A white solder resist ink based on hydrogenated bisphenol A epoxy resin and its preparation method

Abstract

The present invention relates to a white solder resist ink based on hydrogenated bisphenol A epoxy resin and a preparation method thereof, comprising component A and component B; the component A comprises components in the following parts by mass: 10-30 parts of alkali-soluble hydrogenated bisphenol A epoxy resin, 5-10 parts of polyurethane resin, 1-10 parts of reactive monomer, 5-20 parts of modified boron nitride, 1-5 parts of photoinitiator, and 10-50 parts of solvent; the component B comprises components in the following parts by mass: 1-10 parts of bisphenol A epoxy resin, 1-10 parts of auxiliary agent, and 1-10 parts of solvent; wherein, the modified boron nitride is a product obtained by reacting boron nitride with silane coupling agent, polyurethane acrylate, and reactive hindered amine. The present invention realizes good yellowing resistance ability, and at the same time has excellent mechanical strength and stability, overcomes the deficiencies existing in the prior art, and has important significance for the further development and application of solder resist ink.

Description

Technical Field

[0001] The present invention relates to the technical field of solder resist inks, and particularly to a white solder resist ink based on hydrogenated bisphenol A epoxy resin and a preparation method thereof. Background Art

[0002] Solder resist ink is a key raw material in the production process of printed circuit boards and plays an important role in the stable and long-term operation of printed circuit boards. In LED printed circuit boards, white solder resist ink needs to be coated to obtain a solder resist and reflective coating, which can not only prevent the soldering tin from damaging the copper wire, but also improve the light reflectivity of the printed circuit board to ensure the yield of the printed circuit board and increase the brightness of the lamp light source.

[0003] With the rise and progress of high-end LED technologies such as MicroLED, the yellowing resistance performance of photosensitive solder resist white oil used in printed circuit boards faces more stringent standards. In the past, the core resin components of commonly used white solder resist ink formulations were mostly ordinary benzene-containing epoxy resins and epoxy acrylate esters, and these materials performed poorly in terms of anti-yellowing. Especially during the reflow soldering process and the operation of the lamp, under the dual influence of high-temperature environment and ultraviolet radiation, the unsaturated benzene structure therein is prone to oxidation, and then groups that cause color change are generated, which promotes the change of the resin structure, the yellowing of the white paint layer, and the reduction of the light reflection efficiency.

[0004] To improve the yellowing resistance performance of solder resist ink, it has been reported that acrylate copolymers containing epoxy functional groups are introduced into photosensitive double bonds, and then acid anhydride grafting is used to increase carboxyl groups to endow the material with alkali developability. The resulting aliphatic acrylic epoxy resin benefits from its stable chemical structure and is not easily generated color-causing substances under ultraviolet exposure or high-temperature conditions, showing better anti-yellowing performance than traditional materials. There are also technical solutions to reduce the content of aromatic rings or add components such as light stabilizers and ultraviolet absorbers to achieve better yellowing resistance effects. However, the above technical solutions still have defects such as insufficient product strength, too high cost, and unsatisfactory yellowing resistance effects, and it is difficult to meet the current production and application requirements and needs to be further solved.

[0005] In summary, it is necessary to develop a new technical solution to solve the deficiencies existing in the prior art. Summary of the Invention

[0006] Based on this, the present invention provides a white solder resist ink based on hydrogenated bisphenol A epoxy resin and a preparation method thereof. The present invention uses components such as alkali-soluble hydrogenated bisphenol A epoxy resin and polyurethane resin as the main body, modifies boron nitride fillers, introduces polyurethane and hindered amine groups, and realizes good anti-yellowing ability under the synergistic action of various components, and at the same time has excellent mechanical strength and stability, overcomes the deficiencies existing in the prior art, and has important significance for the further development and application of solder resist ink.

[0007] An object of the present invention is to provide a white solder resist ink based on hydrogenated bisphenol A epoxy resin, and the white solder resist ink based on hydrogenated bisphenol A epoxy resin includes component A and component B;

[0008] Component A includes the following components in parts by mass:

[0009]

[0010] Component B includes the following components in parts by mass:

[0011] Bisphenol A epoxy resin 1 - 10 parts

[0012] Auxiliary agent 1 - 10 parts

[0013] Solvent 1 - 10 parts;

[0014] Wherein,

[0015] The modified boron nitride is a product obtained by reacting boron nitride with a silane coupling agent, a polyurethane acrylate, and a reactive hindered amine.

[0016] Further, the silane coupling agent is selected from acrylate - based silane coupling agents, and the reactive hindered amine is selected from acrylate - based hindered amines.

[0017] Further, the preparation method of the modified boron nitride includes the following steps:

[0018] S1. Mix boron nitride and a silane coupling agent, and after ultrasonic heating reaction, an intermediate product is obtained;

[0019] S2. Mix polyisocyanate, polyether polyol, dimethylolpropionic acid, and a catalyst, heat and react, then add hydroxy acrylate and pentaerythritol triacrylate, raise the temperature for reaction, then add hydroxyl - terminated hyperbranched polyester, continue the reaction, and after adding an alkali for neutralization, a polyurethane acrylate is obtained;

[0020] S3. Mix the intermediate product, polyurethane acrylate, reactive hindered amine, and an initiator, and heat and react under an inert gas atmosphere to obtain modified boron nitride.

[0021] Further, in step S1, the temperature of the ultrasonic heating reaction is 50 - 80 °C, and the time is 3 - 6 h.

[0022] Further, in step S2, the temperature of the heating reaction is 50 - 70 °C, the temperature of the temperature - raising reaction is 80 - 100 °C, and the temperature of the continued reaction is 70 - 90 °C.

[0023] Further, in step S3, the temperature of the heating reaction is 60 - 100 °C, and the time is 4 - 12 h.

[0024] Further, in step S2, the mass ratio of the polyisocyanate, polyether polyol, dimethylolpropionic acid, hydroxy acrylate, pentaerythritol triacrylate, and hydroxyl-terminated hyperbranched polyester is (35-40):(40-45):(3-4):(12-13):(10-15):(4-5).

[0025] Further, in step S3, the mass ratio of the intermediate product, polyurethane acrylate, and reactive hindered amine is (5-10):(1-5):(1-5).

[0026] Further, the auxiliary agent is selected from one or more of color powder, leveling agent, defoaming agent, ultraviolet absorber, dispersant, antioxidant, and toughening agent.

[0027] Further, the active monomer is a monomer having acrylate units with single or multiple functional groups.

[0028] Specifically, the optional objects of the active monomer include, but are not limited to: monomers containing one acrylate unit, such as methyl acrylate, ethyl acrylate, propyl acrylate, butyl acrylate, octyl acrylate, dodecyl acrylate, hexadecyl acrylate, octadecyl acrylate, etc., or methyl methacrylate, ethyl methacrylate, propyl methacrylate, ethyl propyl acrylate, ethyl butyl acrylate, propyl butyl acrylate, propyl octyl acrylate, propyl dodecyl acrylate, butyl octadecyl acrylate, etc. In short, an alkyl chain structure of C1-C22 can be connected to the ester group, and the alkyl chain part connected to acrylic acid can also be an alkyl chain structure of C1-C22;

[0029] Monomers containing two acrylate units, such as diethylene glycol diacrylate, dipropylene glycol diacrylate, 1,6-hexanediol diacrylate, tetraethylene glycol diacrylate, diacrylate, etc.; on the ester group of the acrylate, an alkyl chain structure of C1-C22 can be independently connected;

[0030] Monomers containing three acrylate units, such as trimethylolpropane triacrylate, 1,2,3-propanetriyl triacrylate, tris(2-hydroxyethyl) isocyanurate triacrylate, triacrylate, etc.; on the ester group of the acrylate, an alkyl chain structure of C1-C22 can be independently connected;

[0031] Monomers containing 4-6 acrylate units, such as dipentaerythritol hexaacrylate, and on the ester group of the acrylate, an alkyl chain structure of C1-C22 can be independently connected;

[0032] And, a mixture obtained by blending any two or more monomers of acrylate units having single functional groups or multiple functional groups in any mass ratio. The blending can be binary blending, ternary blending, quaternary blending or blending of more components.

[0033] Furthermore, in the auxiliary agent:

[0034] The color powder can be but is not limited to: phthalocyanine blue, phthalocyanine green, iodine green, diazo yellow, crystal violet, titanium dioxide, carbon black, naphthalene black, etc.

[0035] The leveling agent can be but is not limited to: silicone-based, polyurethane-based, alcohol-based, polyalcohol-based, acrylic-based, inorganic substances, etc., such as isopropyl alcohol, polysiloxane, dimethyl silicone oil, glycerol, polyether, alumina, calcium oxide, etc., and a mixture obtained by blending any of the above optional substances in any mass ratio.

[0036] The dispersant can be but is not limited to: anionic surfactant series, such as AES, AOS, LAS, MES, etc.; non-ionic surfactant series, such as AEO series, Span series, Tween series, etc., and a mixture obtained by blending any of the above optional substances in any mass ratio.

[0037] The defoaming agent can be but is not limited to: mineral oil, polydimethylsilicone oil, tributyl phosphate, silicone resin, etc., and a mixture obtained by blending any of the above optional substances in any mass ratio.

[0038] The ultraviolet absorber can be but is not limited to: benzophenone-based, benzotriazole-based, acrylonitrile-based, triazine-based, etc., and a mixture obtained by blending any of the above optional substances in any mass ratio.

[0039] The antioxidant can be but is not limited to: phenol-based, thiol-based, etc., and a mixture obtained by blending any of the above optional substances in any mass ratio.

[0040] The toughening agent can be but is not limited to: rubber-based toughening agents, resin-based toughening agents, etc., such as ethylene-propylene rubber, polybutadiene rubber, butyl rubber, nitrile rubber, styrene-butadiene rubber, SBS, ABS, MBS, CPE, DOP, DBP, TCP, TPP, etc., and a mixture obtained by blending any of the above optional substances in any mass ratio.

[0041] Furthermore, the dispersant is selected from anionic surfactants, preferably one or more of dodecylbenzenesulfonate, dodecyl sulfate, metasilicate, stearate.

[0042] Further, the solvent is selected from organic solvents such as methanol, ethanol, propanol, butanol, chlorobenzene, toluene, tetrahydrofuran, dichloromethane, chloroform, petroleum ether, benzene, DMF, DMSO, DBE, or derivatives of the above optional objects, and mixtures of any of the above optional objects blended in any mass ratio.

[0043] Another object of the present invention is to provide a method for preparing the above-mentioned white solder resist ink based on hydrogenated bisphenol A epoxy resin. The method for preparing the white solder resist ink based on hydrogenated bisphenol A epoxy resin includes the following steps:

[0044] Blend an alkali-soluble hydrogenated bisphenol A epoxy resin, a polyurethane resin, a reactive monomer, modified boron nitride, a photoinitiator, and a solvent to obtain component A; blend a bisphenol A epoxy resin, an auxiliary agent, and a solvent to obtain component B, and then blend component A and component B, stir and disperse evenly, and then carry out grinding and filtration to obtain a product.

[0045] The present invention has the following beneficial effects:

[0046] The white solder resist ink based on hydrogenated bisphenol A epoxy resin provided by the present invention uses an alkali-soluble hydrogenated bisphenol A epoxy resin and polyurethane as the main body, and is compounded with components such as modified boron nitride. First, the boron nitride is treated with a silane coupling agent to obtain an intermediate product with acrylate groups on the surface. At the same time, polyurethane acrylate is prepared from substances such as polyisocyanate, polyether polyol, acrylic hydroxy ester, and hydroxyl-terminated hyperbranched polyester. Then, the intermediate product, polyurethane acrylate, and acrylate-based hindered amine are mixed and reacted, thereby introducing hyperbranched polyurethane and hindered amine groups into the boron nitride filler. The modified boron nitride significantly improves the compatibility with organic polymers such as epoxy resin and polyurethane, enhances the stability of the system. At the same time, the modified boron nitride has a large number of functional groups such as alkoxy groups, carboxyl groups, hydroxyl groups, and ester groups, which not only helps to improve the adhesion of the ink, but also can form chemical cross-links and intermolecular forces with epoxy resin and polyurethane to obtain a denser and more stable three-dimensional network structure, thereby improving the mechanical strength of the coating. In addition, after the modified boron nitride is combined with other components, the hindered amine groups therein can more efficiently provide antioxidant and degradation effects on the organic resin. At the same time, a large number of active groups in the modified boron nitride can also further enhance the stability of the ink through hydrogen bonding and other effects, and endow the coating with a more durable yellowing resistance effect under the combined action of multiple components. Specific embodiments

[0047] In order to more clearly illustrate the technical solutions of the present invention, the following examples are listed. The raw materials, reactions, and post-treatment means appearing in the examples are all common raw materials on the market and technical means well-known to those skilled in the art, unless otherwise specified.

[0048] The terms "preferred", "preferably", "more preferred", etc. in the present invention refer to embodiments of the present invention that can provide certain beneficial effects under certain circumstances. However, in the same circumstances or other circumstances, other embodiments may also be preferred. In addition, the description of one or more preferred embodiments does not imply that other embodiments are not available, nor is it intended to exclude other embodiments from the scope of the present invention.

[0049] It should be understood that, except in any operating instance or otherwise indicated, all numbers representing, for example, the amounts of ingredients used in the specification and claims should be understood to be modified in all instances by the term "about". Accordingly, unless indicated to the contrary, the numerical parameters set forth in the following specification and attached claims are approximations that vary depending upon the desired properties sought to be obtained by the present invention.

[0050] The preparation method of the alkali-soluble hydrogenated bisphenol A epoxy resin in the embodiments of the present invention comprises the following steps:

[0051] 500 parts of hydrogenated bisphenol A epoxy resin and 180 parts of acrylic acid are put into 300 parts of diethylene glycol monoethyl ether acetate, heated to 100 °C and stirred until dissolved uniformly; then 2 parts of triphenylphosphine are added, heated to 110 °C and reacted for 2 h, and then the temperature is raised to 120 °C and reacted for another 12 h; 415 parts of dibasic acid ester and 250 parts of tetrahydrophthalic anhydride are added to the obtained reaction solution, and reacted at 110 °C for 4 h. After cooling, an alkali-soluble hydrogenated bisphenol A epoxy resin is obtained.

[0052] The polyurethane resin in the embodiments of the present invention is Sartomer CU612NS.

[0053] The hydrogenated bisphenol A epoxy resin in the embodiments of the present invention is HE4080E of Complex High-Tech Materials (Shanghai) Co., Ltd.

[0054] The reactive monomer in the embodiments of the present invention is trimethylolpropane triacrylate (TMPTA) and dipentaerythritol hexaacrylate (DPHA) with a mass ratio of 1:1.

[0055] The photoinitiator in the embodiments of the present invention is photoinitiator 819.

[0056] The auxiliary agent in the embodiments of the present invention is a color powder, a leveling agent and a dispersant with a mass ratio of 1:1:2. The color powder is titanium dioxide, the leveling agent is isopropanol, and the dispersant is sodium dodecyl sulfate.

[0057] The particle size of boron nitride in the embodiments of the present invention is 200 nm.

[0058] The reactive hindered amine in the embodiments of the present invention is 2,2,6,6-tetramethylpiperidine methacrylate (MTMP).

[0059] In the embodiment of the present invention, the preparation method of modified boron nitride comprises the following steps:

[0060] S1. Immerse boron nitride in a 5 mol / L NaOH solution, react at 120 °C for 18 h, wash and dry to obtain hydroxylated boron nitride;

[0061] Using a 95 wt% ethanol - aqueous solution as the solvent, add KH - 570 and the hydroxylated boron nitride with a mass ratio of 1:10, react by ultrasonic wave at 60 °C for 5 h, wash and dry to obtain an intermediate product;

[0062] S2. Add 40 g of polytetrahydrofuran (PTMG - 1000) and 3.6 g of dimethylolpropionic acid into a reaction kettle, then stir and add 37 g of isophorone diisocyanate and 0.01 g of dibutyltin dilaurate, stir and react at 60 °C for 1 h, then raise the temperature to 80 °C and continue to react until the NCO content is reduced to about 10.4%, lower the temperature to 70 °C, add 12.3 g of hydroxyethyl acrylate, continue to react for 2 h, add 13 g of pentaerythritol triacrylate, raise the temperature to 85 °C, continue to react for 2 h, add 4.6 g of hydroxyl - terminated hyperbranched polyester (H101, Mn = 500 g / mol), continue to react at 85 °C until the NCO content in the system is lower than 0.6%, lower the temperature to 60 °C, add 2.4 g of triethylamine to neutralize the reaction for 0.5 h, and remove the solvent to obtain polyurethane acrylate;

[0063] S3. Using xylene as the solvent, mix the intermediate product, polyurethane acrylate, reactive hindered amine and potassium persulfate with a mass ratio of 5:2:1:0.08, react at 85 °C for 8 h under a nitrogen atmosphere, and remove the solvent to obtain modified boron nitride.

[0064] "Parts" in the embodiments of the present invention all refer to parts by mass.

[0065] Example 1

[0066] A white solder mask ink based on hydrogenated bisphenol A epoxy resin, the white solder mask ink based on hydrogenated bisphenol A epoxy resin comprises component A and component B;

[0067] Component A comprises the following components in parts by mass:

[0068]

[0069] Component B comprises the following components in parts by mass:

[0070] Hydrogenated bisphenol A epoxy resin 2 parts

[0071] Auxiliary agent 1 part

[0072] Divalent acid ester 2 parts;

[0073] The preparation method of the above-mentioned white solder resist ink based on hydrogenated bisphenol A epoxy resin comprises the following steps:

[0074] According to the above mass parts, blend alkali-soluble hydrogenated bisphenol A epoxy resin, polyurethane resin, reactive monomer, modified boron nitride, photoinitiator, and dicarboxylic acid ester to obtain component A; blend hydrogenated bisphenol A epoxy resin, auxiliary agent, and dicarboxylic acid ester to obtain component B, and then blend the component A and component B, stir and disperse evenly, grind to a fineness of ≤20 μm, and pass through a 120-mesh sieve to obtain the product.

[0075] Example 2

[0076] A white solder resist ink based on hydrogenated bisphenol A epoxy resin, the white solder resist ink based on hydrogenated bisphenol A epoxy resin comprises component A and component B;

[0077] Component A comprises the following components in mass parts:

[0078]

[0079]

[0080] Component B comprises the following components in mass parts:

[0081] Hydrogenated bisphenol A epoxy resin 5 parts

[0082] Auxiliary agent 3 parts

[0083] Dicarboxylic acid ester 5 parts;

[0084] The preparation method of the above-mentioned white solder resist ink based on hydrogenated bisphenol A epoxy resin comprises the following steps:

[0085] According to the above mass parts, blend alkali-soluble hydrogenated bisphenol A epoxy resin, polyurethane resin, reactive monomer, modified boron nitride, photoinitiator, and dicarboxylic acid ester to obtain component A; blend hydrogenated bisphenol A epoxy resin, auxiliary agent, and dicarboxylic acid ester to obtain component B, and then blend the component A and component B, stir and disperse evenly, grind to a fineness of ≤20 μm, and pass through a 120-mesh sieve to obtain the product.

[0086] Example 3

[0087] A white solder resist ink based on hydrogenated bisphenol A epoxy resin, the white solder resist ink based on hydrogenated bisphenol A epoxy resin comprises component A and component B;

[0088] Component A comprises the following components in mass parts:

[0089]

[0090] The component B includes the following components in parts by mass:

[0091] Hydrogenated bisphenol A epoxy resin: 3 parts

[0092] Auxiliary agent: 2 parts

[0093] Divalent acid ester: 4 parts;

[0094] The preparation method of the above white solder mask ink based on hydrogenated bisphenol A epoxy resin includes the following steps:

[0095] According to the above parts by mass, blend alkali-soluble hydrogenated bisphenol A epoxy resin, polyurethane resin, reactive monomer, modified boron nitride, photoinitiator, and divalent acid ester to obtain component A; blend hydrogenated bisphenol A epoxy resin, auxiliary agent, and divalent acid ester to obtain component B, and then blend the component A and component B, stir and disperse evenly, grind to a fineness ≤ 20 μm, and pass through a 120-mesh sieve to obtain the product.

[0096] Comparative example 1

[0097] A white solder mask ink based on hydrogenated bisphenol A epoxy resin. The difference between this comparative example and Example 1 is that the modified boron nitride is replaced with a physical mixture of boron nitride, polyurethane resin, and 2,2,6,6-tetramethylpiperidine with a mass ratio of 5:2:1, and other components and preparation methods are the same as those in Example 1.

[0098] Comparative example 2

[0099] A white solder mask ink based on hydrogenated bisphenol A epoxy resin. The difference between this comparative example and Example 1 is that in step S2 of the preparation method of the modified boron nitride, the hydroxyl-terminated hyperbranched polyester is not added, and other components and preparation methods are the same as those in Example 1.

[0100] Test example

[0101] Perform performance tests on the white solder mask inks based on hydrogenated bisphenol A epoxy resin prepared in Examples 1-3 and Comparative examples 1-2.

[0102] The test method is as follows:

[0103] Coat the solder mask inks prepared in the examples and comparative examples on the PCB board respectively, and cure them under ultraviolet light (wavelength 395 nm, intensity 25.0 mW / cm 2 for 1 h), and then cure them thermally at 150 °C for 1 h to form a 0.5-mm-thick film.

[0104] Adhesion: Use a needle tip to draw a cross on the film respectively, then stick a cellophane tape on the scratch and pull it, and evaluate according to the following criteria:

[0105] ○: Not torn off;

[0106] ×: Tear off a large amount.

[0107] Flexural resistance: Bend at 180° with the solder mask ink film on the outside, and evaluate according to the following criteria:

[0108] ○: No cracks on the film;

[0109] ×: Cracks on the film.

[0110] Elongation at break: Measure the elongation at break (tensile fracture elongation) of the film using a tensile-compression testing machine (manufactured by Shimadzu Corporation).

[0111] Acid / alkali resistance: Immerse the PCB circuit board coated with solder mask ink in a 10% sulfuric acid solution or a 10% sodium hydroxide solution at 20°C, take it out after 30 minutes, and evaluate the state and adhesion of the coating film. The judgment criteria are as follows:

[0112] ○: No change or slight change is found;

[0113] ×: Swelling or swelling and peeling off on the coating film.

[0114] Heat resistance: Conduct a thermal shock performance test according to the method in IPC-SM-840E. The judgment criteria are as follows:

[0115] ○: No bubbles or cracks;

[0116] ×: Bubbles and cracks appear.

[0117] Anti-yellowing performance: Measure the reflectivity of the sample after three times of reflow soldering. The reflow soldering conditions are: 190°C * 3 min, 220°C * 2 min, 240°C * 3 min, 280°C * 4 min, for a total of 12 min. Use an X-RITE color difference meter model SP62 for testing. The larger the △B value, the more serious the yellowing.

[0118] The test results are shown in Table 1.

[0119] Table 1 Performance test results

[0120]

[0121] It can be concluded from Table 1 that the white solder resist ink prepared in the embodiments of the present invention based on hydrogenated bisphenol A epoxy resin has excellent mechanical properties, stability and good yellowing resistance. In Comparative Example 1, the modified boron nitride was replaced with a mixture of unmodified boron nitride, polyurethane and hindered amine, which could not improve the compatibility between different components and was difficult to form a stable cross-linked structure, resulting in a significant decrease in various properties. In Comparative Example 2, the hyperbranched polyester structure was not introduced into the modified boron nitride, the interaction between active groups was weakened, and the degree of cross-linking was also reduced. Therefore, the thermal stability and yellowing resistance of the ink coating were both reduced. In summary, the white solder resist ink based on hydrogenated bisphenol A epoxy resin of the present invention maintains good strength and stability, and significantly improves the yellowing resistance, solves the defects existing in the prior art, and has good application prospects.

[0122] For those skilled in the art, it is obvious that the present invention is not limited to the details of the above exemplary embodiments, and without departing from the spirit or basic characteristics of the present invention, the present invention can be implemented in other specific forms. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting. The scope of the present invention is defined by the appended claims rather than the above description. Therefore, it is intended to embrace all changes falling within the meaning and scope of the equivalent elements of the claims in the present invention.

[0123] In addition, it should be understood that although this specification is described according to embodiments, not every embodiment only contains an independent technical solution. This narrative way of the specification is only for clarity. Those skilled in the art should regard the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A white solder resist ink based on hydrogenated bisphenol A epoxy resin, characterized in that, The white solder resist ink based on hydrogenated bisphenol A epoxy resin comprises component A and component B; Component A comprises the following components in parts by mass: Alkali-soluble hydrogenated bisphenol A epoxy resin 10 - 30 parts Polyurethane resin 5 - 10 parts Reactive monomer 1 - 10 parts Modified boron nitride 5 - 20 parts Photoinitiator 1 - 5 parts Solvent 10 - 50 parts; Component B comprises the following components in parts by mass: Bisphenol A epoxy resin 1 - 10 parts Auxiliary agent 1 - 10 parts Solvent 1 - 10 parts; Among them, The modified boron nitride is a product obtained by reacting boron nitride with a silane coupling agent, polyurethane acrylate, and a reactive hindered amine; The preparation method of the modified boron nitride comprises the following steps: S1. Mix boron nitride and a silane coupling agent, and after ultrasonic heating reaction, an intermediate product is obtained; S2. Mix polyisocyanate, polyether polyol, dimethylolpropionic acid, and a catalyst, heat and react, then add hydroxy acrylate and pentaerythritol triacrylate, raise the temperature for reaction, then add hydroxyl-terminated hyperbranched polyester, continue the reaction, and after adding alkali for neutralization, polyurethane acrylate is obtained; S3. Mix the intermediate product, polyurethane acrylate, reactive hindered amine, and initiator, and after heating reaction in an inert gas atmosphere, modified boron nitride is obtained; The silane coupling agent is selected from acrylate-based silane coupling agents, and the reactive hindered amine is selected from acrylate-based hindered amines; In step S2, the mass ratio of the polyisocyanate, polyether polyol, dimethylolpropionic acid, hydroxy acrylate, pentaerythritol triacrylate, and hydroxyl-terminated hyperbranched polyester is (35 - 40):(40 - 45):(3 - 4):(12 - 13):(10 - 15):(4 - 5); In step S3, the mass ratio of the intermediate product, polyurethane acrylate, and reactive hindered amine is (5 - 10):(1 - 5):(1 - 5); The auxiliary agent is selected from one or more of color powder, leveling agent, defoaming agent, ultraviolet absorber, dispersant, antioxidant, and toughening agent.

2. The white solder resist ink based on hydrogenated bisphenol A epoxy resin according to claim 1, wherein In step S1, the temperature of the ultrasonic heating reaction is 50 - 80 °C, and the time is 3 - 6 h.

3. The white solder resist ink based on hydrogenated bisphenol A epoxy resin according to claim 1, wherein In step S2, the temperature of the heating reaction is 50 - 70 °C, the temperature of the temperature-raising reaction is 80 - 100 °C, and the temperature of the continued reaction is 70 - 90 °C.

4. The white solder resist ink based on hydrogenated bisphenol A epoxy resin according to claim 1, characterized in that, In step S3, the temperature of the heating reaction is 60 - 100 °C, and the time is 4 - 12 h.

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