Electroplating polishing method for metal parts

Abstract

The invention relates to the technical field of metal part electroplating, and discloses a metal part electroplating and polishing method which comprises the following steps: marking an electroplating space occupied by a to-be-plated workpiece in an electroplating pool as a to-be-plated space, and dividing the to-be-plated workpiece into n to-be-plated segments by an interface of adjacent to-be-plated spaces; executing a first adjusting strategy, and adjusting the concentrations of plating cations in the first space, the second space and the third space in each to-be-plated space to be equal; executing a plating layer concentration test experiment, obtaining the thickness of the plating layer increased in unit time of the workpiece to be plated in the electroplating solutions with different plating layer concentrations, and recording the thickness as unit thickness; executing a concentration determination strategy, and measuring the plating concentration of each to-be-plated space; executing a second adjusting strategy, and calculating the coating thickness increased when the workpiece to be plated is turned once in the space to be plated; the positions of the first end and the second end of the to-be-plated workpiece are adjusted, and meanwhile, the concentration of cations of the plating layer in the to-be-plated space is adjusted, so that the plating layer of the to-be-plated workpiece is more uniform.

Description

Technical Field

[0001] The invention relates to the technical field of electroplating of metal parts, in particular to an electroplating polishing method for metal parts. Background Art

[0002] Electroplating is a metal surface treatment technology that deposits a thin layer of other metals or alloys on the metal surface to enhance its corrosion resistance, wear resistance, aesthetics or electrical conductivity. Electroplating technology is particularly important in shipbuilding because ship components are often exposed to humid and salt water environments, which are highly susceptible to metal corrosion and material degradation. The precision in the electroplating process has a significant impact on the performance and life of ship components. The uniformity, adhesion, thickness of the electroplated layer, as well as the microstructure of the electroplated layer are all key factors affecting the performance of the component. Uneven or insufficient electroplating may cause the component to perform poorly in use, such as premature wear, corrosion or failure. By precisely controlling the composition, temperature, current density and time of the electroplating solution, manufacturers are able to ensure a high-quality coating with the desired characteristics, thereby extending the service life of ship components and reducing maintenance costs. In short, electroplating precision plays a vital role in the manufacture of ship components, which is directly related to the overall performance and maintenance needs of the ship.

[0003] Since ship parts are usually large in size, the volume of the configured electroplating pool will also become larger accordingly. The larger electroplating pool leads to uneven distribution of the concentration of plating cations. When electroplating ship parts, uneven plating often occurs.

[0004] This scheme proposes to divide the electroplating pool into multiple spaces to be plated. When electroplating the workpiece to be plated, the positions of the first end and the second end of the workpiece to be plated are reversed, and the concentration of the plating cations in the space to be plated is adjusted so that the plating thickness of each segment to be plated of the workpiece to be plated is equal. Summary of the invention

[0005] The present invention provides an electroplating polishing method for metal parts, which is used to promote solving the problems mentioned in the above background technology.

[0006] The present invention provides the following technical solution: a method for electroplating and polishing metal parts, comprising:

[0007] Obtain workpieces that need to be electroplated for ship production;

[0008] The workpiece is subjected to degreasing, sandblasting and polishing treatments in sequence, and the treated workpiece is recorded as a workpiece to be plated, wherein the workpiece to be plated is a container, including an inner space and an outer space;

[0009] Obtain an electroplating cell, wherein the electroplating cell is a rectangular container, wherein the anode is the metal to be plated, and the cathode is the workpiece to be plated;

[0010] The direction from anode to cathode is recorded as the positive direction;

[0011] Divide the electroplating pool into several electroplating spaces in the positive direction;

[0012] Plating the workpiece to be plated into the electroplating bath for electroplating;

[0013] The plating space occupied by the workpiece to be plated in the plating bath is recorded as the plating space, and the plating spaces are named in sequence in the positive direction as the first plating space, the second plating space, and the nth plating space;

[0014] The interface between adjacent spaces to be plated divides the workpiece to be plated into n segments to be plated;

[0015] In a space to be plated, the inner space of the segment to be plated is recorded as the first space;

[0016] The two external spaces of the segment to be plated are respectively recorded as the second space and the third space;

[0017] Executing a first adjustment strategy to adjust the concentrations of plating cations in the first space, the second space, and the third space in each space to be plated to be equal;

[0018] The concentration of the plating cations is recorded as the plating concentration;

[0019] Perform a coating concentration test experiment to obtain the thickness of the coating added per unit time of the workpiece to be plated in the electroplating solution with different coating concentrations, which is recorded as the unit thickness;

[0020] One end of the workpiece to be plated in the first space to be plated is recorded as the first end;

[0021] Recording one end of the workpiece to be plated in the nth space to be plated as the second end;

[0022] Execute concentration determination strategy to measure the coating concentration of each space to be plated;

[0023] Execute the second adjustment strategy to calculate the thickness of the coating that increases when the workpiece to be plated is turned once in the space to be plated, and record it as the turning thickness;

[0024] Obtain the qualified thickness of the workpiece to be plated;

[0025] Execute the switch plating strategy to electroplate the workpiece.

[0026] Optionally, executing the first adjustment strategy includes:

[0027] stirring the electroplating solutions in the first space, the second space and the third space with a stirrer;

[0028] The electroplating solution in the first space is exchanged with the electroplating solutions in the second space and the third space respectively, so as to keep the concentrations of the plating cations in the first space, the second space and the third space equal.

[0029] Optionally, the execution of the concentration determination strategy includes:

[0030] Set the measurement value used to select the number of test samples in the space to be plated, denoted as H;

[0031] For each space to be plated:

[0032] Obtain a line segment parallel to the positive direction in the space to be plated, recorded as a space line segment;

[0033] The space line segment is equally divided into the measured value line segments to obtain a plurality of divided line segments;

[0034] Get the midpoint of each segment and record it as the measurement point;

[0035] Obtain the plating solution at each measuring point and record it as a measuring sample;

[0036] Measuring the concentration of plating cations in each measurement sample to obtain a plating sample value;

[0037] Obtain all electroplating sample values, and record them as the first electroplating sample value, the second electroplating sample value, ... the Hth electroplating sample value;

[0038] Execute the following formula:

[0039] (first electroplating sample value+second electroplating sample value+...+Hth electroplating sample value) / H=plating concentration of the space to be plated.

[0040] Optionally, the performing of the coating concentration test experiment includes:

[0041] Set the gradient of the coating concentration when conducting the coating concentration test experiment, which is recorded as the test gradient;

[0042] Obtain the lowest coating concentration during electroplating, recorded as the lowest concentration;

[0043] Get the highest coating concentration during electroplating, recorded as the highest concentration;

[0044] Calculate the lowest concentration + test gradient = first test concentration;

[0045] Calculate the lowest concentration + test gradient * 2 = the second test concentration;

[0046] …

[0047] Calculate the lowest concentration + test gradient * (c-1) = the highest concentration, where c is the number of all coating concentrations in the coating concentration test experiment;

[0048] The unit thickness is tested in plating solutions with coating concentrations equal to the lowest concentration, the first test concentration, the second test concentration, ... the highest concentration.

[0049] Optionally, executing the second adjustment strategy includes:

[0050] The said one-time rotation means that after the workpiece to be plated is electroplated in the space to be plated for a unit time, the positions of the first end and the second end are reversed to adjust the concentration of the coating in the space to be plated and continue the electroplating for a unit time;

[0051] Set the rotation relationship (a, b) of the to-be-plated segment, where a is the serial number of the to-be-plated space where the to-be-plated segment is located before the rotation, and b is the serial number of the to-be-plated space where the to-be-plated segment is located after the rotation, where the ath to-be-plated space and the bth to-be-plated space electroplate the same to-be-plated segment;

[0052] When n is an even number:

[0053] The space to be plated corresponding to the rotation relationship of the first space to be plated is the nth space to be plated;

[0054] The space to be plated corresponding to the rotation relationship of the second space to be plated is the n-1th space to be plated;

[0055] …

[0056] The space to be plated corresponding to the rotation relationship of the n / 2th space to be plated is the n / 2+1th space to be plated.

[0057] Optionally, executing the second adjustment strategy includes:

[0058] When n is an odd number:

[0059] The space to be plated corresponding to the rotation relationship of the first space to be plated is the nth space to be plated;

[0060] The space to be plated corresponding to the rotation relationship of the second space to be plated is the n-1th space to be plated;

[0061] …

[0062] The space to be plated corresponding to the rotation relationship of the (n+1) / 2th space to be plated is the (n+1) / 2th space to be plated.

[0063] Optionally, executing the second adjustment strategy includes:

[0064] For any segment to be plated:

[0065] Obtaining two spaces to be plated corresponding to the rotation relationship of the segment to be plated, wherein the space to be plated where the segment to be plated is located before the rotation is recorded as the first rotation space, and the space to be plated where the segment to be plated is located after the rotation is recorded as the second rotation space;

[0066] Obtaining a unit thickness corresponding to the coating concentration in the first rotation space, recorded as a first thickness;

[0067] Obtaining the unit thickness corresponding to the coating concentration in the second switching space, recorded as the second thickness;

[0068] Calculate the first thickness + the second thickness, and record the result as the reverse thickness;

[0069] The turned thickness of each to-be-plated segment is obtained, and the average of all turned thicknesses is calculated, and the result is recorded as the average thickness.

[0070] Optionally, executing the second adjustment strategy includes:

[0071] For each segment to be plated:

[0072] Obtain the reverse thickness of the segment to be plated and compare it with the average thickness;

[0073] When the turned thickness > average thickness, the turned thickness minus the average thickness is calculated and recorded as the first thickness;

[0074] Obtaining a coating concentration corresponding to a first thickness increase per unit time, recorded as a first concentration;

[0075] Then, after the switching, the coating concentration in the second switching space is reduced by the first concentration;

[0076] When the reverse thickness is less than the average thickness, the average thickness minus the reverse thickness is calculated and recorded as the second thickness;

[0077] Obtaining the coating concentration corresponding to the second thickness increase per unit time, recorded as the second concentration;

[0078] Then, after the switching, the coating concentration in the second switching space is increased by the second concentration;

[0079] Get all first concentrations and second concentrations;

[0080] The space to be plated corresponding to the first concentration is recorded as the first space to be reduced;

[0081] The space to be plated corresponding to the second concentration is recorded as the first space to be increased;

[0082] Then, after the workpiece to be plated is turned, the reduced coating cations in the first space to be reduced are added to the first space to be increased, so that the total coating thickness increased per unit time of each section to be plated after the turn is equal to the average thickness.

[0083] Optionally, the step of switching the electroplating strategy includes:

[0084] Get the average thickness;

[0085] Calculate qualified thickness / average thickness, which equals the number of units;

[0086] Calculate the number of units * unit time, and record the result as the execution time;

[0087] Then, after the workpiece to be plated is placed in the space to be plated and electroplated for a certain period of time, the positions of the first end and the second end of the workpiece to be plated are reversed, and the concentration of the coating in the space to be plated is adjusted and the electroplating is continued for a certain period of time, and then the electroplating of the workpiece to be plated is completed;

[0088] Among them, the coating concentration of the space to be plated is adjusted after the electroplating execution time and the coating concentration of the space to be plated is adjusted after the electroplating unit time.

[0089] The present invention has the following beneficial effects:

[0090] 1. The electroplating and polishing method of metal parts can keep the concentration of plating cations in each space uniform during the electroplating process by stirring the plating solution in the first space, the second space and the third space with a stirrer, and exchange the plating solution in the first space with the plating solution in the second space and the third space respectively, so as to prevent the concentration of plating cations in the first space and the concentration of plating cations in the second space and the third space from being too different due to the poor fluidity of the plating solution in the first space during the electroplating process, resulting in poor electroplating effect in the internal space of the workpiece to be plated. By stirring the plating solution and exchanging the plating solution in different spaces, the concentration of plating cations at each position in a space to be plated is equal, so as to prevent the uneven electroplating of the to-be-plated segments in a space to be plated, and improve the qualified rate of products.

[0091] 2. The electroplating and polishing method for metal parts divides the space line segment in the space to be plated into the measurement value divided line segments by setting the measurement value, obtains the midpoint of each divided line segment, obtains multiple measurement points, obtains the electroplating solution at each measurement point, obtains the test sample, measures the concentration of the plating cations in each measurement sample, obtains multiple electroplating sample values, calculates the mean of all the electroplating sample values, obtains the plating concentration of the space to be plated, and calculates the plating concentration through the electroplating sample values ​​of multiple measurement samples, so that the plating concentration can better represent the concentration of the plating cations in the space to be plated, making the data more convincing.

[0092] 3. The electroplating and polishing method of the metal parts obtains the minimum coating concentration and the maximum coating concentration during electroplating, and calculates multiple coating concentrations for the coating concentration test experiment by setting a test gradient. The interval between adjacent coating concentration tests is the test gradient. Test gradients of different sizes can be set according to the different degrees of electroplating accuracy of the workpiece to be plated. When the value of the test gradient is large, the requirement for the accuracy of the electroplating of the workpiece to be plated is low. When the value of the test gradient is small, the requirement for the accuracy of the electroplating of the workpiece to be plated is high. Different test gradients can meet different accuracy requirements. At the same time, the unit thickness corresponding to the multiple coating concentrations obtained by the test gradient is convenient for the subsequent adjustment of the coating concentration of the space to be plated according to the thickness, thereby improving the electroplating effect.

[0093] 4. The electroplating and polishing method of the metal parts, since the plating cations in the electroplating pool are generated by the anode and continuously flow to the cathode, the closer to the anode, the higher the concentration of the plating cations. In the process of the flow of the plating cations, from the anode to the cathode, the concentration of the plating cations continuously decreases. In order to simplify the calculation, it is assumed that the concentration of the plating cations in each space to be plated is equal, and the concentration of the plating cations in different spaces to be plated is not equal. Therefore, after electroplating unit time in different spaces to be plated, the increased plating thickness of different fragments to be plated is not equal. It is roughly assumed that the increased plating thickness per unit time of the fragment to be plated from the anode to the cathode presents an irregular decrease, and this irregular decrease can be made to show a regular change by adjusting the concentration of the plating cations in the space to be plated. Therefore, by turning the first end and the second end of the workpiece to be plated, the purpose of adjusting the plating concentration of the workpiece to be plated is to make the irregular plating thickness regular, so that after the turning, the plating thickness of each workpiece to be plated is increased to be equal, thereby improving the effect of electroplating.

[0094] 5. The electroplating and polishing method for metal parts sets a rotation relationship for each segment to be plated. Since the space to be plated for electroplating of the segment to be plated changes after the first end and the second end of the workpiece to be plated are rotated, and the two spaces to be plated of a segment to be plated are fixed before and after the rotation, the rotation relationship of the segment to be plated is fixed; when the number n of the spaces to be plated is an even number or an odd number, the rotation relationship is determined for each segment to be plated, so as to facilitate the subsequent determination of whether to increase or decrease the coating concentration according to the coating concentrations of the two spaces to be plated in the rotation relationship. The determination of the rotation relationship simplifies the subsequent calculation steps and improves efficiency.

[0095] 6. The electroplating and polishing method of the metal part comprises the following steps: obtaining two spaces to be plated corresponding to the rotation relationship of the segment to be plated, obtaining a first rotation space and a second rotation space, obtaining a first thickness according to the coating concentration in the first rotation space, obtaining a second thickness according to the coating concentration in the second rotation space, calculating the first thickness + the second thickness, and obtaining the rotation thickness, wherein the rotation thickness is the coating thickness increased per unit time after each segment to be plated is electroplated after the first end and the second end are rotated without changing the coating concentration in the space to be plated in theory, and since the coating thickness increased per unit time of the segment to be plated from the anode to the cathode decreases irregularly, the rotation thickness after the rotation is also not equal, considering that if the coating thickness increased per unit time of the segment to be plated from the anode to the cathode increases The added coating thickness shows a regular decrease, so after the rotation, the coating thickness of each workpiece to be plated is equal and equal to the average thickness. Therefore, when the turned thickness is greater than the average thickness, the first thickness is calculated to obtain the first concentration, and the coating concentration of the second turned space after the rotation is reduced by the first concentration. Similarly, when the turned thickness is less than the average thickness, the second concentration is obtained, and the coating concentration of the second turned space is increased by the second concentration to compensate for the irregular decrease in the coating thickness per unit time of the segment to be plated from the anode to the cathode before the rotation; at this time, the coating thickness per unit time of the segment to be plated from the anode to the cathode can be defaulted to a regular decrease, and the first end and the second end are rotated to optimize the coating thickness of each workpiece to be plated to be equal and improve the effect of electroplating.

[0096] 7. The electroplating and polishing method of the metal parts, when multiple first concentrations and second concentrations are obtained after the conversion, all the first concentrations and second concentrations are obtained, and matched according to whether they are equal, then the spaces to be plated corresponding to the first concentrations and second concentrations that match the same are recorded as the first space to be reduced and the first space to be increased, respectively, the reduced plating cations in the first space to be reduced are directly added to the first space to be increased, the spaces to be plated where the first concentrations and second concentrations that match the same are not equal are recorded as the second space to be reduced and the second space to be increased, the reduced plating cations in all the second spaces to be reduced are added to all the second spaces to be increased, so as to avoid the waste of plating cations and save costs.

[0097] 8. The electroplating and polishing method of the metal parts, when multiple first concentrations and second concentrations are obtained after the conversion, all the first concentrations and second concentrations are obtained, and the spaces to be plated corresponding to the first concentrations and the second concentrations are respectively recorded as the first space to be reduced and the first space to be increased, and the reduced plating cations in the first space to be reduced are directly added to the first space to be increased, so as to avoid the waste of plating cations and save costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0098] Figure 1 Schematic diagram of the method of the present invention

[0099] Figure 2It is a schematic diagram of the structure of the present invention. DETAILED DESCRIPTION

[0100] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0101] Embodiment 1, refer to Figure 1 , a method for electroplating and polishing a metal part, comprising:

[0102] Obtain workpieces that need to be electroplated for ship production;

[0103] The workpiece is subjected to degreasing, sandblasting and polishing treatments in sequence, and the treated workpiece is recorded as a workpiece to be plated, wherein the workpiece to be plated is a container, including an inner space and an outer space;

[0104] Obtain an electroplating cell, wherein the electroplating cell is a rectangular container, wherein the anode is the metal to be plated, and the cathode is the workpiece to be plated;

[0105] The direction from anode to cathode is recorded as the positive direction;

[0106] Divide the electroplating pool into several electroplating spaces in the positive direction;

[0107] Plating the workpiece to be plated into the electroplating bath for electroplating;

[0108] The plating space occupied by the workpiece to be plated in the plating bath is recorded as the plating space, and the plating spaces are named in sequence in the positive direction as the first plating space, the second plating space, and the nth plating space;

[0109] The interface between adjacent spaces to be plated divides the workpiece to be plated into n segments to be plated;

[0110] In this embodiment, the value of n is 5, referring to Figure 2 , the workpieces to be plated are named as the first workpiece to be plated, the second workpiece to be plated, the third workpiece to be plated, the fourth workpiece to be plated and the fifth workpiece to be plated according to the positive direction;

[0111] In a space to be plated, the inner space of the segment to be plated is recorded as the first space;

[0112] The two external spaces of the segment to be plated are respectively recorded as the second space and the third space;

[0113] Executing a first adjustment strategy to adjust the concentrations of plating cations in the first space, the second space, and the third space in each space to be plated to be equal;

[0114] The concentration of the plating cations is recorded as the plating concentration;

[0115] Perform a coating concentration test experiment to obtain the thickness of the coating added per unit time of the workpiece to be plated in the electroplating solution with different coating concentrations, which is recorded as the unit thickness;

[0116] One end of the workpiece to be plated in the first space to be plated is recorded as the first end;

[0117] Recording one end of the workpiece to be plated in the nth space to be plated as the second end;

[0118] In this embodiment, refer to Figure 2 , the positions of the first end and the second end are shown in the figure;

[0119] Execute concentration determination strategy to measure the coating concentration of each space to be plated;

[0120] Execute the second adjustment strategy to calculate the thickness of the coating that increases when the workpiece to be plated is turned once in the space to be plated, and record it as the turning thickness;

[0121] Obtain the qualified thickness of the workpiece to be plated;

[0122] Execute the switch plating strategy to electroplate the workpiece.

[0123] The executing the first adjustment strategy includes:

[0124] stirring the electroplating solutions in the first space, the second space and the third space with a stirrer;

[0125] The electroplating solution in the first space is exchanged with the electroplating solutions in the second space and the third space respectively, so as to keep the concentrations of the plating cations in the first space, the second space and the third space equal.

[0126] By stirring the plating solution in the first space, the second space and the third space with a stirrer, the concentration of the plating cations in each space can be kept uniform during the electroplating process. The plating solution in the first space is exchanged with the plating solutions in the second space and the third space respectively, so as to prevent the concentration of the plating cations in the first space from being too different from the concentration of the plating cations in the second space and the third space due to the poor fluidity of the plating solution in the first space during the electroplating process, resulting in poor electroplating effect in the internal space of the workpiece to be plated. By stirring the plating solution and exchanging the plating solution in different spaces, the concentration of the plating cations at each position in a space to be plated is equalized, so as to prevent the uneven electroplating of the to-be-plated segments in a space to be plated, thereby improving the qualified rate of the product.

[0127] The execution concentration determination strategy comprises:

[0128] Set the measurement value used to select the number of test samples in the space to be plated, denoted as H;

[0129] For each space to be plated:

[0130] Obtain a line segment parallel to the positive direction in the space to be plated, recorded as a space line segment;

[0131] The space line segment is equally divided into the measured value line segments to obtain a plurality of divided line segments;

[0132] Get the midpoint of each segment and record it as the measurement point;

[0133] Obtain the plating solution at each measuring point and record it as a measuring sample;

[0134] Measuring the concentration of plating cations in each measurement sample to obtain a plating sample value;

[0135] Obtain all electroplating sample values, and record them as the first electroplating sample value, the second electroplating sample value, ... the Hth electroplating sample value;

[0136] Execute the following formula:

[0137] (first electroplating sample value+second electroplating sample value+...+Hth electroplating sample value) / H=plating concentration of the space to be plated.

[0138] By setting the measurement value, the space line segment in the space to be plated is evenly divided into the measurement value dividing line segments, the midpoint of each dividing line segment is obtained, a plurality of measurement points are obtained, the plating solution of each measurement point is obtained, a test sample is obtained, the concentration of the plating cations in each measurement sample is measured, a plurality of electroplating sample values ​​are obtained, the mean of all the electroplating sample values ​​is calculated, and the plating concentration of the space to be plated is obtained. The plating concentration calculated by the electroplating sample values ​​of the plurality of measurement samples makes the plating concentration more representative of the concentration of the plating cations in the space to be plated, and the data is more convincing.

[0139] The performing of the coating concentration test experiment comprises:

[0140] Set the gradient of the coating concentration when conducting the coating concentration test experiment, which is recorded as the test gradient;

[0141] Obtain the lowest coating concentration during electroplating, recorded as the lowest concentration;

[0142] Get the highest coating concentration during electroplating, recorded as the highest concentration;

[0143] Calculate the lowest concentration + test gradient = first test concentration;

[0144] Calculate the lowest concentration + test gradient * 2 = the second test concentration;

[0145] …

[0146] Calculate the lowest concentration + test gradient * (c-1) = the highest concentration, where c is the number of all coating concentrations in the coating concentration test experiment;

[0147] The unit thickness is tested in plating solutions with coating concentrations equal to the lowest concentration, the first test concentration, the second test concentration, ... the highest concentration.

[0148] The lowest coating concentration and the highest coating concentration during electroplating are obtained, and a plurality of coating concentrations for the coating concentration test experiment are calculated by setting a test gradient. The interval between adjacent coating concentration tests is the test gradient. Test gradients of different sizes can be set according to the different degrees of electroplating accuracy of the workpiece to be plated. When the value of the test gradient is large, the requirements for the accuracy of electroplating of the workpiece to be plated are low. When the value of the test gradient is small, the requirements for the accuracy of electroplating of the workpiece to be plated are high. Different test gradients can meet different accuracy requirements. At the same time, the unit thickness corresponding to the plurality of coating concentrations obtained by the test gradient is convenient for adjusting the coating concentration of the space to be plated according to the thickness in the subsequent process, thereby improving the effect of electroplating.

[0149] The executing the second adjustment strategy includes:

[0150] The said one-time rotation means that after the workpiece to be plated is electroplated in the space to be plated for a unit time, the positions of the first end and the second end are reversed to adjust the concentration of the coating in the space to be plated and continue the electroplating for a unit time;

[0151] Since the plating cations in the electroplating pool are generated by the anode and continuously flow to the cathode, the closer to the anode, the higher the concentration of the plating cations. During the flow of the plating cations, from the anode to the cathode, the concentration of the plating cations continuously decreases. In order to simplify the calculation, it is assumed that the concentration of the plating cations in each space to be plated is equal, and the concentration of the plating cations in different spaces to be plated is not equal. Therefore, after electroplating unit time in different spaces to be plated, the increased plating thickness of different fragments to be plated is not equal. It is roughly believed that the increased plating thickness per unit time of the fragment to be plated from the anode to the cathode shows an irregular decrease, and this irregular decrease can be made to show a regular change by adjusting the concentration of the plating cations in the space to be plated. Therefore, by turning the first end and the second end of the workpiece to be plated, the purpose of adjusting the plating concentration of the workpiece to be plated is to make the irregular plating thickness regular, so that after the turning, the plating thickness of each workpiece to be plated is equal, thereby improving the electroplating effect.

[0152] Set the rotation relationship (a, b) of the to-be-plated segment, where a is the serial number of the to-be-plated space where the to-be-plated segment is located before the rotation, and b is the serial number of the to-be-plated space where the to-be-plated segment is located after the rotation, where the ath to-be-plated space and the bth to-be-plated space electroplate the same to-be-plated segment;

[0153] When n is an even number:

[0154] The space to be plated corresponding to the rotation relationship of the first space to be plated is the nth space to be plated;

[0155] The space to be plated corresponding to the rotation relationship of the second space to be plated is the n-1th space to be plated;

[0156] …

[0157] The space to be plated corresponding to the rotation relationship of the n / 2th space to be plated is the n / 2+1th space to be plated.

[0158] The executing the second adjustment strategy includes:

[0159] When n is an odd number:

[0160] The space to be plated corresponding to the rotation relationship of the first space to be plated is the nth space to be plated;

[0161] The space to be plated corresponding to the rotation relationship of the second space to be plated is the n-1th space to be plated;

[0162] …

[0163] The space to be plated corresponding to the rotation relationship of the (n+1) / 2th space to be plated is the (n+1) / 2th space to be plated.

[0164] In this embodiment, refer to Figure 2 , n=5 is an odd number, then the rotation relationship of the first segment to be plated is (1,5), the rotation relationship of the second segment to be plated is (2,4), and the rotation relationship of the third segment to be plated is (3,3).

[0165] A rotation relationship is set for each segment to be plated. Since the space to be plated for electroplating of the segment to be plated changes after the first end and the second end of the workpiece to be plated are rotated, and the two spaces to be plated of a segment to be plated are fixed before and after the rotation, the rotation relationship of the segment to be plated is fixed. According to whether the number n of the spaces to be plated is an even number or an odd number, a rotation relationship is determined for each segment to be plated, so as to facilitate the subsequent determination of whether to increase or decrease the coating concentration according to the coating concentrations of the two spaces to be plated in the rotation relationship. The determination of the rotation relationship simplifies the subsequent calculation steps and improves efficiency.

[0166] The executing the second adjustment strategy includes:

[0167] For any segment to be plated:

[0168] Obtaining two spaces to be plated corresponding to the rotation relationship of the segment to be plated, wherein the space to be plated where the segment to be plated is located before the rotation is recorded as the first rotation space, and the space to be plated where the segment to be plated is located after the rotation is recorded as the second rotation space;

[0169] Obtaining a unit thickness corresponding to the coating concentration in the first rotation space, recorded as a first thickness;

[0170] Obtaining the unit thickness corresponding to the coating concentration in the second switching space, recorded as the second thickness;

[0171] Calculate the first thickness + the second thickness, and record the result as the reverse thickness;

[0172] The turned thickness of each to-be-plated segment is obtained, and the average of all turned thicknesses is calculated, and the result is recorded as the average thickness.

[0173] In this embodiment, the unit thickness of the first space to be plated is 10, the unit thickness of the second space to be plated is 8, the unit thickness of the third space to be plated is 7, the unit thickness of the fourth segment to be plated is 5, and the unit thickness of the fifth segment to be plated is 2;

[0174] Then, the reverse thickness of the first segment to be plated = 10 + 2 = 12;

[0175] The reverse thickness of the second segment to be plated = 8 + 5 = 13;

[0176] The reverse thickness of the third segment to be plated = 7 + 7 = 14;

[0177] The reverse thickness of the fourth segment to be plated = 5 + 8 = 13;

[0178] The reverse thickness of the fifth segment to be plated = 2 + 10 = 12;

[0179] Calculate the average thickness = (12 + 13 + 14 + 13 + 12) / 5 = 12.8;

[0180] The executing the second adjustment strategy includes:

[0181] For each segment to be plated:

[0182] Obtain the reverse thickness of the segment to be plated and compare it with the average thickness;

[0183] When the turned thickness > average thickness, the turned thickness minus the average thickness is calculated and recorded as the first thickness;

[0184] Obtaining a coating concentration corresponding to a first thickness increase per unit time, recorded as a first concentration;

[0185] Then, after the switching, the coating concentration in the second switching space is reduced by the first concentration;

[0186] When the reverse thickness is less than the average thickness, the average thickness minus the reverse thickness is calculated and recorded as the second thickness;

[0187] Obtaining the coating concentration corresponding to the second thickness increase per unit time, recorded as the second concentration;

[0188] Then, after the switching, the coating concentration in the second switching space is increased by the second concentration;

[0189] In this embodiment, refer to Figure 2 , then, the second thickness that needs to be increased for the first segment to be plated = 0.8;

[0190] The first thickness of the second to-be-plated segment to be reduced = 0.2;

[0191] The first thickness of the third to-be-plated segment to be reduced = 1.2;

[0192] The first thickness of the fourth segment to be plated that needs to be reduced = 0.2;

[0193] The fifth segment to be plated needs to have a second thickness increased by 0.8;

[0194] Wherein, the coating concentration of unit thickness = 0.8 is recorded as the first unit concentration;

[0195] The coating concentration of unit thickness = 0.2 is recorded as the second unit concentration;

[0196] The coating concentration of unit thickness = 1.2 is recorded as the third unit concentration;

[0197] The second transfer space of the first to-be-plated segment is the fifth to-be-plated space;

[0198] The second transfer space of the second segment to be plated is the fourth space to be plated;

[0199] The second transfer space of the third segment to be plated is the third space to be plated;

[0200] The second transfer space of the fourth segment to be plated is the second space to be plated;

[0201] The second transfer space of the fifth segment to be plated is the first space to be plated;

[0202] Then, after the workpiece to be plated is turned, the coating concentration in the fifth space to be plated is increased by the first unit concentration;

[0203] reducing the coating concentration of the fourth to-be-plated space by a second unit concentration;

[0204] reducing the coating concentration in the third to-be-plated space by a third unit concentration;

[0205] reducing the plating concentration of the second to-be-plated space by a second unit concentration;

[0206] Increasing the plating concentration of the first to-be-plated space by a first unit concentration;

[0207] Among them, the electroplating solution of the space to be plated where the concentration of plating cations needs to be reduced can be added to the space to be plated where the concentration of plating cations needs to be increased.

[0208] Obtain two spaces to be plated corresponding to the rotation relationship of the segment to be plated, obtain a first rotation space and a second rotation space, obtain a first thickness according to the coating concentration in the first rotation space, obtain a second thickness according to the coating concentration in the second rotation space, calculate the first thickness + the second thickness, and obtain the rotation thickness, wherein the rotation thickness is theoretically the coating thickness increased per unit time after each segment to be plated rotates the first end and the second end without changing the coating concentration in the space to be plated, and continues to electroplating after a unit time of electroplating. Since the coating thickness increased per unit time of the segment to be plated from the anode to the cathode decreases irregularly, the rotation thickness after the rotation is also not equal. Considering that if the coating thickness increased per unit time of the segment to be plated from the anode to the cathode decreases irregularly, the rotation thickness after the rotation is also not equal. If the thickness of the coating on the workpiece to be plated decreases regularly, then after the rotation, the coating thickness of each workpiece to be plated is equal and equal to the average thickness. Therefore, when the rotation thickness is greater than the average thickness, the first thickness is calculated to obtain the first concentration, and the coating concentration of the second rotation space after the rotation is reduced by the first concentration. Similarly, when the rotation thickness is less than the average thickness, the second concentration is obtained, and the coating concentration of the second rotation space is increased by the second concentration to compensate for the irregular decrease in the coating thickness per unit time of the segment to be plated from the anode to the cathode before the rotation. At this time, the coating thickness per unit time of the segment to be plated from the anode to the cathode can be defaulted to a regular decrease, and the first end and the second end are rotated to make the coating thickness of each workpiece to be plated equal, thereby improving the effect of electroplating.

[0209] Get all first concentrations and second concentrations;

[0210] The space to be plated corresponding to the first concentration is recorded as the first space to be reduced;

[0211] The space to be plated corresponding to the second concentration is recorded as the first space to be increased;

[0212] Then, after the workpiece to be plated is turned, the reduced coating cations in the first space to be reduced are added to the first space to be increased, so that the total coating thickness increased per unit time of each section to be plated after the turn is equal to the average thickness.

[0213] After the conversion, multiple first concentrations and second concentrations are obtained, and all the first concentrations and second concentrations are obtained. The spaces to be plated corresponding to the first concentrations and the second concentrations are respectively recorded as the first space to be reduced and the first space to be increased, and the reduced plating cations in the first space to be reduced are directly added to the first space to be increased, so as to avoid waste of plating cations and save costs.

[0214] The implementation of the switching electroplating strategy includes:

[0215] Get the average thickness;

[0216] Calculate qualified thickness / average thickness, which equals the number of units;

[0217] Calculate the number of units * unit time, and record the result as the execution time;

[0218] Then, after the workpiece to be plated is placed in the space to be plated and electroplated for a certain period of time, the positions of the first end and the second end of the workpiece to be plated are reversed, and the concentration of the coating in the space to be plated is adjusted and the electroplating is continued for a certain period of time, and then the electroplating of the workpiece to be plated is completed;

[0219] Among them, the coating concentration of the space to be plated is adjusted after the electroplating execution time and the coating concentration of the space to be plated is adjusted after the electroplating unit time.

[0220] Calculate qualified thickness / average thickness to get unit quantity, then unit quantity represents how many turns need to be performed, wherein unit time of electroplating is required before each turn, and unit time of electroplating is required after each turn. In order to simplify the complexity of the operation, multiply unit quantity by unit time to get execution time, and execution time is the total time required for electroplating before and after the turn. Then, the execution time of electroplating the workpiece to be plated before the turn and the execution time of electroplating the workpiece to be plated after the turn are calculated, so as to avoid the increased complexity of operation caused by multiple turns, simplify the electroplating steps and improve production efficiency.

[0221] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0222] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the technical principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A method for electroplating and polishing a metal part, comprising: Obtain workpieces that need to be electroplated for ship production; The workpiece is subjected to degreasing, sandblasting and polishing treatments in sequence, and the treated workpiece is recorded as a workpiece to be plated, wherein the workpiece to be plated is a container, including an inner space and an outer space; Obtain an electroplating cell, wherein the electroplating cell is a rectangular container, wherein the anode is the metal to be plated, and the cathode is the workpiece to be plated; The direction from anode to cathode is recorded as the positive direction; Divide the electroplating pool into several electroplating spaces in the positive direction; Plating the workpiece to be plated into an electroplating bath for electroplating; The plating space occupied by the workpiece to be plated in the plating bath is recorded as the plating space, and the plating spaces are named in sequence in the positive direction as the first plating space, the second plating space, and the nth plating space; The interface between adjacent spaces to be plated divides the workpiece to be plated into n segments to be plated; In a space to be plated, the inner space of the segment to be plated is recorded as the first space; The two external spaces of the segment to be plated are respectively recorded as the second space and the third space; Executing a first adjustment strategy to adjust the concentrations of plating cations in the first space, the second space, and the third space in each space to be plated to be equal; The concentration of the plating cations is recorded as the plating concentration; Perform a coating concentration test experiment to obtain the thickness of the coating added per unit time of the workpiece to be plated in the electroplating solution with different coating concentrations, which is recorded as the unit thickness; One end of the workpiece to be plated in the first space to be plated is recorded as the first end; Recording one end of the workpiece to be plated in the nth space to be plated as the second end; Execute concentration determination strategy to measure the coating concentration of each space to be plated; Execute the second adjustment strategy to calculate the thickness of the coating that increases when the workpiece to be plated is turned once in the space to be plated, and record it as the turning thickness; Obtain the qualified thickness of the workpiece to be plated; Execute the switch plating strategy to electroplate the workpiece.

2. The electroplating polishing method for metal parts according to claim 1, characterized in that: The executing the first adjustment strategy includes: stirring the electroplating solutions in the first space, the second space and the third space with a stirrer; The electroplating solution in the first space is exchanged with the electroplating solutions in the second space and the third space respectively, so as to keep the concentrations of the plating cations in the first space, the second space and the third space equal.

3. The electroplating polishing method for metal parts according to claim 1, characterized in that: The execution concentration determination strategy comprises: Set the measurement value used to select the number of test samples in the space to be plated, denoted as H; For each space to be plated: Obtain a line segment parallel to the positive direction in the space to be plated, recorded as a space line segment; The space line segment is equally divided into the measured value line segments to obtain a plurality of divided line segments; Get the midpoint of each segment and record it as the measurement point; Obtain the plating solution at each measuring point and record it as a measuring sample; Measuring the concentration of plating cations in each measurement sample to obtain a plating sample value; Obtain all electroplating sample values, and record them as the first electroplating sample value, the second electroplating sample value, ... the Hth electroplating sample value; Execute the following formula: (first electroplating sample value+second electroplating sample value+...+Hth electroplating sample value) / H=plating concentration of the space to be plated.

4. The electroplating polishing method for metal parts according to claim 1, characterized in that: The performing of the coating concentration test experiment comprises: Set the gradient of the coating concentration when conducting the coating concentration test experiment, which is recorded as the test gradient; Get the lowest coating concentration during electroplating, recorded as the lowest concentration; Get the highest coating concentration during electroplating, recorded as the highest concentration; Calculate the lowest concentration + test gradient = first test concentration; Calculate the lowest concentration + test gradient * 2 = the second test concentration; …… Calculate the lowest concentration + test gradient * (c-1) = the highest concentration, where c is the number of all coating concentrations in the coating concentration test experiment; The unit thickness is tested in plating solutions with coating concentrations equal to the lowest concentration, the first test concentration, the second test concentration, ... the highest concentration.

5. The electroplating polishing method for metal parts according to claim 1, characterized in that: The executing the second adjustment strategy includes: The said one-time rotation means that after the workpiece to be plated is electroplated in the space to be plated for a unit time, the positions of the first end and the second end are reversed, and the concentration of the coating in the space to be plated is adjusted to continue electroplating for a unit time; Set the rotation relationship (a, b) of the to-be-plated segment, where a is the serial number of the to-be-plated space where the to-be-plated segment is located before the rotation, and b is the serial number of the to-be-plated space where the to-be-plated segment is located after the rotation, where the ath to-be-plated space and the bth to-be-plated space electroplate the same to-be-plated segment; When n is an even number: The space to be plated corresponding to the rotation relationship of the first space to be plated is the nth space to be plated; The space to be plated corresponding to the rotation relationship of the second space to be plated is the n-1th space to be plated; …… The space to be plated corresponding to the rotation relationship of the n / 2th space to be plated is the n / 2+1th space to be plated.

6. The electroplating polishing method for metal parts according to claim 4, characterized in that: The executing the second adjustment strategy includes: When n is an odd number: The space to be plated corresponding to the rotation relationship of the first space to be plated is the nth space to be plated; The space to be plated corresponding to the rotation relationship of the second space to be plated is the n-1th space to be plated; …… The space to be plated corresponding to the rotation relationship of the (n+1) / 2th space to be plated is the (n+1) / 2th space to be plated.

7. The electroplating polishing method for metal parts according to claim 5, characterized in that: The executing the second adjustment strategy includes: For any segment to be plated: Obtaining two spaces to be plated corresponding to the rotation relationship of the segment to be plated, wherein the space to be plated where the segment to be plated is located before the rotation is recorded as the first rotation space, and the space to be plated where the segment to be plated is located after the rotation is recorded as the second rotation space; Obtaining a unit thickness corresponding to the coating concentration in the first rotation space, recorded as a first thickness; Obtaining the unit thickness corresponding to the coating concentration in the second switching space, recorded as the second thickness; Calculate the first thickness + the second thickness, and record the result as the reverse thickness; The turned thickness of each to-be-plated segment is obtained, and the average of all turned thicknesses is calculated, and the result is recorded as the average thickness.

8. The electroplating polishing method for metal parts according to claim 7, characterized in that: The executing the second adjustment strategy includes: For each segment to be plated: Obtain the reverse thickness of the segment to be plated and compare it with the average thickness; When the turned thickness > average thickness, the turned thickness minus the average thickness is calculated and recorded as the first thickness; Obtaining a coating concentration corresponding to a first thickness increase per unit time, recorded as a first concentration; Then, after the switching, the coating concentration in the second switching space is reduced by the first concentration; When the reverse thickness is less than the average thickness, the average thickness minus the reverse thickness is calculated and recorded as the second thickness; Obtaining the coating concentration corresponding to the second thickness increase per unit time, recorded as the second concentration; Then, after the switching, the coating concentration in the second switching space is increased by the second concentration; Get all first concentrations and second concentrations; The space to be plated corresponding to the first concentration is recorded as the first space to be reduced; The space to be plated corresponding to the second concentration is recorded as the first space to be increased; Then, after the workpiece to be plated is turned, the reduced coating cations in the first space to be reduced are added to the first space to be increased, so that the total coating thickness increased per unit time of each section to be plated after the turn is equal to the average thickness.

9. The electroplating polishing method for metal parts according to claim 1, characterized in that: The implementation of the switching electroplating strategy includes: Get the average thickness; Calculate qualified thickness / average thickness, which equals the number of units; Calculate the number of units * unit time, and record the result as the execution time; Then, after the workpiece to be plated is placed in the space to be plated and electroplated for a certain period of time, the positions of the first end and the second end of the workpiece to be plated are reversed, and the concentration of the coating in the space to be plated is adjusted and the electroplating is continued for a certain period of time, and then the electroplating of the workpiece to be plated is completed; Among them, the coating concentration of the space to be plated is adjusted after the electroplating execution time and the coating concentration of the space to be plated is adjusted after the electroplating unit time.

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