The ultrasonic energy converter is used in the device to generate ultrasonic vibration, which is transmitted to the suction nozzle to generate a tiny air cushion, generating an outward thrust on the chip to prevent the chip from colliding. The vacuum airflow passes through the air guide holes on the suction nozzle to generate uniform suction on the chip. The thrust generated by the ultrasonic wave and the adsorption force generated by the vacuum airflow are precisely controlled so that the chip can be stably suspended without the need for multiple PINs to contact the edge of the chip for support, thus achieving completely non-contact pickup and greatly improving the yield rate. The chips with irregular shapes and uneven surfaces can be effectively adsorbed and transferred without contact. In addition, the flow rate requirement in the ultrasonic non-contact suction nozzle is relatively low, and a certain negative pressure adsorption force can be achieved by maintaining a uniform airflow, without the need to use high-speed airflow, reducing the requirements for precise negative pressure control, and reducing energy consumption at the same time.

[0026] Through the coordination between the cylinder, tension spring and ball head slot in the handover module, the non-contact ultrasonic nozzle can achieve precise positioning between two workstations with independent racks, avoiding the problem of possible changes in the spacing in all directions caused by the independent vibration isolation system of the rack of each workstation, avoiding the impact on the chip handover between the two workstations, thereby improving the chip handover accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a structural schematic diagram of the non-contact ultrasonic suction nozzle of the present invention;

[0028] Figure 2 It is a schematic diagram of the internal structure of the non-contact ultrasonic suction nozzle of the present invention;

[0029] Figure 3 It is a structural schematic diagram of the nozzle body of the non-contact ultrasonic nozzle of the present invention;

[0030] Figure 4 It is a structural schematic diagram of the handover module in the present invention;

[0031] Figure 5 It is a structural schematic diagram of the handover module in the present invention from another perspective;

[0032] Figure 6 It is a structural schematic diagram of the positioning plate of the handover module in the present invention;

[0033] In the figure, 1-nozzle body, 2-shell, 3-nozzle adapter, 4-leaf spring, 5-ultrasonic energy converter, 6-negative pressure interface, 7-air guide hole, 100-non-contact ultrasonic nozzle, 101-positioning ball head, 102-positioning seat, 103-cylinder, 104-positioning plate, 105-tension spring, 106-hook, 107-pull arm, 108-long slot, 109-structural part, 110-tension spring seat. DETAILED DESCRIPTION

[0034] In the description of the present invention, it should be noted that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, they cannot be understood as limitations on the present invention.

[0035] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0036] Below is a combination of the embodiments and the attached Figures 1 to 6 , the technical solution of the present invention is further elaborated. Example 1

[0037] A non-contact picking device comprises: a shell 2, an ultrasonic energy converter 5, a nozzle adapter 3 and a nozzle body 1, wherein the main body of the ultrasonic energy converter 5 is arranged inside the shell 2 and one end of the ultrasonic energy converter 5 is extended outward, the nozzle body 1 is installed on the front end of the nozzle adapter 3 by interference fit and a closed cavity is formed between the two, the rear end of the nozzle adapter 3 is fixedly connected to the front end of the ultrasonic energy converter 5, the ultrasonic energy converter 5 is provided with a channel for introducing a vacuum airflow, the outside of the channel is connected to a negative pressure interface 6, the inside of the channel connects the inside of the nozzle adapter 3 to the closed cavity, the end surface of the nozzle body 1 is provided with air guide holes 7 connected to the closed cavity, and the shell 2 is provided with a handover module, which is used to transfer and handover a non-contact ultrasonic nozzle 100 between two independent equipment station racks.

[0038] In some chip packaging equipment, racks at different workstations are separated to reduce the impact of vibration crosstalk between modules. If each rack has an independent vibration isolation system, such as a rubber pad, the distance between the racks of the two workstations may change in all directions when the equipment is working. If this distance changes greatly, it may affect the handover of chips between the two workstations. As a further preferred embodiment, the handover module includes a structural member 109, a positioning plate 104 and a positioning seat 102, wherein the positioning plate 104 is located on the rear side of the structural member 109, and the positioning seat 102 is located on the front side of the structural member 109. The non-contact ultrasonic suction nozzle 100 is fixed to the inner side of the structural member 109, and a positioning ball head 101 is provided on each side of the front and rear sides of the structural member 109. A pull arm 107 is provided on the side of the structural member 109. The structural member 109 and the positioning plate 104 of the frame of the work station on one side are provided with tension spring seats 110 in pairs, and each pair of the tension spring seats 110 includes a tension spring 105. The positioning plate 104 and the positioning seat 102 are both provided with a long groove 108 matching the positioning ball head 101. The positioning seat 102 of the frame of the work station on the other side is provided with a cylinder 103 inside, and the cylinder 103 is connected with a draw hook 106. The draw arm 107 is gap-arranged on the inner side of the draw hook 106.

[0039] As a further preferred embodiment, the pulling arm 107 and the pulling hook 106 are symmetrically arranged in two groups, the cylinder 103 and the positioning seat 102 are symmetrically arranged in two groups, the positioning ball head 101 and the long slot 108 are arranged in three groups at intervals of 120 degrees, the cross-sectional shape of the pulling hook 106 is "C" shaped, the cross-sectional shape of the pulling arm 107 is "T" shaped, the structural member 109 and the positioning plate 104 of the frame of the one side station are provided with a total of six groups of tension spring seats 110, which further improves the balance and reliability of the equipment.

[0040] As a further preferred embodiment, a leaf spring 4 is fixed inside the housing 2, and an ultrasonic energy converter 5 is fixedly connected to the inner side of the leaf spring 4. Since the leaf spring 4 structure has the characteristic of low stiffness, the leaf spring 4 can be regarded as a low-pass filter, so that high-frequency vibrations cannot be directly transmitted to the device housing 2.

[0041] As a further preferred embodiment, the leaf springs 4 are provided in two groups, one above the other, to further improve the vibration reduction effect.

[0042] As a further preferred embodiment, the rear end of the nozzle adapter 3 is fixedly connected to the ultrasonic energy converter 5 by means of threads, so as to facilitate quick installation and ensure the stability of installation.

[0043] As a further preferred embodiment, the air guide holes 7 are distributed on the end surface of the nozzle body 1 in a circular array.

[0044] A control method for a non-contact picking device comprises the following steps: S1: in a free state, the cylinder 103 does not work, and the tension spring 105 of the tension spring seat 110 is tightened, so that the positioning ball head 101 on the rear side of the structural member 109 is closely attached to the inside of the long slot 108 of the positioning plate 104 and the positioning ball head 101 on the front side of the structural member 109 is separated from the long slot 108 of the positioning seat 102, and the positioning ball head 101 in front of the structural member 109 and the positioning seat 102, as well as the pull hook 106 and the pull arm 107 are all suspended, so that the two station frames of the equipment remain relatively independent, so that the non-contact suction nozzle 100 is located at the chip picking position;

[0045] S2: Turn on the ultrasonic energy converter 5 in the non-contact suction nozzle 100, input electrical energy into it and convert it into high-frequency mechanical vibration energy. The vibration energy is transmitted to the suction nozzle adapter 3 and the suction nozzle body 1 connected to the ultrasonic energy converter 5 through resonance. The high-frequency vibration of the suction nozzle body 1 generates a tiny air cushion between the suction nozzle surface and the picked-up chip, and the tiny air cushion generates an outward thrust on the chip;

[0046] S3: The external negative pressure gas source is connected to the device through the negative pressure interface 6, and the vacuum airflow generates adsorption force on the chip through the channel and the air guide hole 7;

[0047] S4: adjusting the vacuum flow rate and vacuum pressure of the external negative pressure gas source, adjusting the ultrasonic vibration frequency and ultrasonic amplitude of the ultrasonic energy converter 5, so that the vacuum adsorption force, ultrasonic thrust and the chip's own mass acting on the chip are balanced, so that the chip is suspended without contacting the suction nozzle;

[0048] S5: The cylinder 103 drives the hook 106 to pull the arm 107, and pulls the structural member 109 and the non-contact ultrasonic suction nozzle 100 toward the cylinder 103, so that the positioning ball head 101 on the rear side of the structural member 109 is separated from the long slot 108 of the positioning plate 104 and the positioning ball head 101 on the front side of the structural member 109 is closely attached to the inside of the long slot 108 of the positioning seat 102, and the non-contact ultrasonic suction nozzle 100 is accurately positioned with the station frame on the other side of the equipment;

[0049] S6: The nozzle turns off the vacuum and the chip placement is completed.

[0050] The non-contact chip pickup device using ultrasonic technology realizes non-contact pickup and transportation of chips, avoiding physical damage or contamination to the precise chip structure through physical contact. The ultrasonic energy converter is used in the device to generate ultrasonic vibration, which is transmitted to the suction nozzle to generate a tiny air cushion, generating an outward thrust on the chip to prevent the chip from colliding. The vacuum airflow passes through the air guide holes on the suction nozzle to generate uniform suction on the chip. The thrust generated by the ultrasonic wave and the adsorption force generated by the vacuum airflow are precisely controlled so that the chip can be stably suspended without the need for multiple PINs to contact the edge of the chip for support, thus achieving completely non-contact pickup and greatly improving the yield rate. Chips with irregular shapes and uneven surfaces can be effectively adsorbed and transferred without contact. In addition, the flow rate requirement in the ultrasonic non-contact suction nozzle is relatively low, and a certain negative pressure adsorption force can be achieved by maintaining a uniform airflow, without the need to use high-speed airflow, reducing the requirements for precise negative pressure control, and reducing energy consumption at the same time.

[0051] Through the coordination between the cylinder, tension spring and ball head slot in the handover module, the non-contact ultrasonic nozzle can achieve precise positioning between two workstations with independent racks, avoiding the problem of possible changes in the spacing in all directions caused by the independent vibration isolation system of the rack of each workstation, avoiding the impact on the chip handover between the two workstations, thereby improving the chip handover accuracy.

[0052] The preferred specific embodiments of the present invention are described in detail above. It should be understood that a person skilled in the art can make many modifications and changes based on the concept of the present invention without creative work. Therefore, any technical solution that can be obtained by a person skilled in the art through logical analysis, reasoning or limited experiments based on the concept of the present invention on the basis of the prior art should be within the scope of protection determined by the claims.

Claims

1. A non-contact picking device, characterized in that: include: A shell, an ultrasonic energy converter, a nozzle adapter and a nozzle body, wherein the body of the ultrasonic energy converter is arranged inside the shell and one end of the ultrasonic energy converter is extended outward, the nozzle body is installed on the front end of the nozzle adapter by interference fit and a closed cavity is formed between the two, the rear end of the nozzle adapter is fixedly connected to the front end of the ultrasonic energy converter, a channel for introducing a vacuum airflow is provided inside the ultrasonic energy converter, a negative pressure interface is connected to the outside of the channel, the inside of the channel connects the inside of the nozzle adapter to the closed cavity, air guide holes connecting the closed cavity are distributed on the end surface of the nozzle body, and a handover module is provided on the shell, and the handover module is used to transfer and handover a non-contact ultrasonic nozzle between two independent equipment station racks; The handover module includes a structural member, a positioning plate and a positioning seat, the positioning plate is located on the rear side of the structural member, the positioning seat is located on the front side of the structural member, the non-contact ultrasonic suction nozzle is fixed to the inner side of the structural member, a positioning ball head is provided on each of the front and rear sides of the structural member, a pulling arm is provided on the side of the structural member, and tension spring seats are provided in pairs on the positioning plates of the structural member and the rack of the one side station, each pair of the tension spring seats includes a tension spring, the positioning plate and the positioning seat are provided with a long groove matching the positioning ball head, a cylinder is provided inside the positioning seat of the rack of the other side station, the cylinder is connected with a pulling hook, and the pulling arm gap is arranged on the inner side of the pulling hook.

2. A non-contact picking device according to claim 1, characterized in that: The pulling arm and the pulling hook are symmetrically arranged in two groups, the cylinder and the positioning seat are symmetrically arranged in two groups, the positioning ball head and the long slot are arranged in three groups at intervals of 120 degrees, the cross-sectional shape of the pulling hook is "C" shaped, the cross-sectional shape of the pulling arm is "T" shaped, and the positioning plate of the structural member and the frame of the one side station is provided with a total of six groups of tension spring seats.

3. A non-contact picking device according to claim 1, characterized in that: A leaf spring is fixed inside the shell, and the inner side of the leaf spring is fixedly connected to an ultrasonic energy converter.

4. A non-contact picking device according to claim 3, characterized in that: The leaf springs are arranged in two groups, one above the other.

5. The non-contact picking device according to claim 1, characterized in that: The rear end of the nozzle adapter is fixedly connected to the ultrasonic energy converter via threads.

6. The non-contact picking device according to claim 1, characterized in that: The air guide holes are distributed on the end surface of the nozzle body in a ring array.

7. A control method using a non-contact pickup device according to any one of claims 1 to 6, characterized in that: The following steps are involved: S1: The cylinder does not work in the free state, and the tension spring of the tension spring seat is tightened, so that the positioning ball head on the rear side of the structural part is closely attached to the inside of the long slot of the positioning plate and the positioning ball head on the front side of the structural part is separated from the long slot of the positioning seat, and the positioning ball head in front of the structural part and the positioning seat as well as the hook and the arm are suspended, so that the two station frames of the equipment remain relatively independent, and the non-contact suction nozzle is located at the chip picking position; S2: Turn on the ultrasonic energy converter in the non-contact nozzle, input electrical energy into it and convert it into high-frequency mechanical vibration energy. The vibration energy is transmitted to the nozzle adapter and the nozzle body connected to the ultrasonic energy converter through resonance. The high-frequency vibration of the nozzle body generates a tiny air cushion between the nozzle surface and the picked-up chip, which generates an outward thrust on the chip through the tiny air cushion. S3: The external negative pressure gas source is connected to the device through the negative pressure interface, and the vacuum airflow generates adsorption force on the chip through the channel and the air guide hole; S4: Adjust the vacuum flow rate and vacuum pressure of the external negative pressure gas source, adjust the ultrasonic vibration frequency and ultrasonic amplitude of the ultrasonic energy converter, so that the vacuum adsorption force, ultrasonic thrust and chip mass acting on the chip are balanced, so that the chip is suspended without touching the nozzle; S5: The cylinder drives the hook to pull the arm, and pulls the structural part and the non-contact ultrasonic suction nozzle toward the cylinder side, so that the positioning ball head on the rear side of the structural part is separated from the long slot of the positioning plate and the positioning ball head on the front side of the structural part is closely attached to the inside of the long slot of the positioning seat, and the non-contact ultrasonic suction nozzle is accurately positioned with the station frame on the other side of the equipment; S6: The nozzle turns off the vacuum and the chip placement is completed.

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