Grounding resistance-reducing material and application thereof

Abstract

The invention provides a grounding resistance-reducing material and application thereof, and belongs to the technical field of resistance-reducing materials, the grounding resistance-reducing material comprises conductive cement, bentonite and a retarder, and the mass ratio of the conductive cement to the bentonite to the retarder is 100: (10-25): (1.5-3); the retarder is at least one of sodium lignin sulfonate, calcium lignin sulfonate, titanium lignosulfonate and zirconium lignosulfonate. The grounding resistance-reducing material disclosed by the invention can effectively improve the corrosion resistance and the resistance-reducing effect of the anti-corrosion power distribution network grounding device.

Description

Technical Field

[0001] The present disclosure relates to the technical field of resistance reduction materials, and in particular to a grounding resistance reduction material and applications thereof. Background Art

[0002] The distribution network refers to the power grid that receives electric energy from the transmission network or regional power plants and distributes it locally or step by step according to voltage to various users through distribution facilities. It is composed of overhead lines, cables, towers, distribution transformers, disconnectors, reactive power compensators and some ancillary facilities, and plays an important role in distributing electric energy in the power grid.

[0003] In order to improve the lightning protection performance of the distribution network, a grounding device needs to be installed. In actual use, the grounding device is directly placed in the grounding pit after connecting the metal grounding lead, and then covered with backfill soil. The grounding device in this state is very easy to be corroded during use, which eventually leads to grounding failure. Summary of the invention

[0004] The purpose of the present invention is to overcome the deficiencies of the prior art, provide a grounding resistance reduction material and its application, improve the resistance reduction effect, and improve the anti-corrosion effect of the grounding device.

[0005] To achieve the above-mentioned purpose, the technical solution adopted by the present invention is as follows: in the first aspect, a grounding resistance reduction material is provided, including conductive cement, bentonite and retarder, the mass ratio of conductive cement, bentonite and retarder is 100:10-25:1.5-3; the retarder is at least one of sodium lignin sulfonate, calcium lignin sulfonate, titanium lignin sulfonate and zirconium lignin sulfonate.

[0006] The grounding resistance reduction material disclosed in the present invention acts between the grounding body and the soil. On the one hand, it can be in close contact with the grounding body to form a sufficiently large current flow surface. On the other hand, the grounding resistance reduction material can penetrate into the surrounding soil to reduce the resistivity of the surrounding soil and form a low-resistance area with a gentle change around the grounding body, which is conducive to the guidance of lightning. The retarder in the grounding resistance reduction material can ensure the fluidity of the grounding resistance reduction material, so that the grounding resistance reduction material can evenly wrap the grounding body and fill the grounding foundation pit, thereby avoiding the presence of bubbles between the solidified grounding resistance reduction material and the grounding body, and avoiding the presence of gaps between the grounding device composed of the grounding resistance reduction material, the grounding body and the grounding foundation pit, resulting in a reduction in the strength of the grounding resistance reduction material and a reduction in the effective thickness of the protective layer of the grounding body. In addition, the retarder can form a protective film on the surface of the grounding resistance reduction material to reduce the permeability of the grounding resistance reduction material and reduce the erosion of the grounding body by the grounding resistance reduction material. On the other hand, the retarder can also improve the strength and durability of the grounding resistance reduction material. The present disclosure preferably uses titanium lignin sulfonate and / or zirconium lignin sulfonate as a retarder, which can further improve the resistance reduction performance of the grounding resistance reduction material and reduce its corrosion effect on the grounding body.

[0007] Specifically, the mass ratio of the conductive cement, bentonite and retarder can be but is not limited to 100:10:1.5, 100:12:1.5, 100:15:1.5, 100:18:1.5, 100:20:1.5, 100:23:1.5, 100:25:1.5, 100:10:1.8, 100:10:2.0, 100:10:2.2, 100:10:2.5, 100:10:2.8, and 100:10:3.

[0008] In some embodiments, the preparation method of the zirconium lignin sulfonate is: zirconium salt and sodium lignin sulfonate are uniformly mixed, and a hydrothermal reaction is performed at a temperature of 100-130° C. to obtain zirconium lignin sulfonate after the reaction is completed;

[0009] In some embodiments, the preparation method of the titanium lignin sulfonate is: uniformly mix titanium salt and sodium lignin sulfonate, perform hydrothermal reaction at a temperature of 100-130° C., and obtain titanium lignin sulfonate after the reaction is completed.

[0010] One of zirconium salt or titanium salt is assembled with sodium lignin sulfonate through hydrothermal reaction to form a polyphenol biopolymer, wherein the polyphenol biopolymer has a porous inorganic-organic skeleton structure. 4+ or Ti in titanium salts 4+ The strong coordination with the phenolic hydroxyl groups in lignosulfonates leads to the formation of strong Lewis acid-base coupling sites (Zr 4+ -O 2-), and the inherent sulfonic acid groups in sodium lignin sulfonate can serve as acidic sites. The multifunctional acid-base sites interact with conductive cement and bentonite, which can reduce the erosion of grounding resistance reduction materials on the grounding body and improve the strength and durability of grounding resistance reduction materials.

[0011] In some embodiments, the mass ratio of the zirconium salt to sodium lignin sulfonate is 0.5-2:1, for example, 0.5:1, 0.8:1, 1:1, 1.2:1, 1.4:1, 1.6:1, 1.8:1, 2:1;

[0012] In some embodiments, the mass ratio of the titanium salt to sodium lignin sulfonate is 0.5-2:1, for example, 0.5:1, 0.8:1, 1:1, 1.2:1, 1.4:1, 1.6:1, 1.8:1, 2:1.

[0013] In some embodiments, the zirconium salt is at least one of zirconium tetrachloride, zirconium sulfate, zirconium hydroxide, and zirconium oxychloride;

[0014] In some embodiments, the titanium salt is at least one of titanium tetrachloride, titanium sulfate, and titanyl sulfate.

[0015] In some embodiments, the grounding resistance reduction material also includes water, and the ratio of the mass of the water to the total mass of the conductive cement and bentonite is 0.4-0.6, for example, it can be but not limited to 0.4, 0.43, 0.45, 0.48, 0.5, 0.52, 0.55, 0.57, 0.6.

[0016] When the ratio of the mass of water to the total mass of the conductive cement and bentonite is within the above range, the grounding resistance reduction material can be formed into a paste with good fluidity, which is beneficial to the subsequent application of the grounding resistance reduction material.

[0017] In the second aspect, an anti-corrosion distribution network grounding device is provided, including a grounding body, a resistance reduction layer, and a copper wire, wherein the resistance reduction layer is composed of the grounding resistance reduction material; the resistance reduction layer wraps the grounding body, and the copper wire is vertically embedded in the resistance reduction layer from a direction away from the outer surface of the grounding body, and the copper wire and the grounding body do not contact each other.

[0018] Copper wire is added to the anti-corrosion distribution network grounding device disclosed in the present invention. After the resistance reduction layer is combined with the copper wire, the copper wire is similar to steel bars, and forms a structure similar to a concrete block with the grounding resistance reduction material, thereby improving the strength of the resistance reduction layer; at the same time, the copper wire further diffuses the low resistance area, which is beneficial to the guidance of lightning.

[0019] In some embodiments, the grounding body is connected to a metal grounding down conductor.

[0020] In some embodiments, the outer surface of the grounding body is plated with a zinc layer.

[0021] The present invention discloses a grounding body with a zinc layer plated on its outer surface, the zinc layer forms a protective film on the outer surface of the grounding body, isolating the grounding body from the outside world, preventing the grounding body from rusting and oxidation, and improving the anti-corrosion effect of the grounding body.

[0022] Specifically, the galvanizing step is: placing the grounding body in molten zinc and hot dipping for 3-5 minutes; the hot dipping temperature is 450-480°C.

[0023] In some embodiments, the distance between the outer surface of the grounding body and the copper wire is 30-50 mm.

[0024] In some embodiments, the diameter of the copper wire is 1-10 mm, and the length of the copper wire is 300-500 mm.

[0025] In some embodiments, the material of the grounding body may be, but is not limited to, round steel, angle steel, flat steel, or steel pipe.

[0026] Specifically, the diameter of the round steel is greater than 10mm; the cross-sectional area of ​​the flat steel is greater than 100mm2, and the thickness is greater than 4mm; the size of the flat steel is 40mm×40mm×4mm; the diameter of the steel pipe is 32-40mm, and the thickness is greater than 3.5mm.

[0027] Specifically, the preparation method of the grounding body is:

[0028] Grind the raw material surface of the grounding body to remove rust and protrusions on the raw material surface of the grounding body;

[0029] Weld the cleaned raw materials into a metal frame and clean the weld scars and protrusions at the welding points;

[0030] The metal frame is placed in molten zinc and hot-dipped at 450-480°C for 3-5 minutes to obtain a grounding body.

[0031] In a third aspect, a method for preparing the anti-corrosion distribution network grounding device is provided, comprising the following steps:

[0032] S1: multiple sockets are provided on the inner wall of the grounding pit, the grounding resistance reduction material is injected into the sockets, and then the copper wire is inserted into the sockets;

[0033] S2: placing the grounding body into the grounding foundation pit, and leaving a gap between the outside of the grounding body and the copper wire; then pouring the grounding resistance reduction material into the grounding foundation pit, so that the grounding resistance reduction material completely wraps the grounding body;

[0034] S3: After the grounding resistance reduction material is completely solidified, backfill with fine soil and compact it.

[0035] The present invention installs the copper wire on the inner wall of the grounding pit through the insertion hole, thereby avoiding the problem that the copper wire cannot be evenly distributed in the grounding resistance reduction material, thereby causing the conductive efficiency of the anti-corrosion distribution network grounding device to be reduced.

[0036] In some embodiments, the interval between adjacent holes is 30-50 mm, the depth of the hole is 30-50 mm, and the diameter of the hole is 2-20 mm.

[0037] In some embodiments, the distance between the outer surface of the grounding body and the inner wall of the grounding pit is 300-500 mm.

[0038] Compared with the prior art, the present invention has the following beneficial effects:

[0039] (1) The grounding resistance reduction material disclosed in the present invention acts between the grounding body and the soil. On the one hand, it can be in close contact with the grounding body to form a sufficiently large current flow surface. On the other hand, the grounding resistance reduction material can penetrate into the surrounding soil, reduce the resistivity of the surrounding soil, and form a low-resistance area with a gentle change around the grounding body, which is conducive to the guidance of lightning. The retarder in the grounding resistance reduction material can ensure the fluidity of the grounding resistance reduction material, so that the grounding resistance reduction material can evenly wrap the grounding body and fill the grounding foundation pit, thereby avoiding the presence of bubbles between the solidified grounding resistance reduction material and the grounding body, and avoiding the presence of gaps between the grounding device composed of the grounding resistance reduction material, the grounding body and the grounding foundation pit, resulting in a reduction in the strength of the grounding resistance reduction material and a reduction in the effective thickness of the protective layer of the grounding body. In addition, the retarder can form a protective film on the surface of the grounding resistance reduction material, reduce the permeability of the grounding resistance reduction material, and reduce the erosion of the grounding body by the grounding resistance reduction material. On the other hand, the retarder can also improve the strength and durability of the grounding resistance reduction material. The present disclosure preferably uses titanium lignin sulfonate and / or zirconium lignin sulfonate as a retarder, which can further improve the resistance reduction performance of the grounding resistance reduction material and reduce its corrosion effect on the grounding body.

[0040] (2) Copper wire is added to the anti-corrosion distribution network grounding device disclosed in the present invention. After the resistance reduction layer is combined with the copper wire, the copper wire is similar to steel bars, and forms a structure similar to a concrete block with the grounding resistance reduction material, thereby improving the strength of the resistance reduction layer; at the same time, the copper wire further diffuses the low resistance area, which is beneficial to the guidance of lightning.

[0041] (3) The present invention discloses a zinc layer on the outer surface of the grounding body. The zinc layer forms a protective film on the outer surface of the grounding body, isolating the grounding body from the outside world, preventing the grounding body from rusting and oxidation, and improving the anti-corrosion effect of the grounding body. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] Figure 1 It is a schematic diagram of a socket in the anti-corrosion distribution network grounding device disclosed in the present invention;

[0043] Figure 2 It is a schematic diagram of the anti-corrosion distribution network grounding device disclosed in the present invention. DETAILED DESCRIPTION

[0044] In order to facilitate understanding of the present disclosure, the present disclosure will be described more fully below. However, the present disclosure can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present disclosure more thorough and comprehensive.

[0045] In the following examples and comparative examples, the grounding body is homemade, and its preparation method is as follows:

[0046] Grind the surface of the grounding material to remove rust and protrusions on the surface of the grounding material;

[0047] The polished grounding body raw material is welded into a rectangular metal frame, and the weld scars and protrusions at the welding points are cleaned;

[0048] The metal frame is placed in a hot-dip plating tank at 450° C. for 3 minutes, wherein the plating solution in the hot-dip plating tank is molten zinc, to obtain a metal frame with a zinc-plated layer on the surface;

[0049] Among them, the raw material of the grounding body is round steel, and the diameter of the round steel is 12mm.

[0050] Zirconium lignin sulfonate is homemade, and its preparation method is as follows: zirconium tetrachloride and sodium lignin sulfonate are evenly mixed and placed in a reactor, and a hydrothermal reaction is carried out at a temperature of 100°C. After the reaction is completed, the product is centrifuged, washed, and dried to obtain zirconium lignin sulfonate; wherein the mass ratio of zirconium tetrachloride to sodium lignin sulfonate is 1:1.

[0051] Titanium lignin sulfonate is homemade, and its preparation method is as follows: titanium tetrachloride and sodium lignin sulfonate are evenly mixed and placed in a reactor, and a hydrothermal reaction is carried out at a temperature of 130°C. After the reaction is completed, the product is centrifuged, washed, and dried to obtain titanium lignin sulfonate; wherein the mass ratio of titanium tetrachloride to sodium lignin sulfonate is 1:1.

[0052] Example 1

[0053] like Figure 1 and Figure 2 As shown, this embodiment provides a method for preparing an anti-corrosion distribution network grounding device, comprising the following steps:

[0054] S1: Spread 40mm thick fine soil at the bottom of the grounding pit, and then open multiple array-distributed installation sockets with a size of 2×2×30mm around the inner wall of the grounding pit, with a spacing of 30mm between adjacent sockets;

[0055] S2: inject the grounding resistance reduction material into the installation socket, and then vertically insert a copper wire with a diameter of 1 mm and a length of 300 mm into the installation socket, wherein the grounding resistance reduction material is composed of conductive cement, bentonite, retarder and water, the mass ratio of conductive cement, bentonite and retarder is 100:10:1.5, the ratio of the mass of water to the total mass of conductive cement and bentonite is 0.4:1, and the retarder is calcium lignin sulfonate;

[0056] S3: Place the metal frame in the center of the grounding pit, so that the distance between the outer surface of the metal frame and the inner wall of the grounding pit is 300 mm, and the distance between the outer surface of the metal frame and the copper wire is 30 mm; then pour the grounding resistance reduction material in S2 into the grounding pit, so that the grounding resistance reduction material completely wraps the metal frame and completely fills the gap between the outer surface of the metal frame and the inner wall of the grounding pit;

[0057] S4: After the grounding resistance reduction material in step S3 is solidified, backfill with fine soil and compact it.

[0058] Example 2

[0059] like Figure 1 and Figure 2 As shown, this embodiment provides a method for preparing an anti-corrosion distribution network grounding device, comprising the following steps:

[0060] S1: Spread 45mm thick fine soil at the bottom of the grounding pit, and then open multiple array-distributed installation sockets with a size of 10×10×40mm around the inner wall of the grounding pit, with a spacing of 40mm between adjacent sockets;

[0061] S2: inject the grounding resistance reduction material into the installation socket, and then vertically insert a copper wire with a diameter of 5 mm and a length of 400 mm into the installation socket, wherein the grounding resistance reduction material is composed of conductive cement, bentonite, retarder and water, the mass ratio of conductive cement, bentonite and retarder is 100:17:2.3, the ratio of the mass of water to the total mass of conductive cement and bentonite is 0.5:1, and the retarder is calcium lignin sulfonate;

[0062] S3: Place the metal frame in the center of the grounding pit, so that the distance between the outer surface of the metal frame and the inner wall of the grounding pit is 400 mm, and the distance between the outer surface of the metal frame and the copper wire is 40 mm; then pour the grounding resistance reduction material in S2 into the grounding pit, so that the grounding resistance reduction material completely wraps the metal frame and completely fills the gap between the outer surface of the metal frame and the inner wall of the grounding pit;

[0063] S4: After the grounding resistance reduction material in step S3 is solidified, backfill with fine soil and compact it.

[0064] Example 3

[0065] like Figure 1 and Figure 2 As shown, this embodiment provides a method for preparing an anti-corrosion distribution network grounding device, comprising the following steps:

[0066] S1: Spread 50mm thick fine soil at the bottom of the grounding pit, and then open multiple array-distributed installation sockets with a size of 20×20×50mm around the inner wall of the grounding pit, with a spacing of 50mm between adjacent sockets;

[0067] S2: inject the grounding resistance reduction material into the installation socket, and then vertically insert a copper wire with a diameter of 10 mm and a length of 500 mm into the installation socket, wherein the grounding resistance reduction material is composed of conductive cement, bentonite, retarder and water, the mass ratio of conductive cement, bentonite and retarder is 100:25:3, the ratio of the mass of water to the total mass of conductive cement and bentonite is 0.6:1, and the retarder is calcium lignin sulfonate;

[0068] S3: Place the metal frame in the center of the grounding pit, so that the distance between the outer surface of the metal frame and the inner wall of the grounding pit is 500 mm, and the distance between the outer surface of the metal frame and the copper wire is 50 mm; then pour the grounding resistance reduction material in S2 into the grounding pit, so that the grounding resistance reduction material completely wraps the metal frame and completely fills the gap between the outer surface of the metal frame and the inner wall of the grounding pit;

[0069] S4: After the grounding resistance reduction material in step S3 is solidified, backfill with fine soil and compact it.

[0070] Example 4

[0071] This embodiment provides a method for preparing an anti-corrosion distribution network grounding device. The only difference between this embodiment and Example 2 is that the retarder of this embodiment is sodium lignin sulfonate; the remaining steps and parameters are the same as those of Example 2.

[0072] Example 5

[0073] This embodiment provides a method for preparing an anti-corrosion distribution network grounding device. The only difference between this embodiment and Example 2 is that the retarder of this embodiment is titanium lignin sulfonate; the remaining steps and parameters are the same as those of Example 2.

[0074] Example 6

[0075] This embodiment provides a method for preparing an anti-corrosion distribution network grounding device. The only difference between this embodiment and Example 2 is that the retarder of this embodiment is zirconium lignin sulfonate; the remaining steps and parameters are the same as those of Example 2.

[0076] Comparative Example 1

[0077] This comparative example provides a method for preparing an anti-corrosion distribution network grounding device. The only difference between this comparative example and Example 2 is that the mass ratio of conductive cement, bentonite and retarder in this comparative example is 100:17:6; the remaining steps and parameters are the same as those in Example 2.

[0078] Comparative Example 2

[0079] This comparative example provides a method for preparing an anti-corrosion distribution network grounding device. The only difference between this comparative example and Example 2 is that the mass ratio of conductive cement, bentonite and retarder in this comparative example is 100:17:0.5; the remaining steps and parameters are the same as those in Example 2.

[0080] Comparative Example 3

[0081] This comparative example provides a method for preparing an anti-corrosion distribution network grounding device. The only difference between this comparative example and Example 2 is that the grounding resistance reduction material of this comparative example does not contain a retarder; the remaining steps and parameters are the same as those of Example 2.

[0082] Comparative Example 4

[0083] This comparative example provides a method for preparing an anti-corrosion distribution network grounding device. The only difference between this comparative example and Example 2 is that the retarder in this comparative example is lignin; the remaining steps and parameters are the same as those in Example 2.

[0084] Comparative Example 5

[0085] This comparative example provides a method for preparing an anti-corrosion distribution network grounding device. The only difference between this comparative example and Example 2 is that the retarder in this comparative example is cellulose; the remaining steps and parameters are the same as those in Example 2.

[0086] Comparative Example 6

[0087] This comparative example provides a method for preparing an anti-corrosion distribution network grounding device. The only difference between this comparative example and Example 2 is that the retarder in this comparative example is carbon fiber; the remaining steps and parameters are the same as those in Example 2.

[0088] Comparative Example 7

[0089] This comparative example provides a method for preparing an anti-corrosion distribution network grounding device. The only difference between this comparative example and Example 2 is that the retarder in this comparative example is graphite; the remaining steps and parameters are the same as those in Example 2.

[0090] Comparative Example 8

[0091] This comparative example provides a method for preparing an anti-corrosion distribution network grounding device. The only difference between this comparative example and Example 2 is that no copper wire is inserted in step S2 of this comparative example, that is, the anti-corrosion distribution network grounding device in this comparative example does not contain copper wire; the remaining steps and parameters are the same as those in Example 2.

[0092] Comparative Example 9

[0093] This comparative example provides a method for preparing an anti-corrosion distribution network grounding device. The only difference between this comparative example and Example 2 is that the diameter of the copper wire in this comparative example is 13 mm; the remaining steps and parameters are the same as those in Example 2.

[0094] Performance Testing

[0095] The performance test of the anti-corrosion distribution network grounding device obtained in the embodiment and the comparative example is carried out, and the test method is as follows:

[0096] (1) Resistance test of resistance reducing agent: The resistance reducing agent material is placed in a small groove of 30*10*10 cm, two electrodes are inserted at both ends of the small groove, and the resistance of the resistance reducing agent in the small groove is measured by connecting the GEI electrical instrument. Then, the resistivity of the resistance reducing agent is obtained through the relationship between resistivity and resistance, electrode spacing, and surface area of ​​the small groove.

[0097] (2) Grounding resistance test: Two anti-corrosion distribution network grounding devices of Example 1 are prepared in the soil adjacent to each other for 2 m, and then a grounding hole with a radius of 0.025 m and a depth of 1 m is drilled in the center of the anti-corrosion distribution network grounding device; the radius of the measuring grounding electrode is 0.025 m, which is inserted into the center of the grounding hole and in the hole, and the wire is connected. The grounding resistance detection interface is opened on the GEI operation interface. The grounding resistance test of the anti-corrosion distribution network grounding devices of other embodiments and comparative examples adopts the same test steps.

[0098] (3) Corrosion resistance: The grounding resistance reduction material is evenly coated on a galvanized steel plate (10cm×10cm×1cm) with a coating thickness of 10mm to obtain the sample to be tested; after the three test plates are dried, scratches are made on the coating surface with a knife, and the scratch distance from each edge of the test plate or between the scratches is 25mm. At the same time, the scratch should be a straight line through the coating to the galvanized steel plate. Then put the test plate into a salt spray box at 70±2℃, take it out every 4 days, and rinse it with clean warm water to remove the test solution residue on the surface of the test plate. Then wipe the test plate dry immediately and check the damage on the surface of the test plate. If blistering is found and the rust at the scratch is not seriously spread, it is considered to be the longest anti-corrosion time.

[0099] The test results are shown in Table 1.

[0100] Table 1

[0101]

[0102]

[0103] It can be seen from the experimental data in Table 1 that the grounding resistance reduction material disclosed in the present invention has lower resistivity, grounding resistance and corrosion resistance.

[0104] Finally, it should be noted that the above embodiments are used to illustrate the technical solution of the present disclosure rather than to limit the protection scope of the present disclosure. Although the present disclosure has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solution of the present disclosure can be modified or replaced by equivalents without departing from the essence and scope of the technical solution of the present disclosure.

Claims

1. A grounding resistance reduction material, characterized in that: The invention comprises conductive cement, bentonite and retarder, wherein the mass ratio of the conductive cement, bentonite and retarder is 100:10-25:1.5-3; the retarder is at least one of sodium lignin sulfonate, calcium lignin sulfonate, titanium lignin sulfonate and zirconium lignin sulfonate.

2. The grounding resistance reduction material according to claim 1, characterized in that: The preparation method of the zirconium lignin sulfonate is as follows: zirconium salt and sodium lignin sulfonate are uniformly mixed, and a hydrothermal reaction is carried out at a temperature of 100-130° C., and zirconium lignin sulfonate is obtained after the reaction is completed; And / or, the preparation method of the titanium lignin sulfonate is: titanium salt and sodium lignin sulfonate are uniformly mixed, and a hydrothermal reaction is carried out at a temperature of 100-130° C. to obtain the titanium lignin sulfonate after the reaction is completed.

3. The grounding resistance reduction material according to claim 2, characterized in that: The mass ratio of the zirconium salt to the sodium lignin sulfonate is 0.5-2:1; and / or the mass ratio of the titanium salt to the sodium lignin sulfonate is 0.5-2:

1.

4. The grounding resistance reduction material according to claim 2, characterized in that: The zirconium salt is at least one of zirconium tetrachloride, zirconium sulfate, zirconium hydroxide, and zirconium oxychloride; And / or, the titanium salt is at least one of titanium tetrachloride, titanium sulfate, and titanyl sulfate.

5. An anti-corrosion distribution network grounding device, characterized in that: It includes a grounding body, a resistance reduction layer, and a copper wire, wherein the resistance reduction layer is composed of the grounding resistance reduction material according to any one of claims 1 to 4; the resistance reduction layer wraps the grounding body, and the copper wire is vertically embedded in the resistance reduction layer from a direction away from the outer surface of the grounding body, and the copper wire and the grounding body do not contact each other.

6. The anti-corrosion distribution network grounding device according to claim 5, characterized in that: The grounding body is connected to the metal grounding down conductor; and / or, the outer surface of the grounding body is plated with a zinc layer; and / or, the distance between the outer surface of the grounding body and the copper wire is 30-50 mm.

7. The anti-corrosion distribution network grounding device according to claim 5, characterized in that: The diameter of the copper wire is 1-10 mm, and the length of the copper wire is 300-500 mm.

8. A method for preparing the anti-corrosion distribution network grounding device according to any one of claims 5 to 6, characterized in that: The following steps are involved: S1: a plurality of sockets are provided on the inner wall of the grounding foundation pit, the grounding resistance reduction material according to any one of claims 1 to 4 is injected into the sockets, and then the copper wire is inserted into the sockets; S2: placing the grounding body into the grounding foundation pit, and leaving a gap between the outside of the grounding body and the copper wire; then pouring the grounding resistance reduction material according to any one of claims 1 to 4 into the grounding foundation pit, so that the grounding resistance reduction material completely wraps the grounding body; S3: After the grounding resistance reduction material is completely solidified, backfill with fine soil and compact it.

9. The method for preparing the anti-corrosion distribution network grounding device according to claim 8, characterized in that: The interval between adjacent jacks is 30-50 mm, the depth of the jack is 30-50 mm, and the diameter of the jack is 2-20 mm.

10. The method for preparing the anti-corrosion distribution network grounding device according to claim 8, characterized in that: The distance between the outer surface of the grounding body and the inner wall of the grounding pit is 300-500 mm.

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